TWM595562U

TWM595562U - Diamond arranging device of diamond conditioner

Info

Publication number: TWM595562U
Application number: TW108214768U
Authority: TW
Inventors: 李文華; 顏冠緻
Original assignee: 銓科光電材料股份有限公司
Priority date: 2019-11-07
Filing date: 2019-11-07
Publication date: 2020-05-21
Also published as: CN211846222U

Abstract

本創作係為一種鑽石整理器之鑽石排列整理裝置，其包括有一整理板，整理板上設有複數鑽石容置槽，鑽石容置槽可為圓形鑽石容置槽或橢圓形鑽石容置槽，且每一鑽石容置槽的開口大小，皆小於鑽石的直徑，當鑽石落入鑽石容置槽時，能使鑽石的銳利端朝外。本創作利用特殊的鑽石容置槽設計，能有效整理鑽石，令鑽石鑲設於鑽石整理器時，銳利表面皆能外露於鑽石整理器外，能避免鑽石的平面露出於鑽石整理器，影響鑽石整理器的切削率。This creation is a diamond arrangement and arrangement device of a diamond arrangement, which includes a arrangement plate, which is provided with a plurality of diamond accommodation grooves. The diamond accommodation groove may be a round diamond accommodation groove or an oval diamond accommodation groove And, the opening size of each diamond containing groove is smaller than the diameter of the diamond. When the diamond falls into the diamond containing groove, the sharp end of the diamond can face outward. This creation uses a special diamond receiving slot design, which can effectively organize diamonds, so that when the diamond is set in the diamond organizer, the sharp surface can be exposed outside the diamond organizer, which can prevent the plane of the diamond from being exposed to the diamond organizer and affecting the diamond. The cutting rate of the finisher.

Description

鑽石整理器之鑽石排列整理裝置Diamond arrangement and arrangement device of diamond arrangement

本創作係有關一種製作鑽石整理器之技術，特別是一種能整理鑽石整理器上佈設的鑽石之鑽石整理器之鑽石排列整理裝置。This creation relates to a technique for making diamond sorters, especially a diamond sorting and sorting device that can sort diamonds arranged on the diamond sorter.

化學機械平坦化(Chemical-Mechanical Planarization，CMP)，是一種常見於半導體製程中的技術，化學機械平坦化係使用機械力搭配化學腐蝕對加工過程中的晶圓或其他半導體元件的表面進行平坦化處理。Chemical-Mechanical Planarization (CMP) is a technique commonly used in semiconductor manufacturing processes. Chemical-mechanical planarization uses mechanical force and chemical etching to planarize the surface of wafers or other semiconductor devices during processing deal with.

在半導體的化學機械平坦化製程中，常見的技術係利用研磨墊(Pad)接觸晶圓或是其他半導體元件的表面，以對晶圓或是其他半導體元件利用機械力進行研磨，在研磨的同時一併搭配化學腐蝕的研磨液(Slurry)使用，以透過化學反應與物理機械力來移除晶圓或其他半導體元件表面之雜質或不平坦結構。In the chemical mechanical planarization process of semiconductors, a common technique is to use a pad to contact the surface of the wafer or other semiconductor devices to polish the wafer or other semiconductor devices by mechanical force. It is also used with chemical etching slurry (Slurry) to remove impurities or uneven structures on the surface of wafers or other semiconductor devices through chemical reactions and physical mechanical forces.

其中鑽石整理器的切削率(cutting rate)會隨著鑽石排列角度及密度而有所改變，因此為提高鑽石整理器的切削率，鑽石整理器上的鑽石排列角度及密度就顯得相當重要，但過去製作鑽石整理器時，對於鑽石整理器上鑽石的露出面並沒有一個有效製作方式，導致鑽石整理器的成品可能有多數鑽石平面朝外的風險，此種鑽石的設置方式不但影響到鑽石整理器的切削率，同時鑽石也容易從鑽石整理器上脫落。當鑽石整理器的品質不良時，更一併影響到後續研磨晶圓或其他半導體的品質，因此鑽石整理器的品質是否優良，對於晶圓或其他半導體製成良率具有相當深遠的影響，相對的對於半導體產業來說也是相當重要的一環。The cutting rate of the diamond sorter will change with the angle and density of the diamond arrangement. Therefore, in order to improve the cutting rate of the diamond sorter, the angle and density of the diamond arrangement on the diamond sorter are very important, but In the past, when making a diamond sorter, there was no effective way to make the exposed surface of the diamond on the diamond sorter. As a result, the finished product of the diamond sorter may have the risk of most diamonds facing out. This way of setting the diamond not only affects the diamond finishing The cutting rate of the tool, and the diamond is also easy to fall off from the diamond sorter. When the quality of the diamond finisher is poor, it also affects the quality of subsequent polished wafers or other semiconductors. Therefore, whether the quality of the diamond finisher is good has a profound impact on the yield of wafers or other semiconductors. It is also a very important part for the semiconductor industry.

有鑑於此，本創作遂針對上述習知技術之缺失，提出一種鑽石整理器之鑽石排列整理裝置，以有效克服上述之該等問題。In view of this, this creation proposes a diamond arrangement and arrangement device for a diamond organizer in order to effectively overcome the aforementioned problems in view of the lack of the above-mentioned conventional technology.

本創作之主要目的在提供一種鑽石整理器之鑽石排列整理裝置，其利用特殊的鑽石容置槽設計，能有效整理鑽石的擺設角度，當鑽石鑲在鑽石整理器時，所有鑽石的銳利表面皆能外露於鑽石整理器，提升鑽石整理器的切削率。The main purpose of this creation is to provide a diamond arrangement and arrangement device for a diamond organizer, which uses a special diamond accommodating groove design to effectively arrange the diamond's arrangement angle. When the diamond is set in the diamond organizer, the sharp surfaces of all diamonds are It can be exposed to the diamond finisher to improve the cutting rate of the diamond finisher.

本創作之另一目的在提供一種鑽石整理器之鑽石排列整理裝置，其能有效整理鑽石的擺設角度，避免鑽石設置在鑽石整理器時，鑽石的平面露出於鑽石整理器外，而降低鑽石整理器的切削率。Another purpose of this creation is to provide a diamond arrangement and arrangement device for a diamond organizer, which can effectively arrange the arrangement angle of the diamonds, to avoid the diamond plane being exposed outside the diamond arrangement when the diamond is arranged in the diamond arrangement, and to reduce the diamond arrangement The cutting rate of the device.

為達上述之目的，本創作提供一種鑽石整理器之鑽石排列整理裝置，包括一整理板，整理板上設有複數鑽石容置槽，每一鑽石容置槽可供分別容置一鑽石，且每一鑽石容置槽之開口大小，必定小於鑽石的直徑。In order to achieve the above purpose, the present invention provides a diamond arrangement and arrangement device for a diamond arrangement, which includes a arrangement plate, which is provided with a plurality of diamond accommodation slots, each diamond accommodation slot can accommodate one diamond separately, and The opening size of each diamond containing groove must be smaller than the diameter of the diamond.

其中複數鑽石容置槽可為圓形鑽石容置槽或橢圓形鑽石容置槽。The plural diamond accommodating grooves may be round diamond accommodating grooves or oval diamond accommodating grooves.

其中整理板為鋼整理板。The finishing board is a steel finishing board.

茲為使　貴審查委員對本創作之結構特徵及所達成之功效更有進一步之瞭解與認識，謹佐以較佳之實施例圖及配合詳細之說明，說明如後。In order to make your reviewer have a better understanding and understanding of the structural characteristics and the achieved effect of this creation, I would like to use the preferred embodiment drawings and detailed explanations as follows.

本創作係為一種鑽石整理器之鑽石排列整理裝置，其可供整理鑽石的安裝角度，令鑽石鑲設在鑽石整理器時，所有鑽石的銳利表面皆可朝外，以提升鑽石整理器的切削率，相對的有助於提升後續製作晶圓或其他半導體的良率。This creation is a diamond arrangement and arrangement device of a diamond organizer, which can be used to arrange the installation angle of diamonds, so that when the diamond is set in the diamond organizer, all the sharp surfaces of the diamonds can face outwards to enhance the cutting of the diamond organizer The rate is relatively helpful to improve the yield of subsequent wafer or other semiconductor production.

請參照第一圖，以詳細說明鑽石整理器之鑽石排列整理裝置1之結構，如圖所示，鑽石整理器之鑽石排列整理裝置1之結構包括一整理板10，整理板10可為鋼整理板，整理板10上設有複數鑽石容置槽12，以供分別容置鑽石(圖中未示)，每一鑽石容置槽12之開口大小，皆小於鑽石的直徑，且複數鑽石容置槽12為圓形鑽石容置槽或橢圓形鑽石容置槽，鑽石容置槽12的邊緣皆為圓弧，沒有任何直角的鑽石容置槽12。Please refer to the first figure to explain in detail the structure of the diamond arrangement and arrangement device 1 of the diamond organizer. As shown in the figure, the structure of the diamond arrangement and arrangement device 1 of the diamond arrangement includes a arrangement plate 10, which may be steel arrangement Plate, the finishing plate 10 is provided with a plurality of diamond accommodating grooves 12 for accommodating diamonds (not shown), the opening size of each diamond accommodating groove 12 is smaller than the diameter of the diamond, and the plurality of diamond accommodating The groove 12 is a round diamond accommodating groove or an oval diamond accommodating groove. The edges of the diamond accommodating groove 12 are all rounded, without any right-angled diamond accommodating groove 12.

鑽石容置槽12的結構能使鑽石銳利表面朝外，除了因開口的大小小於鑽石的直徑，可令鑽石可卡合在鑽石容置槽12的開口之外，更因為鑽石容置槽12為圓形鑽石容置槽或橢圓形鑽石容置槽，其邊緣皆為圓弧，沒有直角的設計。由於鑲在鑽石整理器的鑽石通常為六面體、八面體或十四面體的鑽石的，因此搭配鑽石容置槽12為沒有邊角的設計，能避免六面體、八面體或十四面體的鑽石銳利部分剛好落入鑽石容置槽12邊角的位置，而露出平面的部分。The structure of the diamond accommodating groove 12 can make the sharp surface of the diamond face outward, except that the size of the opening is smaller than the diameter of the diamond, so that the diamond can be snapped into the opening of the diamond accommodating groove 12, and the diamond accommodating groove 12 is The round diamond accommodating groove or oval diamond accommodating groove has rounded edges and no right angle design. Since the diamonds set in the diamond sorter are usually hexahedral, octahedral or tetrahedral diamonds, the matching diamond receiving groove 12 is a design without corners, which can avoid hexahedral, octahedral or The sharp part of the diamond of the tetrahedron just falls into the corner of the diamond accommodating groove 12, and the flat part is exposed.

在說明完本創作鑽石整理器之鑽石排列整理裝置1之結構後，接下來請參照第二A圖至第二F圖，以詳細說明鑽石整理器之鑽石排列整理裝置1之使用狀態，首先請參第二A圖，將複數鑽石40撒在整理板10。由於鑽石容置槽12的開口大小係小於鑽石40的直徑，以及鑽石容置槽12為圓形鑽石容置槽或橢圓形鑽石容置槽，沒有邊角的設計，因此複數鑽石40掉入鑽石容置槽12時，所有鑽石40的銳利表面皆可朝外。After explaining the structure of the diamond arrangement and arrangement device 1 of the created diamond arrangement, please refer to the second figures A to F to explain the use state of the diamond arrangement and arrangement device 1 of the diamond arrangement in detail, first please Referring to the second figure A, a plurality of diamonds 40 are scattered on the finishing plate 10. Since the opening size of the diamond accommodating slot 12 is smaller than the diameter of the diamond 40, and the diamond accommodating slot 12 is a round diamond accommodating slot or an oval diamond accommodating slot, there is no corner design, so the plural diamonds 40 fall into the diamond When the groove 12 is accommodated, the sharp surfaces of all diamonds 40 can face outward.

接著請參第二B圖，將軟性物質20，如不織布或紙類等軟性物質服貼於整理板10上，令鑽石容置槽12上的鑽石40可鑲入軟性物20質中。接著請配合參照第三C圖，移除整理板10，並將鑲有鑽石40的軟性物質20鋪設在一基板22上，該基板22可為釉基板或陶瓷基板，接著以800℃~1000℃的高溫進行燒結，經過高溫燒結後，軟性物質20已變形或破碎，此時可以水柱沖洗基板22表面，將基板22上的軟性物質20沖洗乾淨，如第二D圖所示，鑽石40鑲設在基板22上。最後請參照第二E圖以及第二F圖，將鑲有鑽石40的基板22安裝在一金屬底座24上，以完成鑽石整理器26。Next, referring to FIG. 2B, a soft substance 20, such as non-woven fabric or paper, is attached to the finishing board 10, so that the diamond 40 in the diamond accommodating groove 12 can be embedded in the soft substance 20. Next, please refer to the third figure C, remove the finishing board 10, and lay the soft substance 20 inlaid with diamonds 40 on a substrate 22, which can be a glaze substrate or a ceramic substrate, and then 800 ℃ ~ 1000 ℃ After sintering at a high temperature, the soft substance 20 has been deformed or broken after high temperature sintering. At this time, the surface of the substrate 22 can be rinsed with a water column to rinse the soft substance 20 on the substrate 22, as shown in the second D figure, the diamond 40 is set On the substrate 22. Finally, please refer to the second E diagram and the second F diagram, the substrate 22 inlaid with diamonds 40 is mounted on a metal base 24 to complete the diamond organizer 26.

接下來請參照第三A圖至第三C圖說明利用本創作之鑽石整理器之鑽石排列整理裝置1，製作鑽石整理器的另一實施例，首先請參照第三A圖，其與上述實施例步驟相同，先將複數鑽石撒在整理板10，令所有鑽石40落入鑽石容置槽12時，鑽石40的銳利表面皆可朝外。Next, please refer to FIGS. 3A to 3C to illustrate another embodiment of the diamond arrangement and finishing device 1 using the diamond arrangement of this creation, first referring to FIG. 3A, which is the same as the above The steps in the example are the same. Sprinkle a plurality of diamonds on the finishing plate 10 so that when all the diamonds 40 fall into the diamond receiving groove 12, the sharp surfaces of the diamonds 40 can face outwards.

接著請參第三B圖，提供一底座30，底座30可為鋼底座，底座30上佈塗有金屬層32，並將佈塗有金屬層32的一面與鑽石40黏接。接著請參第三C圖，將整理板10移除，並進行電鍍，令鑽石40可穩固的鑲入金屬層32內，即可完成鑽石整理器34。Next, referring to FIG. 3B, a base 30 is provided. The base 30 may be a steel base. The base 30 is coated with a metal layer 32, and the side coated with the metal layer 32 is bonded to the diamond 40. Next, referring to FIG. 3C, the finishing plate 10 is removed and electroplated, so that the diamond 40 can be stably inserted into the metal layer 32, and the diamond finisher 34 can be completed.

綜上所述，本創作利用特殊的鑽石容置槽設計，能有效整理鑽石的擺設角度，當鑽石鑲在鑽石整理器時，所有鑽石的銳利表面皆能外露於鑽石整理器，避免鑽石的平面露出於鑽石整理器外，以提升鑽石整理器的切削率。In summary, this creation uses a special diamond receiving slot design, which can effectively arrange the diamond's display angle. When the diamond is set in the diamond organizer, all the sharp surfaces of the diamond can be exposed in the diamond organizer to avoid the flat surface of the diamond It is exposed outside the diamond finisher to increase the cutting rate of the diamond finisher.

唯以上所述者，僅為本創作之較佳實施例而已，並非用來限定本創作實施之範圍。故即凡依本創作申請範圍所述之特徵及精神所為之均等變化或修飾，均應包括於本創作之申請專利範圍內。The above are only preferred embodiments of this creation, and are not intended to limit the scope of this creation. Therefore, any changes or modifications based on the characteristics and spirit described in the scope of this creative application should be included in the scope of the patent application for this creative.

1:鑽石整理器之鑽石排列整理裝置 10:整理板 12:鑽石容置槽 20:軟性物質 22:基板 24:金屬基板 26:鑽石整理器 30:底座 32:金屬層 34:鑽石整理器 40:鑽石1: Diamond arrangement and arrangement device of diamond arrangement 10: Finishing board 12: Diamond receiving slot 20: Soft substances 22: substrate 24: Metal substrate 26: Diamond Organizer 30: Base 32: Metal layer 34: Diamond Organizer 40: Diamond

第一圖係為本創作之立體示意圖。第二A圖至第二F圖係為利用本創作製作鑽石整理器的連續步驟示意圖。第三A圖至第三C圖係為利用本創作製作鑽石整理器的另一實施例之連續步驟示意圖。 The first picture is a three-dimensional schematic drawing of the creation. The second picture A to the second picture F are schematic diagrams of successive steps for making a diamond sorter using this creation. Figures 3A to 3C are schematic diagrams of successive steps of another embodiment of using this creation to make a diamond collator.

1:整理器之鑽石排列整理裝置 1: Diamond arrangement and arrangement device of finishing device

10:整理板 10: Finishing board

12:鑽石容置槽 12: Diamond receiving slot

Claims

一種鑽石整理器之鑽石排列整理裝置，包括：一整理板，上設有複數鑽石容置槽，以供分別容置鑽石，且每一該鑽石容置槽之開口大小，小於該鑽石的直徑。 A diamond arrangement and arrangement device for a diamond arrangement includes: A finishing board is provided with a plurality of diamond accommodating grooves for accommodating diamonds respectively, and the opening size of each diamond accommodating groove is smaller than the diameter of the diamond.

如請求項1所述之鑽石整理器之鑽石排列整理裝置，其中該等鑽石容置槽可為圓形鑽石容置槽。The diamond arrangement and arrangement device of the diamond organizer according to claim 1, wherein the diamond accommodation grooves may be round diamond accommodation grooves.

如請求項1所述之鑽石整理器之鑽石排列整理裝置，其中該等鑽石容置槽可為橢圓形鑽石容置槽。The diamond arrangement and arrangement device of the diamond organizer according to claim 1, wherein the diamond accommodating grooves may be oval-shaped diamond accommodating grooves.

如請求項1所述之鑽石整理器之鑽石排列整理裝置，其中該整理板為鋼整理板。The diamond arrangement and arrangement device of the diamond arrangement as described in claim 1, wherein the arrangement plate is a steel arrangement plate.