TWM596373U

TWM596373U - Server structure

Info

Publication number: TWM596373U
Application number: TW109200968U
Authority: TW
Inventors: 穆冠良
Original assignee: 英屬維京群島商鯨鏈先進股份有限公司
Priority date: 2020-01-21
Filing date: 2020-01-21
Publication date: 2020-06-01

Abstract

一種伺服器結構，其包括電子作動模組和氣流產生件，電子作動模組包括彼此間隔排列的多個板件，每個板件的板面上具有多個熱源產生元件，每個板件具有相對的第一端緣和第二端緣，每個板件的第一端緣設置空缺部；氣流產生件設置於每個板件的第一端緣的一側，並且與空缺部對應，氣流產生件產生的氣流自多個板件的第一端緣通過多個板件之間，氣流帶走多個熱源產生元件所產生的熱源至電子作動模組外。氣流產生件產生的氣流通過空缺部的結構在進入各板件間的空間前能夠混合而使氣流進入各空間的氣流量達到均勻化。A server structure includes an electronic actuation module and an airflow generating element. The electronic actuation module includes a plurality of plates arranged at a distance from each other. Each plate has a plurality of heat source generating elements on its surface, and each plate has Opposite the first end edge and the second end edge, the first end edge of each plate member is provided with a vacant portion; the airflow generating member is provided on one side of the first end edge of each plate member, and corresponds to the vacant portion, the airflow The air flow generated by the generating part passes between the first end edges of the plurality of plate parts through the plurality of plate parts, and the air flow takes away the heat source generated by the plurality of heat source generating elements to the outside of the electronic actuator module. The airflow generated by the airflow generating member can be mixed before entering the space between the plate members through the structure of the vacant portion, so that the airflow rate of the airflow entering each space can be uniformized.

Description

伺服器結構Server structure

本申請涉及伺服器的技術領域，尤其涉及一種使散熱氣流均勻分佈的伺服器結構。The present application relates to the technical field of servers, and in particular to a server structure that distributes heat radiation airflow uniformly.

伺服器具有多片電路板，在每個電路板上的電子元件在運行時會產生熱，因此通常在伺服器中設置風扇以產生氣流，使氣流通過電路板的電子元件進行散熱，以避免電子元件溫度過高而影響其運行狀態。現有技術是將風扇設置在電路板的端緣處，風扇產生的氣流從電路板的端緣進入相鄰電路板相對排列所形成的空間中，且沿著板面通過發熱的電子元件進行散熱。因為風扇在軸心與邊緣處的風速不同，而且在各電路板上電子元件的配置也不相同而使得各空間的流阻也不相同，因此容易造成進入電路板間的各空間的氣流量無法均勻分佈，對各電路板上的電子元件的散熱效能因而產生差異。另外，氣流在流過電路板的板緣處容易產生風切噪音。The server has multiple circuit boards, and the electronic components on each circuit board generate heat during operation. Therefore, a fan is usually installed in the server to generate airflow, and the airflow is dissipated through the electronic components of the circuit board to avoid electronic The component temperature is too high and affects its operating status. In the prior art, a fan is arranged at the edge of the circuit board, and the air flow generated by the fan enters the space formed by the relative arrangement of adjacent circuit boards from the edge of the circuit board, and dissipates heat through the heat-generating electronic components along the board surface. Because the fan has different wind speeds at the axis and the edge, and the arrangement of electronic components on each circuit board is different, the flow resistance of each space is also different, so it is easy to cause the air flow into each space between the circuit boards Evenly distributed, the heat dissipation efficiency of the electronic components on each circuit board is thus different. In addition, the airflow easily generates wind shear noise at the edge of the circuit board.

本申請實施例提供一種伺服器結構，解決目前伺服器中多個電路板間氣流量不均勻所造成的散熱效率不平均的問題。Embodiments of the present application provide a server structure to solve the problem of uneven heat dissipation efficiency caused by uneven air flow among multiple circuit boards in the server.

為了解決上述技術問題，本申請是這樣實現的：In order to solve the above technical problems, this application is implemented as follows:

提供了一種伺服器結構，其包括電子作動模組和氣流產生件，電子作動模組包括彼此間隔排列的多個板件，每個板件的板面上具有多個熱源產生元件，每個板件具有相對的第一端緣和第二端緣，每個板件的第一端緣設置空缺部；氣流產生件設置於每個板件的第一端緣的一側，並且與空缺部對應，氣流產生件產生的氣流自多個板件的第一端緣通過多個板件之間，氣流帶走多個熱源產生元件所產生的熱源至電子作動模組外。A server structure is provided, which includes an electronic actuation module and an airflow generating member. The electronic actuation module includes a plurality of board members arranged at a distance from each other, each board member has a plurality of heat source generating elements on the board surface, and each board The piece has opposite first and second end edges, and the first end edge of each plate member is provided with a vacant portion; the airflow generating member is provided on one side of the first end edge of each plate member, and corresponds to the vacant portion The airflow generated by the airflow generating element passes through the first end edges of the plurality of plates through the plurality of plates, and the airflow takes away the heat generated by the plurality of heat source generating elements to the outside of the electronic actuator module.

在本申請實施例中，通過在板件的第一端緣處形成空缺部，讓氣流產生模組產生的氣流通過空缺部的結構在進入各板件間的空間前能夠混合而使氣流進入各空間的氣流量達到均勻化，從而使進入各空間的散熱量達到平均，解決板件間各空間的散熱效率不均的問題。另外，通過在各板件的第一端緣設置空缺部，氣流在流經各板件的第一端緣處時，可降低風切噪音。In the embodiment of the present application, by forming a vacant portion at the first end edge of the plate, the airflow generated by the airflow generation module can be mixed through the structure of the vacant portion before entering the space between each plate, so that the airflow enters each The air flow in the space is uniform, so that the heat dissipation into each space is averaged, and the problem of uneven heat dissipation efficiency in each space between the plates is solved. In addition, by providing a vacant portion at the first end edge of each plate, the airflow can reduce the wind shear noise when flowing through the first end edge of each plate.

下面將結合本申請實施例中的附圖，對本申請實施例中的技術方案進行清楚、完整地描述，顯然，所描述的實施例是本申請一部分實施例，而不是全部的實施例。基於本申請中的實施例，所屬技術領域中具有通常知識者在沒有作出創造性勞動前提下所獲得的所有其他實施例，都屬於本申請保護的範圍。The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by persons with ordinary knowledge in the technical field without making creative work fall within the protection scope of the present application.

請參閱圖1、圖2、圖3和圖4，其是本申請一實施例的伺服器結構的立體圖、圖1的伺服器結構的前視圖、圖1的伺服器結構的立體分解圖和圖2的伺服器結構的分解圖；如圖所示，本實施例提供一種伺服器結構100，其包括電子作動模組10和氣流產生件21，電子作動模組10包括彼此間隔排列的多個板件11，每個板件11的板面上具有多個熱源產生元件，每個板件11具有相對的第一端緣111和第二端緣113，在至少一個板件11的所述第一端緣111設置空缺部112；氣流產生件21設置於每個板件11的所述第一端緣111的一側，並且與空缺部112對應，氣流產生件21產生的氣流自多個板件11的第一端緣111通過多個板件11之間，氣流帶走多個熱源產生元件所產生的熱源至電子作動模組10外。Please refer to FIG. 1, FIG. 2, FIG. 3 and FIG. 4, which are a perspective view of a server structure according to an embodiment of the present application, a front view of the server structure of FIG. 1, a perspective exploded view and a diagram of the server structure of FIG. 2 is an exploded view of the server structure; as shown in the figure, this embodiment provides a server structure 100, which includes an electronic actuation module 10 and an airflow generating member 21, the electronic actuation module 10 includes a plurality of plates arranged at intervals from each other Each plate 11 has a plurality of heat source generating elements on the surface of each plate 11, each plate 11 has a first end 111 and a second end 113 opposite to each other. The edge 111 is provided with a vacant portion 112; the airflow generating member 21 is provided on one side of the first end edge 111 of each plate 11 and corresponds to the vacant portion 112, and the airflow generated by the airflow generating member 21 comes from a plurality of plates The first end 111 of the 11 passes between the plurality of plate members 11, and the airflow takes away the heat sources generated by the multiple heat source generating elements to the outside of the electronic actuator module 10.

圖1、圖2、圖3和圖4所示的伺服器結構100，為了方便說明且清楚地表示本申請的主要技術特徵，因此省略伺服器的外殼。電子作動模組10是執行伺服器電子功能的模組，其包括多個板件11，多個板件11彼此間隔設置。在板件11上具有多個熱源產生元件（未圖示）。在本實施例中，板件11是電路板，熱源產生元件是電子元件。因為電子元件在運行時會發熱，例如處理器晶片或各種高功率元件。因而在板件11上成為多個熱源產生元件。因為過高的溫度會影響電子元件的運行，因此必須對多個熱源產生元件進行散熱，使板件11間的空間維持在適當的溫度，以確保電子作動模組10運行的效能。在板件11的第一端緣111設置氣流產生件21，氣流產生件21產生氣流，所述氣流從板件11的第一端緣111進入板件11間的空間，而且流過多個熱源產生元件，以強制對流的方式進行散熱。氣流產生件21是與空缺部112對應設置，在本實施例中，空缺部112的位置是對準氣流產生件21的出風口。The server structure 100 shown in FIG. 1, FIG. 2, FIG. 3, and FIG. 4 shows the main technical features of the present application for convenience of description and clearly, so the housing of the server is omitted. The electronic actuation module 10 is a module that performs the electronic functions of the server, and includes a plurality of boards 11 that are spaced apart from each other. The plate 11 has a plurality of heat source generating elements (not shown). In this embodiment, the board 11 is a circuit board, and the heat source generating element is an electronic element. Because electronic components generate heat during operation, such as processor chips or various high-power components. Therefore, a plurality of heat source generating elements are formed on the plate 11. Because the excessively high temperature will affect the operation of the electronic components, it is necessary to dissipate heat from the multiple heat source generating components to maintain the space between the boards 11 at an appropriate temperature to ensure the performance of the electronic actuator module 10. An airflow generating member 21 is provided on the first end edge 111 of the plate 11. The airflow generating member 21 generates an airflow that enters the space between the plate 11 from the first end 111 of the plate 11 and flows through multiple heat sources The components dissipate heat by forced convection. The airflow generating member 21 is provided corresponding to the vacant portion 112. In this embodiment, the position of the vacant portion 112 is aligned with the air outlet of the airflow generating member 21.

在本實施例中，多個板件11是彼此等間距排列。在本實施例中，多個板件11是彼此平行設置。但本申請不限於此，各板件11間的間距也可以是相異的，例如各板件11設置不同結構的導熱組件 30，各板件11間的間距可以根據不同導熱組件 30的高度而改變。每個板件11呈長方形結構且具有相對設置的第一端緣111和第二端緣113，氣流產生件21可設置在靠近第一端緣111處和第二端緣113處。空缺部112對應於氣流產生件21，使氣流產生件21產生的氣流可以在與板件11的板面垂直的方向流動，使板件11間各空間的進氣量平均化。In this embodiment, the plurality of plate members 11 are arranged at equal intervals from each other. In this embodiment, the plurality of plate members 11 are arranged parallel to each other. However, the present application is not limited to this. The spacing between the plates 11 may also be different. For example, each plate 11 is provided with a thermally conductive component 30 having a different structure. The spacing between the plates 11 may vary according to the height of the different thermal components 30 change. Each plate 11 has a rectangular structure and has a first end 111 and a second end 113 oppositely disposed. The airflow generating member 21 may be disposed near the first end 111 and the second end 113. The vacant portion 112 corresponds to the airflow generating member 21 so that the airflow generated by the airflow generating member 21 can flow in a direction perpendicular to the plate surface of the plate 11 to equalize the intake air amount in each space between the plate 11.

本申請的伺服器結構100還包括輔助導流件22，輔助導流件22設置於每個板件10的第二端緣113，並且與氣流產生件21相對，輔助導流件22導引帶有熱源的氣流自第二端緣113離開電子作動模組10。例如在氣流產生件21的出風端朝向第一端緣111，而能夠對板件11間的各空間進氣，而輔助導流件22的進風端則朝向第二端緣113，而能夠對板件11間的各空間排氣。在本實施例中，氣流產生件21與輔助導流件22都是軸流式風扇。The server structure 100 of the present application further includes an auxiliary deflector 22 disposed on the second end edge 113 of each plate 10 and opposed to the air flow generating member 21, and the auxiliary deflector 22 guides the belt The airflow with the heat source leaves the electronic actuation module 10 from the second end edge 113. For example, the air outlet end of the airflow generating member 21 faces the first end edge 111, and air can be drawn into each space between the plate members 11, while the air inlet end of the auxiliary deflector 22 faces the second end edge 113. The spaces between the panels 11 are exhausted. In this embodiment, the airflow generating member 21 and the auxiliary air guide 22 are both axial fans.

本申請的伺服器結構100還包括多個導熱組件 30，其設置在每個板件11的板面且與熱源產生元件熱連接，氣流通過多個導熱組件 30。導熱組件 30是將熱源產生元件的熱傳導到表面積較大的結構，當氣流通過導熱組件 30時，可以增加單位時間的散熱量，起快速降溫的作用。在本實施例中，導熱組件 30可以是例如散熱鰭片。另外，為了避免氣流流經不需要散熱的區域（沒有熱源產生元件的區域），本申請的伺服器結構100還包括氣流導引件40，設置在板件11的板面，氣流沿著所述氣流導引件40通過熱源產生元件。在本實施例中，氣流導引件40是導板，沿著導熱組件30設置，氣流由板件11的第一端緣111進入板件11間的空間後，通過氣流導引件40的導引流過導熱組件30而不會進入如圖1和圖3所示的板件11上方的不需要散熱的區域。The server structure 100 of the present application further includes a plurality of thermally conductive components 30 that are disposed on the surface of each plate 11 and are thermally connected to the heat source generating element, and the airflow passes through the plurality of thermally conductive components 30. The heat-conducting component 30 is a structure that conducts the heat of the heat-source generating element to a larger surface area. When the airflow passes through the heat-conducting component 30, the heat dissipation per unit time can be increased and the temperature can be rapidly reduced. In this embodiment, the heat conductive component 30 may be, for example, heat dissipation fins. In addition, in order to prevent the airflow from flowing through the area that does not require heat dissipation (the area without the heat source generating element), the server structure 100 of the present application further includes an airflow guide 40 disposed on the surface of the plate 11 and the airflow is along the The air flow guide 40 passes through the heat source generating element. In this embodiment, the airflow guide 40 is a guide plate, which is disposed along the thermally conductive assembly 30. After the airflow enters the space between the plates 11 from the first end 111 of the plate 11, the airflow guide 40 guides the airflow guide 40. It drains through the thermally conductive assembly 30 without entering the area above the plate 11 shown in FIGS. 1 and 3 that does not require heat dissipation.

因為單位時間內通過熱源產生元件的氣流量越大，可帶走的熱量就越多，所以板件11間的各空間的氣流量與板件11上的熱源產生元件的散熱效率有關。另外，因為熱對流效能除了與散熱結構有關以外，也與氣流的物理性質和氣流的平均速度有關，為了使每個板件11上的散熱效率能夠平均，在每個板件11上的散熱結構相同或近似的情況下，希望在板件11間的各空間中的氣流速度也能夠接近，以便使每個板件11都得到平均的散熱效率。Because the larger the air flow rate through the heat source generating element per unit time, the more heat can be taken away, so the air flow rate in each space between the plates 11 is related to the heat dissipation efficiency of the heat source generating elements on the plate 11. In addition, because the thermal convection efficiency is not only related to the heat dissipation structure, but also to the physical properties of the airflow and the average speed of the airflow, in order to make the heat dissipation efficiency on each plate 11 average, the heat dissipation structure on each plate 11 Under the same or similar conditions, it is desirable that the airflow velocity in the spaces between the plates 11 can also be close, so that each plate 11 can obtain an average heat dissipation efficiency.

請參閱圖5及圖6，其是圖1的伺服器結構移除熱傳導件及殼體的立體圖和圖5的伺服器結構的前視圖；在圖5及圖6中，為了清楚地表示各板件11間形成氣流通道的空間，因此省略導熱組件 30、氣流導引件40和輔助導流件22。如圖所示，氣流產生件21設置在靠近每個板件11的第一端緣111。在氣流產生件21產生的氣流的流速不平均的情況下，例如軸流式風扇產生的氣流的速度在不同的位置會有不平均的情況，其在扇葉的軸心與邊緣處的風速不同，而因為板件11間的各空間對應氣流產生件21（軸流式風扇）不同的位置，因而板件11間的各空間的進氣的氣流速度也不同。Please refer to FIG. 5 and FIG. 6, which is a perspective view of the server structure of FIG. 1 with the heat conduction member and housing removed and a front view of the server structure of FIG. 5; in FIGS. 5 and 6, in order to clearly show the boards The space between the pieces 11 forms an air flow path, so the heat conduction assembly 30, the air flow guide 40 and the auxiliary flow guide 22 are omitted. As shown in the figure, the airflow generating member 21 is disposed near the first end edge 111 of each plate 11. In the case where the flow rate of the air flow generated by the air flow generating member 21 is uneven, for example, the speed of the air flow generated by the axial fan may be uneven at different positions, and the wind speed at the axis of the blade and the edge is different And, because the spaces between the plates 11 correspond to different positions of the airflow generating member 21 (axial fan), the airflow velocity of the intake air in the spaces between the plates 11 is also different.

本申請的電子作動模組10的板件11的第一端緣111處設置空缺部112，氣流產生件21產生的氣流在進入板件11間的各空間前，可以在與板件11垂直的方向上流動，也就是讓氣流在進入板件11間的各空間前能夠充分混合，使氣流在進入板件11間的各空間前的平均氣流量相近，以便對各板件11起相近的散熱效果。The first end edge 111 of the board 11 of the electronic actuation module 10 of the present application is provided with a vacant portion 112. The airflow generated by the airflow generating member 21 can be perpendicular to the board 11 before entering the spaces between the board 11 Flow in the direction, that is, the air flow can be fully mixed before entering the spaces between the plates 11, so that the average air flow before the air flows into the spaces between the plates 11 is similar, so that the plates 11 have similar heat dissipation effect.

如圖6所示，在本實施例中，空缺部112是設置在板件11的第一端緣111處的缺口，空缺部112的至少一個邊緣呈直線狀。空缺部112的至少一個邊緣與第一端緣111平行。空缺部112的邊緣是指與第一端緣111連接且定義出空缺部112輪廓的板件11的邊緣。在本實施例中，空缺部112的邊緣包括與第一端緣111連接的兩個傾斜邊緣以及與第一端緣111平行的平行邊緣，空缺部112的平行邊緣上各位置都與第一端緣111的延伸線L保持相同的垂直距離，但在在另一實施例中，空缺部112的邊緣呈圓弧狀。使得空缺部112的邊緣上各位置的與第一端緣111的延伸線具有不同的垂直距離。空缺部112（缺口）的邊緣形狀可以視需求決定在此並非限定。另外，各板件11的空缺部112也可根據需求彼此具有相異的邊緣輪廓或相同輪廓但具有不同的寬度（與第一端緣111的延伸線L的垂直距離），例如如前所述，在各板件11設置不同結構的導熱組件 30的情況，因為各板件11間所需要的氣流量不同，因此各板件11的空缺部112的寬度或輪廓也可以根據所希望得到的氣流量做不同的變化。As shown in FIG. 6, in this embodiment, the vacant portion 112 is a notch provided at the first end edge 111 of the plate 11, and at least one edge of the vacant portion 112 is linear. At least one edge of the void 112 is parallel to the first end edge 111. The edge of the void 112 refers to the edge of the plate 11 connected to the first end 111 and defining the outline of the void 112. In this embodiment, the edge of the vacant portion 112 includes two inclined edges connected to the first end edge 111 and a parallel edge parallel to the first end edge 111. Each position on the parallel edge of the vacant portion 112 is the same as the first end The extension line L of the rim 111 maintains the same vertical distance, but in another embodiment, the edge of the vacant portion 112 has an arc shape. Therefore, each position on the edge of the vacant portion 112 has a different vertical distance from the extension line of the first end edge 111. The shape of the edge of the vacant portion 112 (notch) may be determined according to needs, and is not limited herein. In addition, the vacant portions 112 of each plate 11 may have different edge profiles or the same profile but different widths (vertical distance from the extension line L of the first end edge 111) according to requirements, for example, as described above In the case where each plate 11 is provided with a thermally conductive assembly 30 of a different structure, because the required air flow between the plates 11 is different, the width or contour of the vacant portion 112 of each plate 11 can also be based on the desired air Different changes in traffic.

在第一端緣111的長度較大的情況下，可以在第一端緣111設置多個氣流產生件21，如圖5和圖6所示，可以沿第一端緣111上下設置兩個氣流產生件21，而每個板件11可以對應氣流產生件21的位置設置多個空缺部112。In the case where the length of the first end 111 is large, a plurality of airflow generating members 21 may be provided on the first end 111, as shown in FIGS. 5 and 6, two airflows may be provided up and down along the first end 111 The generating member 21, and each plate member 11 may be provided with a plurality of vacant portions 112 corresponding to the position of the airflow generating member 21.

另外，為了避免氣流散逸到其他不需要散熱的空間，在最底部的板件11（最靠近殼體壁的板件）可以不形成空缺部112，避免氣流散逸至殼體與板件11間的空間。In addition, in order to prevent the airflow from escaping to other spaces that do not require heat dissipation, the bottom plate 11 (the plate closest to the housing wall) may not form a void 112 to prevent the airflow from escaping between the housing and the plate 11 space.

另外，因為氣流經過第二端緣113時已經吸收熱源產生元件的熱而具有較高的溫度，為了順利將溫度較高的氣流排出，除了在第二端緣113處設置二氣流產生件22，將溫度較高的氣流排出，在板件11的第二端緣113處不設置空缺部。In addition, because the airflow has absorbed the heat of the heat source generating element when passing through the second end 113 and has a higher temperature, in order to smoothly discharge the airflow with a higher temperature, in addition to the provision of two airflow generating elements 22 at the second end 113, The airflow with a higher temperature is discharged, and no vacant portion is provided at the second end edge 113 of the plate 11.

綜上所述，本申請提供一種伺服器結構，其在各板件的第一端緣（進氣端）設置多個空缺部，當氣流產生件產生的氣流從各板件的第一端緣進入各板件間的空間時，氣流可通過空缺部在與板件垂直的方向上流動，從而使進入各板件間的空間的氣流量達到平均，進而使氣流對各板件的散熱效率平均化。In summary, the present application provides a server structure, which is provided with a plurality of vacancies at the first end edge (intake end) of each plate member, when the air flow generated by the airflow generating member flows from the first end edge of each plate member When entering the space between the plates, the airflow can flow through the vacant portion in the direction perpendicular to the plates, so that the air flow into the space between the plates is averaged, and the heat dissipation efficiency of the airflow to the plates is averaged. Change.

另外，需要說明的是，在本文中，術語“包括”、“包含”或者其任何其他變體意在涵蓋非排他性的包含，從而使得包括一系列要素的過程、方法、物品或者裝置不僅包括那些要素，而且還包括沒有明確列出的其他要素，或者是還包括為這種過程、方法、物品或者裝置所固有的要素。在沒有更多限制的情況下，由語句“包括一個……”限定的要素，並不排除在包括該要素的過程、方法、物品或者裝置中還存在另外的相同要素。In addition, it should be noted that in this article, the terms "include", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those Elements, but also include other elements that are not explicitly listed, or include elements inherent to this process, method, article, or device. Without more restrictions, the element defined by the sentence "include one..." does not exclude that there are other identical elements in the process, method, article or device that includes the element.

上面結合附圖對本申請的實施例進行了描述，但是本申請並不局限於上述的具體實施方式，上述的具體實施方式僅僅是示意性的，而不是限制性的，所屬技術領域中具有通常知識者在本申請的啟示下，在不脫離本申請宗旨和申請專利範圍所保護的範圍情況下，還可做出很多形式，均屬於本申請的保護之內。The embodiments of the present application have been described above with reference to the drawings, but the present application is not limited to the above-mentioned specific embodiments. The above-mentioned specific embodiments are only schematic, not restrictive, and have general knowledge in the technical field to which they belong. Under the inspiration of this application, many forms can be made without departing from the purpose of this application and the scope of protection of the scope of patent application, which are all covered by the protection of this application.

10:電子作動模組 11:板件 21:氣流產生件 22:輔助導流件 30:導熱組件 40:氣流導引件 100:伺服器結構 111:第一端緣 112:空缺部 113:第二端緣 L:延伸線 10: Electronic actuator module 11: Board 21: Air flow generating parts 22: auxiliary deflector 30: Thermal component 40: Airflow guide 100: server structure 111: first edge 112: Vacancy Department 113: Second edge L: extension line

此處所說明的附圖用來提供對本申請的進一步理解，構成本申請的一部分，本申請的示意性實施例及其說明用於解釋本申請，並不構成對本申請的不當限定。在附圖中：圖1是本申請一實施例的伺服器結構的立體圖：圖2是圖1的伺服器結構的前視圖；圖3是圖1的伺服器結構的立體分解圖；圖4是圖2的伺服器結構的分解圖；圖5是圖1的伺服器結構移除熱傳導件及殼體的立體圖；以及圖6是圖5的伺服器結構的前視圖。 The drawings described herein are used to provide a further understanding of the present application and form a part of the present application. The schematic embodiments and descriptions of the present application are used to explain the present application and do not constitute an undue limitation on the present application. In the drawings: FIG. 1 is a perspective view of a server structure according to an embodiment of the application: 2 is a front view of the structure of the server of FIG. 1; 3 is an exploded perspective view of the structure of the server of FIG. 1; 4 is an exploded view of the structure of the server of FIG. 2; 5 is a perspective view of the server structure of FIG. 1 with the heat conductive member and the housing removed; and 6 is a front view of the structure of the server of FIG.

11:板件 11: Board

21:氣流產生件 21: Air flow generating parts

111:第一端緣 111: first edge

112:空缺部 112: Vacancy Department

113:第二端緣 113: Second edge

L:延伸線 L: extension line

Claims

一種伺服器結構，其包括一電子作動模組和一氣流產生件，該電子作動模組包括彼此間隔排列的多個板件，每個該板件的板面上具有複數個熱源產生元件，每個該板件具有相對的一第一端緣和一第二端緣，至少一該板件的該第一端緣設置一空缺部；該氣流產生件設置於每個該板件的該第一端緣的一側，並且與該空缺部對應，該氣流產生件產生的氣流自該等板件的該第一端緣通過該等板件之間，該氣流帶走該等熱源產生元件所產生的熱源至該電子作動模組外。A server structure includes an electronic actuation module and an air flow generating member. The electronic actuation module includes a plurality of plates arranged at intervals from each other, and each plate has a plurality of heat source generating elements on the surface of the plate. Each of the plate members has a first end edge and a second end edge opposite to each other, at least one of the first end edges of the plate member is provided with a vacant portion; the airflow generating member is provided on the first end of each plate member One side of the edge, and corresponding to the vacant portion, the airflow generated by the airflow generating member passes from the first end edges of the plates through the plates, and the airflow takes away the heat source generating elements Heat source outside the electronic actuator module.

如請求項1所述的伺服器結構，其更包括一輔助導流件，該輔助導流件設置於每個該板件的該第二端緣，並且與該氣流產生件相對，該輔助導流件導引帶有該熱源的該氣流自該第二端緣離開該電子作動模組。The server structure according to claim 1, further comprising an auxiliary deflector, the auxiliary deflector is disposed on the second end edge of each of the plates, and is opposite to the airflow generating element, the auxiliary deflector The flow member guides the air flow with the heat source to leave the electronic actuation module from the second end edge.

如請求項1所述的伺服器結構，其中，該空缺部是包括至少一個缺口。The server structure according to claim 1, wherein the vacant portion includes at least one notch.

如請求項3所述的伺服器結構，其中，該空缺部的至少一個邊緣呈直線狀或圓弧狀。The server structure according to claim 3, wherein at least one edge of the vacant portion is linear or arc-shaped.

如請求項4所述的伺服器結構，其中，該空缺部的至少一個邊緣與該第一端緣平行。The server structure according to claim 4, wherein at least one edge of the void is parallel to the first end edge.

如請求項1所述的伺服器結構，其中，還包括複數個導熱組件，該等導熱組件分別設置在每個該板件的該板面且並且與該等熱源產生元件對應。The server structure according to claim 1, further comprising a plurality of thermally conductive components, the thermally conductive components are respectively disposed on the surface of each of the plates and correspond to the heat source generating elements.

如請求項1所述的伺服器結構，其更包括一氣流導引件，設置在該板件的該板面，該氣流沿著該氣流導引件通過該等熱源產生元件。The server structure according to claim 1, further comprising an airflow guide member disposed on the board surface of the plate member, the airflow passing through the heat source generating elements along the airflow guide member.

如請求項1所述的伺服器結構，其中，該板件是電路板，該熱源產生元件是電子元件。The server structure according to claim 1, wherein the board is a circuit board, and the heat source generating element is an electronic element.

如請求項1所述的伺服器結構，其中，該等板件是彼此等間距排列。The server structure according to claim 1, wherein the boards are arranged at equal intervals from each other.