TWM576228U - Dual beam module and headlight assembly - Google Patents
Dual beam module and headlight assembly Download PDFInfo
- Publication number
- TWM576228U TWM576228U TW107213911U TW107213911U TWM576228U TW M576228 U TWM576228 U TW M576228U TW 107213911 U TW107213911 U TW 107213911U TW 107213911 U TW107213911 U TW 107213911U TW M576228 U TWM576228 U TW M576228U
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- emitting elements
- group
- light emitting
- dual
- Prior art date
Links
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
本案是有關於一種雙光模組及一種具有此雙光模組的頭燈組件。 The present invention relates to a dual light module and a headlight assembly having the same.
一般而言，車輛在設計上會裝設不同功能的車燈，例如頭燈、霧燈與方向燈。其中，頭燈組件具有切換遠光與近光的功能。 In general, vehicles are designed with different functions of headlights, such as headlights, fog lights and directional lights. Among them, the headlight assembly has the function of switching between high beam and low beam.
頭燈組件可包含光源、散熱器、導熱材、反射杯、遮光片與透鏡。當頭燈組件透過升起遮光片切換為近光時，遮光片可阻擋部分光線而使投射出的光線具有明暗截止線的光型，避免對前方與對向車輛的駕駛人造成不適。當頭燈組件透過降下遮光片切換為遠光時，遮光片收起讓光線投射至遠方，使光線具有如橢圓形般的光型。近年來，頭燈已廣泛採用發光二極體(LED)作為光源，特別是以白光LED作為頭燈使用。發出雖然使用白光具有科技感及亮度效果，但白光並不利於在雨霧中穿透使用，原因是白光在雨霧中的穿透能力不佳。 The headlight assembly can include a light source, a heat sink, a heat conductive material, a reflective cup, a light shield, and a lens. When the headlight assembly is switched to the low beam by raising the light shielding sheet, the light shielding sheet can block part of the light so that the projected light has a light cut-off line shape, thereby avoiding discomfort to the driver of the front and the opposite vehicle. When the headlight assembly is switched to the high beam by lowering the light shielding sheet, the light shielding sheet is stowed to project the light to a distant place, so that the light has an elliptical light type. In recent years, headlamps have widely used light-emitting diodes (LEDs) as light sources, particularly white light LEDs as headlights. Although the use of white light has the effect of technology and brightness, white light is not conducive to penetration in rain and fog, because white light penetration ability in rain and fog is not good.
本新型之一技術態樣為一種雙光模組。 One of the technical aspects of the present invention is a dual light module.
根據本新型一實施方式，一種雙光模組包含基板、第一組發光元件、第二組發光元件，其中第一組發光元件產生第一色溫的光線，第二組發光元件產生第二色溫的光線。第一組發光元件可例如是多個發光二極體封裝所編織而成，第一組發光元件的每一，可例如是發光二極體封裝，其包括有第一晶片以及第一波長轉換層，第一晶片所發出的光經由第一波長轉換層後，產生具有第一色溫的光線。第二組發光元件亦是，可例如是多個發光二極體封裝所編織而成，第二組發光元件的每一，可例如是發光二極體封裝，其包括有第二晶片以及第二波長轉換層，第二晶片所發出的光經由第二波長轉換層後，產生具有第二色溫的光線，其中，第二色溫小於第一色溫。 According to an embodiment of the present invention, a dual light module includes a substrate, a first group of light emitting elements, and a second group of light emitting elements, wherein the first group of light emitting elements generate light of a first color temperature, and the second group of light emitting elements produce a second color temperature. Light. The first group of light-emitting elements can be woven, for example, by a plurality of light-emitting diode packages, each of the first group of light-emitting elements, for example, a light-emitting diode package including a first wafer and a first wavelength conversion layer After the light emitted by the first wafer passes through the first wavelength conversion layer, light having a first color temperature is generated. The second group of light-emitting elements can also be woven, for example, by a plurality of light-emitting diode packages. Each of the second group of light-emitting elements can be, for example, a light-emitting diode package including a second wafer and a second The wavelength conversion layer, after the light emitted by the second wafer passes through the second wavelength conversion layer, generates light having a second color temperature, wherein the second color temperature is less than the first color temperature.
在本新型一實施方式中，第二組發光元件包圍在第一組發光元件前方。 In an embodiment of the invention, the second set of illuminating elements are enclosed in front of the first set of illuminating elements.
在本新型一實施方式中，第一組發光元件與第二組發光元件均以長條型方式排列，第二組發光元件為設置在第一組發光元件上前作為包圍。 In an embodiment of the present invention, the first group of light-emitting elements and the second group of light-emitting elements are arranged in a strip shape, and the second group of light-emitting elements are surrounded by the first group of light-emitting elements.
在本新型一實施方式中，第一組發光元件以長條型方式排列，第二組發光元件以凸字型方式排列，第二組發光元件為設置在第一組發光元件前方作為包圍。 In an embodiment of the present invention, the first group of light-emitting elements are arranged in a strip shape, the second group of light-emitting elements are arranged in a convex shape, and the second group of light-emitting elements are disposed in front of the first group of light-emitting elements as a surround.
在本新型一實施方式中，第一組發光元件以凸字型方式排列，第二組發光元件佈局在第一組發光元件凸字型前方周圍作為包圍。 In an embodiment of the present invention, the first group of light-emitting elements are arranged in a convex shape, and the second group of light-emitting elements are arranged around the front of the first group of light-emitting elements.
在本新型一實施方式中，上述第一組發光元件彼 此電性連接，第二組發光元件彼此電性連接。 In an embodiment of the present invention, the first group of light-emitting elements In this electrical connection, the second group of light-emitting elements are electrically connected to each other.
在本新型一實施方式中，上述第一組發光元件與第二組發光元件彼此電性連接。 In an embodiment of the present invention, the first group of light emitting elements and the second group of light emitting elements are electrically connected to each other.
在本新型一實施方式中，上述第一組發光元件為複數個發光二極體封裝。 In an embodiment of the present invention, the first group of light emitting elements is a plurality of light emitting diode packages.
在本新型一實施方式中，上述第二組發光元件為複數個發光二極體封裝。 In an embodiment of the present invention, the second group of light emitting elements is a plurality of light emitting diode packages.
根據本新型一實施方式，一種頭燈組件包含上述雙光模組、反射杯、透鏡與遮光片。雙光模組位於反射杯中。遮光片位於透鏡與反射杯之間。 According to an embodiment of the present invention, a headlight assembly includes the above dual light module, a reflective cup, a lens, and a light shielding sheet. The dual light module is located in the reflector cup. The light shield is located between the lens and the reflective cup.
在本新型上述實施方式中，在頭燈組件使用時，可僅點亮第一組發光元件，產生較高色溫的光線，例如正白光，作為近光使用。或者，可同時點亮在第一組發光元件以及第二組發光元件，混光後產生較低色溫的光線，例如中性白光或金黃光，作為遠光使用。 In the above-described embodiment of the present invention, when the headlight assembly is used, only the first group of light-emitting elements can be illuminated to generate light of a higher color temperature, such as positive white light, for use as a low beam. Alternatively, the first group of light-emitting elements and the second group of light-emitting elements may be illuminated at the same time, and light mixed at a lower color temperature, such as neutral white light or golden light, may be used as a high beam.
100、100a、100b、100c、100d‧‧‧雙光模組 100, 100a, 100b, 100c, 100d‧‧‧ dual optical modules
102‧‧‧電極 102‧‧‧Electrode
104‧‧‧電極 104‧‧‧electrode
106‧‧‧導熱材 106‧‧‧heat-conducting materials
110‧‧‧散熱器 110‧‧‧ radiator
120‧‧‧基板 120‧‧‧Substrate
130‧‧‧第一組發光元件 130‧‧‧The first group of light-emitting elements
132‧‧‧第一晶片 132‧‧‧First chip
134‧‧‧第一波長轉換層 134‧‧‧First wavelength conversion layer
140‧‧‧第二組發光元件 140‧‧‧Second group of light-emitting elements
142‧‧‧第二晶片 142‧‧‧second chip
144‧‧‧第二波長轉換層 144‧‧‧second wavelength conversion layer
152‧‧‧上方區域 152‧‧‧ upper area
154‧‧‧下方區域 154‧‧‧Under the area
200‧‧‧頭燈組件 200‧‧‧ headlight assembly
210‧‧‧反射杯 210‧‧‧Reflection Cup
220‧‧‧透鏡 220‧‧‧ lens
230‧‧‧遮光片 230‧‧ ‧ shading film
A1~A8‧‧‧區域 A1~A8‧‧‧Area
D1、D2‧‧‧方向 D1, D2‧‧‧ direction
L‧‧‧明暗截止線 L‧‧‧Dark cutoff
第1圖繪示根據本新型一實施方式之頭燈組件的側視圖。 1 is a side view of a headlamp assembly in accordance with an embodiment of the present invention.
第2圖繪示第1圖之雙光模組的俯視圖。 Figure 2 is a plan view of the dual light module of Figure 1.
第3圖繪示第1圖之頭燈組件點亮第2圖之雙光模組時的遠光光型圖。 FIG. 3 is a high-beam light pattern diagram of the headlight assembly of FIG. 1 when the dual light module of FIG. 2 is illuminated.
第4圖繪示第3圖之頭燈組件的近光光型圖。 Figure 4 is a close-up view of the headlight assembly of Figure 3.
第5圖繪示根據本新型一實施方式之雙光模組的俯視圖。 FIG. 5 is a top view of a dual light module according to an embodiment of the present invention.
第6圖繪示根據本新型一實施方式之雙光模組的俯視圖。 FIG. 6 is a top view of a dual light module according to an embodiment of the present invention.
第7圖繪示根據本新型一實施方式之雙光模組的俯視圖。 FIG. 7 is a top view of a dual light module according to an embodiment of the present invention.
第8圖繪示根據本新型一實施方式之雙光模組的俯視圖。 FIG. 8 is a top plan view of a dual light module according to an embodiment of the present invention.
以下將以圖式揭露本新型之複數個實施方式，為明確說明起見，許多實務上的細節將在以下敘述中一併說明。然而，應瞭解到，這些實務上的細節不應用以限制本新型。也就是說，在本新型部分實施方式中，這些實務上的細節是非必要的。此外，為簡化圖式起見，一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。 The embodiments of the present invention are disclosed in the following drawings, and for the sake of clarity, the details of the invention are described in the following description. However, it should be understood that these practical details are not intended to limit the novel. That is to say, in some embodiments of the present invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.
第1圖繪示根據本新型一實施方式之頭燈組件200的側視圖。第2圖繪示第1圖之雙光模組100的俯視圖。同時參閱第1圖與第2圖，頭燈組件200包含雙光模組100、散熱器110、導熱材106、反射杯210、透鏡220與遮光片230。雙光模組100位於反射杯210中。遮光片230位於透鏡220與反射杯210之間。當雙光模組100發光時，反射杯210可將雙光模組100的光線反射至透鏡220。此外，雙光模組100可切換為遠光模式或近光模式。當雙光模組100為近光模式時，遮光片230可往方向D1升起，使頭燈組件200投射出具有明暗截止線的光型，避免對前方與對向車輛的駕駛人造成不適。當雙光模組100為遠光模式時，遮光片230可往方向D2下降，以利頭燈組件200向遠方投射。 1 is a side view of a headlamp assembly 200 in accordance with an embodiment of the present invention. FIG. 2 is a plan view of the dual light module 100 of FIG. 1 . Referring to FIGS. 1 and 2 , the headlight assembly 200 includes a dual light module 100 , a heat sink 110 , a heat conductive material 106 , a reflective cup 210 , a lens 220 , and a light shielding sheet 230 . The dual light module 100 is located in the reflective cup 210. The light shielding sheet 230 is located between the lens 220 and the reflective cup 210. When the dual light module 100 emits light, the reflective cup 210 can reflect the light of the dual light module 100 to the lens 220. In addition, the dual light module 100 can be switched to a high beam mode or a low beam mode. When the dual light module 100 is in the low beam mode, the light shielding sheet 230 can be raised in the direction D1 to cause the headlight assembly 200 to project a light pattern having a cut-off line to avoid discomfort to the driver of the front and the opposite vehicle. When the dual light module 100 is in the high beam mode, the light shielding sheet 230 can be lowered in the direction D2 to facilitate the projection of the headlight assembly 200 to a distant position.
如第2圖所示，雙光模組100包含基板120、第一 組發光元件130與第二組發光元件140。第一組發光元件130與第二組發光元件140位於基板120上，且第二組發光元件140位於第一組發光元件130的至少一側。在本實施方式中，第二組發光元件140位於第一組發光元件130的前側，較靠近透鏡220，但並不用以限制本新型。 As shown in FIG. 2, the dual optical module 100 includes a substrate 120 and a first The group of light emitting elements 130 and the second group of light emitting elements 140. The first set of light emitting elements 130 and the second set of light emitting elements 140 are located on the substrate 120, and the second set of light emitting elements 140 are located on at least one side of the first set of light emitting elements 130. In the present embodiment, the second group of light-emitting elements 140 are located on the front side of the first group of light-emitting elements 130, closer to the lens 220, but are not intended to limit the present invention.
第一組發光元件130可產生第一色溫的光線，第二組發光元件140可產生第二色溫的光線。第一組發光元件130可例如是多個發光二極體封裝所編織而成。第一組發光元件130的每一發光元件130可例如是發光二極體封裝，其包括有第一晶片132以及第一波長轉換層134。第一波長轉換層134位於第一晶片132上方，也就是覆蓋第一晶片132。當第一晶片132所發出的光經由第一波長轉換層134後，可產生具有第一色溫的光線。第二組發光元件140亦是，可例如是多個發光二極體封裝所編織而成。第二組發光元件140的每一發光元件140可例如是發光二極體封裝，其包括有第二晶片142以及第二波長轉換層144。第二波長轉換層144位於第二晶片142上方，也就是覆蓋第二晶片142。當第二晶片142所發出的光經由第二波長轉換層144後，可產生具有第二色溫的光線。其中，第二色溫小於第一色溫。 The first set of light-emitting elements 130 can produce light of a first color temperature, and the second set of light-emitting elements 140 can produce light of a second color temperature. The first set of light emitting elements 130 can be woven, for example, from a plurality of light emitting diode packages. Each of the first set of light emitting elements 130 can be, for example, a light emitting diode package including a first wafer 132 and a first wavelength conversion layer 134. The first wavelength conversion layer 134 is located above the first wafer 132, that is, over the first wafer 132. When the light emitted by the first wafer 132 passes through the first wavelength conversion layer 134, light having a first color temperature can be generated. The second group of light-emitting elements 140 can also be woven, for example, by a plurality of light-emitting diode packages. Each of the light emitting elements 140 of the second set of light emitting elements 140 can be, for example, a light emitting diode package including a second wafer 142 and a second wavelength conversion layer 144. The second wavelength conversion layer 144 is located above the second wafer 142, that is, over the second wafer 142. When the light emitted by the second wafer 142 passes through the second wavelength conversion layer 144, light having a second color temperature can be generated. Wherein, the second color temperature is less than the first color temperature.
舉例來說，經第一波長轉換層134的光線可以為正白光(例如5500K至6500K)，可作為頭燈組件200的近光使用。經第二波長轉換層144的光線可以為中性白光(例如4000K至5000K)或金黃光(例如2500K至3500K)，其與經第一波長轉換層134的光線混光後，可作為頭燈組件200的遠光使用。 For example, the light passing through the first wavelength conversion layer 134 may be positive white light (eg, 5500K to 6500K), which may be used as the low beam of the headlight assembly 200. The light passing through the second wavelength conversion layer 144 may be neutral white light (for example, 4000K to 5000K) or golden light (for example, 2500K to 3500K), which can be used as a headlight assembly after being mixed with light passing through the first wavelength conversion layer 134. 200 high beam use.
在本實施方式中，第一組發光元件130彼此電性連接，且電性連接電極102。第二組發光元件140彼此電性連接，且電性連接電極104。在本文中，電性連接可以是串聯也可以是並聯，並不用以限制本新型。這樣的設計，可藉由電性連接電極102、104的驅動器(未繪示)來同時點亮或熄滅第一組發光元件130的第一晶片132，且可同時點亮或熄滅第二組發光元件140的第二晶片142。也就是說，第一組發光元件130的第一晶片132的亮滅與第二組發光元件140的第二晶片142的亮滅可獨立控制。在使用時，可僅點亮第一組發光元件130的第一晶片132，產生較高色溫的光線，例如具有科技感與亮度效果的正白光，作為頭燈組件200的近光使用。或者，可同時點亮第一組發光元件130的第一晶片132與第二組發光元件140的第二晶片142，混光後產生較低色溫的光線，例如具有較高穿透度的中性白光或金黃光，作為頭燈組件200的遠光使用。 In the embodiment, the first group of light-emitting elements 130 are electrically connected to each other and electrically connected to the electrode 102. The second group of light emitting elements 140 are electrically connected to each other and electrically connected to the electrodes 104. In this context, the electrical connections may be in series or in parallel and are not intended to limit the present invention. Such a design can simultaneously illuminate or extinguish the first wafer 132 of the first group of light-emitting elements 130 by electrically connecting the electrodes (not shown) of the electrodes 102, 104, and can simultaneously illuminate or extinguish the second group of illuminations. A second wafer 142 of element 140. That is to say, the light-off of the first wafer 132 of the first group of light-emitting elements 130 and the light-off of the second wafer 142 of the second group of light-emitting elements 140 can be independently controlled. In use, only the first wafer 132 of the first group of light-emitting elements 130 can be illuminated to produce light of a higher color temperature, such as positive white light with a scientific and luminous effect, for use as a low beam of the headlamp assembly 200. Alternatively, the first wafer 132 of the first group of light-emitting elements 130 and the second wafer 142 of the second group of light-emitting elements 140 can be simultaneously illuminated, and light mixed to produce light of a lower color temperature, such as a neutral having a higher transmittance. White light or golden light is used as the high beam of the headlight assembly 200.
在本實施方式中，第一晶片132與第二晶片142可以為相同的，例如藍色發光二極體，第一波長轉換層134與第二波長轉換層144可以為黃色螢光粉。在其他實施方式中，第一晶片132與第二晶片142也可以是不同的，並不用以限制本新型。在本實施方式中，為了讓第一晶片132的光線經第一波長轉換層134後的第一色溫大於第二晶片142經第二波長轉換層144後的第二色溫，第一波長轉換層134的濃度可小於第二波長轉換層144的濃度。此外，在其他實施方式中，亦可經由電極102提供較大的電流予第一波長轉換層134中之第一晶 片132，並經由電極104提供較小的電流予第二波長轉換層144中之第二晶片142，以讓第一色溫大於第二色溫，並不用以限制本新型。 In this embodiment, the first wafer 132 and the second wafer 142 may be the same, for example, a blue light emitting diode, and the first wavelength conversion layer 134 and the second wavelength conversion layer 144 may be yellow phosphor powder. In other embodiments, the first wafer 132 and the second wafer 142 may also be different and are not intended to limit the present invention. In this embodiment, in order to make the first color temperature of the first wafer 132 after passing through the first wavelength conversion layer 134 is greater than the second color temperature of the second wafer 142 after passing through the second wavelength conversion layer 144, the first wavelength conversion layer 134 The concentration may be less than the concentration of the second wavelength conversion layer 144. In addition, in other embodiments, a larger current may be supplied to the first crystal in the first wavelength conversion layer 134 via the electrode 102. The chip 132, and providing a smaller current to the second wafer 142 of the second wavelength conversion layer 144 via the electrode 104, so that the first color temperature is greater than the second color temperature, is not intended to limit the present invention.
在本實施方式中，第一組發光元件130以長條型方式排列(如區域A1)，第二組發光元件140以凸字型方式排列(如區域A2)。第二組發光元件140為設置在第一組發光元件130前方作為包圍，且往透鏡220的方向凸出。 In the present embodiment, the first group of light-emitting elements 130 are arranged in a strip shape (such as the area A1), and the second group of light-emitting elements 140 are arranged in a convex type (such as the area A2). The second group of light-emitting elements 140 are disposed in front of the first group of light-emitting elements 130 to be surrounded and protrude in the direction of the lens 220.
第3圖繪示第1圖之頭燈組件200點亮第2圖之雙光模組100時的遠光光型圖。同時參閱第2圖與第3圖，在本實施方式中，第一組發光元件130的第一晶片132與第二組發光元件140的第二晶片142同時被點亮，且第1圖的遮光片230往方向D2下降，無明暗截止線。如此一來，混光後上方區域152為較低色溫的光線(例如具有較高穿透度的中性白光或金黃光)，下方區域154則為較高色溫的光線(例如具有科技感與較佳照射路面亮度效果的正白光)。第3圖的光型有利於頭燈組件200的遠光使用，例如照射遠方的穿透度佳且能清楚照亮路面。 FIG. 3 is a high-beam light pattern diagram when the headlight module 200 of FIG. 1 lights the dual light module 100 of FIG. Referring to FIG. 2 and FIG. 3 simultaneously, in the present embodiment, the first wafer 132 of the first group of light-emitting elements 130 and the second wafer 142 of the second group of light-emitting elements 140 are simultaneously illuminated, and the shading of FIG. The sheet 230 descends in the direction D2 without a cut-off line. In this way, the upper region 152 after light mixing is a light of a lower color temperature (for example, a neutral white light or a golden light having a higher transmittance), and the lower region 154 is a light of a higher color temperature (for example, having a sense of technology and comparison) The white light of the brightness effect of the road surface is good. The light pattern of Fig. 3 facilitates the high beam use of the headlamp assembly 200, such as good penetration of the illumination and clear illumination of the road surface.
第4圖繪示第3圖之頭燈組件200的近光光型圖。同時參閱第2圖與第4圖，在本實施方式中，第一組發光元件130的第一晶片132與第二組發光元件140的第二晶片142同時被點亮，且第1圖的遮光片230往方向D1升起，形成明暗截止線L。明暗截止線L上方為暗部，下方為亮部。如此一來，混光後大部分上方區域152的光線(即較低色溫的光線)及少部分下方區域154的光線(即較高色溫的光線)由第1圖的遮光片 230阻擋，在明暗截止線L上方形成暗部。混光後小部分上方區域152的光線(即較低色溫的光線)及大部分下方區域154的光線(即較高色溫的光線)不會被第1圖的遮光片230阻擋，在明暗截止線L下方形成亮部。第4圖的光型有利於頭燈組件200的近光使用，例如能清楚照射路面且能避免對前方與對向車輛的駕駛人不適。 FIG. 4 is a close-up view of the headlight assembly 200 of FIG. Referring to FIG. 2 and FIG. 4 simultaneously, in the present embodiment, the first wafer 132 of the first group of light-emitting elements 130 and the second wafer 142 of the second group of light-emitting elements 140 are simultaneously illuminated, and the shading of FIG. The sheet 230 is raised in the direction D1 to form a cut-off line L. The top of the cut-off line L is a dark part, and the lower part is a bright part. In this way, the light of most of the upper region 152 after mixing (ie, the light of a lower color temperature) and the light of a small portion of the lower region 154 (ie, the light of a higher color temperature) are formed by the light shielding sheet of FIG. 230 blocks, forming a dark portion above the cut-off line L. The light in the upper portion 152 (i.e., the light of the lower color temperature) and the light in the lower portion 154 (i.e., the light of the higher color temperature) after the light mixing are not blocked by the light blocking sheet 230 of Fig. 1, in the cut-off line of the light and dark A bright portion is formed below L. The light pattern of Fig. 4 facilitates the use of the low beam of the headlight assembly 200, for example, to clearly illuminate the road surface and to avoid discomfort to the driver of the front and opposite vehicles.
應瞭解到，已敘述過的元件連接關係與功效將不再重複贅述，合先敘明。在以下敘述中，將說明其他形式的雙光模組。 It should be understood that the relationship and function of the components that have been described will not be repeated, and will be described first. In the following description, other forms of dual light modules will be described.
第5圖繪示根據本新型一實施方式之雙光模組100a的俯視圖。雙光模組100a包含基板120、第一組發光元件130與第二組發光元件140。。第一組發光元件130彼此電性連接，第二組發光元件140彼此電性連接。與第2圖實施方式不同的地方在於：雙光模組100a的第一組發光元件130以凸字型方式排列(如區域A3)，雙光模組100a的第二組發光元件140為設置在第一組發光元件130前方(如區域A4)作為包圍。 FIG. 5 is a top plan view of a dual light module 100a according to an embodiment of the present invention. The dual light module 100a includes a substrate 120, a first set of light emitting elements 130, and a second set of light emitting elements 140. . The first group of light emitting elements 130 are electrically connected to each other, and the second group of light emitting elements 140 are electrically connected to each other. The difference from the embodiment of FIG. 2 is that the first group of light-emitting elements 130 of the dual-light module 100a are arranged in a convex shape (such as the area A3), and the second group of the light-emitting elements 140 of the dual-light module 100a are disposed in the The front of the first group of light-emitting elements 130 (such as area A4) is surrounded.
第6圖繪示根據本新型一實施方式之雙光模組100b的俯視圖。雙光模組100b包含基板120、第一組發光元件130與第二組發光元件140。。第一組發光元件130彼此電性連接，第二組發光元件140彼此電性連接。與第2圖實施方式不同的地方在於：雙光模組100b的第一組發光元件130以凸字型方式排列(如區域A5)，第二組發光元件140佈局在第一組發光元件130凸字型前方周圍(如區域A6)作為包圍。舉例來說，雙光模組100b的第二組發光元件140除了包圍在第一組發光 元件130前方外，還包圍第一組發光元件130的左方與右方。 FIG. 6 is a top view of a dual light module 100b according to an embodiment of the present invention. The dual light module 100b includes a substrate 120, a first set of light emitting elements 130, and a second set of light emitting elements 140. . The first group of light emitting elements 130 are electrically connected to each other, and the second group of light emitting elements 140 are electrically connected to each other. The difference from the embodiment of FIG. 2 is that the first group of light-emitting elements 130 of the dual-light module 100b are arranged in a convex type (such as the area A5), and the second group of light-emitting elements 140 are arranged in the first group of the light-emitting elements 130. The area around the front of the font (such as area A6) is enclosed. For example, the second group of light-emitting elements 140 of the dual-light module 100b are surrounded by the first group of light-emitting elements. The front side of the element 130 also surrounds the left and right sides of the first group of light-emitting elements 130.
第7圖繪示根據本新型一實施方式之雙光模組100c的俯視圖。雙光模組100c包含基板120、第一組發光元件130與第二組發光元件140。第一組發光元件130彼此電性連接，第二組發光元件140彼此電性連接。與第2圖實施方式不同的地方在於：雙光模組100c的第一組發光元件130以長條型方式排列(如區域A7)，第二組發光元件140也以長條型方式排列(如區域A8)，且第二組發光元件140為設置在第一組發光元件130前方作為包圍。在非雨霧的天氣使用遠光時，可僅點亮第一組發光元件130的第一晶片132，產生較高色溫的光線，例如具有科技感與亮度效果的正白光。在雨霧的天氣使用遠光時，可僅點亮第二組發光元件140的第二晶片142，產生較低色溫的光線，或者同時點亮第一組發光元件130的第一晶片132與第二組發光元件140的第二晶片142，混光後產生較低色溫的光線，例如產生具有較高穿透度的中性白光或金黃光。由於固晶參數相似，可共用光學系統，達到光型位置無偏移的效果。 FIG. 7 is a top view of a dual light module 100c according to an embodiment of the present invention. The dual light module 100c includes a substrate 120, a first set of light emitting elements 130, and a second set of light emitting elements 140. The first group of light emitting elements 130 are electrically connected to each other, and the second group of light emitting elements 140 are electrically connected to each other. The difference from the embodiment of FIG. 2 is that the first group of light-emitting elements 130 of the dual-light module 100c are arranged in a long-length manner (such as the area A7), and the second group of light-emitting elements 140 are also arranged in a long-length manner (for example, The area A8) and the second group of light-emitting elements 140 are disposed in front of the first group of light-emitting elements 130 as a surround. When the high beam is used in non-rainy weather, only the first wafer 132 of the first group of light-emitting elements 130 may be illuminated to generate light of a higher color temperature, such as positive white light having a scientific and luminous effect. When the high beam is used in the rainy weather, only the second wafer 142 of the second group of light emitting elements 140 may be illuminated to generate light of a lower color temperature, or to simultaneously illuminate the first wafer 132 and the second of the first group of light emitting elements 130. The second wafer 142 of the group of light-emitting elements 140, when mixed, produces light of a lower color temperature, for example, producing neutral white or golden light having a higher degree of transparency. Since the solid crystal parameters are similar, the optical system can be shared to achieve the effect of no shift of the optical position.
第8圖繪示根據本新型一實施方式之雙光模組100d的俯視圖。雙光模組100d包含基板120、第一組發光元件130與第二組發光元件140。與第7圖實施方式不同的地方在於：雙光模組100d的第一組發光元件130與第二組發光元件140彼此電性連接。在本實施方式中，雙光模組100d的第一組發光元件130的第一晶片132與第二組發光元件140的第二晶片142可同時點亮，經第一波長轉換層134的光線可以為正白 光，經第二波長轉換層144的光線可以為中性白光或金黃光，混光後可作為霧燈使用。 FIG. 8 is a top view of a dual light module 100d according to an embodiment of the present invention. The dual light module 100d includes a substrate 120, a first set of light emitting elements 130, and a second set of light emitting elements 140. The difference from the embodiment of FIG. 7 is that the first group of light-emitting elements 130 and the second group of light-emitting elements 140 of the dual-light module 100d are electrically connected to each other. In this embodiment, the first wafer 132 of the first group of light-emitting elements 130 of the dual-light module 100d and the second wafer 142 of the second group of light-emitting elements 140 can be simultaneously illuminated, and the light passing through the first wavelength conversion layer 134 can be For positive white The light passing through the second wavelength conversion layer 144 may be neutral white light or golden light, and may be used as a fog light after being mixed.
雖然本新型已以實施方式揭露如上，然其並非用以限定本新型，任何熟習此技藝者，在不脫離本新型之精神和範圍內，當可作各種之更動與潤飾，因此本新型之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Any one skilled in the art can make various changes and retouchings without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107213911U TWM576228U (en) | 2018-10-15 | 2018-10-15 | Dual beam module and headlight assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107213911U TWM576228U (en) | 2018-10-15 | 2018-10-15 | Dual beam module and headlight assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM576228U true TWM576228U (en) | 2019-04-01 |
Family
ID=66997342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107213911U TWM576228U (en) | 2018-10-15 | 2018-10-15 | Dual beam module and headlight assembly |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM576228U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12038144B1 (en) | 2023-08-02 | 2024-07-16 | Coplus Inc. | Integrated dual-color vehicle light device |
-
2018
- 2018-10-15 TW TW107213911U patent/TWM576228U/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12038144B1 (en) | 2023-08-02 | 2024-07-16 | Coplus Inc. | Integrated dual-color vehicle light device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8847242B2 (en) | Multi-element LED lamp | |
| US8475023B2 (en) | Light emitting module and automotive lamp | |
| JP6340719B2 (en) | LIGHTING DEVICE AND AUTOMOBILE WITH LIGHTING DEVICE | |
| TWI391266B (en) | Vehicle headlight | |
| US20090073710A1 (en) | Illumination system and vehicular headlamp | |
| US20130329440A1 (en) | Light-emitting module and automotive lamp | |
| US20080055896A1 (en) | Systems, devices, components and methods for controllably configuring the color of light emitted by an automotive LED illumination system | |
| US20080055065A1 (en) | Systems, devices, components and methods for controllably configuring the brightness of light emitted by an automotive LED illumination system | |
| JP6052952B2 (en) | Light emitting module and vehicle lamp | |
| KR101798884B1 (en) | Light emitting device assembly and head light including the same | |
| US20150116980A1 (en) | Illumination system | |
| US7566152B2 (en) | Vehicular lamp unit | |
| JP2015149307A (en) | Light emitting module and vehicle lamp fitting | |
| CN109539160B (en) | Light emitting module and vehicle-mounted lamp | |
| JP7487822B2 (en) | Vehicle lighting fixtures | |
| US20090225564A1 (en) | Vehicle light and led package | |
| US10876702B2 (en) | Dual light sources having similar solor temperatures and different spectral characteristics | |
| JP6340696B2 (en) | Lighting device and automobile | |
| TWM576228U (en) | Dual beam module and headlight assembly | |
| CN109743883A (en) | Light emitting module and lamp unit | |
| US20170059115A1 (en) | Led array on partially reflective substrate within dam having reflective and non-reflective regions | |
| CN101120203A (en) | Lighting device | |
| JP2014186897A (en) | Light source device, and front lamp for vehicle using the same | |
| CN208750631U (en) | Double optical modules and its headlamp assemblies | |
| KR101461552B1 (en) | Lamp for vehicles |