TWM622696U - Liquid-cooling device - Google Patents
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- TWM622696U TWM622696U TW110212541U TW110212541U TWM622696U TW M622696 U TWM622696 U TW M622696U TW 110212541 U TW110212541 U TW 110212541U TW 110212541 U TW110212541 U TW 110212541U TW M622696 U TWM622696 U TW M622696U
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Abstract
本創作提供一種液冷裝置,包括一液冷管單元與一液冷連接座,該液冷管單元具有一板狀管殼內形成一殼內空間,該殼內空間具有複數第一流道與複數第二流道經由一回流流道連通, 該液冷連接座具有一入水通道與一出水通道,該入水通道與該出水通道彼此分隔從該液冷連接座的一側面貫穿到另一側面形成一接口係對接該板狀管殼的一開口端,該入水通道與該出水通道分別連通該複數第一流道與該複數第二流道 ,藉以簡化整體結構及減少焊接面積並增加強度及氣密性。The present invention provides a liquid cooling device, which includes a liquid cooling tube unit and a liquid cooling connection base, the liquid cooling tube unit has a plate-shaped tube shell and an inner shell space is formed, and the inner shell space has a plurality of first flow channels and a plurality of The second flow channel is communicated through a return flow channel. The liquid cooling connection seat has a water inlet channel and a water outlet channel. The water inlet channel and the water outlet channel are separated from each other and penetrate from one side of the liquid cooling connection seat to the other side to form a The interface is connected to an open end of the plate-shaped tube shell, and the water inlet channel and the water outlet channel are respectively connected to the plurality of first flow channels and the plurality of second flow channels, so as to simplify the overall structure, reduce the welding area and increase the strength and air tightness .
Description
本創作有關於一種液冷散熱領域,尤指關於一種液冷裝置。This creation relates to the field of liquid cooling and heat dissipation, especially to a liquid cooling device.
在電子設備(如電腦或伺服器)中,為保證系統可靠、穩定運行及延長設備使用壽命,需將相關器件運行產生的熱量及時帶走。由於液體的導熱性要高於空氣,因此很多電子設備採用液冷散熱系統行散熱。
液冷板是液冷散熱系統的核心部件,其通過液冷板吸收電子器件(如中央處理器、圖形處理器)的發熱,所以液冷板性能的好壞直接影響到冷卻系統的效率。
請參閱第1圖,現有該液冷板1包括一上板11、一下板12、一鰭片組13、一第一封蓋件14及一第二封蓋件15,該上板11和下板12分別結合在該鰭片組13的上側與下側,且該上板11與下板12的內側與該鰭片組13的上、下側相接觸處的地方採用鋁焊焊接方式結合一起,該第一、二封蓋件14、15分別蓋合在該上、下板11、12的兩側邊且密封銲接起來,該第一封蓋件14開設有供一工作液體進出的一進口141及一出口142,該第二封蓋件15具有一腔室空間151係連通該鰭片組13之間形成的一流道131。
所以現有上述液冷板1需使用多個零件焊接組裝構成容易造成組裝製造上難度高,以及各零件生產費用高導致整體成本提高。並在該上板11及該下板12及該鰭片組13相互接觸的地方必需採用鋁焊接接合使得會造成焊接面積多,因焊接面積多便時常發生多處焊接地方焊接不良(如虛焊(或假焊)),不僅會造成該工作液體洩漏外,且還會影響該液冷板1整體的結構強度不夠(即整體結構強度降低)的問題。此外,由於該上板11及該下板12及該鰭片組13各元件的厚度或邊緣在製作過程一定會存在尺寸公差,使得會造成各元件彼此的尺寸及/或厚度不一致,進而延伸出焊接的接縫精度差及焊接精度不容易控制致使焊縫夾渣、氣孔、裂紋、燒穿等缺陷進而降低焊接接合強度以及液冷板1內部液體洩漏的問題。
是以,要如何解決上述之問題與缺失,即為本案之創作人與從事此行業之相關廠商所亟欲研究改善之方向所在者。
In electronic equipment (such as computers or servers), in order to ensure the reliable and stable operation of the system and prolong the service life of the equipment, the heat generated by the operation of the related devices needs to be taken away in time. Because the thermal conductivity of liquid is higher than that of air, many electronic devices use liquid cooling system to dissipate heat.
The liquid-cooled plate is the core component of the liquid-cooled heat dissipation system. It absorbs the heat of electronic devices (such as central processing units and graphics processors) through the liquid-cooled plate. Therefore, the performance of the liquid-cooled plate directly affects the efficiency of the cooling system.
Please refer to FIG. 1, the existing
本創作之一目的提供一種液冷裝置具有可簡化整體結構及減少焊接面積的液冷管單元以提升導熱性能及增加結構強度。 本創作之另一目的提供一種可達到避免液體洩漏且確保氣密性,及結構簡單製程簡易方便,以有效節省成本。 為達上述目的,本創作提供一種液冷裝置,包括一液冷管單元,具有一板狀管殼,該板狀管殼內形成一殼內空間,該板狀管殼具有一第一開口端與一第二開口端,該第一、二開口端分別位於該板狀管殼的兩端且連通該殼內空間,該第二開口端設有一封蓋件,該殼內空間具有複數第一流道、複數第二流道及一回流流道,該回流流道係相鄰該第二開口端的該封蓋件且連通該複數第一流道與該複數第二流道;一液冷連接座,具有一入水通道與一出水通道,該入水通道與該出水通道彼此分隔從該液冷連接座的一側面貫穿到另一側面形成一接口,該接口係對接該板狀管殼的該第一開口端,該入水通道與該出水通道分別連通該複數第一流道與該複數第二流道。 上述複數第一流道之間及該複數第二流道之間具有一隔牆,該隔牆從該殼內空間內的該板狀管殼的底側一體凸伸到該板狀管殼的頂側。上述入水通道與該出水通道之間被一分隔壁分開且延伸到該接口,該分隔壁與該板狀管殼的該第一開口端內的其中一隔牆相接。 上述複數第一流道與該複數第二流道從該第一開口端延伸到鄰近該第二開口端,該回流流道設置在該第二開口端與該複數第一流道與該複數第二流道之間。上述該出水通道設置有一出水口位在該液冷連接座的一側面且連通該出水通道,該入水通道設置有一入水口位在該液冷連接座的一側面且連通該入水通道。 上述液冷管單元的上方設有一散熱器單元,該散熱器單元具有一散熱器底面連接或接觸該板狀管殼的頂側,且該散熱器底面設有一階梯部放置結合在該液冷連接座的頂面。上述複數第一流道的流道數量係多於該複數第二流道的流道數量。 One objective of the present invention is to provide a liquid cooling device with a liquid cooling tube unit that can simplify the overall structure and reduce the welding area, so as to improve the thermal conductivity and increase the structural strength. Another object of the present invention is to provide a device that can avoid liquid leakage and ensure air tightness, and has a simple structure and simple and convenient manufacturing process, so as to effectively save costs. In order to achieve the above purpose, the present invention provides a liquid cooling device, which includes a liquid cooling tube unit, and has a plate-shaped tube shell, an inner space is formed in the plate-shaped tube shell, and the plate-shaped tube shell has a first open end and a second open end, the first and second open ends are respectively located at two ends of the plate-shaped tube shell and communicate with the inner space of the shell, the second open end is provided with a cover, and the inner space of the shell has a plurality of first flow a plurality of second flow channels and a return flow channel, the return flow channel is adjacent to the cover member of the second open end and communicates with the plurality of first flow channels and the plurality of second flow channels; a liquid cooling connection seat, There is a water inlet channel and a water outlet channel, the water inlet channel and the water outlet channel are separated from each other and penetrate from one side of the liquid cooling connection seat to the other side to form an interface, the interface is connected to the first opening of the plate shell The water inlet channel and the water outlet channel respectively communicate with the plurality of first flow channels and the plurality of second flow channels. There is a partition wall between the plurality of first flow channels and the plurality of second flow channels, and the partition wall integrally protrudes from the bottom side of the plate-shaped tube shell in the inner space of the shell to the top of the plate-shaped tube shell side. The water inlet channel and the water outlet channel are separated by a partition wall and extend to the interface, and the partition wall is connected to one of the partition walls in the first open end of the plate-shaped tube shell. The plurality of first flow channels and the plurality of second flow channels extend from the first open end to adjacent to the second open end, and the return flow channel is disposed at the second open end and the plurality of first flow channels and the plurality of second flow channels between the roads. The water outlet channel is provided with a water outlet located on one side of the liquid cooling connection seat and communicates with the water outlet channel, and the water inlet channel is provided with a water inlet located on a side surface of the liquid cooling connection seat and communicates with the water inlet channel. A radiator unit is arranged above the above-mentioned liquid-cooled tube unit, and the radiator unit has a bottom surface of the radiator connected to or contacting the top side of the plate-shaped tube shell, and the bottom surface of the radiator is provided with a stepped portion placed and combined with the liquid-cooled connection the top of the seat. The number of flow channels of the plurality of first flow channels is greater than the number of flow channels of the plurality of second flow channels.
本創作之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。
本創作係一種液冷裝置2,應用裝設在一液冷系統(圖中未示),該液冷系統包含一水泵浦與一水冷頭,該水冷頭主要是用以與一電子裝置(如伺服器或電腦)內的一發熱元件接觸吸熱,該水冷頭的一入水端與該水泵浦的一出水端之間透過一水管連接相通,該液冷裝置2是透過複數水管分別連接該水泵浦的一入水端與該水冷頭的一出水端,以構成一個液冷迴路。所以該水冷頭內的一工作液體3(如純水)與其上吸收該發熱元件上的熱量熱交換後,透過該水泵浦推動帶有熱量的工作液體3流動到該液冷裝置2上做熱交換散熱,令冷卻(降溫)後的工作液體3再流回到該水冷頭內,一直不斷水循環散熱。此外本創作液冷裝置2也可裝設在該水泵浦與水冷頭整合在一個單體的液冷系統上。
請參閱第2、3、4圖,本創作液冷裝置2包括一液冷管單元21與一液冷連接座22,該液冷管單元21為一體成型的構件(如由鋁擠型一體成型製出的構件),該液冷管單元21具有一板狀管殼211,該板狀管殼211具有一第一開口端214與一第二開口端215,該第一、二開口端214、215分別位於該板狀管殼211的兩端,該第一開口端214係與該液冷連接座22的一側相接,該第二開口端215被設置一封蓋件24以如焊接或黏接方式密封。
該板狀管殼211內形成一殼內空間212,該殼內空間212係位於該第一、二開口端214、215之間且相連通,該殼內空間212具有複數第一流道2122、複數第二流道2123及一回流流道2124,該複數第一流道2122與該複數第二流道2123從該第一開口端214延伸到鄰近該第二開口端215,且平行該板狀管殼211的長方向(長度方向),在本實施例該複數第一流道2122的流道數量係多於該複數第二流道2123的流道數量,以確保該液冷管單元21流入的工作液體3有較大流入範圍,以及提供更多與工作液體3熱交換的散熱面積。所以透過這樣設置,讓帶有熱量的工作液體3進入該液冷管單元21內通過多數第一流道2122時可與更多隔牆216和板狀管殼211內的頂部和底部進行快速熱交換散熱,使降溫後的工作液體再由該回流流道2124回流到少數第二流道2123時會再次熱交換而持續降溫,藉以確保流出該液冷管單元21的冷卻後工作液體3的溫度降低至所需溫度。
該複數第一流道2122之間及該複數第二流道2123之間具有一隔牆216,該隔牆216從該殼內空間212內的該板狀管殼211的底側一體凸伸到該板狀管殼211的頂側,以隔開每一第一流道2122與每一第二流道2123,防止各自第一、二流道2122、2123內的工作液體3不會流竄到旁邊相鄰的流道內。該回流流道2124設置在該第二開口端215與該複數第一流道2122與該複數第二流道2123之間,且相鄰該第二開口端215的該封蓋件24,亦即該殼內空間212的該複數隔牆216與該第二開口端215之間有一內空間是沒有設置隔牆216,此內空間就是該回流流道2124的位置。並本實施例該回流流道2124的設置方向是平行該板狀管殼211的短方向(寬度方向),且該回流流道2124是作為該複數第一流道2122與該複數第二流道2123之間相連通的路徑流道,令該複數第一流道2122通過該回流流道2124連通該複數第二流道2123。
續參閱第2、4圖,該液冷連接座22具有一入水通道221及一出水通道222,該入水通道221與該出水通道222彼此分隔從該液冷連接座22的一側面(如前側面)貫穿到另一側面(如左側面)形成一接口223,在本實施例該入水通道221與該出水通道222之間被一分隔壁224分開且延伸到相鄰該接口223,該接口223係對接該板狀管殼211的該第一開口端214,且該分隔壁224與該板狀管殼211的該第一開口端214內的其中一隔牆216相接,令該入水通道221與該出水通道222分別連通該複數第一流道2122與該複數第二流道2123,所以透過該分隔壁224以如焊接方式與對應的隔牆216相連接密封,以確保工作液體3如第4圖的箭頭所示可順暢被導引由該入水通道221通過該複數第一流道2122後,經由該回流流道2124回流到該複數第二流道2123至該出水通道222外流動。
該出水通道222設置有一出水口2221,該出水口2221位在該液冷連接座22的一側面(如前側面),且連通該出水通道222,該出水口2221透過一水管將冷卻後的工作液體3流出至該水泵浦內,該入水通道221設置有一入水口2211,該入水口2211位在該液冷連接座22的一側面(如前側面),且連通該入水通道221,該入水口2211透過另一水管將帶有熱量的工作液體3導入至該液冷裝置2內作熱交換散熱。
另外,在本實施例該液冷管單元21的上方設有一散熱器單元25,該散熱器單元25具有一散熱器底面251,該散熱器底面251係連接或接觸該板狀管殼211的頂側,且該散熱器底面251設有一階梯部252放置結合在該液冷連接座22的頂面,透過該散熱器單元25底面吸收該板狀管殼211上的熱量向外快速散熱,以及該階梯部252會輔助吸附該液冷連接座22上的熱量(如入水通道221內帶有熱量的工作液體3所帶來的熱量)並向外散熱。
所以當帶有熱量的工作液體3經該液冷裝置2的入水口2211通過該入水通道221流入該液冷管單元21的殼內空間212後,該工作液體3會如第4圖的箭頭所示沿著該複數第一流道2122從該第一開口端214朝該第二開口端215方向流動,並流動到該回流流道2124後,再藉由該回流流道2124回流到該複數第二流道2123,並沿著該複數第二流道2123從該第二開口端215朝該第一開口端214方向流動,然後通過該出水通道222與出水口2221而流出該液冷連接座22。其中該工作液體3在該複數第一、二流道2122、2123及該回流流道2124的流動過程中會與該板狀管殼211內頂部與底部及該複數隔牆216進行熱交換,同時於上方的散熱器單元25會將吸附該板狀管殼211上的熱量與外部空氣做熱交換散熱。
因此,透過本創作此液冷裝置2使用較少零件構成,使得結構簡單且製程簡易方便,且該液冷管單元21係由如鋁擠型一體成型出該板狀管殼211及在殼內空間212的該複數第一、二流道2122、2123與該回流流道2124的結構,使得可有效減少焊接面積及達到避免液體洩漏且確保氣密性的效果,進而可提升結構強度及導熱性能,且還有效達到簡化該液冷裝置2整體結構。
以上已將本創作做一詳細說明,惟以上所述者,僅為本創作之一較佳實施例而已,當不能限定本創作實施之範圍。即凡依本創作申請範圍所作之均等變化與修飾等,皆應仍屬本創作之專利涵蓋範圍。
The above-mentioned purpose of the present invention and its structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings.
The present invention is a
2:液冷裝置 21:液冷管單元 211:板狀管殼 212:殼內空間 2122:第一流道 2123:第二流道 2124:回流流道 214:第一開口端 215:第二開口端 216:隔牆 22:液冷連接座 221:入水通道 2211:入水口 222:出水通道 2221:出水口 223:接口 224:分隔壁 24:封蓋件 25:散熱器單元 251:散熱器底面 252:階梯部 3:工作液體 2: Liquid cooling device 21: Liquid cooling tube unit 211: plate shell 212: Space inside the shell 2122: First runner 2123: Second runner 2124: Return runner 214: First open end 215: Second open end 216: Partition 22: Liquid cooling connector 221: Water entry channel 2211: Inlet 222: outlet channel 2221: Water outlet 223: interface 224: Dividing Wall 24: Covers 25: Radiator unit 251: The bottom of the radiator 252: Steps 3: Working liquid
第1圖為習知技術立體分解示意圖。 第2圖為本創作立體分解示意圖。 第3圖為本創作立體組合示意圖。 第4圖為圖3剖面的俯視示意圖。 FIG. 1 is a schematic exploded perspective view of the prior art. Figure 2 is a three-dimensional exploded schematic diagram of the creation. Figure 3 is a schematic diagram of the three-dimensional composition of the creation. FIG. 4 is a schematic top view of the section of FIG. 3 .
2:液冷裝置 2: Liquid cooling device
21:液冷管單元 21: Liquid cooling tube unit
211:板狀管殼 211: plate shell
212:殼內空間 212: Space inside the shell
214:第一開口端 214: First open end
215:第二開口端 215: Second open end
216:隔牆 216: Partition
22:液冷連接座 22: Liquid cooling connector
221:入水通道 221: Water entry channel
2211:入水口 2211: Inlet
222:出水通道 222: outlet channel
2221:出水口 2221: Water outlet
223:接口 223: interface
224:分隔壁 224: Dividing Wall
24:封蓋件 24: Covers
25:散熱器單元 25: Radiator unit
251:散熱器底面 251: The bottom of the radiator
252:階梯部 252: Steps
Claims (7)
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Application Number | Priority Date | Filing Date | Title |
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TW110212541U TWM622696U (en) | 2021-10-25 | 2021-10-25 | Liquid-cooling device |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI800350B (en) * | 2022-04-13 | 2023-04-21 | 英業達股份有限公司 | Sever with improving heat dissipation |
TWI807461B (en) * | 2021-10-25 | 2023-07-01 | 奇鋐科技股份有限公司 | Liquid cooling device |
-
2021
- 2021-10-25 TW TW110212541U patent/TWM622696U/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI807461B (en) * | 2021-10-25 | 2023-07-01 | 奇鋐科技股份有限公司 | Liquid cooling device |
TWI800350B (en) * | 2022-04-13 | 2023-04-21 | 英業達股份有限公司 | Sever with improving heat dissipation |
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