TWM619301U - Antenna welding disc structure for radio frequency identification unit - Google Patents

Antenna welding disc structure for radio frequency identification unit Download PDF

Info

Publication number
TWM619301U
TWM619301U TW110210116U TW110210116U TWM619301U TW M619301 U TWM619301 U TW M619301U TW 110210116 U TW110210116 U TW 110210116U TW 110210116 U TW110210116 U TW 110210116U TW M619301 U TWM619301 U TW M619301U
Authority
TW
Taiwan
Prior art keywords
radio frequency
pcb substrate
chip
identification unit
frequency identification
Prior art date
Application number
TW110210116U
Other languages
Chinese (zh)
Inventor
吳宗勲
Original Assignee
吳宗勲
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 吳宗勲 filed Critical 吳宗勲
Priority to TW110210116U priority Critical patent/TWM619301U/en
Publication of TWM619301U publication Critical patent/TWM619301U/en

Links

Images

Landscapes

  • Details Of Aerials (AREA)

Abstract

一種無線射頻識別單元天線焊盤結構，係PCB基板正面上同極連接的小矩形焊盤及大矩形焊盤各搭配小焊島與大焊島，可供不同封裝或規格形式的RFID無線射頻晶片電性連接，俾使該無線射頻識別單元因應市場不同需求，採用或替換不同封裝或規格形式的RFID無線射頻識別晶片時，不需變更PCB基板的銅箔迴路設計，即，多種不同封裝或規格形式的RIFD無線射頻晶片可共用在相同的該PCB基板上，能使無線射頻識別單元的生產或製造，提高市場需求的因應能力與經濟效益。 A wireless radio frequency identification unit antenna pad structure, which is a small rectangular pad and a large rectangular pad connected with the same pole on the front of the PCB substrate, each with a small solder island and a large solder island, which can be used for RFID radio frequency chips of different packages or specifications Electrical connection, so that the RFID unit adopts or replaces RFID RFID chips with different packages or specifications in response to different market needs without changing the copper foil circuit design of the PCB substrate, that is, a variety of different packages or specifications Forms of RIFD radio frequency chips can be shared on the same PCB substrate, enabling the production or manufacturing of radio frequency identification units, improving the ability to respond to market demand and economic benefits.

Description

無線射頻識別單元天線焊盤結構 Radio frequency identification unit antenna pad structure

本創作係有關一種不同封裝或規格形式的RFID無線射頻識別晶片，可共用相同PCB基板，能使無線射頻識別單元的生產，提高市場需求因應能力與經濟效益的無線射頻識別單元天線焊盤結構。 This creation is about an RFID radio frequency identification chip with different packages or specifications, which can share the same PCB substrate, which can enable the production of radio frequency identification units, improve the ability to respond to market demand and improve the economic efficiency of the radio frequency identification unit antenna pad structure.

按，無線射頻辨識(Radio Frequency Identification，RFID)是一種利用射頻傳輸電波作為物件辨識的技術，可提供商品、貨物、甚至是動物之追蹤，也能提升倉儲、物流管理之便利性，因而廣泛應用於運輸、製造、管理及動物研究等行業。詳言之，在無線射頻辨識系統中，線圈是作為資料發射及讀取接收的重要媒介，無線射頻辨識系統乃是藉由對發訊用線圈通以電流所產生的磁通，造成收訊用線圈的磁場變化，以於發訊用線圈與收訊用線圈之間進行資訊交換；常用的技術，係收訊用線圈圍繞一無線射頻識別單元，並激發該無線射頻識別單元上的RFID無線射頻晶片對發訊端讀取裝置發送ID識別碼，達成物體辨識或識別。 Press, Radio Frequency Identification (RFID) is a technology that uses radio frequency transmission waves to identify objects. It can provide tracking of commodities, goods, and even animals. It can also improve the convenience of warehousing and logistics management, so it is widely used Used in transportation, manufacturing, management and animal research industries. In detail, in the radio frequency identification system, the coil is used as an important medium for data transmission and reading and receiving. The magnetic field of the coil changes to exchange information between the transmitting coil and the receiving coil; a common technology is that the receiving coil surrounds a radio frequency identification unit and activates the RFID radio frequency on the radio frequency identification unit The chip sends the ID identification code to the reading device at the sending end to achieve object identification or identification.

習用圈繞線圈的無線射頻識別單元，係以一絕緣包覆體膠裝包覆一PCB基板，由該PCB基板上的銅箔製作出天線迴路與焊盤(Pad)，並在該焊盤(Pad)位置上電性連接一RFID無線射頻晶片，且該RFID無線射頻晶片，並同該PCB基板一併被該絕緣包覆體膠裝包覆；然而， 隨著晶片封裝技術的發展，PCB基板上所採用的RFID無線射頻晶片，為因應線圈場效、頻段、封裝設備、焊接設備、價格或市場需求等因素，會選用不同封裝、規格或加工形式的RFID無線射頻晶片，如選用DFN/QFN封裝IC晶片，可透過SMIT(Surface Mount Technology)表面貼焊工藝，以錫膏焊接在PCB基板，如選用覆晶封裝(Flip Chip)晶片，可利用異方性導電膠焊接在PCB基板上，又如選用裸晶(IC Chip)晶片，則可運用COB(Chip On Board)打線工藝，電性連接在PCB基板上；唯，多種形式RFID無線射頻晶片的不同選擇，必須需要不同版本的PCB基板，造成設計成本、生產成本或庫存備成品的增加，影響經濟效益。 The conventional coil-wound radio frequency identification unit is coated with an insulating coating body glue to cover a PCB substrate, the antenna loop and pad (Pad) are made from the copper foil on the PCB substrate, and the pad ( Pad) is electrically connected to an RFID radio frequency chip, and the RFID radio frequency chip, together with the PCB substrate, is covered by the insulating coating; however, With the development of chip packaging technology, RFID radio frequency chips used on PCB substrates will choose different packages, specifications or processing forms in response to factors such as coil field effect, frequency band, packaging equipment, welding equipment, price or market demand. RFID wireless radio frequency chips, such as DFN/QFN packaged IC chips, can be soldered on the PCB substrate with solder paste through the SMIT (Surface Mount Technology) surface mount technology. The conductive glue is soldered on the PCB substrate, and if the IC chip is selected, the COB (Chip On Board) wire bonding process can be used to electrically connect to the PCB substrate; only, the different forms of RFID radio frequency chips To choose, different versions of PCB substrates must be required, which will increase design costs, production costs, or inventory of finished products, and affect economic benefits.

本創作之主要目的係在提供一種無線射頻識別單元天線焊盤結構，係一無線射頻識別單元之周邊圍繞一線圈，用於識別物體上，可由讀取裝置讀取該無線射頻識別單元上的RFID無線射頻晶片之ID識別碼，辨識該識別物體；該無線射頻識別單元，係以一絕緣包覆體包覆一PCB基板，該PCB基板的正面，係以多曲折形狀的銅箔製作出兩極分開，而同極前後串接的一小矩形焊盤及一大矩形焊盤；該小矩形焊盤與該大矩形焊盤的兩極分開處，分別具有一小焊島及一大焊島；且該大矩形焊盤的一極端，並相接一具有導電性的第一導電穿孔貫穿至該PCB基板的背面，而另一極端，則以一環迴路相接一具有導電性的第二導電穿孔貫穿至該PCB基板的背面；該PCB基板背面的該第一導電穿孔及該第二導電穿孔，並由一迴繞的第一天線迴路形成電性相接；該RFID無線射頻晶片，係設在該PCB基板正面，電性相接在該小矩形焊盤/或該大矩形焊盤的 兩極上，並連同該PCB基板，一併被該絕緣包覆體包覆；藉由該PCB基板正面上同極連接的小矩形焊盤及大矩形焊盤各搭配小焊島與大焊島，可供不同封裝或規格形式的RFID無線射頻晶片電性連接，俾使該無線射頻識別單元因應市場不同需求，採用或替換不同封裝或規格形式的RFID無線射頻識別晶片時，不需變更PCB基板的銅箔迴路設計，即，多種不同封裝或規格形式的RIFD無線射頻晶片可共用在相同的該PCB基板上，能使無線射頻識別單元的生產或製造，提高市場需求的因應能力與經濟效益。 The main purpose of this creation is to provide a radio frequency identification unit antenna pad structure. A coil is surrounded by a radio frequency identification unit for identifying objects. The RFID on the radio frequency identification unit can be read by a reader. The ID identification code of the radio frequency chip identifies the identification object; the radio frequency identification unit covers a PCB substrate with an insulating coating. The front side of the PCB substrate is made of copper foil with multiple zigzag shapes to separate the two poles. , And a small rectangular pad and a large rectangular pad connected in series with the same pole; where the two poles of the small rectangular pad and the large rectangular pad are separated, there are a small solder island and a large solder island respectively; and One end of the large rectangular pad is connected to a conductive first conductive through hole to penetrate to the back of the PCB substrate, and the other end is connected to a conductive second conductive through hole in a loop to penetrate to the back of the PCB substrate. The back of the PCB substrate; the first conductive through hole and the second conductive through hole on the back of the PCB substrate are electrically connected by a winding first antenna loop; the RFID radio frequency chip is set on the PCB The front side of the substrate is electrically connected to the small rectangular pad/or the large rectangular pad The two poles, together with the PCB substrate, are covered by the insulating covering; the small rectangular pads and the large rectangular pads connected to the same pole on the front of the PCB substrate are each matched with a small solder island and a large solder island. It can be electrically connected to RFID radio frequency chips of different packages or specifications, so that the radio frequency identification unit can adapt or replace RFID radio frequency identification chips of different packages or specifications in response to different market needs without changing the PCB substrate. The copper foil circuit design, that is, a variety of RIFD radio frequency chips of different packages or specifications can be shared on the same PCB substrate, enabling the production or manufacturing of radio frequency identification units, improving the ability to respond to market demand and economic benefits.

本創作之次一目的係在提供一種無線射頻識別單元天線焊盤結構，其中，該RFID無線射頻晶片，為一電性連接在該PCB基板大矩形焊盤兩極上的六埠DFN/QFN封裝IC晶片，俾使該RFID無線射頻晶片，能採用SMT(Surface Mount Technology)表面貼焊工藝在該PCB基板上完成焊接。 The second purpose of this creation is to provide a radio frequency identification unit antenna pad structure, where the RFID radio frequency chip is a six-port DFN/QFN packaged IC electrically connected to the two poles of the large rectangular pad on the PCB substrate The chip, so that the RFID radio frequency chip can be soldered on the PCB substrate by using the SMT (Surface Mount Technology) surface mount soldering process.

本創作之再一目的係在提供一種無線射頻識別單元天線焊盤結構，其中，該RFID無線射頻晶片，為一電性連接在該PCB基板小矩形焊盤兩極上的四埠DFN/QFN封裝IC晶片，俾使該RFID無線射頻晶片，能採用SMT(Surface Mount Technology)表面貼焊工藝在該PCB基板上完成焊接。 Another purpose of this creation is to provide a radio frequency identification unit antenna pad structure, wherein the RFID radio frequency chip is a four-port DFN/QFN packaged IC electrically connected to the two poles of the small rectangular pad on the PCB substrate The chip, so that the RFID radio frequency chip can be soldered on the PCB substrate by using the SMT (Surface Mount Technology) surface mount soldering process.

本創作之另一目的係在提供一種無線射頻識別單元天線焊盤結構，其中，該RFID無線射頻晶片，為一設在該PCB基板小焊島與大焊島上，且電性連接該小矩形焊盤與大矩形焊盤交接處兩極上的多埠覆晶封裝(Flip Chip)晶片，俾使該RFID無線射頻晶片，能用異方性導電膠焊接在該PCB基板上。 Another purpose of this creation is to provide a radio frequency identification unit antenna pad structure, wherein the RFID radio frequency chip is set on the small solder island and the large solder island of the PCB substrate, and is electrically connected to the small rectangular solder The multi-port flip chip (Flip Chip) chip on the two poles at the junction of the disk and the large rectangular pad enables the RFID radio frequency chip to be soldered on the PCB substrate with anisotropic conductive glue.

本創作之又一目的係在提供一種無線射頻識別單元天線焊盤結構，其中，該RFID無線射頻晶片，為一貼設在該PCB基板小焊島/或大焊島上，且與該小矩形焊盤/或大矩形焊盤兩極電性連接的裸晶(IC Chip)晶片，俾使該RFID無線射頻晶片，能採用COB(Chip On Board)打線工藝，電性連接在該PCB基板上使用。 Another purpose of this creation is to provide a radio frequency identification unit antenna pad structure, wherein the RFID radio frequency chip is attached to a small solder island/or a large solder island on the PCB substrate, and is soldered to the small rectangle A die (IC Chip) chip with two poles electrically connected to the disk/or a large rectangular pad, so that the RFID radio frequency chip can adopt COB (Chip On Board) wire bonding process and be electrically connected to the PCB substrate for use.

10:無線射頻識別單元 10: Radio frequency identification unit

11:絕緣包覆體 11: Insulation coating

12:PCB基板 12: PCB substrate

13:小矩形焊盤 13: Small rectangular pad

14:大矩形焊盤 14: Large rectangular pad

140:環迴路 140: Loop

15:小焊島 15: Small solder island

16:大焊島 16: Big welding island

17:第一導電穿孔 17: The first conductive through hole

18:第二導電穿孔 18: The second conductive through hole

19:第一天線迴路 19: The first antenna loop

20:線圈 20: coil

30、30A、30B、30C:RFID無線射頻晶片 30, 30A, 30B, 30C: RFID radio frequency chip

圖1係本創作圍繞線圈的狀態示意圖 Figure 1 is a schematic diagram of the state of the creation surrounding the coil

圖2係本創作外觀立體圖 Figure 2 is a three-dimensional view of the appearance of this creation

圖3係本創作剖面結構示意圖 Figure 3 is a schematic diagram of the cross-sectional structure of this creation

圖4係本創作PCB基板焊接RFID無線射頻晶片前的立體圖 Figure 4 is a three-dimensional view of the original creation's PCB substrate before welding the RFID radio frequency chip

圖5係本創作PCB基板正面迴路示意圖 Figure 5 is a schematic diagram of the front circuit of the PCB substrate of this creation

圖6係本創作PCB基板背面迴路示意圖 Figure 6 is a schematic diagram of the back circuit of the PCB substrate of this creation

圖7係本創作PCB基板完成RFID無線射頻晶片焊接時的狀態示意圖 Figure 7 is a schematic diagram of the state of the creation of the PCB substrate when the RFID radio frequency chip is soldered

圖8係本創作PCB基板使用另一種DFN/QFN形式RFID無線射頻晶片的焊接前立體圖 Figure 8 is a perspective view of another DFN/QFN type RFID radio frequency chip before welding on the PCB substrate of the original creation

圖9係本創作PCB基板完成另一種DFN/QFN形式RFID無線射頻晶片的焊接時的狀態示意圖 Figure 9 is a schematic diagram of the state when the PCB substrate of the original creation completes the welding of another DFN/QFN type RFID radio frequency chip.

圖10係本創作PCB基板使用覆晶封裝形式RFID無線射頻晶片的焊接前立體圖 Figure 10 is a three-dimensional view of the RFID radio frequency chip in the form of flip-chip packaging on the PCB substrate of the original creation before welding

圖11係本創作PCB基板完成覆晶封裝形式RFID無線射頻晶片的焊接時的狀態示意圖 Figure 11 is a schematic diagram of the state of the PCB substrate of this creation when the flip-chip package RFID radio frequency chip is soldered

圖12係本創作PCB基板使用裸晶形式RFID無線射頻晶片的焊接前立體圖 Figure 12 is a three-dimensional view of the original creation PCB substrate using a bare RFID radio frequency chip before welding

圖13係本創作PCB基板完成裸晶封裝形式RFID無線射頻晶片的焊接時的狀態示意圖 Figure 13 is a schematic diagram of the state of the creation of the PCB substrate when the soldering of the RFID radio frequency chip in the form of a bare chip package is completed

本創作為達上述目的，特舉較佳實施例，並配合所附圖式，作詳細說明如下： In order to achieve the above-mentioned purpose, this creation specially presents the preferred embodiments, and in conjunction with the attached drawings, the detailed description is as follows:

一種無線射頻識別單元天線焊盤結構，如圖1、3，係一無線射頻識別單元10之周邊圍繞一線圈20，用於識別物體上(圖未示)，可由讀取裝置(圖未示)讀取該無線射頻識別單元10上的RFID無線射頻晶片30之ID識別碼，辨識該識別物體；如圖2、3，該無線射頻識別單元10，係以一絕緣包覆體11包覆一PCB基板12，如圖4、5、6，該PCB基板12的正面，係以多曲折形狀的銅箔製作出兩極分開，而同極前後串接的一小矩形焊盤13及一大矩形焊盤14；該小矩形焊盤13與該大矩形焊盤14的兩極分開處，分別具有一小焊島15及一大焊島16；且該大矩形焊盤14的一極端，並相接一具有導電性的第一導電穿孔17貫穿至該PCB基板12的背面，而另一極端，則以一環迴路140相接一具有導電性的第二導電穿孔18貫穿至該PCB基板12的背面；該PCB基板12背面的該第一導電穿孔17及該第二導電穿孔18，並由一迴繞的第一天線迴路19形成電性相接；如圖3、4、7，該RFID無線射頻晶片30，係設在該PCB基板12正面，電性相接在該小矩形焊盤13/或該大矩形焊盤14的兩極上，並連同該PCB基板1 2，一併被該絕緣包覆體11包覆；如圖4、5、7，藉由該PCB基板12正面上同極連接的小矩形焊盤13及大矩形焊盤14各搭配小焊島15與大焊島16，可供不同封裝或規格形式的RFID無線射頻晶片30電性連接，俾使該無線射頻識別單元10因應市場不同需求，採用或替換不同封裝或規格形式的RFID無線射頻識別晶片30時，不需變更PCB基板12的銅箔迴路設計，即，多種不同封裝或規格形式的RIFD無線射頻晶片30可共用在相同的該PCB基板12上，能使無線射頻識別單元10的生產或製造，提高市場需求的因應能力與經濟效益。 An antenna pad structure of a radio frequency identification unit, as shown in Figures 1 and 3, is a coil 20 around a radio frequency identification unit 10 for identifying objects (not shown), which can be read by a reading device (not shown) Read the ID identification code of the RFID radio frequency chip 30 on the radio frequency identification unit 10 to identify the identification object; as shown in Figures 2 and 3, the radio frequency identification unit 10 is covered with an insulating coating 11 on a PCB The substrate 12, as shown in Figures 4, 5, and 6, the front side of the PCB substrate 12 is made of copper foil with multiple zigzag shapes to separate two poles, and a small rectangular pad 13 and a large rectangular pad are connected in series before and after the same pole. 14; The small rectangular pad 13 and the large rectangular pad 14 have a small solder island 15 and a large solder island 16 where the two poles are separated; and one end of the large rectangular pad 14 is connected with The conductive first conductive through hole 17 penetrates to the back of the PCB substrate 12, and at the other extreme, a loop 140 is connected to a conductive second conductive through hole 18 to penetrate to the back of the PCB substrate 12; the PCB The first conductive through hole 17 and the second conductive through hole 18 on the back of the substrate 12 are electrically connected by a winding first antenna loop 19; as shown in Figs. 3, 4, and 7, the RFID radio frequency chip 30, It is set on the front of the PCB substrate 12, electrically connected to the two poles of the small rectangular pad 13/or the large rectangular pad 14, and together with the PCB substrate 1 2. It is also covered by the insulating covering 11; as shown in Figures 4, 5, and 7, the small rectangular pads 13 and the large rectangular pads 14 connected to the same pole on the front of the PCB substrate 12 are each matched with a small solder island 15 and the large soldering island 16, which can be electrically connected to RFID radio frequency chips 30 of different packages or specifications, so that the radio frequency identification unit 10 can adapt or replace RFID radio frequency identification of different packages or specifications in response to different market needs When the chip 30 is used, the copper foil circuit design of the PCB substrate 12 does not need to be changed. That is, the RIFD radio frequency chips 30 of different packages or specifications can be shared on the same PCB substrate 12, enabling the production of the radio frequency identification unit 10 Or manufacturing to improve the ability to respond to market demand and economic benefits.

根據上述實施例，其中，如圖4，該RFID無線射頻晶片30，為一電性連接在該PCB基板12大矩形焊盤14兩極上的六埠DFN/QFN封裝IC晶片，俾使該RFID無線射頻晶片30，能採用SMT(Surface Mount Technology)表面貼焊工藝在該PCB基板12上完成焊接。 According to the above embodiment, as shown in FIG. 4, the RFID wireless radio frequency chip 30 is a six-port DFN/QFN packaged IC chip electrically connected to the two poles of the large rectangular pad 14 of the PCB substrate 12 to make the RFID wireless The radio frequency chip 30 can be soldered on the PCB substrate 12 by using the SMT (Surface Mount Technology) surface mount soldering process.

根據上述實施例，其中，如圖8、9，該RFID無線射頻晶片30A，為一電性連接在該PCB基板12小矩形焊盤13兩極上的四埠DFN/QFN封裝IC晶片，俾使該RFID無線射頻晶片30A，能採用SMT(Surface Mount Technology)表面貼焊工藝在該PCB基板12上完成焊接。 According to the above-mentioned embodiment, as shown in Figures 8 and 9, the RFID radio frequency chip 30A is a four-port DFN/QFN packaged IC chip electrically connected to the two poles of the small rectangular pad 13 of the PCB substrate 12 to make the The RFID radio frequency chip 30A can be soldered on the PCB substrate 12 by using the SMT (Surface Mount Technology) surface mount soldering process.

根據上述實施例，其中，如圖10、11，該RFID無線射頻晶片30B，為一貼設在該PCB基板12小焊島15與大焊島16上，且電性連接該小矩形焊盤13與大矩形焊盤14交接處兩極上的多埠覆晶封裝(Flip Chip)晶片，俾使該RFID無線射頻晶片30B，能用異方性導電膠焊接在該PCB基板12上。 According to the above embodiment, as shown in Figs. 10 and 11, the RFID radio frequency chip 30B is attached to the small solder island 15 and the large solder island 16 of the PCB substrate 12, and is electrically connected to the small rectangular pad 13 The multi-port flip chip (Flip Chip) chip on the two poles at the junction with the large rectangular pad 14 enables the RFID radio frequency chip 30B to be soldered on the PCB substrate 12 with anisotropic conductive glue.

根據上述實施例，其中，如圖12、13，該RFID無線射頻晶片30C，為一貼設在該PCB基板12小焊島15/或大焊島16上，且與該小矩形焊盤13/或大矩形焊盤14兩極電性連接的裸晶(IC Chip)晶片，俾使該RFID無線射頻晶片30C，能採用COB(Chip On Board)打線(打金線或鋁線)工藝，電性連接在該PCB基板12上使用。 According to the above embodiment, as shown in Figures 12 and 13, the RFID radio frequency chip 30C is a small solder island 15/or a large solder island 16 attached to the PCB substrate 12, and is connected to the small rectangular pad 13/ Or a bare chip (IC Chip) chip with the two poles of the large rectangular pad 14 electrically connected, so that the RFID radio frequency chip 30C can adopt COB (Chip On Board) wire bonding (gold wire or aluminum wire) process for electrical connection It is used on the PCB substrate 12.

以上說明對本創作而言只是說明性的，而非限制性的，本領域普通技術人員理解，在不脫離所附說明書所限定的精神和範圍的情況下，可做出許多修改、變化或等效，但都將落入本創作的保護範圍內。 The above description is only illustrative, not restrictive, for this creation. Those of ordinary skill in the art understand that many modifications, changes or equivalents can be made without departing from the spirit and scope defined by the attached specification. , But all will fall into the protection scope of this creation.

12:PCB基板 12: PCB substrate

13:小矩形焊盤 13: Small rectangular pad

14:大矩形焊盤 14: Large rectangular pad

140:環迴路 140: Loop

15:小焊島 15: Small solder island

16:大焊島 16: Big welding island

17:第一導電穿孔 17: The first conductive through hole

18:第二導電穿孔 18: The second conductive through hole

30:RFID無線射頻晶片 30: RFID wireless radio frequency chip

Claims (5)

一種無線射頻識別單元天線焊盤結構，係一無線射頻識別單元之周邊圍繞一線圈，用於識別物體上，可由讀取裝置讀取該無線射頻識別單元上的RFID無線射頻晶片之ID識別碼，辨識該識別物體；該無線射頻識別單元，係以一絕緣包覆體包覆一PCB基板，該PCB基板的正面，係以多曲折形狀的銅箔製作出兩極分開，而同極前後串接的一小矩形焊盤及一大矩形焊盤；該小矩形焊盤與該大矩形焊盤的兩極分開處，分別具有一小焊島及一大焊島；且該大矩形焊盤的一極端，並相接一具有導電性的第一導電穿孔貫穿至該PCB基板的背面，而另一極端，則以一環迴路相接一具有導電性的第二導電穿孔貫穿至該PCB基板的背面；該PCB基板背面的該第一導電穿孔及該第二導電穿孔，並由一迴繞的第一天線迴路形成電性相接；該RFID無線射頻晶片，係設在該PCB基板正面，電性相接在該小矩形焊盤/或該大矩形焊盤的兩極上，並連同該PCB基板，一併被該絕緣包覆體包覆。 An antenna pad structure of a radio frequency identification unit is a coil surrounding a radio frequency identification unit for identifying an object. The ID identification code of the RFID radio frequency chip on the radio frequency identification unit can be read by a reading device, Identify the identification object; the radio frequency identification unit is a PCB substrate covered with an insulating covering. The front side of the PCB substrate is made of copper foil with multiple zigzag shapes to separate the two poles, and the same poles are connected in series before and after A small rectangular pad and a large rectangular pad; the two poles of the small rectangular pad and the large rectangular pad have a small solder island and a large solder island respectively; and one extreme of the large rectangular pad, And a conductive first conductive through hole is connected to the back of the PCB substrate, and the other end is connected to a conductive second conductive through hole to the back of the PCB substrate in a loop; the PCB The first conductive through hole and the second conductive through hole on the back of the substrate are electrically connected by a winding first antenna loop; the RFID radio frequency chip is arranged on the front of the PCB substrate and is electrically connected to The small rectangular pad and/or the two poles of the large rectangular pad, together with the PCB substrate, are covered by the insulating coating. 依據申請專利範圍第1項所述之無線射頻識別單元天線焊盤結構，其中，該RFID無線射頻晶片，為一電性連接在該PCB基板大矩形焊盤兩極上的六埠DFN/QFN封裝IC晶片。 According to the radio frequency identification unit antenna pad structure described in item 1 of the scope of patent application, the RFID radio frequency chip is a six-port DFN/QFN packaged IC electrically connected to the two poles of the large rectangular pad on the PCB substrate Wafer. 依據申請專利範圍第1項所述之無線射頻識別單元天線焊盤結構，其中，該RFID無線射頻晶片，為一電性連接在該PCB基板小矩形焊盤兩極上的四埠DFN/QFN封裝IC晶片。 According to the radio frequency identification unit antenna pad structure described in item 1 of the scope of patent application, the RFID radio frequency chip is a four-port DFN/QFN packaged IC electrically connected to the two poles of the small rectangular pad on the PCB substrate Wafer. 依據申請專利範圍第1項所述之無線射頻識別單元天線焊盤結構，其中，該RFID無線射頻晶片，為一設在該PCB基板小焊島與大焊島 上，且電性連接該小矩形焊盤與大矩形焊盤交接處兩極上的多埠覆晶封裝(Flip Chip)晶片。 According to the radio frequency identification unit antenna pad structure described in item 1 of the scope of patent application, the RFID radio frequency chip is a small solder island and a large solder island set on the PCB substrate It is electrically connected to the multi-port flip chip (Flip Chip) chip on the two poles of the junction of the small rectangular pad and the large rectangular pad. 依據申請專利範圍第1項所述之無線射頻識別單元天線焊盤結構，其中，該RFID無線射頻晶片，為一貼設在該PCB基板小焊島/或大焊島上，且與該小矩形焊盤/或大矩形焊盤兩極電性連接的裸晶(IC Chip)晶片。 According to the radio frequency identification unit antenna pad structure described in item 1 of the scope of patent application, the RFID radio frequency chip is a small solder island/or a large solder island attached to the PCB substrate, and is soldered to the small rectangle A die (IC Chip) chip in which the two poles of the plate/or the large rectangular pad are electrically connected.
TW110210116U 2021-08-27 2021-08-27 Antenna welding disc structure for radio frequency identification unit TWM619301U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW110210116U TWM619301U (en) 2021-08-27 2021-08-27 Antenna welding disc structure for radio frequency identification unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110210116U TWM619301U (en) 2021-08-27 2021-08-27 Antenna welding disc structure for radio frequency identification unit

Publications (1)

Publication Number Publication Date
TWM619301U true TWM619301U (en) 2021-11-01

Family

ID=79908564

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110210116U TWM619301U (en) 2021-08-27 2021-08-27 Antenna welding disc structure for radio frequency identification unit

Country Status (1)

Country Link
TW (1) TWM619301U (en)

Similar Documents

Publication Publication Date Title
US5972156A (en) Method of making a radio frequency identification tag
KR101897944B1 (en) Method for Embedding an Integrated Circuit Flip Chip
US7630209B2 (en) Universal PCB and smart card using the same
JP5234071B2 (en) RFIC module
US9390365B2 (en) Integrated circuit module for a dual-interface smart card
US7425755B2 (en) Semiconductor package, method for manufacturing the same and lead frame for use in the same
MX2014009459A (en) Rfid antenna modules and methods.
US20160275391A1 (en) Miniature rfid tag with coil on ic package
US20110169115A1 (en) Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products
US20110204147A1 (en) Smartcard interconnect
US9536188B2 (en) Dual-interface IC card components and method for manufacturing the dual-interface IC card components
US9424507B2 (en) Dual interface IC card components and method for manufacturing the dual-interface IC card components
JP2014178731A (en) Method for manufacturing semiconductor device
TWM619301U (en) Antenna welding disc structure for radio frequency identification unit
WO2016070698A1 (en) Multilayer wiring coupling dual interface card carrier-band module
JP3572216B2 (en) Contactless data carrier
CN107832825A (en) Coupled RF identification label and preparation method thereof
US20110259965A1 (en) High performance glass transponder
CN213092344U (en) Carrier band and smart card
TW201134332A (en) Printed circuit board with embedded antenna for RFID tag and method for manufacturing the same
CN207882942U (en) Coupled RF identifies label
JP2012248154A (en) Rfid tag and communication device using the same
EP3079105B1 (en) Dual-interface ic card components and method for manufacturing the dual-interface ic card components
JP3231664B2 (en) Thin IC card and method of manufacturing the same
JP2001143039A (en) Semiconductor device and manufacturing method therefor