TWM607681U - Lithography system - Google Patents
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Abstract
本創作公開一種光刻系統。光刻系統包括一第一無塵腔體、設置於第一無塵腔體中的一光阻塗佈裝置、一第二無塵腔體、設置於第二無塵腔體中的一固化裝置、設置於第二無塵腔體中的一顯影設備、設置於第二無塵腔體中的一蝕刻設備、以及一推車。本創作所提供的光刻系統能通過“第一無塵腔體以及第二無塵腔體用來避免金屬滾輪被環境中的汙染源黏附”的技術方案,以避免金屬滾輪被環境中的汙染源汙染,並使金屬滾輪的製造良率大幅提升。This creation discloses a lithography system. The lithography system includes a first dust-free cavity, a photoresist coating device arranged in the first dust-free cavity, a second dust-free cavity, and a curing device arranged in the second dust-free cavity , A developing device arranged in the second dust-free cavity, an etching device arranged in the second dust-free cavity, and a cart. The lithography system provided by this creation can prevent the metal roller from being polluted by the pollution source in the environment through the technical solution of "the first dust-free cavity and the second dust-free cavity are used to prevent the metal roller from being adhered by the pollution source in the environment" , And greatly improve the manufacturing yield of metal rollers.
Description
本創作涉及一種光刻系統,特別是涉及一種無塵光刻系統。This creation relates to a lithography system, especially to a dust-free lithography system.
現有的滾輪光阻塗佈設備經常在一金屬滾輪的外表面設置一光阻層後,就需要將所述金屬滾輪轉移至下一階段的製程設備中(如:滾輪顯影設備、滾輪光刻設備)。然而,在所述金屬滾輪的轉移過程中,經常會因為環境中的汙染源汙染了所述金屬滾輪,導致所述金屬滾輪於後續製程中的良率大幅下降。Existing roller photoresist coating equipment often installs a photoresist layer on the outer surface of a metal roller, and then the metal roller needs to be transferred to the next stage of the process equipment (such as: roller developing equipment, roller photolithography equipment) ). However, during the transfer process of the metal roller, pollution sources in the environment often contaminate the metal roller, resulting in a substantial decrease in the yield of the metal roller in the subsequent manufacturing process.
故,如何通過結構設計的改良,來克服上述的缺陷,已成為該項事業所欲解決的重要課題之一。Therefore, how to overcome the above-mentioned shortcomings through the improvement of structural design has become one of the important issues to be solved by this business.
本創作實施例針對現有技術的不足提供一種光刻系統,其能有效地改善現有的滾輪光刻系統所可能產生的缺陷。This creative embodiment provides a lithography system for the shortcomings of the prior art, which can effectively improve the possible defects of the existing roller lithography system.
本創作實施例公開一種光刻系統,用來在一金屬滾輪的外表面上形成一壓印層,所述光刻系統包括:一第一無塵腔體,用來避免所述金屬滾輪被環境中的汙染源黏附,並且所述第一無塵腔體包含一第一滾輪固定裝置,其用來夾持並轉動所述金屬滾輪;一光阻塗佈裝置,設置於所述第一無塵腔體中,並且所述光阻塗佈裝置用來在所述金屬滾輪的所述外表面上塗佈一光阻層;一第二無塵腔體,用來避免所述金屬滾輪被環境中的汙染源黏附,並且所述第二無塵腔體包含一第二滾輪固定裝置,其用來夾持並轉動所述金屬滾輪;一固化裝置,設置於所述第二無塵腔體中,並且所述固化裝置用來將一圖案化光源照射於所述光阻層,以使所述光阻層的一側形成多個曝光圖案;一顯影設備,設置於所述第二無塵腔體中,並且所述顯影設備用來移除所述光阻層上的多個所述曝光圖案的材料,並形成一圖案化光阻層;及一蝕刻設備,設置於所述第二無塵腔體中,並且所述蝕刻設備用來以非等向性蝕刻方式對所述圖案化光阻層進行蝕刻以形成所述壓印層。This creative embodiment discloses a photolithography system for forming an imprint layer on the outer surface of a metal roller. The photolithography system includes: a first dust-free cavity to prevent the metal roller from being exposed to the environment. The pollution source in the first dust-free cavity is attached, and the first dust-free cavity includes a first roller fixing device for holding and rotating the metal roller; a photoresist coating device is arranged in the first dust-free cavity Body, and the photoresist coating device is used to coat a photoresist layer on the outer surface of the metal roller; a second dust-free cavity is used to prevent the metal roller from being affected by the environment The pollution source is adhered, and the second dust-free cavity includes a second roller fixing device for clamping and rotating the metal roller; a curing device is arranged in the second dust-free cavity, and The curing device is used to irradiate a patterned light source on the photoresist layer to form a plurality of exposure patterns on one side of the photoresist layer; a developing device is arranged in the second dust-free cavity, And the developing device is used to remove a plurality of materials of the exposure patterns on the photoresist layer and form a patterned photoresist layer; and an etching device is arranged in the second dust-free cavity And the etching equipment is used to etch the patterned photoresist layer in an anisotropic etching manner to form the imprint layer.
本創作的其中一有益效果在於,本創作所提供的所述光刻系統,其能通過“所述第一無塵腔體以及所述第二無塵腔體用來避免所述金屬滾輪被環境中的汙染源黏附”以及“所述光阻塗佈裝置設置於所述第一無塵腔體中,並且所述固化裝置、所述顯影設備、以及所述蝕刻設備設置於所述第二無塵腔體中”的技術方案,以避免所述金屬滾輪被環境中的汙染源汙染,並使所述金屬滾輪的製造良率大幅提升。One of the beneficial effects of this creation is that the lithography system provided by this creation can use "the first dust-free cavity and the second dust-free cavity to prevent the metal roller from being affected by the environment. "Pollution source adhesion" and "The photoresist coating device is arranged in the first dust-free cavity, and the curing device, the developing equipment, and the etching equipment are arranged in the second dust-free cavity The technical solution of "in the cavity" prevents the metal roller from being polluted by environmental pollution sources, and greatly improves the manufacturing yield of the metal roller.
為使能更進一步瞭解本創作的特徵及技術內容,請參閱以下有關本創作的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本創作加以限制。In order to further understand the features and technical content of this creation, please refer to the following detailed descriptions and drawings about this creation. However, the drawings provided are only for reference and explanation, and are not used to limit this creation.
以下是通過特定的具體實施例來說明本創作所公開有關“光刻系統”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本創作的優點與效果。本創作可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不背離本創作的構思下進行各種修改與變更。另外,本創作的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。此外,以下如有指出請參閱特定圖式或是如特定圖式所示,其僅是用以強調於後續說明中,所述及的相關內容大部份出現於該特定圖式中,但不限制該後續說明中僅可參考所述特定圖式。以下的實施方式將進一步詳細說明本創作的相關技術內容,但所公開的內容並非用以限制本創作的保護範圍。The following is a specific embodiment to illustrate the implementation of the "lithography system" disclosed in this creation, and those skilled in the art can understand the advantages and effects of this creation from the content disclosed in this specification. This creation can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this creation. In addition, the drawings of this creation are merely schematic illustrations, and are not depicted in actual size, and are stated in advance. In addition, if it is pointed out below, please refer to a specific drawing or as shown in a specific drawing, it is only used to emphasize in the subsequent description, and most of the related content appears in the specific drawing, but not It is restricted that only the specific drawings can be referred to in this subsequent description. The following implementations will further describe the related technical content of this creation in detail, but the disclosed content is not intended to limit the protection scope of this creation.
應當可以理解的是,雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號,但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件,或者一信號與另一信號。另外,本文中所使用的術語“或”,應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another, or one signal from another signal. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.
[第一實施例][First Embodiment]
請參閱圖1至圖9A所示,其為本創作的第一實施例,需先說明的是,本實施例所對應到的附圖及其所提及的相關數量與外形,僅用來具體地說明本創作的實施方式,以便於了解本創作的內容,而非用來侷限本創作的保護範圍。Please refer to Figures 1 to 9A, which are the first embodiment of the creation. It should be noted that the drawings corresponding to this embodiment and the related numbers and appearances mentioned in this embodiment are only used for specific details. Explain the implementation of this creation in order to understand the content of this creation, not to limit the scope of protection of this creation.
如圖1至圖9A所示,本創作第一實施例提供一種光刻系統100,用來在一金屬滾輪200的外表面201上形成一壓印層300’’。需要說明的是,所述金屬滾輪200定義有一中心軸線C,並且於本實施例中,所述金屬滾輪200的長度為1公尺(M)~2公尺,而所述金屬滾輪200的橫截面的直徑為10公分(cm)~45公分。其中,所述金屬滾輪200較佳由不銹鋼製成,但本創作並不限於此。舉例來說,所述金屬滾輪200也可以由錫、鉛、鋅、鋁、銅、黃銅、鐵、鎳、鈷、鎢、鉻或其硬度大於鉻的金屬製成,而所述金屬滾輪200的長度與橫截面也能以依需求進行設計。As shown in FIGS. 1-9A, the first embodiment of the present invention provides a
如圖1所示,所述光刻系統100包括一第一無塵腔體1、設置於所述第一無塵腔體1中的一光阻塗佈裝置2、一第二無塵腔體3、設置於所述第二無塵腔體3中的一固化裝置4、設置於所述第二無塵腔體3中的一顯影設備5、設置於所述第二無塵腔體3中的一蝕刻設備6、以及一推車7,但本創作並不限於此。舉例來說,於本創作未繪示的其他實施例中,所述光刻系統100也可以不包含所述推車7。As shown in FIG. 1, the
需要說明的是,所述推車7用來將所述金屬滾輪200自所述第一無塵腔體1移入所述第二無塵腔體3中。更詳細地說,於本實施例中,所述推車7包含一推車本體71以及一防塵套件72,所述推車本體71用來可移動地設置在一地面上,並且所述推車本體71包含一承載支架711,其用來支撐所述金屬滾輪200。其中,所述防塵套件72安裝於所述承載支架711上,並且所述防塵套件72定義出具有預定潔淨等級(如:美國聯邦標準分級1~美國聯邦標準分級100)的一防塵空間721,所述防塵空間721能用來容置所述金屬滾輪200,使所述推車本體71能夠用來使所述金屬滾輪200在預定潔淨等級的環境下進行輸送。It should be noted that the
需要說明的是,所述第一無塵腔體1以及所述第二無塵腔體3用來避免所述金屬滾輪200被環境中的汙染源黏附,並且所述第一無塵腔體1以及所述第二無塵腔體3分別包含一第一滾輪固定裝置11以及一第二滾輪固定裝置31。其中,所述第一無塵腔體1以及所述第二無塵腔體3的等級為美國聯邦標準分級1~美國聯邦標準分級100,並且所述第一滾輪固定裝置11以及所述第二滾輪固定裝置31分別能用來夾持並轉動所述金屬滾輪200。It should be noted that the first dust-
需要說明的是,為方便說明與理解所述第二滾輪固定裝置31的技術內容,以下將先介紹其他裝置(如:所述光阻塗佈裝置2),而後在介紹所述顯影設備5時一併介紹所述第二滾輪固定裝置31的細部技術內容。It should be noted that, in order to facilitate the description and understanding of the technical content of the second
如圖2所示,所述光阻塗佈裝置2用來在所述金屬滾輪200的所述外表面201上塗佈一光阻層300。其中,所述光阻塗佈裝置2是一噴塗塗佈裝置,但本創作並不以此為限。舉例來說,所述光阻塗佈裝置2也可以是線棒式塗佈裝置、雙面成形塗佈裝置、以及封閉式刮刀塗佈裝置等多種應用不同塗佈技術的塗佈裝置。As shown in FIG. 2, the
需要說明的是,所述光阻層300於本實施例中由一正光阻劑製成,其主要是由酚醛樹脂(Phenol-formaldehyde resin)製成,但本創作並不限於此。舉例來說,所述光阻層300也可以由或環氧樹脂(Epoxy resin)等正光阻劑材料製成。It should be noted that the
具體來說,當所述光阻塗佈裝置2在所述金屬滾輪200的所述外表面201上噴塗所述正光阻劑時,所述金屬滾輪200被所述第一滾輪固定裝置11夾持並轉動,以使所述外表面201被所述正光阻劑均勻地噴塗,續而形成設置於所述外表面201的所述光阻層300。其中,於本實施例中,所述光阻塗佈裝置2包含位置臨近於所述金屬滾輪200的一噴頭,用來可移動地將所述正光阻劑噴塗於所述外表面201,但本創作並不限於此。舉例來說,於本創作未繪示的其他實施例中,所述光阻塗佈裝置2也可以包含多個噴頭。Specifically, when the
如圖3A及圖3B所示,所述固化裝置4用來將一圖案化光源4L照射於所述光阻層300,以使所述光阻層300的一側形成多個曝光圖案301。進一步地說,於本實施例中,所述固化裝置4包含一光源(如:LED或雷射二極體)以及一光罩,所述光源產生的光線能穿透所述光罩而形成所述圖案化光源4L,但本創作並不以此為限。舉例來說,所述圖案化光源4L也能夠是由雷射光源或紫外光LED通過微菱鏡聚焦所形成。As shown in FIGS. 3A and 3B, the
具體來說,當所述固化裝置4以所述圖案化光源4L照射於所述光阻層300的一側時,所述金屬滾輪200被所述第二滾輪固定裝置31夾持並轉動,使所述光阻層300被所述圖案化光源4L均勻地照射,續而於所述光阻層300的一側形成多個所述曝光圖案301。Specifically, when the
如圖4所示,所述浸潤裝置51用來容納一顯影劑R,並且所述浸潤裝置51包含一蓋體511,所述蓋體511用來保護設置於所述浸潤裝置51的所述顯影劑R,避免其受到外部環境的汙染。更詳細地說,所述蓋體511包含可相互組合的兩個組合面,兩個所述組合面分別設置於所述浸潤裝置51的位置對稱的任兩側,兩個所述組合面可移動地組合在一起,使所述浸潤裝置51用來供所述金屬滾輪200進入的開口被封閉或開啟,但本創作並不限於此。舉例來說。於本創作未繪示的其他實施例中,所述蓋體511也可以包含一捲簾,所述捲簾設置於所述浸潤裝置51的任意一側,並且所述捲簾可以被鋪展以使所述浸潤裝置51用來供所述金屬滾輪200進入的開口被封閉或開啟。As shown in FIG. 4, the
需要說明的是,所述顯影劑R的組成材料的種類與組成材料比例對應於所述光阻層300的組成材料的種類與組成材料比例。換句話說,所述顯影劑R包含的組成材料種類與組成材料比例會隨所述光阻層300的組成材料的種類與比例變動。所述顯影劑R於本實施例中包含溶解有四甲基氫氧化銨(TMAH)的鹼水溶液,但本創作並不限於此。舉例來說,於其他實施例中,溶解有四甲基氫氧化銨(TMAH)的所述鹼水溶液,也可以被替換成溶解有四乙基氫氧化銨(TEAH)、四丙基氫氧化銨(TPAH)、或四丁基氫氧化銨(TBAH)的鹼水溶液。It should be noted that the type and the ratio of the composition material of the developer R correspond to the type and the ratio of the composition material of the
如圖5A及圖5B所示,所述顯影設備5用來移除所述光阻層300上的多個所述曝光圖案301的材料,並形成一圖案化光阻層300’。更詳細地說,所述顯影設備5包含與所述金屬滾輪200間隔地設置的一浸潤裝置51、連接於所述浸潤裝置51的一移動裝置52、安裝於所述第二滾輪固定裝置31的一速度控制機構53、以及與所述金屬滾輪200間隔地設置的一沖洗裝置54。As shown in FIGS. 5A and 5B, the developing
如圖5A所示,所述移動裝置52用來使所述第二滾輪固定裝置31與所述浸潤裝置51相對地移動,以使所述浸潤裝置51能用來將其所容納的所述顯影劑R浸潤於局部所述光阻層300。更詳細地說,於本實施例中,所述移動裝置52用來移動所述浸潤裝置51並使所述浸潤裝置51向所述第二滾輪固定裝置31相對地移動,但本創作並不限於此。舉例來說,於本創作未繪示的其他實施例中,所述移動裝置52也可以是用來移動所述第二滾輪固定裝置31並使所述第二滾輪固定裝置31向所述浸潤裝置51相對地移動。As shown in FIG. 5A, the moving
所述移動裝置52包含一升降機構521以及安裝於所述升降機構521的一支撐機構522。其中,所述支撐機構522用來支撐所述浸潤裝置51的底部,而所述升降機構521用來使所述浸潤裝置51沿垂直所述金屬滾輪200的所述中心軸線C的一方向移動。The moving
如圖5A至圖6所示,所述速度控制機構53用來使所述第二滾輪固定裝置31選擇性地以一浸潤速度S1以及一甩乾速度S2轉動所述金屬滾輪200。更詳細地說,所述速度控制機構53能用來控制所述第二滾輪固定裝置31,以使所述金屬滾輪200以介於1轉/分鐘(RPM)至120轉/分鐘的所述浸潤速度S1轉動,並且所述速度控制機構53也能用來控制所述第二滾輪固定裝置31,以使所述金屬滾輪200以介於2900轉/分鐘(RPM)至4500轉/分鐘的所述甩乾速度S2轉動。As shown in FIGS. 5A to 6, the
需要說明的是,如圖5A所示,所述速度控制機構53能用來在所述光阻層300被所述浸潤裝置51中的所述顯影劑R浸潤時,使所述第二滾輪固定裝置31以所述浸潤速度S1轉動所述金屬滾輪200而令所述光阻層300被所述顯影劑R均勻浸潤,使部分所述光阻層300溶於所述顯影劑R中,進而形成所述圖案化光阻層300’。It should be noted that, as shown in FIG. 5A, the
如圖6所示,所述沖洗裝置54用來在所述圖案化光阻層300’離開所述浸潤裝置51內的所述顯影劑R時,以水沖洗分布於所述圖案化光阻層300’的所述顯影劑R。其中,當所述沖洗裝置54以水沖洗分布於所述圖案化光阻層300’的所述顯影劑R時,所述速度控制機構53控制所述第二滾輪固定裝置31,以使所述金屬滾輪200以所述浸潤速度S1轉動。As shown in FIG. 6, the rinsing
需要說明的是,當所述沖洗裝置54以水沖洗分布於所述圖案化光阻層300’的所述顯影劑R時,所述浸潤裝置51的所述蓋體511將封閉所述浸潤裝置51,阻擋使用過的水與使用過的所述顯影劑R回流到所述浸潤裝置51中。It should be noted that when the
需要說明的是,如圖7所示,當所述圖案化光阻層300’離開所述浸潤裝置51內的所述顯影劑R,而且所述沖洗裝置54對所述圖案化光阻層300’沖洗完畢後,所述速度控制機構53能控制所述第二滾輪固定裝置31,以使所述金屬滾輪200以所述甩乾速度S2轉動,並使殘留於所述圖案化光阻層300’的水分離。It should be noted that, as shown in FIG. 7, when the patterned photoresist layer 300' leaves the developer R in the
如圖8至圖9A所示,所述蝕刻設備6用來以非等向性蝕刻方式(如:電漿蝕刻)對所述圖案化光阻層300’進行蝕刻以形成所述壓印層300’’。更詳細地說,如圖9A所示,所述蝕刻設備6包含一第一蝕刻機構61以及第二蝕刻機構62,並且所述第一蝕刻機構61能用來對所述圖案化光阻層300’進行蝕刻以形成所述壓印層300’’。其中,所述壓印層300’’包含多個鏤空部301’’和多個遮蔽部302’’,多個所述鏤空部301’’用來暴露部分所述外表面201,而多個所述遮蔽部302’’遮蔽部分所述外表面201。As shown in FIGS. 8 to 9A, the
需要說明的是,由於非等向性蝕刻方式具有蝕刻方向可控制的特點,使得所述圖案化光阻層300’能夠以大致上沿著和所述金屬滾輪200的所述外表面201的法線方向被蝕刻,因此能夠確保所述壓印層300’’的多個所述鏤空部301’’和多個所述遮蔽部302’’的形狀的正確性,並且減少了所述壓印層300’’產生缺陷的機會。It should be noted that because the anisotropic etching method has the characteristic of controllable etching direction, the patterned photoresist layer 300' can be substantially along the
[第二實施例][Second Embodiment]
參閱圖9B及9C所示,其為本創作的第二實施例,需先說明的是,本實施例類似於上述第一實施例,所以兩個實施例的相同處則不再加以贅述;再者,本實施例對應附圖所提及的相關數量與外型,僅用來具體地說明本創作的實施方式,以便於了解本創作的內容,而非用來侷限本創作的保護範圍。Refer to Figures 9B and 9C, which are the second embodiment of the creation. It should be noted that this embodiment is similar to the above-mentioned first embodiment, so the similarities between the two embodiments will not be described again; In addition, the relevant quantities and appearances mentioned in the corresponding drawings in this embodiment are only used to specifically illustrate the implementation of this creation, so as to understand the content of this creation, and not to limit the protection scope of this creation.
如圖9B所示,所述第二蝕刻機構62能以所述壓印層300’’為遮罩,並透過非等向蝕刻手段蝕刻所述金屬滾輪200的所述外表面201,而於所述外表面201形成多個壓印圖形303’’。其中,如圖9C所示,所述第二蝕刻機構62能用來使任一個所述壓印圖形303’’的深度d介於0.2微米至0.6微米之間,使任一個所述壓印圖形303’’的寬度w介於0.3微米至0.8微米之間,並使相鄰的任兩個所述壓印圖形303’’的間距p介於0.6微米至1.6微米之間。As shown in FIG. 9B, the
需要說明的是,於本實施例中,所述第二蝕刻機構62是使用高密度電漿源 (High density plasma, HDP)並以反應式離子蝕刻手段(Reactive Ion Etch, RIE)進行蝕刻,但本創作並不限於此。舉例來說,所述第二蝕刻機構62也能夠採用磁場強化活性離子蝕刻手段(Magnetic Enhanced RIE, MERIE),或者透過脈衝電場強化的技術手段,增強蝕刻的效率並控制蝕刻的方向。It should be noted that, in this embodiment, the
需要說明的是,當所述外表面201形成有多個所述壓印圖形303’’後,所述金屬滾輪200的所述外表面201上的所述壓印層300’’被移除,而使得所述金屬滾輪200形成一轉印滾輪。It should be noted that, after a plurality of
[實施例的有益效果][Beneficial effects of the embodiment]
本創作的其中一有益效果在於,本創作所提供的所述光刻系統100,其能通過“所述第一無塵腔體1以及所述第二無塵腔體3用來避免所述金屬滾輪200被環境中的汙染源黏附”以及“所述光阻塗佈裝置2設置於所述第一無塵腔體1中,並且所述固化裝置4、所述顯影設備5、以及所述蝕刻設備6設置於所述第二無塵腔體3中”的技術方案,以避免所述金屬滾輪200被環境中的汙染源汙染,並使所述金屬滾輪200的製造良率大幅提升。One of the beneficial effects of this creation is that the
更進一步來說,本創作所提供的所述光刻系統100能通過“所述速度控制機構53能用來在所述光阻層300被所述浸潤裝置51中的所述顯影劑R浸潤時,使所述第二滾輪固定裝置31以所述浸潤速度S1轉動所述金屬滾輪200”的技術方案,使受到曝光的部分所述光阻層300能充分與所述顯影劑R反應,進而被所述顯影劑R完全溶解。Furthermore, the
更進一步來說,本創作所提供的所述光刻系統100能通過“所述速度控制機構53能控制所述第二滾輪固定裝置31,以使所述金屬滾輪200以所述甩乾速度S2轉動,並使殘留於所述圖案化光阻層300’的水分離”的技術方案,使所述圖案化光阻層300’上沒有殘留所述顯影劑R以及水,進而避免所述圖案化光阻層300’於後續的其他製程中發生氧化或其他化學反應,續而使所述金屬滾輪200的製造良率上升。Furthermore, the
更進一步來說,本創作所提供的所述光刻系統100能通過“所述防塵套件72安裝於所述承載支架711,並且所述防塵套件72定義出具有預定潔淨等級的一防塵空間721,所述防塵空間721能用來容置所述金屬滾輪200,使所述推車本體71能夠用來使所述金屬滾輪200在預定潔淨等級的環境下進行輸送”的技術方案,使所述金屬滾輪200在工作機台之間移動時,不會受到灰塵、微粒或其他的汙染物影響。Furthermore, the
更進一步來說,本創作所提供的所述光刻系統100能通過“所述蝕刻設備6用來以非等向性蝕刻方式對所述圖案化光阻層300’進行蝕刻以形成所述壓印層300’’”的技術方案,減少了所述壓印層300’’產生缺陷的機會。More specifically, the
以上所公開的內容僅為本創作的優選可行實施例,並非因此侷限本創作的申請專利範圍,所以凡是運用本創作說明書及圖式內容所做的等效技術變化,均包含於本創作的申請專利範圍內。The content disclosed above is only a preferred and feasible embodiment of this creation, and does not limit the scope of patent application for this creation. Therefore, all equivalent technical changes made using this creation specification and schematic content are included in the application for this creation. Within the scope of the patent.
100:光刻系統
1:第一無塵腔體
11:第一滾輪固定裝置
2:光阻塗佈裝置
3:第二無塵腔體
31:第二滾輪固定裝置
S1:浸潤速度
S2:甩乾速度
4:固化裝置
4L:圖案化光源
5:顯影設備
51:浸潤裝置
511:蓋體
52:移動裝置
521:升降機構
522:支撐機構
53:速度控制機構
54:沖洗裝置
6:蝕刻設備
61:第一蝕刻機構
62:第二蝕刻機構
7:推車
71:推車本體
711:承載支架
72:防塵套件
721:防塵空間
200:金屬滾輪
201:外表面
300:光阻層
301:曝光圖案
300’:圖案化光阻層
300’’:壓印層
301’’:鏤空部
302’’:遮蔽部
303’’:壓印圖形
d:深度
w:寬度
p:間距
R:顯影劑
C:中心軸線
100: Lithography system
1: The first clean chamber
11: The first roller fixing device
2: Photoresist coating device
3: The second clean chamber
31: The second roller fixing device
S1: Wetting speed
S2: Spinning speed
4: curing
圖1為本創作第一實施例的光刻系統的示意圖。FIG. 1 is a schematic diagram of the lithography system of the first embodiment of the creation.
圖2為本創作第一實施例的光阻塗佈裝置的示意圖。Fig. 2 is a schematic diagram of the photoresist coating device according to the first embodiment of the creation.
圖3A為本創作第一實施例的固化裝置照射金屬滾輪的動態示意圖。Fig. 3A is a dynamic schematic diagram of the curing device irradiating the metal roller according to the first embodiment of the creation.
圖3B為本創作第一實施例的固化裝置照射光阻層的示意圖。3B is a schematic diagram of the curing device irradiating the photoresist layer according to the first embodiment of the creation.
圖4為本創作第一實施例的顯影設備的動態示意圖(一)。Figure 4 is a dynamic schematic diagram (1) of the developing device of the first embodiment of the creation.
圖5A為本創作第一實施例的顯影設備的動態示意圖(二)。Figure 5A is a dynamic schematic diagram (2) of the developing device of the first embodiment of the creation.
圖5B本創作第一實施例的顯影設備移除曝光圖案的示意圖。Fig. 5B is a schematic diagram of the developing device of the first embodiment of the present invention removing the exposure pattern.
圖6為本創作第一實施例的顯影設備的動態示意圖(三)。Figure 6 is a dynamic schematic diagram (3) of the developing device of the first embodiment of the creation.
圖7為本創作第一實施例的顯影設備的動態示意圖(四)。Figure 7 is a dynamic schematic diagram (4) of the developing device of the first embodiment of the creation.
圖8為本創作第一實施例的蝕刻設備蝕刻圖案化光阻層的動態示意圖。FIG. 8 is a dynamic schematic diagram of the etching device etching the patterned photoresist layer according to the first embodiment of the creation.
圖9A為本創作第一實施例的蝕刻設備形成壓印層的動作示意圖。FIG. 9A is a schematic diagram of the formation of an imprinted layer by the etching device according to the first embodiment of the creation.
圖9B為本創作第二實施例的蝕刻設備於金屬滾輪表面形成壓印圖形的動作示意圖。FIG. 9B is a schematic diagram of the action of the etching device in the creation of the second embodiment of forming an imprint pattern on the surface of the metal roller.
圖9C為本創作第二實施例移除壓印層後的金屬滾輪的局部剖面示意圖。FIG. 9C is a partial cross-sectional schematic diagram of the metal roller after the imprinting layer is removed in the second embodiment of the creation.
100:光刻系統 100: Lithography system
1:第一無塵腔體 1: The first clean chamber
11:第一滾輪固定裝置 11: The first roller fixing device
2:光阻塗佈裝置 2: Photoresist coating device
3:第二無塵腔體 3: The second clean chamber
31:第二滾輪固定裝置 31: The second roller fixing device
4:固化裝置 4: curing device
5:顯影設備 5: Development equipment
6:蝕刻設備 6: Etching equipment
7:推車 7: cart
71:推車本體 71: Cart body
711:承載支架 711: Carrying bracket
72:防塵套件 72: Dustproof kit
721:防塵空間 721: Dustproof Space
200:金屬滾輪 200: Metal roller
201:外表面 201: Outer surface
Claims (10)
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