TWM613976U - Lead frame structure - Google Patents
Lead frame structure Download PDFInfo
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- TWM613976U TWM613976U TW110201630U TW110201630U TWM613976U TW M613976 U TWM613976 U TW M613976U TW 110201630 U TW110201630 U TW 110201630U TW 110201630 U TW110201630 U TW 110201630U TW M613976 U TWM613976 U TW M613976U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
Description
本揭露係關於一種導線架結構及一種導線架結構的製造方法。The disclosure relates to a lead frame structure and a manufacturing method of the lead frame structure.
一般而言，用於發光二極體(LED)的導線架結構可包括電極及電極上的擋牆。當LED設置於電極上時，擋牆可圍繞LED。擋牆可用環氧樹酯形成。在製作前述的導線架結構時，由於水平切割與垂直切割的原因，導線架結構的電極的側面通常齊平於其上方的環氧樹酯的側面，使導線架結構的外側面為平面。此外，在組裝導線架結構與電路板時，導線架結構下方會塗佈接合層。接合層位於導線架結構與電路板之間，以穩固導線架結構於電路板上。然而，當接合層夾於導線架結構與電路板之間時，檢測人員無法目測觀察導線架結構下方的接合層，因此檢測人員無法得知接合層是否均勻塗佈於導線架結構與電路板之間，造成導線架結構在封裝應用時產生缺陷，降低了導線架結構之產品的良率。Generally speaking, a lead frame structure for a light emitting diode (LED) may include electrodes and retaining walls on the electrodes. When the LED is arranged on the electrode, the retaining wall can surround the LED. The retaining wall can be formed with epoxy resin. When making the aforementioned lead frame structure, due to horizontal cutting and vertical cutting, the side surface of the electrode of the lead frame structure is usually flush with the side surface of the epoxy resin above it, so that the outer side of the lead frame structure is flat. In addition, when assembling the lead frame structure and the circuit board, the bonding layer is coated under the lead frame structure. The bonding layer is located between the lead frame structure and the circuit board to stabilize the lead frame structure on the circuit board. However, when the bonding layer is sandwiched between the lead frame structure and the circuit board, the inspector cannot visually observe the bonding layer under the lead frame structure. Therefore, the inspector cannot know whether the bonding layer is evenly coated between the lead frame structure and the circuit board. At the same time, the lead frame structure is caused to produce defects in the packaging application, and the yield of the lead frame structure product is reduced.
本揭露之一技術態樣為一種導線架結構。One technical aspect of this disclosure is a lead frame structure.
根據本揭露一實施方式，一種導線架結構包括底板以及擋牆。底板具有第一導電部與第二導電部。第一導電部與第二導電部分開。第一導電部與第二導電部配置以電性連接光源。擋牆位於底板上，且擋牆圍繞出一開口。第一導電部與第二導電部從開口裸露。第一導電部與第二導電部各具有延伸部。延伸部沿水平方向延伸而超出擋牆的外表面。According to an embodiment of the present disclosure, a lead frame structure includes a bottom plate and a retaining wall. The bottom plate has a first conductive portion and a second conductive portion. The first conductive part is separated from the second conductive part. The first conductive portion and the second conductive portion are configured to be electrically connected to the light source. The retaining wall is located on the bottom plate, and the retaining wall surrounds an opening. The first conductive portion and the second conductive portion are exposed from the opening. The first conductive portion and the second conductive portion each have an extension portion. The extension part extends in the horizontal direction beyond the outer surface of the retaining wall.
在本揭露一實施方式中，上述底板具有絕緣部。絕緣部位於第一導電部與第二導電部之間。In an embodiment of the present disclosure, the bottom plate has an insulating portion. The insulating part is located between the first conductive part and the second conductive part.
在本揭露一實施方式中，上述第一導電部與第二導電部之兩延伸部各具有遠離擋牆的外側面，且兩延伸部的兩外側面各具有凹部。In an embodiment of the present disclosure, the two extension portions of the first conductive portion and the second conductive portion each have an outer surface away from the retaining wall, and the two outer surfaces of the two extension portions each have a concave portion.
在本揭露一實施方式中，上述第一導電部與第二導電部之兩延伸部各具有遠離擋牆的外側面，且兩延伸部的兩外側面各具有凸部。In an embodiment of the present disclosure, the two extension portions of the first conductive portion and the second conductive portion each have an outer surface away from the retaining wall, and the two outer surfaces of the two extension portions each have a convex portion.
在本揭露一實施方式中，上述第一導電部與第二導電部之兩延伸部各具有遠離擋牆的外側面，且兩延伸部的兩外側面皆整個為平面。In an embodiment of the present disclosure, the two extension portions of the first conductive portion and the second conductive portion each have an outer surface away from the retaining wall, and both outer surfaces of the two extension portions are entirely flat.
在本揭露一實施方式中，上述第一導電部之延伸部的底面以及第二導電部之延伸部的底面配置以塗佈接合層。In an embodiment of the present disclosure, the bottom surface of the extension portion of the first conductive portion and the bottom surface of the extension portion of the second conductive portion are configured to coat the bonding layer.
在本揭露一實施方式中，上述第一導電部之延伸部的底面與第二導電部之延伸部的底面各具有凹部。In an embodiment of the present disclosure, the bottom surface of the extension portion of the first conductive portion and the bottom surface of the extension portion of the second conductive portion each have a concave portion.
在本揭露一實施方式中，上述第一導電部之延伸部的底面的凹部及第二導電部之延伸部的底面的凹部配置以塗佈接合層。In an embodiment of the present disclosure, the recesses on the bottom surface of the extension portion of the first conductive portion and the recesses on the bottom surface of the extension portion of the second conductive portion are configured to coat the bonding layer.
在本揭露一實施方式中，上述底板還具有第三導電部。絕緣部延伸至第二導電部與第三導電部之間。第三導電部具有延伸部。第三導電部的延伸部沿水平方向延伸而超出擋牆的外表面。In an embodiment of the present disclosure, the above-mentioned base plate further has a third conductive portion. The insulating part extends between the second conductive part and the third conductive part. The third conductive part has an extension. The extension portion of the third conductive portion extends in the horizontal direction and exceeds the outer surface of the retaining wall.
在本揭露一實施方式中，上述底板還具有第四導電部。絕緣部延伸至第一導電部與第四導電部之間。第四導電部具有延伸部。第四導電部的延伸部沿水平方向延伸而超出擋牆的外表面。In an embodiment of the present disclosure, the above-mentioned base plate further has a fourth conductive portion. The insulating portion extends between the first conductive portion and the fourth conductive portion. The fourth conductive part has an extension. The extension portion of the fourth conductive portion extends in the horizontal direction and exceeds the outer surface of the retaining wall.
本揭露之一技術態樣為一種導線架結構的製造方法。One technical aspect of this disclosure is a manufacturing method of a lead frame structure.
根據本揭露一實施方式，一種導線架結構的製造方法包括：形成具有第一導電部與第二導電部的底板，其中第一導電部與第二導電部分開，第一導電部與第二導電部各具有延伸部；以及使用遮蔽兩延伸部的模具在底板上形成擋牆，使延伸部沿水平方向延伸而超出擋牆的外表面，其中擋牆圍繞出一開口，且第一導電部與第二導電部從開口裸露。According to an embodiment of the present disclosure, a method for manufacturing a lead frame structure includes: forming a bottom plate having a first conductive portion and a second conductive portion, wherein the first conductive portion is separated from the second conductive portion, and the first conductive portion is separated from the second conductive portion. Each part has an extension; and a mold that shields the two extensions is used to form a retaining wall on the bottom plate, so that the extension extends in the horizontal direction beyond the outer surface of the retaining wall, wherein the retaining wall surrounds an opening, and the first conductive portion and The second conductive part is exposed from the opening.
在本揭露一實施方式中，上述方法更包括：蝕刻第一導電部之延伸部的底面與第二導電部之延伸部的底面，使第一導電部之延伸部的底面與第二導電部之延伸部的底面各具有凹部。In an embodiment of the present disclosure, the above method further includes: etching the bottom surface of the extension portion of the first conductive portion and the bottom surface of the extension portion of the second conductive portion so that the bottom surface of the extension portion of the first conductive portion and the bottom surface of the second conductive portion are The bottom surface of the extension portion each has a recess.
在本揭露上述實施方式中，由於導線架結構的第一導電部與第二導電部具有延伸部，且第一導電部與第二導電部的延伸部沿水平方向延伸而超出其上方之擋牆的外表面，因此當接合層塗佈於導線架結構下方而與電路板接合後，受擠壓的接合層可從延伸部溢出，使接合層易於觀察。如此一來，檢測人員便可藉由觀察位於延伸部的接合層來確保接合層已均勻填滿導線架結構下方，以降低導線架結構的缺陷並提高導線架結構之產品的良率，使導線架結構可應用於後續封裝製程中。In the above-mentioned embodiment of the present disclosure, the first conductive portion and the second conductive portion of the lead frame structure have extensions, and the extensions of the first conductive portion and the second conductive portion extend in the horizontal direction beyond the retaining wall above them. Therefore, when the bonding layer is coated under the lead frame structure and bonded with the circuit board, the squeezed bonding layer can overflow from the extension, making the bonding layer easy to observe. In this way, the inspector can observe the bonding layer located at the extension to ensure that the bonding layer has evenly filled the bottom of the lead frame structure, so as to reduce the defects of the lead frame structure and improve the yield rate of the product of the lead frame structure, so that the wire The frame structure can be used in subsequent packaging processes.
以下揭示之實施方式內容提供了用於實施所提供的標的之不同特徵的許多不同實施方式，或實例。下文描述了元件和佈置之特定實例以簡化本案。當然，該等實例僅為實例且並不意欲作為限制。此外，本案可在各個實例中重複元件符號及/或字母。此重複係用於簡便和清晰的目的，且其本身不指定所論述的各個實施方式及/或配置之間的關係。The implementation content disclosed below provides many different implementations, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the case. Of course, these examples are only examples and are not intended as limitations. In addition, in this case, component symbols and/or letters may be repeated in each instance. This repetition is used for simplicity and clarity, and does not in itself specify the relationship between the various embodiments and/or configurations discussed.
諸如「在……下方」、「在……之下」、「下部」、「在……之上」、「上部」等等空間相對術語可在本文中為了便於描述之目的而使用，以描述如附圖中所示之一個元件或特徵與另一元件或特徵之關係。空間相對術語意欲涵蓋除了附圖中所示的定向之外的在使用或操作中的裝置的不同定向。裝置可經其他方式定向(旋轉90度或以其他定向)並且本文所使用的空間相對描述詞可同樣相應地解釋。Spatially relative terms such as "below", "below", "lower", "above", "upper" and so on can be used in this article for the purpose of description, to describe The relationship between one element or feature and another element or feature is shown in the drawings. The spatial relative terms are intended to cover different orientations of the device in use or operation in addition to the orientations shown in the figures. The device can be oriented in other ways (rotated by 90 degrees or in other orientations) and the spatial relative descriptors used herein can also be interpreted accordingly.
第1圖繪示根據本揭露一實施方式之導線架結構100的立體圖。請參照第1圖，導線架結構100包括底板110以及擋牆120。導線架結構100的底板110具有第一導電部112與第二導電部114。底板110的第一導電部112與第二導電部114分開。底板110的第一導電部112與第二導電部114配置以電性連接光源130。舉例來說，光源130可為發光二極體，其底面(例如正極)電性連接第一導電部112，其頂面(例如負極)利用導線電性連接第二導電部114。導線架結構100的擋牆120位於底板110上，且擋牆120圍繞出一開口122。擋牆120的開口122圍繞光源130，可用於遮光或反射用途。底板110的第一導電部112與第二導電部114從擋牆120的開口122中裸露。底板110的第一導電部112與第二導電部114皆具有延伸部118。第一導電部112與第二導電部114的延伸部118沿水平方向D1延伸而超出擋牆120的外表面124。在一些實施方式中，導線架結構100之擋牆120的材質可包括環氧樹脂，可利用模製方式形成。FIG. 1 is a perspective view of a
在一些實施方式中，第一導電部112與第二導電部114的延伸部118具有遠離擋牆120的外側面119。並且，第一導電部112與第二導電部114的延伸部118的外側面119具有凹部119a。舉例來說，延伸部118的凹部119a可位於延伸部118的外側面119的中間處。此外，導線架結構100的底板110具有絕緣部116。底板110的絕緣部116位於底板110的第一導電部112與第二導電部114之間，以間隔第一導電部112與第二導電部114，避免短路。並且，底板110的絕緣部116從擋牆120圍繞出的開口122中裸露。In some embodiments, the
第2圖繪示第1圖中導線架結構100的下視圖。第3圖繪示第1圖的導線架結構100塗佈接合層140且與電路板200接合後的上視圖。同時參照第2圖與第3圖，在一些實施方式中，第一導電部112與第二導電部114的延伸部118的底面117可塗佈接合層140。舉例來說，接合層140可為錫膏，但並不以此為限。當導線架結構100塗佈接合層140與電路板200接合後，接合層140可讓導線架結構100穩固於電路板200上，還可讓導線架結構100的第一導電部112與第二導電部114電性連接電路板200。FIG. 2 shows a bottom view of the
具體而言，由於導線架結構100的第一導電部112與第二導電部114具有延伸部118，且第一導電部112與第二導電部114的延伸部118沿水平方向D1延伸而超出其上方之擋牆120的外表面124，因此當接合層140塗佈於導線架結構100下方而與電路板200接合後，受擠壓的接合層140可從延伸部118的凹部119a溢出，使接合層140易於觀察。如此一來，檢測人員便可藉由觀察位於延伸部118的接合層140來確保接合層140已均勻填滿導線架結構100下方，以降低導線架結構100的缺陷並提高導線架結構100之產品的良率，使導線架結構100可應用於後續封裝製程中。Specifically, since the first
應理解到，已敘述的元件連接關係與功效將不重覆贅述，合先敘明。在以下敘述中，將說明其他形式的延伸部。It should be understood that the connection relationships and functions of the components that have been described will not be repeated and will be described first. In the following description, other types of extensions will be explained.
第4圖繪示根據本揭露另一實施方式之導線架結構100a的下視圖。導線架結構100a包括底板110以及擋牆120。導線架結構100a的底板110具有第一導電部112與第二導電部114。與第2圖之實施方式不同地方在於，除了延伸部118的外側面119具有凹部119a外，第一導電部112與第二導電部114之延伸部118的底面117還具有凹部117a。在一些實施方式中，凹部117a在水平方向D1的深度較凹部119a深。也就是說，凹部117a較凹部119a靠近絕緣部116。位於延伸部118的底面117的凹部117a可藉由蝕刻製程所形成。舉例來說，可在延伸部118的底面117蝕刻延伸部118的一半厚度以形成凹部117a。延伸部118的凹部117a具有較大的容納空間，使第3圖中的接合層140(見第3圖)可位於其中，以提高穩固效果。當接合層140塗佈於導線架結構100a下方時，延伸部118的凹部117a可容納較多的接合層140。因此，延伸部118的凹部117a可加強穩固導線架結構100a與電路板200(見第3圖)之間的位置關係。FIG. 4 is a bottom view of a
第5圖繪示根據本揭露再一實施方式之導線架結構100b的上視圖。導線架結構100b包括底板110以及擋牆120。導線架結構100b的底板110具有第一導電部112與第二導電部114。第一導電部112與第二導電部114的延伸部118具有遠離擋牆120的外側面119。與第3圖之實施方式不同地方在於，延伸部118的外側面119具有凸部119b。由於延伸部118的外側面119具有凸部119b，且凸部119b沿水平方向D1延伸而超出其上方之擋牆120的外表面124，因此當接合層140塗佈於導線架結構100b下方而導線架結構100b與電路板200接合後，受擠壓的接合層140可從延伸部118的外側面119及凸部119b溢出，使接合層140易於觀察。如此一來，檢測人員便可藉由觀察位於延伸部118的接合層140來確保接合層140已均勻填滿導線架結構100b下方，以降低導線架結構100b的缺陷，使導線架結構100b可應用於後續封裝製程中。FIG. 5 shows a top view of a
第6圖繪示根據本揭露又一實施方式之導線架結構100c的上視圖。導線架結構100c包括底板110以及擋牆120。導線架結構100c的底板110具有第一導電部112與第二導電部114。第一導電部112與第二導電部114之延伸部118具有遠離擋牆120的外側面119。與第3圖之實施方式不同地方在於，延伸部118的外側面119整個為平面。由於第一導電部112與第二導電部114的延伸部118的外側面119整個為平面，因此當接合層140塗佈於導線架結構100c下方而與電路板200接合後，受擠壓的接合層140可從延伸部118的外側面119溢出，使接合層140易於觀察。如此一來，檢測人員便可藉由觀察位於延伸部118之外側面119的接合層140來確保接合層140已均勻填滿導線架結構100下方，以降低導線架結構100c的缺陷並提高導線架結構100c之產品的良率。FIG. 6 is a top view of a
第7圖繪示根據本揭露又一實施方式之導線架結構100d的上視圖。導線架結構100d包括底板110以及擋牆120。導線架結構100d的底板110具有第一導電部112與第二導電部114。與第3圖之實施方式不同地方在於，導線架結構100d的底板110還具有第三導電部113，且導線架結構100d的絕緣部116延伸至第二導電部114與第三導電部113之間。底板110的第三導電部113具有延伸部118。第三導電部113的延伸部118沿水平方向D1延伸而超出擋牆120的外表面124。並且，導線架結構100d的絕緣部116延伸至第二導電部114的延伸部118與第三導電部113的延伸部118之間，以提供絕緣效果。 第一導電部112、第二導電部114以及第三導電部113的延伸部118皆具有遠離擋牆120的外側面119，且延伸部118的外側面119具有凹部119a。FIG. 7 shows a top view of a
第8圖繪示根據本揭露又一實施方式之導線架結構100e的上視圖。導線架結構100e包括底板110以及擋牆120。導線架結構100e的底板110具有第一導電部112、第二導電部114以及第三導電部113。與第7圖之實施方式不同地方在於，導線架結構100e的底板110還具有第四導電部115，且導線架結構100e的絕緣部116延伸至第一導電部112與第四導電部115之間。底板110的第四導電部115具有延伸部118。第四導電部115的延伸部118沿水平方向D1延伸而超出擋牆120的外表面124。並且，導線架結構100e的絕緣部116延伸至第一導電部112的延伸部118與第四導電部115的延伸部118之間，以提供絕緣效果。第一導電部112、第二導電部114、第三導電部113以及第四導電部115的延伸部118皆具有遠離擋牆120的外側面119，且延伸部118的外側面119具有凹部119a。FIG. 8 shows a top view of a
在以下敘述中，將說明導線架結構的製造方法。In the following description, the manufacturing method of the lead frame structure will be explained.
第9圖繪示根據本揭露一實施方式之導線架結構的製造方法的流程圖。導線架結構的製造方法包括下列步驟。首先在步驟S1中，形成具有第一導電部與第二導電部的底板，其中第一導電部與第二導電部分開，第一導電部與第二導電部各具有延伸部。接著在步驟S2中，使用遮蔽兩延伸部的模具在底板上形成擋牆，使延伸部沿水平方向延伸而超出擋牆的外表面，其中擋牆圍繞出一開口，且第一導電部與第二導電部從開口裸露。FIG. 9 is a flowchart of a manufacturing method of a lead frame structure according to an embodiment of the present disclosure. The manufacturing method of the lead frame structure includes the following steps. First, in step S1, a bottom plate having a first conductive portion and a second conductive portion is formed, wherein the first conductive portion and the second conductive portion are separated, and the first conductive portion and the second conductive portion each have an extension portion. Next, in step S2, a retaining wall is formed on the bottom plate using a mold that shields the two extensions, so that the extension extends in a horizontal direction beyond the outer surface of the retaining wall, wherein the retaining wall surrounds an opening, and the first conductive portion and the second conductive portion The two conductive parts are exposed from the opening.
在步驟S1中，可在第一導電部與第二導電部之間設置絕緣部，以分開第一導電部與第二導電部。In step S1, an insulating part may be provided between the first conductive part and the second conductive part to separate the first conductive part and the second conductive part.
在步驟S2後，可將光源設置於第一導電部上，且光源可為發光二極體，便可得到第1圖的結構。After step S2, the light source can be disposed on the first conductive part, and the light source can be a light-emitting diode, and the structure of FIG. 1 can be obtained.
在一些實施方式中，導線架結構的製造方法更包括蝕刻第一導電部之延伸部的底面與第二導電部之延伸部的底面，使第一導電部之延伸部的底面與第二導電部之延伸部的底面各具有凹部，如第4圖所示。詳細來說，可在延伸部的底面蝕刻延伸部的一半厚度以形成凹部。位於延伸部之底面的凹部可塗佈接合層。接合層可接合導線架結構與電路板，使導線架結構穩固於電路板上。In some embodiments, the manufacturing method of the lead frame structure further includes etching the bottom surface of the extension portion of the first conductive portion and the bottom surface of the extension portion of the second conductive portion, so that the bottom surface of the extension portion of the first conductive portion and the second conductive portion The bottom surface of the extension part has recesses, as shown in Figure 4. In detail, half of the thickness of the extension portion may be etched on the bottom surface of the extension portion to form the recess. The concave portion located on the bottom surface of the extension portion can be coated with a bonding layer. The bonding layer can join the lead frame structure and the circuit board, so that the lead frame structure is stable on the circuit board.
前述概述了幾個實施方式的特徵，使得本領域技術人員可以更好地理解本揭露的態樣。本領域技術人員應當理解，他們可以容易地將本揭露用作設計或修改其他過程和結構的基礎，以實現與本文介紹的實施方式相同的目的和/或實現相同的優點。本領域技術人員還應該認識到，這樣的等效構造不脫離本揭露的精神和範圍，並且在不脫離本揭露的精神和範圍的情況下，它們可以在這裡進行各種改變，替換和變更。The foregoing outlines the features of several embodiments, so that those skilled in the art can better understand the aspects of the present disclosure. Those skilled in the art should understand that they can easily use the present disclosure as a basis for designing or modifying other processes and structures to achieve the same purpose and/or the same advantages as the embodiments introduced herein. Those skilled in the art should also realize that such equivalent structures do not depart from the spirit and scope of the present disclosure, and they can make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure.
100,100a,100b,100c,100d,100e:導線架結構
110:底板
112:第一導電部
113:第三導電部
114:第二導電部
115:第四導電部
116:絕緣部
117:底面
117a:凹部
118:延伸部
119:外側面
119a:凹部
119b:凸部
120:擋牆
122:開口
124:外表面
130:光源
140:接合層
200:電路板
D1:水平方向100, 100a, 100b, 100c, 100d, 100e: lead frame structure
110: bottom plate
112: The first conductive part
113: Third conductive part
114: second conductive part
115: fourth conductive part
116: Insulation
117:
當結合隨附諸圖閱讀時，得自以下詳細描述最佳地理解本揭露之一實施方式。應強調，根據工業上之標準實務，各種特徵並未按比例繪製且僅用於說明目的。事實上，為了論述清楚，可任意地增大或減小各種特徵之尺寸。 第1圖繪示根據本揭露一實施方式之導線架結構的立體圖。 第2圖繪示第1圖中導線架結構的下視圖。 第3圖繪示第1圖的導線架結構塗佈接合層且與電路板接合後的上視圖。 第4圖繪示根據本揭露另一實施方式之導線架結構的下視圖。 第5圖繪示根據本揭露再一實施方式之導線架結構的上視圖。 第6圖繪示根據本揭露又一實施方式之導線架結構的上視圖。 第7圖繪示根據本揭露又一實施方式之導線架結構的上視圖。 第8圖繪示根據本揭露又一實施方式之導線架結構的上視圖。 第9圖繪示根據本揭露一實施方式之導線架結構的製造方法的流程圖。 When read in conjunction with the accompanying drawings, one of the embodiments of the present disclosure can be best understood from the following detailed description. It should be emphasized that according to industry standard practice, the various features are not drawn to scale and are used for illustrative purposes only. In fact, for clarity of discussion, the size of various features can be increased or decreased arbitrarily. FIG. 1 is a perspective view of a lead frame structure according to an embodiment of the present disclosure. Figure 2 shows a bottom view of the lead frame structure in Figure 1. FIG. 3 is a top view of the lead frame structure of FIG. 1 after the bonding layer is coated and the circuit board is bonded. FIG. 4 is a bottom view of a lead frame structure according to another embodiment of the present disclosure. FIG. 5 is a top view of a lead frame structure according to still another embodiment of the present disclosure. FIG. 6 is a top view of a lead frame structure according to another embodiment of the present disclosure. FIG. 7 is a top view of a lead frame structure according to another embodiment of the present disclosure. FIG. 8 is a top view of a lead frame structure according to another embodiment of the present disclosure. FIG. 9 is a flowchart of a manufacturing method of a lead frame structure according to an embodiment of the present disclosure.
100:導線架結構 100: Lead frame structure
110:底板 110: bottom plate
112:第一導電部 112: The first conductive part
114:第二導電部 114: second conductive part
116:絕緣部 116: Insulation
118:延伸部 118: Extension
119:外側面 119: Outer side
119a:凹部 119a: recess
120:擋牆 120: retaining wall
122:開口 122: open
124:外表面 124: Outer surface
130:光源 130: light source
D1:水平方向 D1: horizontal direction
Claims (10)
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|---|---|---|---|
| TW110201630U TWM613976U (en) | 2021-02-08 | 2021-02-08 | Lead frame structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110201630U TWM613976U (en) | 2021-02-08 | 2021-02-08 | Lead frame structure |
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| Publication Number | Publication Date |
|---|---|
| TWM613976U true TWM613976U (en) | 2021-07-01 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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2021
- 2021-02-08 TW TW110201630U patent/TWM613976U/en unknown
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