TWM611027U - Light-emitting component - Google Patents

Abstract

一種發光組件，包含一基板、多個發光件及一封裝片。這些發光件設置於基板上。封裝片具有多個開孔。封裝片貼附於基板上，且這些發光件分別位於這些開孔內。A light-emitting component includes a substrate, a plurality of light-emitting elements, and a packaging sheet. These light-emitting elements are arranged on the substrate. The packaging sheet has a plurality of openings. The packaging sheet is attached to the substrate, and the light-emitting elements are respectively located in the openings.

Description

發光組件Light-emitting components

本新型係關於一種發光組件，特別是一種發光件位於封裝片之開孔內的發光組件。The present invention relates to a light-emitting component, especially a light-emitting component in which the light-emitting element is located in the opening of the packaging sheet.

一般而言，發光裝置(如發光燈條)的基板上設有發光件。目前市面上發光裝置可透過熱壓膠膜(如乙烯-醋酸乙烯酯共聚物膜，EVA膜)於基板上，或塗佈光學膠於基板，而對於發光件進行封裝。Generally speaking, a light-emitting element is provided on the substrate of a light-emitting device (such as a light-emitting light bar). At present, the light-emitting devices on the market can encapsulate the light-emitting devices by applying a hot-pressed adhesive film (such as ethylene-vinyl acetate copolymer film, EVA film) on the substrate, or coating the substrate with optical glue.

然而，將膠膜熱壓於基板上的方式容易因發光件係凸出於基板之設置，而在熱壓的過程中會在發光件上產生應力集中的現象，而造成發光件損壞。另一方面，塗佈光學膠的方式雖可避免發光件的損壞，但由於光學膠塗佈於發光件之後，會向外流動擴散，故需要塗佈大量的光學膠於發光件上及發光件周圍，才能確保發光件受到光學膠的封裝，而造成成本相較於將膠膜熱壓於基板上的方式為高。因此，目前廠商正致力於改善封裝發光件的方式，以兼具發光件之品質及低封裝成本的需求。However, the method of hot-pressing the adhesive film on the substrate is likely to cause the light-emitting element to protrude from the substrate, and during the hot-pressing process, stress concentration occurs on the light-emitting element, which may cause damage to the light-emitting element. On the other hand, although the method of coating optical glue can avoid the damage of the light-emitting element, since the optical glue will flow and spread out after being coated on the light-emitting element, it is necessary to coat a large amount of optical glue on the light-emitting element and the light-emitting element. The surrounding area can ensure that the light emitting element is encapsulated by the optical glue, and the cost is higher than that of hot pressing the glue film on the substrate. Therefore, manufacturers are currently committed to improving the way of packaging light-emitting devices to meet the needs of both the quality of light-emitting devices and low packaging costs.

本新型在於提供一種發光組件，藉以解決先前技術所述之目前封裝發光件的方式難以兼具發光件之品質及低封裝成本的需求。The present invention is to provide a light-emitting component, so as to solve the requirement of the current method of packaging the light-emitting element as described in the prior art that it is difficult to have both the quality of the light-emitting element and the low packaging cost.

本新型之一實施例所揭露之一種發光組件，包含一基板、多個發光件及一封裝片。這些發光件設置於基板上。封裝片具有多個開孔。封裝片貼附於基板上，且這些發光件分別位於這些開孔內。A light-emitting component disclosed in an embodiment of the present invention includes a substrate, a plurality of light-emitting elements, and a packaging sheet. These light-emitting elements are arranged on the substrate. The packaging sheet has a plurality of openings. The packaging sheet is attached to the substrate, and the light-emitting elements are respectively located in the openings.

根據上述實施例所揭露的發光組件，藉由將封裝片貼附於基板上，使得這些發光件分別係位於封裝片的這些開孔內，故在後續將光學膠封裝發光件時，僅需要以少量的光學膠填充於封裝片的這些開孔及覆蓋發光件，即可確保發光件受到光學膠的封裝。因此，不僅可降低光學膠的使用量以節省封裝成本，亦能透過光學膠確保發光件的品質。According to the light-emitting assembly disclosed in the above embodiment, by attaching the packaging sheet to the substrate, the light-emitting elements are respectively located in the openings of the packaging sheet. Therefore, when the light-emitting element is subsequently packaged with optical glue, it is only necessary to use A small amount of optical glue is filled in the openings of the packaging sheet and covers the light-emitting element to ensure that the light-emitting element is encapsulated by the optical glue. Therefore, not only the amount of optical glue used can be reduced to save packaging costs, but the quality of the light-emitting parts can also be ensured through the optical glue.

另一方面，當封裝片貼附於基板上使這些發光件分別係位於封裝片的這些開孔之後，接著係設置密封層封裝發光件時，設置密封層的過程中所產生的應力可避免集中在發光件上，故在以設置密封層之低封裝成本的方式封裝發光件的情況下，仍可維持發光件的品質。On the other hand, when the encapsulation sheet is attached to the substrate so that the light-emitting elements are located behind the openings of the encapsulation sheet, and then a sealing layer is used to encapsulate the light-emitting element, the stress generated in the process of setting the sealing layer can be avoided to concentrate On the light-emitting element, the quality of the light-emitting element can still be maintained when the light-emitting element is packaged in a low packaging cost manner with a sealing layer.

以上關於本新型內容的說明及以下實施方式的說明係用以示範與解釋本新型的原理，並且提供本新型的專利申請範圍更進一步的解釋。The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention, and to provide a further explanation of the scope of the patent application of the present invention.

請參閱圖1至圖2。圖1為根據本新型之第一實施例所揭露之發光組件的側視示意圖。圖2為圖1的封裝片的俯視示意圖。Please refer to Figure 1 to Figure 2. FIG. 1 is a schematic side view of the light-emitting element disclosed according to the first embodiment of the present invention. FIG. 2 is a schematic top view of the packaging sheet of FIG. 1.

在本實施例中，發光組件1例如為發光燈條。發光組件1包含一基板10、多個發光件20及一封裝片30。此外，在本實施例或其他實施例中，發光組件1還可包含一光學膠40。In this embodiment, the light-emitting component 1 is, for example, a light-emitting light bar. The light-emitting component 1 includes a substrate 10, a plurality of light-emitting elements 20 and a packaging sheet 30. In addition, in this embodiment or other embodiments, the light-emitting component 1 may further include an optical glue 40.

這些發光件20例如為發光二極體。這些發光件20設置於基板10的同一表面上，且這些發光件20例如彼此分離。These light-emitting elements 20 are, for example, light-emitting diodes. The light emitting elements 20 are arranged on the same surface of the substrate 10, and the light emitting elements 20 are separated from each other, for example.

封裝片30具有相分離的多個開孔31。如圖2所示，這些開孔31例如但不限為正方形。封裝片30貼附於基板10上，這些發光件20分別位於封裝片30的這些開孔31內，且這些開孔31的內壁面311分別環繞這些發光件20。光學膠40填充於封裝片30的這些開孔31內，並覆蓋於這些發光件20，而將這些發光件20封裝。The packaging sheet 30 has a plurality of openings 31 separated from each other. As shown in FIG. 2, these openings 31 are, for example, but not limited to squares. The packaging sheet 30 is attached to the substrate 10, the light emitting elements 20 are respectively located in the openings 31 of the packaging sheet 30, and the inner wall surfaces 311 of the openings 31 surround the light emitting elements 20 respectively. The optical glue 40 is filled in the openings 31 of the packaging sheet 30 and covers the light-emitting elements 20 to encapsulate the light-emitting elements 20.

接著，以下將說明發光組件1的製造過程。請參閱圖3至圖5，圖3至5為圖1之發光組件的製造過程的側視示意圖。Next, the manufacturing process of the light-emitting assembly 1 will be described below. Please refer to FIGS. 3 to 5. FIGS. 3 to 5 are schematic side views of the manufacturing process of the light-emitting component of FIG. 1.

如圖3所示，首先提供基板10，然後設置這些發光件20於基板10上。接著，如圖4所示，貼附具有這些開孔31的封裝片30於基板10上，而令這些發光件20分別位於封裝片30的這些開孔31內。然後，如圖5所示，填充光學膠40於封裝片30的這些開孔31並覆蓋發光件20，即完成發光件20的封裝。As shown in FIG. 3, the substrate 10 is provided first, and then the light-emitting elements 20 are arranged on the substrate 10. Next, as shown in FIG. 4, the packaging sheet 30 with these openings 31 is attached to the substrate 10, so that the light-emitting elements 20 are respectively located in the openings 31 of the packaging sheet 30. Then, as shown in FIG. 5, the openings 31 of the packaging sheet 30 are filled with optical glue 40 and cover the light-emitting element 20, that is, the packaging of the light-emitting element 20 is completed.

在本實施例中，藉由將封裝片30貼附於基板10上，使得這些發光件20分別係位於封裝片30的這些開孔31內，故在後續係以光學膠40封裝發光件20時，僅需要以少量的光學膠40填充於封裝片30的這些開孔31及覆蓋發光件20，即可確保發光件20受到光學膠40的封裝。因此，不僅可降低光學膠40的使用量以節省封裝成本，亦能透過光學膠40確保發光件20的品質。In this embodiment, by attaching the packaging sheet 30 to the substrate 10, the light-emitting elements 20 are respectively located in the openings 31 of the packaging sheet 30. Therefore, when the light-emitting element 20 is packaged with the optical glue 40 later, It is only necessary to fill the openings 31 of the packaging sheet 30 and cover the light emitting element 20 with a small amount of optical glue 40 to ensure that the light emitting element 20 is encapsulated by the optical glue 40. Therefore, not only can the use amount of the optical glue 40 be reduced to save packaging costs, but also the quality of the light emitting element 20 can be ensured through the optical glue 40.

在本實施例中，封裝片30例如為透光或不透光材質、導電或電絕緣材質及導熱或熱絕緣材質。舉例來說，封裝片30可為透明、電絕緣及熱絕緣的塑膠膜片，或透明、電絕緣及導熱的塑膠膜片。或是，封裝片30為不透明、導電及導熱的金屬片。In this embodiment, the packaging sheet 30 is, for example, a light-transmitting or opaque material, a conductive or electrically insulating material, and a thermally conductive or thermally insulating material. For example, the packaging sheet 30 may be a transparent, electrically insulating and thermally insulating plastic film, or a transparent, electrically insulating and thermally conductive plastic film. Or, the packaging sheet 30 is an opaque, electrically and thermally conductive metal sheet.

在本實施例中，當封裝片30為非透明材質時，可限制發光件20的光僅經由其上的光學膠40散發於外，而使每個發光件20所發出的光可集中向外射出。另一方面。當封裝片30為透明材質時，發光件20所發出的光不僅可以經由其上的光學膠40散發於外，還可經由封裝片30散發於外，而使得發光組件1有較大的發光範圍。In this embodiment, when the encapsulation sheet 30 is made of a non-transparent material, the light of the light-emitting elements 20 can be restricted from being emitted only through the optical glue 40 thereon, so that the light emitted by each light-emitting element 20 can be concentrated outward Projected. on the other hand. When the encapsulation sheet 30 is made of a transparent material, the light emitted by the light-emitting element 20 can be emitted not only through the optical glue 40 thereon, but also through the encapsulation sheet 30, so that the light-emitting assembly 1 has a larger light-emitting range .

此外，當封裝片30為電絕緣材質時，可避免施加於發光件20的電流傳導至封裝片30，以防止人員接觸封裝片30時觸電的情形發生。另一方面，當封裝片30為導電材質時，可用作電路的其中一部份，而提供電路設計的不同選擇。In addition, when the packaging sheet 30 is made of an electrically insulating material, the current applied to the light-emitting element 20 can be prevented from being conducted to the packaging sheet 30, so as to prevent electric shock when a person touches the packaging sheet 30. On the other hand, when the packaging sheet 30 is made of conductive material, it can be used as a part of the circuit, providing different options for circuit design.

再者，當封裝片30為熱絕緣材質時，可避免發光件20的熱傳導至封裝片30，而避免人員接觸封裝片30時產生不適感。另一方面，當封裝片30為導熱材質時，發光件20的熱可傳導至封裝片30，而透過封裝片30排除。Furthermore, when the packaging sheet 30 is made of a thermally insulating material, the heat of the light-emitting element 20 can be prevented from being conducted to the packaging sheet 30, and the uncomfortable feeling when a person touches the packaging sheet 30 can be avoided. On the other hand, when the encapsulation sheet 30 is made of a thermally conductive material, the heat of the light-emitting element 20 can be conducted to the encapsulation sheet 30 and be removed through the encapsulation sheet 30.

接著，請參閱圖6，圖6為根據本新型之第二實施例所揭露之發光組件的側視示意圖。Next, please refer to FIG. 6. FIG. 6 is a schematic side view of the light-emitting element disclosed according to the second embodiment of the present invention.

在本實施例中，發光組件1a例如為發光燈條。發光組件1a包含一基板10a、多個發光件20a及一封裝片30a。此外，在本實施例或其他實施例中，發光組件1a還可包含一密封層40a。In this embodiment, the light-emitting component 1a is, for example, a light-emitting light bar. The light-emitting element 1a includes a substrate 10a, a plurality of light-emitting elements 20a, and a packaging sheet 30a. In addition, in this embodiment or other embodiments, the light-emitting element 1a may further include a sealing layer 40a.

這些發光件20a例如為發光二極體。這些發光件20a設置於基板10a的同一表面上，且這些發光件20a例如彼此分離。These light-emitting elements 20a are, for example, light-emitting diodes. The light-emitting elements 20a are arranged on the same surface of the substrate 10a, and the light-emitting elements 20a are separated from each other, for example.

封裝片30a具有相分離的多個開孔31a，這些開孔31a例如但不限為正方形(如圖2所示)。封裝片30a貼附於基板10a上，這些發光件20a分別位於封裝片30a的這些開孔31a內，且這些開孔31a的內壁面311a分別環繞這些發光件20a。密封層40a例如為乙烯-醋酸乙烯酯共聚物膜(EVA膜)，且密封層40a例如為透明材質。密封層40a例如透過熱壓或貼合的方式設置於封裝片30a遠離基板10a之一側而密封封裝片30a的這些開孔31a。The packaging sheet 30a has a plurality of openings 31a separated from each other, and the openings 31a are, for example, but not limited to, a square shape (as shown in FIG. 2). The packaging sheet 30a is attached to the substrate 10a, the light-emitting elements 20a are respectively located in the openings 31a of the packaging sheet 30a, and the inner walls 311a of the openings 31a surround the light-emitting elements 20a, respectively. The sealing layer 40a is, for example, an ethylene-vinyl acetate copolymer film (EVA film), and the sealing layer 40a is, for example, a transparent material. The sealing layer 40a is provided on the side of the packaging sheet 30a away from the substrate 10a by hot pressing or bonding, for example, to seal the openings 31a of the packaging sheet 30a.

接著，以下將說明發光組件1a的製造過程。首先，提供基板10a，然後設置這些發光件20a於基板10a上(如圖3所示)。接著，貼附具有這些開孔31a的封裝片30a於基板10a上，而令這些發光件20a分別位於封裝片30a的這些開孔31a內(如圖4所示)。然後，設置密封層40a於封裝片30a遠離基板10a之一側而密封封裝片30a的這些開孔31a，即完成發光件20a的封裝(如圖6所示)。此密封層40a，可以具有圖案化。Next, the manufacturing process of the light-emitting assembly 1a will be described below. First, the substrate 10a is provided, and then the light-emitting elements 20a are arranged on the substrate 10a (as shown in FIG. 3). Then, the packaging sheet 30a with the openings 31a is attached to the substrate 10a, so that the light-emitting elements 20a are respectively located in the openings 31a of the packaging sheet 30a (as shown in FIG. 4). Then, a sealing layer 40a is provided on the side of the packaging sheet 30a away from the substrate 10a to seal the openings 31a of the packaging sheet 30a, which completes the packaging of the light emitting element 20a (as shown in FIG. 6). The sealing layer 40a may be patterned.

在本實施例中，藉由將封裝片30a貼附於基板10a上，使得這些發光件20a分別係位於封裝片30a的這些開孔31a內，故在後續設置密封層40a封裝發光件20a時，設置密封層40a的過程中所產生的應力可避免集中在發光件20a上。因此，在以設置密封層40a之低封裝成本的方式封裝發光件20a的情況下，仍可維持發光件20a的品質。In this embodiment, by attaching the packaging sheet 30a to the substrate 10a, the light-emitting elements 20a are respectively located in the openings 31a of the packaging sheet 30a. Therefore, when the sealing layer 40a is subsequently provided to encapsulate the light-emitting element 20a, The stress generated in the process of setting the sealing layer 40a can be prevented from being concentrated on the light emitting element 20a. Therefore, when the light emitting element 20a is packaged in a low packaging cost manner with the sealing layer 40a, the quality of the light emitting element 20a can still be maintained.

在本實施例中，封裝片30a例如為透光或不透光材質、導電或電絕緣材質及導熱或熱絕緣材質。舉例來說，封裝片30a為透明、電絕緣及熱絕緣的塑膠膜片，或透明、電絕緣及導熱的塑膠膜片。或是，封裝片30a為不透明、導電及導熱的金屬片。In this embodiment, the packaging sheet 30a is, for example, a light-transmitting or opaque material, a conductive or electrically insulating material, and a thermally conductive or thermally insulating material. For example, the packaging sheet 30a is a transparent, electrically insulating and thermally insulating plastic film, or a transparent, electrically insulating and thermally conductive plastic film. Or, the packaging sheet 30a is an opaque, electrically and thermally conductive metal sheet.

在本實施例中，當封裝片30a為非透明材質時，可限制發光件20a的光僅經由密封層40a對應於發光件20a之區域散發於外，而使每個發光件20a所發出的光可集中向外射出。另一方面。當封裝片30a為透明材質時，發光件20a所發出的光不僅可以經由密封層40a對應於發光件20a之區域散發於外，還可經由封裝片30a及密封層40a之其他區域散發於外，而使得發光組件1有較大的發光範圍。In this embodiment, when the packaging sheet 30a is made of a non-transparent material, the light of the light-emitting element 20a can be restricted from being emitted only through the area of the sealing layer 40a corresponding to the light-emitting element 20a, so that the light emitted by each light-emitting element 20a Can be focused outwards. on the other hand. When the encapsulation sheet 30a is made of a transparent material, the light emitted by the light-emitting element 20a can be emitted not only through the area of the sealing layer 40a corresponding to the light-emitting element 20a, but also through the encapsulation sheet 30a and other areas of the sealing layer 40a. Therefore, the light-emitting component 1 has a larger light-emitting range.

此外，當封裝片30a為電絕緣材質時，可避免施加於發光件20a的電流傳導至封裝片30a，以防止人員接觸封裝片30a時觸電的情形發生。另一方面，當封裝片30a為導電材質時，可用作電路的其中一部份，而提供電路設計的不同選擇。In addition, when the packaging sheet 30a is made of an electrically insulating material, the current applied to the light-emitting element 20a can be prevented from being conducted to the packaging sheet 30a, so as to prevent electric shock when a person touches the packaging sheet 30a. On the other hand, when the packaging sheet 30a is made of conductive material, it can be used as a part of the circuit, providing different options for circuit design.

再者，當封裝片30a為熱絕緣材質時，可避免發光件20a的熱傳導至封裝片30a，而避免人員接觸封裝片30a時產生不適感。另一方面，當封裝片30a為導熱材質時，發光件20a的熱可傳導至封裝片30a，而透過封裝片30a排除。Furthermore, when the packaging sheet 30a is made of a thermally insulating material, the heat of the light emitting element 20a can be prevented from being conducted to the packaging sheet 30a, and the discomfort caused by personnel touching the packaging sheet 30a can be avoided. On the other hand, when the encapsulation sheet 30a is made of a thermally conductive material, the heat of the light-emitting element 20a can be conducted to the encapsulation sheet 30a, but is eliminated through the encapsulation sheet 30a.

在上述實施例中，封裝片的開孔為正方形，但並不以此為限。在其他實施例中，封裝片的開孔可以為其他形狀。舉例來說，請參閱圖7至圖9，圖7至9為根據本新型之第三至第五實施例所揭露之封裝片的俯視示意圖。如圖7所示，封裝片30b之開孔31b的形狀為圓形。如圖8所示，封裝片30d之開孔31d的形狀為五角形。如圖9所示，封裝片30e之開孔31e的形狀為心形。In the above embodiment, the opening of the packaging sheet is square, but it is not limited to this. In other embodiments, the openings of the packaging sheet may have other shapes. For example, please refer to FIGS. 7-9. FIGS. 7-9 are schematic top views of the package sheets disclosed according to the third to fifth embodiments of the present invention. As shown in FIG. 7, the shape of the opening 31b of the packaging sheet 30b is circular. As shown in FIG. 8, the shape of the opening 31d of the packaging sheet 30d is a pentagonal shape. As shown in FIG. 9, the shape of the opening 31e of the packaging sheet 30e is a heart shape.

在上述實施例中，藉由封裝片之開孔形狀的設計(如正方形、圓形、三角形、五角形或心形等)，可增添發光組件的美觀性。In the above-mentioned embodiment, the design of the opening shape of the package sheet (such as square, circle, triangle, pentagon or heart shape, etc.) can increase the aesthetics of the light-emitting device.

在上述的實施例中，封裝片的開孔的排列為一維陣列的形式，以與一維陣列形式排列的發光件相搭配，但並不以此為限。舉例來說，請參閱圖10，圖10為根據本新型之第六實施例所揭露之封裝片及發光件的俯視示意圖。In the above-mentioned embodiment, the arrangement of the openings of the packaging sheet is in the form of a one-dimensional array to match the light-emitting elements arranged in the form of a one-dimensional array, but it is not limited to this. For example, please refer to FIG. 10. FIG. 10 is a schematic top view of the packaging sheet and the light-emitting element disclosed according to the sixth embodiment of the present invention.

在本實施例中，封裝片30f的這些開孔31f的排列為二維陣列的形式，例如圖10所示之3x3陣列的形式。這樣的封裝片30f與以3x3陣列形式排列的發光件20f相搭配。然而，開孔及發光件並不限排列為3x3的陣列形式。在其他實施例中，可依據實際需求將開孔及發光件排列為NxM的形式，其中N及M皆為大於等於1的正整數。In this embodiment, the openings 31f of the packaging sheet 30f are arranged in the form of a two-dimensional array, such as the form of a 3×3 array shown in FIG. 10. Such a packaging sheet 30f is matched with the light emitting elements 20f arranged in a 3×3 array. However, the openings and light-emitting elements are not limited to be arranged in a 3x3 array. In other embodiments, the openings and the light-emitting elements can be arranged in the form of N×M according to actual requirements, where N and M are both positive integers greater than or equal to 1.

根據上述實施例所揭露的發光組件，藉由將封裝片貼附於基板上，使得這些發光件分別係位於封裝片的這些開孔內，故在後續將光學膠封裝發光件時，僅需要以少量的光學膠填充於封裝片的這些開孔及覆蓋發光件，即可確保發光件受到光學膠的封裝。因此，不僅可降低光學膠的使用量以節省封裝成本，亦能透過光學膠確保發光件的品質。According to the light-emitting assembly disclosed in the above embodiment, by attaching the packaging sheet to the substrate, the light-emitting elements are respectively located in the openings of the packaging sheet. Therefore, when the light-emitting element is subsequently packaged with optical glue, it is only necessary to use A small amount of optical glue is filled in the openings of the packaging sheet and covers the light-emitting element to ensure that the light-emitting element is encapsulated by the optical glue. Therefore, not only the amount of optical glue used can be reduced to save packaging costs, but the quality of the light-emitting parts can also be ensured through the optical glue.

另一方面，當在封裝片貼附於基板上使這些發光件分別係位於封裝片的這些開孔之後，接著係設置密封層封裝發光件時，設置密封層的過程中所產生的應力可避免集中在發光件上，故在以設置密封層之低封裝成本的方式封裝發光件的情況下，仍可維持發光件的品質。On the other hand, when the encapsulation sheet is attached to the substrate so that the light-emitting elements are respectively located in the openings of the encapsulation sheet, and then a sealing layer is used to encapsulate the light-emitting element, the stress generated in the process of setting the sealing layer can be avoided Concentrated on the light-emitting element, so the quality of the light-emitting element can still be maintained when the light-emitting element is packaged in a low packaging cost manner with a sealing layer.

雖然本新型以前述之較佳實施例揭露如上，然其並非用以限定本新型，任何熟習相像技藝者，在不脫離本新型之精神和範圍內，當可作些許之更動與潤飾，因此本新型之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed in the foregoing preferred embodiments as above, it is not intended to limit the present invention. Anyone familiar with similar art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of patent protection for new models shall be determined by the scope of patent applications attached to this specification.

1、1a:發光組件 10、10a:基板 20、20a、20f:發光件 30、30a、30b、30d、30e、30f:封裝片 31、31a、31b、31d、31e、31f:開孔 311、311a:內壁面 40:光學膠 40a:密封層 1.1a: Light-emitting components 10, 10a: substrate 20, 20a, 20f: luminous parts 30, 30a, 30b, 30d, 30e, 30f: package sheet 31, 31a, 31b, 31d, 31e, 31f: opening 311, 311a: inner wall surface 40: Optical glue 40a: Sealing layer

圖1為根據本新型之第一實施例所揭露之發光組件的側視示意圖。 圖2為圖1的封裝片的俯視示意圖。 圖3至5為圖1之發光組件的製造過程的側視示意圖。 圖6為根據本新型之第二實施例所揭露之發光組件的側視示意圖。 圖7至9為根據本新型之第三至第五實施例所揭露之封裝片的俯視示意圖。 圖10為根據本新型之第六實施例所揭露之封裝片及發光件的俯視示意圖。 FIG. 1 is a schematic side view of the light-emitting element disclosed according to the first embodiment of the present invention. FIG. 2 is a schematic top view of the packaging sheet of FIG. 1. 3 to 5 are schematic side views of the manufacturing process of the light-emitting component of FIG. 1. FIG. 6 is a schematic side view of the light-emitting element disclosed according to the second embodiment of the present invention. 7 to 9 are schematic top views of the package sheets disclosed according to the third to fifth embodiments of the present invention. 10 is a schematic top view of the packaging sheet and the light-emitting element disclosed according to the sixth embodiment of the present invention.

1:發光組件 1: Light-emitting components

10:基板 10: substrate

20:發光件 20: luminous parts

30:封裝片 30: Encapsulation sheet

31:開孔 31: Hole

311:內壁面 311: Inner Wall

40:光學膠 40: Optical glue

Claims (7)

一種發光組件，包含：一基板；多個發光件，設置於該基板上；以及一封裝片，具有多個開孔，該封裝片貼附於該基板上，且該些發光件分別位於該些開孔內。A light-emitting component includes: a substrate; a plurality of light-emitting elements arranged on the substrate; and a packaging sheet having a plurality of openings, the packaging sheet is attached to the substrate, and the light-emitting elements are respectively located on the substrate Inside the opening. 如請求項1所述之發光組件，更包含一光學膠，該光學膠填充於該些開孔內。The light-emitting component according to claim 1, further comprising an optical glue, and the optical glue is filled in the openings. 如請求項1所述之發光組件，更包含一密封層，該密封層設置於該封裝片遠離該基板之一側而密封該些開孔。The light-emitting device according to claim 1, further comprising a sealing layer disposed on a side of the packaging sheet away from the substrate to seal the openings. 如請求項1所述之發光組件，其中該些開孔的內壁面分別環繞該些發光件。The light-emitting assembly according to claim 1, wherein the inner wall surfaces of the openings respectively surround the light-emitting elements. 如請求項1所述之發光組件，其中該封裝片為透光材質或不透光材質。The light-emitting component according to claim 1, wherein the packaging sheet is made of light-transmitting material or non-light-transmitting material. 如請求項1所述之發光組件，其中該封裝片為導電材質或電絕緣材質。The light-emitting component according to claim 1, wherein the packaging sheet is made of conductive material or electrically insulating material. 如請求項1所述之發光組件，其中該封裝片為導熱材質或熱絕緣材質。The light-emitting component according to claim 1, wherein the packaging sheet is made of a thermally conductive material or a thermally insulating material.

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