TWM600614U

TWM600614U - Mold removal structure

Info

Publication number: TWM600614U
Application number: TW109206895U
Authority: TW
Inventors: 鄭婷瑜; 鄭皓云
Original assignee: 鄭婷瑜; 鄭皓云
Priority date: 2020-06-02
Filing date: 2020-06-02
Publication date: 2020-09-01

Abstract

一種除霉構造用以對一發霉位置進行除霉，該除霉構造包含一載體以及一吸收體，該吸收體結合於該載體，該吸收體用以承載一流體，使承載有該流體的該吸收體具有除霉效能，該吸收體用以接觸該發霉位置，以對該發霉位置進行除霉。A mildew removal structure is used to remove mildew from a mildewed position. The mildew removal structure includes a carrier and an absorber. The absorber is combined with the carrier. The absorber is used to carry a fluid so that the The absorber has the effect of removing mildew, and the absorber is used to contact the mildewed location to remove mildew from the mildewed location.

Description

除霉構造Mold removal structure

本創作是關於一種除霉構造，特別是一種避免流體垂流或滴落的除霉構造，以及降低流體蒸發速度的除霉構造，且在除霉工作後可簡單地被移除的除霉構造。This creation is about a mold-removing structure, especially a mold-removing structure that prevents fluid from sagging or dripping, and a mold-removing structure that reduces the evaporation rate of the fluid, and can be easily removed after the mold is removed. .

水分及溫度是影響霉菌繁殖的因素，因此在潮濕的環境中容易滋生霉菌，一般為了抑制霉菌生長會保持環境通風或使用除濕器/除濕劑進行除濕，以降低環境中的水分。Moisture and temperature are factors that affect the growth of mold, so mold is easy to grow in a humid environment. Generally, in order to inhibit mold growth, keep the environment ventilated or use a dehumidifier/dehumidifier for dehumidification to reduce the moisture in the environment.

然而，浴室是最不易控制濕度的生活環境之一，因此浴室也最容易孳生霉菌，為去除霉菌，市場上銷售有除霉凝膠、除霉噴液或除霉泡沫除霉用品。However, the bathroom is one of the most difficult living environments to control humidity. Therefore, the bathroom is also the easiest to breed mold. In order to remove mold, mold removal gel, mildew spray or mildew foam and foam removal products are sold in the market.

使用除霉凝膠進行除霉，是將除霉凝膠塗抹於發霉位置，但由於除霉凝膠是藉由凝膠劑粘著於牆壁、地板或天花板，因此在使用除霉凝膠去除霉菌或菌斑後，會有不易清除該除霉凝膠的問題。To remove mildew using a mildew gel, apply the mildew gel to the moldy area, but because the gel is adhered to the wall, floor or ceiling by the gel, it is used to remove the mildew Or after plaque, there will be a problem that it is not easy to remove the mold gel.

使用除霉噴液或除霉泡沫進行除霉，是將除霉液或除霉泡沫大範圍噴灑在發霉位置，然而當除霉液或除霉泡沫被噴灑在牆壁或天花板時，會有垂流或滴落的問題，此外，由於除霉液或除霉泡沫是大範圍噴灑在牆壁、地板或天花板，因此會有快速蒸發的問題；然而，不論是垂流、滴落或快速蒸發都會造成除霉液或除霉泡沫除霉時間不足，僅能對發霉位置的表面霉菌進行清除，無法對霉根進行深層的清除，當霉根未被清除時，在短時間內將再長出霉菌，其除霉實效並不長。Using mildew spray or mildew foam to remove mildew is to spray a wide range of mildew liquid or foam on the moldy areas. However, when the mildew liquid or foam is sprayed on the wall or ceiling, there will be sag In addition, since the mold liquid or mold foam is sprayed on the wall, floor or ceiling in a large area, there will be a problem of rapid evaporation; however, whether it is a droop, dripping or rapid evaporation will cause the The mildew liquid or the mildew-removing foam is not enough to remove the mildew. It can only remove the surface mold at the moldy site, and cannot remove the mildew root deeply. When the mildew root is not removed, the mold will grow again in a short time. The effect of mold removal is not long.

不論使用除霉凝膠、除霉噴液或除霉泡沫進行除霉，在除霉工作後，由於除霉凝膠黏著於粘著於牆壁、地板或天花板，或因除霉噴液或泡沫流動、垂流、滴落都必須再進行除霉後的清潔工作，例如以水液沖洗除霉凝膠、除霉噴液或除霉泡沫，而這將浪費水資源。Regardless of the use of mildew gel, mildew spray or foam for mildew removal, after the mildew removal work, the mildew gel adheres to the wall, floor or ceiling, or the mildew spray or foam flows , Sag, and dripping must be cleaned after mold removal, such as rinsing mold gel, mold spray or mold foam with water, which will waste water resources.

本創作的一種除霉構造，其主要目的是在提供一種避免流體垂流、滴落及降低流體蒸發速度的除霉構造，且該除霉構造在除霉後能被簡單地移除。The main purpose of the mold removing structure of the present invention is to provide a mold removing structure that prevents fluid from drooping and dripping and reducing the evaporation speed of the fluid, and the mold removing structure can be simply removed after the mold is removed.

本創作的一種除霉構造，用以接觸一發霉位置，以對該發霉位置進行除霉，該除霉構造包含一載體及一吸收體，該載體具有一第一固定部、一第二固定部及至少一注液口，該注液口位於該第一固定部與該第二固定部之間，該吸收體結合於該載體，該吸收體用以吸收及承載經由該注液口注入的一流體，該第一固定部及該第二固定部用以固定該除霉構造，使該吸收體接觸該發霉位置。A mold removing structure of the present invention is used to contact a moldy location to remove mold from the moldy location. The mold removing structure includes a carrier and an absorber. The carrier has a first fixing part and a second fixing part. And at least one liquid injection port, the liquid injection port is located between the first fixing part and the second fixing part, the absorber is combined with the carrier, and the absorber is used for absorbing and carrying a liquid injected through the liquid injection port. Fluid, the first fixing part and the second fixing part are used to fix the mold removing structure so that the absorber contacts the moldy position.

本創作藉由該第一固定部及該第二固定部將該除霉構造固定於該發霉位置，使該吸收體接觸該發霉位置，並經由該注液口注入該流體後，使該吸收體吸收並承載該流體，以對該發霉位置進行除霉，由於該流體被保持在該吸收體，因此能避免流體垂流或滴落，且能降低流體蒸發速度，以增加除霉效能，此外，在完成除霉工作後，可快速地移除該除霉構造。In this creation, the mold removing structure is fixed to the moldy position by the first fixing portion and the second fixing portion, so that the absorbent body contacts the moldy position, and the fluid is injected through the liquid injection port to make the absorbent body Absorb and carry the fluid to remove mildew from the moldy location. Since the fluid is held in the absorbent body, the fluid can be prevented from sagging or dripping, and the fluid evaporation speed can be reduced to increase the mildew removal efficiency. In addition, After the mold removal work is completed, the mold removal structure can be quickly removed.

請參閱第1、3及9A圖，為本創作的一種除霉構造100，用以接觸一發霉位置11，以對該發霉位置11進行除霉，該除霉構造100包含一載體110及一吸收體120，在本實施例中，該載體110為可撓性載體，該載體110可選自於聚丙烯薄膜(Oriented polypropylene，OPP)、聚酯膜(Polyester)、玻璃紙(Cellophane)、聚氯乙烯薄膜(Polyvinyl Chloride，PVC)、聚乙烯薄膜(PE)、聚氨基甲酸酯薄膜(PU)、紙、牛皮紙、不織布、棉紙、麻或海綿等可撓性載體，該吸收體120可選自於吸水性高分子（Superabsorbent polymers，SAP）材料、棉、麻、紙、海綿或布等吸水材料，請參閱第11圖，在另一實施例中，該載體110與該吸收體120可選自於相同材質，例如該載體110與該吸收體120可選自於高吸水性高分子（Superabsorbent polymers，SAP）材料、棉、麻、紙、海綿或布。Please refer to Figures 1, 3, and 9A. This is a mold removing structure 100 created for this creation, which is used to contact a moldy location 11 to remove mold from the moldy location 11. The mold removal structure 100 includes a carrier 110 and an absorbent Body 120. In this embodiment, the carrier 110 is a flexible carrier, and the carrier 110 can be selected from polypropylene film (Oriented polypropylene, OPP), polyester film (Polyester), cellophane (Cellophane), and polyvinyl chloride. Flexible carriers such as film (Polyvinyl Chloride, PVC), polyethylene film (PE), polyurethane film (PU), paper, kraft paper, non-woven fabric, cotton paper, hemp or sponge, the absorbent 120 can be selected from For superabsorbent polymers (SAP), cotton, linen, paper, sponge or cloth and other absorbent materials, please refer to Figure 11. In another embodiment, the carrier 110 and the absorbent 120 can be selected from Based on the same material, for example, the carrier 110 and the absorbent body 120 can be selected from superabsorbent polymers (SAP) materials, cotton, linen, paper, sponge or cloth.

請參閱第1圖，該除霉構造100能被捲收於一載具200，在本實施例中，該載具200選自於捲輪，或者，在不同實施例中，該載具200選自於一包裝袋或包裝盒(圖未繪出)，該除霉構造100能被折疊或捲收後收藏於該包裝袋或包裝盒中，但不以此為限。Please refer to Figure 1, the mold removing structure 100 can be rolled up in a carrier 200. In this embodiment, the carrier 200 is selected from a reel, or, in different embodiments, the carrier 200 is selected From a packaging bag or packaging box (not shown in the figure), the mold removing structure 100 can be folded or rolled and stored in the packaging bag or packaging box, but it is not limited thereto.

請參閱第2A、2B、2C、3及9A圖，該載體110具有至少一固定部，在不同實施例中，該固定部包含一第一固定部111及一第二固定部112，然而在不同實施例中，請參閱第9C及9D圖，該固定部僅具有該第一固定部111及該第二固定部112的其中之一。Please refer to FIGS. 2A, 2B, 2C, 3 and 9A. The carrier 110 has at least one fixing portion. In different embodiments, the fixing portion includes a first fixing portion 111 and a second fixing portion 112. In the embodiment, referring to FIGS. 9C and 9D, the fixing portion has only one of the first fixing portion 111 and the second fixing portion 112.

請參閱第2A、2B、2C、3及9A圖，在本實施例中以該載體110具有該第一固定部111及該第二固定部112說明，但不以此為限，該載體110另具有至少一注液口113，該注液口113位於該第一固定部111與該第二固定部112之間，請參閱第2A及3圖，在一實施例中，該注液口113為該第一固定部111與該第二固定部112之間的間隙，或者，請參閱第2B、2C及4圖，在另一實施例中，該注液口113為貫穿該載體110的穿孔，該注液口113的形狀選自於長槽孔、圓形孔、橢圓孔、方形孔或其他幾何圖形的穿孔。Please refer to FIGS. 2A, 2B, 2C, 3, and 9A. In this embodiment, the carrier 110 is described as having the first fixing portion 111 and the second fixing portion 112, but it is not limited to this. The carrier 110 has another There is at least one liquid injection port 113, and the liquid injection port 113 is located between the first fixing portion 111 and the second fixing portion 112. Please refer to FIGS. 2A and 3. In one embodiment, the liquid injection port 113 is The gap between the first fixing portion 111 and the second fixing portion 112, or refer to Figures 2B, 2C, and 4, in another embodiment, the liquid injection port 113 is a perforation penetrating the carrier 110, The shape of the liquid injection port 113 is selected from a slotted hole, a circular hole, an elliptical hole, a square hole or other geometrical perforations.

請參閱第3、4、5、9A、9C及9D圖，該吸收體120結合於該載體110，該吸收體120用以接觸該發霉位置11，請參閱第4圖，較佳地，該吸收體120可以藉由一黏膠150結合於該載體110，在本實施例中，該吸收體120藉由該黏膠150結合於該第一固定部111及該第二固定部112，使該載體110與該吸收體120結合成一體，或者，請參閱第5圖，在另一實施例中，該吸收體120具有一第一結合部121及一第二結合部122，該第一結合部121被熱壓合於該第一固定部111，該第二結合部122被熱壓合於該第二固定部112，使該載體110與該吸收體120結合成一體。Please refer to Figures 3, 4, 5, 9A, 9C and 9D, the absorbent body 120 is combined with the carrier 110, and the absorbent body 120 is used to contact the moldy site 11. Please refer to Figure 4. Preferably, the absorbent The body 120 can be bonded to the carrier 110 by an adhesive 150. In this embodiment, the absorbent body 120 is bonded to the first fixing portion 111 and the second fixing portion 112 by the glue 150, so that the carrier 110 and the absorbent body 120 are combined into one body, or, referring to FIG. 5, in another embodiment, the absorbent body 120 has a first joining portion 121 and a second joining portion 122, and the first joining portion 121 The carrier 110 and the absorber 120 are thermally pressed to the first fixing portion 111, and the second joining portion 122 is thermally pressed to the second fixing portion 112 to integrate the carrier 110 and the absorber 120.

請參閱第3、4、5及9B圖，該吸收體120用以吸收一流體300，該吸收體120用以吸收並承載經由該注液口113注入的該流體300，較佳地，該注液口113顯露出該吸收體120，在本實施例中，該流體300為一除霉流體，該流體300可選自於含有漂白水、酒精或過氧化氫(Hydrogen peroxide，雙氧水)、硼砂/醋/水混合液、小蘇打粉/水混合液或茶樹油/水混合液等除霉流體，但不以此為限，當該除霉流體經由該注液口113注入該吸收體120後，該吸收體120吸收並承載該流體300，使該吸收體120具有除霉效能。Please refer to Figures 3, 4, 5 and 9B, the absorbent body 120 is used to absorb a fluid 300, and the absorbent body 120 is used to absorb and carry the fluid 300 injected through the liquid injection port 113. Preferably, the injection The liquid port 113 exposes the absorber 120. In this embodiment, the fluid 300 is a mildew-removing fluid. The fluid 300 may be selected from the group consisting of bleach, alcohol, hydrogen peroxide (Hydrogen peroxide), borax/ Mould removal fluid such as vinegar/water mixture, baking soda powder/water mixture or tea tree oil/water mixture, but not limited to this, when the mould removal fluid is injected into the absorbent body 120 through the liquid injection port 113, The absorbent body 120 absorbs and carries the fluid 300, so that the absorbent body 120 has the effect of removing mildew.

在另一實施例中的該吸收體120搭載有一除霉物質(圖未繪出)，該除霉物質可選自於小蘇打粉、硼砂或漂白粉(Calcium hypochlorite)等除霉物質，該流體300選自於水，當該流體300注入該吸收體120時，該除霉物質可溶於該流體300中，使該流體300形成為一除霉流體，且使承載有該流體300的該吸收體120具有除霉效能。In another embodiment, the absorbent body 120 is equipped with a mildew-removing substance (not shown in the figure). The mildew-removing substance can be selected from baking soda powder, borax, or bleach (Calcium hypochlorite), etc., and the fluid 300 It is selected from water. When the fluid 300 is injected into the absorbent 120, the mildew-removing substance can be dissolved in the fluid 300, so that the fluid 300 is formed into a mildew-removing fluid, and the absorbent body carrying the fluid 300 120 has the effect of removing mildew.

請參閱第6、7及8圖，該除霉構造100另包含一罩蓋130，該罩蓋130用以選擇性地覆蓋該注液口113或該吸收體120，或同時覆蓋該注液口113及該吸收體120，請參閱第6及7圖，在本實施例中，該除霉構造100另包含複數個連接肋140，該載體110、該罩蓋130及該些連接肋140可為相同材質，且該載體110、該罩蓋130及該些連接肋140由一薄膜一體成型，該罩蓋130位於該注液口113中，且該些連接肋140連接該罩蓋部130及該載體110，使該罩蓋130覆蓋該注液口113及該吸收體120，在本實施例中，該些連接肋140連接該罩蓋130及該注液口113的一側壁113a，當欲將該流體300注入該吸收體120時，先將覆蓋於該注液口113的該罩蓋130掀起，並使該些連接肋140斷離該罩蓋130或該載體110，即可顯露出該注液口113，該流體即可經由該注液口113注入該吸收體120，必要時在注入該流體300後，再將該罩蓋130覆蓋該注液口113，以減少該注液口113的顯露面積，以降低承載於該吸收體120的該流體300的蒸發速度。Please refer to Figures 6, 7 and 8, the mold removing structure 100 further includes a cover 130 for selectively covering the liquid injection port 113 or the absorbent body 120, or simultaneously covers the liquid injection port 113 and the absorbent body 120, please refer to Figures 6 and 7. In this embodiment, the mold removing structure 100 further includes a plurality of connecting ribs 140. The carrier 110, the cover 130, and the connecting ribs 140 may be The same material, and the carrier 110, the cover 130 and the connecting ribs 140 are integrally formed by a thin film, the cover 130 is located in the liquid injection port 113, and the connecting ribs 140 connect the cover portion 130 and the The carrier 110 enables the cover 130 to cover the liquid injection port 113 and the absorber 120. In this embodiment, the connecting ribs 140 connect the cover 130 and a side wall 113a of the liquid injection port 113. When the fluid 300 is injected into the absorbent body 120, the cover 130 covering the liquid injection port 113 is first lifted, and the connecting ribs 140 are disconnected from the cover 130 or the carrier 110, and the injection is revealed The liquid port 113, the fluid can be injected into the absorbent body 120 through the liquid injection port 113. If necessary, after the fluid 300 is injected, the cover 130 can cover the liquid injection port 113 to reduce the liquid injection port 113 The exposed area is used to reduce the evaporation speed of the fluid 300 carried on the absorber 120.

請參閱第8圖，在另一的實施例中，該罩蓋130與該載體110為不同個體，較佳地，該罩蓋130以一黏膠(圖未繪出)或靜電貼附於該載體110，並覆蓋該注液口113及該吸收體120，當欲使該流體300注入該吸收體120時，先將覆蓋於該注液口113的該罩蓋130掀起，即可顯露出該注液口113，該流體300即可經由該注液口113注入該吸收體120，必要時在注入該流體300後再將該罩蓋130覆蓋該注液口113，以減少該注液口113的顯露面積，以降低承載於該吸收體120的該流體300的蒸發速度。Please refer to Figure 8. In another embodiment, the cover 130 and the carrier 110 are different individuals. Preferably, the cover 130 is attached to the cover 130 with an adhesive (not shown in the figure) or electrostatically. The carrier 110 covers the liquid injection port 113 and the absorber 120. When the fluid 300 is to be injected into the absorber 120, first lift the cover 130 covering the liquid injection port 113 to reveal the The liquid injection port 113, the fluid 300 can be injected into the absorbent body 120 through the liquid injection port 113, and if necessary, after the fluid 300 is injected, the cover 130 can cover the liquid injection port 113 to reduce the liquid injection port 113. In order to reduce the evaporation rate of the fluid 300 carried on the absorber 120.

請參閱第3、4、5、9A及9B圖，該第一固定部111及該第二固定部112用以固定該除霉構造100於一物體10(如牆壁、或磁磚等物體)，並使用以吸收及承載該流體300的該吸收體120接觸該發霉位置11，請參閱第9C及9D圖，在另一實施例中，該除霉構造100以該第一固定部111或該第二固定部112其中之一，將該除霉構造100固定於該物體10，該第一固定部111及該第二固定部112可藉由水或靜電附著於該物體10並使該吸收體120接觸該發霉位置11，請參閱第9A、9C及9D圖圖，該發霉位置11位於一牆角的一膠條12的一表面，但不以此為限。Please refer to Figures 3, 4, 5, 9A and 9B. The first fixing portion 111 and the second fixing portion 112 are used to fix the mold removing structure 100 to an object 10 (such as a wall, or a tile, etc.). The absorbent body 120 used to absorb and carry the fluid 300 contacts the moldy position 11. Please refer to Figures 9C and 9D. In another embodiment, the mold removing structure 100 uses the first fixing portion 111 or the One of the two fixing parts 112 fixes the mold removing structure 100 to the object 10. The first fixing part 111 and the second fixing part 112 can be attached to the object 10 by water or static electricity to make the absorber 120 For contacting the moldy position 11, please refer to drawings 9A, 9C and 9D. The moldy position 11 is located on a surface of a rubber strip 12 in a corner, but not limited to this.

請參閱第4、5、9A、9B、9C及9D圖，較佳地，該黏膠150設置於該第一固定部111的一第一表面111a及該第二固定部112的一第二表面112a，請參閱第9A、9B、9C及9D圖，在本實施例中，該除霉構造100藉由該黏膠150附著於該物體10，並使該吸收體120接觸該發霉位置11。Please refer to Figures 4, 5, 9A, 9B, 9C and 9D. Preferably, the adhesive 150 is disposed on a first surface 111a of the first fixing portion 111 and a second surface of the second fixing portion 112 112a, please refer to FIGS. 9A, 9B, 9C, and 9D. In this embodiment, the mold removing structure 100 is attached to the object 10 by the adhesive 150, and the absorbent body 120 is brought into contact with the moldy location 11.

請參閱第3及4圖，該除霉構造100另包含一隔離膜160，請參閱第3圖，在一實施例中，該隔離膜160覆蓋該第一固定部111的該第一表面111a及該第二固定部112的該第二表面111a。Please refer to FIGS. 3 and 4. The mold removing structure 100 further includes an isolation film 160. Please refer to FIG. 3. In one embodiment, the isolation film 160 covers the first surface 111a of the first fixing portion 111 and The second surface 111 a of the second fixing portion 112.

請參閱第4圖，在另一實施例中，該隔離膜160覆蓋設置於該第一固定部111的該黏膠150及該第二固定部112的該黏膠150，請參閱第3及4圖，較佳地，該隔離膜160覆蓋該吸收體120的一接觸面120a。Please refer to FIG. 4, in another embodiment, the isolation film 160 covers the adhesive 150 disposed on the first fixing portion 111 and the adhesive 150 of the second fixing portion 112, please refer to Nos. 3 and 4 As shown, preferably, the isolation film 160 covers a contact surface 120a of the absorber 120.

當欲使用該除霉構造100進行除霉時，首先，請參閱第4及9A圖，若該除霉構造100設有該隔離膜160，且該第一固定部111及該第二固定部112設有該黏膠150時，先撕離該隔離膜160，以顯露出設置於該第一固定部111及該第二固定部112的該黏膠150，並藉由該黏膠150將該第一固定部111及該第二固定部112貼附著於該物體10，並使該吸收體120的該接觸面120a接觸該發霉位置11；或者，在不同的實施例中，當該第一固定部111及該第二固定部112未設有該黏膠150時，該第一固定部111及該第二固定部112可藉由水或靜電附著於該物體10，並使該吸收體120的該接觸面120a接觸該發霉位置11。When the mold removal structure 100 is to be used for mold removal, first, please refer to Figures 4 and 9A. If the mold removal structure 100 is provided with the isolation membrane 160, and the first fixing portion 111 and the second fixing portion 112 When the adhesive 150 is provided, the isolation film 160 is first torn away to expose the adhesive 150 disposed on the first fixing portion 111 and the second fixing portion 112, and the second fixing portion 112 is exposed by the adhesive 150 A fixing portion 111 and the second fixing portion 112 are attached to the object 10, and the contact surface 120a of the absorber 120 contacts the moldy position 11; or, in different embodiments, when the first fixing portion When the adhesive 150 is not provided on the second fixing portion 111 and the second fixing portion 112, the first fixing portion 111 and the second fixing portion 112 can be attached to the object 10 by water or static electricity, and make the absorber 120 The contact surface 120a contacts the moldy position 11.

請參閱第6、7、8及9A圖，當該除霉構造100設有該罩蓋130時，則掀起該罩蓋130，以顯露出該注液口113。Please refer to FIGS. 6, 7, 8 and 9A. When the mold removing structure 100 is provided with the cover 130, the cover 130 is lifted to expose the liquid injection port 113.

請參閱第9B圖，在該除霉構造100附著於該物體10之後，經由該注液口113將該流體300注入該除霉構造100，在本實施例中，該流體300被裝置於一容器400中，該容器400可選自於注射筒或瓶子等容器，藉由該容器400的一出液口410將該流體300輸出，並經由該注液口113將該流體300注入該除霉構造100的該吸收體120，使該吸收體120吸收及承載該流體300，藉由吸收及承載該流體300的該吸收體120接觸該發霉位置11，以對該發霉位置11進行除霉，由於該流體300被保持在該吸收體120，因此，當該除霉構造100被使用於牆壁、地板或天花板都能避免該流體300垂流或滴落，且能降低該流體300蒸發速度，以增加除霉效能。Please refer to Figure 9B. After the mold removal structure 100 is attached to the object 10, the fluid 300 is injected into the mold removal structure 100 through the liquid injection port 113. In this embodiment, the fluid 300 is installed in a container In 400, the container 400 can be selected from containers such as syringes or bottles, and the fluid 300 is output through a liquid outlet 410 of the container 400, and the fluid 300 is injected into the mold removing structure through the liquid injection port 113 The absorbent body 120 of 100 allows the absorbent body 120 to absorb and carry the fluid 300, and the absorbent body 120 absorbing and carrying the fluid 300 contacts the moldy site 11 to remove mold from the moldy site 11. The fluid 300 is held in the absorber 120. Therefore, when the mold removing structure 100 is used on a wall, floor or ceiling, the fluid 300 can be prevented from flowing or dripping, and the evaporation rate of the fluid 300 can be reduced to increase the removal rate. Mildew performance.

此外，當除霉工作完成後，僅需要將該除霉構造100撕離該物體10，即能夠快速地將貼附於該物體10的該除霉構造100移除，以減少除霉後的清潔工作。In addition, when the mold removal work is completed, the mold removal structure 100 only needs to be torn away from the object 10, that is, the mold removal structure 100 attached to the object 10 can be quickly removed, so as to reduce the cleaning after mold removal. jobs.

請參閱第9C、9D及10圖，在另一實施例中，該除霉構造100的該載體110不具有該注液口113，當欲使用該除霉構造100進行除霉時，直接將該流體300注入該吸收體120，或者經由該吸收體120的該接觸面120a注入該流體300，使該吸收體120吸收及承載該流體300，再將該第一固定部111及/或該第二固定部112附著於該物體10，並使該吸收體120接觸該發霉位置11，即可對該發霉位置11進行除霉。Please refer to Figures 9C, 9D and 10, in another embodiment, the carrier 110 of the mold removing structure 100 does not have the liquid injection port 113. When the mold removing structure 100 is to be used for mold removing, the The fluid 300 is injected into the absorber 120, or the fluid 300 is injected through the contact surface 120a of the absorber 120, so that the absorber 120 absorbs and carries the fluid 300, and then the first fixing portion 111 and/or the second The fixing portion 112 is attached to the object 10 and the absorbent body 120 is brought into contact with the moldy position 11 to remove mold from the moldy position 11.

請參閱第11圖，在另一實施例中，該除霉構造100的該載體110與該吸收體120為相同材質，且該除霉構造100的該載體110不具有該注液口113，該載體110與該吸收體120可選自於高吸水性高分子（Superabsorbent polymers，SAP）材料、棉、麻、紙、海綿或布等材料，且該載體110與該吸收體120為一體，相同地，該載體110具有至少一固定部，在本實施例中，以該載體110具有該第一固定部111及該第二固定部112說明，該第一固定部111及該第二固定部112可藉由該黏膠150附著於該物體10，並使該吸收體120接觸該發霉位置11，當該流體300注入該吸收體120後，使該吸收體120吸收及承載該流體300，以對該發霉位置11進行除霉。Please refer to Figure 11, in another embodiment, the carrier 110 of the mold removing structure 100 and the absorbent body 120 are made of the same material, and the carrier 110 of the mold removing structure 100 does not have the liquid injection port 113, the The carrier 110 and the absorbent body 120 can be selected from materials such as superabsorbent polymers (SAP), cotton, linen, paper, sponge or cloth, and the carrier 110 and the absorbent body 120 are integrated, similarly The carrier 110 has at least one fixing portion. In this embodiment, it is assumed that the carrier 110 has the first fixing portion 111 and the second fixing portion 112. The first fixing portion 111 and the second fixing portion 112 may The adhesive 150 is attached to the object 10, and the absorbent body 120 is brought into contact with the moldy site 11. When the fluid 300 is injected into the absorbent body 120, the absorbent body 120 is made to absorb and carry the fluid 300 to Mold removal is performed at the moldy position 11.

本創作藉由該載體110的至少一固定部(該第一固定部111及該第二固定部112，或其中之一)將該除霉構造100固定於該發霉位置11，並使吸收並承載有該流體300的該吸收體120接觸該發霉位置11，以對該發霉位置11進行除霉，由於該流體300被保持在該吸收體120，因此能避免該流體300垂流或滴落，且能降低該流體300蒸發速度，以增加除霉效能，此外，在完成除霉工作後，可快速地移除該除霉構造100，以減少除霉後的清潔工作。In this creation, the mold removing structure 100 is fixed to the moldy position 11 by at least one fixing portion (the first fixing portion 111 and the second fixing portion 112, or one of them) of the carrier 110, so as to absorb and carry The absorbent body 120 with the fluid 300 contacts the moldy position 11 to remove mold from the moldy position 11. Since the fluid 300 is held in the absorbent body 120, the fluid 300 can be prevented from flowing or dripping, and The evaporation rate of the fluid 300 can be reduced to increase the mold removal efficiency. In addition, after the mold removal work is completed, the mold removal structure 100 can be quickly removed to reduce the cleaning work after mold removal.

本創作之保護範圍當視後附之申請專利範圍所界定者為準，任何熟知此項技藝者，在不脫離本創作之精神和範圍內所作之任何變化與修改，均屬於本創作之保護範圍。The scope of protection of this creation shall be subject to the scope of the attached patent application. Any changes and modifications made by anyone who is familiar with this technique without departing from the spirit and scope of this creation shall fall within the scope of protection of this creation. .

10:物體 11:發霉位置 12:膠條 100:除霉構造 110:載體 111:第一固定部 111a:第一表面 112:第二固定部 112a:第二表面 113:注液口 113a:側壁 120:吸收體 120a:接觸面 121:第一結合部 122:第二結合部 130:罩蓋 140:連接肋 150:黏膠 160:隔離膜 200:載具 300:流體 400:容器 410:出液口10: Object 11: Moldy location 12: Adhesive strip 100: Mildew removal structure 110: carrier 111: The first fixed part 111a: first surface 112: second fixed part 112a: second surface 113: Liquid injection port 113a: side wall 120: Absorber 120a: contact surface 121: first joint 122: second joint 130: cover 140: connecting rib 150: viscose 160: isolation film 200: Vehicle 300: fluid 400: container 410: Liquid Outlet

第1圖：本創作的除霉構造捲收於捲輪的立體圖。第2A圖：本創作的除霉構造的一實施例的上視圖。第2B圖：本創作的除霉構造的一實施例的上視圖。第2C圖：本創作的除霉構造的一實施例的上視圖。第3圖：本創作的除霉構造的一實施例的剖視立體圖。第4圖：本創作的除霉構造的一實施例的剖視立體圖。第5圖：本創作的除霉構造的一實施例的剖視立體圖。第6圖：本創作的除霉構造的一實施例的上視圖。第7圖：本創作的除霉構造的一實施例的剖視立體圖。第8圖：本創作的除霉構造的一實施例的剖視立體圖。第9A圖：使用本創作的除霉構造進行除霉的剖視圖。第9B圖：使用本創作的除霉構造進行除霉的剖視圖。第9C圖：使用本創作的除霉構造進行除霉的剖視圖。第9D圖：使用本創作的除霉構造進行除霉的剖視圖。第10圖：使用本創作的除霉構造進行除霉的剖視圖。第11圖：使用本創作的除霉構造進行除霉的剖視圖。 Figure 1: A three-dimensional view of the mold removal structure of this creation wrapped in a reel. Figure 2A: A top view of an embodiment of the mold removal structure of the present creation. Figure 2B: A top view of an embodiment of the mold removal structure of the present creation. Figure 2C: A top view of an embodiment of the mold removing structure of the present creation. Figure 3: A cross-sectional perspective view of an embodiment of the mold removing structure of the present creation. Figure 4: A cross-sectional perspective view of an embodiment of the mold removing structure of this creation. Figure 5: A cutaway perspective view of an embodiment of the mold removing structure of the present creation. Figure 6: The top view of an embodiment of the mold removal structure of the present creation. Figure 7: A cut-away perspective view of an embodiment of the mold removing structure of this creation. Figure 8: A cross-sectional perspective view of an embodiment of the mold removing structure of this creation. Figure 9A: A cross-sectional view of mold removal using the mold removal structure of this creation. Figure 9B: A cross-sectional view of mold removal using the mold removal structure of this creation. Figure 9C: A cross-sectional view of mold removal using the mold removal structure of this creation. Figure 9D: A cross-sectional view of the mold removal structure using this creation. Figure 10: A cross-sectional view of mold removal using the mold removal structure of this creation. Figure 11: A cross-sectional view of mold removal using the mold removal structure of this creation.

10:物體 10: Object

11:發霉位置 11: Moldy location

12:膠條 12: Adhesive strip

100:除霉構造 100: Mildew removal structure

110:載體 110: carrier

111:第一固定部 111: The first fixed part

112:第二固定部 112: second fixed part

113:注液口 113: Liquid injection port

120:吸收體 120: Absorber

120a:接觸面 120a: contact surface

150:黏膠 150: viscose

Claims

一種除霉構造，用以接觸一發霉位置，以對該發霉位置進行除霉，該除霉構造包含：一載體，具有一第一固定部、一第二固定部及至少一注液口，該注液口位於該第一固定部與該第二固定部之間；以及一吸收體，結合於該載體，該吸收體用以吸收及承載經由該注液口注入的一流體，該第一固定部及該第二固定部用以固定該除霉構造，使該吸收體接觸該發霉位置。 A mold removing structure used for contacting a moldy location to remove mold on the moldy location, the mold removing structure comprising: A carrier having a first fixing portion, a second fixing portion and at least one liquid injection port, the liquid injection port being located between the first fixing portion and the second fixing portion; and An absorbent body is combined with the carrier, the absorbent body is used to absorb and carry a fluid injected through the liquid injection port, and the first fixing part and the second fixing part are used to fix the mold removing structure so that the absorbent Touch the moldy area.

如請求項1之除霉構造，其中該注液口顯露出該吸收體。Such as the mold removing structure of claim 1, wherein the liquid injection port reveals the absorbent body.

如請求項1之除霉構造，其中該注液口為該第一固定部與該第二固定部之間的間隙。Such as the mold removing structure of claim 1, wherein the liquid injection port is a gap between the first fixing part and the second fixing part.

如請求項1之除霉構造，其中該注液口為貫穿該載體的穿孔。Such as the mold removing structure of claim 1, wherein the liquid injection port is a perforation penetrating the carrier.

如請求項1之除霉構造，其另包含一罩蓋，該罩蓋用以選擇性地覆蓋該注液口。Such as the mold removing structure of claim 1, which further includes a cover for selectively covering the liquid injection port.

如請求項5之除霉構造，其另包含至少一連接肋，該罩蓋位於該注液口中，且該連接肋連接該罩蓋部及該載體。For example, the mold removing structure of claim 5, which further includes at least one connecting rib, the cover is located in the liquid injection port, and the connecting rib connects the cover portion and the carrier.

如請求項6之除霉構造，其中該連接肋連接該罩蓋及該注液口的一側壁。Such as the mold removing structure of claim 6, wherein the connecting rib connects the cover and a side wall of the liquid injection port.

如請求項1之除霉構造，其另包含一黏膠，該黏膠設置於該第一固定部的一第一表面及該第二固定部的一第二表面。For example, the mold removing structure of claim 1, which further includes a glue disposed on a first surface of the first fixing portion and a second surface of the second fixing portion.

如請求項1之除霉構造，其中該吸收體藉由一黏膠結合於該載體。Such as the mold removing structure of claim 1, wherein the absorbent is bonded to the carrier by an adhesive.

如請求項1之除霉構造，其中該吸收體具有一第一結合部，該第一結合部被熱壓合於該第一固定部。Such as the mold removing structure of claim 1, wherein the absorbent body has a first joining part, and the first joining part is heat-compressed to the first fixing part.

如請求項10之除霉構造，其中該吸收體具有一第二結合部，該第二結合部被熱壓合於該第二固定部。Such as the mold removing structure of claim 10, wherein the absorbent body has a second joining part, and the second joining part is heat-compressed to the second fixing part.

如請求項1、2、5、9、10或11之除霉構造，其另包含一隔離膜，該隔離膜覆蓋該第一固定部的一第一表面及該第二固定部的一第二表面。For example, the mold removal structure of claim 1, 2, 5, 9, 10 or 11, which further includes an isolation film covering a first surface of the first fixing portion and a second surface of the second fixing portion surface.

如請求項1、2、5、9、10或11之除霉構造，其另包含一隔離膜，該隔離膜覆蓋該吸收體。For example, the mold removing structure of claim 1, 2, 5, 9, 10, or 11 further includes an isolation film covering the absorber.

如請求項8之除霉構造，其另包含一隔離膜，該隔離膜覆蓋該黏膠。Such as the mold removal structure of claim 8, which further includes an isolation film covering the adhesive.

如請求項14之除霉構造，其中該隔離膜覆蓋該吸收體。Such as the mold removing structure of claim 14, wherein the isolation film covers the absorber.

如請求項1之除霉構造，其中該吸收體搭載有一除霉物質，該除霉物質選自於小蘇打粉、硼砂或漂白粉(Calcium hypochlorite)。Such as the mildew removal structure of claim 1, wherein the absorbent body is equipped with a mildew removal material, and the mildew removal material is selected from baking soda powder, borax or bleaching powder (Calcium hypochlorite).

如請求項1之除霉構造，其中該流體為一除霉流體，該除霉流體選自於含有漂白水、酒精、過氧化氫(Hydrogen peroxide，雙氧水)、硼砂/醋/水混合液、小蘇打粉/水混合液或茶樹油/水混合液。Such as the mildew removal structure of claim 1, wherein the fluid is a mildew removal fluid, and the mildew removal fluid is selected from the group consisting of bleach, alcohol, hydrogen peroxide (hydrogen peroxide), borax/vinegar/water mixture, and small Soda powder/water mixture or tea tree oil/water mixture.

如請求項1之除霉構造，其中該載體選自於聚丙烯薄膜(Oriented polypropylene，OPP)、聚酯膜(Polyester)、玻璃紙(Cellophane)、聚氯乙烯薄膜(Polyvinyl Chloride，PVC)、聚乙烯薄膜(PE)、聚氨基甲酸酯薄膜(PU)、紙、牛皮紙、不織布、棉紙、麻或海綿。Such as the mildew-removing structure of claim 1, wherein the carrier is selected from polypropylene film (Oriented polypropylene, OPP), polyester film (Polyester), cellophane (Cellophane), polyvinyl chloride film (Polyvinyl Chloride, PVC), polyethylene Film (PE), polyurethane film (PU), paper, kraft paper, non-woven fabric, cotton paper, hemp or sponge.

如請求項1之除霉構造，其中該吸收體選自於高吸水性高分子（Superabsorbent polymers，SAP）材料、棉、麻、紙、海綿或布。Such as the mildew-removing structure of claim 1, wherein the absorbent body is selected from superabsorbent polymers (SAP) materials, cotton, linen, paper, sponge or cloth.

一種除霉構造，用以接觸一發霉位置，以對該發霉位置進行除霉，該除霉構造包含：一載體，具有至少一固定部及至少一注液口；以及一吸收體，結合於該載體，該吸收體用以吸收及承載經由該注液口注入的一流體，該固定部用以固定該除霉構造，使用以吸收該流體的該吸收體接觸該發霉位置。 A mold removing structure used for contacting a moldy location to remove mold on the moldy location, the mold removing structure comprising: A carrier having at least one fixing part and at least one liquid injection port; and An absorbent body is combined with the carrier, the absorbent body is used to absorb and carry a fluid injected through the liquid injection port, the fixing part is used to fix the mold removing structure, and the absorbent body used to absorb the fluid contacts the mold position.

如請求項20之除霉構造，其中該注液口為貫穿該載體的穿孔。Such as the mold removing structure of claim 20, wherein the liquid injection port is a perforation penetrating the carrier.

一種除霉構造，用以接觸一發霉位置，以對該發霉位置進行除霉，該除霉構造包含：一載體，具有至少一固定部；以及一吸收體，結合於該載體，該吸收體用以吸收及承載一流體，該固定部用以固定該除霉構造，使用以吸收該流體的該吸收體接觸該發霉位置。 A mold removing structure used for contacting a moldy location to remove mold on the moldy location, the mold removing structure comprising: A carrier having at least one fixing part; and An absorber is combined with the carrier, the absorber is used for absorbing and carrying a fluid, the fixing part is used for fixing the mold removing structure, and the absorber used for absorbing the fluid contacts the moldy position.

一種除霉構造，用以接觸一發霉位置，以對該發霉位置進行除霉，其特徵在於：該除霉構造包含一載體及一吸收體，該載體與該吸收體為相同材質，該載體具有至少一固定部，該固定部用以固定該除霉構造，並使該吸收體接觸一發霉位置，該吸收體用以吸收及承載一流體。A mold removing structure for contacting a moldy location to remove mold from the moldy location, wherein the mold removing structure includes a carrier and an absorber, the carrier and the absorber are made of the same material, and the carrier has At least one fixing part is used for fixing the mold removing structure and making the absorber contact a moldy position, and the absorber is used for absorbing and carrying a fluid.

如請求項20至23中任一項之除霉構造，其另包含一黏膠，該黏膠設置於該固定部的一表面。For example, the mold removing structure of any one of claims 20 to 23, which further includes an adhesive, and the adhesive is disposed on a surface of the fixing portion.

如請求項20至23中任一項之除霉構造，其另包含一隔離膜，該隔離膜覆蓋該固定部的一表面。For example, the mold removing structure of any one of claims 20 to 23 further includes an isolation film covering a surface of the fixing portion.

如請求項20至23中任一項之除霉構造，其另包含一隔離膜，該隔離膜覆蓋該吸收體。Such as the mold removing structure of any one of claims 20 to 23, which further includes an isolation film covering the absorber.

如請求項24之除霉構造，其另包含一隔離膜，該隔離膜覆蓋該黏膠。For example, the mildew-removing structure of claim 24 further includes an isolation film covering the glue.

如請求項20至23中任一項之除霉構造，其中該吸收體搭載有一除霉物質，該除霉物質選自於小蘇打粉、硼砂或漂白粉(Calcium hypochlorite)。According to any one of claims 20 to 23, the mold removing structure, wherein the absorbent body is equipped with a mold removing substance selected from baking soda powder, borax or bleach (Calcium hypochlorite).

如請求項20至23中任一項之除霉構造，其中該流體選自於含有漂白水、酒精、過氧化氫(Hydrogen peroxide，雙氧水)、硼砂/醋/水混合液、小蘇打粉/水混合液或茶樹油/水混合液。Such as the mold removal structure of any one of claims 20 to 23, wherein the fluid is selected from the group consisting of bleach, alcohol, hydrogen peroxide (hydrogen peroxide), borax/vinegar/water mixture, baking soda/water Mixture or tea tree oil/water mixture.

如請求項20至23中任一項之除霉構造，其中該吸收體選自於高吸水性高分子（Superabsorbent polymers，SAP）材料、棉、麻、紙、海綿或布。Such as the mold removal structure of any one of claims 20 to 23, wherein the absorbent is selected from superabsorbent polymers (SAP) materials, cotton, linen, paper, sponge or cloth.