TWM607729U - Bonding pad structure for electronic device - Google Patents
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本案涉及一種電子裝置。詳細而言，本案涉及一種用於電子裝置的接合墊結構。This case involves an electronic device. In detail, this case relates to a bonding pad structure for electronic devices.
現有顯示面板朝超薄可撓性基板技術發展，並為提高面板的屏占比而不斷壓縮面板週遭的接合區域。Existing display panels are developing towards ultra-thin flexible substrate technology, and in order to increase the screen-to-body ratio of the panel, the bonding area around the panel is constantly compressed.
此外，於製程過程中，接腳材料因熱脹縮導致接合時產生偏移的問題。根據先前技術CN201571253U可知，傳統兩相互疊合的線路基板於疊合對位時需面對所得公差增加問題，往往透過硬板材料本身的抗漲縮來降低壓合異位；然而，在面對下一世代超薄可撓性基板技術發展，壓合薄膜基板本身壓合熱漲縮問題將更嚴重，傳統疊合手法已無法有效抑制壓合異位；因此，有待本領域從業人員研發出其餘適合能對抗壓合異位的設計方式。In addition, during the manufacturing process, the pin material expands and shrinks due to heat, which causes the problem of offset during bonding. According to the prior art CN201571253U, it is known that the traditional two mutually superimposed circuit substrates have to face the problem of increased tolerances when they are superimposed and aligned, and the resistance to expansion and contraction of the rigid board material itself is often used to reduce the misalignment; however, in the face With the development of the next generation of ultra-thin flexible substrate technology, the problem of thermal expansion and contraction of the laminated film substrate itself will be more serious. The traditional laminating method can no longer effectively suppress the ectopic laminating; therefore, it is necessary for practitioners in the field to develop the rest It is suitable for the design method that can resist the out-of-position pressing.
本案的一面向涉及一種用於電子裝置的接合墊結構。用於電子裝置的接合墊結構包含基板及軟性電路板。基板包含複數個第一接腳。複數個第一接腳設置於基板上。軟性電路板包含複數個第二接腳。複數個第二接腳設置於軟性電路板上。複數個第一接腳與複數個第二接腳互相接合以形成複數個接合接腳。複數個接合接腳包含至少一中央接合接腳及至少二第一接合接腳。至少一中央接合接腳位於複數個接合接腳之中心位置。至少二第一接合接腳最遠離至少一中央接合接腳以至少一中央接合接腳鏡像對稱。至少一中央接合接腳包含第一端及第二端。第一端之第一寬度設為a。第二端之第二寬度設為b。a及b滿足關係式0＜a/b≦1。至少二第一接合接腳其中一者與基板的一側包含傾斜角。傾斜角設為θ。θ滿足關係式0＜θ≦90。One aspect of this case relates to a bonding pad structure for electronic devices. The bonding pad structure for electronic devices includes a substrate and a flexible circuit board. The substrate includes a plurality of first pins. The plurality of first pins are arranged on the substrate. The flexible circuit board contains a plurality of second pins. The plurality of second pins are arranged on the flexible circuit board. The plurality of first pins and the plurality of second pins are connected to each other to form a plurality of bonding pins. The plurality of bonding pins includes at least one central bonding pin and at least two first bonding pins. At least one central bonding pin is located at the center of the plurality of bonding pins. The at least two first bonding pins are farthest away from the at least one central bonding pin, and the at least one central bonding pin is mirror-symmetrical. The at least one central bonding pin includes a first end and a second end. The first width of the first end is set to a. The second width of the second end is set to b. a and b satisfy the relationship 0<a/b≦1. One of the at least two first bonding pins has an inclination angle with one side of the substrate. The tilt angle is set to θ. θ satisfies the relational expression 0<θ≦90.
在一些實施例中，複數個接合接腳更包含至少二第二接合接腳。至少二第二接合接腳位於至少一中央接合接腳及至少二第一接合接腳之間並以至少一中央接合接腳鏡像對稱。至少二第二接合接腳其中一者包含第三端及第四端。第三端之第三寬度設為c，第四端之第四寬度設為d，c及d滿足關係式0＜c/d≦1。In some embodiments, the plurality of bonding pins further includes at least two second bonding pins. The at least two second bonding pins are located between the at least one central bonding pin and the at least two first bonding pins and are mirror-symmetrical with the at least one central bonding pin. One of the at least two second bonding pins includes a third end and a fourth end. The third width at the third end is set to c, and the fourth width at the fourth end is set to d, and c and d satisfy the relationship 0<c/d≦1.
在一些實施例中，至少一中央接合接腳之第一端之第一寬度與至少二第二接合接腳其中一者之第三端之第三寬度相同。In some embodiments, the first width of the first end of the at least one central bonding pin is the same as the third width of the third end of one of the at least two second bonding pins.
在一些實施例中，至少一中央接合接腳之第二端之第二寬度與至少二第二接合接腳其中一者之第四端之第四寬度相同。In some embodiments, the second width of the second end of the at least one central bonding pin is the same as the fourth width of the fourth end of one of the at least two second bonding pins.
在一些實施例中，至少一中央接合接腳之第一端與至少二第二接合接腳其中一者之第三端之間包含第一間距。第一間距、第一端之第一寬度與第三端之第三寬度均相同。In some embodiments, a first distance is included between the first end of the at least one central bonding pin and the third end of one of the at least two second bonding pins. The first pitch, the first width of the first end, and the third width of the third end are all the same.
在一些實施例中，至少一中央接合接腳之第二端與至少二第二接合接腳其中一者之第四端之間包含第二間距。第二間距、第二端之第二寬度與第四端之第四寬度均相同。第一間距小於第二間距。In some embodiments, a second distance is included between the second end of the at least one central bonding pin and the fourth end of one of the at least two second bonding pins. The second pitch, the second width of the second end, and the fourth width of the fourth end are all the same. The first distance is smaller than the second distance.
在一些實施例中，複數個接合接腳位於電子裝置之接合區域。第二間距、第二端之第二寬度及第四端之第四寬度與接合區域之長度關係式如下： b=d=f=L/(x+y) 其中b為第二端之第二寬度，d為第四端之第四寬度，f為第二間距，L為接合區域之長度，x為複數個接合接腳之數量，y為複數個接合接腳之間的間隔數量。 In some embodiments, the plurality of bonding pins are located in the bonding area of the electronic device. The relationship between the second pitch, the second width at the second end, and the fourth width at the fourth end, and the length of the joining area are as follows: b=d=f=L/(x+y) Where b is the second width of the second end, d is the fourth width of the fourth end, f is the second pitch, L is the length of the bonding area, x is the number of bonding pins, and y is the bonding connection The number of spaces between the feet.
在一些實施例中，至少一中央接合接腳包含梯形，至少二第一接合接腳包含梯形，至少二第二接合接腳包含梯形。In some embodiments, at least one central bonding pin includes a trapezoid shape, at least two first bonding pins include a trapezoid shape, and at least two second bonding pins include a trapezoid shape.
在一些實施例中，至少一中央接合接腳、至少二第一接合接腳與至少二第二接合接腳排列於同一直線上。In some embodiments, at least one central joint pin, at least two first joint pins and at least two second joint pins are arranged on the same straight line.
在一些實施例中，複數個接合接腳更包含至少二第三接合接腳。至少二第三接合接腳位於至少二第一接合接腳及該至少二第二接合接腳之間並以至少一中央接合接腳鏡像對稱。至少二第三接合接腳其中一者包含第五端及第六端。第五端之第五寬度小於設為g，第六端之第六寬度設為h，g及h滿足關係式0＜g/h≦1。In some embodiments, the plurality of bonding pins further includes at least two third bonding pins. The at least two third bonding pins are located between the at least two first bonding pins and the at least two second bonding pins and are mirror-symmetrical with the at least one central bonding pin. One of the at least two third bonding pins includes a fifth end and a sixth end. The fifth width of the fifth end is less than g, and the sixth width of the sixth end is h, and g and h satisfy the relationship 0<g/h≦1.
在一些實施例中，至少二第二接合接腳其中一者之第三端與至少二第三接合接腳其中一者之第五端包含一三間距。至少二第二接合接腳其中一者之第四端與至少二第三接合接腳其中一者之第六端包含第四間距。第三間距小於第四間距。In some embodiments, the third end of one of the at least two second bonding pins and the fifth end of one of the at least two third bonding pins comprise a three pitch. The fourth end of one of the at least two second bonding pins and the sixth end of one of the at least two third bonding pins include a fourth pitch. The third distance is smaller than the fourth distance.
在一些實施例中，第一間距、第三間距、第一寬度、第三寬度與第五寬度相等，第二間距、第四間距、第二寬度、第四寬度與第六寬度相等。In some embodiments, the first pitch, the third pitch, the first width, the third width, and the fifth width are equal, and the second pitch, the fourth pitch, the second width, the fourth width, and the sixth width are equal.
在一些實施例中，至少一中央接合接腳、至少二第一接合接腳、至少二第二接合接腳與該至少二第三接合接腳排列於同一直線上。In some embodiments, at least one central joint pin, at least two first joint pins, at least two second joint pins, and at least two third joint pins are arranged on the same straight line.
在一些實施例中，複數個接合接腳於預先接合接合過程中，複數個第一接腳及複數個第二接腳其中一者具有脹縮量。In some embodiments, during the pre-bonding process of the plurality of bonding pins, one of the plurality of first pins and the plurality of second pins has an amount of expansion and contraction.
本案的另一面向涉及用於電子裝置的接合墊結構。用於電子裝置的接合墊結構包含用於電子裝置的接合墊結構包含基板及軟性電路板。基板包含複數個第一接腳。複數個第一接腳設置於基板上。軟性電路板包含複數個第二接腳。複數個第二接腳設置於軟性電路板上。複數個第一接腳與複數個第二接腳互相接合以形成複數個接合接腳。複數個接合接腳包含至少一中央接合接腳及至少二第一接合接腳。至少一中央接合接腳位於複數個接合接腳之中心位置。至少二第一接合接腳最遠離至少一中央接合接腳以至少一中央接合接腳鏡像對稱。至少一中央接合接腳包含第一端及第二端。第一端之第一寬度設為a’。第二端之第二寬度設為b’。a’及b’滿足關係式a’/b’≧1。至少二第一接合接腳其中一者與基板的一側包含傾斜角。傾斜角設為φ。φ滿足關係式0＜φ≦90。Another aspect of this case relates to the bonding pad structure for electronic devices. The bonding pad structure for electronic devices includes a bonding pad structure for electronic devices including a substrate and a flexible circuit board. The substrate includes a plurality of first pins. The plurality of first pins are arranged on the substrate. The flexible circuit board contains a plurality of second pins. The plurality of second pins are arranged on the flexible circuit board. The plurality of first pins and the plurality of second pins are connected to each other to form a plurality of bonding pins. The plurality of bonding pins includes at least one central bonding pin and at least two first bonding pins. At least one central bonding pin is located at the center of the plurality of bonding pins. The at least two first bonding pins are farthest away from the at least one central bonding pin, and the at least one central bonding pin is mirror-symmetrical. The at least one central bonding pin includes a first end and a second end. The first width of the first end is set to a'. The second width of the second end is set to b'. a'and b'satisfy the relationship a'/b'≧1. One of the at least two first bonding pins has an inclination angle with one side of the substrate. The tilt angle is set to φ. φ satisfies the relationship 0<φ≦90.
在一些實施例中，至少二第二接合接腳位於至少一中央接合接腳及至少二第一接合接腳之間並以至少一中央接合接腳鏡像對稱。至少二第二接合接腳包含第三端及第四端。第三端之第三寬度設為c’。第四端之第四寬度設為d’。c’及d’滿足關係式c’/d’≧1。In some embodiments, the at least two second bonding pins are located between the at least one central bonding pin and the at least two first bonding pins and are mirror-symmetrical with the at least one central bonding pin. The at least two second bonding pins include a third end and a fourth end. The third width at the third end is set to c'. The fourth width of the fourth end is set as d'. c'and d'satisfy the relation c'/d'≧1.
在一些實施例中，至少一中央接合接腳之第一端之第一寬度與至少二第二接合接腳其中一者之第三端之第三寬度相同。In some embodiments, the first width of the first end of the at least one central bonding pin is the same as the third width of the third end of one of the at least two second bonding pins.
在一些實施例中，至少一中央接合接腳之第二端之第二寬度與至少二第二接合接腳其中一者之第四端之第四寬度相同。In some embodiments, the second width of the second end of the at least one central bonding pin is the same as the fourth width of the fourth end of one of the at least two second bonding pins.
在一些實施例中，至少一中央接合接腳之第一端與至少二第二接合接腳其中一者之第三端之間包含第一間距。第一間距、第一端之第一寬度與第三端之第三寬度均相同。In some embodiments, a first distance is included between the first end of the at least one central bonding pin and the third end of one of the at least two second bonding pins. The first pitch, the first width of the first end, and the third width of the third end are all the same.
綜上所述，本案提供一種用於電子裝置的接合墊結構，藉以改善接腳材料因熱脹縮導致接合時產生偏移的問題。In summary, the present application provides a bonding pad structure for an electronic device, so as to improve the problem of the offset of the pin material due to thermal expansion and contraction during bonding.
以上所述僅係用以闡述本案所欲解決的問題、解決問題的技術手段、及其產生的功效等等，本案之具體細節將在下文的實施方式及相關圖式中詳細介紹。The above description is only used to explain the problem to be solved in this case, the technical means to solve the problem, and the effects produced by it, etc. The specific details of this case will be described in detail in the following embodiments and related drawings.
以下將以圖式及詳細敘述清楚說明本案之精神，任何所屬技術領域中具有通常知識者在瞭解本案之實施例後，當可由本案所教示之技術，加以改變及修飾，其並不脫離本案之精神與範圍。The following will clearly illustrate the spirit of this case with diagrams and detailed descriptions. Anyone with ordinary knowledge in the technical field who understands the embodiments of this case can change and modify the technology taught in this case without departing from the scope of this case. Spirit and scope.
本文之用語只為描述特定實施例，而無意為本案之限制。單數形式如“一”、“這”、“此”、“本”以及“該”，如本文所用，同樣也包含複數形式。The terms used herein are only to describe specific embodiments, and are not intended to limit the present application. Singular forms such as "a", "this", "this", "本" and "this", as used herein, also include plural forms.
關於本文中所使用之『包含』、『包括』、『具有』、『含有』等等，均為開放性的用語，即意指包含但不限於。Regarding the "include", "include", "have", "contain", etc. used in this article, they are all open terms, which means including but not limited to.
關於本文中所使用之用詞(terms)，除有特別註明外，通常具有每個用詞使用在此領域中、在本案之內容中與特殊內容中的平常意義。某些用以描述本案之用詞將於下或在此說明書的別處討論，以提供本領域技術人員在有關本案之描述上額外的引導。Regarding the terms used in this article, unless otherwise specified, each term usually has the usual meaning when used in this field, in the content of this case, and in the special content. Some terms used to describe the case will be discussed below or elsewhere in this specification to provide those skilled in the art with additional guidance on the description of the case.
在一些實施例中，為使本案之電子裝置100的結構易於理解，請一併參閱第1A圖至第1B圖，第1A圖為根據本案一些實施例繪示的預計接腳示意圖。第1B圖為根據本案一些實施例繪示的實際接腳示意圖。請參閱第1A圖至第1B圖，電子裝置100包含基板120及軟性電路板220。在一些實施例中，電子裝置100可為面板及顯示裝置。In some embodiments, in order to make the structure of the
在一些實施例中，請參閱第1A及第1B圖，基板120包含接腳10。軟性電路板220包含接腳20。於模擬上，期許接腳10及接腳20完整重疊如第1A圖。但於實作上，接腳10及接腳20會因接腳本身材料產生脹縮而形成如第1B圖之錯位。In some embodiments, referring to FIGS. 1A and 1B, the
在一些實施例中，為使本案之電子裝置100的結合墊結構易於理解，請一併參閱第2圖至第4圖，第2圖為根據本案一些實施例繪示的基板之接腳示意圖。第3圖為根據本案一些實施例繪示的軟性電路板之接腳示意圖。第4圖為根據本案一些實施例繪示的接合接腳之示意圖。In some embodiments, in order to make the bonding pad structure of the
在一些實施例中，請參閱第2圖，第2圖為電子裝置100中基板接腳的示意圖。基板120包含複數個第一接腳110。第一接腳110之圖示上端之寬度a1之自身誤差介於±50μm。第一接腳110之圖示下端之寬度b1之自身誤差介於±50μm。In some embodiments, please refer to FIG. 2, which is a schematic diagram of the substrate pins in the
在一些實施例中，請參閱第3圖，第3圖為電子裝置100中軟性電路板接腳的示意圖。軟性電路板220包含複數個第二接腳210。第二接腳210之圖示上端之寬度a2之自身誤差介於±50μm。第二接腳210之圖示下端之寬度b2之自身誤差介於±50μm。In some embodiments, please refer to FIG. 3, which is a schematic diagram of the pins of the flexible circuit board in the
在一些實施例中，請參閱第2圖至第4圖，複數個第一接腳110與複數個第二接腳210互相接合以形成複數個接合接腳310。在一些實施例中，Z為複數個第一接腳110與複數個第二接腳210實際接合的接合區域寬度。In some embodiments, referring to FIGS. 2 to 4, the plurality of
第5圖為根據本案一些實施例繪示的接合接腳之示意圖。在一些實施例中，第4圖之複數個接合接腳310實際接合形成如第5圖所示之接合接腳410、420及430。電子裝置100包含第一側M1及第二側M2，須說明的是，於第5圖中，雖然第一側M1及第二側M2於圖中繪示為左側及右側，但於實作上，第一側M1及第二側M2不以左側及右側為限。FIG. 5 is a schematic diagram of bonding pins according to some embodiments of the present application. In some embodiments, the plurality of bonding pins 310 in FIG. 4 are actually bonded to form bonding pins 410, 420, and 430 as shown in FIG. 5. The
此外，複數個接合接腳包含至少一中央接合接腳410及至少二第一接合接腳450。至少一中央接合接腳410位於複數個接合接腳之中心位置。至少二第一接合接腳450最遠離至少一中央接合接腳410並以至少一中央接合410接腳為準呈現鏡像對稱。第一接合接腳450最靠近第一側M1及第二側M2，且第一接合接腳450與基板120之一側(如圖式下側)間的夾角為傾斜角θ。當接合接腳越靠近中心位置，傾斜角θ越接近90˚。In addition, the plurality of bonding pins includes at least one
此外，第一端之第一寬度設為a。第二端之第二寬度設為b。a及b滿足關係式0＜a/b≦1。至少二第一接合接腳450其中一者與基板120的一側(如圖式下側)包含傾斜角θ。θ滿足關係式0＜θ≦90。In addition, the first width of the first end is set to a. The second width of the second end is set to b. a and b satisfy the relationship 0<a/b≦1. One of the at least two first bonding pins 450 and one side of the substrate 120 (the lower side as shown in the figure) includes an inclination angle θ. θ satisfies the relational expression 0<θ≦90.
在一些實施例中，複數個接合接腳更包含至少二第二接合接腳420，位於至少一中央接合接腳410及至少二第一接合接腳450之間並以至少一中央接合接腳410鏡像對稱。至少二第二接合接腳420包含第三端及第四端。第三端之第三寬度設為c。第四端之第四寬度設為d。c及d滿足關係式0＜c/d≦1。In some embodiments, the plurality of bonding pins further includes at least two second bonding pins 420 located between at least one
此外，至少一中央接合接腳410包含第一端(如圖中上端)及第二端(如圖中下端)。在一些實施例中，至少一中央接合接腳410可為梯形。In addition, at least one
此外，至少二第二接合接腳420其中一者(如圖中靠右側之第二接合接腳420)包含第三端(如圖中上端)及第四端(如圖中下端)。在一些實施例中，圖中的每一個第二接合接腳420皆可為梯形。In addition, one of the at least two second bonding pins 420 (the
再者，最靠近第一側M1及第二側M2兩側的至少二第一接合接腳450皆可為梯形。Furthermore, the at least two first bonding pins 450 closest to the two sides of the first side M1 and the second side M2 can all be trapezoidal.
在一些實施例中，請參閱第5圖，至少一中央接合接腳410之第一端之第一寬度a與至少二第二接合接腳420其中一者之第三端之第三寬度c相同。In some embodiments, please refer to FIG. 5, the first width a of the first end of the at least one
在一些實施例中，至少一中央接合接腳410之第二端之第二寬度b與至少二第二接合接腳420其中一者之第四端之第四寬度d相同。In some embodiments, the second width b of the second end of the at least one
在一些實施例中，至少一中央接合接腳410之第一端與至少二第二接合接腳420其中一者(如圖中靠右側之第二接合接腳420)之第三端之間包含第一間距e。第一間距e、第一端之第一寬度a與第三端之第三寬度c均相同。In some embodiments, the first end of the at least one central
在一些實施例中，至少一中央接合接腳410之第二端與至少二第二接合接腳420其中一者(如圖中靠右側之第二接合接腳420)之第四端之間包含第二間距f。第二間距f、第二端之第二寬度b與第四端之第四寬度d均相同。第一間距e小於第二間距f。須說明的是，由於至少一中央接合接腳410的邊界線P1與至少二第二接合接腳420其中一者(如圖中靠右側之第二接合接腳420)的邊界線P2不平行，間隔自第二間距f沿著邊界線P1及邊界線P2逐漸向第一間距e緊縮。In some embodiments, the second end of the at least one central
在一些實施例中，複數個接合接腳位於電子裝置100之接合區域。第二間距f、第二端之第二寬度b及第四端之第四寬度d與接合區域之長度L關係式如下：
b=d=f=L/(x+y)…式1
In some embodiments, a plurality of bonding pins are located in the bonding area of the
在式1中，x為複數個接合接腳之數量，y為複數個接合接腳之間的間隔數量，舉例而言，間隔可為第4圖之接合接腳410及接合2接腳420之間的間距f。In Equation 1, x is the number of bonding pins, and y is the number of intervals between the bonding pins. For example, the interval can be the number of bonding pins 410 and
接著，第一間距e、第一端之第一寬度a及第三端之第三寬度c與接合區域之設計長度L1關係式如下：
a=c=e=L1/(x+y)…式2
Then, the relationship between the first distance e, the first width a at the first end, and the third width c at the third end, and the design length L1 of the joining area are as follows:
a=c=e=L1/(x+y)…
在式2中，L1為使接合接腳呈現「八」字形的接合區域之設計長度，上述L及L1之關係式滿足0＜L1/L≦1。In
在一些實施例中，請參閱第4圖，至少一中央接合接腳410為等腰梯形，須說明的是，當至少一中央接腳410兩側之接合接腳數量越多時，兩側之接合接腳的圖形趨近於平行四邊形。In some embodiments, referring to FIG. 4, at least one central
在一些實施例中，至少一中央接合接腳410、至少二第二接合接腳420及至少二第一接合接腳450排列於同一直線上。In some embodiments, at least one
在一些實施例中，複數個接合接腳更包含至少二第三接合接腳430。至少二第三接合接腳430位於至少二第二接合接腳420及至少二第一接合接腳450之間並以至少一中央接合接腳410為準呈現鏡像對稱。至少二第三接合接腳430其中一者(如圖中靠右側之第三接合接腳430)包含第五端(如圖中上端)及第六端(如圖中下端)。第五端之第五寬度設為g。第六端之一第六寬度設為h。g及h滿足關係式0＜g/h≦1。In some embodiments, the plurality of bonding pins further includes at least two third bonding pins 430. The at least two third bonding pins 430 are located between the at least two second bonding pins 420 and the at least two first bonding pins 450 and exhibit mirror symmetry based on the at least one
在一些實施例中，請參閱第4圖，至少二第二接合接腳420其中一者(如圖中靠右側之第二接合接腳420)之第一端與至少二第三接合接腳430其中一者(如圖中靠右側之第三接合接腳430)之第三端包含第三間距i。In some embodiments, please refer to FIG. 4, the first end of one of the at least two second bonding pins 420 (the
此外，至少二第二接合接腳420其中一者之第二端與至少二第三接合接腳430其中一者之第四端包含第四間距j。第三間距i小於第四間距j。須說明的是，至少二第二接合接腳420可為梯形，至少二第三接合接腳430可為梯形。In addition, the second end of one of the at least two second bonding pins 420 and the fourth end of one of the at least two third bonding pins 430 include a fourth pitch j. The third distance i is smaller than the fourth distance j. It should be noted that at least two second bonding pins 420 may be trapezoidal, and at least two third bonding pins 430 may be trapezoidal.
在一些實施例中，第一間距e、第三間距i、第一端之第一寬度a、第三端之第三寬度c與第五端之第五寬度g相等。第二間距f、第四間距j、第二端之第二寬度b、第四端之第四寬度d與第六端之第六寬度h相等。In some embodiments, the first distance e, the third distance i, the first width a at the first end, the third width c at the third end, and the fifth width g at the fifth end are equal. The second pitch f, the fourth pitch j, the second width b at the second end, the fourth width d at the fourth end, and the sixth width h at the sixth end are equal.
在一些實施例中，至少一中央接合接腳410、至少二第二接合接腳420、至少二第三接合接腳430及至少二第一接合接腳450排列於同一直線上。In some embodiments, at least one
在一些實施例中，請參閱第5圖，依據前述實施例可知，第四接合接腳440與第三接合接腳430及第一接合接腳450分別包含上間距o及上間距t。第四接合接腳440包含上端寬度r及下端寬度s。In some embodiments, referring to FIG. 5, it can be seen from the foregoing embodiments that the
在一些實施例中，第四接合接腳440與第三接合接腳430及第一接合接腳450分別包含下間距q及下間距u。第一接合接腳450包含上端寬度v及下端寬度w。In some embodiments, the
在一些實施例中，第一間距e、第三間距i、第一端之第一寬度a、第三端之第三寬度c、第五端之第五寬度g、上端寬度r、上端寬度v、上間距o及上間距t相等。In some embodiments, the first distance e, the third distance i, the first width a at the first end, the third width c at the third end, the fifth width g at the fifth end, the upper end width r, the upper end width v , The upper spacing o and the upper spacing t are equal.
此外，第二間距f、第四間距j、第二端之第二寬度b、第四端之第四寬度d與第六端之第六寬度h、下端寬度s、下端寬度w、下間距q及下間距u相等。In addition, the second pitch f, the fourth pitch j, the second width b at the second end, the fourth width d at the fourth end, and the sixth width h at the sixth end, the lower end width s, the lower end width w, and the lower pitch q And the lower distance u is equal.
在一些實施例中，為使本案之接合接腳因材料脹縮量並調整接合之差異易於理解，請一併參閱第6A至6F圖及第7圖。第6A至6F圖為根據本案一些實施例繪示的接合接腳預壓脹縮及調整接合之示意圖。第7圖為根據本案一些實施例繪示的用於電子裝置的接合墊結構製造方法之步驟流程圖。在一些實施例中，此用於電子裝置的接合墊結構製造方法700用以將第2圖之基板120及第3圖之軟性電路板220互相接合以形成如第4圖所示之複數個接合接腳310。In some embodiments, in order to make it easy to understand the difference of the bonding pins due to material expansion and contraction and adjusting the bonding difference, please refer to FIGS. 6A to 6F and FIG. 7 together. FIGS. 6A to 6F are schematic diagrams illustrating the pre-compression, expansion and contraction of the bonding pins and the adjustment of bonding according to some embodiments of the present application. FIG. 7 is a flowchart of steps of a method of manufacturing a bonding pad structure for an electronic device according to some embodiments of the present application. In some embodiments, the
於步驟710中，設置複數個第一接腳於基板上。In
舉例而言，請參閱第2圖，設置複數個第一接腳110於基板120上。For example, referring to FIG. 2, a plurality of
於步驟720中，設置複數個第二接腳於軟性電路板上。In
舉例而言，請參閱第3圖，設置複數個第二接腳210於軟性電路板220上。For example, referring to FIG. 3, a plurality of
於步驟730中，接合複數個第一接腳及複數個第二接腳以於電子裝置中之接合區域之中心位置形成至少一中央接合接腳，並於最遠離至少一中央接合接腳處形成以至少一中央接合接腳鏡像對稱的至少二第一接合接腳。至少一中央接合接腳包含第一端及第二端。第一端之第一寬度設為a。第二端之第二寬度設為b。a及b滿足關係式0＜a/b≦1。至少二第一接合接腳其中一者與基板的一側包含傾斜角。傾斜角設為θ。θ滿足關係式0＜θ≦90。In
舉例而言，請參閱第2圖至第7圖，接合複數個第一接腳110及複數個第二接腳220以於電子裝置100中之接合區域之中心位置形成至少一中央接合接腳410，並於最遠離至少一中央接合接腳410處形成以至少一中央接合接腳410鏡像對稱的至少二第一接合接腳450。至少一中央接合接腳410包含第一端(如圖中上端)及第二端(如圖中下端)。第一端之第一寬度設為a。第二端之第二寬度設為b。a及b滿足關係式0＜a/b≦1。至少二第一接合接腳450其中一者與基板120的一側(如圖式下側)包含傾斜角θ。θ滿足關係式0＜θ≦90。For example, referring to FIGS. 2-7, the plurality of
在一些實施例中，上述步驟730包含以下操作：預先接合複數個第一接腳及複數個第二接腳。複數個第二接腳於預先接合過程中產生脹縮量。In some embodiments, the
舉例而言，請參閱第6A圖、第6C及第6E圖，複數個第一接腳及複數個第二接腳分別於預先接合過程中產生如6A圖中脹縮量α1或如6C圖中脹縮量α2或如6E圖中脹縮量α3。For example, please refer to Fig. 6A, Fig. 6C and Fig. 6E. A plurality of first pins and a plurality of second pins respectively produce expansion and contraction amount α1 as shown in Fig. 6A or as shown in Fig. 6C during the pre-bonding process. The amount of expansion and contraction α2 or the amount of expansion and contraction α3 as shown in Figure 6E.
在一些實施例中，上述步驟730更包含以下操作：根據脹縮量調整複數個第一接腳及複數個第二接腳以形成至少一中央接合接腳及至少二第一接合接腳。In some embodiments, the
舉例而言，請參閱第6A至6F圖，使用Y方向調整平移技巧，根據如6A圖中脹縮量α1通過Y方向調整調整如6B圖中之位移β1。根據如6C圖中脹縮量α2通過Y方向調整調整如6D圖中之位移β2。根據如6E圖中脹縮量α3通過Y方向調整調整如6F圖中之位移β3。For example, please refer to Figures 6A to 6F, use the Y-direction adjustment translation technique, and adjust the displacement β1 in the Y-direction according to the expansion and contraction amount α1 in Figure 6A as shown in Figure 6B. According to the expansion and contraction amount α2 in the figure 6C, the displacement β2 in the figure 6D is adjusted through the Y direction adjustment. According to the expansion and contraction amount α3 in the figure 6E, adjust the displacement β3 in the figure 6F through the Y direction adjustment.
在一些實施例中，脹縮量α1為0.5‰調整位移β1為17μm。又一些實施例中，脹縮量α2為1‰調整位移β2為35μm。另一些實施例中，脹縮量α3為2‰調整位移β3為70μm。以上為具體Y向平移調整技巧實踐。In some embodiments, the amount of expansion and contraction α1 is 0.5‰, and the adjustment displacement β1 is 17 μm. In still other embodiments, the amount of expansion and contraction α2 is 1‰, and the adjustment displacement β2 is 35 μm. In other embodiments, the amount of expansion and contraction α3 is 2‰, and the adjustment displacement β3 is 70 μm. The above is the practice of specific Y-direction translation adjustment skills.
在一些實施例中，上述步驟730包含以下操作：接合複數個第一接腳及複數個第二接腳以於電子裝置中之接合區域之中心位置形成至少一中央接合接腳，於最遠離至少一中央接合接腳處形成以至少一中央接合接腳鏡像對稱的至少二第一接合接腳，並於至少一中央接合接腳及至少二第一接合接腳之間形成以至少一中央接合接腳鏡像對稱的至少二第二接合接腳。至少二第二接合接腳其中一者包含第三端及第四端。第三端之第三寬度設為c，第四端之第四寬度設為d，c及d滿足關係式0＜c/d≦1。In some embodiments, the
舉例而言，請參閱第2圖至第7圖，接合複數個第一接腳110及複數個第二接腳210以於電子裝置100中之接合區域之中心位置形成至少一中央接合接腳410，於最遠離至少一中央接合接腳410處形成以至少一中央接合410接腳鏡像對稱的至少二第一接合接腳450，並於至少一中央接合接腳410及至少二第一接合接腳450之間形成以至少一中央接合接腳410鏡像對稱的至少二第二接合接腳420。至少一第二接合接腳420其中一者包含第三端(如圖中上端)及第四端(如圖中下端)。第三端之第三寬度設為c，第四端之第四寬度設為d，c及d滿足關係式0＜c/d≦1。For example, referring to FIGS. 2-7, the plurality of
在一些實施例中，請參閱第4圖及第5圖，當實際接合區域寬度Z與接合區域長度L不變，依據前述實施例可知，接合接腳之間距與寬度關係，於是，改變接合區域之設計長度L1及上述傾斜角θ如下：
由表一可知，接合接腳最佳傾斜角度為80˚，實際搭接面積提升程度29%。It can be seen from Table 1 that the best inclination angle of the joint pins is 80˚, and the actual overlap area is increased by 29%.
第8圖為根據本案一些實施例繪示接合接腳之示意圖。第8圖為繪示第5圖實施例之變形實施例的接合接腳。在一些實施例中，第5圖實施例為上底較小下底較大的梯形接合接腳設計，而第8圖實施例為上底較大下底較小的梯形接合接腳設計。第8圖之複數個接合接腳包含接合區域長度L’及接合區域之設計長度L2。FIG. 8 is a schematic diagram showing bonding pins according to some embodiments of the present application. Fig. 8 shows the bonding pins of a modified embodiment of the embodiment shown in Fig. 5; In some embodiments, the embodiment in Fig. 5 is a trapezoidal joint pin design with a smaller upper base and a larger lower base, and the embodiment in Fig. 8 is a trapezoidal joint pin design with a larger upper base and a smaller bottom base. The plurality of bonding pins in Fig. 8 includes a bonding area length L'and a design length L2 of the bonding area.
此外，複數個接合接腳包含至少一中央接合接腳410A及至少二第一接合接腳450A。至少一中央接合接腳410A位於複數個接合接腳之中心位置。至少二第一接合接腳450A最遠離至少一中央接合接腳410A並以至少一中央接合410A接腳為準呈現鏡像對稱。第一接合接腳450A最靠近第一側M1及第二側M2，且第一接合接腳450A與基板120之一側(如圖式上側)間的夾角為傾斜角φ。當接合接腳越靠近中心位置，傾斜角φ越接近90˚。In addition, the plurality of bonding pins includes at least one
此外，第一端之第一寬度設為a’。第二端之第二寬度設為b’。a’及b’滿足關係式a’/b’≧1。至少二第一接合接腳450A其中一者與基板120的一側(如圖式上側)包含傾斜角φ。φ滿足關係式0＜φ≦90。In addition, the first width of the first end is set to a'. The second width of the second end is set to b'. a'and b'satisfy the relationship a'/b'≧1. One of the at least two
在一些實施例中，複數個接合接腳更包含至少二第二接合接腳420A，位於至少一中央接合接腳410A及至少二第一接合接腳450A之間並以至少一中央接合接腳410A鏡像對稱。至少二第二接合接腳420A包含第三端及第四端。第三端之第三寬度設為c’。第四端之第四寬度設為d’。’c及d’滿足關係式c’/d’≧1。In some embodiments, the plurality of bonding pins further includes at least two second bonding pins 420A, located between at least one
在一些實施例中，依據前述實施例可知，每一接合接腳(如圖式中由中央往第一側M1的中央接合接腳410A、第二接合接腳420A、第三接合接腳430A、第四接合接腳440A及第一接合接腳450A)分別具有各自的上底(如圖式上端)寬度及下底(如圖式下端)寬度。相鄰的接合接腳分別具有上間距及下間距。In some embodiments, according to the foregoing embodiments, each bonding pin (as shown in the figure from the center to the
此外，由中央接合接腳410A往第一側M1分別為第一端之第一寬度a’、第一間距e’、第三端之第三寬度c’、第三間距i’、第五端之第五寬度g’、上間距o’、上端寬度r’、上間距t’及上端寬度v’。前述接合接腳之上底寬度及上間距均相等。In addition, from the central
再者，由中央接合接腳410A往第一側M1分別為第二端之第二寬度b’、第二間距f’、第四端之第四寬度d’、第四間距j’、第六端之第六寬度h’、下間距q’、下端寬度s’、下間距u’及下端寬度w’。前述接合接腳之下底寬度及下間距均相等。Furthermore, from the central
在一些實施例中，上述接合區域長度L’與上述接合區域長度L可相同或不相同。在一些實施例中，上述接合區域之設計長度L1與合區域之設計長度L2可相同或不相同。In some embodiments, the above-mentioned joining area length L'and the above-mentioned joining area length L may be the same or different. In some embodiments, the design length L1 of the joint area and the design length L2 of the joint area may be the same or different.
依據前述實施例，本案提供一種用於電子裝置的接合墊結構，藉以改善超薄可撓性基板上的接腳材料因熱脹縮導致接合時產生偏移的問題。According to the foregoing embodiment, the present application provides a bonding pad structure for an electronic device, so as to improve the problem that the pin material on the ultra-thin flexible substrate will be offset due to thermal expansion and contraction during bonding.
雖然本案以詳細之實施例揭露如上，然而本案並不排除其他可行之實施態樣。因此，本案之保護範圍當視後附之申請專利範圍所界定者為準，而非受於前述實施例之限制。Although this case is disclosed as above with detailed embodiments, this case does not exclude other feasible implementation aspects. Therefore, the scope of protection of this case shall be determined by the scope of the attached patent application, and shall not be restricted by the foregoing embodiments.
對本領域技術人員而言，在不脫離本案之精神和範圍內，當可對本案作各種之更動與潤飾。基於前述實施例，所有對本案所作的更動與潤飾，亦涵蓋於本案之保護範圍內。For those skilled in the art, without departing from the spirit and scope of the case, various changes and modifications can be made to the case. Based on the foregoing embodiment, all changes and modifications made to this case are also covered by the scope of protection of this case.
100:電子裝置 10:接腳 20:接腳 120:基板 220:軟性電路板 110:第一接腳 a1~a2:上端之寬度 b1~b2:下端之寬度 210:第二接腳 310:接合接腳 Z:實際接合區域之寬度 410~410A:中央接合接腳 420~420A:第二接合接腳 430~430A:第三接合接腳 440~440A:第四接合接腳 450~450A:第一接合接腳 a, a’:第一寬度 b, b’:第二寬度 c, c’:第三寬度 d, d’:第四寬度 e, e’:第一間距 f, f’:第二間距 g, g’:第五寬度 h, h’:第六寬度 i, i’:第三間距 j, j’:第四間距 θ, φ:傾斜角 P1:邊界線 P2:邊界線 L, L’:接合區域之長度 L1~L2:接合區域之設計長度 M1:第一側 M2:第二側 o, t, o’, t’:上間距 q, u, q’, u’:下間距 r, v, r’, v’:上端寬度 s, w, s’, w’:下端寬度 α1~α3:脹縮量 β1~β3:位移 700:方法 710~730:步驟 100: electronic device 10: Pin 20: Pin 120: substrate 220: flexible circuit board 110: first pin a1~a2: the width of the upper end b1~b2: the width of the lower end 210: second pin 310: Bonding pin Z: The width of the actual joint area 410~410A: Central bonding pin 420~420A: second bonding pin 430~430A: third bonding pin 440~440A: Fourth bonding pin 450~450A: The first bonding pin a, a’: first width b, b’: second width c, c’: third width d, d’: fourth width e, e’: first spacing f, f’: second spacing g, g’: fifth width h, h’: sixth width i, i’: third spacing j, j’: fourth spacing θ, φ: tilt angle P1: boundary line P2: boundary line L, L’: Length of joint area L1~L2: Design length of the joint area M1: First side M2: second side o, t, o’, t’: upper spacing q, u, q’, u’: lower spacing r, v, r’, v’: upper end width s, w, s’, w’: bottom width α1~α3: The amount of expansion and contraction β1~β3: displacement 700: method 710~730: steps
參照後續段落中的實施方式以及下列圖式，當可更佳地理解本案的內容： 第1A圖為根據本案一些實施例繪示的預計接腳示意圖； 第1B圖為根據本案一些實施例繪示的實際接腳示意圖； 第2圖為根據本案一些實施例繪示的基板之接腳示意圖； 第3圖為根據本案一些實施例繪示的軟性電路板之接腳示意圖； 第4圖為根據本案一些實施例繪示的接合接腳之示意圖； 第5圖為根據本案一些實施例繪示的接合接腳之示意圖； 第6A圖為根據本案一些實施例繪示的接合接腳預壓脹縮之示意圖； 第6B圖為根據本案一些實施例繪示的接合接腳調整接合之示意圖； 第6C圖為根據本案一些實施例繪示的接合接腳預壓脹縮之示意圖； 第6D圖為根據本案一些實施例繪示的接合接腳調整接合之示意圖； 第6E圖為根據本案一些實施例繪示的接合接腳預壓脹縮之示意圖； 第6F圖為根據本案一些實施例繪示的接合接腳預調整接合之示意圖； 第7圖為根據本案一些實施例繪示的用於電子裝置的接合墊結構製造方法之步驟流程圖；以及 第8圖為根據本案一些實施例繪示接合接腳之示意圖。 With reference to the implementation in the subsequent paragraphs and the following diagrams, you can better understand the content of this case: FIG. 1A is a schematic diagram of expected pins according to some embodiments of the present case; Figure 1B is a schematic diagram of actual pins drawn according to some embodiments of the present case; Figure 2 is a schematic diagram showing the pins of the substrate according to some embodiments of the present case; Figure 3 is a schematic diagram of the pins of a flexible circuit board drawn according to some embodiments of the present case; Figure 4 is a schematic diagram of bonding pins according to some embodiments of the present case; Figure 5 is a schematic diagram of bonding pins according to some embodiments of the present case; Fig. 6A is a schematic diagram of the pre-compression expansion and contraction of the joint pins according to some embodiments of the present case; FIG. 6B is a schematic diagram of adjusting the bonding of the bonding pins according to some embodiments of the present case; FIG. Fig. 6C is a schematic diagram of the pre-compression expansion and contraction of the joint pins according to some embodiments of the present case; FIG. 6D is a schematic diagram of adjusting the bonding of bonding pins according to some embodiments of the present application; FIG. Fig. 6E is a schematic diagram of the pre-compression expansion and contraction of the joint pins according to some embodiments of the present case; FIG. 6F is a schematic diagram of pre-adjusted bonding of bonding pins according to some embodiments of the present case; FIG. 7 is a flowchart of steps of a method for manufacturing a bonding pad structure for an electronic device according to some embodiments of the present case; and FIG. 8 is a schematic diagram showing bonding pins according to some embodiments of the present application.
100:電子裝置 100: electronic device
120:基板 120: substrate
220:軟性電路板 220: flexible circuit board
Z:實際接合區域之寬度 Z: The width of the actual joint area
410:中央接合接腳 410: Central bonding pin
420:第二接合接腳 420: second bonding pin
430:第三接合接腳 430: third bonding pin
440:第四接合接腳 440: Fourth bonding pin
450:第一接合接腳 450: The first bonding pin
a:第一寬度 a: first width
b:第二寬度 b: second width
c:第三寬度 c: third width
d:第四寬度 d: fourth width
e:第一間距 e: first spacing
f:第二間距 f: second spacing
g:第五寬度 g: fifth width
h:第六寬度 h: sixth width
i:第三間距 i: third spacing
j:第四間距 j: fourth spacing
θ:傾斜角 θ: tilt angle
P1:邊界線 P1: boundary line
P2:邊界線 P2: boundary line
L:接合區域之長度 L: Length of joint area
L1:接合區域之設計長度 L1: Design length of joint area
M1:第一側 M1: First side
M2:第二側 M2: second side
o,t:上間距 o, t: upper spacing
q,u:下間距 q, u: lower spacing
r,v:上端寬度 r,v: upper end width
s,w:下端寬度 s, w: lower end width
Claims (19)
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| TW109214547U TWM607729U (en) | 2020-11-04 | 2020-11-04 | Bonding pad structure for electronic device |
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| Application Number | Priority Date | Filing Date | Title |
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| TW109214547U TWM607729U (en) | 2020-11-04 | 2020-11-04 | Bonding pad structure for electronic device |
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| TWM607729U true TWM607729U (en) | 2021-02-11 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI756900B (en) * | 2020-11-04 | 2022-03-01 | 大陸商宸美（廈門）光電有限公司 | Bonding pad structure for electronic device and manufacturing method thereof |
| US11800642B2 (en) | 2020-12-01 | 2023-10-24 | Tpk Advanced Solutions Inc. | Bonding pad structure for electronic device and manufacturing method thereof |
-
2020
- 2020-11-04 TW TW109214547U patent/TWM607729U/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI756900B (en) * | 2020-11-04 | 2022-03-01 | 大陸商宸美（廈門）光電有限公司 | Bonding pad structure for electronic device and manufacturing method thereof |
| US11800642B2 (en) | 2020-12-01 | 2023-10-24 | Tpk Advanced Solutions Inc. | Bonding pad structure for electronic device and manufacturing method thereof |
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