TWM583115U

TWM583115U - Key structure

Info

Publication number: TWM583115U
Application number: TW108206090U
Authority: TW
Inventors: 張立德; 陳志宏
Original assignee: 達方電子股份有限公司
Priority date: 2019-05-15
Filing date: 2019-05-15
Publication date: 2019-09-01

Abstract

The key structure includes a key cap, a circuit board, a lifting mechanism, and a conductive frame. The circuit board includes a first pad and a second pad. The lifting mechanism is disposed between the circuit board and the keycap, and the keycap moves relative to the circuit board via the lifting mechanism. The conductive frame is disposed on the lifting mechanism to move up and down with the lifting mechanism, and the conductive frame includes a first conductive portion and a second conductive portion respectively located above the first pad and the second pad, and movement path of the first conductive portion and movement path of the second conductive portion respectively reach the first pad and the second pad. When the first conductive portion and the second conductive portion respectively contact the first pad and the second pad, the first pad, the first conductive portion, the second conductive portion and the second pad form a traverse current path.

Description

按鍵結構 Button structure

本創作是有關於一種按鍵結構，且特別是有關於一種具有導電結構之按鍵結構。 The present invention relates to a button structure, and in particular to a button structure having a conductive structure.

傳統的按鍵結構大多使用彈性體去擠壓薄膜開關層，使薄膜開關層內原本分隔的上、下電極接觸，而產生一觸發訊號。薄膜開關層本身屬於軟性結構，因此要讓薄膜開關層的上、下電極接觸必須要克服薄膜開關層本身材質的抵抗力，才能讓將上、下電極接近而接觸。然而，由於必須要克服薄膜開關層本身材質的抵抗力，再加上薄膜開關層本身材質的疲乏問題，因此導致習知按鍵結構的觸發可靠度不佳。 Conventional button structures mostly use an elastomer to squeeze the membrane switch layer to contact the originally separated upper and lower electrodes in the membrane switch layer to generate a trigger signal. The membrane switch layer itself is a soft structure. Therefore, in order to make the upper and lower electrodes of the membrane switch layer have to overcome the resistance of the material of the membrane switch layer, the upper and lower electrodes can be brought close to each other. However, since it is necessary to overcome the resistance of the material of the membrane switch layer itself, and the fatigue of the material of the membrane switch layer itself, the trigger reliability of the conventional button structure is poor.

本創作係有關於一種按鍵結構，可改善前述習知問題。 This creation is about a key structure that can improve the aforementioned conventional problems.

根據本創作之一實施例，提出一種按鍵結構。按鍵結構包括一鍵帽、一電路板、一升降機構及一導電架。電路板包括一第一接墊及一第二接墊。升降機構配置在電路板與鍵帽之間，鍵帽經由升降機構相對電路板上下移動。導電架配置在升降機構上，以隨升降機構上下移動，導電架包括分別位於第一接墊及第二接墊上方之一第一導電部及一第二導電部，第一導電部之運動路徑及第二導電部之運動路徑分別到達第一接墊及第二接墊。其中，當第一導電部及第二導電部分別接觸第一接墊及第二接墊時，第一接墊、第一導電部、第二導電部與第二接墊形成一第一橫跨電流路徑。 According to an embodiment of the present invention, a button structure is proposed. The button structure comprises a keycap, a circuit board, a lifting mechanism and a conductive frame. The circuit board includes a first pad and a second pad. The lifting mechanism is disposed between the circuit board and the keycap, and the keycap moves relative to the circuit board via the lifting mechanism. Conductive frame is configured to lift The mechanism is configured to move up and down with the lifting mechanism, and the conductive frame comprises a first conductive portion and a second conductive portion respectively located above the first pad and the second pad, a movement path of the first conductive portion and a second conductive portion The motion path reaches the first pad and the second pad, respectively. Wherein, when the first conductive portion and the second conductive portion respectively contact the first pad and the second pad, the first pad, the first conductive portion, the second conductive portion and the second pad form a first span Current path.

根據本創作之另一實施例，提出一種按鍵結構。按鍵結構包括一鍵帽、一電路板、一升降機構及一導電架。電路板包括一第一接墊及一第二接墊，第一接墊及第二接墊間隔一預設間距。升降機構配置在電路板與鍵帽之間，鍵帽經由升降機構相對電路板上下移動於一釋放位置與一按壓位置間。導電架配置在升降機構上，以隨升降機構上下移動，導電架包括一第一導電部，一第二導電部及一橫向導電部，第一導電部與第二導電部分別位於第一接墊及第二接墊上方，橫向導電部位於第一導電部與該二導電部間且橫向導電部之延伸長度超過預設間距。其中，當鍵帽位於釋放位置時，第一導電部及第二導電部分別遠離第一接墊及第二接墊，使第一接墊及第二接墊保持電性隔離。其中，當鍵帽被按壓而位於按壓位置時，第一導電部及第二導電部分別接觸第一接墊及第二接墊時，第一接墊的電能依序流經第一導電部、橫向導電部、第二導電部而到達第二接墊。 According to another embodiment of the present invention, a button structure is proposed. The button structure comprises a keycap, a circuit board, a lifting mechanism and a conductive frame. The circuit board includes a first pad and a second pad, and the first pad and the second pad are separated by a predetermined spacing. The lifting mechanism is disposed between the circuit board and the keycap, and the keycap is moved between the release position and the pressing position by the lifting mechanism relative to the circuit board. The conductive frame is disposed on the lifting mechanism to move up and down with the lifting mechanism, the conductive frame includes a first conductive portion, a second conductive portion and a lateral conductive portion, and the first conductive portion and the second conductive portion are respectively located on the first pad And a second conductive pad, the lateral conductive portion is located between the first conductive portion and the two conductive portions, and the extended length of the lateral conductive portion exceeds a preset interval. When the key cap is in the release position, the first conductive portion and the second conductive portion are respectively away from the first pad and the second pad, so that the first pad and the second pad are electrically isolated. Wherein, when the first conductive portion and the second conductive portion contact the first pad and the second pad respectively when the key cap is pressed and is in the pressing position, the electric energy of the first pad sequentially flows through the first conductive portion, The lateral conductive portion and the second conductive portion reach the second pad.

根據本創作之另一實施例，提出一種按鍵結構。按鍵結構包括一鍵帽、一電路板、一升降機構及一可撓式導電件。電路板包括一接墊，接墊包含相鄰之一正極與一負極。升降機構配置在電路板與鍵帽之間，鍵帽經由升降機構相對電路板上下移動。可撓式導電件配置在升降機構之底部或鍵帽之底部，以隨升降機構運動，可撓式導電件之一底部區域的運動路徑到達正極及負極。其中，當可撓式導電件之底部區域接觸正極及負極時，正極與負極導通。 According to another embodiment of the present invention, a button structure is proposed. The button structure comprises a keycap, a circuit board, a lifting mechanism and a flexible conductive member. The circuit board includes a pad, and the pad includes an adjacent one of the positive electrode and a negative electrode. The lifting mechanism is disposed between the circuit board and the keycap, and the keycap moves relative to the circuit board via the lifting mechanism. The flexible conductive member is disposed at the bottom of the lifting mechanism or the bottom of the keycap to move with the lifting mechanism, and the moving path of the bottom portion of the flexible conductive member reaches the positive pole and the negative pole. Wherein, when the bottom region of the flexible conductive member contacts the positive electrode and the negative electrode, the positive electrode and the negative electrode are electrically connected.

據本創作之另一實施例，提出一種按鍵結構。按鍵結構包括一鍵帽、一電路板、一升降機構及一可撓式導電件。電路板包括一第一接墊及一第二接墊，第一接墊及第二接墊間隔一間隔區。升降機構配置在電路板與鍵帽之間，鍵帽經由升降機構相對電路板上下移動於一釋放位置與一按壓位置間。可撓式導電件包括一上段結合部，一中段彈性部與一下段導電部，藉由上段結合部，可撓式導電件結合在升降機構之底部或鍵帽之底面，以隨升降機構運動，下段導電部尺寸大於間隔區。其中，當鍵帽位於釋放位置時，下段導電部遠離第一接墊及第二接墊，使第一接墊及第二接墊保持電性隔離。其中，當鍵帽被按壓而位於按壓位置時，中段彈性部配合鍵帽上下移動而變形，使下段導電部保持面接觸而同時覆蓋在間隔區，部分第一接墊及部分第二接墊上，使第一接墊的電能流經下段導電部而到達第二接墊。 According to another embodiment of the present invention, a button structure is proposed. The button structure comprises a keycap, a circuit board, a lifting mechanism and a flexible conductive member. The circuit board includes a first pad and a second pad, and the first pad and the second pad are separated by a spacer. The lifting mechanism is disposed between the circuit board and the keycap, and the keycap is moved between the release position and the pressing position by the lifting mechanism relative to the circuit board. The flexible conductive member comprises an upper joint portion, a middle elastic portion and a lower conductive portion. The upper conductive portion is coupled to the bottom of the lifting mechanism or the bottom surface of the key cap to move with the lifting mechanism. The lower conductive portion is larger in size than the spacer. Wherein, when the key cap is in the release position, the lower conductive portion is away from the first pad and the second pad, so that the first pad and the second pad are electrically isolated. Wherein, when the keycap is pressed and is in the pressing position, the middle elastic portion cooperates with the keycap to move up and down to deform, so that the lower conductive portion maintains the surface contact while covering the spacer, part of the first pad and part of the second pad, The electric energy of the first pad flows through the lower conductive portion to reach the second pad.

為了對本創作之上述及其他方面有更佳的瞭解，下文特舉實施例，並配合所附圖式詳細說明如下： In order to better understand the above and other aspects of the present invention, the following specific embodiments are described in detail below with reference to the accompanying drawings:

100、200、300、400、500‧‧‧按鍵結構 100, 200, 300, 400, 500‧‧‧ button structure

110、310‧‧‧鍵帽 110, 310‧‧‧ keycap

120、320‧‧‧電路板 120, 320‧‧‧ circuit board

121‧‧‧第一接墊 121‧‧‧First mat

122‧‧‧第二接墊 122‧‧‧second mat

123‧‧‧第三接墊 123‧‧‧3rd pad

124‧‧‧第四接墊 124‧‧‧fourth pad

130、330‧‧‧升降機構 130, 330‧‧‧ Lifting mechanism

131、331‧‧‧第一升降件 131,331‧‧‧First lifting parts

132、332‧‧‧第二升降件 132, 332‧‧‧second lifting parts

131a、132a‧‧‧結合孔洞 131a, 132a‧‧‧ combined with holes

140、240‧‧‧導電架 140, 240‧‧‧ Conductive frame

141、241‧‧‧第一導電部 141, 241‧‧‧ First Conductive Department

142、242‧‧‧第二導電部 142, 242‧‧‧Second Conductive Department

1411‧‧‧可撓部 1411‧‧‧Flexible

1412‧‧‧接觸部 1412‧‧‧Contacts

143‧‧‧橫向導電部 143‧‧‧Transverse Conductance

144、171‧‧‧結合彈片 144, 171‧‧‧ combined with shrapnel

150、350‧‧‧控制器 150, 350‧‧ ‧ controller

160、360‧‧‧底板 160, 360‧‧‧ bottom plate

170、270‧‧‧磁性件 170, 270‧‧‧ magnetic parts

180‧‧‧磁性部 180‧‧‧Magnetic Department

271‧‧‧第三導電部 271‧‧‧ Third Conductive Department

272‧‧‧第四導電部 272‧‧‧4th Conductive Department

310b‧‧‧底面 310b‧‧‧ bottom

321‧‧‧接墊 321‧‧‧ pads

321A‧‧‧正極 321A‧‧‧ positive

321B‧‧‧負極 321B‧‧‧negative

331A‧‧‧樞接端 331A‧‧‧ pivot end

331B‧‧‧自由端 331B‧‧‧Free end

331C‧‧‧樞接部 331C‧‧‧ pivotal

340、640‧‧‧可撓式導電件 340, 640‧‧‧Flexible conductive parts

341、641‧‧‧上段結合部 341, 641‧‧‧ the previous section

342‧‧‧中段彈性部 342‧‧‧ Middle section of the elastic part

343、643‧‧‧下段導電部 343, 643‧‧‧Electrical section

340R‧‧‧底部區域 340R‧‧‧ bottom area

370、470‧‧‧彈性件 370, 470‧‧‧ elastic parts

540‧‧‧金屬件 540‧‧‧Metal parts

642‧‧‧中段連接部 642‧‧ mid-section connection

643A‧‧‧突點 643A‧‧‧

643B‧‧‧凹槽 643B‧‧‧ Groove

A1‧‧‧鈍角 A1‧‧‧ obtuse angle

C11、C12、C13、C21、C22、C23‧‧‧曲線 C11, C12, C13, C21, C22, C23‧‧‧ curves

C11a、C21a‧‧‧最低點 C11a, C21a‧‧‧ lowest point

F1‧‧‧按壓力 F1‧‧‧ press pressure

H1‧‧‧高位準 H1‧‧‧ high standard

H2‧‧‧低位準 H2‧‧‧low standard

L1‧‧‧第一橫跨電流路徑 L1‧‧‧ first cross current path

L2‧‧‧第二橫跨電流路徑 L2‧‧‧Second traverse current path

S1‧‧‧預設間距 S1‧‧‧Preset spacing

S2‧‧‧延伸長度 S2‧‧‧ extended length

M1、M2‧‧‧運動路徑 M1, M2‧‧‧ sports path

PH‧‧‧較高位置 PH‧‧‧higher position

PL‧‧‧較低位置 PL‧‧‧lower position

P1‧‧‧第一樞接點 P1‧‧‧ first pivot point

P2‧‧‧第二樞接點 P2‧‧‧ second pivot point

Pa、Pb‧‧‧變換點 Pa, Pb‧‧‧ change point

ΔP‧‧‧延遲行程 ΔP‧‧‧delay itinerary

SP1‧‧‧間隔區 SP1‧‧‧ interval

W1‧‧‧長度 W1‧‧‧ length

W2‧‧‧寬度 W2‧‧‧Width

第1A圖繪示依照本創作第一實施例之按鍵結構的分解示意圖。 FIG. 1A is an exploded perspective view showing the structure of a button according to the first embodiment of the present invention.

第1B圖繪示依照本第1A圖之按鍵結構的組合示意圖(處於未按壓狀態)。 FIG. 1B is a schematic diagram showing the combination of the button structure according to the first FIG. 1A (in an unpressed state).

第1C圖繪示第1B圖之按鍵結構省略鍵帽的示意圖。 FIG. 1C is a schematic diagram showing the key structure of the button structure of FIG. 1B omitting the key cap.

第1D圖繪示第1C圖之按鍵結構的俯視圖。 Fig. 1D is a plan view showing the structure of the button of Fig. 1C.

第1E圖繪示第1D圖之按鍵結構沿方向1E-1E’的剖視圖。 Fig. 1E is a cross-sectional view showing the key structure of Fig. 1D in the direction 1E-1E'.

第1F圖繪示第1D圖之按鍵結構沿方向1F-1F’的剖視圖。 Fig. 1F is a cross-sectional view showing the key structure of Fig. 1D in the direction 1F-1F'.

第2A圖繪示第1A圖之按鍵結構處於按壓狀態的立體示意圖。 FIG. 2A is a schematic perspective view showing the button structure of FIG. 1A in a pressed state.

第2B圖繪示第2A圖之按鍵結構的俯視圖。 FIG. 2B is a top view showing the structure of the button of FIG. 2A.

第2C圖繪示第2B圖之按鍵結構沿方向2C-2C’的剖視圖。 Fig. 2C is a cross-sectional view showing the key structure of Fig. 2B in the direction 2C-2C'.

第3圖繪示第1B圖之按鍵結構從未按壓狀態變換至按壓狀態之過程的訊號變化圖。 FIG. 3 is a diagram showing a signal change diagram of a process in which the button structure of FIG. 1B is changed from an unpressed state to a pressed state.

第4A圖繪示依照本創作第二實施例之按鍵結構處於未按壓狀態的分解圖。 FIG. 4A is an exploded view showing the button structure according to the second embodiment of the present invention in an unpressed state.

第4B圖繪示第4A圖之按鍵結構之組合示意圖。 FIG. 4B is a schematic diagram showing the combination of the button structures of FIG. 4A.

第4C圖繪示第4B圖之按鍵結構的俯視圖(省略鍵帽)。 Fig. 4C is a plan view showing the key structure of Fig. 4B (the keycap is omitted).

第4D圖繪示第4C圖之按鍵結構沿方向4D-4D’的剖視圖。 Fig. 4D is a cross-sectional view showing the button structure of Fig. 4C in the direction 4D-4D'.

第4E圖繪示第4C圖之按鍵結構沿方向4E-4E’的剖視圖。 Figure 4E is a cross-sectional view of the button structure of Figure 4C taken along direction 4E-4E'.

第5A圖繪示第4B圖之按鍵結構處於按壓狀態的組合示意圖(省略鍵帽)。 FIG. 5A is a schematic diagram showing the combination of the button structure of FIG. 4B in a pressed state (the keycap is omitted).

第5B圖繪示第5A圖之按鍵結構的俯視圖。 FIG. 5B is a top view showing the button structure of FIG. 5A.

第5C圖繪示第5B圖之按鍵結構沿方向5C-5C’的剖視圖。 Fig. 5C is a cross-sectional view showing the key structure of Fig. 5B in the direction 5C-5C'.

第5D圖繪示第5B圖之按鍵結構沿方向5D-5D’的剖視圖。 Fig. 5D is a cross-sectional view showing the key structure of Fig. 5B in the direction 5D-5D'.

第6圖繪示第4B圖之按鍵結構從未按壓狀態變換至按壓狀態之過程的訊號變化圖。 FIG. 6 is a diagram showing a signal change diagram of a process in which the button structure of FIG. 4B is changed from an unpressed state to a pressed state.

第7A圖繪示依照本創作第三實施例之按鍵結構處於未按壓狀態的分解示意圖。 FIG. 7A is an exploded perspective view showing the button structure according to the third embodiment of the present invention in an unpressed state.

第7B圖繪示第7A圖之按鍵結構之組合示意圖。 FIG. 7B is a schematic diagram showing the combination of the button structures of FIG. 7A.

第7C圖繪示第7B圖之按鍵結構省略鍵帽的示意圖。 FIG. 7C is a schematic diagram showing the key structure of the button structure of FIG. 7B omitting the key cap.

第7D圖繪示第7C圖之按鍵結構沿方向7D-7D’的剖視圖。 Fig. 7D is a cross-sectional view showing the key structure of Fig. 7C in the direction 7D-7D'.

第7E圖繪示第7C圖之接墊之俯視圖。 Fig. 7E is a plan view showing the pad of Fig. 7C.

第8圖繪示第7D圖之按鍵結構處於按壓狀態的剖視圖。 Figure 8 is a cross-sectional view showing the button structure of Figure 7D in a pressed state.

第9圖繪示依照本創作第四實施例之按鍵結構處於未按壓狀態的剖視圖。 Figure 9 is a cross-sectional view showing the button structure in accordance with the fourth embodiment of the present invention in an unpressed state.

第10A圖繪示依照本創作第五實施例之按鍵結構處於未按壓狀態的立體示意圖。 FIG. 10A is a perspective view showing the button structure according to the fifth embodiment of the present invention in an unpressed state.

第10B圖繪示第10A圖之按鍵結構的俯視圖。 FIG. 10B is a top view showing the structure of the button of FIG. 10A.

第10C圖繪示第10B圖之按鍵結構沿方向10C-10C’的剖視圖。 Figure 10C is a cross-sectional view of the button structure of Figure 10B taken along the direction 10C-10C'.

第11圖繪示依照本創作另一實施例之可撓式導電件的示意圖。 11 is a schematic view of a flexible conductive member according to another embodiment of the present invention.

請參照第1A~2C圖，第1A圖繪示依照本創作第一實施例之按鍵結構100的分解圖，第1B圖繪示依照本第1A圖之按鍵結構100的組合示意圖(處於未按壓狀態)，第1C圖繪示第1B圖之按鍵結構100省略鍵帽的示意圖，第1D圖繪示第1C圖之按鍵結構100的俯視圖，第1E圖繪示第1D圖之按鍵結構100沿方向1E-1E’的剖視圖，而第1F圖繪示第1D圖之按鍵結構100沿方向1F-1F’的剖視圖。 1A-2C, FIG. 1A is an exploded view of the button structure 100 according to the first embodiment of the present invention, and FIG. 1B is a schematic view showing the combination of the button structure 100 according to the first FIG. 1A (in an unpressed state). 1C is a schematic view showing the key structure 100 of FIG. 1B omitting the key cap, FIG. 1D is a top view of the button structure 100 of FIG. 1C, and FIG. 1E is a view showing the key structure 100 of the 1D figure along the direction 1E. -1E' is a cross-sectional view, and FIG. 1F is a cross-sectional view of the button structure 100 of FIG. 1D in the direction 1F-1F'.

第2A圖繪示第1A圖之按鍵結構100處於按壓狀態的立體示意圖，第2B圖繪示第2A圖之按鍵結構100的俯視圖，而第2C圖繪示第2B圖之按鍵結構100沿方向2C-2C’的剖視圖。 2A is a perspective view showing the button structure 100 of FIG. 1A in a pressed state, FIG. 2B is a top view of the button structure 100 of FIG. 2A, and FIG. 2C is a view showing a button structure 100 of FIG. 2B along the direction 2C. -2C' cross-sectional view.

如第1A~1C圖所示，按鍵結構100包括鍵帽110、電路板120、升降機構130、導電架140、控制器150、底板160、磁性件170及磁性部180。鍵帽110、升降機構130、導電架140、磁性件170與磁性部180可構成一組按鍵。本創作實施例之按鍵結構100係以一組按鍵為例說明，然按鍵結構100亦可適用於一鍵盤所包含多組按鍵。 As shown in FIGS. 1A to 1C, the key structure 100 includes a keycap 110, a circuit board 120, a lifting mechanism 130, a conductive frame 140, a controller 150, a bottom plate 160, a magnetic member 170, and a magnetic portion 180. The keycap 110, the lifting mechanism 130, the conductive frame 140, the magnetic member 170 and the magnetic portion 180 can constitute a set of buttons. The button structure 100 of the present embodiment is described by taking a group of buttons as an example. However, the button structure 100 can also be applied to a plurality of groups of buttons included in a keyboard.

電路板120包括第一接墊121及第二接墊122。升降機構130配置在電路板120與鍵帽110之間。鍵帽110經由升降機構130相對電路板120上下移動。導電架140配置在升降機構130上，以隨升降機構130上下移動。導電架140包括第一導電部141及第二導電部142，其分別位於第一接墊121及第二接墊122上方。第一導電部141之運動路徑M1(繪示於第1E及2C圖)及第二導電部142之運動路徑分別到達第一接墊121及第二接墊122，使第一導電部141及第二導電部142在運動過程中得以接觸到第一接墊121及第二接墊122。當第一導電部141及第二導電部142分別接觸第一接墊121及第二接墊122時，第一接墊121、第一導電部141、第二導電部142與第二接墊122形成一第一橫跨電流路徑L1。 The circuit board 120 includes a first pad 121 and a second pad 122. The lifting mechanism 130 is disposed between the circuit board 120 and the keycap 110. The keycap 110 moves up and down relative to the circuit board 120 via the lifting mechanism 130. The conductive frame 140 is disposed on the lifting mechanism 130 to move up and down with the lifting mechanism 130. The conductive frame 140 includes a first conductive portion 141 and a second conductive portion 142, which are respectively located on the first pad 121 and the second pad 122. square. The moving path M1 of the first conductive portion 141 (shown in FIGS. 1E and 2C) and the moving path of the second conductive portion 142 reach the first pad 121 and the second pad 122, respectively, so that the first conductive portion 141 and the first conductive portion 141 The two conductive portions 142 are in contact with the first pads 121 and the second pads 122 during the movement. When the first conductive portion 141 and the second conductive portion 142 respectively contact the first pad 121 and the second pad 122, the first pad 121, the first conductive portion 141, the second conductive portion 142 and the second pad 122 A first traverse current path L1 is formed.

如第1D圖所示，第一接墊121及第二接墊122間隔一預設間距S1。升降機構130相對電路板120上下移動於較高位置PH(或稱釋放位置，下同，繪示於第1E圖)與較低位置PL(或稱按壓位置，下同，繪示於第2C圖)之間。導電架140配置在升降機構130上，以隨升降機構130上下移動，導電架140包括第一導電部141，第二導電部142及橫向導電部143，第一導電部141與第二導電部142分別位於第一接墊121及第二接墊122上方，橫向導電部143位於第一導電部141與第二導電部142間且橫向導電部143之延伸長度S2(繪示於第1D圖)超過預設間距S1(繪示於第1D圖)。當鍵帽110位於較高位置PH時(鍵帽110處於未按壓狀態，如第1E圖所示)，第一導電部141及第二導電部142分別接觸第一接墊121及第二接墊122，使第一接墊121的電能依序流經第一導電部141、橫向導電部143、第二導電部142而到達第二接墊122，電流傳輸路徑如第1C圖所示。當鍵帽110被按壓而位於較低位置PL(如第2C圖所示)時，第一導電部141及第二導電部142分別遠離第一接墊121及第二接墊122，使第一接墊121及第二接墊122保持電性隔離。 As shown in FIG. 1D, the first pads 121 and the second pads 122 are spaced apart by a predetermined interval S1. The lifting mechanism 130 moves up and down relative to the circuit board 120 at a higher position PH (or a release position, the same as below, shown in Figure 1E) and a lower position PL (or a pressed position, the same below, shown in Figure 2C) )between. The conductive frame 140 is disposed on the lifting mechanism 130 to move up and down with the lifting mechanism 130. The conductive frame 140 includes a first conductive portion 141, a second conductive portion 142 and a lateral conductive portion 143, and the first conductive portion 141 and the second conductive portion 142. The first conductive pad 143 and the second conductive pad 142 are located between the first conductive portion 141 and the second conductive portion 142, and the extended length S2 of the lateral conductive portion 143 (shown in FIG. 1D) exceeds The preset spacing S1 (shown in Figure 1D). When the keycap 110 is at the upper position PH (the key cap 110 is in the unpressed state, as shown in FIG. 1E), the first conductive portion 141 and the second conductive portion 142 contact the first pad 121 and the second pad, respectively. 122, the electric energy of the first pad 121 is sequentially flowed through the first conductive portion 141, the lateral conductive portion 143, and the second conductive portion 142 to reach the second pad 122, and the current transmission path is as shown in FIG. 1C. When the keycap 110 is pressed and located at the lower position PL (as shown in FIG. 2C), the first conductive portion 141 and the second conductive portion 142 are respectively far The first pad 121 and the second pad 122 are electrically isolated from the first pad 121 and the second pad 122.

本創作實施例之按鍵結構100係以電路板120取代習知軟性的薄膜開關層(Membrane Switches layer)。由於電路板120為硬板，只要導電架140的二個導電部一接觸到電路板120上的接墊，即形成第一橫跨電流路徑L1，不需克服材料本身的壓縮性。因此，相較於習知的薄膜開關層，本創作實施例按鍵結構100之觸發可靠度較高。 The key structure 100 of the present embodiment replaces the conventional soft membrane switch layer with the circuit board 120. Since the circuit board 120 is a hard board, as long as the two conductive portions of the conductive frame 140 contact the pads on the circuit board 120, the first traverse current path L1 is formed, and the compressibility of the material itself is not required to be overcome. Therefore, the triggering reliability of the button structure 100 of the present embodiment is higher than that of the conventional membrane switch layer.

就結構而言，電路板120包含一基材，其可為單層或多層結構。當基材為單層板時，基材為一介電質，例如聚醯亞胺(polyimide)等。當基材為多層板時，基材可為一核心(core)基板例如可由陶瓷材料、有機材質、纖維強化有機材料(Fiber-reinforced)或顆粒強化有機材質(Particle-reinforced)等所構成，具體材質例如：環氧樹脂(Epoxy resin)、聚乙醯胺(polyimide)、順雙丁醯二酸醯亞胺/三氮阱樹脂(Bismaleimide triazine-based,BT)、氰酯(Cyanate ester)等，亦可以為表面覆上一層積介電層的已完成核心電路佈局的核心基板。 In terms of structure, the circuit board 120 includes a substrate which may be a single layer or a multilayer structure. When the substrate is a single layer, the substrate is a dielectric such as polyimide or the like. When the substrate is a multi-layer board, the substrate may be a core substrate, for example, a ceramic material, an organic material, a fiber-reinforced organic material or a particle-reinforced organic material (Particle-reinforced), etc. Materials such as: Epoxy resin, polyimide, Bismaleimide triazine-based (BT), Cyanate ester, etc. It is also possible to have a core substrate with a completed core circuit layout of a dielectric layer on the surface.

如第1C~1E圖所示，升降機構130樞接於底板160且升降機構130包括第一升降件131及第二升降件132。底板160配置在電路板120與鍵帽110之間。第一升降件131與底板160樞接於第一樞接點P1，第二升降件132與底板160樞接於第二樞接點 P2。當升降機構130進行升降運動時，第一升降件131相對第一樞接點P1轉動，而第二升降件132相對第二樞接點P2轉動。 As shown in FIGS. 1C-1E, the lifting mechanism 130 is pivotally connected to the bottom plate 160 and the lifting mechanism 130 includes a first lifting member 131 and a second lifting member 132. The bottom plate 160 is disposed between the circuit board 120 and the keycap 110. The first lifting member 131 and the bottom plate 160 are pivotally connected to the first pivot point P1, and the second lifting member 132 and the bottom plate 160 are pivotally connected to the second pivot point. P2. When the lifting mechanism 130 performs the lifting movement, the first lifting member 131 rotates relative to the first pivot point P1, and the second lifting member 132 rotates relative to the second pivot point P2.

如第1A圖所示，本創作實施例之升降機構130係以蝶式剪刀腳機構為例。第1D圖為俯視圖，但若從第1D圖之側視方向(如往+Y方向)看去，第一導電部141(或第二導電部142)位於第一樞接點P1與第二樞接點P2之間。如此，當按鍵結構100處於未按壓狀態(如第1E圖所示)時，第一導電部141得以接觸第一接墊121，且第二導電部142(未繪示於第1E圖)得以接觸第二接墊122(未繪示於第1E圖)；當按鍵結構100處於按壓狀態(如第2C圖所示)時，第一導電部141與第一接墊121分離，且第二導電部142(未繪示於第2C圖)與第二接墊122(未繪示於第2C圖)分離。 As shown in FIG. 1A, the elevating mechanism 130 of the present embodiment is exemplified by a butterfly scissor mechanism. 1D is a plan view, but the first conductive portion 141 (or the second conductive portion 142) is located at the first pivot point P1 and the second pivot point when viewed from the side view direction of the 1D view (eg, toward the +Y direction). Between the points P2. Thus, when the button structure 100 is in an unpressed state (as shown in FIG. 1E), the first conductive portion 141 is in contact with the first pad 121, and the second conductive portion 142 (not shown in FIG. 1E) is contacted. a second pad 122 (not shown in FIG. 1E); when the button structure 100 is in a pressed state (as shown in FIG. 2C), the first conductive portion 141 is separated from the first pad 121, and the second conductive portion is separated 142 (not shown in FIG. 2C) is separated from the second pad 122 (not shown in FIG. 2C).

如第1D及1F圖所示，導電架140更包括數個結合彈片144，其中前述第一導電部141、第二導電部142及結合彈片144連接於橫向導電部143。在實施例中，第一導電部141、第二導電部142、結合彈片144與橫向導電部143例如是一體成形結構。例如，導電架140係以鈑金工法形成的鈑件。以材質來說，導電架140的材質例如是包含銅、鋁或其它具優良導電性的材料。 As shown in FIGS. 1D and 1F , the conductive frame 140 further includes a plurality of bonded elastic pieces 144 , wherein the first conductive portion 141 , the second conductive portion 142 , and the combined elastic piece 144 are connected to the lateral conductive portion 143 . In the embodiment, the first conductive portion 141, the second conductive portion 142, the bonded elastic piece 144 and the lateral conductive portion 143 are, for example, an integrally formed structure. For example, the conductive frame 140 is a member formed by a sheet metal method. In terms of materials, the material of the conductive frame 140 is, for example, copper, aluminum or other materials having excellent electrical conductivity.

如第1A及1C圖所示，橫向導電部143配置在升降機構130上方，第一導電部141及第二導電部142連接橫向導電部143且自橫向導電部143往電路板120方向延伸。如此，當按鍵結構100從按壓狀態(如第2C圖所示)變換至未按壓狀態(如第1E圖所示)時，導電部(第一導電部141及第二導電部142)得以往接墊 (第一接墊121及第二接墊122)方向接近。此外，如第1E圖所示，第一導電部141包括相連接之可撓部1411與接觸部1412，可撓部1411連接橫向導電部143與接觸部1412，接觸部1412與可撓部1411之間夾一鈍角A1，以提供第一導電部141一良好的可撓性。在實施例中，可撓部1411與接觸部1412例如是一體成形結構。 As shown in FIGS. 1A and 1C, the lateral conductive portion 143 is disposed above the elevating mechanism 130, and the first conductive portion 141 and the second conductive portion 142 are connected to the lateral conductive portion 143 and extend from the lateral conductive portion 143 toward the circuit board 120. As described above, when the key structure 100 is changed from the pressed state (as shown in FIG. 2C) to the unpressed state (as shown in FIG. 1E), the conductive portions (the first conductive portion 141 and the second conductive portion 142) are connected in the past. pad (The first pad 121 and the second pad 122 are in the same direction). In addition, as shown in FIG. 1E, the first conductive portion 141 includes the connecting flexible portion 1411 and the contact portion 1412, and the flexible portion 1411 connects the lateral conductive portion 143 and the contact portion 1412, and the contact portion 1412 and the flexible portion 1411 An obtuse angle A1 is interposed to provide a good flexibility of the first conductive portion 141. In the embodiment, the flexible portion 1411 and the contact portion 1412 are, for example, an integrally formed structure.

如第1F圖所示，導電架140卡合於第一升降件131。舉例來說，第一升降件131具有數個結合孔洞131a。當導電架140與第一升降件131組合時，各結合彈片144穿過對應之結合孔洞131a，並伸入第一升降件131的內部或下方，以卡合於第一升降件131。此外，如第1D圖所示，磁性件170包括至少一結合彈片171，其穿過第二升降件132之結合孔洞132a，並伸入第二升降件132的內部或下方，以卡合於第二升降件132。結合彈片171的結構類似結合彈片144，於此不再贅述。 As shown in FIG. 1F, the conductive frame 140 is engaged with the first lifting member 131. For example, the first lifting member 131 has a plurality of coupling holes 131a. When the conductive frame 140 is combined with the first lifting member 131, each of the combined elastic pieces 144 passes through the corresponding coupling hole 131a and protrudes into the inside or below of the first lifting member 131 to be engaged with the first lifting member 131. In addition, as shown in FIG. 1D, the magnetic member 170 includes at least one combined elastic piece 171 which passes through the coupling hole 132a of the second lifting member 132 and extends into the inside or below of the second lifting member 132 to be engaged with the first Two lifting members 132. The structure of the combined elastic piece 171 is similar to that of the combined elastic piece 144, and details are not described herein again.

請參照第3圖，其繪示第1B圖之按鍵結構100從未按壓狀態變換至按壓狀態之過程的訊號變化圖。如圖所示，曲線C11表示按壓行程與按壓力F1(按壓力F1繪示於第2C圖)的關係，其中曲線C11之最低點C11a表示手感覺到按鍵升降機構130撞擊接觸到底板160或電路板120時的行程點。曲線C12表示按壓行程與控制器150所偵測到電壓的關係，而曲線C13表示對曲線C12延遲且反轉的訊號曲線。如圖所示，曲線C12之高位準H1之區域表示按鍵結構100處於未按壓狀態時控制器150所偵測到的訊號，曲線C12之低位準H2之區域表示按鍵結構100處於按壓狀態時控制器 150所偵測到的訊號。如曲線C12可知，由於按鍵結構100處於未按壓狀態時第一橫跨電流路徑L1形成閉迴路，使控制器150偵測到第一橫跨電流路徑L1的電訊號(高位準H1)。由於按鍵結構100處於按壓狀態時第一橫跨電流路徑L1形成開迴路(斷開)，因此無電流流經控制器150，控制器150以低位準表示偵測狀態。 Referring to FIG. 3, a signal change diagram of the process of changing the button structure 100 of FIG. 1B from the unpressed state to the pressed state is shown. As shown in the figure, the curve C11 indicates the relationship between the pressing stroke and the pressing force F1 (the pressing force F1 is shown in FIG. 2C), wherein the lowest point C11a of the curve C11 indicates that the hand feels that the button lifting mechanism 130 is in contact with the bottom plate 160 or the circuit. The travel point of the board 120. Curve C12 represents the relationship between the pressing stroke and the voltage detected by the controller 150, and curve C13 represents the signal curve delayed and inverted for the curve C12. As shown, the region of the high level H1 of the curve C12 indicates the signal detected by the controller 150 when the button structure 100 is in the unpressed state, and the region of the low level H2 of the curve C12 indicates that the button structure 100 is in the pressed state. 150 detected signals. As can be seen from the curve C12, the first traverse current path L1 forms a closed loop when the button structure 100 is in the unpressed state, so that the controller 150 detects the electrical signal (high level H1) of the first traverse current path L1. Since the first traverse current path L1 forms an open circuit (open) when the button structure 100 is in the pressed state, no current flows through the controller 150, and the controller 150 indicates the detection state at a low level.

控制器150用以：(1).偵測第一橫跨電流路徑L1的電壓變化，如曲線C12；(2).判斷曲線C12之電壓變化從高位準H1變化至低位準H2的變換點Pa，其中變換點Pa表示第一橫跨電流路徑L1從閉迴路(按鍵結構100呈未按壓狀態)變換成開迴路(按鍵結構100呈按壓狀態)的行程點；(3).將變換點Pa延遲一行程ΔP後，再反轉電壓變化，以得到曲線C13。控制器150將變換點Pa延遲一行程ΔP，使曲線C13(反轉後)的變換點Pb對應或稍微落後曲線C11之最低點C11a(手感覺到升降機構130撞擊接觸到底板160或電路板120時，如此提供力回饋給使用者告知開關觸發的行程點)。 The controller 150 is configured to: (1) detect a voltage change of the first traverse current path L1, such as a curve C12; (2) determine a change point of the voltage change of the curve C12 from a high level H1 to a low level H2. Wherein the change point Pa represents a travel point at which the first traverse current path L1 is converted from the closed loop (the button structure 100 is unpressed) to the open loop (the button structure 100 is pressed); (3). The transition point Pa is delayed After one stroke ΔP, the voltage change is reversed to obtain a curve C13. The controller 150 delays the change point Pa by one stroke ΔP such that the change point Pb of the curve C13 (after the reverse rotation) corresponds to or slightly falls behind the lowest point C11a of the curve C11 (the hand senses that the lift mechanism 130 is in contact with the bottom plate 160 or the circuit board 120). In this case, the force feedback is provided to the user to inform the switch of the stroke point of the switch.

控制器150在偵測到變換點Pb時才發出觸發訊號。詳言之，控制器150在偵測到變換點Pa時，尚不發出觸發訊號，而是將變換點Pa延遲一行程ΔP後再發出觸發訊號。延遲後的變換點Pb大致對應或稍微落後曲線C11之最低點C11a(手感覺到力回饋提示開關觸發的行程點)。如此，不會發生使用者尚未感覺到按鍵結構100受觸發的手感，控制器150就發出觸發訊號的問題。此外，觸發訊號可發送到一電子裝置(未繪示)的處理器 (processor)，處理器據以執行對應該觸發訊號的功能。在一實施例中，使用者可透過韌體(firmware)/應用程式任意調整電訊號觸發的延遲時間(如行程ΔP)，讓使用者的手指感覺到按鍵結構100受觸發的時機點與控制器150發出觸發訊號的時機點接近。 The controller 150 issues a trigger signal when the change point Pb is detected. In detail, when detecting the change point Pa, the controller 150 does not issue the trigger signal, but delays the change point Pa by one stroke ΔP before issuing the trigger signal. The delayed transition point Pb substantially corresponds to or slightly falls behind the lowest point C11a of the curve C11 (the hand feels the stroke point triggered by the force feedback cue switch). In this way, the user does not feel the touch of the button structure 100 being triggered, and the controller 150 issues a trigger signal. In addition, the trigger signal can be sent to a processor of an electronic device (not shown) (processor), the processor performs the function corresponding to the trigger signal. In an embodiment, the user can arbitrarily adjust the delay time of the electrical signal trigger (such as the stroke ΔP) through the firmware/application, so that the user's finger feels the timing and the controller of the key structure 100 being triggered. The timing of the 150 trigger signal is close.

此外，本創作實施例之按鍵結構100例如是磁吸式按鍵結構。詳言之，如第1A及1D圖所示，磁性部180可配置在底板160上，而磁性件170可配置在第二升降件132上，以隨第二升降件132上下移動。磁性件170與磁性部180之間能產生一吸引力，使得磁性件170與磁性部180趨向相互靠近，其中磁性件170與磁性部180正對設置，但本創作實施例不以此為限。原則上，磁性件與磁性部之設置僅需使吸引力滿足產品要求即可。此外，當按鍵結構100處於未按壓狀態時，磁性件170與磁性部180部分接觸或相互接近。當按鍵結構100處於按壓狀態時，磁性件170與磁性部180完全分離或相互遠離。 Further, the key structure 100 of the present embodiment is, for example, a magnetic button structure. In detail, as shown in FIGS. 1A and 1D, the magnetic portion 180 may be disposed on the bottom plate 160, and the magnetic member 170 may be disposed on the second lifting member 132 to move up and down with the second lifting member 132. An attractive force is generated between the magnetic member 170 and the magnetic portion 180, so that the magnetic member 170 and the magnetic portion 180 tend to be close to each other, wherein the magnetic member 170 is disposed opposite to the magnetic portion 180, but the present embodiment is not limited thereto. In principle, the arrangement of the magnetic part and the magnetic part only needs to make the attraction meet the product requirements. Further, when the key structure 100 is in an unpressed state, the magnetic member 170 is partially in contact with or close to each other. When the key structure 100 is in the pressed state, the magnetic member 170 is completely separated from or away from the magnetic portion 180.

磁性件170可做為向上回復力元件。例如，當按鍵結構100從按壓狀態被釋放時，磁性件170與磁性部180之間產生吸引力而相互靠近，使鍵帽110向上回復至未按壓狀態。此外，如第1A及1D圖所示，預設間距S1大於磁性件170(向上回復力元件)的長度W1，使得磁性件170可設置於第一接墊121及第二接墊122之間，然此為舉例說明，本創作實施例不以此為限。在一實施例中，預設間距S1可大於鍵帽110的寬度W2的1/4，如此可容納較大尺寸的磁性件170。 The magnetic member 170 can be used as an upward return force member. For example, when the key structure 100 is released from the pressed state, an attraction force is generated between the magnetic member 170 and the magnetic portion 180 to approach each other, and the keycap 110 is returned upward to the unpressed state. In addition, as shown in FIGS. 1A and 1D, the preset spacing S1 is greater than the length W1 of the magnetic member 170 (upward restoring force member), so that the magnetic member 170 can be disposed between the first pad 121 and the second pad 122. However, for the sake of illustration, the present embodiment is not limited thereto. In an embodiment, the predetermined spacing S1 may be greater than 1/4 of the width W2 of the keycap 110 so as to accommodate the larger size magnetic member 170.

在另一實施例中，向上回復力元件例如是橡膠彈性體(Rubber Dome)，其可設置在第一升降件131與第二升降件132之間的區域並位於鍵帽110與底板160之間；當按鍵結構100從按壓狀態(橡膠彈性體被按壓而儲存彈性位能)被釋放時，橡膠彈性體釋放彈性位能而趨使鍵帽110向上回復至未按壓狀態。在另一實施例中，向上回復力元件例如是彈簧，其可水平式地連接第一升降件131與第二升降件132；當按鍵結構100從按壓狀態(彈簧形變而儲存彈性位能)被釋放時，彈簧釋放彈性位能而趨使第一升降件131與第二升降件132運動而將鍵帽110向上回復至未按壓狀態。在其它實施例中，彈簧可垂直式地連接鍵帽110與底板160；相似地，當按鍵結構100從按壓狀態(彈簧形變而儲存彈性位能)被釋放時，彈簧釋放彈性位能而趨使鍵帽110向上回復至未按壓狀態。 In another embodiment, the upward restoring force element is, for example, a rubber dome that can be disposed between the first lifter 131 and the second lifter 132 and between the keycap 110 and the bottom plate 160. When the key structure 100 is released from the pressed state (the rubber elastic body is pressed to store the elastic potential energy), the rubber elastic body releases the elastic potential energy to cause the keycap 110 to return upward to the unpressed state. In another embodiment, the upward restoring force element is, for example, a spring that horizontally connects the first lifting member 131 and the second lifting member 132; when the button structure 100 is pressed from the state (the spring is deformed to store the elastic potential energy) Upon release, the spring releases the elastic potential energy to cause the first lifter 131 and the second lifter 132 to move to return the keycap 110 upward to the unpressed state. In other embodiments, the spring can vertically connect the keycap 110 to the bottom plate 160; similarly, when the button structure 100 is released from the pressed state (spring deformation to store the elastic potential energy), the spring releases the elastic potential energy and tends to The keycap 110 is returned upward to the unpressed state.

請參照第4A~5D圖，第4A圖繪示依照本創作第二實施例之按鍵結構200處於未按壓狀態的分解示意圖，第4B圖繪示第4A圖之按鍵結構200之組合示意圖，第4C圖繪示第4B圖之按鍵結構200的俯視圖(省略鍵帽110)，第4D圖繪示第4C圖之按鍵結構200沿方向4D-4D’的剖視圖，而第4E圖繪示第4C圖之按鍵結構200沿方向4E-4E’的剖視圖。 4A-5D, FIG. 4A is an exploded perspective view showing the button structure 200 according to the second embodiment of the present invention in an unpressed state, and FIG. 4B is a schematic diagram showing the combination of the button structure 200 of FIG. 4A, 4C. FIG. 4D is a plan view of the button structure 200 of FIG. 4B (the keycap 110 is omitted), FIG. 4D is a cross-sectional view of the button structure 200 of FIG. 4C along the direction 4D-4D′, and FIG. 4E is a diagram of FIG. A cross-sectional view of the button structure 200 in the direction 4E-4E'.

第5A圖繪示第4B圖之按鍵結構200處於按壓狀態的組合示意圖(省略鍵帽110)，第5B圖繪示第5A圖之按鍵結構200的俯視圖，第5C圖繪示第5B圖之按鍵結構200沿方向5C-5C’ 的剖視圖，而第5D圖繪示第5B圖之按鍵結構200沿方向5D-5D’的剖視圖。 FIG. 5A is a schematic diagram showing a combination of the button structure 200 of FIG. 4B in a pressed state (the keycap 110 is omitted), FIG. 5B is a top view of the button structure 200 of FIG. 5A, and FIG. 5C is a diagram of the button of FIG. 5B. Structure 200 along the direction 5C-5C' FIG. 5D is a cross-sectional view of the button structure 200 of FIG. 5B in the direction 5D-5D'.

如第4A~4E圖所示，按鍵結構200包括鍵帽110、電路板120、升降機構130、導電架240、控制器150(未繪示)、底板160、磁性件270及磁性部180。電路板120包括第一接墊121及第二接墊122。升降機構130配置在電路板120與鍵帽110之間。鍵帽110經由升降機構130相對電路板120上下移動。導電架240配置在升降機構130上，以隨升降機構130上下移動，導電架240包括第一導電部241及第二導電部242，其分別位於第一接墊121及第二接墊122上方。第一導電部241之運動路徑M1(繪示於第4E圖)及第二導電部242之運動路徑分別到達第一接墊121及第二接墊122，使第一導電部241及第二導電部242在運動過程中得以接觸到第一接墊121及第二接墊122。當第一導電部241及第二導電部242分別接觸第一接墊121及第二接墊122時，第一接墊121、第一導電部241、第二導電部242與第二接墊122形成第一橫跨電流路徑L1。 As shown in FIGS. 4A-4E, the button structure 200 includes a keycap 110, a circuit board 120, a lifting mechanism 130, a conductive frame 240, a controller 150 (not shown), a bottom plate 160, a magnetic member 270, and a magnetic portion 180. The circuit board 120 includes a first pad 121 and a second pad 122. The lifting mechanism 130 is disposed between the circuit board 120 and the keycap 110. The keycap 110 moves up and down relative to the circuit board 120 via the lifting mechanism 130. The conductive frame 240 is disposed on the lifting mechanism 130 to move up and down with the lifting mechanism 130. The conductive frame 240 includes a first conductive portion 241 and a second conductive portion 242 respectively located above the first pad 121 and the second pad 122. The moving path M1 of the first conductive portion 241 (shown in FIG. 4E ) and the moving path of the second conductive portion 242 respectively reach the first pad 121 and the second pad 122 to make the first conductive portion 241 and the second conductive portion The portion 242 is in contact with the first pad 121 and the second pad 122 during the movement. When the first conductive portion 241 and the second conductive portion 242 respectively contact the first pad 121 and the second pad 122, the first pad 121, the first conductive portion 241, the second conductive portion 242 and the second pad 122 A first traverse current path L1 is formed.

此外，按鍵結構200之導電部(如第一導電部241及第二導電部242)的位置不同於按鍵結構100之導電部(如第一導電部141及第二導電部142)。例如，第4C圖為俯視圖，但若從第4C圖之側視方向(如往+Y方向)看去，第一樞接點P1位於第一導電部241與第二樞接點P2之間。如此，當按鍵結構100處於未按壓狀態(如第4E圖所示)時，第一導電部241未接觸第一接墊121，且第二導電部242(未繪示於第4E圖)未接觸第二接墊122(未繪示於第4E圖)；當按鍵結構100處於按壓狀態(如第5D圖所示)時，第一導電部241與第一接墊121接觸，且第二導電部242(未繪示於第5D圖)與第二接墊122(未繪示於第5D圖)接觸，而形成第一橫跨電流路徑L1。 In addition, the conductive portions of the button structure 200 (such as the first conductive portion 241 and the second conductive portion 242) are different from the conductive portions of the button structure 100 (such as the first conductive portion 141 and the second conductive portion 142). For example, FIG. 4C is a plan view, but the first pivot point P1 is located between the first conductive portion 241 and the second pivot point P2 as seen from the side view direction of the FIG. 4C (eg, toward the +Y direction). As such, when the button structure 100 is in an unpressed state (as shown in FIG. 4E), the first conductive portion 241 does not contact the first pad 121, and the second The conductive portion 242 (not shown in FIG. 4E) does not contact the second pad 122 (not shown in FIG. 4E); when the button structure 100 is in a pressed state (as shown in FIG. 5D), the first conductive portion 241 is in contact with the first pad 121, and the second conductive portion 242 (not shown in FIG. 5D) is in contact with the second pad 122 (not shown in FIG. 5D) to form a first traverse current path L1. .

磁性件270也可以具有類似導電架240的導電部結構。舉例來說，如第4C及4D圖所示，電路板120更包括第三接墊123及第四接墊124。磁性件270具有導電性，且配置在第二升降件132上，以隨第二升降件132上下移動。磁性件270包括第三導電部271及第四導電部272，其分別位於第三接墊123及第四接墊124上方。第三導電部271之運動路徑M2(繪示於第4D圖)及第四導電部272之運動路徑分別到達第三接墊123及第四接墊124，使第三導電部271及第四導電部272在運動過程中得以分別接觸第三接墊123及第四接墊124。如第5A圖所示，(1)當第一導電部241及第二導電部242分別接觸第一接墊121及第二接墊122時，使得第一接墊121、第一導電部241、第二導電部242與第二接墊122之間形成第一橫跨電流路徑L1；(2)當第三導電部271及第四導電部272分別接觸第三接墊123及第四接墊124時，使得第三接墊123、第三導電部271、第四導電部272與第四接墊124之間形成第二橫跨電流路徑L2。 The magnetic member 270 may also have a conductive portion structure similar to the conductive frame 240. For example, as shown in FIGS. 4C and 4D, the circuit board 120 further includes a third pad 123 and a fourth pad 124. The magnetic member 270 is electrically conductive and disposed on the second lifting member 132 to move up and down with the second lifting member 132. The magnetic member 270 includes a third conductive portion 271 and a fourth conductive portion 272 respectively located above the third pad 123 and the fourth pad 124. The moving path M2 of the third conductive portion 271 (shown in FIG. 4D) and the moving path of the fourth conductive portion 272 reach the third pad 123 and the fourth pad 124 respectively, so that the third conductive portion 271 and the fourth conductive portion The portion 272 is in contact with the third pad 123 and the fourth pad 124 respectively during the movement. As shown in FIG. 5A, (1) when the first conductive portion 241 and the second conductive portion 242 contact the first pad 121 and the second pad 122, respectively, the first pad 121, the first conductive portion 241, A first traverse current path L1 is formed between the second conductive portion 242 and the second pad 122; (2) when the third conductive portion 271 and the fourth conductive portion 272 respectively contact the third pad 123 and the fourth pad 124 The second traverse current path L2 is formed between the third pad 123, the third conductive portion 271, the fourth conductive portion 272, and the fourth pad 124.

請參照第6圖，其繪示第4B圖之按鍵結構200從未按壓狀態變換至按壓狀態之過程的訊號變化圖。後述實施例之按鍵結構300~500的訊號變化圖也類似第6圖，容此不再贅述。如圖所示，曲線C21表示按壓行程與按壓力的關係，曲線C22表示按壓行程與控制器150所偵測到電壓的關係，而曲線C23表示曲線C22延遲後的訊號曲線。曲線C22之低位準H2之區域表示按鍵結構100處於未按壓狀態(第一橫跨電流路徑L1呈開迴路)時控制器150所偵測到的訊號，曲線C22之高位準H1之區域表示按鍵結構100處於按壓狀態(第一橫跨電流路徑L1呈閉迴路)時控制器150所偵測到的訊號。如曲線C21所示，最低點C21a表示手感覺到按鍵升降機構130撞擊接觸到底板160或電路板120時產生力回饋的行程點。如曲線C22可知，由於按鍵結構100處於未按壓狀態時第一橫跨電流路徑L1形成開迴路，無電流流經控制器150，控制器150以低位準表示偵測狀態。由於按鍵結構100處於按壓狀態時第一橫跨電流路徑L1形成閉迴路，使控制器150偵測到第一橫跨電流路徑L1的電訊號(高位準H1)。 Please refer to FIG. 6 , which shows a signal change diagram of the process of changing the button structure 200 of FIG. 4B from the unpressed state to the pressed state. Button of the embodiment to be described later The signal change diagram of the structure 300~500 is similar to that of the sixth figure, and will not be described again. As shown, curve C21 represents the relationship between the pressing stroke and the pressing force, curve C22 represents the relationship between the pressing stroke and the voltage detected by the controller 150, and curve C23 represents the delayed signal curve of the curve C22. The area of the lower level H2 of the curve C22 indicates the signal detected by the controller 150 when the button structure 100 is in the unpressed state (the first traverse current path L1 is open circuit), and the area of the high level H1 of the curve C22 indicates the button structure. The signal detected by the controller 150 when the 100 is in the pressed state (the first traverse current path L1 is closed). As shown by the curve C21, the lowest point C21a indicates the stroke point at which the hand feels the force feedback of the button lift mechanism 130 when it hits the bottom plate 160 or the circuit board 120. As can be seen from the curve C22, since the first traverse current path L1 forms an open circuit when the button structure 100 is in the unpressed state, no current flows through the controller 150, and the controller 150 indicates the detection state at a low level. When the button structure 100 is in the pressed state, the first traverse current path L1 forms a closed loop, so that the controller 150 detects the electrical signal (high level H1) of the first traverse current path L1.

在本實施例中，控制器150用以：(1).偵測第一橫跨電流路徑L1的電壓變化，如曲線C22；(2).判斷曲線C22之電壓變化從低位準H2變化至高位準H1的變換點Pa，其中變換點Pa表示第一橫跨電流路徑L1從開迴路(按鍵結構100呈未按壓狀態)變換成閉迴路(按鍵結構100呈按壓狀態)的行程點；(3).將變換點Pa延遲一行程ΔP後，得到曲線C23。控制器150將變換點Pa延遲一行程ΔP，可使曲線C23的變換點Pb對應或稍微落後曲線C21之最低點C21a(手感覺到升降機構130撞擊接觸到底板160或電路板120時產生力回饋的行程點)。 In this embodiment, the controller 150 is configured to: (1) detect a voltage change of the first traverse current path L1, such as a curve C22; (2). determine that the voltage change of the curve C22 changes from a low level H2 to a high level. a change point Pa of the quasi-H1, wherein the change point Pa represents a travel point of the first cross current path L1 from an open circuit (the button structure 100 is in an unpressed state) to a closed loop (the button structure 100 is in a pressed state); (3) After the transformation point Pa is delayed by one stroke ΔP, a curve C23 is obtained. The controller 150 delays the transformation point Pa by one stroke ΔP, so that the transformation point Pb of the curve C23 can be corresponding to or slightly behind the curve C21. The lowest point C21a (the hand feels the stroke point at which the lifting mechanism 130 hits the bottom plate 160 or the circuit board 120 to generate a force feedback).

控制器150在偵測到變換點Pb時才發出觸發訊號。詳言之，控制器150在偵測到變換點Pa時，尚不發出觸發訊號，而是將變換點Pa延遲一行程ΔP後再發出觸發訊號。延遲後的變換點Pb大致對應或稍微落後曲線C21之最低點C21a(手感覺到力回饋的行程點)。如此，不會發生使用者尚未感覺到按鍵結構200受觸發的手感，控制器150就發出觸發訊號的問題。此外，觸發訊號可發送到一電子裝置(未繪示)的處理器，處理器據以執行對應該觸發訊號的功能。在一實施例中，使用者可透過韌體/應用程式任意調整電訊號觸發的延遲時間(如行程ΔP)，讓使用者的手指感覺到按鍵結構100受觸發的時機點與控制器150發出觸發訊號的時機點接近。 The controller 150 issues a trigger signal when the change point Pb is detected. In detail, when detecting the change point Pa, the controller 150 does not issue the trigger signal, but delays the change point Pa by one stroke ΔP before issuing the trigger signal. The delayed transition point Pb substantially corresponds to or slightly falls behind the lowest point C21a of the curve C21 (the hand feels the stroke point of the force feedback). In this way, the user does not feel the touch of the button structure 200 being triggered, and the controller 150 issues a trigger signal. In addition, the trigger signal can be sent to a processor of an electronic device (not shown), and the processor performs a function corresponding to the trigger signal. In an embodiment, the user can arbitrarily adjust the delay time of the signal triggering (such as the stroke ΔP) through the firmware/application, so that the user's finger feels that the button structure 100 is triggered by the trigger point and the controller 150 triggers. The timing of the signal is close.

請參照第7A~7D圖以及第8圖，第7A圖繪示依照本創作第三實施例之按鍵結構300處於未按壓狀態的分解示意圖，第7B圖繪示第7A圖之按鍵結構300之組合示意圖，第7C圖繪示第7B圖之按鍵結構300省略鍵帽110的示意圖，第7D圖繪示第7C圖之按鍵結構300沿方向7D-7D’的剖視圖，第7E圖繪示第7C圖之接墊321之俯視圖，而第8圖繪示第7D圖之按鍵結構300處於按壓狀態的剖視圖。 Please refer to FIGS. 7A-7D and FIG. 8 , FIG. 7A is an exploded perspective view showing the button structure 300 according to the third embodiment of the present invention in an unpressed state, and FIG. 7B is a combination of the button structure 300 of FIG. 7A . FIG. 7C is a schematic view showing the key structure 300 of the button structure 300 of FIG. 7B omitting the key cap 110, FIG. 7D is a cross-sectional view of the button structure 300 of FIG. 7C along the direction 7D-7D′, and FIG. 7E is a 7Cth view. The top view of the pad 321 is shown, and FIG. 8 is a cross-sectional view showing the button structure 300 of the 7D view in a pressed state.

如第7A~7E圖所示，按鍵結構300包括鍵帽310、電路板320、升降機構330、可撓式導電件340、控制器350、底板 360及彈性件370。如第7C及7E圖所示，電路板320包括至少一接墊321，接墊321包含相鄰之正極321A與負極321B。升降機構330配置在電路板320與鍵帽310之間，鍵帽310經由升降機構330相對電路板320上下移動。在本創作實施例中，可撓式導電件340配置在升降機構330之底部，以隨升降機構330運動，可撓式導電件340之底部區域340R的運動路徑到達正極321A及負極321B。當可撓式導電件340之底部區域340R接觸正極321A及負極321B時，正極321A與負極321B導通。 As shown in FIGS. 7A-7E, the button structure 300 includes a key cap 310, a circuit board 320, a lifting mechanism 330, a flexible conductive member 340, a controller 350, and a bottom plate. 360 and elastic member 370. As shown in FIGS. 7C and 7E, the circuit board 320 includes at least one pad 321 including the adjacent positive electrode 321A and negative electrode 321B. The lifting mechanism 330 is disposed between the circuit board 320 and the keycap 310, and the keycap 310 moves up and down relative to the circuit board 320 via the lifting mechanism 330. In the present embodiment, the flexible conductive member 340 is disposed at the bottom of the lifting mechanism 330 to move along with the lifting mechanism 330. The moving path of the bottom portion 340R of the flexible conductive member 340 reaches the positive electrode 321A and the negative electrode 321B. When the bottom region 340R of the flexible conductive member 340 contacts the positive electrode 321A and the negative electrode 321B, the positive electrode 321A and the negative electrode 321B are electrically connected.

如第7E圖所示，電路板320之正極321A(如第一接墊)與負極321B(如第二接墊)間隔一間隔區SP1。如第7D圖所示，升降機構330配置在電路板320與鍵帽310之間，鍵帽310經由升降機構330相對電路板320上下移動於一較高位置PH(或稱釋放位置，下同，繪示於第7D圖)與較低位置PL(或稱按壓位置，下同，繪示於第8圖)之間。可撓式導電件340包括上段結合部341、中段彈性部342與下段導電部343，其中中段彈性部342連接上段結合部341與下段導電部343。中段彈性部342與下段導電部343相對上段結合部341係可形變，此提供可撓式導電件340一可撓性。藉由上段結合部341，可撓式導電件340結合在升降機構330之底部，以隨升降機構330運動，而下段導電部343尺寸大於間隔區SP1(間隔區SP1繪示於第7E圖)。如第7D及7E圖所示，當鍵帽310位於較高位置PH時，下段導電部343遠離正極321A及負極321B，使正極321A及負極321B保持電性隔離。如第8圖所示，當鍵帽310被按壓而位於較低位置PL時，下段導電部343覆蓋在間隔區SP1，且同時與部分正極321A(如部分第一接墊)及部分負極321B(如部分第二接墊)保持面接觸，使正極321A的電能流經下段導電部343而到達負極321B。當可撓式導電件340觸發接墊321時(受到按壓力F1)，下段導電部343可與正極321A及負極321B保持面接觸，且配合使用者按壓鍵帽310的力量大小，中段彈性部342可配合鍵帽310些許上下移動而變形。 As shown in FIG. 7E, the positive electrode 321A of the circuit board 320 (such as the first pad) and the negative electrode 321B (such as the second pad) are separated by a spacer SP1. As shown in FIG. 7D, the lifting mechanism 330 is disposed between the circuit board 320 and the keycap 310, and the keycap 310 is moved up and down relative to the circuit board 320 via the lifting mechanism 330 to a higher position PH (or a release position, the same below, (Fig. 7D) is shown between the lower position PL (or the pressed position, the same below, shown in Fig. 8). The flexible conductive member 340 includes an upper joint portion 341, a middle elastic portion 342 and a lower conductive portion 343, wherein the middle elastic portion 342 connects the upper joint portion 341 and the lower conductive portion 343. The middle elastic portion 342 and the lower conductive portion 343 are deformable with respect to the upper joint portion 341, which provides flexibility of the flexible conductive member 340. By means of the upper joint portion 341, the flexible conductive member 340 is coupled to the bottom of the lifting mechanism 330 for movement with the lifting mechanism 330, and the lower conductive portion 343 is larger than the spacing portion SP1 (the spacing portion SP1 is shown in FIG. 7E). As shown in FIGS. 7D and 7E, when the keycap 310 is at the higher position PH, the lower conductive portion 343 is away from the positive electrode 321A and the negative electrode 321B, so that the positive electrode 321A and the negative electrode 321B are electrically isolated. As shown in Figure 8, When the keycap 310 is pressed to be at the lower position PL, the lower conductive portion 343 covers the spacer SP1, and at the same time, a portion of the positive electrode 321A (such as a portion of the first pad) and a portion of the negative electrode 321B (such as a portion of the second pad) The surface contact is maintained such that the electric energy of the positive electrode 321A flows through the lower conductive portion 343 to reach the negative electrode 321B. When the flexible conductive member 340 triggers the pad 321 (subject pressure F1), the lower conductive portion 343 can maintain surface contact with the positive electrode 321A and the negative electrode 321B, and cooperate with the user to press the strength of the key cap 310, and the middle elastic portion 342 It can be deformed with the keycap 310 moving up and down a little.

第7E圖所示之虛線框R1表示可撓式導電件340之底部區域340R接觸到正極321A與負極321B的區域。當可撓式導電件340之底部區域340R接觸到正極321A與負極321B時，正極321A與負極321B導通。控制器350電性連接各接墊321之正極321A及負極321B。當控制器350偵測到正極321A與負極321B導通時，執行對應的功能。 The broken line frame R1 shown in Fig. 7E indicates a region where the bottom region 340R of the flexible conductive member 340 contacts the positive electrode 321A and the negative electrode 321B. When the bottom region 340R of the flexible conductive member 340 contacts the positive electrode 321A and the negative electrode 321B, the positive electrode 321A and the negative electrode 321B are turned on. The controller 350 is electrically connected to the positive electrode 321A and the negative electrode 321B of each of the pads 321 . When the controller 350 detects that the positive electrode 321A and the negative electrode 321B are turned on, the corresponding function is performed.

如第7C圖所示，在本實施例中，升降機構330例如是交叉式剪刀腳機構。底板360配置在電路板320與鍵帽310之間。升降機構330樞接於底板360且升降機構330包括第一升降件331及第二升降件332，第一升降件331包括樞接端331A、自由端331B及樞接部331C。第一升降件331透過樞接部331C與第二升降件332交叉地樞接。第一升降件331之樞接端331A樞接於底板360。第二升降件332具有類似第一升降件331的結構，於此不再贅述。可撓式導電件340配置在第一升降件331之自由端331B的底部及/或第二升降件332之自由端(未標示)的底部。 As shown in Fig. 7C, in the present embodiment, the elevating mechanism 330 is, for example, a crossed scissor mechanism. The bottom plate 360 is disposed between the circuit board 320 and the keycap 310. The lifting mechanism 330 is pivotally connected to the bottom plate 360 and the lifting mechanism 330 includes a first lifting member 331 and a second lifting member 332. The first lifting member 331 includes a pivoting end 331A, a free end 331B and a pivoting portion 331C. The first lifting member 331 is pivotally connected to the second lifting member 332 through the pivoting portion 331C. The pivoting end 331A of the first lifting member 331 is pivotally connected to the bottom plate 360. The second lifting member 332 has a structure similar to that of the first lifting member 331 and will not be described herein. The flexible conductive member 340 is disposed at the bottom of the free end 331B of the first lifter 331 and/or at the bottom of the free end (not labeled) of the second lifter 332.

如第7C圖所示，彈性件370配置在鍵帽310與底板360之間。當按鍵結構300處於按壓狀態時，如第8圖所示，彈性件370受到壓縮而儲存一彈性位能。當按壓力釋放，彈性件370之彈性位能也釋放，以將鍵帽310往上推動，使按鍵結構300回復至未按壓狀態。在本實施例中，彈性件370例如是彈性橡膠體。 As shown in FIG. 7C, the elastic member 370 is disposed between the keycap 310 and the bottom plate 360. When the button structure 300 is in the pressed state, as shown in Fig. 8, the elastic member 370 is compressed to store an elastic potential energy. When the pressing force is released, the elastic position of the elastic member 370 is also released to push the keycap 310 upward to return the button structure 300 to the unpressed state. In the present embodiment, the elastic member 370 is, for example, an elastic rubber body.

此外，在另一實施例中，按鍵結構300包括數個可撓式導電件340，其中一個或一些可配置在升降機構330的底部，而另一個或另一些可配置在鍵帽310的底面。在其它實施例中，按鍵結構300的全部的可撓式導電件340可配置在升降機構330的底部，或全部的可撓式導電件340可配置在鍵帽310的底面。 Moreover, in another embodiment, the button structure 300 includes a plurality of flexible conductive members 340, one or some of which may be disposed at the bottom of the lift mechanism 330, and another or others may be disposed at the bottom surface of the keycap 310. In other embodiments, all of the flexible conductive members 340 of the button structure 300 may be disposed at the bottom of the lifting mechanism 330, or all of the flexible conductive members 340 may be disposed at the bottom surface of the keycap 310.

請參照第9圖，其繪示依照本創作第四實施例之按鍵結構400處於未按壓狀態的剖視圖。按鍵結構400包括鍵帽310、電路板320、升降機構330、至少一可撓式導電件340、控制器350(未繪示)、底板360及彈性件470。 Please refer to FIG. 9 , which is a cross-sectional view showing the button structure 400 according to the fourth embodiment of the present invention in an unpressed state. The button structure 400 includes a key cap 310, a circuit board 320, a lifting mechanism 330, at least one flexible conductive member 340, a controller 350 (not shown), a bottom plate 360, and an elastic member 470.

本創作實施例之按鍵結構400具有類似前述按鍵結構300的結構，不同處在於，其中一個可撓式導電件340’可配置在鍵帽310的底面310b，如位於底面310b的中間位置，且按鍵結構400的彈性件470為彈簧，彈簧圍繞可撓式導電件340’。在設計上，當按鍵結構400處於釋放狀態時，各可撓式導電件340都與對應的接墊321分離。當按鍵結構400處於按壓狀態時，各可撓式導電件340大致上都接觸到對應的接墊321。當按鍵結構400處於按壓狀態時，只要數個可撓式導電件340之其中一者與接墊321接觸，控制器350(未繪示)即執行對應的功能。換言之，由於可撓式導電件340的數量係多個，因此可增加按鍵結構400的觸發可靠度。 The button structure 400 of the present embodiment has a structure similar to that of the button structure 300 described above, except that one of the flexible conductive members 340' can be disposed on the bottom surface 310b of the keycap 310, such as in the middle of the bottom surface 310b, and the buttons The resilient member 470 of the structure 400 is a spring that surrounds the flexible conductive member 340'. In design, when the button structure 400 is in the released state, each of the flexible conductive members 340 is separated from the corresponding pads 321 . When the button structure 400 is in the pressed state, each of the flexible conductive members 340 substantially contacts the corresponding pads 321. When the button structure 400 is in the pressed state, only one of the plurality of flexible conductive members 340 is connected to the pad 321 In response, the controller 350 (not shown) performs the corresponding function. In other words, since the number of the flexible conductive members 340 is plural, the trigger reliability of the key structure 400 can be increased.

請參照第10A~10C圖，第10A圖繪示依照本創作第五實施例之按鍵結構500處於未按壓狀態的立體示意圖，第10B圖繪示第10A圖之按鍵結構500的俯視圖，而第10C圖繪示第10B圖之按鍵結構500沿方向10C-10C’的剖視圖。 10A-10C, FIG. 10A is a perspective view showing the button structure 500 according to the fifth embodiment of the present invention in an unpressed state, and FIG. 10B is a top view of the button structure 500 of FIG. 10A, and FIG. 10C. The figure shows a cross-sectional view of the button structure 500 of FIG. 10B along the direction 10C-10C'.

按鍵結構500包括鍵帽110、電路板320、升降機構130、金屬件540、至少一可撓式導電件340、控制器150、底板160及磁性件170。在本實施例中，本創作實施例按鍵結構500具有類似前述按鍵結構100的結構，不同處在於，金屬件540可不具有導電部(如第一導電部141及第二導電部142)，且可撓式導電件340配置在升降機構130(蝶式剪刀腳機構)的底部。此外，在本實施例中，可撓式導電件340配置在升降機構130的方式類似或同於前述可撓式導電件340配置在升降機構330的方式，容此不再贅述。 The button structure 500 includes a key cap 110, a circuit board 320, a lifting mechanism 130, a metal member 540, at least one flexible conductive member 340, a controller 150, a bottom plate 160, and a magnetic member 170. In this embodiment, the button structure 500 of the present embodiment has a structure similar to that of the button structure 100 described above, except that the metal member 540 may have no conductive portions (such as the first conductive portion 141 and the second conductive portion 142). The flexural conductive member 340 is disposed at the bottom of the elevating mechanism 130 (butterfly scissor mechanism). In addition, in the present embodiment, the manner in which the flexible conductive member 340 is disposed in the lifting mechanism 130 is similar or the same as the manner in which the flexible conductive member 340 is disposed in the lifting mechanism 330, and details are not described herein.

如第10A及10C圖所示，可撓式導電件340可配置在鍵帽110的底面。本創作實施例不限定可撓式導電件340的配置位置，其可配置在鍵帽110的底面邊緣及/或中間。 As shown in FIGS. 10A and 10C, the flexible conductive member 340 may be disposed on the bottom surface of the keycap 110. The present embodiment does not limit the arrangement position of the flexible conductive member 340, which may be disposed at the bottom edge and/or the middle of the keycap 110.

請參照第11圖，其繪示依照本創作另一實施例之可撓式導電件640的示意圖。類似前述可撓式導電件340的配置方式，可撓式導電件640可內埋於升降機構中。可撓式導電件640包含上段結合部641、中段連接部642及下段導電部643，其中中段連接部642連接上段結合部641與下段導電部643。上段結合部641及中段連接部642可內埋於本創作任一實施例之升降機構。由於上段結合部641的外徑大於中段連接部642的外徑，因此內埋於升降機構內的上段結合部641不容易與升降機構脫離。當上段結合部641及中段連接部642內埋於升降機構時，下段導電部643從升降機構露出，以接觸電路板的接墊。下段導電部643包含突點643A及凹槽643B，突點643A相對於周圍的環形凹槽643B係凸出，因此突點643A相對周圍係可形變，此提供可撓式導電件640一可撓性。以製程來說，可撓式導電件640為以板金工法製成的板金件，如此可更增加可撓式導電件640的可撓性。此外，在一實施例中，上段結合部641、中段連接部642與下段導電部643係一體成形結構。 Please refer to FIG. 11 , which illustrates a schematic diagram of a flexible conductive member 640 according to another embodiment of the present invention. Similar to the configuration of the flexible conductive member 340 described above, the flexible conductive member 640 can be embedded in the lifting mechanism. Flexible conductive parts 640 The upper stage connecting portion 641, the middle portion connecting portion 642 and the lower portion conductive portion 643 are included, wherein the middle portion connecting portion 642 connects the upper portion connecting portion 641 and the lower portion conductive portion 643. The upper joint portion 641 and the middle joint portion 642 may be embedded in the lift mechanism of any of the embodiments of the present invention. Since the outer diameter of the upper joint portion 641 is larger than the outer diameter of the middle joint portion 642, the upper joint portion 641 embedded in the lift mechanism is not easily separated from the lift mechanism. When the upper stage joint portion 641 and the middle portion joint portion 642 are buried in the elevating mechanism, the lower stage conductive portion 643 is exposed from the elevating mechanism to contact the pads of the circuit board. The lower conductive portion 643 includes a bump 643A and a groove 643B. The bump 643A protrudes relative to the surrounding annular groove 643B, so that the bump 643A is deformable relative to the periphery, which provides flexibility of the flexible conductive member 640. . In the process of the process, the flexible conductive member 640 is a sheet metal member made by a sheet metal working method, so that the flexibility of the flexible conductive member 640 can be further increased. Further, in an embodiment, the upper stage joint portion 641, the middle portion joint portion 642, and the lower stage conductive portion 643 are integrally formed.

綜上所述，雖然本創作已以實施例揭露如上，然其並非用以限定本新型。本新型所屬技術領域中具有通常知識者，在不脫離本創作之精神和範圍內，當可作各種之更動與潤飾。因此，本新型之保護範圍當視後附之申請專利範圍所界定者為準。 In summary, although the present invention has been disclosed above by way of example, it is not intended to limit the present invention. Those of ordinary skill in the art to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this new type is subject to the definition of the scope of the patent application.

Claims

一種按鍵結構，包括：一鍵帽；一電路板，包括一第一接墊及一第二接墊；一升降機構，配置在該電路板與該鍵帽之間，該鍵帽經由該升降機構相對該電路板上下移動；一導電架，配置在該升降機構上，以隨該升降機構上下移動，該導電架包括分別位於該第一接墊及該第二接墊上方之一第一導電部及一第二導電部，該第一導電部之運動路徑及該第二導電部之運動路徑分別到達該第一接墊及該第二接墊；其中，當該第一導電部及該第二導電部分別接觸該第一接墊及該第二接墊時，該第一接墊、該第一導電部、該第二導電部與該第二接墊形成一第一橫跨電流路徑。 A button structure, comprising: a key cap; a circuit board comprising a first pad and a second pad; a lifting mechanism disposed between the circuit board and the key cap, the key cap passing the lifting mechanism Moving on the upper and lower sides of the circuit board; a conductive frame disposed on the lifting mechanism to move up and down with the lifting mechanism, the conductive frame comprising a first conductive portion respectively located above the first pad and the second pad And a second conductive portion, the moving path of the first conductive portion and the moving path of the second conductive portion respectively reach the first pad and the second pad; wherein, the first conductive portion and the second portion When the conductive portion contacts the first pad and the second pad, the first pad, the first conductive portion, the second conductive portion and the second pad form a first traverse current path.

如申請專利範圍第1項所述之按鍵結構，更包括：一底板，配置在該電路板與該鍵帽之間；其中，該升降機構樞接於該底板且包括一第一升降件及一第二升降件，該第一升降件與該底板樞接於一第一樞接點，該第二升降件與該底板樞接於一第二樞接點；其中，該第一導電部位於該第一樞接點與該第二樞接點之間，或者該第一樞接點位於該第一導電部與該第二樞接點之間。 The button structure of claim 1, further comprising: a bottom plate disposed between the circuit board and the keycap; wherein the lifting mechanism is pivotally connected to the bottom plate and includes a first lifting member and a a second lifting member, the first lifting member is pivotally connected to the bottom plate at a first pivoting point, and the second lifting member is pivotally connected to the bottom plate at a second pivoting point; wherein the first conductive portion is located at the second pivoting point Between the first pivot point and the second pivot point, or the first pivot point is between the first conductive portion and the second pivot point.

如申請專利範圍第2項所述之按鍵結構，其中該電路板更包括一第三接墊及一第四接墊，該導電架配置在該第一升降件上，該按鍵結構更包括：一磁性件，具有導電性，該磁性件配置在該第二升降件上，以隨該第二升降件上下移動，該磁性件包括分別位於該第三接墊及該第四接墊上方之一第三導電部及一第四導電部，該第三導電部之運動路徑及該第四導電部之運動路徑分別到達該第三接墊及該第四接墊；其中，當該第三導電部及該第四導電部分別接觸該第三接墊及該第四接墊時，該第三接墊、該第四導電部、該第三導電部與該第四接墊形成一第二橫跨電流路徑。 The button structure of claim 2, wherein the circuit board further comprises a third pad and a fourth pad, the conductive frame is disposed on the first lifting member, the button structure further comprises: The magnetic member is electrically conductive, and the magnetic member is disposed on the second lifting member to move up and down with the second lifting member, and the magnetic member comprises one of the third connecting pad and the fourth connecting pad respectively a third conductive portion and a fourth conductive portion, wherein the moving path of the third conductive portion and the moving path of the fourth conductive portion respectively reach the third pad and the fourth pad; wherein, the third conductive portion and When the fourth conductive portion contacts the third pad and the fourth pad, the third pad, the fourth conductive portion, the third conductive portion and the fourth pad form a second traverse current path.

如申請專利範圍第1項所述之按鍵結構，其中該導電架更包括一橫向導電部，該橫向導電部配置在該升降機構之上方，該第一導電部及該第二導電部連接該橫向導電部且自該橫向導電部往該電路板方向延伸。 The button structure of claim 1, wherein the conductive frame further comprises a lateral conductive portion disposed above the lifting mechanism, the first conductive portion and the second conductive portion connecting the lateral direction The conductive portion extends from the lateral conductive portion toward the circuit board.

如申請專利範圍第4項所述之按鍵結構，其中該第一導電部包括相連接之一可撓部與一接觸部，該可撓部連接該橫向導電部與該接觸部，該接觸部與該可撓部之間夾一鈍角。 The button structure of claim 4, wherein the first conductive portion includes a flexible portion and a contact portion, the flexible portion connecting the lateral conductive portion and the contact portion, the contact portion An obtuse angle is formed between the flexible portions.

一種按鍵結構，包括：一鍵帽；一電路板，包括一第一接墊及一第二接墊，該第一接墊及該第二接墊間隔一預設間距；一升降機構，配置在該電路板與該鍵帽之間，該鍵帽經由該升降機構相對該電路板上下移動於一釋放位置與一按壓位置間；一導電架，配置在該升降機構上，以隨該升降機構上下移動，該導電架包括一第一導電部，一第二導電部及一橫向導電部，該第一導電部與該第二導電部分別位於該第一接墊及該第二接墊上方，該橫向導電部位於該第一導電部與該第二導電部間且該橫向導電部之延伸長度超過該預設間距；其中，當該鍵帽位於該釋放位置時，該第一導電部及該第二導電部分別遠離該第一接墊及該第二接墊，使該第一接墊及該第二接墊保持電性隔離；其中，當該鍵帽被按壓而位於該按壓位置時，該第一導電部及該第二導電部分別接觸該第一接墊及該第二接墊，該第一接墊的電能依序流經該第一導電部、該橫向導電部、該第二導電部而到達該第二接墊。 A button structure, comprising: a key cap; a circuit board comprising a first pad and a second pad, wherein the first pad and the second pad are separated by a predetermined spacing; a lifting mechanism disposed between the circuit board and the keycap, wherein the key cap is moved relative to the circuit board by a lifting mechanism between a release position and a pressing position; a conductive frame is disposed on the lifting mechanism The conductive frame includes a first conductive portion, a second conductive portion and a lateral conductive portion, wherein the first conductive portion and the second conductive portion are respectively located on the first pad and the first Above the two pads, the lateral conductive portion is located between the first conductive portion and the second conductive portion and the extended length of the lateral conductive portion exceeds the predetermined pitch; wherein when the key cap is located at the release position, the first The first conductive pad and the second bonding pad are electrically isolated from each other, and the first conductive pad and the second bonding pad are electrically separated from each other; wherein the keycap is pressed and located In the pressing position, the first conductive portion and the second conductive portion respectively contact the first pad and the second pad, and the electric energy of the first pad sequentially flows through the first conductive portion, the lateral conductive The second conductive portion reaches the second connection .

如申請專利範圍第6項所述之按鍵結構，更包括：一控制器，用以：偵測該第一橫跨電流路徑的一電壓變化；判斷該電壓變化從一高位準變化至一低位準的變換點；以及延遲該變換點後，反轉該電壓變化。 The button structure of claim 6, further comprising: a controller for: detecting a voltage change of the first traverse current path; determining that the voltage change changes from a high level to a low level The change point; and after delaying the change point, the voltage change is reversed.

如申請專利範圍第6項所述之按鍵結構，更包括一向上回復力元件，該預設間距大於該向上回復力元件，使得該向上回復力元件可設置於該第一接墊及該第二接墊間，該預設間距大於該鍵帽寬度的1/4。 The button structure of claim 6, further comprising an upward restoring force component, the preset spacing being greater than the upward restoring force component, such that the upward restoring force component can be disposed on the first pad and the second The preset spacing between the pads is greater than 1/4 of the width of the keycap.

如申請專利範圍第6項所述之按鍵結構，其中該導電架更包括複數個結合彈片，該升降機構更包括複數個結合孔洞，該些結合彈片分別嵌入該些結合孔洞內，使該導電架結合於該升降機構上。 The key structure of the sixth aspect of the invention, wherein the conductive frame further comprises a plurality of combined elastic pieces, the lifting mechanism further comprises a plurality of coupling holes, wherein the combined elastic pieces are respectively embedded in the coupling holes, so that the conductive frame is Combined with the lifting mechanism.

一種按鍵結構，包括：一鍵帽；一電路板，包括一接墊，該接墊包含相鄰之一正極與一負極；一升降機構，配置在該電路板與該鍵帽之間，該鍵帽經由該升降機構相對該電路板上下移動；一可撓式導電件，配置在該升降機構之底部或該鍵帽之底部，以隨該升降機構運動，該可撓式導電件之一底部區域的運動路徑到達該正極及該負極；其中，當該可撓式導電件之該底部區域接觸該正極及該負極時，該正極與該負極導通。 A button structure includes: a key cap; a circuit board comprising a pad, the pad includes an adjacent one of the positive pole and a negative pole; and a lifting mechanism disposed between the circuit board and the keycap, the key The cap moves up and down relative to the circuit board via the lifting mechanism; a flexible conductive member is disposed at the bottom of the lifting mechanism or the bottom of the key cap to move with the lifting mechanism, and the bottom portion of the flexible conductive member The moving path reaches the positive electrode and the negative electrode; wherein when the bottom region of the flexible conductive member contacts the positive electrode and the negative electrode, the positive electrode is electrically connected to the negative electrode.

如申請專利範圍第10項所述之按鍵結構，更包括：一導電架，配置在該升降機構上，以隨該升降機構上下移動，該導電架具有該可撓式導電件；以及一底板，配置在該電路板與該鍵帽之間；其中，該升降機構樞接於該底板且包括一第一升降件及一第二升降件，該第一升降件與該底板樞接於一第一樞接點，該第二升降件與該底板樞接於一第二樞接點，該第一樞接點位於該可撓式導電件與該第二樞接點之間。 The button structure of claim 10, further comprising: a conductive frame disposed on the lifting mechanism to move up and down with the lifting mechanism, the conductive frame having the flexible conductive member; a bottom plate disposed between the circuit board and the keycap; wherein the lifting mechanism is pivotally connected to the bottom plate and includes a first lifting member and a second lifting member, the first lifting member being pivotally connected to the bottom plate The first pivoting point is pivotally connected to the bottom plate at a second pivoting point, and the first pivoting point is located between the flexible conductive member and the second pivoting point.

如申請專利範圍第10項所述之按鍵結構，更包括：一底板，配置在該電路板與該鍵帽之間；其中，該升降機構樞接於該底板且包括一第一升降件及一第二升降件，該第一升降件包括一樞接端、一自由端及一樞接部，該第一升降件透過該樞接部與該第二升降件交叉地樞接，該第一升降件之該樞接端樞接於該底板，該可撓式導電件配置在該自由端的底部。 The button structure of claim 10, further comprising: a bottom plate disposed between the circuit board and the keycap; wherein the lifting mechanism is pivotally connected to the bottom plate and includes a first lifting member and a The second lifting member includes a pivoting end, a free end and a pivoting portion, and the first lifting member is pivotally connected to the second lifting member through the pivoting portion, the first lifting and lowering The pivoting end of the piece is pivotally connected to the bottom plate, and the flexible conductive member is disposed at the bottom of the free end.

如申請專利範圍第10項所述之按鍵結構，其中該可撓式導電件配置在該鍵帽之該底部；該按鍵結構包括：一彈性件，連接於該鍵帽之該底部，且環繞該可撓式導電件。 The button structure of claim 10, wherein the flexible conductive member is disposed at the bottom of the keycap; the button structure comprises: an elastic member coupled to the bottom of the keycap, and surrounding the Flexible conductive parts.

一種按鍵結構，包括：一鍵帽；一電路板，包括一第一接墊及一第二接墊，該第一接墊及該第二接墊間隔一間隔區；一升降機構，配置在該電路板與該鍵帽之間，該鍵帽經由該升降機構相對該電路板上下移動於一釋放位置與一按壓位置間；一可撓式導電件，包括一上段結合部、一中段彈性部與一下段導電部，藉由該上段結合部，該可撓式導電件結合在該升降機構之底部或該鍵帽之底面，以隨該升降機構運動，該下段導電部尺寸大於該間隔區；其中，當該鍵帽位於該釋放位置時，該下段導電部遠離該第一接墊及該第二接墊，使該第一接墊及該第二接墊保持電性隔離；其中，當該鍵帽被按壓而位於該按壓位置時，該中段彈性部配合該鍵帽上下移動而變形，使該下段導電部保持面接觸而同時覆蓋在該間隔區，部分該第一接墊及部分該第二接墊上，使該第一接墊的電能流經該下段導電部而到達該第二接墊。 A button structure, comprising: a key cap; a circuit board comprising a first pad and a second pad, the first pad and the second pad are separated by a spacer; a lifting mechanism is disposed in the Between the circuit board and the keycap, the key cap is moved relative to the circuit board by a lifting mechanism between a release position and a pressing position; a flexible conductive member includes an upper joint portion, a middle elastic portion and a lower portion conductive portion. The flexible conductive member is coupled to the bottom of the lifting mechanism or the bottom surface of the key cap by the upper joint portion. The first conductive portion is larger than the spacer, and the lower conductive portion is away from the first pad and the second pad, so that the first portion is located in the release position. The pad and the second pad are electrically isolated; wherein when the key cap is pressed and located in the pressing position, the middle elastic portion is deformed by the up and down movement of the key cap, so that the lower conductive portion is kept in surface contact At the same time, the first pad and a portion of the second pad are covered in the spacer, so that the electric energy of the first pad flows through the lower conductive portion to reach the second pad.