TWM584896U - Scanning module and three dimensional sensor device comprising the same - Google Patents
Scanning module and three dimensional sensor device comprising the same Download PDFInfo
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- TWM584896U TWM584896U TW108208531U TW108208531U TWM584896U TW M584896 U TWM584896 U TW M584896U TW 108208531 U TW108208531 U TW 108208531U TW 108208531 U TW108208531 U TW 108208531U TW M584896 U TWM584896 U TW M584896U
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Abstract
Description
本新型創作係關於一種掃描模組及包含其之三維感測裝置。 The novel creation relates to a scanning module and a three-dimensional sensing device including the same.
三維感測係用以偵測環境、現實物體形狀或外觀等之測量技術，其可應用於工業、醫學、生物等眾多領域中。 Three-dimensional sensing is a measurement technology used to detect the environment, the shape or appearance of real objects, and it can be used in many fields such as industry, medicine, and biology.
然而，請參閱第1圖所示，現有之三維感測裝置的最小可感測距離D、感測範圍E、解析度及整體體積等特性，受限於掃描模組TX與接收模組RX之間的配置方式或掃描模組TX內使用的元件類型，難有所改進。 However, as shown in FIG. 1, the minimum detectable distance D, sensing range E, resolution, and overall volume of the existing three-dimensional sensing device are limited by the characteristics of the scanning module TX and the receiving module RX. It is difficult to improve the configuration method or the type of components used in the scan module TX.
請參閱第2圖所示，即便有嘗試改善三維感測裝置的最小可感測距離，例如以傾斜整個掃描模組TX、或於掃描模組TX中增加透鏡元件(圖未示)的方式來改變投射光路，然而此不可避免地增加了三維感測裝置的整體體積，提升三維感測裝置的組裝定位難度。 Please refer to FIG. 2, even if there is an attempt to improve the minimum detectable distance of the three-dimensional sensing device, for example, by tilting the entire scanning module TX or adding a lens element (not shown) to the scanning module TX The projection light path is changed, however, this inevitably increases the overall volume of the three-dimensional sensing device and increases the difficulty of assembling and positioning the three-dimensional sensing device.
有鑑於此，如何提供改善上述缺失，乃為業界待解決的問題。另說明的是，上述之技術內容係用於幫助對本新型創造所欲解決問題的理解，其不必然是本領域已公開或公知者。 In view of this, how to provide improvements to the above-mentioned shortcomings is a problem for the industry. It is further stated that the above technical content is used to help the understanding of the problem to be solved by the novel creation, and it is not necessarily known or known in the art.
本新型創作之一目的在於提供一種掃描模組，其無須額外 的支撐結構或二次光學元件即可偏移掃描範圍；本新型創作之另一目的在於提供一種三維感測裝置，其可包含前述之掃描模組，從而可縮減其最小可感測距離，且可縮減其整體體積。 One of the purposes of this new creation is to provide a scanning module that requires no additional The supporting structure or the secondary optical element can offset the scanning range; another purpose of this new creation is to provide a three-dimensional sensing device that can include the aforementioned scanning module, thereby reducing its minimum sensing distance, and Can reduce its overall volume.
為達上述目的，本新型創作提供之一種掃描模組，包含一基板、一雷射光源、一振鏡及一光束整形單元。基板包含一第一平面及一第二平面。第一平面與第二平面相傾斜地連接，且第一平面與第二平面之間定義有一夾角，大於45°、且不大於60°。雷射光源設置於基板上且與第二平面相距。振鏡設置於基板的第二平面上。光束整形單元設置於基板上且位於雷射光源與振鏡之間。 In order to achieve the above object, a scanning module provided by the present invention includes a substrate, a laser light source, a galvanometer, and a beam shaping unit. The substrate includes a first plane and a second plane. The first and second planes are connected obliquely, and an included angle is defined between the first and second planes, which is greater than 45 ° and not greater than 60 °. The laser light source is disposed on the substrate and is separated from the second plane. The galvanometer is disposed on a second plane of the substrate. The beam shaping unit is disposed on the substrate and located between the laser light source and the galvanometer.
於一實施態樣中，本新型創作之掃描模組所具有之第一平面與第二平面之間的夾角大於45°且不大於50°。 In an implementation aspect, the included angle between the first plane and the second plane of the scanning module of the novel creation is greater than 45 ° and not greater than 50 °.
於一實施態樣中，本新型創作之掃描模組所具有之基板更包含一第三平面，第三平面與第一平面相垂直連接，而雷射光源設置於第三平面上。 In an embodiment, the substrate of the scanning module of the novel creation further includes a third plane, the third plane is perpendicular to the first plane, and the laser light source is disposed on the third plane.
於一實施態樣中，本新型創作之掃描模組所具有之基板更包含一定位標記，其設置於第一平面、第二平面及第三平面之至少其中一者上。 In an implementation aspect, the substrate of the scanning module of the novel creation further includes a positioning mark disposed on at least one of the first plane, the second plane, and the third plane.
於一實施態樣中，本新型創作之掃描模組所具有之定位標記為一凹陷、凸起、通孔或印刷圖案之結構。 In an implementation aspect, the positioning mark of the scanning module created by the new model is a structure having a depression, a protrusion, a through hole, or a printed pattern.
於一實施態樣中，本新型創作之掃描模組所具有之雷射光源設置於第一平面上。 In an implementation aspect, the laser light source of the scanning module of the novel creation is disposed on the first plane.
於一實施態樣中，本新型創作之掃描模組所具有之光束整 形單元包含一體成形的一透鏡部及一框體部。 In an implementation aspect, the beam shaping of the scanning module of the novel creation has The shape unit includes a lens portion and a frame body portion that are integrally formed.
於一實施態樣中，本新型創作之掃描模組所具有之振鏡是一種一維振鏡或是一種二維振鏡。 In an implementation aspect, the galvanometer in the scanning module of the novel creation is a one-dimensional galvanometer or a two-dimensional galvanometer.
於一實施態樣中，本新型創作之振鏡為一種微機電系統(MEMS)掃描振鏡。 In an implementation aspect, the galvanometer of the novel creation is a micro-electromechanical system (MEMS) scanning galvanometer.
本新型創作所提供之三維感測裝置可包含上述任一種之掃描模組及一接收模組。接收模組位於掃描模組之一側，用以接收掃描模組發射出之一掃描光線被待測物件反射後之一反射光線。 The three-dimensional sensing device provided by the novel creation may include any one of the above-mentioned scanning module and a receiving module. The receiving module is located on one side of the scanning module, and is used for receiving one reflected light emitted by the scanning module and reflected by the object to be measured.
為了讓上述的目的、技術特徵和優點能夠更為本領域之人士所知悉並應用，下文係以本新型創作之數個較佳實施例以及附圖進行詳細的說明。 In order to make the above-mentioned objects, technical features, and advantages better known and applied by those skilled in the art, the following is a detailed description of several preferred embodiments and drawings attached to the present novel.
10‧‧‧三維感測裝置 10‧‧‧Three-dimensional sensing device
20‧‧‧掃描模組 20‧‧‧Scan module
30‧‧‧接收模組 30‧‧‧Receiving module
100‧‧‧基板 100‧‧‧ substrate
110‧‧‧第一平面 110‧‧‧First Plane
120‧‧‧第二平面 120‧‧‧ second plane
130‧‧‧第三平面 130‧‧‧ third plane
200‧‧‧雷射光源 200‧‧‧laser light source
210‧‧‧雷射光 210‧‧‧laser light
300‧‧‧振鏡 300‧‧‧ Galvanometer
400‧‧‧光束整形單元 400‧‧‧ Beam Shaping Unit
410‧‧‧透鏡部 410‧‧‧Lens section
420‧‧‧框體部 420‧‧‧Frame body
A‧‧‧夾角 A‧‧‧ angle
D‧‧‧最小可感測距離 D‧‧‧Minimum sensing distance
D1‧‧‧感測距離 D1‧‧‧ Sensing distance
E‧‧‧感測範圍 E‧‧‧ Sensing range
L‧‧‧掃描光線 L‧‧‧scanning light
P‧‧‧待測物件 P‧‧‧ Object to be tested
R‧‧‧掃瞄範圍 R‧‧‧scanning range
R1‧‧‧掃瞄範圍 R1‧‧‧scanning range
R2‧‧‧視場範圍 R2‧‧‧field of view
R3‧‧‧感測範圍 R3‧‧‧ Sensing range
RL‧‧‧反射光線 RL‧‧‧Reflected light
RX‧‧‧接收模組 RX‧‧‧Receiving Module
TX‧‧‧掃描模組 TX‧‧‧Scan Module
M‧‧‧定位標記 M‧‧‧ Positioning mark
W‧‧‧投射光線擺動角度 W‧‧‧Swing angle of projected light
V‧‧‧法線 V‧‧‧ normal
第1圖為一種三維感測裝置及其感測範圍之示意圖；第2圖為另一種三維感測裝置及其感測範圍之示意圖；第3A圖為本新型創作之三維感測裝置與第1圖所示之三維感測裝置之感測範圍比較示意圖；第3B圖為本新型創作之三維感測裝置之感測示意圖；第4圖為本新型創作之一較佳實施例之掃描模組之示意圖；第5圖為本新型創作之另一較佳實施例之掃描模組之示意圖；第6圖為本新型創作之掃描模組具有定位標記之示意圖；第7A圖為本新型創作之掃描模組之一種定位標記之示意圖； 第7B圖為本新型創作之掃描模組之另一種定位標記之示意圖；以及第8圖為本新型創作之掃描模組之振鏡傾斜角度與深度解析度之間的變化示意圖。 Figure 1 is a schematic diagram of a three-dimensional sensing device and its sensing range; Figure 2 is a schematic diagram of another three-dimensional sensing device and its sensing range; Figure 3A is a novel three-dimensional sensing device and the first The comparison diagram of the sensing range of the three-dimensional sensing device shown in the figure; FIG. 3B is the sensing schematic diagram of the three-dimensional sensing device of the novel creation; and FIG. 4 is the scanning module of one of the preferred embodiments of the novel creation. Schematic diagram; Figure 5 is a schematic diagram of the scanning module of another preferred embodiment of the novel creation; Figure 6 is a schematic diagram of the scanning module with positioning marks of the novel creation; Figure 7A is a scanning module of the novel creation A schematic diagram of a set of positioning marks; FIG. 7B is a schematic diagram of another positioning mark of the scanning module of the novel creation; and FIG. 8 is a schematic diagram of the change between the tilt angle and the depth resolution of the galvanometer of the scanning module of the novel creation.
以下將具體地描述根據本新型創作的具體實施例；惟，在不背離本新型創作之精神下，本新型創作尚可以多種不同形式之實施例來實踐，不應將本新型創作保護範圍解釋為限於說明書所陳述者。另，上述新型創作內容中的各實施態樣的技術內容亦可作為實施例的技術內容，或是作為實施例的可能變化態樣。此外，除非上下文清楚地另外指明，否則本文所用之單數形式「一」亦包含複數形式，當本說明書中使用用語「包含」或「包括」時，係用以指出特徵、元件或組件等之存在，不排除含有一個或多個其他特徵、元件或組件等之存在或添加。另，所述方位(如前、後、上、下、兩側、內、外等)係為相對者，可依據掃描模組的使用狀態而定義，而不是指示或暗示掃描模組須有特定方位、以特定方位構造或操作；所述方位因此不能理解為對本新型創作的限制。 The following will specifically describe the specific embodiments of the new creation; however, without departing from the spirit of the new creation, the new creation can be practiced in many different forms of embodiments, and the scope of protection of the new creation should not be interpreted as Limited to those stated in the manual. In addition, the technical content of each implementation aspect in the above-mentioned novel creation content may also be used as the technical content of the embodiment, or as a possible variation aspect of the embodiment. In addition, unless the context clearly indicates otherwise, the singular form "a" or "an" used herein includes the plural form. When the terms "including" or "including" are used in this specification, they indicate the existence of a feature, element, or component, etc. , Does not exclude the presence or addition of one or more other features, components or components. In addition, the orientation (such as front, back, up, down, sides, inside, outside, etc.) is relative, and can be defined according to the use status of the scanning module, rather than indicating or implying that the scanning module must have a specific Orientation, constructed or operated in a particular orientation; the orientation cannot therefore be understood as a limitation on the novel creation.
本新型創作之掃描模組20可應用於環境掃描、產品檢測等多種感測裝置中，而為方便說明本新型創作之掃描模組20可達到之效果，以下實施例係以應用於三維感測裝置中作為示例，但不限於此。首先，如第3A圖至第3B圖所示為應用掃描模組20之本新型創作之三維感測裝置10之示意圖，其至少包含掃描模組20及接收模組30，兩者相光耦合，也就是，掃描模組20可發射一掃描光線L，而光耦合的接收模組30可接收掃描光線L經一待 測物件P反射產生之一反射光線RL。為此，接收模組30鄰設於掃描模組20，位於掃描模組20之一側，兩者之間的距離足以讓兩者達成上述的光耦合。所以，只要接收模組30能接受反射光線RL，即屬於鄰設或光耦合之關係。另，兩者不限定需位於相同水平面上，兩者之間的高低差仍能達成光耦合。 The scanning module 20 of the novel creation can be applied to a variety of sensing devices such as environmental scanning and product detection. To facilitate the description of the effects of the scanning module 20 of the novel creation, the following embodiments are applied to three-dimensional sensing. The device is used as an example, but is not limited thereto. First, as shown in FIG. 3A to FIG. 3B, a schematic diagram of the three-dimensional sensing device 10 using the novel creation of the scanning module 20 is shown, which includes at least the scanning module 20 and the receiving module 30, both of which are optically coupled. That is, the scanning module 20 can emit a scanning light L, and the light-coupled receiving module 30 can receive the scanning light L through a waiting The reflection object P generates a reflected light RL. For this reason, the receiving module 30 is adjacent to the scanning module 20 and is located on one side of the scanning module 20, and the distance between the two is sufficient for the two to achieve the above-mentioned optical coupling. Therefore, as long as the receiving module 30 can receive the reflected light RL, it belongs to an adjacent or optical coupling relationship. In addition, the two are not limited to be located on the same horizontal plane, and the height difference between the two can still achieve optical coupling.
詳細而言，掃描模組20發射之掃描光線L可經由振動(擺動)以形成一掃瞄範圍R1，接收模組30包含一照相機，其具有一視場範圍(FOV)R2，掃瞄範圍R1與視場範圍R2可產生一感測範圍R3，感測範圍R3中經測試可獲得有效偵測數據之部分為三維感測裝置10之有效處理範圍。而在感測範圍R3中，掃瞄範圍R1與視場範圍R2中最接近三維感測裝置10的交會處至三維感測裝置10的垂直距離，便係為最小可感測距離，或簡稱為感測距離D1。 In detail, the scanning light L emitted by the scanning module 20 may be vibrated (oscillated) to form a scanning range R1. The receiving module 30 includes a camera having a field of view range (FOV) R2, and the scanning range R1 and The field of view range R2 can generate a sensing range R3, and the portion of the sensing range R3 that can be obtained by testing to obtain effective detection data is the effective processing range of the three-dimensional sensing device 10. In the sensing range R3, the vertical distance from the intersection of the scanning range R1 and the field of view range R2 closest to the three-dimensional sensing device 10 to the three-dimensional sensing device 10 is the minimum sensing distance, or simply referred to as Sensing distance D1.
於本新型創作中之掃描模組20當應用於三維感測裝置10時，可使三維感測裝置10具有較小的感測距離D1及較大的感測範圍R3。掃描模組20依據應用裝置之不同可具有其他元件，因非本實施例之重點、且不影響本實施例之爾後技術內容的描述，故將省略描述及繪製。 When the scanning module 20 in the novel creation is applied to the three-dimensional sensing device 10, the three-dimensional sensing device 10 can have a smaller sensing distance D1 and a larger sensing range R3. The scanning module 20 may have other components according to different application devices. Since it is not the focus of this embodiment and does not affect the description of subsequent technical content of this embodiment, description and drawing will be omitted.
如第4圖所示，為本新型創作之掃描模組20之示意圖，其可包含一基板100、一雷射光源200、一振鏡300及一光束整形單元400，各元件之技術內容依序說明如下。 As shown in FIG. 4, it is a schematic diagram of the scanning module 20 created by the novel, which may include a substrate 100, a laser light source 200, a galvanometer 300, and a beam shaping unit 400. The technical content of each element is in order described as follows.
基板100可包括印刷電路(塑膠)基板、陶瓷基板、金屬機板等本技術領域中應知悉的基板類型。而本新型創作之掃描模組20之基板100可係為一鋁合金基板，且通常可與一外殼(圖未示)相互固定以保護基 板100上的元件。於一較佳實施例中，請同時參考第4圖至第6圖，基板100可包含第一平面110、第二平面120及第三平面130。第二平面120相對於第一平面110傾斜且與第一平面110相連接，第三平面130相對第一平面110垂直地與第一平面110連接。也就是，第二平面120與第三平面130係設置於第一平面110之兩側。第一平面110及第二平面120之間具有一夾角A(第二平面120自第一平面110逆時針轉動之一角度)，夾角A可大於45°，但不大於50°或不大於60°。而依據應用之裝置的不同，第三平面130的法線V可通過第二平面120(如第4圖所示)，或平行第二平面120(如第5圖所示)，方便其他元件之配置。 The substrate 100 may include a printed circuit (plastic) substrate, a ceramic substrate, a metal machine plate, and other substrate types that should be known in the art. The substrate 100 of the novel scanning module 20 can be an aluminum alloy substrate, and can usually be fixed to a housing (not shown) to protect the substrate. Components on board 100. In a preferred embodiment, please refer to FIGS. 4 to 6 at the same time. The substrate 100 may include a first plane 110, a second plane 120, and a third plane 130. The second plane 120 is inclined with respect to the first plane 110 and connected to the first plane 110, and the third plane 130 is perpendicularly connected to the first plane 110 with respect to the first plane 110. That is, the second plane 120 and the third plane 130 are disposed on both sides of the first plane 110. There is an included angle A between the first plane 110 and the second plane 120 (an angle that the second plane 120 rotates counterclockwise from the first plane 110). The included angle A may be greater than 45 °, but not greater than 50 ° or not greater than 60 °. . Depending on the device used, the normal V of the third plane 130 can pass through the second plane 120 (as shown in Figure 4) or parallel to the second plane 120 (as shown in Figure 5), which is convenient for other components. Configuration.
雷射光源200可為一雷射二極體(例如面射型雷射或邊射型雷射)或其他可發出雷射光210之發光元件(如第3B圖所示)，其設置於第三平面130上。振鏡300設置於第二平面120上，因而同樣具有自第一平面110逆時針旋轉夾角A之放置角度，振鏡300是一種微機電系統(Microelectromechanical Systems，簡稱MEMS)掃描振鏡，通常可分成在一軸擺動的一維振鏡或是在兩軸擺動的二維振鏡。在本實施例中振鏡300採用一維振鏡作為範例，當雷射光源200投射雷射光210到振鏡300上，振鏡300在一軸快速地擺動形成一投射光線擺動角度W(如第3B圖所示)，其例如可介於正負45°之間，使投射至振鏡300的雷射光210反射後產生掃瞄範圍R1。在振鏡300之具體內容可參考US2017/0044003A1公開號之美國專利申請案、US 7,329,930公告號及US 9,219,219之美國專利等，振鏡300亦可為申請人所販售之微機電掃描晶片等，然不侷限於此。 The laser light source 200 may be a laser diode (such as a surface-emitting laser or an edge-emitting laser) or other light-emitting elements (as shown in FIG. 3B) that can emit laser light 210, which is arranged in the third place. Plane 130. The galvanometer 300 is disposed on the second plane 120, and therefore also has a placement angle of a counterclockwise rotation angle A from the first plane 110. The galvanometer 300 is a microelectromechanical systems (MEMS) scanning galvanometer, which can usually be divided into A one-dimensional galvo mirror swinging in one axis or a two-dimensional galvo mirror swinging in two axes. In this embodiment, the galvanometer 300 uses a one-dimensional galvanometer as an example. When the laser light source 200 projects the laser light 210 onto the galvanometer 300, the galvanometer 300 quickly swings on one axis to form a projection light swing angle W (such as 3B). (Shown in the figure), for example, it can be between plus and minus 45 °, so that the laser light 210 projected onto the galvanometer 300 is reflected to generate a scanning range R1. For the specific content of the galvanometer 300, please refer to US Patent Application Publication No. US2017 / 0044003A1, US Publication No. 7,329,930, and US Patent No. 9,219,219. However, it is not limited to this.
光束整形單元400包含一透鏡，其設置於第一平面110上，並 位於雷射光源200與振鏡300之間，從而使雷射光源200發出之雷射光210(如第3B圖所示)經由光束整形單元400準直並整束成一線光束射向振鏡300。此外，較佳地，光束整形單元400係與第一平面110垂直地設置，以與入射之雷射光210垂直。 The beam shaping unit 400 includes a lens, which is disposed on the first plane 110 and It is located between the laser light source 200 and the galvanometer 300, so that the laser light 210 (as shown in FIG. 3B) emitted by the laser light source 200 is collimated by the beam-shaping unit 400 and bundled into a single line of light to the galvanometer 300. In addition, preferably, the beam shaping unit 400 is disposed perpendicularly to the first plane 110 so as to be perpendicular to the incident laser light 210.
除此之外，基板100亦可僅具有第一平面110及第二平面120，雷射光源200可直接設置於基板100上或第一平面110上(圖未示)，且與第二平面120相距有一距離，仍可將雷射光210發射至光束整形單元400，再射向振鏡300。 In addition, the substrate 100 may have only the first plane 110 and the second plane 120, and the laser light source 200 may be directly disposed on the substrate 100 or the first plane 110 (not shown in the figure), and the second plane 120 There is a distance from each other, and the laser light 210 can still be emitted to the beam shaping unit 400 and then directed to the galvanometer 300.
請參閱第3A圖至第4圖，經由擺動且傾斜夾角A設置的振鏡300反射而出之雷射光210，產生一個與視場範圍R2交會更多的掃瞄範圍R1。也就是說，由於掃瞄範圍R1相較第1圖之掃瞄範圍R更向接收模組30偏移，因此本新型創作之掃描模組20可具有較小的感測距離D1以及較大的感測範圍R3。經由上述設置，掃描模組20(或接收模組30)整體上可不用傾斜即達到期望之功效，所以當掃描模組20與接收模組30設置於同一平面時，更可有效減少其所占用的空間，因此應用於三維感測裝置10時，便有效減少三維感測裝置10的整體體積。 Referring to FIG. 3A to FIG. 4, the laser light 210 reflected from the galvanometer 300 set by the swinging and tilting angle A generates a scanning range R1 that intersects with the field of view range R2. In other words, since the scanning range R1 is more offset to the receiving module 30 than the scanning range R in FIG. 1, the scanning module 20 of the novel creation can have a smaller sensing distance D1 and a larger Sensing range R3. With the above settings, the scanning module 20 (or the receiving module 30) can achieve the desired effect as a whole without tilting. Therefore, when the scanning module 20 and the receiving module 30 are arranged on the same plane, it can effectively reduce their occupation. Therefore, when applied to the three-dimensional sensing device 10, the overall volume of the three-dimensional sensing device 10 is effectively reduced.
請參考第6圖，基板100更包含至少一定位標記(alignment mark,or fiducial mark)M，其可設置於第一平面110、第二平面120及第三平面130之至少其中一者上，且可係為一凸起(圖未示)、凹陷、通孔或印刷圖案之結構，而其形狀可包含圓形、矩形、三角形、菱形、十字等。舉例而言，如第7A圖所示，定位標記M可為橢圓形孔；或如第7B圖所示為複數直線圖案。藉由定位標記M的設置，掃描模組20便可透過外部辨識影像系統及機械 設備(如機械手臂)自動化組裝內部元件，例如將振鏡300設置於第二平面120上、將光束整形單元400設置於第一平面110上等(圖未示)。如此一來，自動化生產的掃描模組20可具有較高的一致性及校準效率。換言之，若有其他方式可達到自動化組裝之效果，亦可配合使用於其中之一元件，三個平面便不須皆具有定位標記M。 Please refer to FIG. 6. The substrate 100 further includes at least one alignment mark (or fiducial mark) M, which can be disposed on at least one of the first plane 110, the second plane 120, and the third plane 130, and It can be a structure with a protrusion (not shown), a depression, a through hole or a printed pattern, and the shape can include a circle, a rectangle, a triangle, a diamond, a cross, and the like. For example, as shown in FIG. 7A, the positioning mark M may be an elliptical hole; or as shown in FIG. 7B, a plurality of linear patterns. With the setting of the positioning mark M, the scanning module 20 can recognize the image system and machinery through an external Equipment (such as a robotic arm) automatically assembles internal components, such as setting the galvanometer 300 on the second plane 120 and the beam shaping unit 400 on the first plane 110 (not shown). In this way, the scan module 20 produced automatically can have higher consistency and calibration efficiency. In other words, if there are other ways to achieve the effect of automatic assembly, and it can also be used in conjunction with one of the components, it is not necessary to have the positioning mark M on all three planes.
以在第二平面120上設置振鏡300為例，掃描模組20之自動化組裝過程可例如包含：識別第二平面120上之定位標記M於裝配空間之位置；辨識振鏡300於裝配空間之位置；以及計算定位標記M與振鏡300之間的位置關係之後進行組裝。更可包含：再次識別第二平面120上之定位標記及振鏡300，以檢查、校驗組裝是否有瑕疵。因應自動化之組裝過程，於一實施例中，光束整形單元400更可包含一體成型的一透鏡部410與一框體部420(如第5圖所示)，使機械設備移動光束整形單元400時係夾住或扣住框體部420因而不傷到透鏡部410，並可更精準地放置固定光束整形單元400於第一平面110上。 Taking the galvanometer 300 on the second plane 120 as an example, the automated assembly process of the scanning module 20 may include, for example, identifying the position of the positioning mark M on the second plane 120 in the assembly space; identifying the position of the galvo mirror 300 in the assembly space. Position; and the positional relationship between the positioning mark M and the galvanometer 300 is calculated and then assembled. It may further include: re-identifying the positioning mark on the second plane 120 and the galvanometer 300 to check and verify whether the assembly is defective. In response to an automated assembly process, in one embodiment, the beam shaping unit 400 may further include a lens portion 410 and a frame body portion 420 (as shown in FIG. 5) that are integrally formed. When the mechanical equipment moves the beam shaping unit 400, The frame part 420 is clamped or fastened so as not to damage the lens part 410, and the beam shaping unit 400 can be placed and fixed on the first plane 110 more accurately.
請參閱第8圖所示，已測試不同的振鏡300傾斜角度(夾角A)對於三維成像解析度的影響。圖中所示的每一曲線都代表一光軸夾角，其定義為：掃描模組20的光軸與接收模組30的光軸之間的夾角，其中夾角A與光軸夾角的關係為：夾角A=45°+(光軸夾角)/2，因此，圖中六條曲線由上至下依序光軸夾角為0°、2.5°、5°、7.5°、10°及12.5°，亦代表振鏡300傾斜角度(夾角A)為：45°(45°+0°)、46.25°(45°+2.5°/2)、47.5°(45°+5°/2)、48.75°(45°+7.5°/2)、50°(45°+10°/2)和51.25°(45°+12.5°/2)；上述之光軸夾角0°係表示兩光軸相平行、無交錯。而由測試結果可知，當振鏡300擺放角度越大(即 第一平面110與第二平面120之夾角A越大)，具有較佳的解析度。例如當振鏡300傾斜51.25°時，相較於傾斜46.25°或47.5°，無論待測物體位於400mm或800mm之距離，接收模組30所感測到的影像皆具有最佳的深度解析度(depth resolution)。 Please refer to FIG. 8, the influence of different tilt angles (angle A) of the galvanometer 300 on the resolution of the three-dimensional imaging has been tested. Each curve shown in the figure represents an included angle of the optical axis, which is defined as the included angle between the optical axis of the scanning module 20 and the optical axis of the receiving module 30, where the relationship between the included angle A and the optical axis is: The included angle A = 45 ° + (the included angle of the optical axis) / 2. Therefore, the six curves in the figure from top to bottom have the included optical axis angles of 0 °, 2.5 °, 5 °, 7.5 °, 10 °, and 12.5 °. The inclination angle (angle A) of the galvanometer 300 is: 45 ° (45 ° + 0 °), 46.25 ° (45 ° + 2.5 ° / 2), 47.5 ° (45 ° + 5 ° / 2), 48.75 ° (45 ° + 7.5 ° / 2), 50 ° (45 ° + 10 ° / 2), and 51.25 ° (45 ° + 12.5 ° / 2); the above-mentioned optical axis included angle of 0 ° means that the two optical axes are parallel without interlacing. According to the test results, when the galvanometer 300 is placed at a larger angle (that is, The larger the angle A between the first plane 110 and the second plane 120), the better the resolution. For example, when the galvanometer 300 is tilted by 51.25 °, compared with the tilt of 46.25 ° or 47.5 °, the image sensed by the receiving module 30 has the best depth resolution regardless of the object to be measured at a distance of 400mm or 800mm. resolution).
然後，經由另一測試結果可知，掃描模組20與接收模組30之間的距離會影響三維感測裝置10之有效處理範圍(如第3A圖所示的感測範圍R3)，因此為同時保有最大的有效處理範圍與較佳的解析度，振鏡300的傾斜角度需依據掃描模組20與接收模組30之間的距離而調整；換言之，在不同的間隔距離下，振鏡300會有不同的較佳傾斜角度(而非越大越好)，以使三維感測裝置10有較大的有效處理範圍。 Then, according to another test result, it can be known that the distance between the scanning module 20 and the receiving module 30 will affect the effective processing range of the three-dimensional sensing device 10 (such as the sensing range R3 shown in FIG. 3A), so it is simultaneously With the largest effective processing range and better resolution, the tilt angle of the galvo mirror 300 needs to be adjusted according to the distance between the scanning module 20 and the receiving module 30; There are different preferred tilt angles (rather than larger is better), so that the three-dimensional sensing device 10 has a larger effective processing range.
綜上所述，本新型創作所揭示的一種掃描模組20，其包含傾斜設置之振鏡300，因此應用於三維感測裝置10時，可具有較大的感測範圍R3、較佳的解析度以及減小最小可感測距離D。同時掃描模組20未傾斜，因此更可減少其所占用的空間，使三維感測裝置10應用其時具有更小的整體體積。此外，定位標記M的設置，還可使掃描模組20經由自動化組裝，提高一致性及校準效率。 In summary, a scanning module 20 disclosed in this novel creation includes a galvanometer 300 disposed obliquely. Therefore, when applied to the three-dimensional sensing device 10, it can have a larger sensing range R3 and better analysis. And reduce the minimum detectable distance D. At the same time, the scanning module 20 is not tilted, so the space occupied by the scanning module 20 can be reduced, so that the three-dimensional sensing device 10 has a smaller overall volume when it is applied. In addition, the positioning mark M can also enable the scanning module 20 to be assembled automatically to improve consistency and calibration efficiency.
上述之實施例僅用來例舉本新型創作之實施態樣，以及闡釋本新型創作之技術特徵，並非用來限制本新型創作之保護範疇。任何熟悉此技術者可輕易完成之改變或均等性之安排均屬於本新型創作所主張之範圍，本新型創作之權利保護範圍應以申請專利範圍為準。 The above embodiments are only used to exemplify the implementation of the new creation and to explain the technical characteristics of the new creation, but not to limit the scope of protection of the new creation. Any change or equivalence arrangement that can be easily accomplished by those skilled in this technology belongs to the scope claimed by this new type of creation, and the scope of protection of rights of this new type of creation shall be subject to the scope of patent application.
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