TWM599409U - Processor heat dissipation module with having 3-dimension heat dissipation and burning-in device - Google Patents

Abstract

A processor heat dissipation module with 3-dimension heat dissipation comprises: a thermal plate, a base connected to one side of the a thermal plate for contacting a processor, a set of cooling plates, and at least one of heat pipe coupled to the cooling plates, wherein one side of each of the cooling plates connects to a surface of the vapor chamber in order to achieve heat transfer at the same time and accelerates the heat dissipation.

Description

具有三維散熱之處理器散熱模組與燒機裝置Processor heat dissipation module and burning device with three-dimensional heat dissipation

本創作係關於一種散熱模組，尤其是關於在燒機檢測裝置上使用的散熱模組。This creation is about a kind of heat dissipation module, especially about the heat dissipation module used in the burn-in detection device.

圖1與圖2為先前技術的處理器散熱模組，如圖所示，其設置方式為，一接觸於處理器（圖中未顯示）之導熱片21，以及連接於該導熱片21之熱導管22，且該熱導管22另外固接於平行排列之鰭片組23，該散熱模組散熱方式先利用該導熱片21接收處理器所排出之熱量，接著，該導熱片21藉由該熱導管22將傳導於鰭片組23上的熱量進行散熱。Figures 1 and 2 show the processor heat dissipation module of the prior art. As shown in the figure, its arrangement is as follows: a thermal conductive sheet 21 contacting the processor (not shown in the figure), and a thermal conductive sheet 21 connected to the thermal conductive sheet 21 The heat pipe 22 is additionally fixed to the fin set 23 arranged in parallel. The heat dissipation method of the heat dissipation module first uses the heat conducting sheet 21 to receive the heat discharged from the processor, and then the heat conducting sheet 21 uses the heat The duct 22 dissipates the heat conducted on the fin group 23.

利用上述之散熱模組進行散熱時，具有以下缺點：(1) 處理器的熱量必須經由導熱片21、熱導管22、鰭片組23之順序傳導，處理器的熱主要是垂直傳遞，熱以單一方向會集中在導熱片21和熱導管22的局部，無法達到最佳散熱效果，隨著5G時代的到來，該種散熱模組已不敷達成5G散熱之需求；(2) 導熱片21需承受鰭片組23以及熱導管22的重量，更甚至另外加裝風扇的重量，隨著處理器輕薄化，當導熱片接觸處理器，散熱模組整體的重量會由處理器所承受，若處理器所承受的力不平均，非常容易導致處理器斷裂以及破損。When using the above heat dissipation module to dissipate heat, it has the following disadvantages: (1) The heat of the processor must be conducted through the heat conducting sheet 21, the heat pipe 22, and the fin set 23 in order. The heat of the processor is mainly transferred vertically, and the heat is A single direction will be concentrated on the part of the heat conducting sheet 21 and the heat pipe 22, which cannot achieve the best heat dissipation effect. With the advent of the 5G era, this type of heat dissipation module is no longer sufficient to meet the needs of 5G heat dissipation; (2) The heat conduction sheet 21 needs It can bear the weight of the fin set 23 and the heat pipe 22, and even the weight of the additional fan. As the processor becomes thinner and thinner, when the heat conductive sheet contacts the processor, the overall weight of the heat dissipation module will be borne by the processor. The uneven force on the processor can easily cause the processor to break and break.

為解決上述之缺失，本創作利用均熱板上固接散熱導管以及鰭片組來達到同時進行熱傳遞，加速散熱的功效，另外均熱板也可以分擔散熱模組的施加處理器以及熱導管的重量，以減少散熱模組以及處理器損壞的機率。In order to solve the above-mentioned deficiencies, this creation uses the heat spreading plate to fix the heat dissipation pipe and the fin group to achieve the simultaneous heat transfer and accelerate the heat dissipation effect. In addition, the heat spreading plate can also share the processor and heat pipes of the heat dissipation module. Weight to reduce the probability of damage to the heat dissipation module and processor.

據上所述，本創作提供了一種具有三維散熱之處理器散熱模組，包含：一均熱板；一散熱鰭片組，具有連接於該均熱板的複數之散熱鰭片；以及至少一散熱導管，固接於複數之散熱鰭片之間，其中該複數之散熱鰭片之同一側固接於該均熱板之一平面上。According to the above, this creation provides a processor heat dissipation module with three-dimensional heat dissipation, which includes: a heat spreading plate; a heat dissipation fin set having a plurality of heat dissipation fins connected to the heat spreading plate; and at least one The heat dissipation pipe is fixed between the plurality of heat dissipation fins, wherein the same side of the plurality of heat dissipation fins is fixed on a plane of the heat equalizing plate.

另外，本創作提供了一種具有三維散熱之處理器燒機裝置，包含：一均熱板；一燒機座，配置成收容該均熱板；一散熱鰭片組，具有複數之散熱鰭片；及至少一散熱導管，固接於複數之散熱鰭片之間，其中，該複數之散熱鰭片之同一側固接於該均熱板之一平面上。In addition, this creation provides a processor burn-in device with three-dimensional heat dissipation, which includes: a heat equalizing plate; a burn-in base configured to accommodate the equalizing plate; a heat sink fin group with a plurality of heat sink fins; And at least one heat dissipation pipe is fixed between the plurality of heat dissipation fins, wherein the same side of the plurality of heat dissipation fins is fixed on a plane of the heat equalizing plate.

如上述具有三維散熱之處理器散熱模組以及燒機裝置，其中該散熱導管之一部分固接於該均熱板之一平面上的一凹槽。Such as the above-mentioned processor heat dissipation module and burn-in device with three-dimensional heat dissipation, wherein a part of the heat dissipation pipe is fixed to a groove on a plane of the heat equalizing plate.

如上述具有三維散熱之處理器散熱模組以及燒機裝置，其中該散熱導管與該均熱板具有相連通的流體路徑。Such as the above-mentioned processor heat dissipation module and burn-in device with three-dimensional heat dissipation, wherein the heat dissipation pipe and the heat spreader have a connected fluid path.

如上述具有三維散熱之處理器散熱模組以及燒機裝置，更具有一基部，連接於該均熱板的一側，用以接觸處理器，且該基部可為一導熱片或該均熱板的一部分。For example, the processor heat dissipation module and the burn-in device with three-dimensional heat dissipation have a base connected to one side of the heat equalizing plate for contacting the processor, and the base can be a thermal conductive sheet or the equalizing plate a part of.

如上述具有三維散熱之處理器散熱模組以及燒機裝置，其中該散熱鰭片組的一側與一風扇連接，使該風扇面向該均熱板。Such as the above-mentioned processor heat dissipation module and burning device with three-dimensional heat dissipation, wherein one side of the heat dissipation fin set is connected with a fan so that the fan faces the heat equalizing plate.

本創作之實施方式將於下文中，參照本創作的理想實施方式的示意圖來進行描述。該等圖示中的形狀、設置方式會因製造技術、設計及/或公差而有所不同。因此，本創作文中所說明的實施方式不應被視為是用來將本創作結構侷限在特定的元件或形狀，其應包含任何因製作所造成在形狀方面的差異。The implementation of this creation will be described below with reference to the schematic diagram of the ideal implementation of this creation. The shapes and setting methods in these diagrams may vary due to manufacturing technology, design and/or tolerances. Therefore, the implementation described in this creation article should not be regarded as limiting the creation structure to a specific element or shape, and should include any difference in shape caused by production.

請參閱圖3與圖4所示，本創作之具有三維散熱之處理器散熱模組100，具有一均熱板（vapor chamber）110，該均熱板110底面或一側具有一基部111。該基部111用於接觸固定在一電路板上的處理器，該均熱板110之另一面固設有至少一根之散熱導管120。較佳地，如圖3和圖4所示，均熱板110在連接有散熱鰭片131的這一側形成有可對應收容部分散熱導管120的凹槽（未編號），藉此使兩者接觸面積增加。這樣的設計可不必磨平散熱導管120來與均熱板110連接。這邊需要說明的是，該散熱導管120可只焊接於該均熱板110表面上，而與該均熱板110之內部腔體不相通，只進行熱傳導，或者另一種設置方式為，該散熱導管120與該均熱板110之內部腔體相通，熱可以經由相同於均熱板110之散熱方式，在該散熱導管120內部透過工作流體汽往液返的對流快速導熱。此外，在某些實施例中，基部111可省略，並由均熱板110直接接觸處理器。根據處理器的腳數可決定均熱板110是否需要連接基部111。此與施力的考量有關。例如，對於高腳數的處理器而言，以基部111接觸的散熱效果較佳；反觀，低腳數的處理器則以均熱板110的表面接觸即可。Please refer to FIG. 3 and FIG. 4, the processor heat dissipation module 100 with three-dimensional heat dissipation of the present invention has a vapor chamber 110 with a base 111 on the bottom surface or one side thereof. The base 111 is used to contact a processor fixed on a circuit board, and at least one heat dissipation pipe 120 is fixed on the other side of the heat plate 110. Preferably, as shown in FIGS. 3 and 4, the heat equalizing plate 110 is formed with a groove (not numbered) corresponding to a portion of the heat dissipation pipe 120 on the side connected with the heat dissipation fins 131, thereby enabling both The contact area increases. In this design, it is not necessary to smooth the heat dissipation pipe 120 to connect with the heat spreading plate 110. It should be noted here that the heat dissipation pipe 120 can be welded only on the surface of the heat equalizing plate 110 without communicating with the internal cavity of the equalizing plate 110, and only conduct heat conduction, or another arrangement is that the heat dissipation The pipe 120 communicates with the inner cavity of the heat equalizing plate 110, and the heat can be dissipated through the same heat dissipation method as the equalizing plate 110, and the heat dissipation pipe 120 conducts fast heat conduction through the convection of the working fluid vapor to the liquid. In addition, in some embodiments, the base 111 may be omitted, and the heat spreader 110 directly contacts the processor. According to the number of pins of the processor, it can be determined whether the heat spreader 110 needs to be connected to the base 111. This is related to the consideration of force. For example, for a processor with a high pin count, the heat dissipation effect is better by contacting the base 111; on the other hand, a processor with a low pin count can be contacted with the surface of the heat spreader 110.

接著，散熱鰭片組130具有連接於均熱板110的複數的散熱鰭片131，該散熱導管120配置成具有蜿蜒的形狀，且固接於該散熱鰭片組130之間並穿過該散熱鰭片組130的每一散熱鰭片131，也就是說各散熱鰭片131連接該散熱導管120至少一次以上。另外各散熱鰭片131之直立式並列固接於該均熱板110上，也就是說，複數個散熱鰭片131與該均熱板110之平面呈垂直關係，並且該散熱鰭片131之一端附接於該均熱板110上。Then, the heat dissipation fin group 130 has a plurality of heat dissipation fins 131 connected to the heat equalizing plate 110, and the heat dissipation pipe 120 is configured to have a serpentine shape, and is fixed between the heat dissipation fin group 130 and passes through the heat dissipation fin group 130. Each heat dissipation fin 131 of the heat dissipation fin group 130, that is, each heat dissipation fin 131 is connected to the heat dissipation pipe 120 at least once. In addition, the radiating fins 131 are connected to the heat equalizing plate 110 in an upright manner, that is, a plurality of radiating fins 131 and the plane of the equalizing plate 110 are in a vertical relationship, and one end of the radiating fin 131 Attached to the soaking plate 110.

另外，該處理器散熱模組100也可以附加拆裝式的風扇（140），雖然圖示只顯示裝設於該散熱鰭片組130之頂部，但也可以在該散熱鰭片組130之側面部附加複數個風扇，利用熱對流進行散熱。In addition, the processor heat dissipation module 100 can also be attached with a removable fan (140). Although the figure only shows that it is installed on the top of the heat dissipation fin set 130, it can also be installed on the side of the heat dissipation fin set 130. A plurality of fans are attached to the unit to dissipate heat by heat convection.

以下針對三維散熱之處理器散熱模組100之散熱方式進行說明，當處理器啟用時（例如在執行燒機的過程），該處理器會經由均熱板110之基部111接觸，並經由該基部111，將排熱傳導至該均熱板110，而基部111最佳的設置為與該均熱板110一體成形，但也可以為另外附加導熱片的方式進行配置。較佳地，基部111與處理器的接觸面面積應足夠大以覆蓋處理器的表面。此外，基部111也可配置成任何使導熱效率提高的其他形狀。因此，該均熱板110會接收該基部111的排熱先在均熱板110內進行橫向的熱傳導，接著才同時將熱傳導於該散熱導管120以及散熱鰭片組130，直接以三維的方式同時將排熱傳導出去，即同時由散熱導管120定義的二維方向和散熱鰭片組130所定義的另一二維方向所形成的三維方向進行散熱，其中這兩個二維方向可以想像成是兩個相互垂直的平面。所述二維方向的散熱並非指熱僅能由兩個方向散失，而是因應散熱導管120和散熱鰭片組130的結構所形成的主要散熱方向是二維的相對於先前技術必須依設置順序在二維的空間進行熱傳導，此散熱方式可以直接經由均熱板110、散熱導管120以及散熱鰭片組130同時將排熱以二維的方式進行傳導以及散熱，如此一來，排熱可以更有效率的多的方向傳導、散熱，達到更快速散熱的效果。另外，先經由均熱板110之導熱可以直接先進行一段有效的橫向散熱，避免將處理器的熱過度集中在一位置，預先承受處理器的高溫。 The following describes the heat dissipation method of the processor heat dissipation module 100 for three-dimensional heat dissipation. When the processor is activated (for example, during the process of burning), the processor will contact through the base 111 of the heat spreader 110 and pass through the base. 111. Conduct the exhaust heat to the equalizing plate 110, and the base 111 is optimally configured to be integrally formed with the equalizing plate 110, but it can also be configured by adding a thermally conductive sheet. Preferably, the area of the contact surface between the base 111 and the processor should be large enough to cover the surface of the processor. In addition, the base 111 can also be configured in any other shape that improves the thermal conductivity. Therefore, the heat equalizing plate 110 receives the heat from the base 111 and conducts lateral heat conduction in the equalizing plate 110, and then conducts the heat to the heat dissipation pipe 120 and the heat dissipation fin group 130 at the same time, directly and simultaneously in a three-dimensional manner The heat is conducted out, that is, the two-dimensional direction defined by the heat dissipation pipe 120 and the other two-dimensional direction defined by the heat dissipation fin group 130 are used for heat dissipation. The two two-dimensional directions can be imagined as two Two mutually perpendicular planes. The two-dimensional heat dissipation does not mean that heat can only be dissipated in two directions, but the main heat dissipation direction formed by the structure of the heat dissipation pipe 120 and the heat dissipation fin group 130 is two-dimensional. Compared with the prior art, it must be arranged in order Conduct heat conduction in a two-dimensional space. This heat dissipation method can directly conduct and dissipate heat in a two-dimensional manner through the heat equalizing plate 110, the heat dissipation pipe 120, and the heat dissipation fin set 130. In this way, the heat dissipation can be more Efficient conduction and heat dissipation in multiple directions to achieve faster heat dissipation. In addition, the heat conduction through the heat equalizing plate 110 can directly perform a period of effective lateral heat dissipation, avoiding excessive concentration of the heat of the processor in one place, and pre-enduring the high temperature of the processor.

除此之外，當熱在該散熱導管120與該散熱鰭片組130之間進行熱傳導時，該散熱導管120在該散熱鰭片組130之間的繞固配置方式，能增加複數個散熱鰭片131與該散熱導管120的接觸面積，可以增加散熱的速度，以及此設置方式更可以使該散熱鰭片組130與環境溫度變化造成更大的壓力差來進行熱傳導，因此可相較於前案可以不用更多散熱鰭片，即可達到相同的散熱效果。 In addition, when heat conducts heat conduction between the heat dissipation pipe 120 and the heat dissipation fin set 130, the arrangement of the heat dissipation pipe 120 around the heat dissipation fin set 130 can increase a plurality of heat dissipation fins. The contact area between the fin 131 and the heat dissipation pipe 120 can increase the heat dissipation speed, and this arrangement can make the heat dissipation fin set 130 and the ambient temperature change cause a greater pressure difference to conduct heat conduction, so it can be compared with the previous The case can achieve the same heat dissipation effect without using more heat dissipation fins.

本創作之三維散熱之處理器散熱模組100也可以加裝風扇，來增加流體的對流，能使排熱可以加速散熱的速度。 The three-dimensional heat dissipation processor heat dissipation module 100 of the invention can also be equipped with a fan to increase the convection of the fluid, so that the heat dissipation can accelerate the heat dissipation speed.

以上三維散熱之處理器散熱模組100可以加裝於燒機裝置之中，形成三維散熱之處理器燒機裝置，而如習知的燒機裝置都具有可對應接收處理器的一燒機座(socket)，因此，根據上述之配置方式，該三維散熱之處理器散熱模組100於燒機座上時，該均熱板110能夠抵持於燒機座上，減少處理器的承重，且不用如先前技術，由熱導管來承重，最後導致金屬疲乏而變形，因此，此設置方式更可以增加三維散熱之處理器散熱模組100之工作壽命。 The above three-dimensional heat-dissipating processor heat dissipation module 100 can be added to the burn-in device to form a three-dimensional heat-dissipating processor burn-in device, and the conventional burn-in device has a burn-in base corresponding to the receiving processor (socket), therefore, according to the above-mentioned configuration, when the three-dimensional heat dissipation processor heat dissipation module 100 is placed on the burning base, the equalizing plate 110 can be held against the burning base, reducing the load-bearing of the processor, and It is not necessary to use the heat pipe to bear the weight as in the prior art, which will eventually cause the metal to become fatigued and deformed. Therefore, this arrangement can further increase the working life of the three-dimensional heat dissipation processor heat dissipation module 100.

100:處理器散熱模組 100: processor cooling module

110:均熱板 110: Soaking plate

111:基部 111: base

120:散熱導管 120: heat pipe

130:散熱鰭片組 130: cooling fin set

131:散熱鰭片 131: cooling fins

140:風扇 140: fan

21:先前技術之導熱片 21: The thermal conductive sheet of the prior art

22:先前技術之熱導管 22: Heat pipe of prior art

23:先前技術之鰭片組23: Prior art fin set

圖1係顯示先前技術的散熱模組之前視圖。 圖2係顯示先前技術的散熱模組之側視圖。 圖3係顯示具有三維散熱之處理器散熱模組之立體圖。 圖4係顯示具有三維散熱之處理器散熱模組之側視圖。 Figure 1 shows a front view of a prior art heat dissipation module. Figure 2 shows a side view of the prior art heat dissipation module. Figure 3 is a perspective view showing a processor heat dissipation module with three-dimensional heat dissipation. Fig. 4 shows a side view of a processor heat dissipation module with three-dimensional heat dissipation.

100:處理器散熱模組 100: processor cooling module

110:均熱板 110: Soaking plate

111:基部 111: base

120:散熱導管 120: heat pipe

130:散熱鰭片組 130: cooling fin set

131:散熱鰭片 131: cooling fins

140:風扇 140: fan

Claims (8)

一種具有三維散熱之處理器散熱模組，包含： 一均熱板； 一散熱鰭片組，具有連接於該均熱板的複數之散熱鰭片；以及 至少一散熱導管，固接於複數之散熱鰭片之間， 其中該複數之散熱鰭片之同一側固接於該均熱板之一平面上。 A processor heat dissipation module with three-dimensional heat dissipation, including: A hot plate; A heat dissipation fin group having a plurality of heat dissipation fins connected to the heat equalizing plate; and At least one heat dissipation pipe is fixedly connected between the plurality of heat dissipation fins, The same side of the plurality of radiating fins is fixed on a plane of the heat equalizing plate. 如請求項1所述之具有三維散熱之處理器散熱模組，其中該散熱導管之一部分固接於該均熱板之一平面上的一凹槽。The processor heat dissipation module with three-dimensional heat dissipation according to claim 1, wherein a part of the heat dissipation pipe is fixed to a groove on a plane of the heat plate. 如請求項1所述之具有三維散熱之處理器散熱模組，其中該散熱導管與該均熱板具有相連通的流體路徑。The processor heat dissipation module with three-dimensional heat dissipation according to claim 1, wherein the heat dissipation pipe and the heat equalizing plate have a connected fluid path. 如請求項1所述之具有三維散熱之處理器散熱模組，更包含一基部，該基部連接於該均熱板的一側，用以接觸處理器。The processor heat dissipation module with three-dimensional heat dissipation as described in claim 1, further comprising a base part connected to one side of the heat equalizing plate for contacting the processor. 如請求項4所述之具有三維散熱之處理器散熱模組，其中該基部可為一導熱片或該均熱板的一部分。The processor heat dissipation module with three-dimensional heat dissipation according to claim 4, wherein the base may be a thermally conductive sheet or a part of the heat spreader. 如請求項1所述之具有三維散熱之處理器散熱模組，其中該散熱鰭片組的一側與一風扇連接，使該風扇面向該均熱板。The processor heat dissipation module with three-dimensional heat dissipation according to claim 1, wherein one side of the heat dissipation fin set is connected to a fan so that the fan faces the heat equalizing plate. 一種具有三維散熱之處理器燒機裝置，包含： 一均熱板； 一燒機座，配置成收容該均熱板； 一散熱鰭片組，具有複數之散熱鰭片；及 至少一散熱導管，固接於複數之散熱鰭片之間， 其中，該複數之散熱鰭片之同一側固接於該均熱板之一平面上。 A processor burn-in device with three-dimensional heat dissipation, including: A hot plate; The first-burning machine base is configured to accommodate the soaking plate; A heat dissipation fin group with plural heat dissipation fins; and At least one heat dissipation pipe is fixedly connected between the plurality of heat dissipation fins, Wherein, the same side of the plurality of heat dissipation fins is fixed on a plane of the heat equalizing plate. 如請求項7所述之具有三維散熱之處理器燒機裝置，更包含一基部，該基部連接於該均熱板的一側，用以接觸處理器。The processor burn-in device with three-dimensional heat dissipation according to claim 7, further comprising a base connected to one side of the heat equalizing plate for contacting the processor.

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