TWM613246U

TWM613246U - Ssd and ssd system

Info

Publication number: TWM613246U
Application number: TW110202039U
Authority: TW
Inventors: 林智堅; 蔡宏斌; 陳建安
Original assignee: 慧榮科技股份有限公司
Priority date: 2020-03-03
Filing date: 2021-02-25
Publication date: 2021-06-11

Abstract

An SSD comprising: a circuit board; a first storage region, provided on a first side of the circuit board, comprising at least one first memory; a control region, provided on the first side, comprising at least one control IC for controlling the first memory; and first heat sink material, provided on the first storage region or the first control region.

Description

SSD以及SSD系統SSD and SSD system

本創作是有關於SSD (Solid State Disk，固態硬碟)以及SSD系統，特別有關於具有散熱機制的SSD以及SSD系統。This creation is about SSD (Solid State Disk, solid state drive) and SSD system, especially about SSD and SSD system with heat dissipation mechanism.

近年來，由於SSD具有較高的存取速度，其變得越來越普及。然而，SSD的零件在高速運作時可能產生較多的熱能，因此需要一種適合的散熱機制。In recent years, SSDs have become more and more popular due to their higher access speeds. However, the parts of the SSD may generate more heat energy during high-speed operation, so a suitable heat dissipation mechanism is required.

因此，本創作一目的為提供一種具有散熱機制的SSD。Therefore, one purpose of this creation is to provide an SSD with a heat dissipation mechanism.

本創作另一目的為提供一種具有散熱機制的SSD系統。Another purpose of this creation is to provide an SSD system with a heat dissipation mechanism.

本創作一實施例提供了一種SSD，包含：一電路板；一第一儲存區，位於該電路版的一第一側上，包含至少一第一記憶體；一控制區，位於該第一側上，包含至少一控制IC，該控制IC用以控制該第一記憶體；以及第一散熱材料，位於該第一儲存區上或該控制區上。An embodiment of the present invention provides an SSD, including: a circuit board; a first storage area located on a first side of the circuit board and including at least one first memory; a control area located on the first side The upper part includes at least one control IC for controlling the first memory; and a first heat dissipation material located on the first storage area or on the control area.

本創作另一實施例提供了一種SSD系統，包含：一殼體；一SSD組，包含***該殼體中的至少一SSD，以及一控制裝置。其中SSD包含：一電路板；一第一儲存區，位於該電路版的一第一側上，包含至少一第一記憶體；一控制區，位於該第一側上，包含至少一控制IC，該控制IC用以控制該第一記憶體；以及第一散熱材料，位於該第一儲存區上或該控制區上。控制裝置位於殼體中，用以控制SSD。Another embodiment of the present invention provides an SSD system, including: a housing; an SSD group, including at least one SSD inserted into the housing, and a control device. The SSD includes: a circuit board; a first storage area located on a first side of the circuit board and including at least one first memory; a control area located on the first side and including at least one control IC, The control IC is used to control the first memory; and the first heat dissipation material is located on the first storage area or on the control area. The control device is located in the housing to control the SSD.

根據前述實施例，本創作提供的SSD或SSD系統可以具有適當的散熱機制。According to the foregoing embodiments, the SSD or SSD system provided by this creation may have an appropriate heat dissipation mechanism.

以下將以多個實施例來描述本創作的內容，還請留意，以下描述中的”第一”、”第二”以及類似描述僅用來定義不同的元件、參數、資料、訊號或步驟。並非用以限定其次序。舉例來說，第一裝置和第二裝置可表示其具有相同的結構，但為不同的裝置。The following will describe the content of this creation with multiple embodiments. Please also note that the “first”, “second” and similar descriptions in the following description are only used to define different elements, parameters, data, signals or steps. It is not used to limit the order. For example, the first device and the second device may mean that they have the same structure but are different devices.

第1圖繪示了根據本創作一實施例的，不具有散熱材料的SSD 100的示意圖。如第1圖所示，SSD 100包含電路板101，第一儲存區SR_1，控制區CR和第一備用區BR_1。第一儲存區SR_1，控制區CR和第一備用區BR_1設置在電路板101的第一側上。在一實施例中，SSD 100中可不包含第一備用區BR_1。SSD 100還包含SSD拖架103，使用者可以握住該SSD拖架以移動SSD 100。FIG. 1 shows a schematic diagram of an SSD 100 without a heat dissipation material according to an embodiment of the present invention. As shown in FIG. 1, the SSD 100 includes a circuit board 101, a first storage area SR_1, a control area CR, and a first spare area BR_1. The first storage area SR_1, the control area CR and the first spare area BR_1 are arranged on the first side of the circuit board 101. In an embodiment, the SSD 100 may not include the first spare area BR_1. The SSD 100 also includes an SSD tray 103, and the user can hold the SSD tray to move the SSD 100.

第一儲存區SR_1包含至少一個第一記憶體M_1，其可以是NAND快閃記憶體。控制區CR包含用以控制第一記憶體M_1的至少一個控制IC（Integrated Circuit積體電路）CO。請注意，控制IC CO可以分為更多類型的控制IC。例如，控制IC CO可以包含主控制器和其他類型的控制IC。可以根據不同的SSD更改控制IC CO的數量和類型。The first storage area SR_1 includes at least one first memory M_1, which may be a NAND flash memory. The control area CR includes at least one control IC (Integrated Circuit) CO for controlling the first memory M_1. Please note that the control IC CO can be divided into more types of control ICs. For example, the control IC CO may contain a main controller and other types of control ICs. The number and type of control IC CO can be changed according to different SSDs.

第一備用區BR_1包含第一備用電源BP_1和第一備用儲存區BS_1。第一備用電源BP_1可以是電容。第一備用儲存區BS_1包含至少一個第一備用儲存裝置，例如DRAM。當SSD 100不能從外部接收到足夠的電能時，SSD 100使用由第一備用電源BP_1提供的電能將儲存在第一備用儲存裝置BS_1中的資料備份到第一記憶體M_1。例如，SSD 100連接到諸如電腦伺服器之類的外部裝置，但是由於例如電源故障之類的某些原因，電腦伺服器不能向SSD 100提供足夠的電能。在這種情況下，SSD 100使用由第一備用電源BP_1提供的電能將儲存在第一備用儲存裝置BS_1中的資料備份到第一記憶體M_1。通過這種方式，由於第一記憶體M_1是即使不接收電能也可以保持資料的記憶體（例如，NAND快閃記憶體），所以當SSD 100不能從外部接收足夠的電能時仍然可維持必要的資料。The first backup area BR_1 includes a first backup power source BP_1 and a first backup storage area BS_1. The first backup power source BP_1 may be a capacitor. The first backup storage area BS_1 includes at least one first backup storage device, such as DRAM. When the SSD 100 cannot receive sufficient power from the outside, the SSD 100 uses the power provided by the first backup power source BP_1 to back up the data stored in the first backup storage device BS_1 to the first memory M_1. For example, the SSD 100 is connected to an external device such as a computer server, but due to some reasons such as a power failure, the computer server cannot provide enough power to the SSD 100. In this case, the SSD 100 uses the electric energy provided by the first backup power source BP_1 to back up the data stored in the first backup storage device BS_1 to the first memory M_1. In this way, since the first memory M_1 is a memory that can retain data even if it does not receive power (for example, NAND flash memory), it can still maintain the necessary power when the SSD 100 cannot receive enough power from the outside. data.

第2圖、第3圖和第4圖繪示了根據本創作不同實施例的，具有散熱材料的SSD的示意圖。在第2圖的實施例中，會在控制區CR上設置第一散熱材料HSM_1。第一散熱材料HSM_1可以是具有高導熱率的金屬，例如鋁或銅。而且，第一散熱材料HSM_1可以是諸如金屬片的硬質材料。另外，第一散熱材料HSM_1可以是諸如散熱膏的軟性材料。Figures 2, 3, and 4 show schematic diagrams of SSDs with heat dissipation materials according to different embodiments of the invention. In the embodiment of FIG. 2, the first heat dissipation material HSM_1 is provided on the control region CR. The first heat dissipation material HSM_1 may be a metal with high thermal conductivity, such as aluminum or copper. Also, the first heat dissipation material HSM_1 may be a hard material such as a metal sheet. In addition, the first heat dissipation material HSM_1 may be a soft material such as heat dissipation paste.

第一散熱材料HSM_1不限於上述範例。另外，第一散熱材料HSM_1可以設置在SSD 100的任何其他位置。例如，在第3圖的實施例中，第一散熱材料HSM_1也被設置在第一儲存區SR_1和控制區CR上。此外，在第4圖的實施例中，會在第一儲存區SR_1，控制區CR和第一備用區BR_1上設置第一散熱材料HSM_1。The first heat dissipation material HSM_1 is not limited to the above example. In addition, the first heat dissipation material HSM_1 can be disposed at any other position of the SSD 100. For example, in the embodiment of FIG. 3, the first heat dissipation material HSM_1 is also disposed on the first storage area SR_1 and the control area CR. In addition, in the embodiment of FIG. 4, the first heat dissipation material HSM_1 is provided on the first storage area SR_1, the control area CR and the first spare area BR_1.

第1圖所示的元件可以設置在SSD 100的其他位置。第5圖繪示了根據本創作另一實施例的，不具有散熱材料的SSD的示意圖。如第5圖所示，SSD 100包含第二記憶體SR_2和第二備用區BR_2，其設置在電路板101的第二側上。電路板101的第二側與第二儲存區SR_2的第一側相對。第二儲存區SR_2包含至少一個第二記憶體M_2，其可以是NAND快閃記憶體。The components shown in Figure 1 can be placed in other positions of the SSD 100. Figure 5 shows a schematic diagram of an SSD without heat dissipation material according to another embodiment of the present invention. As shown in FIG. 5, the SSD 100 includes a second memory SR_2 and a second spare area BR_2, which are disposed on the second side of the circuit board 101. The second side of the circuit board 101 is opposite to the first side of the second storage area SR_2. The second storage area SR_2 includes at least one second memory M_2, which may be a NAND flash memory.

第二備用區BR_2包含第二備用電源BP_2和第二備用儲存區BS_2。第二備用電源BP_2可以是電容，第二備用儲存裝置BS_2可以是DRAM。SSD 100使用由第二備用電源BP_2提供的電能將儲存在第二備用儲存裝置BS_2中的資料備用到第二記憶體M_2。The second backup area BR_2 includes a second backup power source BP_2 and a second backup storage area BS_2. The second backup power source BP_2 may be a capacitor, and the second backup storage device BS_2 may be a DRAM. The SSD 100 uses the power provided by the second backup power source BP_2 to backup the data stored in the second backup storage device BS_2 to the second memory M_2.

在一實施例中，SSD 100可更包含用於對其進行保護的殼體。在這情況下，殼體圍繞電路板101的最外層，且上述散熱材料設置在殼體與電路板上101的元件（例如，控制區CR，第一儲存區SR_1…）之間。In an embodiment, the SSD 100 may further include a casing for protecting it. In this case, the housing surrounds the outermost layer of the circuit board 101, and the above-mentioned heat dissipation material is disposed between the housing and the components on the circuit board 101 (for example, the control area CR, the first storage area SR_1...).

第6圖和第7圖繪示了根據本創作不同實施例的，具有散熱材料的SSD的示意圖。如第6圖所示，第二散熱材料HSM_2設置在第二儲存區SR_2上。另外，在第7圖的實施例中，第二散熱材料HSM_2設置在第二儲存區SR_2和第二備用區BR_2上。還請留意，在一實施例中，SSD 100還可以包含設置在電路板101第二側的控制電路。在這種情況下，第二散熱材料HSM_2可以設置在第二儲存區SR_2、第二備用區BR_2和控制電路中的至少一個上。例如，第二散熱材料HSM_2可以設置在第二備用區BR_2和控制電路上，或者設置在第二儲存區SR_2和第二備用區BR_2上。Figures 6 and 7 show schematic diagrams of SSDs with heat dissipation materials according to different embodiments of the invention. As shown in FIG. 6, the second heat dissipation material HSM_2 is disposed on the second storage area SR_2. In addition, in the embodiment of FIG. 7, the second heat dissipation material HSM_2 is disposed on the second storage area SR_2 and the second spare area BR_2. Please also note that in an embodiment, the SSD 100 may further include a control circuit provided on the second side of the circuit board 101. In this case, the second heat dissipation material HSM_2 may be provided on at least one of the second storage area SR_2, the second spare area BR_2, and the control circuit. For example, the second heat dissipation material HSM_2 may be provided on the second spare area BR_2 and the control circuit, or on the second storage area SR_2 and the second spare area BR_2.

第8圖繪示了根據本創作一實施例的，具有多個SSD的SSD系統800的示意圖。如第8圖所示，SSD系統800包含一第一機殼Ca_1，一第二機殼Ca_2，一第一SSD組SG_1和一第二SSD組SG_2。第一SSD組SG_1包含多個第一SSD SS_11，SS_12…（僅標記其中的兩個），第二SSD組SG_2包含多個第二SSD SS_21，SS_22…（僅標記其中的兩個）。第一SSD SS_11，SS_12…和第二SSD SS_21，SS_22…可以包含第1圖-第5圖所示的結構。因此，使用者可以握住SSD托架103以將第一SSD SS_11，SS_12…***第一機殼Ca_1，且可以握住SSD托架103以將第二SSD SS_21，SS_22…***第二機殼Ca_2。第一SSD組SG_1和第二SSD組SG_2的控制裝置也可以設置在第一機殼Ca_1和第二機殼Ca_2中。在一實施例中，SSD系統800可以僅包含一機殼和僅一個SSD組。但是，請注意，本創作提供的SSD系統不限於第8圖所示的SSD系統800。FIG. 8 shows a schematic diagram of an SSD system 800 with multiple SSDs according to an embodiment of the present invention. As shown in FIG. 8, the SSD system 800 includes a first casing Ca_1, a second casing Ca_2, a first SSD group SG_1 and a second SSD group SG_2. The first SSD group SG_1 contains multiple first SSDs SS_11, SS_12... (only two of them are marked), and the second SSD group SG_2 contains multiple second SSDs SS_21, SS_22... (only two of them are marked). The first SSD SS_11, SS_12... and the second SSD SS_21, SS_22... may include the structures shown in Figures 1 to 5. Therefore, the user can hold the SSD bracket 103 to insert the first SSD SS_11, SS_12... into the first casing Ca_1, and can hold the SSD bracket 103 to insert the second SSD SS_21, SS_22... into the second casing Ca_2 . The control devices of the first SSD group SG_1 and the second SSD group SG_2 may also be provided in the first casing Ca_1 and the second casing Ca_2. In an embodiment, the SSD system 800 may include only one chassis and only one SSD group. However, please note that the SSD system provided by this creation is not limited to the SSD system 800 shown in Figure 8.

100:SSD 101:電路板 103:SSD托架 BR_1:第一備用區 BS_1:第一備用儲存區 BP_1:第一備用電源 BR_2:第二備用區 BS_2:第二備用儲存區 BP_2:第二備用電源 Ca_1:第一機殼 Ca_2:第二機殼 CO:控制IC CR:控制區 SR_1:第一儲存區 SR_2:第二儲存區 HSM_1:第一散熱材料 HSM_2:第二散熱材料 M_1:第一記憶體 M_2:第二記憶體 800:SSD系統 SG_1:第一SSD組 SG_2:第二SSD組 SS_11，SS_12:第一SSD SS_21，SS_22:第二SSD 100: SSD 101: circuit board 103: SSD bracket BR_1: The first spare area BS_1: The first spare storage area BP_1: The first backup power supply BR_2: The second spare area BS_2: The second spare storage area BP_2: The second backup power supply Ca_1: first chassis Ca_2: second chassis CO: Control IC CR: Control area SR_1: The first storage area SR_2: The second storage area HSM_1: The first heat dissipation material HSM_2: second heat dissipation material M_1: first memory M_2: second memory 800: SSD system SG_1: The first SSD group SG_2: The second SSD group SS_11, SS_12: the first SSD SS_21, SS_22: second SSD

第1圖繪示了根據本創作一實施例的，不具有散熱材料的SSD的示意圖。第2圖、第3圖和第4圖繪示了根據本創作不同實施例的，具有散熱材料的SSD的示意圖。第5圖繪示了根據本創作另一實施例的，不具有散熱材料的SSD的示意圖。第6圖和第7圖繪示了根據本創作不同實施例的，具有散熱材料的SSD的示意圖。第8圖繪示了根據本創作一實施例的，具有多個SSD的SSD系統的示意圖。 Fig. 1 shows a schematic diagram of an SSD without heat dissipation material according to an embodiment of the present invention. Figures 2, 3, and 4 show schematic diagrams of SSDs with heat dissipation materials according to different embodiments of the invention. Figure 5 shows a schematic diagram of an SSD without heat dissipation material according to another embodiment of the present invention. Figures 6 and 7 show schematic diagrams of SSDs with heat dissipation materials according to different embodiments of the invention. Figure 8 shows a schematic diagram of an SSD system with multiple SSDs according to an embodiment of the present invention.

100:SSD 100: SSD

101:電路板 101: circuit board

103:SSD托架 103: SSD bracket

BR_1:第一備用區 BR_1: The first spare area

BS_1:第一備用儲存區 BS_1: The first spare storage area

BP_1:第一備用電源 BP_1: The first backup power supply

SR_1:第一儲存區 SR_1: The first storage area

HSM_1:第一散熱材料 HSM_1: The first heat dissipation material

M_1:第一記憶體 M_1: first memory

Claims

一種SSD，包含：一電路板；一第一儲存區，位於該電路版的一第一側上，包含至少一第一記憶體；一控制區，位於該第一側上，包含至少一控制IC，該控制IC用以控制該第一記憶體；以及第一散熱材料，位於該第一儲存區上或該控制區上。 A type of SSD that contains: A circuit board; A first storage area located on a first side of the circuit board and including at least one first memory; A control area located on the first side, including at least one control IC for controlling the first memory; and The first heat dissipation material is located on the first storage area or on the control area.

如請求項1所述的SSD，其中該第一記憶體為NAND快閃記憶體。The SSD according to claim 1, wherein the first memory is a NAND flash memory.

如請求項1所述的SSD，其中該第一散熱材料為鋁或銅。The SSD according to claim 1, wherein the first heat dissipation material is aluminum or copper.

如請求項1所述的SSD，更包含：一第一備用電源，位於該第一側上；一第一備用儲存區，位於該第一側上，包含至少一第一備用儲存裝置；其中當該SSD無法自外部接收足夠的電能時，會使用該第一備用電源所提供的電能來將儲存在該第一備用儲存裝置中的資料備份到該第一記憶體；其中該第一散熱材料更位於該第一備用電源上或是該第一備用儲存區上。 The SSD described in claim 1, further including: A first standby power supply located on the first side; A first backup storage area located on the first side and including at least one first backup storage device; When the SSD cannot receive enough power from the outside, it will use the power provided by the first backup power source to back up the data stored in the first backup storage device to the first memory; The first heat dissipation material is further located on the first backup power source or on the first backup storage area.

如請求項4所述的SSD，其中該第一備用電源為一電容。The SSD according to claim 4, wherein the first backup power source is a capacitor.

如請求項4所述的SSD，其中該第一備用電源為一DRAM。The SSD according to claim 4, wherein the first backup power source is a DRAM.

如請求項1所述的SSD，更包含：一第二儲存區，位於該電路版的一第二側上，包含至少一第二記憶體；以及第二散熱材料，位於該第二儲存區上。 The SSD described in claim 1, further including: A second storage area located on a second side of the circuit board and including at least one second memory; and The second heat dissipation material is located on the second storage area.

如請求項7所述的SSD，其中該第二記憶體為NAND快閃記憶體。The SSD according to claim 7, wherein the second memory is a NAND flash memory.

如請求項7所述的SSD，更包含：一第二備用電源，位於該第二側上；一第二備用儲存區，位於該第二側上，包含至少一第二備用儲存裝置；其中當該SSD無法自外部接收足夠的電能時，會使用該第二備用電源所提供的電能來將儲存在該第二備用儲存裝置中的資料備份到該第二記憶體；其中該第二散熱材料更位於該第二備用電源上或是該第二備用儲存區上。 The SSD as described in claim 7, further including: A second backup power supply located on the second side; A second backup storage area located on the second side and including at least one second backup storage device; When the SSD cannot receive enough power from the outside, it will use the power provided by the second backup power source to back up the data stored in the second backup storage device to the second memory; The second heat dissipation material is further located on the second backup power source or on the second backup storage area.

如請求項9所述的SSD，其中該第二備用電源為一電容且該第二備用電源為一DRAM。The SSD according to claim 9, wherein the second backup power source is a capacitor and the second backup power source is a DRAM.

一種SSD系統，包含：一殼體；一SSD組，包含***該殼體中的至少一SSD，其中該SSD包含：一電路板；一第一儲存區，位於該電路版的一第一側上，包含至少一第一記憶體；一控制區，位於該第一側上，包含至少一控制IC，該控制IC用以控制該第一記憶體；以及第一散熱材料，位於該第一儲存區上或該控制區上；以及一控制裝置，位於該殼體中，用以控制該SSD。 An SSD system, including: A shell An SSD group includes at least one SSD inserted into the casing, wherein the SSD includes: A circuit board; A first storage area located on a first side of the circuit board and including at least one first memory; A control area located on the first side, including at least one control IC for controlling the first memory; and The first heat dissipation material is located on the first storage area or on the control area; and A control device is located in the casing for controlling the SSD.

如請求項11所述的SSD系統，其中該第一記憶體為NAND快閃記憶體。The SSD system according to claim 11, wherein the first memory is a NAND flash memory.

如請求項11所述的SSD系統，其中該第一散熱材料為鋁或銅。The SSD system according to claim 11, wherein the first heat dissipation material is aluminum or copper.

如請求項11所述的SSD系統，其中該SSD更包含：一第一備用電源，位於該第一側上；一第一備用儲存區，位於該第一側上，包含至少一第一備用儲存裝置；其中當該SSD無法自外部接收足夠的電能時，會使用該第一備用電源所提供的電能來將儲存在該第一備用儲存裝置中的資料備份到該第一記憶體；其中該第一散熱材料更位於該第一備用電源上或是該第一備用儲存區上。 The SSD system according to claim 11, wherein the SSD further includes: A first standby power supply located on the first side; A first backup storage area located on the first side and including at least one first backup storage device; When the SSD cannot receive enough power from the outside, it will use the power provided by the first backup power source to back up the data stored in the first backup storage device to the first memory; The first heat dissipation material is further located on the first backup power source or on the first backup storage area.

如請求項14所述的SSD系統，其中該第一備用電源為一電容。The SSD system according to claim 14, wherein the first backup power source is a capacitor.

如請求項14所述的SSD系統，其中該第一備用電源為一DRAM。The SSD system according to claim 14, wherein the first backup power source is a DRAM.

如請求項11所述的SSD系統，其中該SSD更包含：一第二儲存區，位於該電路版的一第二側上，包含至少一第二記憶體；以及第二散熱材料，位於該第二儲存區上。 The SSD system according to claim 11, wherein the SSD further includes: A second storage area located on a second side of the circuit board and including at least one second memory; and The second heat dissipation material is located on the second storage area.

如請求項17所述的SSD系統，其中該第二記憶體為NAND快閃記憶體。The SSD system according to claim 17, wherein the second memory is a NAND flash memory.

如請求項17所述的SSD系統，其中該SSD更包含：一第二備用電源，位於該第二側上；一第二備用儲存區，位於該第二側上，包含至少一第二備用儲存裝置；其中當該SSD無法自外部接收足夠的電能時，會使用該第二備用電源所提供的電能來將儲存在該第二備用儲存裝置中的資料備份到該第二記憶體；其中該第二散熱材料更位於該第二備用電源上或是該第二備用儲存區上。 The SSD system according to claim 17, wherein the SSD further includes: A second backup power supply located on the second side; A second backup storage area located on the second side and including at least one second backup storage device; When the SSD cannot receive enough power from the outside, it will use the power provided by the second backup power source to back up the data stored in the second backup storage device to the second memory; The second heat dissipation material is further located on the second backup power source or on the second backup storage area.

如請求項19所述的SSD系統，其中該第二備用電源為一電容且該第二備用電源為一DRAM。The SSD system according to claim 19, wherein the second backup power source is a capacitor and the second backup power source is a DRAM.