TWM603129U - Touch device - Google Patents
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- TWM603129U TWM603129U TW109203389U TW109203389U TWM603129U TW M603129 U TWM603129 U TW M603129U TW 109203389 U TW109203389 U TW 109203389U TW 109203389 U TW109203389 U TW 109203389U TW M603129 U TWM603129 U TW M603129U
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04166—Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
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Abstract
Description
本創作係關於觸控面板的應用,尤指一種觸控裝置。 This creation is about the application of touch panels, especially a touch device.
具備影像顯示以及進行觸控輸入等功能,觸控面板已經成為日常生活中不可或缺的科技應用。除了智慧型手機、平板等小尺寸的觸控裝置,近年來大尺寸的觸控裝置也在市場上佔有一席之地,舉例來說,百貨公司、大賣場通常會設置大型看板以供顧客查詢促銷活動或樓層資訊,然而在觸控的應用上,大尺寸比小尺寸觸控面板遭遇更多設計上的瓶頸,諸如所產生的觸控訊號的訊雜比(Signal-to-Noise Ratio,SNR)不足,導致觸控功能在判別上不夠精確,以及功率消耗不平均,導致觸控IC效率不佳等問題。 With functions such as image display and touch input, touch panels have become an indispensable technology application in daily life. In addition to small-sized touch devices such as smart phones and tablets, large-sized touch devices have also taken a place in the market in recent years. For example, department stores and hypermarkets usually set up large signages for customers to inquire about promotional activities or Floor information. However, in touch applications, large-size touch panels encounter more design bottlenecks than small-size touch panels, such as insufficient Signal-to-Noise Ratio (SNR) of the generated touch signals. As a result, the touch function is not accurate enough to distinguish, and the power consumption is uneven, leading to problems such as poor efficiency of the touch IC.
綜上所述,實有需要一種新穎的設計來改善觸控裝置的訊雜比及功率消耗不平均問題,進而改善大尺寸觸控面板的觸控準確度及優化觸控IC效率。 In summary, there is a need for a novel design to improve the signal-to-noise ratio and uneven power consumption of touch devices, thereby improving the touch accuracy of large-size touch panels and optimizing the efficiency of touch ICs.
本創作的目的之一在於提供一種觸控裝置,以改善上述先前技術所遭遇的問題。 One of the objectives of this creation is to provide a touch device to improve the above-mentioned problems encountered in the prior art.
本創作的一實施例提供了一種觸控裝置,其包含一觸控面板、多個晶片以及一處理電路。該觸控面板包含複數條傳送電極作為發射端以及複數條 接收電極作為接收端,且該處理電路受配置以進行以下操作:控制該些晶片分別於一預定時段內傳送至少一筆MxN驅動訊號給觸控裝置中至少一部份的傳送電極,其中M代表位元數,N代表時間長度;控制該些晶片在該預定時段內接收觸控裝置的至少一部份接收電極所偵測到的觸控感測訊號。 An embodiment of the present invention provides a touch device including a touch panel, multiple chips, and a processing circuit. The touch panel includes a plurality of transmission electrodes as transmitting terminals and a plurality of The receiving electrode is used as a receiving end, and the processing circuit is configured to perform the following operations: controlling the chips to respectively transmit at least one MxN driving signal to at least a part of the transmitting electrodes in the touch device within a predetermined period of time, where M represents bit Yuan, N represents the length of time; control the chips to receive touch sensing signals detected by at least a part of the receiving electrodes of the touch device within the predetermined time period.
除了以上實施例,本創作的另一實施例還提供分碼多工(CDM)的餘數問題的解決方案。當畫面中全部傳送電極的數量不為CDM碼長的整數倍時(會導致單一接收電極於接收訊號時佔用更大的ADC動態範圍),針對這些傳送電極重新規劃一M×N範圍。例如,可納入前一個M×N矩陣中最後一或多個電極,亦即,當傳送電極群組內的傳送電極總數目不能被CDM碼長整除時,可以取其他TX群組(不限是否同一晶片的負責區域)之傳送電極,所取之傳送電極數目正好補足CDM碼長即可避免此問題。 In addition to the above embodiments, another embodiment of this creation also provides a solution to the remainder problem of Code Division Multiplexing (CDM). When the number of all transmitting electrodes in the screen is not an integer multiple of the CDM code length (which will cause a single receiving electrode to occupy a larger ADC dynamic range when receiving signals), a M×N range is re-planned for these transmitting electrodes. For example, the last one or more electrodes in the previous M×N matrix can be included, that is, when the total number of transmission electrodes in the transmission electrode group is not evenly divisible by the CDM code length, other TX groups can be selected (not limited to whether This problem can be avoided if the number of transfer electrodes in the responsible area of the same chip is just enough to complement the CDM code length.
200:處理電路的執行事項 200: Processing circuit execution matters
202,204,206:步驟 202,204,206: steps
100:觸控裝置 100: Touch device
110:觸控面板 110: Touch panel
120:處理電路 120: Processing circuit
131,132,133,134,135,136,137,138,181,182,183,184,185:波形 131,132,133,134,135,136,137,138,181,182,183,184,185: Waveform
DIE_1~DIE_K:晶片 DIE_1~DIE_K: chip
TX0~TX7:傳送電極 TX0~TX7: transmission electrode
RX0~RX(L):接收電極 RX0~RX(L): receiving electrode
第1圖係為本創作觸控裝置的示意圖。 Figure 1 is a schematic diagram of the creative touch device.
第2圖係為第1圖中觸控面板的結構圖。 Figure 2 is a structural diagram of the touch panel in Figure 1.
第3圖係為處理電路控制晶片傳送驅動訊號給傳送電極的時序圖。 Figure 3 is a timing diagram of the processing circuit controlling the chip to transmit driving signals to the transmitting electrodes.
第4圖係為根據本創作一實施例的處理電路控制傳送電極發出訊號的時序圖。 FIG. 4 is a timing diagram of the processing circuit controlling the transmitting electrode to emit signals according to an embodiment of the invention.
第5圖係為根據本創作一實施例的處理電路控制傳送電極發出訊號的時序圖。 FIG. 5 is a timing diagram of the processing circuit controlling the transmitting electrode to emit signals according to an embodiment of the invention.
第6圖係為根據本創作一實施例的處理電路控制傳送電極發出訊號的時序圖。 FIG. 6 is a timing diagram of the processing circuit controlling the transmitting electrode to emit signals according to an embodiment of the invention.
第7圖係為根據本創作一實施例的處理電路控制傳送電極發出訊號的時序圖。 FIG. 7 is a timing diagram of the processing circuit controlling the transmitting electrode to emit signals according to an embodiment of the invention.
第8圖係為根據本創作一實施例的處理電路控制傳送電極發出訊號的時序圖。 FIG. 8 is a timing diagram of the processing circuit controlling the transmitting electrode to emit signals according to an embodiment of the invention.
第9圖係為根據本創作一實施例的處理電路控制傳送電極發出訊號的時序圖。 FIG. 9 is a timing diagram of the processing circuit controlling the transmitting electrode to emit signals according to an embodiment of the invention.
第10圖係為根據本創作一實施例的處理電路控制傳送電極發出訊號的時序圖。 FIG. 10 is a timing diagram of the processing circuit controlling the transmitting electrode to emit signals according to an embodiment of the invention.
第11圖係為根據本創作一實施例的處理電路控制傳送電極發出訊號的時序圖。 FIG. 11 is a timing diagram of the processing circuit controlling the transmitting electrode to emit signals according to an embodiment of the invention.
第12圖係為根據本創作一實施例的處理電路控制傳送電極發出訊號的時序圖。 Figure 12 is a timing diagram of the processing circuit controlling the transmitting electrode to emit signals according to an embodiment of the invention.
第13A圖係為對應多根電極所發出的訊號準位的相位圖。 Figure 13A is a phase diagram corresponding to the signal levels emitted by multiple electrodes.
第13B圖係為對應第13A圖的波形圖。 Figure 13B is a waveform diagram corresponding to Figure 13A.
第14圖係為遠近通道的增益比例的示意圖。 Figure 14 is a schematic diagram of the gain ratio of the far and near channels.
第15圖係為對應遠近通道增益比例的調整權重的示意圖。 Figure 15 is a schematic diagram of the adjustment weight corresponding to the gain ratio of the far and near channels.
第16圖示意了先前技術未施以本創作FDM結合CDM重分佈方案的訊號強度衰減情形。 Figure 16 illustrates the signal strength attenuation of the original FDM combined with CDM redistribution scheme in the prior art.
第17圖示意了本創作FDM結合CDM重分佈方案的訊號強度衰減情形。 Figure 17 shows the attenuation of the signal strength of the creative FDM combined with the CDM redistribution scheme.
第18圖示意了相鄰TX群組具有相同或相異極性。 Figure 18 shows that adjacent TX groups have the same or different polarities.
第19圖示意了本創作改善非理想電容效應的方案。 Figure 19 shows the proposal of this creation to improve the non-ideal capacitance effect.
第20圖係為根據本創作的一實施例的處理電路的執行事項的示意圖。 FIG. 20 is a schematic diagram of the execution items of the processing circuit according to an embodiment of the present creation.
在說明書及後續的申請專利範圍當中使用了某些詞彙來指稱特定的元件。所屬領域中具有通常知識者應可理解,硬體製造商可能會用不同的名詞來稱呼同樣的元件。本說明書及後續的申請專利範圍並不以名稱的差異來作為區分元件的方式,而是以元件在功能上的差異來作為區分的準則。在通篇說明書及後續的請求項當中所提及的「包含」係為一開放式的用語,故應解釋成「包含但不限定於」。另外,「耦接」一詞在此係包含任何直接及間接的電氣連接手段。因此,若文中描述一第一裝置耦接於一第二裝置,則代表該第一裝置可直接電氣連接於該第二裝置,或透過其他裝置或連接手段間接地電氣連接至該第二裝置。 In the specification and subsequent patent applications, certain words are used to refer to specific elements. Those with general knowledge in the field should understand that hardware manufacturers may use different terms to refer to the same components. The scope of this specification and subsequent patent applications does not use differences in names as a way to distinguish elements, but uses differences in functions of elements as a criterion for distinguishing. The "include" mentioned in the entire manual and subsequent requests is an open term, so it should be interpreted as "include but not limited to". In addition, the term "coupling" here includes any direct and indirect electrical connection means. Therefore, if it is described that a first device is coupled to a second device, it means that the first device can be directly electrically connected to the second device, or indirectly electrically connected to the second device through other devices or connection means.
本創作的構想主要如下,並將於後續實施例逐一呈現: 1.單一時間內驅動的傳送電極(簡稱TX)總數越多,觸控面板的訊號傳輸可以得到好的雜訊比SNR;2.在同一段時間內驅動多個TX時,可加入分頻多工(Frequency Division Multiplexing,FDM)或分碼多工(Code Division Multiplexing,CDM)來優化SNR;3.若所要驅動的TX總數超過單一IC可用的TX時,可並聯多顆IC來駕馭大量的TX;4.採用FDM或CDM時,可以讓同時驅動的多個TX分散地交由各顆IC來執行,如此可降低單一IC對功耗的需求;5.同時驅動的TX可以採取交錯分佈(Interlace),可以減輕TX驅動的動態負載電容,也可以減輕軟體/韌體在排程上的需求。 The main ideas of this creation are as follows, and will be presented one by one in subsequent embodiments: 1. The more the total number of transmission electrodes (TX for short) driven in a single time, the better the noise ratio SNR of the touch panel signal transmission; 2. When driving multiple TXs in the same period of time, more frequency divisions can be added Frequency Division Multiplexing (FDM) or Code Division Multiplexing (CDM) to optimize SNR; 3. If the total number of TX to be driven exceeds the TX available for a single IC, multiple ICs can be connected in parallel to control a large number of TX 4. When using FDM or CDM, multiple TXs that are driven at the same time can be distributed to each IC for execution, which can reduce the demand for power consumption of a single IC; 5. TXs that are driven at the same time can adopt interlace distribution (Interlace ), which can reduce the dynamic load capacitance of the TX driver, and also reduce the software/firmware scheduling requirements.
請參考第1圖,第1圖係為本創作觸控裝置100的示意圖,其包含一觸控面板110、一處理電路120,其中處理電路120包含多個晶片(或稱為積體電路,即IC),諸如DIE_1~DIE_K。一般而言,隨著面板尺寸的增加,需要運用更多的晶片來進行多工處理。進一步參考第2圖,第2圖係為第1圖中觸控面板110的結構圖,觸控面板110包含複數條傳送電極TX0~TX7(以及未繪出的更多傳送電極)作為發射端以及複數條接收電極RX0~RX(L)作為接收端,其中該些傳送電極可為行電極,該些接收電極則為列電極;或者,該些傳送電極可為列電極,該些接收電極則為行電極。
Please refer to Figure 1. Figure 1 is a schematic diagram of the
傳送電極用以接收驅動訊號,接收電極再偵測使用者的觸控行為,並產生觸控訊號,而為了取得更好的訊雜比,本創作採用多晶片多工的方式來增進效率,並可同時避免單晶片超載的問題。處理電路120會受配置以進行以下操作:控制晶片DIE_1~DIE_K分別於一預定時段內傳送至少一筆MxN驅動訊號
給觸控裝置100中至少一部份的傳送電極,其中M代表位元數,N代表時間長度;控制晶片DIE_1~DIE_K在該預定時段內接收觸控裝置100的至少一部份接收電極所偵測到的觸控感測訊號,具體的範例介紹如下。處理電路120與多個晶片之間的關係寬泛來說會有三種模式:一、處理電路120裡面包含多個晶片,這些多個晶片包含傳送晶片及接收晶片;二、處理電路120裡面只包含傳送晶片,接收晶片係獨立於處理電路120;三、處理電路120、傳送晶片、接收晶片皆各自獨立。
The transmitting electrode is used to receive the driving signal, and the receiving electrode detects the user's touch behavior and generates the touch signal. In order to obtain a better signal-to-noise ratio, this creation uses a multi-chip multiplexing method to improve efficiency. The problem of single chip overload can be avoided at the same time. The
第3圖係為處理電路控制晶片DIE_1~DIE_K傳送驅動訊號給傳送電極簡稱TX)的時序圖,其中橫軸代表時間,縱軸代表對應不同晶片的每一根傳送電極。為了便於瞭解,本範例以及之後的範例僅以四個晶片作舉例說明,然而本創作並不以此為限,在實作上當可包含更多或更少的晶片。如第3圖所示,晶片DIE_0負責第1~10根傳送電極,晶片DIE_1負責第11~20根傳送電極,晶片DIE_2負責第21~30根傳送電極,且晶片DIE_3負責第31~40根傳送電極,其中每一格時間單位僅有一根傳送電極發射訊號,且第1~40根傳送電極依序地發出訊號。在上述範例的前置基礎上,本創作以下實施例中將導入基於分時多工、分碼多工及/或分頻多工的技術,以得到更好的訊雜比SNR,並且使多顆晶片間的功耗分佈更均勻。 Figure 3 is a timing diagram of the processing circuit controlling the chips DIE_1~DIE_K to transmit driving signals to the transmission electrodes (TX), where the horizontal axis represents time, and the vertical axis represents each transmission electrode corresponding to different chips. For ease of understanding, this example and the following examples only use four chips as an example. However, this creation is not limited to this, and more or less chips can be included in practice. As shown in Figure 3, the chip DIE_0 is responsible for the 1st~10th transfer electrodes, the chip DIE_1 is responsible for the 11th~20th transfer electrodes, the chip DIE_2 is responsible for the 21st~30th transfer electrodes, and the chip DIE_3 is responsible for the 31st~40th transfer electrodes. Electrodes, in which only one transmission electrode emits signals in each unit of time, and the 1st to 40th transmission electrodes emit signals in sequence. On the basis of the foregoing example, the following embodiments of this creation will introduce technologies based on time division multiplexing, code division multiplexing and/or frequency division multiplexing to obtain a better signal-to-noise ratio SNR, and make more The power consumption distribution among the chips is more even.
第4圖係為根據本創作一實施例的處理電路控制晶片傳送驅動訊號給傳送電極(簡稱TX)的時序圖,其中橫軸代表時間,縱軸代表對應不同晶片的每一根傳送電極,其中第4圖的訊號傳送方式可被第1圖的觸控裝置100所採用。每一晶片中的傳送電極依照排序分為第一部份電極以及第二部份電極,其中第1~5根傳送電極被分類為第一部份電極,第6~10根傳送電極被分類為第二部份電極,然而這只是作為舉例的目的,在實作上,本創作並不限定一個晶片所對應的傳送電極數量,以及第一、第二部份電極所對應的傳送電極數量。
Figure 4 is a timing diagram of the processing circuit controlling the chip to transmit driving signals to the transmission electrodes (TX for short) according to an embodiment of the invention. The horizontal axis represents time, and the vertical axis represents each transmission electrode corresponding to different chips. The signal transmission method of FIG. 4 can be adopted by the
詳細來說,如第4圖所示,處理電路於第一時段(亦即第1~5個時間單位)中控制第一晶片DIE_0對所對應的第一部份電極(也就是觸控面板中由第一晶片DIE_0所負責管理的第一部份電極)傳送具有固定頻率的5×5訊號(在其他變化例中可以是任意的M×N訊號),於第二時段(亦即第6~10個時間單位,以此類推)中控制第一晶片DIE_0對所對應的第二部份電極傳送具有相同頻率的5×5訊號,於第三時段中控制第二晶片DIE_1對所對應的第一部份電極傳送具有相同頻率的5×5訊號,於第四時段中控制第二晶片DIE_1對所對應的第二部份電極傳送具有相同頻率的5×5訊號,於第五時段中控制第三晶片DIE_2對所對應的第一部份電極傳送具有相同頻率的5×5訊號,於第六時段中控制第三晶片DIE_2對所對應的第二部份電極傳送具有相同頻率的5×5訊號,於第七時段中控制第四晶片DIE_3對所對應的第一部份電極傳送具有相同頻率的5×5訊號,以及於第八時段中控制第四晶片DIE_3對所對應的第二部份電極傳送具有相同頻率的5×5訊號。透過上述作法,由於接收端是一次性地於5個時間單位內偵測使用者的觸控行為,並產生觸控訊號,再解聯立方程式,故相較於第3圖的作法可大幅增加訊號的訊雜比SNR。此外,因為任務已於不同時段被平均地分配給每個晶片,故可有效避免單一晶片負荷過重的情形。
In detail, as shown in Figure 4, the processing circuit controls the first part of the electrode corresponding to the first chip DIE_0 pair (that is, in the touch panel) in the first period (that is, the first to fifth time units). The first part of the electrode managed by the first chip DIE_0 transmits a 5×5 signal with a fixed frequency (in other variations, it can be any M×N signal), in the second period (that is, the 6th~ 10 time units, and so on) in the first chip DIE_0 pair corresponding to the second part of the electrode to transmit 5×5 signals with the same frequency, in the third time period, the second chip DIE_1 pair corresponding to the first Part of the electrodes transmit 5×5 signals with the same frequency. In the fourth period, the second chip DIE_1 is controlled to transmit 5×5 signals with the same frequency for the second portion of the electrodes. In the fifth period, the third is controlled. The chip DIE_2 transmits a 5×5 signal with the same frequency to the corresponding first part of the electrode, and controls the third chip DIE_2 to transmit a 5×5 signal with the same frequency to the corresponding second part of the electrode in the sixth period. Control the first part of the electrode corresponding to the fourth chip DIE_3 pair to transmit a 5×5 signal with the same frequency in the seventh period, and control the second part of the electrode corresponding to the fourth chip DIE_3 pair to transmit in the
第5圖係為根據本創作一實施例的處理電路控制晶片傳送驅動訊號給傳送電極(簡稱TX)的時序圖,其中橫軸代表時間,縱軸代表對應不同晶片的每一根傳送電極,其中第5圖的訊號傳送方式可被第1圖的觸控裝置100所採用。如第5圖所示,於第一時段中(亦即第1~5個時間單位,以此類推),處理電路控制第一晶片DIE_0對所對應的第一部份電極(亦即第1~5根傳送電極)傳送具有第一頻率的5×5訊號(如淺色區塊所示),以及控制第一晶片DIE_0對所對應的第二部份電極(亦即第6~10根傳送電極)傳送具有第二頻率的5×5訊號(如深色區塊所示),換言之,第一晶片DIE_0的10根傳送電極在第一時段中相當於
傳送了一10×5的訊號,但當中包含了兩種不同的頻率。接著,於第二時段中,處理電路控制第二晶片DIE_1對所對應的第一部份電極傳送具有第一頻率的5×5訊號,以及控制第二晶片DIE_1對所對應的第二部份電極傳送具有第二頻率的5×5訊號;於第三時段中,處理電路控制第三晶片DIE_2對所對應的第一部份電極傳送具有第一頻率的5×5訊號,以及控制第三晶片DIE_2對所對應的第二部份電極傳送具有第二頻率的5×5訊號;以及,於第四時段中,處理電路控制第四晶片DIE_3對所對應的第一部份電極傳送具有第一頻率的5×5訊號,以及控制第四晶片DIE_3對所對應的第二部份電極傳送具有第二頻率的5×5訊號。本實施例進一步導入分頻多工的操作,因而降低了掃描時間,故整體傳輸時間可以更為縮短,並且具有更好的訊雜比SNR。
Figure 5 is a timing diagram of the processing circuit controlling the chip to transmit driving signals to the transmission electrodes (TX for short) according to an embodiment of the invention. The horizontal axis represents time and the vertical axis represents each transmission electrode corresponding to different chips. The signal transmission method of FIG. 5 can be adopted by the
第6圖係為根據本創作一實施例的處理電路控制晶片傳送驅動訊號給傳送電極(簡稱TX)的時序圖,其中橫軸代表時間,縱軸代表對應不同晶片的每一根傳送電極,其中第6圖的訊號傳送方式可被第1圖的觸控裝置100所採用。如第6圖所示,於第一時段中(亦即第1~5個時間單位,以此類推),處理電路控制第一晶片DIE_0對所對應的第一部份電極傳送具有第一頻率的5×5訊號,以及控制第三晶片DIE_2對所對應的第一部份電極傳送具有第二頻率的5×5訊號;於第二時段中,處理電路控制第一晶片DIE_0對所對應的第二部份電極傳送具有第一頻率的5×5訊號,以及控制第三晶片DIE_2對所對應的第二部份電極傳送具有第二頻率的5×5訊號;於第三時段中,處理電路控制第二晶片DIE_1對所對應的第一部份電極傳送具有第一頻率的5×5訊號,以及控制該第四晶片DIE_3對所對應的第一部份電極傳送具有第二頻率的5×5訊號;最後,於第四時段中,處理電路控制第二晶片DIE_1對所對應的第二部份電極傳送具有第一頻率的5×5訊號,以及控制第四晶片DIE_3對所對應的第二部份電極傳送具有第二頻率的5×5訊號。相較於第5圖的實施例,本實施例同樣在同一時間發出10根傳送
電極、兩種不同頻率的訊號,但是不同頻率的訊號分別由不同晶片來負責,如此一來,濾波表現會因為分碼多工而提昇,整體掃描時間會因為分頻多工而減少,且每個晶片的功耗也更為平均,不會有單一晶片負荷過重的情形。簡單來說,第5圖的實施例中,單一晶片在同樣5個時間單位必須操作兩倍的傳送電極(亦即10根傳送電極),故可知第6圖的設計實可減少單一晶片的負擔。
Figure 6 is a timing diagram of the processing circuit controlling the chip to transmit driving signals to the transmission electrodes (TX for short) according to an embodiment of the invention. The horizontal axis represents time, and the vertical axis represents each transmission electrode corresponding to different chips. The signal transmission method of FIG. 6 can be adopted by the
第7圖係為根據本創作一實施例的處理電路控制晶片傳送驅動訊號給傳送電極(簡稱TX)的時序圖,其中橫軸代表時間,縱軸代表對應不同晶片的每一根傳送電極,其中第7圖的訊號傳送方式可被第1圖的觸控裝置100所採用。如第7圖所示,於第一時段中(亦即第1~10個時間單位,以此類推),處理電路控制第一晶片DIE_0對所對應的第一部份電極以及第二部份電極傳送具有第一頻率的10×10訊號;於第二時段中,處理電路控制第二晶片DIE_1對所對應的第一部份電極以及第二部份電極傳送具有第一頻率的10×10訊號;於第三時段中,處理電路控制第三晶片DIE_2對所對應的第一部份電極以及第二部份電極傳送具有第一頻率的10×10訊號;最後,於第四時段中,處理電路控制第四晶片DIE_3對所對應的第一部份電極以及第二部份電極傳送具有第一頻率的10×10訊號。相較於第4圖的實施例,本實施例的設計可在單一晶片足以負荷的情況下,同時驅動10根傳送電極,進而得到更好的訊雜比SNR。
Figure 7 is a timing diagram of the processing circuit controlling the chip to transmit drive signals to the transmission electrodes (TX for short) according to an embodiment of the invention. The horizontal axis represents time and the vertical axis represents each transmission electrode corresponding to different chips. The signal transmission method of FIG. 7 can be adopted by the
第8圖係為根據本創作一實施例的處理電路控制晶片傳送驅動訊號給傳送電極(簡稱TX)的時序圖,其中橫軸代表時間,縱軸代表對應不同晶片的每一根傳送電極,其中第8圖的訊號傳送方式可被第1圖的觸控裝置100所採用。如第8圖所示,於第一時段中(亦即第1~10個時間單位,以此類推),處理電路控制第一晶片DIE_0對所對應的第一部份電極傳送具有第一頻率的5×10訊號,以及控制第二晶片DIE_1對所對應的第一部份電極傳送具有第一頻率的5×10訊號;於第二時段中,處理電路控制第一晶片DIE_0對所對應的第二部份電極傳
送具有第一頻率的5×10訊號,以及控制第二晶片DIE_1對所對應的第二部份電極傳送具有第一頻率的5×10訊號;於第三時段中,處理電路控制第三晶片DIE_2對所對應的第一部份電極傳送具有第一頻率的5×10訊號,以及控制第四晶片DIE_3對所對應的第一部份電極傳送具有第一頻率的5×10訊號;最後,於第四時段中,處理電路控制第三晶片DIE_2對所對應的第二部份電極傳送具有第一頻率的5×10訊號,以及控制第四晶片DIE_3對所對應的第二部份電極傳送具有第一頻率的5×10訊號。相較於第7圖的實施例,本實施例同樣在同一時間單位內,將10根傳送電極分成兩種不同碼的訊號,不同碼的訊號分別由不同晶片來負責,如此一來,每個晶片的功耗會因為分碼多工更為平均,不會有單一晶片負荷過重的情形。
Figure 8 is a timing diagram of the processing circuit controlling the chip to transmit driving signals to the transmission electrodes (TX for short) according to an embodiment of the present creation. The horizontal axis represents time, and the vertical axis represents each transmission electrode corresponding to different chips. The signal transmission method of FIG. 8 can be adopted by the
第9圖係為根據本創作一實施例的處理電路控制晶片傳送驅動訊號給傳送電極(簡稱TX)的時序圖,其中橫軸代表時間,縱軸代表對應不同晶片的每一根傳送電極,其中第9圖的訊號傳送方式可被第1圖的觸控裝置100所採用。如第9圖所示,於第一時段中(亦即第1~10個時間單位,以此類推),處理電路控制第一晶片DIE_0對所對應的第一部份電極以及第二部份電極傳送具有第一頻率的10×10訊號,以及控制第三晶片DIE_2對所對應的第一部份電極以及第二部份電極傳送具有第二頻率的10×10訊號;以及,於第二時段中,處理電路控制第二晶片DIE_1對所對應的第一部份電極以及第二部份電極傳送具有第一頻率的10×10訊號,以及控制第四晶片DIE_3對所對應的第一部份電極以及第二部份電極傳送具有第二頻率的10×10訊號。相較於第7圖的實施例,本實施例在相同時間中可以發出兩種不同頻率的訊號,故能更進一步利用分頻多工,在不增加單一晶片負擔的情況下進一步降低掃描時間,且每個晶片的功耗也更為平均,不會有單一晶片負荷過重的情形。
Figure 9 is a timing diagram of the processing circuit controlling the chip to transmit driving signals to the transmission electrodes (TX for short) according to an embodiment of the invention. The horizontal axis represents time, and the vertical axis represents each transmission electrode corresponding to different chips. The signal transmission method of FIG. 9 can be adopted by the
第10圖係為根據本創作一實施例的處理電路控制晶片傳送驅動訊號
給傳送電極(簡稱TX)的時序圖,其中橫軸代表時間,縱軸代表對應不同晶片的每一根傳送電極,其中第10圖的訊號傳送方式可被第1圖的觸控裝置100所採用。如第10圖所示,於第一時段中(亦即第1~10個時間單位,以此類推),處理電路控制第一晶片DIE_0對所對應的第一部份電極傳送具有第一頻率的5×10訊號,控制第二晶片DIE_1對所對應的第一部份電極傳送具有第一頻率的5×10訊號,控制第三晶片DIE_2對所對應的第一部份電極傳送具有第二頻率的5×10訊號,控制第四晶片DIE_3對所對應的第一部份電極傳送具有第二頻率的5×10訊號;以及,於第二時段中,處理電路控制第一晶片DIE_0對所對應的第二部份電極傳送具有第一頻率的5×10訊號,控制第二晶片DIE_1對所對應的第二部份電極傳送具有第一頻率的5×10訊號,控制第三晶片DIE_2對所對應的第二部份電極傳送具有第二頻率的5×10訊號,控制第四晶片DIE_3對所對應的第二部份電極傳送具有第二頻率的5×10訊號。相較於第9圖的實施例,本實施例同樣在同一時間單位內,將10根傳送電極分成兩種不同碼的訊號,不同碼的訊號分別由不同晶片來負責,如此一來,每個晶片的功耗會因為分碼多工更為平均,不會有單一晶片負荷過重的情形。
Figure 10 is a processing circuit controlling chip to transmit driving signals according to an embodiment of the invention
A timing diagram for the transmission electrode (TX for short), where the horizontal axis represents time, and the vertical axis represents each transmission electrode corresponding to different chips. The signal transmission method in Figure 10 can be used by the
第11圖係為根據本創作一實施例的處理電路控制晶片傳送驅動訊號給傳送電極(簡稱TX)的時序圖,其中橫軸代表時間,縱軸代表對應不同晶片的每一根傳送電極,其中第11圖的訊號傳送方式可被第1圖的觸控裝置100所採用。如第11圖所示,於第一時段中(亦即第1~10個時間單位,以此類推),處理電路控制第一晶片DIE_0對所對應的所有電極中的奇數電極(亦即第1、3、5、7...根傳送電極)分別傳送具有第一頻率的1×10訊號,以及控制第二晶片DIE_1對所對應的所有電極中的奇數電極分別傳送具有第一頻率的1×10訊號;於第二時段中,處理電路控制第一晶片DIE_0對所對應的所有電極中的偶數電極(亦即第2、4、6、8...根傳送電極)分別傳送具有第一頻率的1×10訊號,以及控制第二
晶片DIE_1對所對應的所有電極中的偶數電極分別傳送具有第一頻率的1×10訊號;於第三時段中,處理電路控制第三晶片DIE_2對所對應的所有電極中的奇數電極分別傳送具有第一頻率的1×10訊號,以及控制第四晶片DIE_3對所對應的所有電極中的奇數電極分別傳送具有第一頻率的1×10訊號;最後,於第四時段中,處理電路控制第三晶片DIE_2對所對應的所有電極中的偶數電極分別傳送具有第一頻率的1×10訊號,以及控制第四晶片DIE_3對所對應的所有電極中的偶數電極分別傳送具有第一頻率的1×10訊號。然而本創作並不以此為限,處理電路亦可以於第一時段及第三時段控制偶數電極,於第二時段及第四時段控制奇數電極。相較於第8圖的實施例,本實施例的交錯(interlace)設計可以減輕相鄰電極的動態互電容負載,同時也能進一步降低軟體/韌體在排程上的負擔。
Figure 11 is a timing diagram of the processing circuit controlling the chip to transmit driving signals to the transmission electrodes (TX for short) according to an embodiment of the invention. The horizontal axis represents time, and the vertical axis represents each transmission electrode corresponding to different chips. The signal transmission method in FIG. 11 can be adopted by the
第12圖係為根據本創作一實施例的處理電路控制晶片傳送驅動訊號給傳送電極(簡稱TX)的時序圖,其中橫軸代表時間,縱軸代表對應不同晶片的每一根傳送電極,其中第12圖的訊號傳送方式可被第1圖的觸控裝置100所採用。如第12圖所示,於第一時段中(亦即第1~10個時間單位,以此類推),處理電路控制第一晶片DIE_0對所對應的所有電極中的奇數電極(亦即第1、3、5、7...根傳送電極)分別傳送具有第一頻率的1×10訊號,控制第二晶片DIE_1對所對應的所有電極中的奇數電極分別傳送具有第一頻率的1×10訊號,控制第三晶片DIE_2對所對應的所有電極中的奇數電極分別傳送具有第二頻率的1×10訊號,以及控制第四晶片DIE_3對所對應的所有電極中的奇數電極分別傳送具有第二頻率的1×10訊號;以及,於第二時段中,處理電路控制第一晶片DIE_0對所對應的所有電極中的偶數電極(亦即第2、4、6、8...根傳送電極)分別傳送具有第一頻率的1×10訊號,控制第二晶片DIE_1對所對應的所有電極中的偶數電極分別傳送具有第一頻率的1×10訊號,控制第三晶片DIE_2對所對應的所有電極中的偶數電極分別傳送具有第二頻率的1×10訊號,以及控制第四晶片DIE_3對所對應的
所有電極中的偶數電極分別傳送具有第二頻率的1×10訊號。然而本創作並不以此為限,處理電路亦可以於第一時段控制偶數電極,於第二時段控制奇數電極。相較於第11圖的實施例,本實施例進一步導入分頻多工的操作,因而降低了掃描時間,故整體傳輸時間可以更為縮短,並且具有更好的訊雜比SNR。
Figure 12 is a timing diagram of the processing circuit controlling the chip to transmit drive signals to the transmission electrodes (TX for short) according to an embodiment of the present creation. The horizontal axis represents time, and the vertical axis represents each transmission electrode corresponding to different chips. The signal transmission method of FIG. 12 can be adopted by the
請參考第13A圖和第13B圖,第13A圖係為對應8根電極(即傳送電極)所發出的訊號準位的相位圖,其中每一列由左至右代表一根傳送電極的訊號準位隨時間的變化,第13B圖係為對應第13A圖的波形圖,如波形131、132、133、134、135、136、137、138所示。在本範例中,分碼多工係同時驅動8根傳送電極,其中波形相位區分以"+"和"-"來表示,但本創作並不以此為限,所採用的單位矩陣可大於8個區段時間,亦可小於8個區段時間。 Please refer to Figure 13A and Figure 13B. Figure 13A is a phase diagram corresponding to the signal levels emitted by 8 electrodes (that is, transmitting electrodes). Each column represents the signal level of one transmitting electrode from left to right. As time changes, Figure 13B is a waveform diagram corresponding to Figure 13A, as shown in waveforms 131, 132, 133, 134, 135, 136, 137, and 138. In this example, the code division multiplexing system drives 8 transmission electrodes at the same time, and the waveform phase distinction is represented by "+" and "-", but this creation is not limited to this. The unit matrix used can be greater than 8. One segment time can also be less than 8 segment time.
當畫面中全部傳送電極的數量不為M的整數倍時,這會導致全部傳送電極中最後一或數條不能被M整除的傳送電極無法被規劃成一M×N矩陣,這會造成分碼多工(CDM)的餘數問題,也就是說,當總TX數目不為CDM碼長的整數倍時,會導致單一RX接收訊號佔用更多ADC動態範圍。此時,可針對這些傳送電極重新規劃一M×N範圍,例如,可納入前一個M×N矩陣中最後一或多個電極,亦即,當TX群組內的TX總數目不能被CDM碼長整除時,可以取其他TX群組(不限是否同一晶片的負責區域)之TX,所取之TX數目正好補足CDM碼長即可避免此問題。 When the number of transmission electrodes in the screen is not an integer multiple of M, this will cause the last one or several transmission electrodes that cannot be divisible by M to be unable to be planned into an M×N matrix, which will cause code division multiplexing ( CDM) remainder problem, that is, when the total TX number is not an integer multiple of the CDM code length, a single RX received signal will occupy more ADC dynamic range. At this time, an M×N range can be re-planned for these transmission electrodes. For example, the last one or more electrodes in the previous M×N matrix can be included, that is, when the total number of TX in the TX group cannot be coded by CDM When divisible by long, you can use the TX of other TX groups (not limited to the area of responsibility of the same chip), and the number of TXs selected can just complement the CDM code length to avoid this problem.
除了解決上述餘數問題,本創作亦著手於解決遠近場感應量不同的問題,舉例來說,同一支RX觀察來自不同TX的感應量會產生一梯度,這是因為面板走線阻抗導致:同樣待測的電容,近端TX的感應量較遠端TX的感應量大。如同第14圖所示,其中縱軸代表增益比例(Gain Ratio),橫軸由左至右代表第一根傳送電極至最後一根傳送電極。 In addition to solving the above-mentioned remainder problem, this creation also sets out to solve the problem of different inductances in the far and near fields. For example, the same RX will produce a gradient when observing the inductance from different TXs. This is caused by the impedance of the panel trace: For the measured capacitance, the inductance of the near-end TX is larger than that of the far-end TX. As shown in Figure 14, the vertical axis represents the gain ratio, and the horizontal axis represents the first transmission electrode to the last transmission electrode from left to right.
針對以上問題,本創作的一種解決方案是產生一對應的補償曲線, 其原理是任一TX到RX的通道的感應量會與驅動頻率有關,配合適當挑選驅動頻率可消除近遠端TX的差異。例如,一般而言低頻驅動訊號得到之感應量較大,高頻驅動訊號得到之感應量較小,故從面板近IC端至遠IC端可以採取由高而低的驅動頻率。所產生的補償曲線如第15圖所示,各TX間為純頻率分頻多工(Frequency Division Multiplexing,FDM),使得各TX到單一RX通道的振幅響應能夠被個別調整,即可以完全消除各TX間的感應量差異。換言之,處理電路根據每一驅動訊號對應之面板觸控位置與所傳送的晶片之間的距離,賦予該每一驅動訊號不同的驅動頻率而得到不同第一權重值,以均衡化近遠端傳送電極感應量的差異。上述範例並不限於單一根傳送電極TX,可以是不同群組採用不同頻率:短距離範圍內的TX差異不補償,但補償長距離之群組,可以節省解析不同頻率的複雜度。 In view of the above problems, a solution of this creation is to generate a corresponding compensation curve, The principle is that the inductance of any channel from TX to RX will be related to the driving frequency, and the difference between the near and far end TX can be eliminated by selecting the driving frequency appropriately. For example, generally speaking, the low-frequency drive signal has a larger inductance, and the high-frequency drive signal has a smaller inductance. Therefore, the driving frequency can be higher and lower from the near IC end to the far IC end of the panel. The resulting compensation curve is shown in Figure 15. Each TX is pure frequency division multiplexing (Frequency Division Multiplexing, FDM), so that the amplitude response of each TX to a single RX channel can be adjusted individually, that is, each TX can be completely eliminated. The inductance difference between TX. In other words, the processing circuit assigns different driving frequencies to each driving signal to obtain different first weight values according to the distance between the touch position of the panel corresponding to each driving signal and the transmitted chip, so as to equalize the near-to-remote transmission The difference in electrode induction. The above example is not limited to a single transmission electrode TX, and different groups may use different frequencies: TX differences in short-distance ranges are not compensated, but compensation for long-distance groups can save the complexity of analyzing different frequencies.
可能遭遇的另一問題是:採用FDM和CDM時,近遠端TX群組會因走線阻抗而有差異,若每顆IC內含2個TX群組,且各TX群組採用不同的驅動頻率,則訊號感應量會非常不均勻。如第16圖所示,TX群組0/1隸屬於第一IC,TX群組2/3隸屬於第二IC,TX群組4/5隸屬於第三IC,TX群組6/7隸屬於第四IC,如未施以本創作FDM結合CDM重分佈(FDM plus CDM Redistribution)方案,請參考上述第16圖,而使用了第15圖的分佈方式指派各TX群組採用的驅動頻率,則有訊號強度衰減的情形產生,其中縱軸代表正交化大小(Normalized Magnitude),橫軸代表不同的TX群組的排序,從第16圖的曲線可看出TX群組同時受到遠近場走線阻抗不同以及頻率響應不同的影響,導致訊號感應量非常不均勻。本創作第16圖的FDM結合CDM重分佈方案是:同時採用FDM以及CDM時,若每顆IC內含2個TX群組,且同一顆IC內的各TX群組採用相同的驅動頻率,但不同IC間採用不同的驅動頻率,例如距離面板較遠的IC的4個TX群組(#4~7)採用低頻驅動訊號,距離面板較近的IC的4個TX群組(#0~3)採用高頻動訊號,則可
改善感應量均勻性,改善後的曲線如第17圖所示之本創作FDM結合CDM重分佈方案的曲線,從圖中可知,頻率響應所造成的負面影響已經消除。換言之,處理電路根據每一TX群組對應之傳送電極距離的遠近,賦予該每一筆TX群組驅動訊號不同的驅動頻率而得到不同第二權重值,以均衡化面板走線的阻抗差異所造成的感應量的差異。
Another problem that may be encountered is that when using FDM and CDM, the near and far end TX groups will be different due to the trace impedance. If each IC contains 2 TX groups, and each TX group uses a different driver Frequency, the signal induction will be very uneven. As shown in Figure 16,
此外,觸控裝置採用CDM(例如第8圖及第10圖所示的方案)常有的訊號傳輸問題是:當面板上相鄰的TX為同一TX群組時會有極性相異的問題,如第18圖中之波形181、182及183所示,相鄰TX群組因具有極性相異則可能具有更大的動態電容負載,而加重IC驅動電極的負荷,導致輸出波形不理想,或是更耗電。對此,本創作利用交錯排列的解決方案,請參考第11圖和第12圖,如圖19所示於各個驅動電極間***不驅動的電極,藉以減輕動態電容負載,如波形184及185所示。不驅動電極的電位狀態可以透過接地、定電壓輸出,或浮接等方式來實現。請參考第20圖,第20圖係為根據本創作的一實施例的處理電路的執行事項的示意圖。請注意,假若可獲得實質上相同的結果,則這些步驟並不一定要遵照第20圖所示的執行次序來執行。第20圖可簡單歸納如下:步驟202:流程開始;步驟204:控制多個晶片分別於一預定時段內傳送至少一筆MxN驅動訊號給觸控裝置中至少一部份傳送電極,其中M代表位元數,N代表時間長度;步驟206:控制該些晶片在該預定時段內接收觸控裝置的至少一部份接收電極所偵測到的觸控感測訊號。
In addition, touch devices using CDM (such as the solutions shown in Figure 8 and Figure 10) often have signal transmission problems: when adjacent TXs on the panel are in the same TX group, there will be a problem of different polarities. As shown by the
由於熟習技藝者在閱讀完以上段落後應可輕易瞭解第20圖中每一步驟的細節,為簡潔之故,在此將省略進一步的描述。 Since those skilled in the art should be able to easily understand the details of each step in Figure 20 after reading the above paragraphs, for the sake of brevity, further description will be omitted here.
100:觸控裝置 100: Touch device
110:觸控面板 110: Touch panel
120:處理電路 120: Processing circuit
DIE_1,DIE_K:晶片 DIE_1, DIE_K: chip
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