TWM610512U

TWM610512U - Large area electroplating apparatus having grid-side-jet type programmably movable anode

Info

Publication number: TWM610512U
Application number: TW109216946U
Authority: TW
Inventors: 翁義兆
Original assignee: 嵩展科技股份有限公司
Priority date: 2020-12-22
Filing date: 2020-12-22
Publication date: 2021-04-11

Abstract

An electroplating apparatus includes an outer tank, and inner tank, at least one jet device, a programmably movable anode structure and a current control unit. The outer tank is adapted to contain an electroplating liquid. The inner tank is disposed in the outer tank and adapted to contain the electroplating liquid and a cathode. The jet device is disposed in the inner tank, and the jet device is connected to the outer tank and adapted to jet the electroplating liquid in the outer tank into the inner tank. The programmably movable anode structure is disposed in the inner tank and includes a plurality of anode regions, the anode regions are electrically independent to each other, and the anode structure is capable of being controlled by a program to move along a direction parallel to the cathode back and forth. The current control unit is coupled to the anode structure and adapted to control a current of each of the anode regions independently.

Description

具有板柵側噴式可程式移動陽極的大面積電鍍設備Large area electroplating equipment with grid side spray type programmable movable anode

本新型創作是有關於一種電鍍設備，且特別是有關於一種包含噴流裝置及可程式控制移動式陽極的電鍍設備。The present invention relates to a kind of electroplating equipment, and in particular to a kind of electroplating equipment including a jet device and a programmable movable anode.

在大面積的電鍍製程中，可藉由高流速的電鍍液循環來提升電鍍的均勻性。一般來說，電鍍液從外槽透過內槽的底部往上進入內槽以進行循環。在此種循環方式下，電鍍液會先大量地與內槽中之陽極結構的下半部進行反應，導致陽極結構的上半部無法充分地與電鍍液進行反應，從而降低了電鍍效率。此外，在電鍍的過程中，可能因電場不均而使得不同區域的電鍍效率不同，導致電鍍厚度不均。In a large-area electroplating process, the uniformity of electroplating can be improved by circulating the electroplating solution at a high flow rate. Generally speaking, the electroplating solution is circulated from the outer tank through the bottom of the inner tank upwards into the inner tank. In this circulation mode, the electroplating solution will first react in a large amount with the lower half of the anode structure in the inner tank, resulting in the upper half of the anode structure being unable to fully react with the electroplating solution, thereby reducing the plating efficiency. In addition, during the electroplating process, the electroplating efficiency of different areas may be different due to uneven electric field, resulting in uneven electroplating thickness.

本新型創作提供一種電鍍設備，可提升電鍍效率且可提升電鍍的均勻性。The new creation provides an electroplating equipment, which can improve the efficiency of electroplating and the uniformity of electroplating.

本新型創作的電鍍設備包括一外槽、一內槽、至少一噴流裝置、一可程式控制移動式陽極結構及一電流控制單元。外槽適於容納一電鍍液。內槽配置於外槽中且適於容納電鍍液及一陰極材。噴流裝置配置於內槽中，噴流裝置連通於外槽而適於將外槽中的電鍍液往內槽中噴流。陽極結構配置於內槽中且包括多個陽極區塊，這些陽極區塊彼此電性獨立，且陽極結構可藉由程式控制沿平行於陰極材之方向往復移動。電流控制單元耦接於陽極結構且適於獨立地控制各陽極區塊的電流。The electroplating equipment of the present invention includes an outer tank, an inner tank, at least one spray device, a programmable control movable anode structure and a current control unit. The outer tank is suitable for holding an electroplating solution. The inner tank is arranged in the outer tank and is suitable for containing electroplating solution and a cathode material. The spray device is arranged in the inner tank, and the spray device is connected to the outer tank and is suitable for spraying the electroplating solution in the outer tank into the inner tank. The anode structure is arranged in the inner tank and includes a plurality of anode blocks. These anode blocks are electrically independent of each other, and the anode structure can be reciprocated in a direction parallel to the cathode material by program control. The current control unit is coupled to the anode structure and is adapted to independently control the current of each anode block.

在本新型創作的一實施例中，上述的陽極結構具有相對的一第一表面及一第二表面，第一表面朝向陰極材，至少一噴流裝置朝向陽極結構的第二表面而適於將外槽中的電鍍液往第二表面噴流。In an embodiment of the present invention, the above-mentioned anode structure has a first surface and a second surface opposite to each other. The first surface faces the cathode material, and at least one spray device faces the second surface of the anode structure so as to be suitable for external The electroplating solution in the tank is sprayed to the second surface.

在本新型創作的一實施例中，上述的至少一噴流裝置的數量為多個，這些噴流裝置分別對應於不同的這些陽極區塊。In an embodiment of the present invention, the number of the above-mentioned at least one jet flow device is multiple, and the jet flow devices respectively correspond to the different anode blocks.

在本新型創作的一實施例中，上述的各噴流裝置的噴流強度適於獨立地被控制。In an embodiment of the present invention, the jet intensity of each jet device described above is adapted to be independently controlled.

在本新型創作的一實施例中，上述的電鍍設備包括一泵及一管路，其中管路連接於至少一噴流裝置且延伸至外槽中，泵連接於管路且適於驅動外槽中的電鍍液沿著管路往至少一噴流裝置流動。In an embodiment of the present invention, the electroplating equipment described above includes a pump and a pipeline, wherein the pipeline is connected to at least one jet device and extends into the outer tank, and the pump is connected to the pipeline and is suitable for driving the outer tank The electroplating solution flows along the pipeline to at least one spray device.

在本新型創作的一實施例中，上述的陽極結構為不溶性陽極。In an embodiment of the present invention, the above-mentioned anode structure is an insoluble anode.

基於上述，在本新型創作的電鍍設備中，利用噴流裝置將外槽中的電鍍液往內槽中噴流，而可使電鍍液盡可能地與陽極結構的整體均勻地反應，據以提升電鍍的效率。此外，陽極結構劃分為多個陽極區塊且各陽極區塊的電流可獨立地被控制。據此，可藉由控制各陽極區塊的電流大小來彌補因電場不均導致的電鍍厚度不均的現象。Based on the foregoing, in the electroplating equipment created by the present invention, the spray device is used to spray the electroplating solution in the outer tank into the inner tank, so that the electroplating solution can react as uniformly as possible with the entire anode structure, thereby improving the electroplating performance. effectiveness. In addition, the anode structure is divided into a plurality of anode blocks and the current of each anode block can be independently controlled. Accordingly, it is possible to compensate for uneven electroplating thickness caused by uneven electric field by controlling the current of each anode block.

圖1是本新型創作一實施例的電鍍設備的示意圖。請參考圖1，本實施例的電鍍設備100包括一外槽110、一內槽120、多個噴流裝置130及一可程式控制移動式陽極結構140。外槽110適於容納一電鍍液(電鍍藥水)50。內槽120配置於外槽110中且適於容納電鍍液50及一陰極材60。陽極結構140例如為板柵式的不溶性陽極且配置於內槽120中。噴流裝置130配置於內槽120中且連通於外槽110。Figure 1 is a schematic diagram of an electroplating device according to an embodiment of the invention. Please refer to FIG. 1, the electroplating equipment 100 of this embodiment includes an outer tank 110, an inner tank 120, a plurality of jet devices 130 and a programmable movable anode structure 140. The outer tank 110 is suitable for holding an electroplating solution (electroplating solution) 50. The inner tank 120 is disposed in the outer tank 110 and is suitable for containing the electroplating solution 50 and a cathode material 60. The anode structure 140 is, for example, a grid-type insoluble anode and is disposed in the inner tank 120. The spray device 130 is disposed in the inner tank 120 and communicates with the outer tank 110.

噴流裝置130適於將外槽110中的電鍍液50往內槽120中噴流，使電鍍液50不斷地循環至內槽120。電鍍液50在內槽120中與陽極結構140反應以對陰極材60進行電鍍。與陽極結構140反應後的電鍍液50隨著內槽120中之電鍍液50的滿溢而從內槽120的頂端回流至外槽110中。可透過適當方式提供新的電鍍液50至外槽110中，使電鍍可順利進行。The spray device 130 is adapted to spray the electroplating solution 50 in the outer tank 110 into the inner tank 120 so that the electroplating solution 50 is continuously circulated to the inner tank 120. The electroplating solution 50 reacts with the anode structure 140 in the inner tank 120 to electroplate the cathode material 60. The electroplating solution 50 after reacting with the anode structure 140 flows back into the outer tank 110 from the top of the inner tank 120 as the electroplating solution 50 in the inner tank 120 overflows. A new electroplating solution 50 can be provided to the outer tank 110 through an appropriate method, so that the electroplating can proceed smoothly.

如上述般利用噴流裝置130將外槽110中的電鍍液50往內槽140中噴流，可使電鍍液50盡可能地與陽極結構140的整體均勻地反應，據以提升電鍍的效率。具體而言，本實施例的陽極結構140具有相對的一第一表面140a及一第二表面140b，第一表面140a朝向陰極材60，第二表面140b背向陰極材60。各噴流裝置130朝向陽極結構140的第二表面140b而適於將外槽110中的電鍍液50往第二表面140b噴流。陽極結構140可藉由程式控制沿平行於陰極材60之方向(圖1所示的X方向)往復移動。藉由此種側式的噴流方式再加上如印表機般的往復式移動，電鍍液50非為從內槽120的底部往上進入內槽120，如此可避免電鍍液50因先大量地與陽極結構140的下半部進行反應而導致陽極結構140的上半部無法充分地與電鍍液50進行反應。從而，可確保電鍍設備100有良好的電鍍效率。進一步而言，本實施例的噴流裝置130例如是水刀式的噴流裝置，可滿足各種電鍍需求，如重佈線路層結構之電鍍或銅導柱之電鍍等。As described above, the spray device 130 is used to spray the electroplating solution 50 in the outer tank 110 into the inner tank 140, so that the electroplating solution 50 can react uniformly with the entire anode structure 140 as much as possible, thereby improving the efficiency of electroplating. Specifically, the anode structure 140 of this embodiment has a first surface 140 a and a second surface 140 b opposite to each other. The first surface 140 a faces the cathode material 60, and the second surface 140 b faces away from the cathode material 60. Each spray device 130 faces the second surface 140b of the anode structure 140 and is adapted to spray the electroplating solution 50 in the outer tank 110 to the second surface 140b. The anode structure 140 can be reciprocated in a direction parallel to the cathode material 60 (the X direction shown in FIG. 1) by program control. With this side jet method and the reciprocating movement like a printer, the electroplating solution 50 does not enter the inner tank 120 from the bottom of the inner tank 120 upwards, so that the electroplating solution 50 can be avoided due to the large amount of electroplating solution 50. The reaction with the lower half of the anode structure 140 results in the upper half of the anode structure 140 being unable to fully react with the electroplating solution 50. Thus, it can ensure that the electroplating apparatus 100 has a good electroplating efficiency. Furthermore, the spray device 130 of this embodiment is, for example, a water jet spray device, which can meet various electroplating requirements, such as the electroplating of a redistributed circuit layer structure or the electroplating of copper guide posts.

圖2是圖1的電鍍設備沿另一視角的部分構件示意圖。圖3是圖1的電鍍設備的部分構件方塊圖。請參考圖2及圖3，本實施例的電鍍設備100更包括一電流控制單元150。陽極結構140包括多個陽極區塊1401，這些陽極區塊1401彼此電性獨立。電流控制單元150耦接於陽極結構140且適於獨立地控制各陽極區塊1401的電流。據此，可藉由控制各陽極區塊1401的電流大小來彌補因電場不均導致的電鍍厚度不均的現象。Fig. 2 is a schematic diagram of some components of the electroplating apparatus of Fig. 1 from another perspective. Fig. 3 is a block diagram of part of the components of the electroplating apparatus of Fig. 1. Please refer to FIG. 2 and FIG. 3, the electroplating apparatus 100 of this embodiment further includes a current control unit 150. The anode structure 140 includes a plurality of anode blocks 1401, and the anode blocks 1401 are electrically independent of each other. The current control unit 150 is coupled to the anode structure 140 and is adapted to independently control the current of each anode block 1401. Accordingly, by controlling the magnitude of the current of each anode block 1401, the phenomenon of uneven plating thickness caused by uneven electric field can be compensated.

在圖1中，例示性地繪示出兩個噴流裝置130，然其僅為示意，噴流裝置130的數量實際上可為更多且其分別對應於不同的陽極區塊1401。各噴流裝置1401的噴流強度可對應各陽極區塊1401的電流大小而獨立地被控制，以更有效率地進行電鍍。舉例來說，陽極區塊1401的電流越大，則將對應的噴流裝置1401的噴流強度調整為越大。In FIG. 1, two jetting devices 130 are exemplarily shown, but this is only for illustration. The number of jetting devices 130 may actually be more and they correspond to different anode blocks 1401 respectively. The spray intensity of each spray device 1401 can be independently controlled corresponding to the current of each anode block 1401, so as to perform electroplating more efficiently. For example, the larger the current of the anode block 1401 is, the larger the spray intensity of the corresponding spray device 1401 is adjusted.

以下舉例說明本實施例將外槽110中的電鍍液50輸送至內槽120的具體方式。請參考圖1，在本實施例中，電鍍設備100包括一泵160及一管路170。管路170連接於噴流裝置130且延伸至外槽110中，泵160連接於管路170且適於驅動外槽110中的電鍍液50沿著管路170往噴流裝置130流動。從而，噴流裝置130可將電鍍液50往內槽120中噴流。在其他實施例中，可藉由其他適當方式將外槽110中的電鍍液50輸送至內槽120中的噴流裝置130，本新型創作不對此加以限制。The following is an example to illustrate the specific manner of conveying the electroplating solution 50 in the outer tank 110 to the inner tank 120 in this embodiment. Please refer to FIG. 1, in this embodiment, the electroplating equipment 100 includes a pump 160 and a pipeline 170. The pipeline 170 is connected to the spray device 130 and extends into the outer tank 110. The pump 160 is connected to the pipeline 170 and is adapted to drive the electroplating solution 50 in the outer tank 110 to flow to the spray device 130 along the pipeline 170. Therefore, the spray device 130 can spray the electroplating solution 50 into the inner tank 120. In other embodiments, the electroplating solution 50 in the outer tank 110 can be transported to the spray device 130 in the inner tank 120 by other suitable methods, and the invention is not limited to this.

綜上所述，在本新型創作的電鍍設備中，利用噴流裝置將外槽中的電鍍液以側式的噴流方式往內槽中噴流，而可使電鍍液盡可能地與陽極結構的整體均勻地反應，據以提升電鍍的效率。此外，陽極結構劃分為多個陽極區塊且各陽極區塊的電流可獨立地被控制。據此，可藉由控制各陽極區塊的電流大小來彌補因電場不均導致的電鍍厚度不均的現象。In summary, in the electroplating equipment created by the present invention, the spray device is used to spray the electroplating solution in the outer tank into the inner tank in a side spray mode, so that the electroplating solution can be as uniform as possible with the anode structure as a whole Ground response to improve the efficiency of electroplating. In addition, the anode structure is divided into a plurality of anode blocks and the current of each anode block can be independently controlled. Accordingly, it is possible to compensate for the uneven plating thickness caused by uneven electric field by controlling the current of each anode block.

50:電鍍液 60:陰極材 100:電鍍設備 110:外槽 120:內槽 130:噴流裝置 140:陽極結構 140a:第一表面 140b:第二表面 1401:陽極區塊 150:電流控制單元 160:泵 170:管路 50: electroplating solution 60: Cathode material 100: electroplating equipment 110: Outer tank 120: inner slot 130: Jet device 140: anode structure 140a: first surface 140b: second surface 1401: anode block 150: Current control unit 160: pump 170: Pipeline

圖1是本新型創作一實施例的電鍍設備的示意圖。圖2是圖1的電鍍設備沿另一視角的部分構件示意圖。圖3是圖1的電鍍設備的部分構件方塊圖。 Figure 1 is a schematic diagram of an electroplating device according to an embodiment of the invention. Fig. 2 is a schematic diagram of some components of the electroplating apparatus of Fig. 1 from another perspective. Fig. 3 is a block diagram of part of the components of the electroplating apparatus of Fig. 1.

50:電鍍液 50: electroplating solution

60:陰極材 60: Cathode material

100:電鍍設備 100: electroplating equipment

110:外槽 110: Outer tank

120:內槽 120: inner slot

130:噴流裝置 130: Jet device

140:陽極結構 140: anode structure

140a:第一表面 140a: first surface

140b:第二表面 140b: second surface

1401:陽極區塊 1401: anode block

160:泵 160: pump

170:管路 170: Pipeline

Claims

一種電鍍設備，包括：一外槽，適於容納一電鍍液；一內槽，配置於該外槽中，且適於容納該電鍍液及一陰極材；至少一噴流裝置，配置於該內槽中，其中該至少一噴流裝置連通於該外槽而適於將該外槽中的該電鍍液往該內槽中噴流；以及一可程式控制移動式陽極結構，配置於該內槽中且包括多個陽極區塊，其中該些陽極區塊彼此電性獨立，且該陽極結構可藉由程式控制沿平行於該陰極材之方向往復移動；以及一電流控制單元，耦接於該陽極結構且適於獨立地控制各該陽極區塊的電流。 An electroplating equipment, including: An outer tank suitable for holding an electroplating solution; An inner tank arranged in the outer tank and suitable for containing the electroplating solution and a cathode material; At least one spray device is disposed in the inner tank, wherein the at least one spray device is connected to the outer tank and is adapted to spray the electroplating solution in the outer tank into the inner tank; and A programmable movable anode structure is arranged in the inner tank and includes a plurality of anode blocks, wherein the anode blocks are electrically independent of each other, and the anode structure can be programmed to be parallel to the cathode material Reciprocating direction; and A current control unit is coupled to the anode structure and is adapted to independently control the current of each anode block.

如請求項1所述的電鍍設備，其中該陽極結構具有相對的一第一表面及一第二表面，該第一表面朝向該陰極材，該至少一噴流裝置朝向該陽極結構的該第二表面而適於將該外槽中的該電鍍液往該第二表面噴流。The electroplating apparatus according to claim 1, wherein the anode structure has a first surface and a second surface opposed to each other, the first surface faces the cathode material, and the at least one spray device faces the second surface of the anode structure It is suitable for spraying the electroplating solution in the outer tank to the second surface.

如請求項1所述的電鍍設備，其中該至少一噴流裝置的數量為多個，該些噴流裝置分別對應於不同的該些陽極區塊。The electroplating equipment according to claim 1, wherein the number of the at least one jet flow device is multiple, and the jet flow devices respectively correspond to the different anode blocks.

如請求項3所述的電鍍設備，其中各該噴流裝置的噴流強度適於獨立地被控制。The electroplating apparatus according to claim 3, wherein the jet stream intensity of each jet stream device is adapted to be independently controlled.

如請求項1所述的電鍍設備，包括一泵及一管路，其中該管路連接於該至少一噴流裝置且延伸至該外槽中，該泵連接於該管路且適於驅動該外槽中的該電鍍液沿著該管路往該至少一噴流裝置流動。The electroplating equipment according to claim 1, comprising a pump and a pipeline, wherein the pipeline is connected to the at least one jet device and extends into the outer tank, and the pump is connected to the pipeline and is suitable for driving the outer tank The electroplating solution in the tank flows to the at least one spray device along the pipeline.

如請求項1所述的電鍍設備，其中該陽極結構為不溶性陽極。The electroplating equipment according to claim 1, wherein the anode structure is an insoluble anode.