TWM580798U - LED carrier board having preset conductive bump - Google Patents
LED carrier board having preset conductive bump Download PDFInfo
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- TWM580798U TWM580798U TW107217200U TW107217200U TWM580798U TW M580798 U TWM580798 U TW M580798U TW 107217200 U TW107217200 U TW 107217200U TW 107217200 U TW107217200 U TW 107217200U TW M580798 U TWM580798 U TW M580798U
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Abstract
Description
本新型是關於一種發光二極體載板,特別是關於一種表面黏著型發光二極體(SMD LED)載板。The present invention relates to a light emitting diode carrier, and more particularly to a surface mount type light emitting diode (SMD LED) carrier.
發光二極體(以下簡稱LED)的製程可分為上游磊晶製造、中游晶片製造及下游封裝測試及系統組裝,其中,當LED晶粒製造完成後,會將LED晶粒黏著於發光二極體載板(以下簡稱LED載板)上,經過固晶、固化、打線、封膠、切割等一系列製作流程後,製成發光二極體元件(以下簡稱LED元件)。The process of LED (hereinafter referred to as LED) can be divided into upstream epitaxial fabrication, midstream wafer fabrication and downstream packaging testing and system assembly. When the LED die is completed, the LED die will be adhered to the LED. On the body carrier board (hereinafter referred to as the LED carrier board), after a series of production processes such as solid crystal, curing, wire bonding, sealing, and cutting, a light-emitting diode component (hereinafter referred to as an LED component) is fabricated.
現有的封裝技術是藉由焊料使LED晶粒的凸塊與基板的電接點形成電性連接,但由於目前LED晶粒的體積越來越小,使得在LED晶粒上形成凸塊的製程難度顯著升高,良率難以提昇。The existing packaging technology is to electrically connect the bumps of the LED die with the electrical contacts of the substrate by solder, but due to the smaller and smaller size of the LED die, the process of forming bumps on the LED die is performed. The difficulty is significantly increased and the yield is difficult to increase.
有鑑於此,本新型之主要目的在於提供一種有助於提升LED晶粒封裝良率的發光二極體載板。In view of this, the main purpose of the present invention is to provide a light-emitting diode carrier that contributes to the improvement of the LED die package yield.
為了達成上述的目的,本新型提供一種預設有導電凸塊的發光二極體載板,其包括一基板、一電路層及多個導電凸塊,基板具有一發光二極體承載面(以下簡稱LED承載面),電路層形成於該LED承載面,且電路層具有多個電接點,該些導電凸塊分別形成於該些電接點頂面,且該些導電凸塊是分別供多個LED晶粒電性連接。In order to achieve the above object, the present invention provides a light-emitting diode carrier plate pre-equipped with conductive bumps, comprising a substrate, a circuit layer and a plurality of conductive bumps, the substrate having a light-emitting diode bearing surface (below Referring to the LED bearing surface, the circuit layer is formed on the LED bearing surface, and the circuit layer has a plurality of electrical contacts, the conductive bumps are respectively formed on the top surfaces of the electrical contacts, and the conductive bumps are respectively provided A plurality of LED dies are electrically connected.
藉由在發光二極體載板預設導電凸塊,LED晶粒上即無須額外形成凸塊,而由於在載板上形成凸塊的製程難度遠低於在LED晶粒上形成凸塊,因此本新型可以解決以往LED封裝製程中,LED晶粒凸塊製程良率較差的問題,進而提升整體製程的良率。By presetting the conductive bumps on the LED carrier, there is no need to form additional bumps on the LED die, and the process of forming bumps on the carrier is much less difficult than forming bumps on the LED die. Therefore, the novel can solve the problem that the LED die bump process yield is poor in the previous LED packaging process, thereby improving the overall process yield.
請參考第1圖,在本新型的其中一實施例中,LED載板包括一基板10、一電路層20、多個導電凸塊30及防焊層40。該LED載板例如可應用於SMD LED元件的封裝製程。Referring to FIG. 1 , in one embodiment of the present invention, the LED carrier board includes a substrate 10 , a circuit layer 20 , a plurality of conductive bumps 30 , and a solder resist layer 40 . The LED carrier can be applied, for example, to a packaging process of an SMD LED component.
基板10本身具有一或多層絕緣層,這些絕緣層例如是環氧樹脂、玻璃布(woven glass)、聚酯或其他常用於製作電路板基材的材質。此外,基板10具有一LED承載面11,LED承載面11上可能具有一或多個分別供多個LED晶粒貼裝的LED承載區(未繪示)。The substrate 10 itself has one or more insulating layers, such as epoxy, woven glass, polyester, or other materials commonly used in the fabrication of circuit board substrates. In addition, the substrate 10 has an LED carrying surface 11 on the LED carrying surface 11 which may have one or more LED carrying regions (not shown) for mounting a plurality of LED dies.
電路層20形成於LED承載面11,且電路層20具有多個電接點21,電接點21的數量視LED承載面11所需承載的LED晶粒數量而定,其中一部份的電接點21是與LED晶粒的p極通過導電凸塊30電性連接,另一部份的電接點21是與LED晶粒的n極通過導電凸塊30電性連接。電路層20由導電材料製成,例如銅。為了提供足夠的電流傳輸能力,電接點21還可具有一表面鍍層211,表面鍍層211的材質例如可為鎳、金、銀、鈀或其合金。The circuit layer 20 is formed on the LED carrying surface 11 , and the circuit layer 20 has a plurality of electrical contacts 21 . The number of electrical contacts 21 depends on the number of LED dies that the LED carrying surface 11 needs to carry, and a part of the electrical The contact 21 is electrically connected to the p-pole of the LED die through the conductive bump 30, and the other electrical contact 21 is electrically connected to the n-pole of the LED die through the conductive bump 30. The circuit layer 20 is made of a conductive material such as copper. In order to provide sufficient current transmission capability, the electrical contact 21 may further have a surface plating layer 211, and the surface plating layer 211 may be made of, for example, nickel, gold, silver, palladium or an alloy thereof.
導電凸塊30分別形成於該些電接點21頂面,由於本實施例中,電接點21具有表面鍍層211,在此情況下,導電凸塊30是形成於表面鍍層211的頂面,這些導電凸塊30是分別供多個LED晶粒電性連接。導電凸塊30的材質例如為錫。The conductive bumps 30 are respectively formed on the top surfaces of the electrical contacts 21. Since the electrical contacts 21 have a surface plating layer 211 in this embodiment, the conductive bumps 30 are formed on the top surface of the surface plating layer 211. The conductive bumps 30 are electrically connected to the plurality of LED dies, respectively. The material of the conductive bumps 30 is, for example, tin.
防焊層40形成於LED承載面11,防焊層40局部覆蓋電路層20,但電接點21及導電凸塊30未被防焊層40覆蓋,其中導電凸塊30的頂部高於防焊層40頂面,以便與LED晶粒電性連接。所述防焊層40為一絕緣層,其材料可為環氧樹脂、矽樹脂、聚醯亞胺樹脂、酚類樹脂、氟樹脂、二氧化矽或氧化鋁。在第1圖所示的實施例中,防焊層40具有實質上齊平的頂面。在其他可能的實施方式中,位於如第1圖所示兩電接點21之間防焊層的高度等高或略低於電接點的頂面。The solder resist layer 40 is formed on the LED bearing surface 11 , and the solder resist layer 40 partially covers the circuit layer 20 , but the electrical contact 21 and the conductive bump 30 are not covered by the solder resist layer 40 , wherein the top of the conductive bump 30 is higher than the solder resist The top surface of layer 40 is electrically connected to the LED die. The solder resist layer 40 is an insulating layer, and the material thereof may be epoxy resin, enamel resin, polyimide resin, phenol resin, fluororesin, cerium oxide or aluminum oxide. In the embodiment illustrated in Figure 1, the solder mask 40 has a substantially flush top surface. In other possible embodiments, the height of the solder resist layer between the two electrical contacts 21 as shown in FIG. 1 is equal or slightly lower than the top surface of the electrical contact.
第2至4圖繪示前揭LED載板的製備過程的其中一實施方式。首先,如第2圖所示,在基板10的LED承載面11形成一至數層銅層,接著對銅層進行圖形化處理而形成所述電路層20;接著,如第3圖所示,在LED承載面11形成防焊層40,並在對應電接點21處形成開窗41,使電接點21得以裸露;而後,如第4圖所示,在電接點21頂面進行表面處理,使其具有表面鍍層211,再於表面鍍層211頂面形成導電凸塊30,即成為如第1圖所示的LED載板。Figures 2 through 4 illustrate one embodiment of a process for preparing a front LED strip. First, as shown in FIG. 2, one to several copper layers are formed on the LED carrying surface 11 of the substrate 10, and then the copper layer is patterned to form the circuit layer 20; then, as shown in FIG. 3, The LED bearing surface 11 forms a solder resist layer 40, and a window 41 is formed at the corresponding electrical contact 21 to expose the electrical contact 21; and then, as shown in FIG. 4, the surface of the electrical contact 21 is surface-treated. The surface plating layer 211 is provided, and the conductive bump 30 is formed on the top surface of the surface plating layer 211, that is, the LED carrier board as shown in FIG.
第5、6圖繪示前揭LED載板貼裝LED晶粒的製程示意圖,亦即,令LED晶粒1的電極2分別對準導電凸塊30,再通過回流焊接使LED晶粒1與導電凸塊30形成電性連接,以利後續進行其他LED封裝製程。5 and 6 are schematic diagrams showing the process of mounting the LED die on the LED carrier board, that is, the electrodes 2 of the LED die 1 are respectively aligned with the conductive bumps 30, and then the LED die 1 is reflowed by reflow soldering. The conductive bumps 30 are electrically connected to facilitate subsequent LED packaging processes.
綜合上述,由於在載板上形成凸塊的製程難度遠低於在LED晶粒上形成凸塊的難度,因此本新型可以解決以往LED封裝製程中,LED晶粒凸塊製程良率較差的問題,進而提升整體製程的良率。In summary, since the process of forming bumps on the carrier is much less difficult than forming bumps on the LED die, the present invention can solve the problem of poor LED chip bump process yield in the prior LED packaging process. To improve the overall process yield.
1‧‧‧LED晶粒1‧‧‧LED dies
2‧‧‧電極 2‧‧‧electrode
10‧‧‧基板 10‧‧‧Substrate
11‧‧‧LED承載面 11‧‧‧LED bearing surface
20‧‧‧電路層 20‧‧‧ circuit layer
21‧‧‧電接點 21‧‧‧Electrical contacts
211‧‧‧表面鍍層 211‧‧‧ surface coating
30‧‧‧導電凸塊 30‧‧‧Electrical bumps
40‧‧‧防焊層 40‧‧‧ solder mask
41‧‧‧開窗 41‧‧‧Opening the window
第1圖為本新型其中一實施例的剖面示意圖。Figure 1 is a schematic cross-sectional view showing one embodiment of the present invention.
第2至4圖為本新型其中一實施例的製程示意圖。2 to 4 are schematic views showing a process of one embodiment of the present invention.
第5、6圖為本新型其中一實施例貼裝LED晶粒的製程示意圖。5 and 6 are schematic views showing a process of mounting an LED die in one embodiment of the present invention.
Claims (4)
Priority Applications (1)
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TW107217200U TWM580798U (en) | 2018-12-18 | 2018-12-18 | LED carrier board having preset conductive bump |
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TW107217200U TWM580798U (en) | 2018-12-18 | 2018-12-18 | LED carrier board having preset conductive bump |
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TWM580798U true TWM580798U (en) | 2019-07-11 |
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2018
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