TWM613837U - Modular server system and device tray - Google Patents

Abstract

Described herein are modular server systems. The server systems include a server chassis having one or more window bays each having the same dimensions. The system also includes a plurality of device trays each for holding a device that is selected from a plurality of different devices. Each device tray fits in the one or more window bays.

Description

模組化伺服器系統以及裝置盤Modular server system and device disk

本揭露大致有關於一種伺服器系統的模組化前窗。更特定地，本揭露的特點有關於一種整合式機箱，具有有相同尺寸的前窗槽，且配置以容納一個或多個裝置盤，每一裝置盤適於承載不同裝置類型。 This disclosure roughly relates to a modularized front window of a server system. More specifically, the feature of the present disclosure relates to an integrated case, which has a front window slot of the same size and is configured to accommodate one or more device trays, each of which is suitable for carrying different device types.

伺服器係專用的電腦系統，包括使用伺服器機箱(server chassis)整合至單一單元中的許多的電子元件。例如，伺服器可專用於儲存、計算或是視聽媒體用途。這些用途通常決定安裝在伺服器機箱中的元件。此外，伺服器已經發展為具有不同規格(form factors)。塔式外殼是至今仍在使用的早期設計。在塔式設計之後推出了機架式伺服器，且更近期而言，刀鋒伺服器已被實施。機架式伺服器可被大致描述為矩形箱，而每一伺服器可水平放置到機架中。此種規格與塔式外殼相比，提供了節省空間的優勢，而節省空間通常需要桌上型裝置或機櫃。刀鋒伺服器可提供額外的空間節省，且可為有用處的，尤其是一些元件，例如電源供應器和冷卻 風扇，可被共享到不同的刀鋒伺服器之間。 The server is a dedicated computer system, including many electronic components integrated into a single unit using a server chassis. For example, the server can be dedicated to storage, computing, or audiovisual media use. These uses usually determine the components installed in the server chassis. In addition, servers have evolved to have different specifications (form factors). The tower enclosure is an early design that is still in use today. Rack server was introduced after the tower design, and more recently, blade server has been implemented. Rack-mounted servers can be roughly described as rectangular boxes, and each server can be placed horizontally in the rack. Compared with tower enclosures, this specification provides the advantage of saving space, and space saving usually requires desktop devices or cabinets. Blade server can provide additional space saving and can be useful, especially some components, such as power supply and cooling Fans can be shared between different blade servers.

雖然有一些非標準大小，伺服器機架(server rack)的高度係藉由機架的單位「U」來予以分類，其中一「U」等於1.75英吋。總機架高度可變化，例如，從小至4U到42U。機架式伺服器被設計以裝配到伺服器機架的槽或機架內。槽或是機架的高度可被細分為多個「U」單位，以容納不同伺服器高度，例如1U、2U、3U以及4U。伺服器機架的其他尺寸以標準單位表示，例如英吋。伺服器機架的一標準寬度，例如為19英吋。通常，伺服器的深度範圍為24英吋到48英吋。一些伺服器機架也被設計以容納不只一種類型的伺服器規格(例如，塔式外殼、機架式和刀鋒伺服器)。伺服器機架設計也可以容納週邊裝置，例如輸入/輸出裝置(例如，顯示器、鍵盤、滑鼠)、用於線材管理的夾子等。 Although there are some non-standard sizes, the height of the server rack is classified by the unit "U" of the rack, where one "U" is equal to 1.75 inches. The total rack height can vary, for example, from as small as 4U to 42U. Rack-mounted servers are designed to fit into slots or racks of server racks. The height of the slot or rack can be subdivided into multiple "U" units to accommodate different server heights, such as 1U, 2U, 3U, and 4U. Other dimensions of the server rack are expressed in standard units, such as inches. A standard width of the server rack, for example, 19 inches. Generally, the depth of the server ranges from 24 inches to 48 inches. Some server racks are also designed to accommodate more than one type of server format (for example, tower enclosures, rack-mount and blade servers). The server rack design can also accommodate peripheral devices, such as input/output devices (for example, monitors, keyboards, mice), clips for wire management, and so on.

因此伺服器機架被設計為模組化，使不同的伺服器大小和規格可被容納。這允許更換安裝在伺服器機架中的伺服器以進行維護，或是容納多個伺服器的伺服器系統之更換需求。儘管提供了一些彈性，標準系統並沒有在裝置層級提供模組化，如參照第1A圖和第1B圖所示。 Therefore, the server rack is designed to be modular, so that different server sizes and specifications can be accommodated. This allows replacement of servers installed in a server rack for maintenance, or replacement requirements for server systems that accommodate multiple servers. Although it provides some flexibility, the standard system does not provide modularity at the device level, as shown with reference to Figures 1A and 1B.

第1A圖顯示一先前技術領域的機架式伺服器機箱100的一前方部份，具有窗槽102a到102d。由窗槽102a、102c以及102d所示，裝置104在窗槽102a、102c以及102d定位。窗槽102b為敞開的，且具有接納裝置104的大小。 FIG. 1A shows a front portion of a rack server chassis 100 in the prior art, with window slots 102a to 102d. As shown by the window slots 102a, 102c, and 102d, the device 104 is positioned in the window slots 102a, 102c, and 102d. The window slot 102b is open and has the size of the receiving device 104.

第1B圖顯示先前技術領域的伺服器機箱100，具有敞 開的窗槽102a到102d。使用者，例如技術員，可能想要放置一裝置，例如裝置106至這些窗槽之一中，例如窗槽102b。然而，窗槽102a到102d無法容納裝置106，由於其具有不同於裝置104的尺寸。因此，這樣的改變必須使用一不同的機箱。 Figure 1B shows a server chassis 100 in the prior art, with an open Opened window slots 102a to 102d. A user, such as a technician, may want to place a device, such as device 106, into one of these window slots, such as window slot 102b. However, the window slots 102a to 102d cannot accommodate the device 106 because it has a different size from the device 104. Therefore, such a change must use a different chassis.

根據目前設計，當想要不同裝置時需要多種機箱。現有機箱無法輕易地重新用於不同用途，例如從記憶儲存伺服器到計算機伺服器。同樣地，現有機箱無法輕易地以升級裝置擴充，例如以2.5英吋的HHD或固態硬碟(SSD)置換3.5英吋的硬碟機(HHD)。因此當組合新的伺服器系統時，需要不同機箱種類的庫存(inventory)以容納不同的利用元件。此外，具有不同規格的組件(如裝置104和106)的組合，無法被單個機箱容納。 According to the current design, multiple enclosures are needed when different devices are desired. Existing chassis cannot be easily reused for different purposes, such as from memory storage server to computer server. Similarly, the existing chassis cannot be easily expanded with upgraded devices, such as replacing a 3.5-inch hard disk drive (HHD) with a 2.5-inch HHD or a solid state drive (SSD). Therefore, when assembling a new server system, different types of chassis inventory (inventory) are required to accommodate different utilization components. In addition, a combination of components with different specifications (such as devices 104 and 106) cannot be accommodated in a single chassis.

因此，有對於一種可容納不同種類裝置的整合式機箱系統的需求。想要裝置易於在機箱中互換，並且不需要重新設計。這樣的系統會提供伺服器設計改善成本和效率。 Therefore, there is a need for an integrated chassis system that can accommodate different types of devices. Want the device to be easily interchangeable in the chassis, and does not need to be redesigned. Such a system would provide server design to improve cost and efficiency.

實施例的名詞和類似名詞旨在廣義地參照以下本揭露的全部標的和申請專利範圍。應當理解，包含這些名詞的陳述不應限制在此陳述的標的或限制以下申請專利範圍的涵義和範圍。以下涵蓋本揭露的實施例由申請專利範圍所界定，而不是由此新型內容。此新型內容係本揭露的高階概述，並且介紹了一些特點，這些概念在以下實施方式中詳述。本新型內容並非旨在標識申請專利範 圍之標的的關鍵或必要特徵。此新型內容也不旨在單獨決定申請專利範圍標的的範圍。應當參照本揭露的完整說明書的任何或全部附圖以及申請專利範圍的適當部分以了解標的。 The terms of the embodiments and similar terms are intended to broadly refer to all the subject matter of the present disclosure and the scope of patent application. It should be understood that statements containing these terms should not limit the subject matter stated herein or limit the meaning and scope of the scope of the following patent applications. The following embodiments covering the present disclosure are defined by the scope of the patent application, rather than the new content. This new content is a high-level overview of this disclosure, and introduces some features. These concepts are detailed in the following embodiments. This new content is not intended to identify the scope of the patent application The key or necessary characteristics of the target. This new content is not intended to independently determine the scope of the subject matter of the patent application. You should refer to any or all of the drawings in the complete specification of this disclosure and appropriate parts of the scope of the patent application to understand the subject matter.

本揭露的一第一實施方式係一模組化伺服器系統。此模組化伺服器系統包括具有一個或多個窗槽的伺服器機箱，其中每一個窗槽具有相同的尺寸。此實施方式也包括複數個裝置盤，每一個裝置盤用於承載一裝置。此裝置由不同個裝置中選擇出，且每一裝置盤裝配到一個或多個窗槽。 A first embodiment of the present disclosure is a modular server system. The modular server system includes a server chassis with one or more window slots, each of which has the same size. This embodiment also includes a plurality of device disks, and each device disk is used to carry a device. This device is selected from different devices, and each device tray is fitted to one or more window slots.

可選地，其中從複數個裝置中選擇出至少一第一裝置，具有與從裝置中選擇出的第二裝置的規格不同的規格。可選地，此裝置為一組裝置中的一件，其中此組裝置的每一裝置具有相同的規格。在一些實施方式中，一裝置盤包括一裝置承載器，用於耦合裝置與裝置盤。裝置係可選地從一個或多個硬碟機(HDD)、固態硬碟(SSD)、圖形處理單元(GPU)以及尺形裝置(ruler device)中選擇出。 Optionally, the at least one first device selected from a plurality of devices has a specification different from the specification of the second device selected from the devices. Optionally, the device is one piece of a group of devices, wherein each device of the group of devices has the same specifications. In some embodiments, a device tray includes a device carrier for coupling the device and the device tray. The device is optionally selected from one or more hard disk drives (HDD), solid state drives (SSD), graphics processing unit (GPU), and rule devices.

在一些實施方式中，裝置盤包括一個或多個裝置槽，具有內表面，界定一內部空間，用於置放裝置。此裝置槽更包括一前開口，用於裝置的滑動式置放；一後開口，用於連接裝置到至少一第二裝置；以及一結件，用於承載裝置在裝置槽中。可選地，此內部空間由頂部內表面、底部內表面以及間隔件內表面界定。 In some embodiments, the device tray includes one or more device slots with an inner surface defining an internal space for placing devices. The device slot further includes a front opening for sliding placement of the device; a rear opening for connecting the device to at least one second device; and a knot for carrying the device in the device slot. Optionally, this inner space is bounded by the top inner surface, the bottom inner surface, and the spacer inner surface.

在此系統的一些實施方式，窗槽包括窗水平寬度，約相同於裝置盤寬度；窗垂直高度，約相同於裝置盤高度；以及窗深 度，約相同於或約小於裝置盤深度。在機箱中的一開口，由窗水平寬度和窗水平高度界定。此開口允許裝置盤的滑動式置放至每一窗槽。滑動式置放係透過接合一個或多個窗槽的內表面、窗槽的一軌道、窗槽的一凹槽以及一結件。可選地，伺服器機箱包括一頂蓋，可被移除以將裝置盤置放在窗槽中。 In some embodiments of the system, the window slot includes a horizontal width of the window, which is approximately the same as the width of the device tray; a vertical height of the window, which is approximately the same as the height of the device tray; and the depth of the window Degree, about the same as or about less than the depth of the device tray. An opening in the cabinet is defined by the horizontal width of the window and the horizontal height of the window. This opening allows the sliding placement of the device tray into each window slot. The sliding placement is achieved by joining the inner surface of one or more window grooves, a track of the window groove, a groove of the window groove and a knot. Optionally, the server case includes a top cover that can be removed to place the device disk in the window slot.

在模組化伺服器系統的一些實施方式中，伺服器機箱包括機架式伺服器規格，具有一寬度、一高度、一深度。伺服器機箱更包括複數個前窗，在由寬度和高度界定的平面上。每一前窗包括一開口，具有一水平寬度和垂直高度。此開口被定位於機箱的前部，且界定開向窗槽之一的一口。至少兩個開口界定一排窗口。此排窗口的每一開口在寬度方向上排列，且在垂直高度和水平寬度上彼此對齊。可選地，此排窗口的窗口的數量為1到10。 In some embodiments of the modular server system, the server chassis includes a rack-mounted server specification, and has a width, a height, and a depth. The server chassis further includes a plurality of front windows on a plane defined by width and height. Each front window includes an opening with a horizontal width and vertical height. The opening is positioned at the front of the chassis and defines an opening to one of the window slots. At least two openings define a row of windows. Each opening of this row of windows is arranged in the width direction and aligned with each other in vertical height and horizontal width. Optionally, the number of windows in this row of windows is 1 to 10.

在模組化伺服器系統的一些實施方式中，伺服器機箱包括機架式伺服器規格，具有一寬度、一高度、一深度。伺服器機箱更包括複數個前窗，在由寬度和高度界定的平面上。每一前窗包括一開口，具有一水平寬度和一垂直高度。開口被定位於機箱的前部，並界定開向窗槽之一的一口。至少兩個開口界定一列窗口，且此列窗口的每一開口在高度方向上排列，且在垂直高度和水平寬度上彼此對齊。可選地，此列窗口的窗口的數量為1到10。 In some embodiments of the modular server system, the server chassis includes a rack-mounted server specification, and has a width, a height, and a depth. The server chassis further includes a plurality of front windows on a plane defined by width and height. Each front window includes an opening with a horizontal width and a vertical height. The opening is positioned at the front of the chassis and defines an opening to one of the window slots. At least two openings define a row of windows, and each opening of the row of windows is arranged in the height direction and aligned with each other in the vertical height and the horizontal width. Optionally, the number of windows in this column is 1-10.

在模組化伺服器系統的又一其他實施方式中，伺服器機箱包括一機架式伺服器規格，具有一寬度、一高度、一深度。伺服器機箱更包括複數個前窗，在由寬度和高度界定的平面上。每一 前窗包括一開口，具有一水平寬度和垂直高度。開口被定位於機箱的前部，且界定開向窗槽之一的一口。至少兩個開口界定一排窗口。此排窗口的每一開口在寬度方向上排列，且在垂直高度和水平寬度上彼此對齊。至少兩個開口界定一列窗口。此列窗口的每一開口在高度方向上排列，且在垂直高度和水平寬度上彼此對齊。可選地，窗口的數量為3到100個。 In yet another embodiment of the modular server system, the server chassis includes a rack-mounted server specification, with a width, a height, and a depth. The server chassis further includes a plurality of front windows on a plane defined by width and height. Every The front window includes an opening with a horizontal width and a vertical height. The opening is positioned at the front of the chassis and defines an opening to one of the window slots. At least two openings define a row of windows. Each opening of this row of windows is arranged in the width direction and aligned with each other in vertical height and horizontal width. At least two openings define a row of windows. Each opening of this column of windows is arranged in the height direction and aligned with each other in vertical height and horizontal width. Optionally, the number of windows is 3 to 100.

本揭露的第二實施方式係一裝置盤，用於承載裝置。裝置盤具有一個或多個裝置槽，具有內表面，界定一空間，用於置放裝置。裝置盤也包括一前開口，用於裝置的滑動式置放；一後開口，用於連接裝置於至少一第二裝置；以及一結件，用於承載裝置在裝置槽中。可選地，裝置盤更具有一頂部，頂部包括一口，從一外部頂部表面到一內部頂部表面。可選地，此口配置為一槽縫或一圓孔。在一些實施方式中，裝置盤包括一固定機構的第一部份。而裝置包括一固定機構的第二部份。當裝置在裝置槽時，固定機構的第一部份和固定機構的第二部份可接合。當接合時，固定機構將裝置固定在裝置盤上。在一些實施方式中，內部空間至少由頂部內表面、底部內表面以及間隔件內表面界定。 The second embodiment of the present disclosure is a device tray for carrying devices. The device tray has one or more device slots with an inner surface and defines a space for placing devices. The device tray also includes a front opening for sliding placement of the device; a rear opening for connecting the device to at least one second device; and a knot for carrying the device in the device slot. Optionally, the device tray further has a top, and the top includes a mouth from an outer top surface to an inner top surface. Optionally, the port is configured as a slot or a round hole. In some embodiments, the device tray includes a first part of a fixing mechanism. The device includes a second part of a fixing mechanism. When the device is in the device slot, the first part of the fixing mechanism and the second part of the fixing mechanism can be engaged. When engaged, the fixing mechanism fixes the device on the device tray. In some embodiments, the inner space is bounded by at least the top inner surface, the bottom inner surface, and the spacer inner surface.

根據以下本揭露的實施方式，提供了一種整合式機箱系統，可容納不同的裝置。裝置可易於在機箱中互換，提供伺服器設計改善成本和效率。 According to the following embodiments of the present disclosure, an integrated chassis system is provided, which can accommodate different devices. The devices can be easily interchanged in the chassis, providing a server design to improve cost and efficiency.

以上新型內容並非旨在代表本揭露的每一實施例或每個特點。而是，前述新型內容僅在此闡述提供一些新穎特點和特 徵的示例。當結合附圖和所附申請專利範圍時，從以下代表性的實施例的實施方式和實施本新型的方式，本揭露的以上特徵和優點以及其他特徵和優點將變得顯而易見。 The above new content is not intended to represent every embodiment or every feature of this disclosure. Rather, the aforementioned new content is only described here to provide some novel features and special features. Examples of levy. The above features and advantages and other features and advantages of the present disclosure will become apparent from the implementation of the following representative embodiments and the manner of implementing the present invention when combined with the accompanying drawings and the scope of the attached patent application.

100:伺服器機箱 100: server chassis

102a,102b,102c,102d,202a,202b,202j,202a1,202a2,202b1,202b2:窗槽 102a, 102b, 102c, 102d, 202a, 202b, 202j, 202a1, 202a2, 202b1, 202b2: window slot

104,106,1202a,1202b:裝置 104, 106, 1202a, 1202b: device

200:伺服器機箱/整合式伺服器機箱 200: server chassis/integrated server chassis

201:寬度 201: width

203:高度 203: height

204:前域 204: front domain

205:深度 205: Depth

206:垂直高度 206: vertical height

208:水平寬度 208: Horizontal width

210:窗深度 210: window depth

211:頂部面板 211: Top panel

212:內底部表面 212: inner bottom surface

213:底部面板 213: bottom panel

214:內頂部表面 214: inner top surface

216:內側表面 216: Inside surface

217a:左側壁 217a: left side wall

217b:右側壁 217b: Right side wall

218:間隔件表面 218: Spacer surface

219,305,805,1005,606:間隔件 219,305,805,1005,606: spacer

222,230a,230b:外表面 222, 230a, 230b: outer surface

224:外頂部表面 224: outer top surface

300:模組化系統 300: Modular system

301,602,801,1001:頂部 301,602,801,1001: top

301a:頂部內表面 301a: top inner surface

301b:頂部外表面 301b: top outer surface

302:第一裝置承載器 302: first device carrier

303,803,1003,604:底部 303,803,1003,604: bottom

303a:底部內表面 303a: bottom inner surface

304:第一裝置盤 304: first device disk

306:第一模組 306: The first module

307,607,807,1007:側壁 307,607,807,1007: sidewall

307a,602a,606a,607a,801a,803a,807a,1001a,1003a,604a,305a,805a,1005a,1007a:內表面 307a, 602a, 606a, 607a, 801a, 803a, 807a, 1001a, 1003a, 604a, 305a, 805a, 1005a, 1007a: inner surface

308a,308b,408a,408b,408c,408d,408e,408f,408g,408h,808a,808b,1008a,1008b:裝置槽 308a, 308b, 408a, 408b, 408c, 408d, 408e, 408f, 408g, 408h, 808a, 808b, 1008a, 1008b: device slot

310:大箭頭 310: Big Arrow

312,320,412,620,812,820,1012,1013,1020:開口 312, 320, 412, 620, 812, 820, 1012, 1013, 1020: opening

314:裝置盤高度/第二裝置盤高度/第三裝置盤高度/第四裝置盤高度 314: Device Disk Height/Second Device Disk Height/Third Device Disk Height/Fourth Device Disk Height

316:裝置盤寬度/第三裝置盤寬度/第四裝置盤寬度 316: Device disk width/third device disk width/fourth device disk width

318:裝置盤深度/第二裝置盤深度/第三裝置盤深度/第四裝置盤深度 318: Device Disk Depth/Second Device Disk Depth/Third Device Disk Depth/Fourth Device Disk Depth

322:槽部件 322: Groove Parts

402:裝置/第二裝置 402: Device/Second Device

404:第二裝置盤 404: Second Device Disk

404’,804:裝置盤 404’,804: Device Disk

406:第二模組 406: The second module

406’,1206a,1206b,1206c,1206d:模組 406’, 1206a, 1206b, 1206c, 1206d: Module

422:孔部件 422: Hole Parts

608:結件 608: final

609,610:閂鎖機構 609, 610: latch mechanism

802:裝置/第三裝置 802: Device/Third Device

804:第三裝置盤 804: Third Device Disk

806:第三模組 806: The third module

810:頂部表面 810: top surface

814:部件 814: parts

818:高度距離 818: height distance

822:開槽部件 822: Slotted parts

1002:裝置承載器/第三裝置承載器/第四裝置承載器 1002: Device Carrier/Third Device Carrier/Fourth Device Carrier

1004:裝置盤/第四裝置盤 1004: Device Disk/Fourth Device Disk

1006:第四模組 1006: fourth module

1022:槽部件 1022: Slot parts

1023:邊界 1023: boundary

1024:表面 1024: surface

1026:模組 1026: Module

1210,1212,1214:虛線 1210, 1212, 1214: dotted line

從以下示例性實施例的描述並一起參照附圖，將更好地理解本揭露，其中：第1A圖係先前技術的伺服器機箱的立體圖，具有裝置被安裝的一示例；第1B圖係先前技術的伺服器機箱的立體圖，其中不同的裝置無法被安裝；第2A圖係根據一些實施方式，整合式機箱的示例的立體圖；第2B圖係第2A圖的整合式機箱的前視圖；第3A圖係根據一些實施方式，模組化系統的立體圖；第3B圖顯示第3A圖顯示的第一模組的展開圖；第3C圖係第3B圖顯示的裝置盤的背面剖視圖；第4圖係根據另一實施方式，模組化系統的立體圖；第5圖係根據另一實施方式，模組化系統的立體圖；第6A圖係根據本揭露的一些實施方式，模組的立體圖；第6B圖中顯示鎖定機構，用於第6A圖的裝置盤中的裝置；第6C圖係第6A圖的裝置盤的背面剖視圖；第7A圖係第6A圖顯示的裝置盤的上視圖； 第7B圖係第6A圖顯示的裝置盤的前視圖；第7C圖係第6A圖顯示的裝置盤的側視圖；第8A圖係根據本揭露的一些實施方式，模組的立體圖；第8B圖係第8A圖顯示的裝置盤的背面剖視圖；第9A圖係第8A圖顯示的裝置盤的上視圖；第9B圖係第8A圖顯示的裝置盤的前視圖；第9C圖係第8A圖顯示的裝置盤的側視圖；第10A圖係根據一些實施方式，模組的立體圖；第10B圖係第10A圖顯示的裝置承載器的背面剖視圖；第10C圖係裝置承載器的背面剖視圖，根據第10A圖顯示的裝置承載器的另一實施方式；第11A圖係一模組化系統的立體圖，根據一些實施方式，包括四個模組和一整合式機箱；第11B圖係第11A圖顯示的整合式機箱的前視圖；第12A圖係根據一些實施方式的模組化系統的實施方式的頂部示意圖；以及第12B圖係根據本揭露的一些實施方式的模組化系統的前部示意圖。 The present disclosure will be better understood from the description of the following exemplary embodiments and with reference to the accompanying drawings, in which: Figure 1A is a perspective view of a server chassis of the prior art, with an example of the device being installed; Figure 1B is a previous A perspective view of a technical server chassis in which different devices cannot be installed; Figure 2A is a perspective view of an example of an integrated chassis according to some embodiments; Figure 2B is a front view of the integrated chassis of Figure 2A; Figure 3A Figures are a perspective view of a modular system according to some embodiments; Figure 3B shows an expanded view of the first module shown in Figure 3A; Figure 3C is a back cross-sectional view of the device tray shown in Figure 3B; Figure 4 is According to another embodiment, a perspective view of a modular system; Figure 5 is a perspective view of a modular system according to another embodiment; Figure 6A is a perspective view of a module according to some embodiments of the present disclosure; Figure 6B Shows the locking mechanism for the device in the device tray of Fig. 6A; Fig. 6C is the back cross-sectional view of the device disc of Fig. 6A; Fig. 7A is the top view of the device disc shown in Fig. 6A; Figure 7B is a front view of the device disk shown in Figure 6A; Figure 7C is a side view of the device disk shown in Figure 6A; Figure 8A is a perspective view of the module according to some embodiments of the present disclosure; Figure 8B Figure 8A is the rear cross-sectional view of the device disk; Figure 9A is the top view of the device disk shown in Figure 8A; Figure 9B is the front view of the device disk shown in Figure 8A; Figure 9C is the top view of the device disk shown in Figure 8A. Fig. 10A is a perspective view of the module according to some embodiments; Fig. 10B is a cross-sectional view of the back of the device carrier shown in Fig. 10A; Fig. 10C is a cross-sectional view of the back of the device carrier, according to Figure 10A shows another embodiment of the device carrier; Figure 11A is a perspective view of a modular system, according to some embodiments, including four modules and an integrated chassis; Figure 11B is the one shown in Figure 11A Front view of the integrated chassis; FIG. 12A is a schematic top view of an implementation of a modular system according to some embodiments; and FIG. 12B is a front schematic view of a modular system according to some embodiments of the present disclosure.

本揭露易於進行各種修改和替代形式。在附圖中以透過示例的方式示出一些代表性的實施例，且將在此進行詳述。然而，應當理解本新型並非旨在受限於揭露的特定形式。而是，本揭露涵蓋所有落在所附申請專利範圍所界定的本新型的精神和範圍內的所有修改、 均等物和替代形式。 This disclosure is easy to make various modifications and alternative forms. Some representative embodiments are shown in the drawings by way of example, and will be described in detail here. However, it should be understood that the present invention is not intended to be limited to the specific form of disclosure. Rather, this disclosure covers all modifications, all modifications, and modifications that fall within the spirit and scope of the new model defined by the scope of the attached patent application. Equals and alternative forms.

本新型可以許多不同的形式實施。代表性實施例在附圖中示出，且將在以下詳述。本揭露係本揭露之原理的示例或說明，且無意將本揭露的廣泛特點限於所示出的實施例。在這個程度上，例如在摘要、新型內容以及實施方式段落揭露，但未在申請專利範圍中明確提出的元件和限制，不應透過暗示、推斷或其他方式將其單獨或整體的併入申請專利範圍中。為了本實施方式的目的，除非特別聲明，單數包括複數，反之亦然；「包括(including)」一詞意為「包括但不限於(including without limitation)」。此外，近似詞例如「大約(about,almost,substantially,approximately)」等等，可在此視為例如「在...附近(at,near,nearly at)」、「在3%到5%之內」、「在允許的製造公差範圍內」或其中任何合理的組合。 The new model can be implemented in many different forms. Representative embodiments are shown in the drawings and will be detailed below. The present disclosure is an example or description of the principles of the present disclosure, and it is not intended to limit the broad features of the present disclosure to the illustrated embodiments. To this extent, elements and limitations that are disclosed in the abstract, new content, and implementation paragraphs, but are not explicitly mentioned in the scope of the patent application, should not be incorporated into the patent application individually or as a whole by implication, inference, or other means. In the range. For the purpose of this embodiment, unless otherwise stated, the singular includes the plural, and vice versa; the word "including" means "including without limitation". In addition, similar words such as "about (about, almost, substantially, approximately, approximately)" and so on, can be regarded as such as "at, near, near at", "between 3% and 5%". "Within", "Within the allowable manufacturing tolerance" or any reasonable combination of these.

本揭露針對一種模組化伺服器系統，具有一個或多個前窗槽用於模組的置放。模組包括可承載裝置或裝置承載器的裝置盤。不同的模組可裝載不同的裝置。例如，在一些實施方式中，裝置有不同的規格。裝置可包括任何用於計算和儲存的裝置，例如從3.5英吋HDD、2.5英吋HDD、SSD、GPU或是尺形裝置中選擇出。一個或多個窗槽的每一個可容納任意的不同模組之一。 This disclosure is directed to a modular server system with one or more front window slots for module placement. The module includes a device tray that can carry a device or a device carrier. Different modules can be loaded with different devices. For example, in some embodiments, the devices have different specifications. The device may include any device used for computing and storage, for example, selected from 3.5-inch HDD, 2.5-inch HDD, SSD, GPU, or a size-shaped device. Each of the one or more window slots can accommodate any one of the different modules.

第2A圖係根據一些實施方式，一整合式伺服器機箱 200的立體圖。以方位來說，寬度W、高度H和深度D的方向被指示出。整合式伺服器機箱200具有寬度201、高度203和深度205，由頂部面板211、底部面板213、左側壁217a和右側壁217b所界定。整合式伺服器機箱200的外底部表面222、外頂部表面224和外側表面230a和230b也被指示出。機箱寬度201、高度203和深度205可為任意值。例如在一些實施方式中，高度203的值可在1到20U、1到10U或是1U到5U之間。例如，整合式機箱可具有1、2、3、4或5U作為高度203。寬度201可為標準19英吋，雖然其他寬度可在各種整合式伺服器機箱200示例的實施方式被使用。深度205可為例如約10英吋到60英吋之間。在一些實施方式中，深度205為約20英吋到50英吋之間，例如約24、29和48英吋。 Figure 2A is an integrated server chassis according to some embodiments 200's perspective view. In terms of azimuth, the directions of width W, height H, and depth D are indicated. The integrated server chassis 200 has a width 201, a height 203, and a depth 205, defined by a top panel 211, a bottom panel 213, a left side wall 217a, and a right side wall 217b. The outer bottom surface 222, the outer top surface 224, and the outer surfaces 230a and 230b of the integrated server chassis 200 are also indicated. The chassis width 201, height 203, and depth 205 can be any value. For example, in some embodiments, the value of the height 203 may be between 1 to 20U, 1 to 10U, or 1U to 5U. For example, the integrated chassis may have 1, 2, 3, 4, or 5 U as the height 203. The width 201 may be a standard 19 inches, although other widths may be used in various exemplary embodiments of the integrated server chassis 200. The depth 205 may be, for example, between about 10 inches and 60 inches. In some embodiments, the depth 205 is between about 20 inches and 50 inches, such as about 24, 29, and 48 inches.

伺服器機箱200被設計以裝配進機架之槽內的尺寸。因此，寬度201、高度203和深度205、以及伺服器機箱200的外表面222、224、230a和230b被配置以裝配進伺服器機架的槽。 The server chassis 200 is designed to fit into the slot of the rack. Therefore, the width 201, the height 203 and the depth 205, and the outer surfaces 222, 224, 230a, and 230b of the server chassis 200 are configured to fit into the slots of the server rack.

兩個窗槽202a、202b被顯示於前域204(以虛線表示)，在此示例中，窗槽202a和202b具有相同的尺寸。 Two window slots 202a, 202b are shown in the front area 204 (indicated by dashed lines). In this example, the window slots 202a and 202b have the same size.

第2B圖係整合式伺服器機箱200的前視圖，顯示窗槽202a、202b。窗槽202a、202b具有窗垂直高度206和窗水平寬度208的相同尺寸。窗槽202a、202b的窗深度210(第2A圖中)被以雙向箭頭表示。對於窗槽202a、202b，窗深度210也相同。窗垂直高度206和窗水平寬度208界定一窗，窗為每一窗槽202a、202b的開口(aperture)。 Figure 2B is a front view of the integrated server chassis 200, showing the window slots 202a, 202b. The window grooves 202a and 202b have the same size as the vertical height 206 of the window and the horizontal width 208 of the window. The window depth 210 of the window grooves 202a, 202b (Figure 2A) is indicated by a double-headed arrow. The window depth 210 is also the same for the window grooves 202a and 202b. The window vertical height 206 and the window horizontal width 208 define a window, and the window is an aperture of each window slot 202a, 202b.

窗槽202a、202b也可被邊界部件界定。窗槽202a由頂部面板211、底部面板213、左側壁217a和間隔件219界定。窗槽202b由頂部面板211、底部面板213、右側壁217b和間隔件219界定。邊界部件包括整合式伺服器機箱200的內表面。例如，窗槽202b用的邊界部件包括內底部表面212、內頂部表面214、內側表面216和間隔件表面218。在一些實施方式中，伺服器機箱200可具有1到10個窗槽，每一窗槽具有相同的尺寸。 The window grooves 202a, 202b may also be defined by boundary members. The window groove 202a is defined by the top panel 211, the bottom panel 213, the left side wall 217a, and the spacer 219. The window groove 202b is defined by the top panel 211, the bottom panel 213, the right side wall 217b and the spacer 219. The boundary component includes the inner surface of the integrated server chassis 200. For example, the boundary member for the window groove 202b includes an inner bottom surface 212, an inner top surface 214, an inner side surface 216, and a spacer surface 218. In some embodiments, the server chassis 200 may have 1 to 10 window slots, and each window slot has the same size.

如以下所使用的，關於窗槽202a、202b的「相同」的尺寸是指，允許在任一個窗槽202a、202b中置放裝置盤、且可選地將裝置盤固定在任一個窗槽202a、202b中的構造。例如，裝置盤具有外表面、與內表面相稱的部件、以及界定窗槽202a、202b的部件。在一些實施方式中，裝置的外表面可包括軌道，且窗槽202a、202b包括凹槽作為內表面的一部份。當裝置***窗槽202a、202b，凹槽接合軌道。在一些實施方式中，裝置的外表面包括凹槽，而窗槽202a、202b的內表面包括軌道。當裝置***窗槽202a、202b時，軌道接合凹槽。凹槽和軌道部件可幫助裝置盤引導和置放到窗槽202a、202b中。在一些實施方式中，裝置盤可具有部件，例如凸塊，其中窗槽202a、202b具有與凸塊相對應的凹痕之部件。替代地或附加地，裝置盤可具有凹痕，而窗槽202a、202b可具有凸塊。例如，在裝置盤的延伸件、固定件或結件的其他部件，也可被使用到界定窗槽202a、202b的內表面。可替代地，例如，被窗槽202a、202b包括的延伸件的部件可延伸到裝置盤，以承載或引導 裝置盤置放到窗槽202a、202b中。例如部件可被安裝到、附接於或形成一個或多個內底部表面212、內頂部表面214、內側表面216、間隔件表面218的一部分。在窗槽202a、202b的部件也包括在一個或多個窗槽的界定中，每一窗槽具有相同於在此使用的尺寸。 As used below, the "same" size of the window slots 202a, 202b means that the device disk is allowed to be placed in any window slot 202a, 202b, and the device disk is optionally fixed to any window slot 202a, 202b. In the structure. For example, the device tray has an outer surface, parts commensurate with the inner surface, and parts defining window slots 202a, 202b. In some embodiments, the outer surface of the device may include a track, and the window grooves 202a, 202b include grooves as part of the inner surface. When the device is inserted into the window grooves 202a, 202b, the groove engages the track. In some embodiments, the outer surface of the device includes grooves, and the inner surface of the window grooves 202a, 202b includes rails. When the device is inserted into the window grooves 202a, 202b, the track engages the groove. The grooves and track members can help guide and place the device discs in the window grooves 202a, 202b. In some embodiments, the device disk may have components, such as bumps, in which the window grooves 202a and 202b have components with indentations corresponding to the bumps. Alternatively or additionally, the device tray may have dimples, and the window grooves 202a, 202b may have bumps. For example, extensions, fixings, or other components of the device tray can also be used to define the inner surface of the window grooves 202a, 202b. Alternatively, for example, the parts of the extensions included by the window grooves 202a, 202b may be extended to the device tray to carry or guide The device tray is placed in the window slots 202a, 202b. For example, the component may be mounted to, attached to, or form part of one or more of the inner bottom surface 212, the inner top surface 214, the inner side surface 216, and the spacer surface 218. The components of the window slots 202a, 202b are also included in the definition of one or more window slots, each window slot having the same size as used herein.

在一些實施方式中，裝置盤可具有高度約相同於窗垂直高度206，且裝置盤可具有寬度約相同於窗水平寬度208。在這些實施方式中，裝置盤可為約相同於或小於窗深度210。例如，裝置的深度在一些實施方式中為至少小於10%、至少小於20%、至少小於30%、至少小於40%或至少小於50%的窗深度210。 In some embodiments, the device tray may have a height that is approximately the same as the window vertical height 206, and the device tray may have a width that is approximately the same as the window horizontal width 208. In these embodiments, the device tray may be about the same as or less than the window depth 210. For example, the depth of the device is at least less than 10%, at least less than 20%, at least less than 30%, at least less than 40%, or at least less than 50% of the window depth 210 in some embodiments.

第3A圖為根據一些實施方式，模組化系統300的立體圖。模組化系統300包括整合式伺服器機箱200、第一裝置盤304、第一裝置承載器302。第一裝置盤304和第一裝置承載器302的組合形成第一模組或子系統306。第一裝置盤304配置以在每一第一模組306中乘載一個或兩個第一裝置承載器302。 Figure 3A is a perspective view of a modular system 300 according to some embodiments. The modular system 300 includes an integrated server chassis 200, a first device disk 304, and a first device carrier 302. The combination of the first device disk 304 and the first device carrier 302 forms a first module or subsystem 306. The first device tray 304 is configured to carry one or two first device carriers 302 in each first module 306.

在一些實施方式中，模組化系統300包括一裝置(未顯示在第3A圖)，其被承載於裝置承載器，例如第一裝置承載器302。任意裝置具有與裝置承載器302匹配的規格可被使用。例如，在第3A圖顯示的實施方式中，第一裝置承載器302用於2.5英吋HHD。相應地，在一些實施方式中，第一模組306可包括裝置、第一裝置承載器302和第一裝置盤304。在一些其他實施方式中，第一模組306只包括第一裝置承載器302。 In some embodiments, the modular system 300 includes a device (not shown in FIG. 3A ), which is carried on a device carrier, such as the first device carrier 302. Any device having a specification matching the device carrier 302 can be used. For example, in the embodiment shown in Figure 3A, the first device carrier 302 is used for 2.5-inch HHD. Accordingly, in some embodiments, the first module 306 may include a device, a first device carrier 302, and a first device tray 304. In some other embodiments, the first module 306 only includes the first device carrier 302.

第一裝置盤304包括兩個裝置槽308a和308b，用於 第一裝置承載器302的置放。裝置槽308a顯示為空置的，也就是說沒有裝置承載器，例如第一裝置承載器302，在裝置槽308a中。大箭頭310說明滑動式置放。第一裝置承載器302經由輪廓開口312滑進第一裝置盤304中。如此一來放置第一裝置承載器302到裝置槽308a中。第一裝置承載器302顯示佔據裝置槽308b。 The first device tray 304 includes two device slots 308a and 308b for Placement of the first device carrier 302. The device slot 308a is shown as empty, that is, there is no device carrier, such as the first device carrier 302, in the device slot 308a. The large arrow 310 illustrates the sliding placement. The first device carrier 302 slides into the first device tray 304 through the contour opening 312. In this way, the first device carrier 302 is placed in the device slot 308a. The first device carrier 302 is shown to occupy the device slot 308b.

雖然被稱為「滑動式置放」，相反的步驟可被用以從裝置盤移除裝置或裝置承載器，以及從窗槽移除裝置盤。例如，滑動式置放步驟可相反，以從裝置槽308b移除第一裝置承載器302。 Although referred to as "sliding placement", the reverse procedure can be used to remove the device or device carrier from the device tray, and to remove the device tray from the window slot. For example, the sliding placement step can be reversed to remove the first device carrier 302 from the device slot 308b.

第一裝置盤304可被放置到整合式伺服器機箱200的窗槽202a或202b內。這是因為第一裝置盤304具有相似於窗槽202a、202b的外部尺寸。例如，裝置盤高度314可約相同於窗垂直高度206。裝置盤寬度316可約相同於窗水平寬度208。裝置盤深度318可約相同於或短於窗槽202a、202b的窗深度210。 The first device disk 304 can be placed in the window slot 202 a or 202 b of the integrated server chassis 200. This is because the first device tray 304 has external dimensions similar to the window grooves 202a, 202b. For example, the device tray height 314 may be approximately the same as the window vertical height 206. The device tray width 316 may be approximately the same as the window horizontal width 208. The device tray depth 318 may be about the same as or shorter than the window depth 210 of the window grooves 202a, 202b.

第3B圖顯示模組306的展開圖，橫截面“D-D”被示出，也顯示出在第一裝置盤304背面的開口320。第3C圖為第3B圖中的橫截面“D-D”的後視圖，且裝置槽308a或308b(皆在第3A圖)中並未顯示第一裝置承載器302。第一裝置盤304具有頂部301、底部303、間隔件305和側壁307。裝置槽308a和308b具有界定用以置放裝置的空間的內表面。頂部301提供頂部內表面301a。底部303提供底部內表面303a。間隔件305提供內表面305a。側壁307提供內表面307a。裝置槽308a和308b也由第一裝置盤304前面的至少一開口312所界定。在第一裝置盤304背面的一個或多個開口 320，允許放置在第一裝置承載器302中的裝置電連接到安裝在整合式伺服器機箱200的其他組件。例如，主機板可與電源供應器電連接。 FIG. 3B shows an expanded view of the module 306, the cross section "D-D" is shown, and the opening 320 on the back of the first device tray 304 is also shown. Figure 3C is a rear view of the cross section "D-D" in Figure 3B, and the first device carrier 302 is not shown in the device slot 308a or 308b (both in Figure 3A). The first device tray 304 has a top 301, a bottom 303, a spacer 305, and a side wall 307. The device grooves 308a and 308b have inner surfaces that define a space for placing the device. The top 301 provides a top inner surface 301a. The bottom 303 provides a bottom inner surface 303a. The spacer 305 provides an inner surface 305a. The side wall 307 provides an inner surface 307a. The device slots 308 a and 308 b are also defined by at least one opening 312 in the front of the first device tray 304. One or more openings on the back of the first device tray 304 320, allowing the device placed in the first device carrier 302 to be electrically connected to other components installed in the integrated server chassis 200. For example, the motherboard can be electrically connected to the power supply.

在一些實施方式中，第一裝置盤304在表面具有額外的部件。例如，如第3A圖到第3C圖所示，第一裝置盤304包括槽部件322。在此實施方式中，部件在頂部301上，且被配置為槽，提供從頂部外表面301b到頂部內表面301a的口(opening)。在其他實施方式中，部件可為圓形或其他形狀的口。這樣的部件可例如提供通風、減少裝置承載器的重量或增加裝置承載器的彈性。在一些實施方式中，這樣的部件可提供耦接功能，例如耦接到整合式伺服器機箱200的內頂部表面214上的匹配部件，或耦接到裝置或裝置承載器上的匹配部件。在一些其他的實施方式中，這樣的部件可用於組裝用途，例如螺絲孔。其他部件可被使用，例如軌道或其他突出構造，例如安裝在頂部301上或是作為頂部301的一部份。 In some embodiments, the first device tray 304 has additional components on the surface. For example, as shown in FIGS. 3A to 3C, the first device disk 304 includes a groove member 322. In this embodiment, the component is on the top 301 and is configured as a groove, providing an opening from the top outer surface 301b to the top inner surface 301a. In other embodiments, the component may be a circular or other shaped mouth. Such components may, for example, provide ventilation, reduce the weight of the device carrier, or increase the elasticity of the device carrier. In some embodiments, such components may provide a coupling function, such as coupling to a matching component on the inner top surface 214 of the integrated server chassis 200, or to a matching component on a device or a device carrier. In some other embodiments, such components can be used for assembly purposes, such as screw holes. Other components can be used, such as rails or other protruding structures, such as mounted on top 301 or as part of top 301.

在一些實施方式中，第一裝置盤304透過滑動式置放放置於窗槽202a或202b，如大箭頭310所示。第一裝置盤304滑入由窗垂直高度206和窗水平寬度208界定的窗口。這種滑動式置放放置第一裝置盤304到窗槽202a或202b。 In some embodiments, the first device tray 304 is placed in the window groove 202 a or 202 b by sliding placement, as shown by the large arrow 310. The first device tray 304 slides into the window defined by the vertical height 206 of the window and the horizontal width 208 of the window. This sliding placement places the first device tray 304 in the window groove 202a or 202b.

在其他實施方式中，界定整合式伺服器機箱200的一個或多個壁可被移除。例如，由外頂部表面224和內頂部表面214所界定的壁的至少一部份，可被移除以允許第一裝置盤304在窗槽202a或窗槽202b的置放。 In other embodiments, one or more walls defining the integrated server chassis 200 may be removed. For example, at least a portion of the wall defined by the outer top surface 224 and the inner top surface 214 can be removed to allow the first device tray 304 to be placed in the window slot 202a or the window slot 202b.

第4圖係根據另一實施方式，模組化系統300的立體圖。模組化系統300包括整合式機箱200、第二裝置402和第二裝置盤404。第二裝置盤404和第二裝置402的組合，形成第二模組或子系統406。在此實施例中，第二裝置盤404被配置以在每一第二模組406中承載最多八個第二裝置402。 FIG. 4 is a perspective view of a modular system 300 according to another embodiment. The modular system 300 includes an integrated chassis 200, a second device 402 and a second device disk 404. The combination of the second device disk 404 and the second device 402 forms a second module or subsystem 406. In this embodiment, the second device tray 404 is configured to carry a maximum of eight second devices 402 in each second module 406.

在一些實施方式中，模組化系統300包括第二裝置402。對於第二裝置402具有匹配規格的任一裝置，可被使用於模組化系統300。例如如第4圖所示的實施方式，裝置具有尺形規格。 In some embodiments, the modular system 300 includes a second device 402. Any device with matching specifications for the second device 402 can be used in the modular system 300. For example, as shown in the embodiment shown in Fig. 4, the device has a size specification.

第二裝置盤404包括八個槽408a到408h。為了明確起見，只有裝置槽408a和408h被指示。例如裝置槽408a和408h的槽被配置以用於第二裝置402在第二裝置盤404的置放。裝置槽408a顯示未被裝置占用。 The second device tray 404 includes eight slots 408a to 408h. For clarity, only the device slots 408a and 408h are indicated. Slots such as device slots 408a and 408h are configured for placement of the second device 402 on the second device tray 404. The device slot 408a shows that it is not occupied by the device.

大箭頭310說明第二裝置402的滑動式置放到第二裝置盤404，如何透過輪廓開口412，可放置第二裝置402進裝置槽408a。第二裝置402被顯示占用裝置槽408h。 The large arrow 310 illustrates how the second device 402 is slidably placed on the second device tray 404, and how the second device 402 can be placed into the device slot 408a through the contour opening 412. The second device 402 is shown to occupy the device slot 408h.

第二裝置盤404可被放置到整合式伺服器機箱200的任意窗槽202a、202b之一。這是因為第二裝置盤404具有與窗槽202a、202b的尺寸相似的外部尺寸。第二裝置盤404也具有相似於第一裝置盤304(第3A圖)外部尺寸的外部尺寸。例如，第二裝置盤高度314可約相同於窗垂直高度206。裝置盤寬度316可約相同於窗水平寬度208。第二裝置盤深度318可約相同於或短於窗槽202a和202b的窗深度210。 The second device disk 404 can be placed in any one of the window slots 202 a and 202 b of the integrated server chassis 200. This is because the second device tray 404 has an outer size similar to that of the window grooves 202a, 202b. The second device tray 404 also has external dimensions similar to those of the first device tray 304 (Figure 3A). For example, the height 314 of the second device tray may be approximately the same as the vertical height 206 of the window. The device tray width 316 may be approximately the same as the window horizontal width 208. The second device tray depth 318 may be about the same as or shorter than the window depth 210 of the window grooves 202a and 202b.

第5圖係另一實施方式，模組化系統300的立體圖。在此實施方式中，模組化系統300包括整合式伺服器機箱200、模組或子系統306和模組或子系統406。每一第一裝置盤304和第二裝置盤404可被放置到窗槽202a、202b之一。第一裝置盤304可被放置進窗槽202a，且第二裝置盤404可被放置進窗槽202b。可選地，第一裝置盤304可被放置進窗槽202b，且第二裝置盤404可被放置進窗槽202a。第一裝置盤304和第二裝置盤404的置放進窗槽202a或202b為可變換的，因為窗槽202a和202b具有相同的尺寸，如前面所述。 FIG. 5 is a perspective view of a modular system 300 according to another embodiment. In this embodiment, the modular system 300 includes an integrated server chassis 200, a module or subsystem 306, and a module or subsystem 406. Each of the first device tray 304 and the second device tray 404 can be placed in one of the window slots 202a, 202b. The first device tray 304 can be placed into the window slot 202a, and the second device tray 404 can be placed into the window slot 202b. Optionally, the first device tray 304 can be placed in the window slot 202b, and the second device tray 404 can be placed in the window slot 202a. The placement of the first device tray 304 and the second device tray 404 into the window slot 202a or 202b is changeable because the window slots 202a and 202b have the same size, as described above.

第6A圖顯示根據本揭露的一些實施方式，包括裝置盤404’的模組或子系統406’立體圖。裝置盤404’相似於顯示於第4圖的裝置盤404。顯示了一些差異，例如第4圖和第5圖顯示槽部件322，而圓孔部件422則被包含在裝置盤404’。孔部件422可提供組裝的用途，例如容納螺絲或其他結件。孔部件422也可用於其他用途，如前面所述，例如用於通風、重量管理和提供彈性。裝置盤404’配置以用於第二裝置402的滑動式置放到裝置槽408a到408h，如大箭頭310所指示。 Figure 6A shows a perspective view of a module or subsystem 406' including a device disk 404' according to some embodiments of the present disclosure. The device disk 404' is similar to the device disk 404 shown in FIG. 4. Some differences are shown. For example, Figs. 4 and 5 show the slot part 322, while the hole part 422 is included in the device tray 404'. The hole part 422 can be used for assembling, such as accommodating screws or other fasteners. The hole member 422 can also be used for other purposes, as described above, for example, for ventilation, weight management, and elasticity. The device tray 404' is configured for sliding placement of the second device 402 into the device slots 408a to 408h, as indicated by the large arrow 310.

在裝置盤404’後面的開口620允許從第二裝置402電連接到安裝在整合式伺服器機箱200的其他組件。例如，主機板可與電源供應器透過開口620電連接。 The opening 620 behind the device tray 404' allows electrical connection from the second device 402 to other components installed in the integrated server chassis 200. For example, the motherboard can be electrically connected to the power supply through the opening 620.

每一第二裝置402具有相同的規格。在此示例中，有八個第二裝置402裝配到對應的裝置槽408a到408h。如在此所使 用，一「件」係一組裝置中的單個裝置。在一些其他的實施方式中，裝置盤可包括更多或更少承載裝置用的位置。例如，一組裝置可具有1到20、1到10、1到8或1到2件。裝置402的結件608顯示於第6A圖，也顯示在第6B圖的放大和重新定向視圖(blown-up and reoriented view)。在一些實施方式中，結件608為裝置402用的承載器的一部份。 Each second device 402 has the same specifications. In this example, there are eight second devices 402 fitted to the corresponding device slots 408a to 408h. As used here Used, a "piece" refers to a single device in a group of devices. In some other embodiments, the device tray may include more or fewer locations for carrying devices. For example, a set of devices may have 1 to 20, 1 to 10, 1 to 8, or 1 to 2 pieces. The knot 608 of the device 402 is shown in Fig. 6A, and is also shown in the blown-up and reoriented view of Fig. 6B. In some embodiments, the knot 608 is part of the carrier for the device 402.

第6B圖係***裝置盤404’的裝置槽408g和408h中之第二裝置402的一部份的下視圖。結件608被包括作為第二裝置402的一部份，或當被使用時，作為第二裝置402用的承載器。結件608包括閂鎖機構609的第一部份，與閂鎖機構610的第二部份接合，閂鎖機構610的第二部份為裝置盤404’的底部604的口。透過接合第一閂鎖機構609與第二閂鎖機構610，第二裝置402被固定在個別的槽，例如在裝置槽408g和408h之一。其他實施方式使用其他方法以固定裝置，例如在裝置承載器的第二裝置402。例如，其他方法可包括卡入置放(snap in placement)、摩擦或夾持。 Figure 6B is a bottom view of a portion of the second device 402 inserted into the device slots 408g and 408h of the device tray 404'. The knot 608 is included as part of the second device 402 or, when used, as a carrier for the second device 402. The knot 608 includes the first part of the latch mechanism 609, which engages with the second part of the latch mechanism 610. The second part of the latch mechanism 610 is the opening of the bottom 604 of the device tray 404'. By engaging the first latch mechanism 609 and the second latch mechanism 610, the second device 402 is fixed in a separate groove, for example, in one of the device grooves 408g and 408h. Other embodiments use other methods to secure the device, such as the second device 402 in the device carrier. For example, other methods may include snap in placement, rubbing or clamping.

第6C圖係第6A圖中的橫截面“A-A”的後視圖。裝置盤404’具有頂部602、底部604、間隔件606和側壁607。裝置槽408a和408h由頂部602、底部604、間隔件606和側壁607的內表面界定。頂部602提供內表面602a。底部604提供內表面604a。間隔件606提供內表面606a。側壁607提供內表面607a。每一裝置槽408a到408h也由裝置盤404’前面的至少一開口412界定。 Figure 6C is a rear view of the cross section "A-A" in Figure 6A. The device tray 404' has a top 602, a bottom 604, spacers 606, and side walls 607. The device grooves 408a and 408h are defined by the inner surfaces of the top 602, the bottom 604, the spacer 606, and the side wall 607. The top 602 provides an inner surface 602a. The bottom 604 provides an inner surface 604a. The spacer 606 provides an inner surface 606a. The side wall 607 provides an inner surface 607a. Each device slot 408a to 408h is also defined by at least one opening 412 in the front of the device tray 404'.

在一些實施方式中，裝置盤404’由前視角為從左到右 和從上到下對稱，如第6A圖所示。在其他實施方式中，裝置盤從左到右為對稱，但從上到下不對稱。裝置盤也可從上到下為對稱，但從左到右不對稱，或由前視角四側全不對稱。 In some embodiments, the front view of the device tray 404' is from left to right It is symmetrical from top to bottom, as shown in Figure 6A. In other embodiments, the device tray is symmetrical from left to right, but asymmetrical from top to bottom. The device disc can also be symmetrical from top to bottom, but asymmetrical from left to right, or completely asymmetrical on all four sides from the front viewing angle.

第7A圖顯示裝置盤404’的頂視圖。第7B圖顯示裝置盤404’的前視圖。第7C圖顯示裝置盤404’的側視圖。裝置盤高度314、裝置盤寬度316、裝置盤深度318被顯示。窗槽202a、202b的窗垂直高度206(例如，如第5圖所示)約相同於裝置盤404’的裝置盤高度314。窗水平寬度208(第5圖)約相同於裝置盤寬度316。窗深度210(第5圖)約相同於裝置盤深度318。 Figure 7A shows a top view of the device tray 404'. Figure 7B shows a front view of the device tray 404'. Figure 7C shows a side view of the device tray 404'. The device tray height 314, the device tray width 316, and the device tray depth 318 are displayed. The vertical window height 206 of the window slots 202a, 202b (e.g., as shown in FIG. 5) is approximately the same as the device disk height 314 of the device disk 404'. The horizontal window width 208 (Figure 5) is approximately the same as the device tray width 316. The window depth 210 (Figure 5) is approximately the same as the device tray depth 318.

第8A圖係顯示根據本揭露的一些實施方式，第三模組或子系統806的立體圖。第三模組806包括第三裝置盤804、第三裝置802。第三裝置802也可包括第三裝置承載器。第三裝置802或裝置802用的第三裝置承載器係，配置以滑動式置放進裝置槽808a和808b內。裝置槽808a、808b也由第三裝置盤804的前面至少一開口812界定。 FIG. 8A shows a perspective view of the third module or subsystem 806 according to some embodiments of the present disclosure. The third module 806 includes a third device disk 804 and a third device 802. The third device 802 may also include a third device carrier. The third device 802 or the third device carrier system for the device 802 is configured to be slidably placed in the device slots 808a and 808b. The device slots 808a and 808b are also defined by at least one opening 812 in the front of the third device tray 804.

第三裝置盤804背面的開口820允許線材的***，用以電連接到安裝在整合式伺服器機箱200的其他組件。 The opening 820 on the back of the third device tray 804 allows the insertion of wires for electrical connection to other components installed in the integrated server chassis 200.

每一第三裝置802具有相同的規格。裝置802形成一組兩件裝置，裝配進裝置槽808a和808b。在此實施方式中，裝置為圖形處理單元(GPU)卡，但其他的裝置可被使用。 Each third device 802 has the same specifications. The device 802 forms a set of two devices that fit into the device slots 808a and 808b. In this embodiment, the device is a graphics processing unit (GPU) card, but other devices can be used.

第8B圖係第8A圖中橫截面“B-B”的後視圖。第三裝置盤804具有頂部801、底部803、間隔件805和側壁807。裝置 槽808a和808b由頂部801、底部803、間隔件805和側壁807的內表面界定。頂部801提供內表面801a。底部803提供內表面803a。間隔件805提供內表面805a。側壁807提供內表面807a。 Figure 8B is a rear view of the cross section "B-B" in Figure 8A. The third device tray 804 has a top 801, a bottom 803, a spacer 805, and a side wall 807. Device The grooves 808a and 808b are defined by the inner surfaces of the top 801, the bottom 803, the spacer 805, and the side wall 807. The top 801 provides an inner surface 801a. The bottom 803 provides an inner surface 803a. The spacer 805 provides an inner surface 805a. The side wall 807 provides an inner surface 807a.

第9A圖顯示第三裝置盤804的頂視圖。第9B圖顯示第三裝置盤804的前視圖。第9C圖顯示第三裝置盤804的側視圖。第三裝置盤高度314、第三裝置盤寬度316和第三裝置盤深度318被顯示。窗垂直高度206(例如，如第5圖所示)約相同於第三裝置盤804的第三裝置盤高度314。窗水平寬度208(第5圖)約相同於第三裝置盤寬度316。窗深度210(第5圖)約相同於第三裝置盤深度318。 Figure 9A shows a top view of the third device tray 804. Figure 9B shows a front view of the third device tray 804. FIG. 9C shows a side view of the third device tray 804. FIG. The third device tray height 314, the third device tray width 316, and the third device tray depth 318 are displayed. The window vertical height 206 (for example, as shown in FIG. 5) is approximately the same as the third device tray height 314 of the third device tray 804. The window horizontal width 208 (Figure 5) is approximately the same as the third device tray width 316. The window depth 210 (FIG. 5) is approximately the same as the third device tray depth 318.

第三裝置盤804具有大開槽(open slot)部件822，形成在頂部801。在一些實施方式中，開槽部件822提供以用於匹配第三裝置802(如第8A圖所示)的規格的形狀。開槽部件822也可提供以用於前述用途，例如通風、重量管理和提供彈性。 The third device tray 804 has a large open slot part 822 formed on the top 801. In some embodiments, the slotted member 822 is provided with a shape that matches the specifications of the third device 802 (shown in Figure 8A). The slotted member 822 may also be provided for the aforementioned purposes, such as ventilation, weight management, and providing elasticity.

在第8A圖和第9B圖說明的實施方式中，內表面801a包括部件814，形成頂部801的一部份。相較於第三裝置盤高度314，部件814減少內部裝置支架的高度距離818。部件814可提供與裝置802(如第8A圖所示)的頂部表面810接觸，且容納第三裝置802的規格。部件也提供空間以容納連接的線材。 In the embodiment illustrated in FIGS. 8A and 9B, the inner surface 801a includes a part 814 forming part of the top 801. Compared to the third device tray height 314, the component 814 reduces the height distance 818 of the internal device bracket. The component 814 can provide contact with the top surface 810 of the device 802 (as shown in FIG. 8A) and accommodate the specifications of the third device 802. The components also provide space to accommodate the connected wires.

第10A圖係顯示根據本揭露的一些實施方式，第四模組或子系統1006的立體圖。第四模組1006包括第四裝置盤1004和第四裝置承載器1002。在此實施方式中，第四裝置承載器1002配置以承載3.5英吋HHD。第四裝置承載器1002、或第四裝置和第四 裝置承載器1002，配置以滑動式置放進第四裝置承載器1002的裝置槽1008a、1008b，如大箭頭310所示。第四裝置盤1004背面的開口1020允許電連接到安裝在整合式伺服器機箱200中的其他組件。槽部件1022提供以用於前述的原因，例如增加通風、節省材料成本、提供壁的彈性或減少第四裝置盤1004的整體重量。 FIG. 10A shows a perspective view of the fourth module or subsystem 1006 according to some embodiments of the present disclosure. The fourth module 1006 includes a fourth device tray 1004 and a fourth device carrier 1002. In this embodiment, the fourth device carrier 1002 is configured to carry 3.5-inch HHD. The fourth device carrier 1002 or the fourth device and the fourth The device carrier 1002 is configured to be slidably placed into the device slots 1008a, 1008b of the fourth device carrier 1002, as shown by the big arrow 310. The opening 1020 on the back of the fourth device tray 1004 allows electrical connection to other components installed in the integrated server chassis 200. The trough member 1022 is provided for the aforementioned reasons, such as increasing ventilation, saving material cost, providing elasticity of the wall, or reducing the overall weight of the fourth device tray 1004.

第10B圖係第10A圖中橫截面“C-C”的後視圖。第四裝置盤1004具有頂部1001、底部1003、間隔件1005和側壁1007。裝置槽1008a和1008b由頂部1001、底部1003、間隔件1005和側壁1007的內表面界定。頂部1001提供內表面1001a。底部1003提供內表面1003a。間隔件1005提供內表面1005a。側壁1007提供內表面1007a。裝置槽1008a和1008b也由裝置盤1004前面的開口1012界定。 Figure 10B is a rear view of the cross section "C-C" in Figure 10A. The fourth device tray 1004 has a top 1001, a bottom 1003, a spacer 1005, and a side wall 1007. The device grooves 1008a and 1008b are defined by the inner surface of the top 1001, the bottom 1003, the spacer 1005, and the side wall 1007. The top 1001 provides an inner surface 1001a. The bottom 1003 provides an inner surface 1003a. The spacer 1005 provides an inner surface 1005a. The side wall 1007 provides an inner surface 1007a. The device slots 1008a and 1008b are also defined by the opening 1012 in the front of the device tray 1004.

在一些實施方式中，裝置盤的一個或多個部件如在此所述可被移除、失去或修改而不會改變裝置盤的功能。例如，第10C圖顯示由第10A圖的橫截面“C-C”視圖的第三裝置盤804的替代性的實施方式。在此實施例中，如第10B圖所示的間隔件1005被移除。開口1013由內表面1001a、1003a和1007a界定，且相應地為第10B圖中的兩個的開口1012的至少兩倍大小。邊界1023顯示為虛線，表示界定裝置槽1008a和1008b用的細分邊界。在此實施方式中，裝置槽1008a和1008b由內表面1001a、內表面1003a、內表面1007a和邊界1023界定。邊界1023由第三裝置承載器1002(顯示在第10A圖)提供。例如，如第10A圖所示，在裝置槽1008a中之第三 裝置承載器1002的表面1024、以及在裝置槽1008b中之裝置承載器1002的表面1026形成邊界1023。 In some embodiments, one or more components of the device disk may be removed, lost, or modified as described herein without changing the function of the device disk. For example, FIG. 10C shows an alternative embodiment of the third device tray 804 from the cross-sectional "C-C" view of FIG. 10A. In this embodiment, the spacer 1005 as shown in FIG. 10B is removed. The opening 1013 is defined by the inner surfaces 1001a, 1003a, and 1007a, and is correspondingly at least twice the size of the two openings 1012 in Figure 10B. The boundary 1023 is shown as a dashed line, indicating the subdivision boundary used to define the device slots 1008a and 1008b. In this embodiment, the device grooves 1008a and 1008b are bounded by an inner surface 1001a, an inner surface 1003a, an inner surface 1007a, and a boundary 1023. The boundary 1023 is provided by the third device carrier 1002 (shown in Figure 10A). For example, as shown in Figure 10A, the third in the device slot 1008a The surface 1024 of the device carrier 1002 and the surface 1026 of the device carrier 1002 in the device slot 1008b form a boundary 1023.

第四裝置盤1004配置以裝配進整合式伺服器機箱200的窗槽202a、202b(例如，顯示在第5圖)內。第四裝置盤高度314、第四裝置盤寬度316、第四裝置盤深度318被顯示於第10A圖和第10B圖。窗槽202a和202b的窗垂直高度206約相同於第四裝置盤1004的第四裝置盤高度314。窗水平寬度208約相同於第四裝置盤寬度316。窗深度210約相同於第四裝置盤深度318。 The fourth device disk 1004 is configured to fit into the window slots 202a, 202b (for example, shown in FIG. 5) of the integrated server chassis 200. The fourth device disk height 314, the fourth device disk width 316, and the fourth device disk depth 318 are shown in FIGS. 10A and 10B. The vertical window height 206 of the window slots 202 a and 202 b is approximately the same as the fourth device disk height 314 of the fourth device disk 1004. The horizontal width 208 of the window is approximately the same as the width 316 of the fourth device tray. The window depth 210 is approximately the same as the fourth device tray depth 318.

第11A圖顯示根據另一實施方式的模組化系統300。第一模組306、第二模組406、第三模組806、第四模組1006和整合式伺服器機箱200被顯示於立體圖。第一模組306、第二模組406、第三模組806和第四模組1006的任何一個或兩個，可被放置在模組化系統300的窗槽202a或202b。 FIG. 11A shows a modular system 300 according to another embodiment. The first module 306, the second module 406, the third module 806, the fourth module 1006 and the integrated server chassis 200 are shown in a three-dimensional view. Any one or two of the first module 306, the second module 406, the third module 806, and the fourth module 1006 can be placed in the window slot 202a or 202b of the modular system 300.

第11B圖顯示具有兩個模組和對應的裝置在定位的整合式伺服器機箱200的前視圖。第二模組406和第二裝置402(尺形裝置)被顯示於左側的窗槽202a。第三模組806和第三裝置802(GPU)被顯示於右側的窗槽202b。 FIG. 11B shows a front view of the integrated server chassis 200 with two modules and corresponding devices in positioning. The second module 406 and the second device 402 (ruler-shaped device) are displayed in the window slot 202a on the left. The third module 806 and the third device 802 (GPU) are displayed in the window 202b on the right.

在一些用於組裝整合式伺服器系統的實施方式中，裝置盤先被***至窗槽202a或202b，然後對應的裝置被放置於裝置盤。例如，第一裝置盤304被放置於窗槽202a或202b之一，然後裝置和第一裝置承載器302(第11A圖)被放置於裝置盤304的裝置槽308a。替代性地，在一些實施方式中，裝置被放置於裝置盤，然後 承載裝置的裝置盤被放置於窗槽202a或202b。 In some implementations for assembling an integrated server system, the device disk is first inserted into the window slot 202a or 202b, and then the corresponding device is placed on the device disk. For example, the first device tray 304 is placed in one of the window slots 202a or 202b, and then the device and the first device carrier 302 (FIG. 11A) are placed in the device slot 308a of the device tray 304. Alternatively, in some embodiments, the device is placed on the device tray, and then The device tray carrying the device is placed in the window slot 202a or 202b.

第12A圖係根據一些實施方式，模組化系統的頂部示意圖。第一模組(模組A)1206a和第二模組(模組B)1206b被放置於整合式伺服器機箱200的前域204。模組1206a被顯示於窗槽202a。模組1206b被顯示於窗槽202b。如所示，整合式伺服器機箱200可具有一排兩個或多個窗槽202a和202b。例如，整合式機箱可具有1到10個窗槽202a到202j。 Figure 12A is a top schematic view of a modular system according to some embodiments. The first module (module A) 1206a and the second module (module B) 1206b are placed in the front domain 204 of the integrated server chassis 200. The module 1206a is displayed in the window slot 202a. The module 1206b is displayed in the window slot 202b. As shown, the integrated server chassis 200 may have a row of two or more window slots 202a and 202b. For example, the integrated chassis may have 1 to 10 window slots 202a to 202j.

第12A圖所示的每一模組也可具有一個或多個裝置。例如，模組1206a可具有一個或多個裝置，例如裝置(裝置A)1202a。模組1206b可具有一個或多個裝置，例如裝置(裝置B)1202b。如前面所述，可為任意裝置的數量，例如，在一些實施方式中為1到20件。 Each module shown in Figure 12A may also have one or more devices. For example, the module 1206a may have one or more devices, such as device (device A) 1202a. The module 1206b may have one or more devices, such as a device (device B) 1202b. As described above, it can be any number of devices, for example, 1 to 20 in some embodiments.

第12B圖係根據本揭露的一些實施方式，模組化系統的前部示意圖。模組(模組A)1206a、(模組B)1206b、(模組C)1206c和(模組D)1206d被顯示。模組1206a、1206b、1206c和1206d被顯示排列成排和列。排被表示為R1、R2到Rn。在此實施例中，每一排具有一個機架單位(U)的寬度，且「n」表示排的數量。在其他實施例中，排可為其他寬度，例如每一寬度為2U、3U、4U或5U。排的數量依據排寬度和整合式機箱高度。在一些實施方式中，排的數量為1到20、1到10、1到5或1到2。列被表示為C1、C2到Cm，其中m為列的數量。列的數量可為任意值。例如，1到20、1到10、1到5或1到2。 FIG. 12B is a front schematic diagram of a modular system according to some embodiments of the present disclosure. Modules (module A) 1206a, (module B) 1206b, (module C) 1206c, and (module D) 1206d are displayed. The modules 1206a, 1206b, 1206c, and 1206d are displayed arranged in rows and columns. The rows are represented as R1, R2 to Rn. In this embodiment, each row has a width of one rack unit (U), and "n" represents the number of rows. In other embodiments, the rows may have other widths, for example, each width is 2U, 3U, 4U, or 5U. The number of rows depends on the width of the row and the height of the integrated chassis. In some embodiments, the number of rows is 1 to 20, 1 to 10, 1 to 5, or 1 to 2. The columns are represented as C1, C2 to Cm, where m is the number of columns. The number of columns can be any value. For example, 1 to 20, 1 to 10, 1 to 5, or 1 to 2.

在一些實施方式中，模組按排對齊。因此，模組1206a的頂部(或底部)與模組1206b的頂部(或底部)對齊。例如，R1用的頂部對齊線是高度為1U的虛線1210。這是由窗槽202a1、202a2、202b1和202b2的窗口的相應排對齊以提供的。相似地，模組1206c和模組1206d可在排2(R2)被對齊。排R2的頂部對齊線是高度為2U的虛線1212。 In some embodiments, the modules are aligned in rows. Therefore, the top (or bottom) of the module 1206a is aligned with the top (or bottom) of the module 1206b. For example, the top alignment line for R1 is the dashed line 1210 with a height of 1U. This is provided by the alignment of the corresponding rows of the windows of the window slots 202a1, 202a2, 202b1, and 202b2. Similarly, module 1206c and module 1206d can be aligned in row 2 (R2). The top alignment line of row R2 is a dotted line 1212 with a height of 2U.

在一些實施方式中，模組按列對齊。例如，模組1206a的側面與模組1206c的對應側面對齊。模組1206b的側面與模組1206d的側面對齊。虛線1214顯示列C1的對齊，且虛線1216顯示列C2的對齊。列的對齊由窗槽202a1、202a2、202b1和202b2的窗口的相應對齊以提供。窗槽202a1、202a2、202b1和202b2具有如前面所述用的窗槽202a、202b(例如，第5圖所示)相似的特點。 In some embodiments, the modules are aligned in rows. For example, the side of the module 1206a is aligned with the corresponding side of the module 1206c. The side of the module 1206b is aligned with the side of the module 1206d. Dashed line 1214 shows the alignment of column C1, and dotted line 1216 shows the alignment of column C2. The alignment of the columns is provided by the corresponding alignment of the windows of the window slots 202a1, 202a2, 202b1, and 202b2. The window grooves 202a1, 202a2, 202b1, and 202b2 have similar characteristics to the window grooves 202a, 202b (for example, as shown in FIG. 5) used previously.

在此使用的名詞只為描述特定的實施例的用途，且並非旨在限制本新型。如在此所使用的，單數形式「一(a,an,the)」旨在同時包括複數形式，除非上下文明確指出並非如此。此外，名詞「包括(including,includes)」、「具有(having,has,with)」或其變體，為使用在實施方式及/或申請專利範圍，這樣的名詞旨在以相似名詞「包括」的方式包括在內。 The terms used here only describe the purpose of specific embodiments, and are not intended to limit the present invention. As used herein, the singular form "一 (a, an, the)" is intended to include the plural form at the same time, unless the context clearly indicates otherwise. In addition, the nouns "including (including, includes)", "having, has, with" or their variants are used in the implementation and/or the scope of the patent application. Such nouns are intended to be similar to the nouns "including." The way is included.

除非其他的界定，在此使用的全部名詞(包括技術和科學名詞)，具有本技術領域通常知識者普遍理解的相同意義。此外，例如那些定義在常用字典的名詞，應被解讀為具有與其在該相關技術領域的語境中意義一致的意義，除非在此明確定義，不會被 解讀為理想化或過度正式的意義。 Unless otherwise defined, all terms used here (including technical and scientific terms) have the same meanings commonly understood by those skilled in the art. In addition, for example, nouns defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technical field. Unless clearly defined here, they will not be Interpreted as an idealized or over-formal meaning.

儘管本新型的多種實施例已在以上描述，應當理解它們僅以示例而非限制的方式表示。在不脫離本新型的精神或範圍的情況下，可以根據本揭露的實施例進行多種改變。因此，本新型的廣度和範圍不應受到任何上述實施例限制。而是，本新型的範圍應根據以下申請專利範圍及其均等物界定。 Although various embodiments of the present invention have been described above, it should be understood that they are only represented by way of example and not limitation. Various changes can be made according to the embodiments of the present disclosure without departing from the spirit or scope of the present invention. Therefore, the breadth and scope of the present invention should not be limited by any of the above-mentioned embodiments. Rather, the scope of the present model should be defined in accordance with the scope of the following patent applications and their equivalents.

儘管已經相對於一個或多個實施方式示出和描述了本新型(揭露的實施例)，在閱讀和理解此說明書和附圖後，本技術領域具有通常知識者將想到或了解均等物的改變和修改。另外，儘管已經針對幾種實施方式中的一種實施方式揭露本新型的特定特徵，對於任何給定的或特定的應用，這樣的特徵可與其他實施方式的一個或多個其他特徵組合，這可能是理想和有利的。 Although the present invention (disclosed embodiments) has been shown and described with respect to one or more embodiments, after reading and understanding this specification and drawings, those with ordinary knowledge in the art will think of or understand changes in equivalents And modify. In addition, although specific features of the present invention have been disclosed for one of several embodiments, for any given or specific application, such features can be combined with one or more other features of other embodiments, which may be It is ideal and advantageous.

200:伺服器機箱/整合式伺服器機箱 200: server chassis/integrated server chassis

202a,202b:窗槽 202a, 202b: window slot

204:前域 204: front domain

206:窗垂直高度 206: vertical height of window

208:窗水平寬度 208: Window horizontal width

210:窗深度 210: window depth

214:內頂部表面 214: inner top surface

224:外頂部表面 224: outer top surface

300:模組化系統 300: Modular system

302:第一裝置承載器 302: first device carrier

304:第一裝置盤 304: first device disk

306:第一模組 306: The first module

308a,308b:裝置槽 308a, 308b: device slot

310:大箭頭 310: Big Arrow

312,320:開口 312,320: opening

314:裝置盤高度/第二裝置盤高度/第三裝置盤高度/第四裝置盤高度 314: Device Disk Height/Second Device Disk Height/Third Device Disk Height/Fourth Device Disk Height

316:裝置盤寬度/第三裝置盤寬度/第四裝置盤寬度 316: Device disk width/third device disk width/fourth device disk width

318:裝置盤深度/第二裝置盤深度/第三裝置盤深度/第四裝置盤深度 318: Device Disk Depth/Second Device Disk Depth/Third Device Disk Depth/Fourth Device Disk Depth

322:槽部件 322: Groove Parts

Claims (8)

一種模組化伺服器系統，包括：一伺服器機箱，具有一個或多個窗槽，每一該窗槽具有相同的尺寸；以及複數個裝置盤，每一該裝置盤用於承載一裝置，該裝置係從複數個不同裝置中選擇出，且每一該裝置盤裝配到該一個或多個窗槽。 A modular server system includes: a server chassis with one or more window slots, each window slot having the same size; and a plurality of device disks, each of which is used to carry a device, The device is selected from a plurality of different devices, and each device disk is fitted to the one or more window slots. 如請求項1之系統，其中從該等複數個裝置中選擇出至少一第一裝置，具有與從該等複數個裝置中選擇出的第二裝置的規格不同的規格。 Such as the system of claim 1, wherein at least one first device selected from the plurality of devices has a specification different from that of the second device selected from the plurality of devices. 如請求項1之系統，其中至少一該裝置盤包括一裝置承載器，用於將該裝置與該裝置盤耦合。 Such as the system of claim 1, wherein at least one of the device disks includes a device carrier for coupling the device with the device disk. 如請求項1之系統，其中該裝置盤包括：一個或多個裝置槽，具有一內表面，界定一內部空間，用於放置該裝置；一前開口，用於該裝置的滑動式置放；一後開口，用於連接該裝置到至少一第二裝置；以及一結件，用於承載該裝置在該裝置槽中。 Such as the system of claim 1, wherein the device tray includes: one or more device slots with an inner surface defining an internal space for placing the device; a front opening for sliding placement of the device; A rear opening is used to connect the device to at least one second device; and a knot is used to carry the device in the device slot. 如請求項1之系統，其中該窗槽包括：一窗水平寬度，約相同於一裝置盤寬度；一窗垂直高度，約相同於一裝置盤高度；以及一窗深度，約相同於或約小於一裝置盤深度；以及一開口，在該機箱中，由該窗水平寬度和該窗垂直高度界定，該開 口透過接合一個或多個內表面、該窗槽的一軌道、該窗槽的一凹槽以及該窗槽的一結件，允許該裝置盤的滑動式置放至每一該窗槽，其中該內表面界定該窗槽。 Such as the system of claim 1, wherein the window slot includes: a horizontal width of a window, approximately the same as the width of a device tray; a vertical height of the window, approximately the same as the height of a device tray; and a window depth, approximately the same as or approximately less than A device tray depth; and an opening, in the case, defined by the horizontal width of the window and the vertical height of the window, the opening By joining one or more inner surfaces, a track of the window slot, a groove of the window slot, and a knot of the window slot, the device disk is allowed to be slidably placed in each window slot, wherein The inner surface defines the window groove. 如請求項1之系統，其中該伺服器機箱包括：一機架式伺服器規格，包括一寬度、一高度、一深度；以及複數個前窗，在由該寬度和該高度界定的平面上；每一該前窗包括：一開口，具有一水平寬度和一垂直高度，且其中該開口被定位於該機箱的前部，且界定開向該等窗槽之一的一口；其中至少兩個該開口界定一排窗口，且該排窗口的每一開口在該寬度方向上排列，且在該垂直高度和該水平寬度上彼此對齊。 Such as the system of claim 1, wherein the server chassis includes: a rack server specification, including a width, a height, and a depth; and a plurality of front windows on a plane defined by the width and the height; Each of the front windows includes: an opening having a horizontal width and a vertical height, and wherein the opening is positioned at the front of the chassis and defines an opening to one of the window slots; wherein at least two of the openings are The openings define a row of windows, and each opening of the row of windows is arranged in the width direction and aligned with each other in the vertical height and the horizontal width. 如請求項1之系統，其中該伺服器機箱包括：一機架式伺服器規格，包括一寬度、一高度、一深度；以及複數個前窗，在由該寬度和該高度界定的平面上；每一該前窗包括：一開口，具有一水平寬度和一垂直高度，且其中每一該開口被定位於該機箱的前部，並界定開向該等窗槽之一的一口；其中至少兩個該開口界定一列窗口，且該列窗口的每一開口在高度方向上排列，且在該垂直高度和該水平寬度上彼此對齊。 Such as the system of claim 1, wherein the server chassis includes: a rack server specification, including a width, a height, and a depth; and a plurality of front windows on a plane defined by the width and the height; Each of the front windows includes: an opening having a horizontal width and a vertical height, and each of the openings is positioned at the front of the chassis and defines an opening to one of the window slots; at least two of them Each of the openings defines a row of windows, and each opening of the row of windows is arranged in the height direction and aligned with each other in the vertical height and the horizontal width. 如請求項1之系統，其中該伺服器機箱包括：一機架式伺服器規格，包括一寬度、一高度、一深度；以及複數個前窗，在由該寬度和該高度界定的平面上； 每一該前窗包括：一開口，具有一水平寬度和一垂直高度，以及每一該開口被定位於該機箱的前部，且界定開向該等窗槽之一的一口；其中至少兩個該開口界定一排窗口，且該排窗口的每一該開口在寬度方向上排列，且在該垂直高度和該水平寬度上彼此對齊；其中至少兩個該開口界定一列窗口，且該列窗口的每一開口在高度方向上排列，且在該垂直高度和該水平寬度上彼此對齊。Such as the system of claim 1, wherein the server chassis includes: a rack server specification, including a width, a height, and a depth; and a plurality of front windows on a plane defined by the width and the height; Each of the front windows includes: an opening having a horizontal width and a vertical height, and each of the openings is positioned at the front of the chassis and defines an opening to one of the window slots; at least two of them The opening defines a row of windows, and each of the openings of the row of windows is arranged in the width direction and aligned with each other in the vertical height and the horizontal width; wherein at least two of the openings define a row of windows, and the row of windows Each opening is arranged in the height direction and aligned with each other in the vertical height and the horizontal width.

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