TWM604400U

TWM604400U - Probe head structure

Info

Publication number: TWM604400U
Application number: TW109209056U
Authority: TW
Inventors: 蘇偉誌; 李曉剛
Original assignee: 中華精測科技股份有限公司
Priority date: 2020-07-15
Filing date: 2020-07-15
Publication date: 2020-11-21

Abstract

本新型提供的探針頭結構包含第一導板、間隔板、第二導板、探針、外部導電件。第一導板包含第一通孔。間隔板設置於第一導板的一側，且包含第二通孔。第二導板設置於間隔板相對第一導板的另一側，且包含第三通孔。探針貫穿第一通孔、第二通孔、第三通孔，且包含第一端部以及第二端部。外部導電件的一端連接探針的第一端部靠近第一導板處，其另一端連接探針的第二端部靠近第二導板處，使得探針的第一端部靠近第一導板處經由外部導電件連接探針的第二端部靠近第二導板處。當探針頭結構通電運作時，外部導電件負載的電流大於探針負載的電流。The probe head structure provided by the present invention includes a first guide plate, a spacer plate, a second guide plate, probes and external conductive parts. The first guide plate includes a first through hole. The spacer is disposed on one side of the first guide plate and includes a second through hole. The second guide plate is disposed on the other side of the spacer plate opposite to the first guide plate and includes a third through hole. The probe penetrates the first through hole, the second through hole, and the third through hole, and includes a first end and a second end. One end of the external conductive member is connected to the first end of the probe near the first guide plate, and the other end is connected to the second end of the probe near the second guide plate, so that the first end of the probe is close to the first guide. The board is connected to the second end of the probe near the second guide board via an external conductive member. When the probe head structure is powered on, the current loaded by the external conductive member is greater than the current loaded by the probe.

Description

探針頭結構Probe head structure

本新型是關於一種探針頭結構，特別是關於一種能負載高電流的垂直式探針頭結構。The present invention relates to a probe head structure, in particular to a vertical probe head structure that can load high current.

探針頭裝置，是應用於測試設備與晶圓接觸墊的連接及空間轉換裝置。其中，探針是探針頭裝置中最重要的結構，探針作為電性傳輸裝置與力學吸收緩衝裝置，探針的設計必須兼顧良好的電性與力學需求，以確保探針卡內每根探針在使用時，能夠穩定傳輸電氣訊號，並且與晶圓穩定接觸進行測試。The probe head device is a device for connecting test equipment and wafer contact pads and for space conversion. Among them, the probe is the most important structure in the probe head device. The probe is used as an electrical transmission device and a mechanical absorption buffer device. The design of the probe must take into account good electrical and mechanical requirements to ensure that each probe in the probe card When the probe is in use, it can stably transmit electrical signals and make stable contact with the wafer for testing.

現今，積體電路（integrated circuit，IC）所需功率愈來愈高，IC在晶圓測試階段中，測試所需要的電流越來越大。依據現有的探針結構，負載電流的能力無法達到測試晶圓所需要的電流。Nowadays, the power required by integrated circuits (IC) is getting higher and higher. During the wafer test stage of IC, the current required for testing is getting larger and larger. According to the existing probe structure, the load current capacity cannot reach the current required by the test wafer.

探針在晶圓通電測試時，其負載電流能力會有一上限值，一般來說，探針的負載電流上限約為1安培。當測試電流超過探針的負載電流，探針便會產生大量熱累積，造成探針彎曲變形甚至熔毀。當探針的針端水平變差或是無法導通，探針便不能再次進行測試，意即探針頭失效。The probe has an upper limit on its load current capacity when the wafer is energized. Generally speaking, the upper limit of the probe load current is about 1 ampere. When the test current exceeds the load current of the probe, the probe will generate a large amount of heat accumulation, causing the probe to bend and deform or even melt. When the needle end of the probe becomes poor or cannot be conducted, the probe cannot be tested again, which means that the probe head fails.

現有的垂直式探針，可透過加大探針尺寸，以便提升探針負載電流能力。但是，探針尺寸會受限於晶圓測試墊間距（pitch）以及探針測試的施加力道不可過大，使得探針尺寸的設計受到很大的限制。Existing vertical probes can increase the probe size to increase the probe's load current capacity. However, the size of the probe is limited by the wafer test pad pitch and the applied force of the probe test cannot be too large, which greatly restricts the design of the probe size.

有鑑於此，有必要提出一種能負載高電流的垂直式探針頭結構，在既有的探針尺寸設計下，透過本新型的探針頭結構解決習知技術中存在的問題。In view of this, it is necessary to propose a vertical probe head structure that can load high current. Under the existing probe size design, the new probe head structure solves the problems existing in the prior art.

為解決上述習知技術之問題，本新型之目的在於提供一種能負載高電流的垂直式探針頭結構。In order to solve the above-mentioned problems of the prior art, the purpose of the present invention is to provide a vertical probe head structure capable of carrying high current.

為達成上述目的，本新型提供一種探針頭結構，包含一第一導板、一間隔板、一第二導板、一探針、以及一外部導電件。該第一導板包含一第一通孔。該間隔板設置於該第一導板的一側，並且包含一第二通孔。該第二導板設置於該間隔板相對該第一導板的另一側，並且包含一第三通孔。該探針貫穿該第一通孔、該第二通孔、以及該第三通孔，並且包含一第一端部以及相對該第一端部的一第二端部，該第一端部電性連接一測試裝置，該第二端部接觸一待檢測物。該外部導電件的一端電性連接該探針的該第一端部靠近該第一導板處，該外部導電件的另一端電性連接該探針的該第二端部靠近該第二導板處，使得該探針的該第一端部靠近該第一導板處經由該外部導電件電性連接該探針的該第二端部靠近該第二導板處。其中，當該探針頭結構通電運作時，該外部導電件負載的電流大於該探針負載的電流。To achieve the above objective, the present invention provides a probe head structure, which includes a first guide plate, a spacer plate, a second guide plate, a probe, and an external conductive element. The first guide plate includes a first through hole. The spacer is arranged on one side of the first guide plate and includes a second through hole. The second guide plate is disposed on the other side of the spacer plate opposite to the first guide plate and includes a third through hole. The probe penetrates the first through hole, the second through hole, and the third through hole, and includes a first end portion and a second end portion opposite to the first end portion. The first end portion electrically A test device is sexually connected, and the second end contacts an object to be tested. One end of the outer conductive member is electrically connected to the first end of the probe near the first guide plate, and the other end of the outer conductive member is electrically connected to the second end of the probe near the second guide. At the plate, the first end of the probe near the first guide plate is electrically connected to the second end of the probe near the second guide plate via the external conductive member. Wherein, when the probe head structure is powered on, the current loaded by the external conductive element is greater than the current loaded by the probe.

在一較佳實施例中，該外部導電件包含一第一連接區、相對該第一連接區的一第二連接區、以及介於該第一連接區與該第二連接區之間的一中間區；以及該外部導電件的該第一連接區電性連接該探針的該第一端部靠近該第一導板處，該外部導電件的該第二連接區電性連接該探針的該第二端部靠近該第二導板處。In a preferred embodiment, the external conductive element includes a first connection area, a second connection area opposite to the first connection area, and a second connection area between the first connection area and the second connection area. And the first connection area of the outer conductive element is electrically connected to the first end of the probe near the first guide plate, and the second connection area of the outer conductive element is electrically connected to the probe The second end of the device is close to the second guide plate.

在一較佳實施例中，該外部導電件的該第一連接區以及該第二連接區各設置有一微孔，使得該探針貫穿該些微孔以電性連接該外部導電件。In a preferred embodiment, each of the first connection area and the second connection area of the external conductive element is provided with a micro hole, so that the probe penetrates the micro holes to electrically connect the external conductive element.

在一較佳實施例中，該外部導電件的該第一連接區設置於該第一導板與該間隔板之間，該外部導電件的該第二連接區設置於該第二導板與該間隔板之間。In a preferred embodiment, the first connection area of the external conductive element is disposed between the first guide plate and the spacer plate, and the second connection area of the external conductive element is disposed between the second guide plate and the spacer plate. Between the spacer plates.

在一較佳實施例中，該外部導電件包含一具有導電線路的一軟性電路板。In a preferred embodiment, the external conductive member includes a flexible circuit board with conductive circuits.

在一較佳實施例中，該間隔板包含一外表面；以及該外部導電件的該中間區設置於該間隔板的該外表面。In a preferred embodiment, the spacer plate includes an outer surface; and the middle area of the outer conductive member is disposed on the outer surface of the spacer plate.

在一較佳實施例中，該軟性電路板經由蝕刻、雷射切割、以及顯影其中之一的方法形成該些微孔，並且經由蝕刻、電鍍、以及濺鍍其中之一的方法形成該導電線路。In a preferred embodiment, the flexible circuit board is formed with the micro-holes by one of etching, laser cutting, and development, and the conductive circuit is formed by one of etching, electroplating, and sputtering .

在另一較佳實施例中，該外部導電件的該第一連接區以及該第二連接區各包含具有一導電表面的一板材，該外部導電件的該中間區包含一導體柱。In another preferred embodiment, the first connection area and the second connection area of the outer conductive element each include a plate having a conductive surface, and the middle area of the outer conductive element includes a conductor post.

在另一較佳實施例中，該導體柱貫通設置於該間隔板內；以及當該探針頭結構組裝時，該外部導電件的該第一連接區以及該第二連接區的該些板材的該些導電表面與該外部導電件的該導體柱接觸。In another preferred embodiment, the conductor post is arranged through the spacer plate; and when the probe head structure is assembled, the plates of the first connection area and the second connection area of the outer conductive member The conductive surfaces of are in contact with the conductor post of the outer conductive member.

在另一較佳實施例中，該些板材經由蝕刻以及雷射切割其中之一的方法形成該些微孔，並且經由蝕刻、電鍍、濺鍍、以及蒸鍍其中之一的方法形成該些板材的該些導電表面。In another preferred embodiment, the micro-holes are formed by one of etching and laser cutting on the plates, and the plates are formed by one of etching, electroplating, sputtering, and evaporation. These conductive surfaces.

相較於先前技術，本新型的探針頭結構在既有的探針尺寸設計下，利用該外部導電件並聯該探針，藉以分擔該探針在晶圓測試時的電流附載，使得該探針突破習知探針負載電流的能力。因此，本新型的探針頭結構在保有習知探針的力學吸收緩衝能力以及與晶圓作良好接觸的要求之外，同時減少其在通電測試時失效的風險。Compared with the prior art, the probe head structure of the present invention uses the external conductive element to connect the probe in parallel under the existing probe size design, so as to share the current loading of the probe during the wafer test, so that the probe The ability of the needle to break through the load current of the conventional probe. Therefore, the novel probe head structure not only maintains the mechanical absorption buffer capacity of the conventional probe and the requirement of making good contact with the wafer, but also reduces the risk of failure during power-on testing.

爲了讓本新型之上述及其他目的、特徵、優點能更明顯易懂，下文將特舉本新型較佳實施例，並配合所附圖式，作詳細說明如下。In order to make the above and other objectives, features, and advantages of the present invention more obvious and understandable, the following will specifically cite the preferred embodiments of the present invention, together with the drawings, and describe in detail as follows.

第一實施例First embodiment

請參照第1圖，第1圖顯示本新型之第一實施例之探針頭結構100之剖面示意圖。本新型第一實施例的探針頭結構100包含一第一導板110、一間隔板120、一第二導板130、以及一探針140。該第一導板110包含一第一通孔111。該間隔板120設置於該第一導板110的一側，並且包含一第二通孔121。該第二導板130設置於該間隔板120相對該第一導板110的另一側，並且包含一第三通孔131。該探針140貫穿該第一通孔111、該第二通孔121、以及該第三通孔131，並且包含一第一端部141以及相對該第一端部141的一第二端部142。該探針140的該第一端部141電性連接一測試裝置200，而該探針140的該第二端部142接觸一待檢測物300上多個待測電路310的其中之一。Please refer to FIG. 1. FIG. 1 shows a schematic cross-sectional view of the probe head structure 100 according to the first embodiment of the present invention. The probe head structure 100 of the first embodiment of the present invention includes a first guide plate 110, a spacer plate 120, a second guide plate 130, and a probe 140. The first guide plate 110 includes a first through hole 111. The spacer 120 is disposed on one side of the first guide plate 110 and includes a second through hole 121. The second guide plate 130 is disposed on the other side of the partition plate 120 opposite to the first guide plate 110 and includes a third through hole 131. The probe 140 penetrates the first through hole 111, the second through hole 121, and the third through hole 131, and includes a first end 141 and a second end 142 opposite to the first end 141 . The first end 141 of the probe 140 is electrically connected to a testing device 200, and the second end 142 of the probe 140 contacts one of a plurality of circuits to be tested 310 on a test object 300.

第1圖所示之探針頭結構僅為示例性結構，在實際實施時，該探針頭結構100還可能包含多個探針140，以利該測試裝置200經由多個探針140同時接觸該待測物300上多個待測電路310。同理，該探針頭結構100還可能包含更多導板，或是該些導板上包含更多通孔。如此一來，該探針頭結構100能設置多個探針140形成探針陣列。The probe head structure shown in FIG. 1 is only an exemplary structure. In actual implementation, the probe head structure 100 may also include a plurality of probes 140, so that the testing device 200 can be simultaneously contacted by the plurality of probes 140 There are a plurality of circuits 310 on the object under test 300. Similarly, the probe head structure 100 may also include more guide plates, or the guide plates may include more through holes. In this way, the probe head structure 100 can be provided with a plurality of probes 140 to form a probe array.

本新型第一實施例的探針頭結構100還包含一外部導電件150。該外部導電件150包含一第一連接區151、相對該第一連接區的一第二連接區152、以及介於該第一連接區151與該第二連接區152之間的一中間區153。The probe head structure 100 of the first embodiment of the present invention further includes an external conductive element 150. The external conductive element 150 includes a first connection area 151, a second connection area 152 opposite to the first connection area, and an intermediate area 153 between the first connection area 151 and the second connection area 152 .

具體來說，該外部導電件150包含一具有導電線路的一軟性電路板（flexible printed circuit，FPC）。該外部導電件150的該第一連接區151為該軟性電路板的一端，該外部導電件150的該第二連接區152為該軟性電路板的另一端，該外部導電件150的該中間區153即為該軟性電路板的兩端之間的部分。該軟性電路板位於該外部導電件150的該第一連接區151設置有一微孔1511；該軟性電路板位於該外部導電件150的該第二連接區152設置有另一微孔1521。該軟性電路板經由蝕刻、雷射切割、或是顯影等方法形成該些微孔1511、1521。該軟性電路板形成該些微孔1511、1521後，再經由蝕刻、電鍍、或是濺鍍等方法形成該導電線路。Specifically, the external conductive member 150 includes a flexible printed circuit (FPC) with conductive circuits. The first connection area 151 of the external conductive element 150 is one end of the flexible circuit board, the second connection area 152 of the external conductive element 150 is the other end of the flexible circuit board, and the middle area of the external conductive element 150 153 is the part between the two ends of the flexible circuit board. The flexible circuit board is located in the first connection area 151 of the outer conductive element 150 with a micro hole 1511; the flexible circuit board is located in the second connection area 152 of the outer conductive element 150 with another micro hole 1521. The flexible circuit board is formed with the micro holes 1511 and 1521 through etching, laser cutting, or development. After forming the micro holes 1511 and 1521 on the flexible circuit board, the conductive circuit is formed by etching, electroplating, or sputtering.

該探針140設置在該探針頭裝置100時，將會貫穿該第一通孔111、該第二通孔121、以及該第三通孔131，也同時會貫穿該些微孔1511、1521。該微孔1511電性連接該探針140的該第一端部141靠近該第一導板110處；該微孔1521電性連接該探針140的該第二端部142靠近該第二導板130處。最後，將使得該探針140的該第一端部141靠近該第一導板110處經由該外部導電件150電性連接該探針140的該第二端部142靠近該第二導板130處。也就是說，在該探針140的該第一端部141以及該第二端部142之間，本新型的該探針頭裝置100利用該外部導電件150的該軟性電路板並聯該探針140，藉以分擔該探針140在晶圓測試時的電流附載，使得該探針140突破習知探針負載電流的能力。When the probe 140 is installed in the probe head device 100, it will penetrate the first through hole 111, the second through hole 121, and the third through hole 131, and will also penetrate the micro holes 1511, 1521. . The microhole 1511 is electrically connected to the first end 141 of the probe 140 near the first guide plate 110; the microhole 1521 is electrically connected to the second end 142 of the probe 140 near the second guide Board 130 places. Finally, the first end 141 of the probe 140 close to the first guide plate 110 is electrically connected to the second end 142 of the probe 140 close to the second guide plate 130 via the external conductive member 150 Place. That is, between the first end 141 and the second end 142 of the probe 140, the probe head device 100 of the present invention uses the flexible circuit board of the external conductive member 150 to connect the probe in parallel 140. In order to share the current loading of the probe 140 during wafer testing, the probe 140 can break through the current load capacity of the conventional probe.

更進一步地說，該外部導電件150的該第一連接區151設置於該第一導板110與該間隔板120之間；該外部導電件150的該第二連接區152設置於該第二導板130與該間隔板120之間；同時，該間隔板120包含一外表面。該外部導電件150的該中間區153設置於該間隔板120的該外表面。換句話說，該軟性電路板與該探針140的該第一端部141以該微孔1511電性連接後，自該間隔板120的該第二通孔121靠近該探針140的該第一端部141的位置向該間隔板120的該外表面繞出。接著，該軟性電路板再自該間隔板120的該外表面繞進該間隔板120的該第二通孔121靠近該探針140的該第二端部142的位置，並且以該微孔1521電性連接該探針140的該第二端部142。Furthermore, the first connection area 151 of the outer conductive element 150 is disposed between the first guide plate 110 and the spacer 120; the second connection area 152 of the outer conductive element 150 is disposed on the second Between the guide plate 130 and the spacer plate 120; meanwhile, the spacer plate 120 includes an outer surface. The middle area 153 of the outer conductive member 150 is disposed on the outer surface of the spacer 120. In other words, after the flexible circuit board and the first end 141 of the probe 140 are electrically connected by the microhole 1511, the second through hole 121 of the spacer 120 is close to the first end 141 of the probe 140 The position of the one end 141 goes out to the outer surface of the partition plate 120. Then, the flexible circuit board is wound from the outer surface of the spacer plate 120 into the second through hole 121 of the spacer plate 120 near the second end 142 of the probe 140, and uses the micro hole 1521 The second end 142 of the probe 140 is electrically connected.

第二實施例Second embodiment

請參照第2圖，第2圖顯示本新型之第二實施例之探針頭結構100之剖面示意圖。本新型第二實施例的探針頭結構100包含一第一導板110、一間隔板120、一第二導板130、以及一探針140。該第一導板110包含一第一通孔111。該間隔板120設置於該第一導板110的一側，並且包含一第二通孔121。該第二導板130設置於該間隔板120相對該第一導板110的另一側，並且包含一第三通孔131。該探針140貫穿該第一通孔111、該第二通孔121、以及該第三通孔131，並且包含一第一端部141以及相對該第一端部141的一第二端部142。該探針140的該第一端部141電性連接一測試裝置200，而該探針140的該第二端部142接觸一待檢測物300上多個待測電路310的其中之一。Please refer to FIG. 2. FIG. 2 shows a schematic cross-sectional view of the probe head structure 100 according to the second embodiment of the present invention. The probe head structure 100 of the second embodiment of the present invention includes a first guide plate 110, a spacer plate 120, a second guide plate 130, and a probe 140. The first guide plate 110 includes a first through hole 111. The spacer 120 is disposed on one side of the first guide plate 110 and includes a second through hole 121. The second guide plate 130 is disposed on the other side of the partition plate 120 opposite to the first guide plate 110 and includes a third through hole 131. The probe 140 penetrates the first through hole 111, the second through hole 121, and the third through hole 131, and includes a first end 141 and a second end 142 opposite to the first end 141 . The first end 141 of the probe 140 is electrically connected to a testing device 200, and the second end 142 of the probe 140 contacts one of a plurality of circuits to be tested 310 on a test object 300.

第2圖所示之探針頭結構僅為示例性結構，在實際實施時，該探針頭結構100還可能包含多個探針140，以利該測試裝置200經由多個探針140同時接觸該待測物300上多個待測電路310。同理，該探針頭結構100還可能包含更多導板，或是該些導板上包含更多通孔。如此一來，該探針頭結構100能設置多個探針140形成探針陣列。The probe head structure shown in FIG. 2 is only an exemplary structure. In actual implementation, the probe head structure 100 may also include a plurality of probes 140, so that the testing device 200 can be simultaneously contacted by the plurality of probes 140 There are a plurality of circuits 310 on the object under test 300. Similarly, the probe head structure 100 may also include more guide plates, or the guide plates may include more through holes. In this way, the probe head structure 100 can be provided with a plurality of probes 140 to form a probe array.

本新型第二實施例的探針頭結構100還包含一外部導電件150。該外部導電件150包含一第一連接區151、相對該第一連接區的一第二連接區152、以及介於該第一連接區151與該第二連接區152之間的一中間區153。The probe head structure 100 of the second embodiment of the present invention further includes an external conductive element 150. The outer conductive member 150 includes a first connection area 151, a second connection area 152 opposite to the first connection area, and an intermediate area 153 between the first connection area 151 and the second connection area 152 .

具體來說，該外部導電件150的該第一連接區151以及該第二連接區152各包含具有一導電表面的一板材。該外部導電件150的該中間區153包含一導體柱。該些板材可以為銅板、具有銅面的硬質結合板、或是具有銅面的陶瓷板；該導體柱可以為銅柱。在本實施例中，以該些板材為陶瓷板以及該導體柱為銅柱做示例性說明。位於該外部導電件150的該第一連接區151以及該第二連接區152的陶瓷板，可經由其上設置的導電表面與位於該中間區153的該銅柱互相接觸以電性連接。位於該外部導電件150的該第一連接區151的該陶瓷板設置有一微孔1511；位於該外部導電件150的該第二連接區152的該陶瓷板設置有另一微孔1521。該些陶瓷板經由蝕刻或是雷射切割等方法形成該些微孔1511、1521。該些陶瓷板形成該些微孔1511、1521後，再經由蝕刻、電鍍、濺鍍、或是蒸鍍等方法形成該導電表面。Specifically, the first connection area 151 and the second connection area 152 of the outer conductive element 150 each include a plate with a conductive surface. The middle region 153 of the outer conductive member 150 includes a conductive post. The plates can be copper plates, hard bonding plates with copper surfaces, or ceramic plates with copper surfaces; the conductor posts can be copper posts. In this embodiment, the plates are ceramic plates and the conductor pillars are copper pillars for example. The ceramic plates of the first connection area 151 and the second connection area 152 of the outer conductive element 150 can contact the copper pillars of the middle area 153 via a conductive surface provided thereon to be electrically connected. The ceramic plate located in the first connection area 151 of the outer conductive member 150 is provided with a micro hole 1511; the ceramic plate located in the second connection area 152 of the outer conductive member 150 is provided with another micro hole 1521. The micro holes 1511 and 1521 are formed on the ceramic plates by etching or laser cutting. After the microholes 1511 and 1521 are formed on the ceramic plates, the conductive surface is formed by etching, electroplating, sputtering, or evaporation.

該探針140設置在該探針頭裝置100時，將會貫穿該第一通孔111、該第二通孔121、以及該第三通孔131，也同時會貫穿該些微孔1511、1521。該微孔1511電性連接該探針140的該第一端部141靠近該第一導板110處；該微孔1521電性連接該探針140的該第二端部142靠近該第二導板130處。最後，將使得該探針140的該第一端部141靠近該第一導板110處經由該外部導電件150電性連接該探針140的該第二端部142靠近該第二導板130處。也就是說，在該探針140的該第一端部141以及該第二端部142之間，本新型的該探針頭裝置100利用該外部導電件150的該些陶瓷板以及該銅柱並聯該探針140，藉以分擔該探針140在晶圓測試時的電流附載，使得該探針140突破習知探針負載電流的能力。When the probe 140 is installed in the probe head device 100, it will penetrate the first through hole 111, the second through hole 121, and the third through hole 131, and will also penetrate the micro holes 1511, 1521. . The microhole 1511 is electrically connected to the first end 141 of the probe 140 near the first guide plate 110; the microhole 1521 is electrically connected to the second end 142 of the probe 140 near the second guide Board 130 places. Finally, the first end 141 of the probe 140 close to the first guide plate 110 is electrically connected to the second end 142 of the probe 140 close to the second guide plate 130 via the external conductive member 150 Place. That is, between the first end 141 and the second end 142 of the probe 140, the probe head device 100 of the present invention uses the ceramic plates of the external conductive member 150 and the copper pillar The probe 140 is connected in parallel to share the current loading of the probe 140 during the wafer test, so that the probe 140 can break through the current load capacity of the conventional probe.

更進一步地說，一陶瓷板位於該外部導電件150的該第一連接區151設置於該第一導板110與該間隔板120之間；另一陶瓷板位於該外部導電件150的該第二連接區152設置於該第二導板130與該間隔板120之間；同時，該銅柱貫通設置於該間隔板120內。換句話說，本新型第二實施例的探針頭結構100在進行疊層組裝時，位於該外部導電件150的該第一連接區151的該陶瓷板與該探針140的該第一端部141以該微孔1511電性連接後，其導電表面會接觸該外部導電件150的該銅柱的一端；位於該外部導電件150的該第二連接區152的該陶瓷板上的導電表面會接觸該外部導電件150的該銅柱的另一端，最後再與該探針140的該第二端部142以該微孔1521電性連接。More specifically, a ceramic plate is located at the first connection area 151 of the external conductive member 150 and is disposed between the first guide plate 110 and the spacer plate 120; another ceramic plate is located at the first connection area of the external conductive member 150. The two connecting areas 152 are arranged between the second guide plate 130 and the spacer plate 120; meanwhile, the copper pillar is penetrated and arranged in the spacer plate 120. In other words, when the probe head structure 100 of the second embodiment of the present invention is laminated and assembled, the ceramic plate of the first connection area 151 of the outer conductive member 150 and the first end of the probe 140 After the portion 141 is electrically connected with the microhole 1511, its conductive surface will contact one end of the copper pillar of the external conductive element 150; the conductive surface of the ceramic plate located in the second connection area 152 of the external conductive element 150 The other end of the copper pillar contacting the external conductive element 150 is finally electrically connected to the second end 142 of the probe 140 through the microhole 1521.

在本新型第一實施例以及第二實施例的探針頭結構100中，一般所使用的該探針140直徑或寬度大約為50～100 um，而該外部導電件150的寬度設定大約為1 mm以上。也就是說，該外部導電件150的截面積遠大於該探針140的截面積。因此，當該探針頭結構100通電運作時，截面積較大的該外部導電件150電阻較低，而其所能夠負載的電流便大於該探針140所能夠負載的電流，甚至能夠突破至1安培以上。In the probe head structure 100 of the first embodiment and the second embodiment of the present invention, the diameter or width of the probe 140 generally used is about 50-100 um, and the width of the outer conductive member 150 is set to about 1 mm above. In other words, the cross-sectional area of the external conductive member 150 is much larger than the cross-sectional area of the probe 140. Therefore, when the probe head structure 100 is energized, the resistance of the external conductive member 150 with a larger cross-sectional area is lower, and the current that it can load is greater than the current that the probe 140 can load, and it can even reach More than 1 ampere.

並且，在高電流的晶圓測試環境下，時常伴隨著高熱能。透過該外部導電件150的設計，除了能夠達成該探針140電流分流的功效外，也能實現熱能分流的功效。如此一來，大幅降低該探針140所必須承受的電流量與熱能，以延長該探針140的使用壽命。Moreover, in the high-current wafer test environment, high thermal energy is often accompanied. Through the design of the external conductive member 150, in addition to the current shunting effect of the probe 140, the heat energy shunting effect can also be achieved. In this way, the amount of current and heat that the probe 140 must bear is greatly reduced, so as to extend the service life of the probe 140.

綜上所述，本新型的探針頭結構在既有的探針尺寸設計下，利用該外部導電件並聯該探針，藉以分擔該探針在晶圓測試時的電流附載，使得該探針突破習知探針負載電流的能力。因此，本新型的探針頭結構在保有習知探針的力學吸收緩衝能力以及與晶圓作良好接觸的要求之外，同時減少其在通電測試時失效的風險。In summary, under the existing probe size design, the probe head structure of the present invention uses the external conductive element to connect the probe in parallel, thereby sharing the current loading of the probe during wafer testing, so that the probe Break through the ability of conventional probes to load current. Therefore, the novel probe head structure not only maintains the mechanical absorption buffer capacity of the conventional probe and the requirement of making good contact with the wafer, but also reduces the risk of failure during power-on testing.

以上僅是本新型的較佳實施方式，應當指出，對於所屬領域技術人員，在不脫離本新型原理的前提下，還可以做出若干改進和潤飾，這些改進和潤飾也應視爲本新型的保護範圍。The above are only preferred embodiments of the present invention. It should be pointed out that for those skilled in the art, without departing from the principles of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the present invention. protected range.

100:探針頭結構 110:第一導板 111:第一通孔 120:間隔板 121:第二通孔 130:第二導板 131:第三通孔 140:探針 141:第一端部 142:第二端部 150:外部導電件 151:第一連接區 1511:微孔 152:第二連接區 1521:微孔 153:中間區 200:測試裝置 300:待測物 310:待測電路 100: Probe head structure 110: The first guide 111: first through hole 120: Spacer 121: second through hole 130: second guide plate 131: third through hole 140: Probe 141: first end 142: second end 150: External conductive parts 151: first connection zone 1511: Micropore 152: second connection area 1521: Micropore 153: Middle Zone 200: test device 300: DUT 310: circuit under test

［圖1］為本新型之第一實施例之探針頭結構之剖面示意圖。［圖2］為本新型之第二實施例之探針頭結構之剖面示意圖。 [Figure 1] is a schematic cross-sectional view of the probe head structure of the first embodiment of the new type. [Figure 2] is a schematic cross-sectional view of the probe head structure of the second embodiment of the new type.

100:探針頭結構 100: Probe head structure

110:第一導板 110: The first guide

111:第一通孔 111: first through hole

120:間隔板 120: Spacer

121:第二通孔 121: second through hole

130:第二導板 130: second guide plate

131:第三通孔 131: third through hole

140:探針 140: Probe

141:第一端部 141: first end

142:第二端部 142: second end

150:外部導電件 150: External conductive parts

151:第一連接區 151: first connection zone

1511:微孔 1511: Micropore

152:第二連接區 152: second connection area

1521:微孔 1521: Micropore

153:中間區 153: Middle Zone

200:測試裝置 200: test device

300:待測物 300: DUT

310:待測電路 310: circuit under test

Claims

一種探針頭結構，包含：一第一導板，包含一第一通孔；一間隔板，設置於該第一導板的一側，並且包含一第二通孔；一第二導板，設置於該間隔板相對該第一導板的另一側，並且包含一第三通孔；一探針，貫穿該第一通孔、該第二通孔、以及該第三通孔，並且包含一第一端部以及相對該第一端部的一第二端部，該第一端部電性連接一測試裝置，該第二端部接觸一待檢測物；以及一外部導電件，該外部導電件的一端電性連接該探針的該第一端部靠近該第一導板處，該外部導電件的另一端電性連接該探針的該第二端部靠近該第二導板處，使得該探針的該第一端部靠近該第一導板處經由該外部導電件電性連接該探針的該第二端部靠近該第二導板處；其中，當該探針頭結構通電運作時，該外部導電件負載的電流大於該探針負載的電流。 A probe head structure, including: A first guide plate including a first through hole; A spacer plate, which is arranged on one side of the first guide plate and includes a second through hole; A second guide plate disposed on the other side of the spacer plate opposite to the first guide plate and including a third through hole; A probe penetrating the first through hole, the second through hole, and the third through hole, and includes a first end and a second end opposite to the first end, the first end Electrically connected to a testing device, the second end contacting an object to be tested; and An external conductive element, one end of the external conductive element is electrically connected to the first end of the probe near the first guide plate, and the other end of the external conductive element is electrically connected to the second end of the probe Near the second guide plate, so that the first end of the probe near the first guide plate is electrically connected to the second end of the probe near the second guide plate through the external conductive member; Wherein, when the probe head structure is powered on, the current loaded by the external conductive element is greater than the current loaded by the probe.

如請求項1之探針頭結構，其中，該外部導電件包含一第一連接區、相對該第一連接區的一第二連接區、以及介於該第一連接區與該第二連接區之間的一中間區；以及該外部導電件的該第一連接區電性連接該探針的該第一端部靠近該第一導板處，該外部導電件的該第二連接區電性連接該探針的該第二端部靠近該第二導板處。The probe head structure of claim 1, wherein the external conductive member includes a first connection area, a second connection area opposite to the first connection area, and between the first connection area and the second connection area And the first connection area of the outer conductive element is electrically connected to the first end of the probe near the first guide plate, and the second connection area of the outer conductive element is electrically connected The second end connected to the probe is close to the second guide plate.

如請求項2之探針頭結構，其中，該外部導電件的該第一連接區以及該第二連接區各設置有一微孔，使得該探針貫穿該些微孔以電性連接該外部導電件。Such as the probe head structure of claim 2, wherein each of the first connection area and the second connection area of the external conductive member is provided with a micro hole, so that the probe penetrates the micro holes to electrically connect the external conductive member Pieces.

如請求項3之探針頭結構，其中，該外部導電件的該第一連接區設置於該第一導板與該間隔板之間，該外部導電件的該第二連接區設置於該第二導板與該間隔板之間。Such as the probe head structure of claim 3, wherein the first connection area of the external conductive element is disposed between the first guide plate and the spacer plate, and the second connection area of the external conductive element is disposed on the first Between the second guide plate and the spacer plate.

如請求項4之探針頭結構，其中，該外部導電件包含一具有導電線路的一軟性電路板。Such as the probe head structure of claim 4, wherein the external conductive member includes a flexible circuit board with conductive circuits.

如請求項5之探針頭結構，其中，該間隔板包含一外表面；以及該外部導電件的該中間區設置於該間隔板的該外表面。The probe head structure of claim 5, wherein the spacer plate includes an outer surface; and the intermediate region of the outer conductive member is disposed on the outer surface of the spacer plate.

如請求項5之探針頭結構，其中，該軟性電路板經由蝕刻、雷射切割、以及顯影其中之一的方法形成該些微孔，並且經由蝕刻、電鍍、以及濺鍍其中之一的方法形成該導電線路。The probe head structure of claim 5, wherein the flexible circuit board is formed with the micro-holes through one of etching, laser cutting, and development, and through one of etching, electroplating, and sputtering The conductive line is formed.

如請求項4之探針頭結構，其中，該外部導電件的該第一連接區以及該第二連接區各包含具有一導電表面的一板材，該外部導電件的該中間區包含一導體柱。The probe head structure of claim 4, wherein the first connection area and the second connection area of the outer conductive member each include a plate having a conductive surface, and the middle area of the outer conductive member includes a conductor post .

如請求項8之探針頭結構，其中，該導體柱貫通設置於該間隔板內；以及當該探針頭結構組裝時，該外部導電件的該第一連接區以及該第二連接區的該些板材的該些導電表面與該外部導電件的該導體柱接觸。Such as the probe head structure of claim 8, wherein the conductor post is penetrated in the spacer plate; and when the probe head structure is assembled, the first connection area and the second connection area of the external conductive member The conductive surfaces of the plates are in contact with the conductor post of the outer conductive member.

如請求項8之探針頭結構，其中，該些板材經由蝕刻以及雷射切割其中之一的方法形成該些微孔，並且經由蝕刻、電鍍、濺鍍、以及蒸鍍其中之一的方法形成該些板材的該些導電表面。Such as the probe head structure of claim 8, wherein the plates are formed by one of etching and laser cutting to form the micro holes, and are formed by one of etching, electroplating, sputtering, and evaporation The conductive surfaces of the plates.