TWM571967U - Test device and test system - Google Patents
Test device and test systemInfo
- Publication number
- TWM571967U TWM571967U TWM571967U TW M571967 U TWM571967 U TW M571967U TW M571967 U TWM571967 U TW M571967U
- Authority
- TW
- Taiwan
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- opening
- test
- reflector
- device holder
- signal transmission
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Abstract
本新型提供一種測試裝置，其包括一測試基座及一反射器。該測試基座界定一容納空間。該反射器安置於該容納空間中且具有彼此非平行之複數個反射表面。該等反射表面界定一傳輸空間。The present invention provides a test device that includes a test pedestal and a reflector. The test base defines a receiving space. The reflector is disposed in the receiving space and has a plurality of reflecting surfaces that are non-parallel to each other. The reflective surfaces define a transmission space.
Description
本新型係關於一種測試裝置、一種測試系統及一種測試方法，且係關於用以使用非接觸式技術(non-contact technique)來測試無線模組(wireless module)的一種測試裝置、一種測試系統及一種測試方法。The present invention relates to a test device, a test system and a test method, and relates to a test device, a test system and a test system for testing a wireless module using a non-contact technique. A test method.
無線模組（例如：毫米波RF無線模組(mmWave RF wireless module)）可以利用空中傳輸方式(over the air，OTA)來做測試。此種測試可在測試房間(testing room)（或測試室(testing chamber)）中執行，其中（例如在其內部表面上）安置了複數個吸收器。此種測試房間（或測試室）的體積相當大。舉例而言，其大小可係為6米(m)×6 m×6 m，或60厘米(cm)×60 cm×60 cm。另外，此種測試可能會花費很長時間。因此，此種測試可能不適合用以測試量產的裝置，亦即，此種測試不適合做為大批量生產製程或量產過程(mass production process)中的一部分。Wireless modules (eg, mmWave RF wireless modules) can be tested using over the air (OTA). Such testing can be performed in a testing room (or testing chamber) in which a plurality of absorbers are placed (e.g., on its interior surface). The size of such a test room (or test room) is quite large. For example, the size may be 6 meters (m) x 6 m x 6 m, or 60 cm (cm) x 60 cm x 60 cm. In addition, such testing can take a long time. Therefore, such testing may not be suitable for testing mass production equipment, that is, such testing is not suitable as part of a mass production process or a mass production process.
根據一個態樣，在一些實施例中，一種測試裝置包括一測試基座(testing socket)及一反射器(reflector)。該測試基座界定一容納空間(accommodating space)。該反射器安置於該容納空間中且具有彼此非平行之複數個反射表面。該等反射表面界定一傳輸空間(transmission space)。According to one aspect, in some embodiments, a test device includes a test socket and a reflector. The test pedestal defines an accommodating space. The reflector is disposed in the receiving space and has a plurality of reflecting surfaces that are non-parallel to each other. The reflective surfaces define a transmission space.
根據另一態樣，在一些實施例中，一種測試裝置包括一測試夾具(testing fixture)及一裝置托座(device holder)。該測試夾具界定一第一開口及與該第一開口相對之一第二開口，且具有複數個反射表面。該等反射表面界定該第一開口與該第二開口之間的一傳輸空間。該裝置托座安置於該傳輸空間中且界定一上開口。該裝置托座包括至少一個第一信號傳輸部分及一第二信號傳輸部分。該裝置托座之該上開口對應於該測試夾具之該第一開口。該第一信號傳輸部分及該第二信號傳輸部分界定一承接空間，且該第二信號傳輸部分與該上開口相對。According to another aspect, in some embodiments, a test device includes a testing fixture and a device holder. The test fixture defines a first opening and a second opening opposite the first opening and has a plurality of reflective surfaces. The reflective surfaces define a transmission space between the first opening and the second opening. The device holder is disposed in the transmission space and defines an upper opening. The device holder includes at least one first signal transmission portion and a second signal transmission portion. The upper opening of the device holder corresponds to the first opening of the test fixture. The first signal transmitting portion and the second signal transmitting portion define a receiving space, and the second signal transmitting portion is opposite to the upper opening.
根據另一態樣，在一些實施例中，一種測試系統包括一測試裝置、一電路板及一測試器(tester)。該測試裝置包括一測試基座、一反射器及一裝置托座。該測試基座界定一第一開口、與該第一開口相對之一第二開口，及該第一開口與該第二開口之間的一容納空間。該反射器安置於該容納空間中且具有複數個反射表面。該裝置托座安置於該容納空間中且界定用以容納一受測裝置(device under test，DUT)之一承接空間(receiving space)。該裝置托座包括至少一個第一信號傳輸部分及一第二信號傳輸部分。該電路板安置於該測試基座之該第一開口上方且經組態以電連接至該DUT。該測試器安置於該測試基座之該第二開口下且電連接至該電路板。該測試器包括對應於該測試基座之該第二開口的一測試天線。According to another aspect, in some embodiments, a test system includes a test device, a circuit board, and a tester. The test device includes a test base, a reflector and a device holder. The test base defines a first opening, a second opening opposite the first opening, and a receiving space between the first opening and the second opening. The reflector is disposed in the receiving space and has a plurality of reflective surfaces. The device holder is disposed in the receiving space and defined to accommodate a receiving space of a device under test (DUT). The device holder includes at least one first signal transmission portion and a second signal transmission portion. The circuit board is disposed over the first opening of the test pedestal and is configured to electrically connect to the DUT. The tester is disposed under the second opening of the test pedestal and electrically connected to the circuit board. The tester includes a test antenna corresponding to the second opening of the test pedestal.
根據另一態樣，在一些實施例中，一種測試方法包括：(a)提供一測試板及一DUT，該DUT包括一第一表面、與該第一表面相對之一第二表面，及鄰近於該第一表面之複數個電接點；及(b)在該DUT之該第一表面上施加一吸力，以使得該DUT之該等電接點電連接至該測試板。According to another aspect, in some embodiments, a test method includes: (a) providing a test board and a DUT, the DUT including a first surface, a second surface opposite the first surface, and adjacent And a plurality of electrical contacts on the first surface; and (b) applying a suction force on the first surface of the DUT such that the electrical contacts of the DUT are electrically connected to the test board.
貫穿圖式及實施方式使用共同參考編號以指示相同或相似組件。自結合附圖的以下詳細描述將更容易理解本新型之實施例。Common reference numbers are used throughout the drawings and the embodiments to refer to the same. Embodiments of the present invention will be more readily understood from the following detailed description.
以下揭示內容提供用於實施所提供主題之不同特徵的許多不同實施例或實例。在下文描述組件及配置之特定實例以闡明本新型之特定態樣。當然，此等組件、值、操作、材料及配置僅為實例且不意欲為限制性的。舉例而言，在本文中所提供之描述中，第一特徵在第二特徵上方或上的形成可包括第一特徵以及第二特徵直接接觸地形成或安置的實施例，且亦可包括額外特徵可在第一特徵與第二特徵之間形成或安置使得第一特徵與第二特徵可不直接接觸的實施例。另外，本新型可在本文中所提供之各種實例中重複參考數字及/或字母。此重複係出於簡化及清楚之目的，且本身並不指示所論述各種實施例及/或組態之間的關係。The following disclosure provides many different embodiments or examples for implementing different features of the subject matter provided. Specific examples of components and configurations are described below to clarify certain aspects of the present invention. Of course, such components, values, operations, materials, and configurations are merely examples and are not intended to be limiting. For example, in the description provided herein, the formation of the first feature over or over the second feature can include embodiments in which the first feature and the second feature are formed or disposed in direct contact, and can also include additional features. Embodiments may be formed or disposed between the first feature and the second feature such that the first feature and the second feature may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples provided herein. This repetition is for the purpose of simplicity and clarity, and is not a limitation of the various embodiments and/or configurations described.
在比較性測試程序中，受測裝置(device under test，DUT)可具有第一表面及與第一表面相對之第二表面。DUT可包括複數個焊料凸塊及天線。焊料凸塊可安置於第一表面上，且天線可安置於第二表面上。在測試程序期間，測試夾具(testing fixture)自DUT之第二表面拾取(picks up)DUT。因此，測試夾具之硬材料（例如金屬材料）可能會接觸第二表面上之天線。因此，會不利地影響天線之效率（例如經由天線之變形）。In a comparative test procedure, a device under test (DUT) can have a first surface and a second surface opposite the first surface. The DUT can include a plurality of solder bumps and antennas. The solder bumps can be disposed on the first surface and the antenna can be disposed on the second surface. During the test procedure, a testing fixture picks up the DUT from the second surface of the DUT. Therefore, the hard material of the test fixture (such as a metal material) may contact the antenna on the second surface. Therefore, the efficiency of the antenna (e.g., via deformation of the antenna) may be adversely affected.
若DUT包括複數個天線，則DUT之天線可自不同方向發射信號。然而，用以接收DUT之天線之信號的測試天線處於固定位置。因此，在測試過程期間，DUT和測試夾具必須旋轉360度，以使得來自DUT之所有信號可被測試天線接收到。此種測試夾具非常難以設計。If the DUT includes a plurality of antennas, the antenna of the DUT can transmit signals from different directions. However, the test antenna used to receive the signal from the antenna of the DUT is in a fixed position. Therefore, during the test process, the DUT and test fixture must be rotated 360 degrees so that all signals from the DUT can be received by the test antenna. This type of test fixture is very difficult to design.
本公開提供一種可在大批量生產（亦即：量產）期間用於生產線中之測試裝置。在一些實施例中，測試裝置包括安置於測試基座之容納空間中的反射器，以使得反射器可將來自DUT之信號反射至測試天線。因此，可有效地減小測試裝置之大小。本新型之一些實施例至少提供一種測試方法，其在DUT之第一表面上提供吸力以使得DUT之第一表面上的電接點電連接至測試板。The present disclosure provides a test device that can be used in a production line during mass production (ie, mass production). In some embodiments, the test device includes a reflector disposed in the receiving space of the test base such that the reflector can reflect signals from the DUT to the test antenna. Therefore, the size of the test device can be effectively reduced. Some embodiments of the present invention provide at least one test method that provides suction on a first surface of the DUT to electrically connect the electrical contacts on the first surface of the DUT to the test board.
圖1說明根據本新型之一些實施例之測試裝置1的剖面圖。圖2說明圖1中所展示之測試裝置1的俯視圖。應注意，圖1係沿著圖2之線I-I截取的剖面圖。測試裝置1包括測試夾具(testing fixture)11（包括例如測試基座(testing socket)12及反射器(reflector)14）及裝置托座(device holder)2。Figure 1 illustrates a cross-sectional view of a test device 1 in accordance with some embodiments of the present invention. Figure 2 illustrates a top view of the test device 1 shown in Figure 1. It should be noted that Fig. 1 is a cross-sectional view taken along line I-I of Fig. 2. The test apparatus 1 includes a testing fixture 11 (including, for example, a testing socket 12 and a reflector 14) and a device holder 2.
測試基座12界定容納空間(accommodating space)123、第一開口125及第二開口126。第二開口126與第一開口125相對，且容納空間123安置於第一開口125與第二開口126之間。容納空間123、第一開口125與第二開口126彼此連通。在一些實施例中，測試基座12包括一或多個側壁121 (例如四個側壁121)及底壁122。側壁121之各別頂部部分可界定第一開口125。側壁121可連接至底壁122以界定容納空間123。底壁122可界定第二開口126。如圖1中所展示，第二開口126可定位於底壁122之中心處且可延伸穿過底壁122。第一開口125之寬度大於第二開口126之寬度（例如約1.3倍或更大、約1.5倍或更大或約2倍或更大）。在一些實施例中，側壁121與底壁122一體成型為單體結構。另外，測試基座12可在側壁121之頂部（例如上表面1211）中進一步界定複數個狹槽(slots)127，該等狹槽127用於承接裝置托座2之延伸部分22。The test pedestal 12 defines an accommodating space 123, a first opening 125, and a second opening 126. The second opening 126 is opposite to the first opening 125 , and the receiving space 123 is disposed between the first opening 125 and the second opening 126 . The accommodation space 123, the first opening 125, and the second opening 126 are in communication with each other. In some embodiments, the test pedestal 12 includes one or more side walls 121 (eg, four side walls 121) and a bottom wall 122. The respective top portions of the side walls 121 may define a first opening 125. The side wall 121 can be coupled to the bottom wall 122 to define an accommodation space 123. The bottom wall 122 can define a second opening 126. As shown in FIG. 1 , the second opening 126 can be positioned at the center of the bottom wall 122 and can extend through the bottom wall 122 . The width of the first opening 125 is greater than the width of the second opening 126 (eg, about 1.3 times or more, about 1.5 times or more, or about 2 times or more). In some embodiments, the sidewall 121 and the bottom wall 122 are integrally formed as a unitary structure. Additionally, the test pedestal 12 can further define a plurality of slots 127 in the top of the sidewall 121 (e.g., the upper surface 1211) for receiving the extension 22 of the device holder 2.
反射器14安置於測試基座12之容納空間123中，且包括彼此非平行之複數個反射表面143。反射表面143係傾斜表面且界定傳輸空間(transmission space)144。如圖1中所展示，反射器14界定第一開口145及與第一開口145相對之第二開口146，且第一開口145之寬度不同於第二開口146之寬度。第一開口145之寬度大於第二開口146之寬度（例如約1.3倍或更大、約1.5倍或更大或約2倍或更大），且傳輸空間144安置於第一開口145與第二開口146之間。傳輸空間144、第一開口145與第二開口146彼此連通。The reflector 14 is disposed in the accommodation space 123 of the test base 12 and includes a plurality of reflective surfaces 143 that are non-parallel to each other. The reflective surface 143 is an inclined surface and defines a transmission space 144. As shown in FIG. 1 , the reflector 14 defines a first opening 145 and a second opening 146 opposite the first opening 145 , and the width of the first opening 145 is different from the width of the second opening 146 . The width of the first opening 145 is greater than the width of the second opening 146 (eg, about 1.3 times or more, about 1.5 times or more, or about 2 times or more), and the transmission space 144 is disposed at the first opening 145 and the second Between the openings 146. The transmission space 144, the first opening 145 and the second opening 146 are in communication with each other.
反射器14之材料可包括金屬，諸如鋁、銅、鐵或鋼、其他反射性金屬或其合金。在一些實施例中，反射器14之反射表面143係平坦表面或彎曲表面。在一些實施例中，一個反射表面143可包括彼此非平行的兩個或多於兩個子表面(sub-surfaces)。反射器14可包括四個彎曲的角落表面147，且彎曲的角落表面147中之每一者安置於兩個反射表面143之間（以順時針方式）。因此，在兩個反射表面143之間（以順時針方式）可能不存在平坦的傾斜表面。在一些實施例中，反射器14包括四個反射部分14'。反射部分14'中之每一者的剖面係三角形，且所有反射部分14'可一體成型為單體結構。反射器14可一體成型為單體結構。反射部分14'中之每一者具有反射表面143、外部表面141及底部表面142。因此，反射器14具有四個外部表面141及一底部表面142。第一開口145由四個反射部分14'之頂部邊緣界定，且第二開口146由四個反射部分14'之底部內部邊緣界定。當反射器14置放於測試基座12中時，反射器14之外部表面141及底部表面142分別接觸測試基座12之側壁121及底壁122的內部表面。另外，反射器14之第一開口145對應於測試基座12之第一開口125且與其對準，且反射器14之第二開口146對應於測試基座12之第二開口126且與其對準。因此，測試基座12之第二開口126與反射器14之傳輸空間144連通。如圖1中所展示，反射表面143在測試基座12之側壁121之頂部的內部邊緣與測試基座12之第二開口126之側壁的頂部邊緣之間延伸。The material of the reflector 14 may comprise a metal such as aluminum, copper, iron or steel, other reflective metals or alloys thereof. In some embodiments, the reflective surface 143 of the reflector 14 is a flat or curved surface. In some embodiments, one reflective surface 143 can include two or more than two sub-surfaces that are non-parallel to each other. The reflector 14 can include four curved corner surfaces 147, and each of the curved corner surfaces 147 is disposed between the two reflective surfaces 143 (in a clockwise manner). Therefore, there may be no flat inclined surface between the two reflective surfaces 143 (in a clockwise manner). In some embodiments, the reflector 14 includes four reflective portions 14'. The cross section of each of the reflecting portions 14' is triangular, and all of the reflecting portions 14' may be integrally formed into a single structure. The reflector 14 can be integrally formed into a unitary structure. Each of the reflective portions 14' has a reflective surface 143, an outer surface 141, and a bottom surface 142. Thus, the reflector 14 has four outer surfaces 141 and a bottom surface 142. The first opening 145 is defined by the top edge of the four reflective portions 14' and the second opening 146 is defined by the bottom inner edge of the four reflective portions 14'. When the reflector 14 is placed in the test pedestal 12, the outer surface 141 and the bottom surface 142 of the reflector 14 contact the inner surfaces of the side walls 121 and the bottom wall 122 of the test pedestal 12, respectively. Additionally, the first opening 145 of the reflector 14 corresponds to and is aligned with the first opening 125 of the test pedestal 12, and the second opening 146 of the reflector 14 corresponds to and is aligned with the second opening 126 of the test pedestal 12. . Thus, the second opening 126 of the test pedestal 12 is in communication with the transmission space 144 of the reflector 14. As shown in FIG. 1, reflective surface 143 extends between an inner edge of the top of sidewalls 121 of test pedestal 12 and a top edge of a sidewall of second opening 126 of test susceptor 12.
裝置托座2安置於測試夾具11之反射器14的傳輸空間144中，且由測試夾具11（由例如測試基座12或反射器14）支撐。如圖1中所展示，裝置托座2包括承接部分(receiving portion)21及延伸部分(extending portion)22。承接部分21界定承接空間(receiving space)23以用於收納受測裝置(device under test，DUT)4（見圖20）。延伸部分22自承接部分21延伸至測試夾具11之測試基座12的上表面1211。在一些實施例中，延伸部分22可定位於或耦接於測試基座12之側壁121的狹槽(slot)127中。如圖1及圖2中所展示，裝置托座2安置於容納空間123中及傳輸空間144中，以使得承接空間23被反射器14之反射表面143包圍，且反射器14之反射表面143面朝向裝置托座2之承接空間23。The device holder 2 is disposed in the transfer space 144 of the reflector 14 of the test fixture 11 and is supported by the test fixture 11 (by, for example, the test base 12 or the reflector 14). As shown in FIG. 1, the device holder 2 includes a receiving portion 21 and an extending portion 22. The receiving portion 21 defines a receiving space 23 for housing a device under test (DUT) 4 (see Fig. 20). The extension portion 22 extends from the receiving portion 21 to the upper surface 1211 of the test susceptor 12 of the test fixture 11. In some embodiments, the extension portion 22 can be positioned or coupled to a slot 127 of the sidewall 121 of the test pedestal 12. As shown in FIGS. 1 and 2, the device holder 2 is disposed in the accommodating space 123 and in the transmission space 144 such that the receiving space 23 is surrounded by the reflecting surface 143 of the reflector 14, and the reflecting surface 143 of the reflector 14 is faced. The receiving space 23 faces the device holder 2.
另外，裝置托座2之承接部分21界定上開口24。裝置托座2之上開口24對應於測試夾具11之測試基座12的第一開口125及測試夾具11之反射器14的第一開口145。另外，裝置托座2之承接部分21包括至少一或多個第一信號傳輸部分(first signal transmission portions)211及第二信號傳輸部分(second signal transmission portion)212。第一信號傳輸部分211連接至第二信號傳輸部分212，且第一信號傳輸部分211及第二信號傳輸部分212一起界定承接空間23。第二信號傳輸部分212與上開口24相對。如圖1及圖2中所展示，裝置托座2之承接部分21包括分別對應於承接部分21之四個側邊的四個第一信號傳輸部分211。第二信號傳輸部分212對應於承接部分21之底側。另外，延伸部分22自第一信號傳輸部分211延伸至夾具11之測試基座12的上表面1211。In addition, the receiving portion 21 of the device holder 2 defines an upper opening 24. The opening 24 above the device holder 2 corresponds to the first opening 125 of the test pedestal 12 of the test fixture 11 and the first opening 145 of the reflector 14 of the test fixture 11. In addition, the receiving portion 21 of the device holder 2 includes at least one or more first signal transmission portions 211 and a second signal transmission portion 212. The first signal transmission portion 211 is connected to the second signal transmission portion 212, and the first signal transmission portion 211 and the second signal transmission portion 212 together define the receiving space 23. The second signal transmission portion 212 is opposed to the upper opening 24. As shown in FIGS. 1 and 2, the receiving portion 21 of the device holder 2 includes four first signal transmitting portions 211 respectively corresponding to the four sides of the receiving portion 21. The second signal transmission portion 212 corresponds to the bottom side of the receiving portion 21. In addition, the extension portion 22 extends from the first signal transmission portion 211 to the upper surface 1211 of the test susceptor 12 of the jig 11.
圖3說明圖1之測試裝置1之裝置托座2的剖面圖。圖4說明圖3中所展示之裝置托座2的立體圖。裝置托座2可包括複數個條帶(strips)或棒(bars)，且可一體成型為單體結構。在一些實施例中，裝置托座2之材料可係例如塑料、木頭、丙烯酸(acrylic)或氣凝膠(aerogel)。承接部分21之第一信號傳輸部分211界定側向開口2111，且包括側向開口2111及第一條帶部分2112。承接部分21之第二信號傳輸部分212界定下開口2121，且包括下開口2121及第二條帶部分2122。第二條帶部分2122可固持或托住DUT 4之底部邊緣（見圖20）。因此，裝置托座2之承接空間23藉由下開口2121及側向開口2111與反射器14之傳輸空間144連通（見圖1）。圖3及圖4之裝置托座2可被稱作「網袋型(net bag type)」。Figure 3 illustrates a cross-sectional view of the device holder 2 of the test device 1 of Figure 1. Figure 4 illustrates a perspective view of the device holder 2 shown in Figure 3. The device holder 2 can include a plurality of strips or bars and can be integrally formed as a unitary structure. In some embodiments, the material of the device holder 2 can be, for example, plastic, wood, acrylic, or aerogel. The first signal transmission portion 211 of the receiving portion 21 defines a lateral opening 2111 and includes a lateral opening 2111 and a first strip portion 2112. The second signal transmission portion 212 of the receiving portion 21 defines a lower opening 2121 and includes a lower opening 2121 and a second strip portion 2122. The second strap portion 2122 can hold or hold the bottom edge of the DUT 4 (see Figure 20). Therefore, the receiving space 23 of the device holder 2 communicates with the transmission space 144 of the reflector 14 through the lower opening 2121 and the lateral opening 2111 (see FIG. 1). The device holder 2 of Figures 3 and 4 can be referred to as a "net bag type".
圖5說明根據本新型之一些實施例之裝置托座2a的剖面圖。圖6說明圖5中所展示之裝置托座2a的立體圖。裝置托座2a類似於圖3及圖4中所展示之裝置托座2，但是不同處如下。如圖5及圖6中所展示，第一信號傳輸部分211可包括第一信號傳輸部分211a，且第一信號傳輸部分211a之第一條帶部分2112a朝向側向開口2111a延伸。因此，圖5及圖6之第一信號傳輸部分211a之側向開口2111a的大小小於圖3及圖4之第一信號傳輸部分211之側向開口2111的大小。延伸的第一條帶部分2112a可固持DUT 4之側表面47 （見圖20）。Figure 5 illustrates a cross-sectional view of a device holder 2a in accordance with some embodiments of the present invention. Figure 6 illustrates a perspective view of the device holder 2a shown in Figure 5. The device holder 2a is similar to the device holder 2 shown in Figures 3 and 4, but the differences are as follows. As shown in FIGS. 5 and 6, the first signal transmission portion 211 may include a first signal transmission portion 211a, and the first strip portion 2112a of the first signal transmission portion 211a extends toward the lateral opening 2111a. Therefore, the size of the lateral opening 2111a of the first signal transmission portion 211a of FIGS. 5 and 6 is smaller than the size of the lateral opening 2111 of the first signal transmission portion 211 of FIGS. 3 and 4. The extended first strip portion 2112a can hold the side surface 47 of the DUT 4 (see Fig. 20).
圖7說明圖1之測試裝置1之測試基座12的立體圖。測試基座12可包括四個側壁121及底壁122。側壁121之頂部部分可界定第一開口125。側壁121可連接至底壁122以界定容納空間123。底壁122可界定第二開口126。第二開口126可定位於底壁122之中心處且可延伸穿過底壁122。第一開口125之寬度大於第二開口126之寬度（例如約1.3倍或更大、約1.5倍或更大或約2.0倍或更大）。在一些實施例中，側壁121與底壁122一體成型為單體結構。另外，測試基座12可在側壁121之頂部（例如上表面1211）中進一步界定用於承接裝置托座2之延伸部分22的複數個狹槽127。Figure 7 illustrates a perspective view of the test pedestal 12 of the test device 1 of Figure 1. The test pedestal 12 can include four side walls 121 and a bottom wall 122. The top portion of the sidewall 121 can define a first opening 125. The side wall 121 can be coupled to the bottom wall 122 to define an accommodation space 123. The bottom wall 122 can define a second opening 126. The second opening 126 can be positioned at the center of the bottom wall 122 and can extend through the bottom wall 122. The width of the first opening 125 is greater than the width of the second opening 126 (eg, about 1.3 times or more, about 1.5 times or more, or about 2.0 times or more). In some embodiments, the sidewall 121 and the bottom wall 122 are integrally formed as a unitary structure. Additionally, the test pedestal 12 can further define a plurality of slots 127 for receiving the extended portion 22 of the device holder 2 in the top of the sidewall 121 (eg, the upper surface 1211).
圖8說明圖1之測試裝置1之反射器14的立體圖。反射器14可包括彼此非平行之四個反射表面143，且界定第一開口145、與第一開口145相對之第二開口146，及第一開口145與第二開口146之間的傳輸空間144。第一開口145之寬度大於第二開口146之寬度（例如約1.3倍或更大、約1.5倍或更大或約2.0倍或更大）。另外，反射器14可進一步包括四個彎曲的角落表面147，且彎曲的角落表面147中之每一者安置於兩個反射表面143之間（以順時針方式）。因此，兩個反射表面143之間（以順時針方式）可能不存在平坦的傾斜表面。在一些實施例中，反射器14可一體成型為單體結構。反射器14具有一或多個外部表面141 (例如四個外部表面141)及底部表面142。第一開口145由四個反射表面143之頂部邊緣界定，且第二開口146由四個反射表面143之底部內部邊緣界定。Figure 8 illustrates a perspective view of the reflector 14 of the test device 1 of Figure 1. The reflector 14 may include four reflective surfaces 143 that are non-parallel to each other and define a first opening 145, a second opening 146 opposite the first opening 145, and a transmission space 144 between the first opening 145 and the second opening 146. . The width of the first opening 145 is greater than the width of the second opening 146 (eg, about 1.3 times or more, about 1.5 times or more, or about 2.0 times or more). Additionally, the reflector 14 can further include four curved corner surfaces 147, and each of the curved corner surfaces 147 is disposed between the two reflective surfaces 143 (in a clockwise manner). Therefore, there may be no flat inclined surface between the two reflective surfaces 143 (in a clockwise manner). In some embodiments, the reflector 14 can be integrally formed as a unitary structure. The reflector 14 has one or more outer surfaces 141 (eg, four outer surfaces 141) and a bottom surface 142. The first opening 145 is defined by the top edge of the four reflective surfaces 143 and the second opening 146 is defined by the bottom inner edge of the four reflective surfaces 143.
圖9說明圖1之測試裝置1之測試夾具11的立體圖。當反射器14置放於測試基座12之容納空間123中以便形成測試夾具11時，反射器14之外部表面141及底部表面142分別接觸測試基座12之側壁121及底壁122的內部表面。另外，反射器14之第一開口145對應於測試基座12之第一開口125，且反射器14之第二開口146與測試基座12之第二開口126對準。因此，測試基座12之第二開口126與反射器14之傳輸空間144連通。Figure 9 illustrates a perspective view of the test fixture 11 of the test device 1 of Figure 1. When the reflector 14 is placed in the accommodating space 123 of the test susceptor 12 to form the test fixture 11, the outer surface 141 and the bottom surface 142 of the reflector 14 respectively contact the inner surface 121 of the test susceptor 12 and the inner surface of the bottom wall 122. . Additionally, the first opening 145 of the reflector 14 corresponds to the first opening 125 of the test pedestal 12 and the second opening 146 of the reflector 14 is aligned with the second opening 126 of the test pedestal 12. Thus, the second opening 126 of the test pedestal 12 is in communication with the transmission space 144 of the reflector 14.
圖10說明根據本新型之一些實施例之測試夾具11a的剖面圖。測試夾具11a類似於圖1及圖9中所展示之測試夾具11，其不同處如下所述。如圖10中所展示，圖1及圖9之反射器14與測試基座12可一體成型為單體結構以形成測試夾具11a。亦即，測試夾具11a係單體結構，在圖1及圖9之反射器14與測試基座12之間可能不存在邊界。測試夾具11a可界定第一開口115及與第一開口115相對之第二開口116，且可包括複數個反射表面113，其界定第一開口115與第二開口116之間的傳輸空間114。第一開口115之寬度大於第二開口116之寬度（例如約1.3倍或更大、約1.5倍或更大或約2.0倍或更大）。測試夾具11a可在其頂部（例如上表面）上進一步界定複數個狹槽117，其用於承接裝置托座2之延伸部分22。測試夾具11a之材料可係反射材料，諸如金屬。因此，反射表面113可反射電磁信號。Figure 10 illustrates a cross-sectional view of a test fixture 11a in accordance with some embodiments of the present invention. The test fixture 11a is similar to the test fixture 11 shown in Figures 1 and 9, the differences of which are described below. As shown in FIG. 10, the reflector 14 of FIGS. 1 and 9 and the test pedestal 12 can be integrally formed into a unitary structure to form a test fixture 11a. That is, the test fixture 11a is a unitary structure, and there may be no boundary between the reflector 14 of FIGS. 1 and 9 and the test susceptor 12. The test fixture 11a can define a first opening 115 and a second opening 116 opposite the first opening 115, and can include a plurality of reflective surfaces 113 that define a transmission space 114 between the first opening 115 and the second opening 116. The width of the first opening 115 is greater than the width of the second opening 116 (eg, about 1.3 times or more, about 1.5 times or more, or about 2.0 times or more). The test fixture 11a can further define a plurality of slots 117 on its top portion (e.g., the upper surface) for receiving the extension 22 of the device holder 2. The material of the test fixture 11a may be a reflective material such as a metal. Therefore, the reflective surface 113 can reflect electromagnetic signals.
圖11說明根據本新型之一些實施例之測試夾具11b的剖面圖。測試夾具11b類似於圖10中所展示之測試夾具11a，其不同處如下所述。如圖11中所展示，測試夾具11b之材料可包括非反射材料，且諸如金屬之反射材料118安置（例如塗佈）於反射表面113上。Figure 11 illustrates a cross-sectional view of a test fixture 11b in accordance with some embodiments of the present invention. The test jig 11b is similar to the test jig 11a shown in Fig. 10, and the differences are as follows. As shown in FIG. 11, the material of the test fixture 11b can include a non-reflective material, and a reflective material 118, such as a metal, is disposed (eg, coated) on the reflective surface 113.
圖12說明根據本新型之一些實施例之測試夾具11c的剖面圖。測試夾具11c類似於圖1及圖9中所展示之測試夾具11，其不同處如下所述。如圖12中所展示，反射器14a可與圖1及圖9之反射器14相同，但可相反地安置（亦即，倒放）。因此，反射器14a之底部表面142面朝上，且不接觸測試基座12之底壁122的內表面。另外，圖1之第二開口146變成圖12中之第一開口145a，且圖1之第一開口145變成圖12中之第二開口146a。第一開口145a之寬度小於第二開口146a之寬度（例如約3/4倍或更小、約1/2倍或更小或約1/4倍或更）。在一些實施例中，反射器14a與測試基座12可一體成型為單體結構。測試夾具11c可一體成型為單體結構。Figure 12 illustrates a cross-sectional view of a test fixture 11c in accordance with some embodiments of the present invention. The test fixture 11c is similar to the test fixture 11 shown in Figures 1 and 9, the differences of which are described below. As shown in Figure 12, the reflector 14a can be identical to the reflector 14 of Figures 1 and 9, but can be placed oppositely (i.e., inverted). Thus, the bottom surface 142 of the reflector 14a faces upward and does not contact the inner surface of the bottom wall 122 of the test pedestal 12. In addition, the second opening 146 of FIG. 1 becomes the first opening 145a of FIG. 12, and the first opening 145 of FIG. 1 becomes the second opening 146a of FIG. The width of the first opening 145a is less than the width of the second opening 146a (eg, about 3/4 times or less, about 1/2 times or less, or about 1/4 times or more). In some embodiments, the reflector 14a and the test pedestal 12 can be integrally formed as a unitary structure. The test jig 11c can be integrally formed into a single structure.
圖13說明根據本新型之一些實施例之測試夾具11d的剖面圖。測試夾具11d類似於圖1及圖9中所展示之測試夾具11，其不同處如下所述。如圖13中所展示，反射器14b可包括反射器14及內環部分14c。圖13之反射器14可與圖1及圖9之反射器14相同。內環部分14c可安置於反射表面143上。內環部分14c之一部分的剖面可係大體上三角形的。內環部分14c之頂面148面朝上，且界定第一開口145b。內環部分14c之頂面148可大體上平行於反射器14之底部表面142。內環部分14c可包括複數個反射表面149，其與反射器14之反射表面143大體上相交。反射表面143中之一者與反射表面149中之一者之間的一或多個接點可界定為曲線。內環部分14c之反射表面149與反射器14之未被覆蓋之反射表面143一起界定傳輸空間144'。Figure 13 illustrates a cross-sectional view of a test fixture 11d in accordance with some embodiments of the present invention. The test fixture 11d is similar to the test fixture 11 shown in Figures 1 and 9, the differences of which are described below. As shown in Figure 13, the reflector 14b can include a reflector 14 and an inner ring portion 14c. The reflector 14 of Figure 13 can be identical to the reflector 14 of Figures 1 and 9. The inner ring portion 14c can be disposed on the reflective surface 143. The section of a portion of the inner ring portion 14c can be generally triangular. The top surface 148 of the inner ring portion 14c faces upward and defines a first opening 145b. The top surface 148 of the inner ring portion 14c can be substantially parallel to the bottom surface 142 of the reflector 14. The inner ring portion 14c can include a plurality of reflective surfaces 149 that substantially intersect the reflective surface 143 of the reflector 14. One or more joints between one of the reflective surfaces 143 and one of the reflective surfaces 149 can be defined as a curve. The reflective surface 149 of the inner ring portion 14c, together with the uncovered reflective surface 143 of the reflector 14, defines a transmission space 144'.
內環部分14c之反射表面149與反射器14之反射表面143之間的相交部分（接點）界定第三開口147b。另外，圖1之第二開口146變成圖13中之第二開口146b。因此，反射器14b界定第一開口145b、第二開口146b及第三開口147b。第三開口147b位於第一開口145b與第二開口146b之間，且第三開口147b之寬度不等於第一開口145b及第二開口146b之寬度。如圖13中所展示，第三開口147b之寬度大於第一開口145b及第二開口146b之寬度（例如約1.3倍或更大、約1.5倍或更大或約2.0倍或更大）。在一些實施例中，反射器14與內環部分14c可一體成型為單體結構。反射器14b可一體成型為單體結構。在一些實施例中，反射器14b與測試基座12可一體成型為單體結構。測試夾具11d可一體成型為單體結構。The intersection (joint) between the reflective surface 149 of the inner ring portion 14c and the reflective surface 143 of the reflector 14 defines a third opening 147b. In addition, the second opening 146 of FIG. 1 becomes the second opening 146b of FIG. Therefore, the reflector 14b defines the first opening 145b, the second opening 146b, and the third opening 147b. The third opening 147b is located between the first opening 145b and the second opening 146b, and the width of the third opening 147b is not equal to the width of the first opening 145b and the second opening 146b. As shown in FIG. 13, the width of the third opening 147b is greater than the width of the first opening 145b and the second opening 146b (eg, about 1.3 times or more, about 1.5 times or more, or about 2.0 times or more). In some embodiments, the reflector 14 and the inner ring portion 14c can be integrally formed as a unitary structure. The reflector 14b can be integrally formed into a single structure. In some embodiments, the reflector 14b and the test pedestal 12 can be integrally formed as a unitary structure. The test jig 11d can be integrally formed into a single structure.
圖14說明根據本新型之一些實施例之測試裝置1a的剖面圖。圖15說明圖14中所展示之測試裝置1a的俯視圖。測試裝置1a包括測試夾具11e（包括例如測試基座12a及反射器14）及裝置托座2b。測試基座12a類似於圖1及圖2之測試基座12，其不同處如下所述，測試基座12a進一步包括自測試基座12a之側壁121之頂部（例如上表面1211）突出的突出環128。測試基座12a之側壁121的突出環128與上表面1211一起界定容納區域(accommodating area)129，其用於承接裝置托座2b之延伸部分25。Figure 14 illustrates a cross-sectional view of a test device 1a in accordance with some embodiments of the present invention. Figure 15 illustrates a top view of the test device 1a shown in Figure 14. The test apparatus 1a includes a test fixture 11e (including, for example, a test base 12a and a reflector 14) and a device holder 2b. The test pedestal 12a is similar to the test pedestal 12 of Figures 1 and 2, the difference being described below, the test pedestal 12a further comprising a protruding ring projecting from the top of the side wall 121 of the test pedestal 12a (e.g., the upper surface 1211) 128. The protruding ring 128 of the side wall 121 of the test pedestal 12a, together with the upper surface 1211, defines an accommodating area 129 for receiving the extended portion 25 of the device holder 2b.
裝置托座2b包括承接部分21及延伸部分25。裝置托座2b之承接部分21與圖1及圖2之裝置托座2的承接部分21相同。亦即，裝置托座2b之承接部分21界定承接空間23及上開口24。承接空間23可用於收納DUT 4（見圖20）。裝置托座2b之上開口24對應於測試夾具11e之測試基座12a的第一開口125及測試夾具11e之反射器14的第一開口145。裝置托座2b之延伸部分25自承接部分21延伸至測試夾具11e之測試基座12a的上表面1211。在一些實施例中，延伸部分25可定位於容納區域129中。因此，延伸部分25之外圍的底部由測試夾具11e之測試基座12a的上表面1211支撐，且延伸部分25之外側表面受突出環128限制。The device holder 2b includes a receiving portion 21 and an extending portion 25. The receiving portion 21 of the device holder 2b is identical to the receiving portion 21 of the device holder 2 of Figs. That is, the receiving portion 21 of the device holder 2b defines the receiving space 23 and the upper opening 24. The receiving space 23 can be used to house the DUT 4 (see Fig. 20). The opening 24 above the device holder 2b corresponds to the first opening 125 of the test pedestal 12a of the test fixture 11e and the first opening 145 of the reflector 14 of the test fixture 11e. The extension portion 25 of the device holder 2b extends from the receiving portion 21 to the upper surface 1211 of the test base 12a of the test fixture 11e. In some embodiments, the extension portion 25 can be positioned in the receiving area 129. Therefore, the bottom of the periphery of the extended portion 25 is supported by the upper surface 1211 of the test pedestal 12a of the test jig 11e, and the outer side surface of the extended portion 25 is restricted by the protruding ring 128.
圖16說明圖14及圖15中所展示之裝置托座2b的立體圖。裝置托座2b類似於圖3及圖4之裝置托座2，其不同處如下所述，裝置托座2b之延伸部分25係為平板，且其具有對應於承接部分21之中心通孔。裝置托座2b可被稱作「帽型(hat type)」。圖14至圖16之裝置托座2b的剛度可比圖3及圖4之裝置托座2承受更大的向下按壓力，且可提供DUT之位置的良好穩定性。Figure 16 illustrates a perspective view of the device holder 2b shown in Figures 14 and 15. The device holder 2b is similar to the device holder 2 of Figs. 3 and 4, the difference being as follows, the extension 25 of the device holder 2b is a flat plate and has a central through hole corresponding to the receiving portion 21. The device holder 2b can be referred to as a "hat type." The stiffness of the device holder 2b of Figures 14-16 can be greater than the downward pressure of the device holder 2 of Figures 3 and 4 and provides good stability of the position of the DUT.
圖17說明根據本新型之一些實施例之測試裝置1b的剖面圖。圖18說明圖17中所展示之測試裝置1b的俯視圖。測試裝置1b包括測試夾具11f（包括例如測試基座12b及反射器14）及裝置托座2c。測試基座12b類似於圖1及圖2之測試基座12，其不同處如下所述，測試基座12b不包括狹槽127。Figure 17 illustrates a cross-sectional view of a test device 1b in accordance with some embodiments of the present invention. Figure 18 illustrates a top view of the test device 1b shown in Figure 17. The test device 1b includes a test fixture 11f (including, for example, a test base 12b and a reflector 14) and a device holder 2c. The test pedestal 12b is similar to the test pedestal 12 of Figures 1 and 2, the difference being described below, the test pedestal 12b does not include the slot 127.
裝置托座2c包括承接部分21c及固體部分(solid portion)26。裝置托座2c係固體塊結構(solid block structure)。裝置托座2c之承接部分21c界定承接空間23及上開口24。承接空間23用於承接或收納DUT。裝置托座2c之上開口24對應於測試夾具11f之測試基座12b的第一開口125及測試夾具11f之反射器14的第一開口145。裝置托座2c之承接部分21c包括至少一個第一信號傳輸部分211c及第二信號傳輸部分212c。第一信號傳輸部分211c連接至第二信號傳輸部分212c，且第一信號傳輸部分211c及第二信號傳輸部分212c一起界定承接空間23。第二信號傳輸部分212c與上開口24相對。如圖17中所展示，第一信號傳輸部分211c可係為承接部分21c之內部側壁，且第二信號傳輸部分212c可係為承接部分21c之內部底壁。The device holder 2c includes a receiving portion 21c and a solid portion 26. The device holder 2c is a solid block structure. The receiving portion 21c of the device holder 2c defines a receiving space 23 and an upper opening 24. The receiving space 23 is used to receive or house the DUT. The opening 24 above the device holder 2c corresponds to the first opening 125 of the test pedestal 12b of the test fixture 11f and the first opening 145 of the reflector 14 of the test fixture 11f. The receiving portion 21c of the device holder 2c includes at least one first signal transmitting portion 211c and a second signal transmitting portion 212c. The first signal transmission portion 211c is connected to the second signal transmission portion 212c, and the first signal transmission portion 211c and the second signal transmission portion 212c together define the receiving space 23. The second signal transmission portion 212c is opposed to the upper opening 24. As shown in Fig. 17, the first signal transmission portion 211c may be the inner side wall of the receiving portion 21c, and the second signal transmission portion 212c may be the inner bottom wall of the receiving portion 21c.
另外，固體部分26可具有上表面261、底部表面262及複數個外部表面263。底部表面262與上表面261相對，且外部表面263在上表面261與底部表面262之間延伸。承接部分21c凹入於上表面261中，且底部表面262面朝向測試基座12b之第二開口126。在一些實施例中，固體部分26可置放於測試基座12b之容納空間123中。因此，裝置托座2c可由測試夾具11f之反射器14的反射表面143支撐，且外部表面263接觸反射器14之反射表面143。在一些實施例中，裝置托座2c之材料可包括塑料、木頭、丙烯酸或氣凝膠。裝置托座2c之大小可大體上等於傳輸空間144之大小，且上表面261可與測試基座12b之上表面1211大體上共面。Additionally, the solid portion 26 can have an upper surface 261, a bottom surface 262, and a plurality of outer surfaces 263. The bottom surface 262 is opposite the upper surface 261 and the outer surface 263 extends between the upper surface 261 and the bottom surface 262. The receiving portion 21c is recessed in the upper surface 261, and the bottom surface 262 faces the second opening 126 of the test base 12b. In some embodiments, the solid portion 26 can be placed in the receiving space 123 of the test base 12b. Therefore, the device holder 2c can be supported by the reflective surface 143 of the reflector 14 of the test fixture 11f, and the outer surface 263 contacts the reflective surface 143 of the reflector 14. In some embodiments, the material of the device holder 2c can comprise plastic, wood, acrylic or aerogel. The device holder 2c can be substantially the same size as the transfer space 144, and the upper surface 261 can be substantially coplanar with the upper surface 1211 of the test base 12b.
圖19說明圖17及圖18中所展示之裝置托座2c的立體圖。裝置托座2c係固體塊結構，且自上表面261至底部表面262漸縮。圖17至19之裝置托座2c的剛度可比圖3至圖4之裝置托座2承受更大的向下按壓力，且提供DUT之位置的極佳穩定性。Figure 19 illustrates a perspective view of the device holder 2c shown in Figures 17 and 18. The device holder 2c is a solid block structure and tapers from the upper surface 261 to the bottom surface 262. The stiffness of the device holder 2c of Figures 17 through 19 can be subjected to greater downward pressing force than the device holder 2 of Figures 3 through 4 and provides excellent stability of the position of the DUT.
圖20說明根據本新型之一些實施例之測試系統3的剖面圖。測試系統3包括測試裝置1、DUT 4、頂部電路板34（例如測試板(test board)）、搬運臂(handler arm)30、夾頭(chuck)32、連接基座(connecting socket)35、轉換器板(convertor board)36、測試器(tester)38、底部電路板50 （例如負載板(load board)）、板加強件(board stiffener)52及測試天線(test antenna)54。圖20之測試裝置1與圖1及圖2之測試裝置1相同，且包括測試夾具11 (包括例如測試基座12及反射器14)及裝置托座2。Figure 20 illustrates a cross-sectional view of a test system 3 in accordance with some embodiments of the present invention. The test system 3 includes a test device 1, a DUT 4, a top circuit board 34 (such as a test board), a handler arm 30, a chuck 32, a connecting socket 35, and a conversion. A converter board 36, a tester 38, a bottom circuit board 50 (e.g., a load board), a board stiffener 52, and a test antenna 54. The test apparatus 1 of FIG. 20 is identical to the test apparatus 1 of FIGS. 1 and 2 and includes a test fixture 11 (including, for example, the test base 12 and the reflector 14) and a device holder 2.
DUT 4安置於裝置托座2之承接空間23中，且DUT 4包括至少一個信號發射源，其對應於第一信號傳輸部分211及第二信號傳輸部分212中之至少一者。信號發射源可具有發射/接收信號之功能。在一些實施例中，DUT 4可係為封裝結構，且可具有第一表面41、與第一表面41相對之第二表面42，及複數個側表面47。DUT 4可包括基板43、至少一個電氣元件44、封裝體(encapsulant)45及天線46。因此，DUT 4係為具有天線之封裝(antenna in package，AiP)。舉例而言，DUT 4可係為諸如毫米波無線模組(mmWave wireless module)之無線模組。在一個實施例中，DUT 4可係為具有30 GHz至80 GHz之頻率的射頻(radio frequency，RF) AiP。The DUT 4 is disposed in the receiving space 23 of the device holder 2, and the DUT 4 includes at least one signal transmitting source corresponding to at least one of the first signal transmitting portion 211 and the second signal transmitting portion 212. The signal transmission source can have the function of transmitting/receiving signals. In some embodiments, the DUT 4 can be a package structure and can have a first surface 41, a second surface 42 opposite the first surface 41, and a plurality of side surfaces 47. The DUT 4 can include a substrate 43, at least one electrical component 44, an encapsulant 45, and an antenna 46. Therefore, the DUT 4 is an antenna in package (AiP). For example, the DUT 4 can be a wireless module such as a mmWave wireless module. In one embodiment, the DUT 4 can be a radio frequency (RF) AiP having a frequency of 30 GHz to 80 GHz.
基板43鄰近於第一表面41，且包括鄰近於其上表面（亦即第一表面41）之複數個電接點431（例如焊球或焊料凸塊）。電氣元件44，諸如半導體晶粒及/或被動元件，電連接至基板43之下表面。封裝體45，諸如模製化合物(molding compound)，覆蓋基板43之下表面及電氣元件44。天線46嵌入於封裝體45中或安置於封裝體45上。亦即，天線46鄰近於DUT 4之第二表面42。天線46之底部部分可自DUT 4之第二表面42曝露，且天線46之側部的一部分可自DUT 4之側表面47曝露。因此，DUT 4之側表面47可係為對應於裝置托座2之第一信號傳輸部分211的信號發射源，且DUT 4之第二表面42可係為對應於裝置托座2之第二信號傳輸部分212的信號發射源。如圖20中所展示，天線46可以是面朝下。The substrate 43 is adjacent to the first surface 41 and includes a plurality of electrical contacts 431 (eg, solder balls or solder bumps) adjacent the upper surface thereof (ie, the first surface 41). Electrical components 44, such as semiconductor dies and/or passive components, are electrically connected to the lower surface of substrate 43. A package 45, such as a molding compound, covers the lower surface of the substrate 43 and the electrical components 44. The antenna 46 is embedded in the package body 45 or disposed on the package body 45. That is, the antenna 46 is adjacent to the second surface 42 of the DUT 4. The bottom portion of the antenna 46 can be exposed from the second surface 42 of the DUT 4, and a portion of the side of the antenna 46 can be exposed from the side surface 47 of the DUT 4. Therefore, the side surface 47 of the DUT 4 can be a signal transmission source corresponding to the first signal transmission portion 211 of the device holder 2, and the second surface 42 of the DUT 4 can be a second signal corresponding to the device holder 2. The signal transmission source of the transmission portion 212. As shown in Figure 20, the antenna 46 can be face down.
轉換器板36安置於測試夾具11之測試基座12的頂部部分（例如上表面1211）上，且位於裝置托座2之延伸部分22上。轉換器板36可包括具有佈局線(layout line)之至少一個電路層361及複數個彈簧式頂針(pogo pins) 362（或其他電連接件）。轉換器板36可呈環形狀，且界定中心通孔以曝露裝置托座2之承接空間21。The converter plate 36 is disposed on a top portion (e.g., upper surface 1211) of the test pedestal 12 of the test fixture 11 and is located on the extended portion 22 of the device holder 2. The converter board 36 can include at least one circuit layer 361 having a layout line and a plurality of spring-loaded pogo pins 362 (or other electrical connectors). The converter plate 36 can be in the shape of a ring and defines a central through hole to expose the receiving space 21 of the device holder 2.
頂部電路板34 （例如印刷電路板(print circuit board，PCB)）安置於測試裝置1之測試基座12的第一開口125上方，且電連接至轉換器板36及DUT 4。在一個實施例中，頂部電路板34經由夾頭32附接至搬運臂30。夾頭32可用於向DUT 4施加吸力。在一個實施例中，頂部電路板34包括至少一個反射部分341，其鄰近於該頂部電路板34下表面以用於反射信號。在一些實施例中，反射部分341可係頂部電路板34之最外部金屬層，且可自保護層曝露。如圖20中所展示，裝置托座2之延伸部分22的一部分安置於測試基座12與頂部電路板34之間。A top circuit board 34 (e.g., a printed circuit board (PCB)) is disposed over the first opening 125 of the test pedestal 12 of the test device 1 and is electrically coupled to the converter board 36 and the DUT 4. In one embodiment, the top circuit board 34 is attached to the transport arm 30 via the collet 32. The collet 32 can be used to apply suction to the DUT 4. In one embodiment, the top circuit board 34 includes at least one reflective portion 341 that is adjacent to the lower surface of the top circuit board 34 for reflecting signals. In some embodiments, the reflective portion 341 can be the outermost metal layer of the top circuit board 34 and can be exposed from the protective layer. As shown in FIG. 20, a portion of the extension 22 of the device holder 2 is disposed between the test pedestal 12 and the top circuit board 34.
連接基座35附接至頂部電路板34之下表面，且包括複數個測試探針351。測試探針351之一端用以接觸DUT 4之電接點431，且測試探針351之另一端用以接觸頂部電路板34。當夾頭32抽吸(suck)DUT 4之第一表面41時，DUT 4可經由電接點431及測試探針351電連接至頂部電路板34。The connection base 35 is attached to the lower surface of the top circuit board 34 and includes a plurality of test probes 351. One end of the test probe 351 is for contacting the electrical contact 431 of the DUT 4, and the other end of the test probe 351 is for contacting the top circuit board 34. When the collet 32 sucks the first surface 41 of the DUT 4, the DUT 4 can be electrically connected to the top circuit board 34 via the electrical contacts 431 and the test probe 351.
測試器38、底部電路板50及板加強件52安置於測試裝置1下方。板加強件52安置於測試器38上且用於支撐底部電路板50。亦即，測試器38經由板加強件52支撐底部電路板50。測試裝置1安置於底部電路板50上。因此，底部電路板50安置於測試裝置1與測試器38之間。底部電路板50界定通孔501，其與測試基座12之第二開口126對準。在一些實施例中，底部電路板50可經由轉換器板36電連接至頂部電路板34。在一些實施例中，底部電路板50可電連接至測試器38。The tester 38, the bottom circuit board 50, and the board reinforcement 52 are disposed below the test apparatus 1. A plate stiffener 52 is disposed on the tester 38 and is used to support the bottom circuit board 50. That is, the tester 38 supports the bottom circuit board 50 via the board reinforcement 52. The test device 1 is placed on the bottom circuit board 50. Therefore, the bottom circuit board 50 is disposed between the test device 1 and the tester 38. The bottom circuit board 50 defines a via 501 that is aligned with the second opening 126 of the test pedestal 12. In some embodiments, the bottom circuit board 50 can be electrically connected to the top circuit board 34 via the converter board 36. In some embodiments, the bottom circuit board 50 can be electrically connected to the tester 38.
測試器38經由轉換器板36電連接至頂部電路板34。測試器38包括測試天線54、降頻轉換器(down converter)381、增頻轉換器(up converter)382、電源供應器383及測試電腦384。測試天線54鄰近於測試基座12之第二開口126。如圖20中所展示，測試天線54之一部分安置於測試基座12之第二開口126中及底部電路板50之通孔501中，以使得測試天線54曝露於傳輸空間144中。舉例而言，測試天線54之類型可係喇叭天線(horn antenna)、平片天線(patch antenna)、陣列天線(array antenna)或射頻單元(radiofrequency unit，RU)。電源供應器383及測試電腦384電連接至轉換器板36及頂部電路板34以控制DUT 4。測試電腦384可包括處理器，且可執行寫在機器可讀媒體(machine-readable medium)上之指令，該等指令在由處理器執行時使得處理器執行本文中所描述之程序，諸如分析電磁信號。Tester 38 is electrically coupled to top circuit board 34 via converter board 36. The tester 38 includes a test antenna 54, a down converter 381, an up converter 382, a power supply 383, and a test computer 384. The test antenna 54 is adjacent to the second opening 126 of the test pedestal 12. As shown in FIG. 20, one portion of the test antenna 54 is disposed in the second opening 126 of the test pedestal 12 and in the through hole 501 of the bottom circuit board 50 such that the test antenna 54 is exposed in the transmission space 144. For example, the type of test antenna 54 can be a horn antenna, a patch antenna, an array antenna, or a radio frequency unit (RU). Power supply 383 and test computer 384 are electrically coupled to converter board 36 and top board 34 to control DUT 4. Test computer 384 can include a processor and can execute instructions written on a machine-readable medium that, when executed by a processor, cause the processor to perform the procedures described herein, such as analyzing electromagnetic signal.
在圖20中所說明之實施例中，測試系統3可測試DUT 4之發射功能及/或接收功能。舉例而言，在第一測試模式下，其係用以測試DUT 4之發射功能。測試器38控制DUT 4以發射高頻波（例如具有約數毫米之波長的毫米波）。自DUT 4發射之高頻波可通過裝置托座2之第一信號傳輸部分211及/或第二信號傳輸部分212，接著被反射器14之反射表面143反射，且接著由測試天線54接收到。接著，來自測試天線54之信號可由降頻轉換器381降至中頻。最後，測試器38可根據對來自降頻轉換器381之信號的分析而判定DUT 4是否達成所要的發射功能。另外，在第二測試模式下，其係用以測試DUT 4之接收功能。測試器38藉由增頻轉換器382將中頻信號處理成高頻信號。接著，測試器38控制測試天線54以發射高頻波(例如毫米波)。自測試天線54發射之高頻波可由反射器14之反射表面143反射、接著通過裝置托座2之第一信號傳輸部分211及/或第二信號傳輸部分212，且接著由DUT 4接收到。最後，測試器38可根據對來自DUT 4之信號的分析而判定DUT 4是否達成所要的接收功能。In the embodiment illustrated in FIG. 20, test system 3 can test the transmit and/or receive functions of DUT 4. For example, in the first test mode, it is used to test the transmit function of the DUT 4. The tester 38 controls the DUT 4 to emit high frequency waves (e.g., millimeter waves having a wavelength of about several millimeters). The high frequency waves emitted from the DUT 4 may pass through the first signal transmission portion 211 and/or the second signal transmission portion 212 of the device holder 2, and then be reflected by the reflective surface 143 of the reflector 14, and then received by the test antenna 54. The signal from test antenna 54 can then be reduced by down converter 381 to the intermediate frequency. Finally, the tester 38 can determine whether the DUT 4 has achieved the desired transmit function based on an analysis of the signal from the down converter 381. In addition, in the second test mode, it is used to test the receiving function of the DUT 4. The tester 38 processes the intermediate frequency signal into a high frequency signal by the upconverter 382. Next, the tester 38 controls the test antenna 54 to emit high frequency waves (e.g., millimeter waves). The high frequency waves emitted from the test antenna 54 may be reflected by the reflective surface 143 of the reflector 14, then passed through the first signal transmission portion 211 and/or the second signal transmission portion 212 of the device holder 2, and then received by the DUT 4. Finally, the tester 38 can determine whether the DUT 4 has achieved the desired receiving function based on an analysis of the signal from the DUT 4.
因此，可在空氣中(例如僅在空氣中)傳輸波。因此，裝置托座2之材料可大體上不會影響測試結果，以使得裝置托座2之材料可以不是測試程序之顯著環境變數。另外，由於反射表面143之設計，傳輸在傳輸空間144中之所有波可由測試天線54或DUT 4接收到。因此，測試裝置1之大小可減小至X×X×X尺寸，其中X係例如約30 cm或更小、約10 cm或更小或約5 cm或更小。測試裝置1之尺寸不必彼此相等。另外，與比較性測試方法相比，此測試方法可在更少時間中執行。因此，此測試裝置1可在大批量生產（亦即，量產）期間用於生產線中。另外，在測試過程中，DUT 4不必旋轉360度，因此，測試裝置1之測試夾具11可更易於設計及製造。Therefore, waves can be transmitted in the air (for example, only in the air). Thus, the material of the device holder 2 may not substantially affect the test results such that the material of the device holder 2 may not be a significant environmental variable of the test procedure. Additionally, due to the design of reflective surface 143, all of the waves transmitted in transmission space 144 may be received by test antenna 54 or DUT 4. Therefore, the size of the test device 1 can be reduced to X x X x X size, wherein X is, for example, about 30 cm or less, about 10 cm or less, or about 5 cm or less. The sizes of the test devices 1 do not have to be equal to each other. In addition, this test method can be performed in less time than the comparative test method. Therefore, the test device 1 can be used in a production line during mass production (i.e., mass production). In addition, the DUT 4 does not have to be rotated 360 degrees during the test, and therefore, the test fixture 11 of the test apparatus 1 can be more easily designed and manufactured.
圖21至圖24說明根據本新型之一些實施例之測試方法。參考圖21，提供了DUT 4、頂部電路板34（例如測試板）、搬運臂30、夾頭32及連接基座35。在一些實施例中，DUT 4可係為封裝結構，且可具有第一表面41、與第一表面41相對之第二表面42，及複數個側表面47。DUT 4可包括基板43、至少一個電氣元件44、封裝體45及天線46。基板43鄰近於第一表面41，且包括自由區域(free area)432及鄰近於DUT 4之上表面（例如第一表面41）的複數個電接點431（例如焊球或焊料凸塊）。自由區域432位於基板43之上表面（例如DUT 4之第一表面41）上，且不具有電接點。因此，自由區域432係供夾頭32接觸之區域。電氣元件44，諸如半導體晶粒或被動元件，電連接至基板43之下表面。封裝體45，諸如模製化合物，覆蓋基板43之下表面及電氣元件44。天線46嵌入於封裝體45中或安置於封裝體45上。亦即，天線46鄰近於DUT 4之第二表面42。天線46之底部部分可自DUT 4之第二表面42曝露，且天線46之側部的一部分可自DUT 4之側表面47曝露。如圖21中所展示，天線46可面朝下。21 through 24 illustrate test methods in accordance with some embodiments of the present invention. Referring to Figure 21, a DUT 4, a top circuit board 34 (e.g., a test board), a transfer arm 30, a collet 32, and a connection base 35 are provided. In some embodiments, the DUT 4 can be a package structure and can have a first surface 41, a second surface 42 opposite the first surface 41, and a plurality of side surfaces 47. The DUT 4 can include a substrate 43, at least one electrical component 44, a package 45, and an antenna 46. The substrate 43 is adjacent to the first surface 41 and includes a free area 432 and a plurality of electrical contacts 431 (eg, solder balls or solder bumps) adjacent to the upper surface of the DUT 4 (eg, the first surface 41). The free area 432 is located on the upper surface of the substrate 43 (e.g., the first surface 41 of the DUT 4) and has no electrical contacts. Therefore, the free area 432 is the area where the chuck 32 contacts. Electrical components 44, such as semiconductor dies or passive components, are electrically connected to the lower surface of substrate 43. A package 45, such as a molding compound, covers the lower surface of the substrate 43 and the electrical components 44. The antenna 46 is embedded in the package body 45 or disposed on the package body 45. That is, the antenna 46 is adjacent to the second surface 42 of the DUT 4. The bottom portion of the antenna 46 can be exposed from the second surface 42 of the DUT 4, and a portion of the side of the antenna 46 can be exposed from the side surface 47 of the DUT 4. As shown in Figure 21, the antenna 46 can face down.
頂部電路板34經由夾頭32附接至搬運臂30。夾頭32用於向DUT 4施加吸力。連接基座35附接至頂部電路板34之下表面，且包括複數個測試探針351。The top circuit board 34 is attached to the transport arm 30 via a collet 32. The collet 32 is used to apply suction to the DUT 4. The connection base 35 is attached to the lower surface of the top circuit board 34 and includes a plurality of test probes 351.
接著，夾頭32在DUT 4之第一表面41的自由區域432上提供吸力321。因此，夾頭32抽吸DUT 4之第一表面41，且DUT 4之電接點431可經由測試探針351電連接至頂部電路板34。Next, the collet 32 provides a suction 321 on the free area 432 of the first surface 41 of the DUT 4. Thus, the collet 32 draws the first surface 41 of the DUT 4 and the electrical contacts 431 of the DUT 4 can be electrically connected to the top circuit board 34 via the test probe 351.
參考圖22及圖23，圖23係圖22之俯視圖。圖22及圖23展示經提供以安置於測試裝置1之測試基座12之頂面1211上的轉換器板36。22 and 23, FIG. 23 is a plan view of FIG. 22 and 23 show converter plate 36 that is provided for placement on top surface 1211 of test susceptor 12 of test device 1.
參考圖24，測試器38、底部電路板50及板加強件52設置為安置於測試裝置1下方。板加強件52安置於測試器38上且用於支撐底部電路板50。測試裝置1安置於底部電路板50上。在一些實施例中，底部電路板50可經由轉換器板36電連接至頂部電路板34。在一些實施例中，底部電路板50可電連接至測試器38。測試器38經由轉換器板36電連接至頂部電路板34。測試器38包括測試天線54、降頻轉換器381、增頻轉換器382、電源供應器383及測試電腦384。Referring to FIG. 24, the tester 38, the bottom circuit board 50, and the board reinforcement 52 are disposed to be disposed under the test apparatus 1. A plate stiffener 52 is disposed on the tester 38 and is used to support the bottom circuit board 50. The test device 1 is placed on the bottom circuit board 50. In some embodiments, the bottom circuit board 50 can be electrically connected to the top circuit board 34 via the converter board 36. In some embodiments, the bottom circuit board 50 can be electrically connected to the tester 38. Tester 38 is electrically coupled to top circuit board 34 via converter board 36. The tester 38 includes a test antenna 54, a down converter 381, an up converter 382, a power supply 383, and a test computer 384.
接著，向下移動由DUT 4、頂部電路板34、搬運臂30、夾頭32與連接基座35所構成之總成(assembly)。因此，如圖20中所展示，DUT 4可安置於測試基座12上之裝置托座2的承接部分21中。裝置托座2容納DUT 4之下表面(例如第二表面42)及DUT 4之側表面47。Next, the assembly formed by the DUT 4, the top circuit board 34, the transfer arm 30, the chuck 32, and the connection base 35 is moved downward. Thus, as shown in FIG. 20, the DUT 4 can be disposed in the receiving portion 21 of the device holder 2 on the test pedestal 12. The device holder 2 houses the lower surface of the DUT 4 (e.g., the second surface 42) and the side surface 47 of the DUT 4.
圖25說明根據本新型之一些實施例之測試系統3的輻射路徑。DUT 4之天線46可係為端射天線(end fire antenna)。由DUT 4發射之波60可由反射器14之反射表面143及頂部電路板34之反射部分341反射，且接著由測試天線54接收到。在一些實施例中，在測試模式下，頻率波60可由測試天線54發射、由反射器14之反射表面413及頂部電路板34之反射部分341反射，且接著由DUT 4接收到。Figure 25 illustrates the radiation path of test system 3 in accordance with some embodiments of the present invention. The antenna 46 of the DUT 4 can be an end fire antenna. The wave 60 emitted by the DUT 4 can be reflected by the reflective surface 143 of the reflector 14 and the reflective portion 341 of the top circuit board 34 and then received by the test antenna 54. In some embodiments, in test mode, frequency wave 60 may be emitted by test antenna 54, reflected by reflective surface 413 of reflector 14 and reflective portion 341 of top circuit board 34, and then received by DUT 4.
圖26說明根據本新型之一些實施例之測試系統3的輻射路徑。DUT 4之天線46可係平片天線。由DUT 4發射之頻率波62可由反射器14之反射表面143及頂部電路板34之反射部分341反射，且接著由測試天線54接收到。在一些實施例中，在測試模式下，頻率波62可由測試天線54發射、由反射器14之反射表面143及頂部電路板34之反射部分341反射，且接著由DUT 4接收到。Figure 26 illustrates the radiation path of test system 3 in accordance with some embodiments of the present invention. The antenna 46 of the DUT 4 can be a flat antenna. The frequency wave 62 emitted by the DUT 4 can be reflected by the reflective surface 143 of the reflector 14 and the reflective portion 341 of the top circuit board 34 and then received by the test antenna 54. In some embodiments, in test mode, frequency wave 62 may be emitted by test antenna 54, reflected by reflective surface 143 of reflector 14 and reflective portion 341 of top circuit board 34, and then received by DUT 4.
圖27說明根據本新型之一些實施例之測試系統3的各種尺寸。如圖27中所展示，測試距離「d」定義為測試天線54與DUT 4之間的距離。測試天線54及DUT 4之操作頻率「F」介於約30吉赫(gigahertz，GHz)至約80 GHz之範圍內。針對λ至2λ進行近場量測(near-field measurement)，其中λ係波長。λ=C/F，其中「C」係光速：3×10 8m / s。將「d」設定成介於「d1」至「d2」之範圍內， Figure 27 illustrates various dimensions of a test system 3 in accordance with some embodiments of the present invention. As shown in FIG. 27, the test distance "d" is defined as the distance between the test antenna 54 and the DUT 4. The operating frequency "F" of the test antenna 54 and the DUT 4 is in the range of about 30 GHz (gigahertz, GHz) to about 80 GHz. Near-field measurement for λ to 2λ, where λ is the wavelength. λ = C / F, where "C" is the speed of light: 3 × 10 8 m / s. Set "d" to be in the range of "d1" to "d2".
d1= λ = C/F；D1= λ = C/F;
d2= 2λ = 2*(C/F)。D2 = 2λ = 2*(C/F).
舉例而言，操作頻率「F」係30 GHz / 60 GHz / 79 GHz，且測試距離「d」可分別如下：For example, the operating frequency "F" is 30 GHz / 60 GHz / 79 GHz, and the test distance "d" can be as follows:
(a)若F = 30 GHz，則d介於d1至d2之範圍內 = 10毫米(mm) ~ 20 mm之範圍內。(a) If F = 30 GHz, then d is in the range of d1 to d2 = 10 mm (mm) ~ 20 mm.
(b)若F = 60 GHz，則d介於d1至d2之範圍內 = 5 mm ~ 10 mm之範圍內。(b) If F = 60 GHz, then d is in the range of d1 to d2 = 5 mm ~ 10 mm.
(c)若F = 79 GHz，則d介於d1至d2之範圍內 = 3.8 mm ~ 7.6 mm之範圍內。(c) If F = 79 GHz, d is in the range of d1 to d2 = 3.8 mm ~ 7.6 mm.
另外，反射器14之反射部分14'之底部表面142的寬度定義為「a」,反射器14之反射部分14'之外部表面141的高度定義為「b」，反射器14之反射部分14'之反射表面143的長度定義為「c」，測試天線54之寬度定義為「X」，測試基座12之容納空間123的寬度定義為「Y」，且底部表面142與反射表面143之間的夾角定義為「θ」。In addition, the width of the bottom surface 142 of the reflective portion 14' of the reflector 14 is defined as "a", the height of the outer surface 141 of the reflective portion 14' of the reflector 14 is defined as "b", and the reflective portion 14' of the reflector 14 The length of the reflective surface 143 is defined as "c", the width of the test antenna 54 is defined as "X", the width of the accommodation space 123 of the test susceptor 12 is defined as "Y", and between the bottom surface 142 and the reflective surface 143 The angle is defined as "θ".
在一些實施例中，可保持關係式a約等於(Y - X) / 2。In some embodiments, the relationship a can be maintained to be approximately equal to (Y - X) / 2.
在一個實施例中，若X = 20 mm，Y = 70 mm，則a =大致25 mm。另外，若d = 20 mm，b = 25 mm，則c 2= a 2+ b 2= 1250，且c係約35.35 mm。應注意，θ在當前描述之實例中係約45度。在一些實施例中，θ可介於約30度至約45度之範圍內。 In one embodiment, if X = 20 mm, Y = 70 mm, then a = approximately 25 mm. In addition, if d = 20 mm, b = 25 mm, then c 2 = a 2 + b 2 = 1250, and c is about 35.35 mm. It should be noted that θ is about 45 degrees in the currently described example. In some embodiments, θ can range from about 30 degrees to about 45 degrees.
在一些實施例中，若X=10 mm，Y = 50 mm，則a約等於20 mm。另外，若d = 45 mm，b = 50 mm，則c 2= a 2+ b 2= 2900，且c係約53.85 mm。應注意，θ可係大於45度。高度b或夾角θ可係為預先設定的。 In some embodiments, if X = 10 mm, Y = 50 mm, then a is approximately equal to 20 mm. In addition, if d = 45 mm, b = 50 mm, then c 2 = a 2 + b 2 = 2900, and c is about 53.85 mm. It should be noted that θ can be greater than 45 degrees. The height b or the angle θ can be set in advance.
圖28說明根據本新型之一些實施例之測試系統3a的示意圖。測試系統3a可包括四個DUT 4、四個頂部電路板34、搬運臂30a、四個測試裝置1及底部電路板50a。DUT 4中之每一者對應於頂部電路板34中之一個別者，且四個DUT 4及四個頂部電路板34可由一個搬運臂30a處理。四個測試裝置1可安置於一個底部電路板50a上。搬運臂30a與四個DUT 4及四個頂部電路板34可以一起移動以覆蓋四個測試裝置1，且DUT 4中之每一者安置於測試裝置1中之每一者中。因此，測試系統3a可實現多點測試(multi-site testing)，且一個測試裝置1中之信號不會顯著地影響鄰近測試裝置1。在一些實施例中，可使用適合之設備以在多點測試中測試多於四個DUT 4或少於四個DUT 4。Figure 28 illustrates a schematic diagram of a test system 3a in accordance with some embodiments of the present invention. The test system 3a can include four DUTs 4, four top circuit boards 34, a transfer arm 30a, four test devices 1 and a bottom circuit board 50a. Each of the DUTs 4 corresponds to one of the top boards 34, and the four DUTs 4 and the four top boards 34 can be processed by one of the carrying arms 30a. Four test devices 1 can be placed on a bottom circuit board 50a. The carrying arm 30a can be moved together with the four DUTs 4 and the four top circuit boards 34 to cover the four test devices 1, and each of the DUTs 4 is disposed in each of the test devices 1. Therefore, the test system 3a can implement multi-site testing, and the signal in one test device 1 does not significantly affect the adjacent test device 1. In some embodiments, suitable equipment can be used to test more than four DUTs 4 or fewer than four DUTs 4 in a multipoint test.
除非另外規定，否則諸如「上方」、「下方」、「向上」、「左邊」、「右邊」、「向下」、「頂部」、「底部」、「垂直」、「水平」、「側」、「更高」、「下部」、「上部」、「上方」、「下面」等空間描述係關於相對於圖中所展示之定向加以指示。應理解，本文中所使用之空間描述僅出於說明之目的，且本文中所描述之結構的實際實施可以任何定向或方式在空間上配置，其限制條件為本新型之實施例的優點不因此配置而有偏差。Unless otherwise specified, such as "above", "below", "up", "left", "right", "down", "top", "bottom", "vertical", "horizontal", "side" Spatial descriptions such as "higher", "lower", "upper", "above", "below" are indicated with respect to the orientation shown in the figure. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and that the actual implementation of the structures described herein may be spatially configured in any orientation or manner, the limitations of which are the advantages of the novel embodiments. Configuration is biased.
如本文中所使用，術語「大約」、「大體上」、「大體」及「約」用以描述及考慮小的變化。當與事件或情形結合使用時，術語可指事件或情形明確發生之情況以及事件或情形極近似於發生之情況。舉例而言，當結合數值使用時，該等術語可指小於或等於該數值之±10%的變化範圍，諸如小於或等於±5%、小於或等於±4%、小於或等於±3%、小於或等於±2%、小於或等於±1%、小於或等於±0.5%、小於或等於±0.1%或者小於或等於±0.05%之變化範圍。舉例而言，若兩個數值之間的差小於或等於該等值之平均值的±10% (諸如小於或等於±5%、小於或等於±4%、小於或等於±3%、小於或等於±2%、小於或等於±1%、小於或等於±0.5%、小於或等於±0.1%、或小於或等於±0.05%)，則可認為該兩個數值「大體上」相同。As used herein, the terms "about", "substantially", "substantially" and "about" are used to describe and contemplate small variations. When used in connection with an event or circumstance, the term can refer to the circumstances in which the event or circumstance occurs explicitly and the event or circumstance is very similar. For example, when used in connection with a value, the terms may mean a range of variation less than or equal to ±10% of the value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, Less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the difference between two values is less than or equal to ±10% of the average of the equivalents (such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or Equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%), the two values are considered to be "substantially" the same.
若兩個表面之間的移位不大於5 μm、不大於2 μm、不大於1 μm或不大於0.5 μm，則可認為兩個表面共面或大體上共面。If the displacement between the two surfaces is no more than 5 μm, no more than 2 μm, no more than 1 μm or no more than 0.5 μm, the two surfaces may be considered to be coplanar or substantially coplanar.
除非上下文另外明確規定，否則如本文所用，單數術語「一(a/an)」及「該」可包括複數個提及物。在對一些實施例之描述中，提供「在」另一組件「上」之組件可涵蓋前一組件直接在後一組件上(例如，與後一組件實體接觸)的狀況以及一或多個介入組件位於前一組件與後一組件之間的狀況。As used herein, the singular terms "a", "the" In the description of some embodiments, a component that provides "on" another component may cover the condition of the previous component directly on the latter component (eg, contact with the latter component entity) and one or more interventions. The condition of the component between the previous component and the latter component.
如本文中所使用，術語「導電(conductive)」、「導電(electrically conductive)」及「電導率(electrical conductivity)」指代傳送電流之能力。導電材料通常指示呈現對於電流流動之極小或零阻力之彼等材料。電導率之一個量度為西門子/公尺(S/m)。通常，導電性材料係具有大於約10 4S/m (諸如至少10 5S/m或至少10 6S/m)之電導率的一種材料。材料之電導率有時可隨溫度變化。除非另外規定，否則在室溫下量測材料之電導率。 As used herein, the terms "conductive,""electricallyconductive," and "electrical conductivity" refer to the ability to carry current. Conductive materials generally indicate their materials that exhibit minimal or zero resistance to current flow. One measure of conductivity is Siemens/meter (S/m). Typically, the electrically conductive material is a material having a conductivity greater than about 10 4 S/m, such as at least 10 5 S/m or at least 10 6 S/m. The conductivity of a material can sometimes vary with temperature. The conductivity of the material was measured at room temperature unless otherwise specified.
另外，有時在本文中按範圍格式呈現量、比率及其他數值。應理解，此類範圍格式係為便利及簡潔起見而使用，且應靈活地理解為不僅包括明確指定為範圍限制之數值，且亦包括涵蓋於彼範圍內之所有個別數值或子範圍，如同明確指定每一數值及子範圍一般。In addition, quantities, ratios, and other values are sometimes presented in a range format herein. It is to be understood that the scope of the present invention is to be construed as being limited to the scope of the Each value and sub-range are explicitly specified.
儘管本新型已參看其特定實施例進行描述及說明，但此等描述及說明並非限制性的。熟習此項技術者應理解，在不脫離如由所附申請專利範圍界定的本新型之真實精神及範疇的情況下，可作出各種改變且可取代等效物。說明可不必按比例繪製。歸因於製造程序及容限，本新型中之藝術再現與實際裝置之間可存在區別。可存在並未特定說明的本新型之其他實施例。應將本說明書及圖式視為說明性而非限制性的。可做出修改，以使特定情形、材料、物質組成、方法或程序適應於本新型之目標、精神及範疇。所有此類修改意欲處於此處附加之申請專利範圍之範疇內。儘管已參考按特定次序所執行之特定操作描述本文中所揭示之方法，但應理解，可在不脫離本新型之教示的情況下組合、細分，或重新定序此等操作以形成等效方法。因此，除非本文中特定地指示，否則操作之次序及分組並非本新型之限制。The description and illustration are to be considered in all respects It will be understood by those skilled in the art that various changes may be made and substituted in the alternatives without departing from the true spirit and scope of the invention as defined by the appended claims. The description may not necessarily be drawn to scale. Due to the manufacturing process and tolerances, there can be differences between the artistic reproduction and the actual device in the present invention. There may be other embodiments of the present invention that are not specifically described. The description and drawings are to be regarded as illustrative and not limiting. Modifications may be made to adapt a particular situation, material, composition, method, or procedure to the objectives, spirit, and scope of the invention. All such modifications are intended to be within the scope of the appended claims. Although the methods disclosed herein have been described with reference to specific operations performed in a particular order, it is understood that the operations can be combined, sub-sequenced, or re-sequenced to form an equivalent method without departing from the teachings of the present invention. . Therefore, the order of operations and groupings are not limited by the present invention unless specifically indicated herein.
1‧‧‧測試裝置1‧‧‧Testing device
1a‧‧‧測試裝置 1a‧‧‧Testing device
1b‧‧‧測試裝置 1b‧‧‧Testing device
2‧‧‧裝置托座 2‧‧‧ device holder
2a‧‧‧裝置托座 2a‧‧‧ device holder
2b‧‧‧裝置托座 2b‧‧‧ device holder
2c‧‧‧裝置托座 2c‧‧‧ device holder
3‧‧‧測試系統 3‧‧‧Test system
3a‧‧‧測試系統 3a‧‧‧Test system
4‧‧‧受測裝置(DUT) 4‧‧‧Device under test (DUT)
11‧‧‧測試夾具 11‧‧‧Test fixture
11a‧‧‧測試夾具 11a‧‧‧Test fixture
11b‧‧‧測試夾具 11b‧‧‧Test fixture
11c‧‧‧測試夾具 11c‧‧‧Test fixture
11d‧‧‧測試夾具 11d‧‧‧Test fixture
11e‧‧‧測試夾具 11e‧‧‧Test fixture
11f‧‧‧測試夾具 11f‧‧‧Test fixture
12‧‧‧測試基座 12‧‧‧Test base
12a‧‧‧測試基座 12a‧‧‧Test base
12b‧‧‧測試基座 12b‧‧‧Test base
14‧‧‧反射器 14‧‧‧ reflector
14'‧‧‧反射部分 14'‧‧‧Reflection
14a‧‧‧反射器 14a‧‧‧ reflector
14b‧‧‧反射器 14b‧‧‧ reflector
14c‧‧‧內環部分 14c‧‧‧ Inner Ring Section
21‧‧‧承接部分 21‧‧‧Acceptance
21c‧‧‧承接部分 21c‧‧‧Acceptance
22‧‧‧延伸部分 22‧‧‧Extension
23‧‧‧承接空間 23‧‧‧Accepting space
24‧‧‧上開口 24‧‧‧Opening
25‧‧‧延伸部分 25‧‧‧Extension
26‧‧‧固體部分 26‧‧‧ solid part
30‧‧‧搬運臂 30‧‧‧Transport arm
30a‧‧‧搬運臂 30a‧‧‧Transport arm
32‧‧‧夾頭 32‧‧‧ chuck
34‧‧‧頂部電路板 34‧‧‧Top board
35‧‧‧連接基座 35‧‧‧Connecting base
36‧‧‧轉換器板 36‧‧‧ converter board
38‧‧‧測試器 38‧‧‧Tester
41‧‧‧第一表面 41‧‧‧ first surface
42‧‧‧第二表面 42‧‧‧ second surface
43‧‧‧基板 43‧‧‧Substrate
44‧‧‧電氣元件 44‧‧‧Electrical components
45‧‧‧封裝體 45‧‧‧Package
46‧‧‧天線 46‧‧‧Antenna
47‧‧‧側表面 47‧‧‧ side surface
50‧‧‧底部電路板 50‧‧‧Bottom board
50a‧‧‧底部電路板 50a‧‧‧Bottom board
52‧‧‧板加強件 52‧‧‧Sheet reinforcement
54‧‧‧測試天線 54‧‧‧Test antenna
60‧‧‧波 60‧‧‧ waves
62‧‧‧頻率波 62‧‧‧frequency waves
113‧‧‧反射表面 113‧‧‧Reflective surface
114‧‧‧傳輸空間 114‧‧‧Transmission space
115‧‧‧第一開口 115‧‧‧ first opening
116‧‧‧第二開口 116‧‧‧second opening
117‧‧‧狹槽 117‧‧‧ slot
118‧‧‧反射材料 118‧‧‧Reflective materials
121‧‧‧側壁 121‧‧‧ side wall
122‧‧‧底壁 122‧‧‧ bottom wall
123‧‧‧容納空間 123‧‧‧ accommodation space
125‧‧‧第一開口 125‧‧‧ first opening
126‧‧‧第二開口 126‧‧‧ second opening
127‧‧‧狹槽 127‧‧‧ slot
128‧‧‧突出環 128‧‧‧ protruding ring
129‧‧‧容納區域 129‧‧‧ accommodating area
141‧‧‧外部表面 141‧‧‧External surface
142‧‧‧底部表面 142‧‧‧ bottom surface
143‧‧‧反射表面 143‧‧‧Reflective surface
144‧‧‧傳輸空間 144‧‧‧Transmission space
144'‧‧‧傳輸空間 144'‧‧‧Transmission space
145‧‧‧第一開口 145‧‧‧ first opening
145a‧‧‧第一開口 145a‧‧‧first opening
145b‧‧‧第一開口 145b‧‧‧first opening
146‧‧‧第二開口 146‧‧‧ second opening
146a‧‧‧第二開口 146a‧‧‧ second opening
146b‧‧‧第二開口 146b‧‧‧ second opening
147‧‧‧彎曲的角落表面 147‧‧‧Bent corner surface
147b‧‧‧第三開口 147b‧‧‧ third opening
148‧‧‧頂面 148‧‧‧ top surface
149‧‧‧反射表面 149‧‧‧Reflective surface
211‧‧‧第一信號傳輸部分 211‧‧‧First signal transmission part
211a‧‧‧第一信號傳輸部分 211a‧‧‧First signal transmission part
211c‧‧‧第一信號傳輸部分 211c‧‧‧first signal transmission part
212c‧‧‧第二信號傳輸部分 212c‧‧‧Second signal transmission part
212‧‧‧第二信號傳輸部分 212‧‧‧Second signal transmission part
261‧‧‧上表面 261‧‧‧ upper surface
262‧‧‧底部表面 262‧‧‧ bottom surface
263‧‧‧外部表面 263‧‧‧External surface
321‧‧‧吸力 321‧‧‧ suction
341‧‧‧反射部分 341‧‧‧Reflection
351‧‧‧測試探針 351‧‧‧Test probe
361‧‧‧電路層 361‧‧‧ circuit layer
362‧‧‧彈簧式頂針 362‧‧‧Spring thimble
381‧‧‧降頻轉換器 381‧‧‧down converter
382‧‧‧增頻轉換器 382‧‧‧Upconverter
383‧‧‧電源供應器 383‧‧‧Power supply
384‧‧‧測試電腦 384‧‧‧Test computer
431‧‧‧電接點 431‧‧‧Electrical contacts
432‧‧‧自由區域 432‧‧‧Free area
501‧‧‧通孔 501‧‧‧through hole
1211‧‧‧上表面 1211‧‧‧ upper surface
2111‧‧‧側向開口 2111‧‧‧ lateral opening
2111a‧‧‧側向開口 2111a‧‧‧ lateral opening
2112‧‧‧第一條帶部分 2112‧‧‧The first strip part
2112a‧‧‧第一條帶部分 2112a‧‧‧The first strip part
2121‧‧‧下開口 2121‧‧‧ opening
2122‧‧‧第二條帶部分 2122‧‧‧Second strip section
a‧‧‧寬度 A‧‧‧width
b‧‧‧高度 B‧‧‧ Height
c‧‧‧長度 C‧‧‧ Length
d‧‧‧測試距離 D‧‧‧test distance
X‧‧‧寬度 X‧‧‧Width
Y‧‧‧寬度 Y‧‧‧Width
θ‧‧‧夾角 Θ‧‧‧ angle
當結合附圖閱讀時，自以下詳細描述易於理解本新型之一些實施例的態樣。應注意，各種結構可能未按比例繪製，且各種結構之尺寸可出於論述清晰起見任意增大或減小。 圖1說明根據本新型之一些實施例之測試裝置的剖面圖。 圖2說明圖1中所展示之測試裝置的俯視圖。 圖3說明圖1之測試裝置之裝置托座的剖面圖。 圖4說明圖3中所展示之裝置托座的立體圖。 圖5說明根據本新型之一些實施例之裝置托座的剖面圖。 圖6說明圖5中所展示之裝置托座的立體圖。 圖7說明圖1之測試裝置之測試基座的立體圖。 圖8說明圖1之測試裝置之反射器的立體圖。 圖9說明圖1之測試裝置之測試夾具的立體圖。 圖10說明根據本新型之一些實施例之測試夾具的剖面圖。 圖11說明根據本新型之一些實施例之測試夾具的剖面圖。 圖12說明根據本新型之一些實施例之測試夾具的剖面圖。 圖13說明根據本新型之一些實施例之測試夾具的剖面圖。 圖14說明根據本新型之一些實施例之測試裝置的剖面圖。 圖15說明圖14中所展示之測試裝置的俯視圖。 圖16說明圖14及圖15中所展示之裝置托座的立體圖。 圖17說明根據本新型之一些實施例之測試裝置的剖面圖。 圖18說明圖17中所展示之測試裝置的俯視圖。 圖19說明圖17及圖18中所展示之裝置托座的立體圖。 圖20說明根據本新型之一些實施例之測試系統的剖面圖。 圖21說明根據本新型之一些實施例之測試方法之實例的一或多個階段。 圖22說明根據本新型之一些實施例之測試方法之實例的一或多個階段。 圖23說明圖22中所展示之測試方法之一或多個階段的俯視圖。 圖24說明根據本新型之一些實施例之測試方法之實例的一或多個階段。 圖25說明根據本新型之一些實施例之測試系統的輻射路徑。 圖26說明根據本新型之一些實施例之測試系統的輻射路徑。 圖27說明根據本新型之一些實施例之測試系統的各種尺寸。 圖28說明根據本新型之一些實施例之測試系統的示意圖。Aspects of some embodiments of the present invention are readily apparent from the following detailed description. It should be noted that various structures may not be drawn to scale, and the dimensions of the various structures may be arbitrarily increased or reduced for clarity of discussion. 1 illustrates a cross-sectional view of a test device in accordance with some embodiments of the present invention. Figure 2 illustrates a top view of the test device shown in Figure 1. Figure 3 illustrates a cross-sectional view of the device holder of the test device of Figure 1. Figure 4 illustrates a perspective view of the device holder shown in Figure 3. Figure 5 illustrates a cross-sectional view of a device holder in accordance with some embodiments of the present invention. Figure 6 illustrates a perspective view of the device holder shown in Figure 5. Figure 7 illustrates a perspective view of the test pedestal of the test device of Figure 1. Figure 8 illustrates a perspective view of the reflector of the test apparatus of Figure 1. Figure 9 illustrates a perspective view of the test fixture of the test apparatus of Figure 1. Figure 10 illustrates a cross-sectional view of a test fixture in accordance with some embodiments of the present invention. Figure 11 illustrates a cross-sectional view of a test fixture in accordance with some embodiments of the present invention. Figure 12 illustrates a cross-sectional view of a test fixture in accordance with some embodiments of the present invention. Figure 13 illustrates a cross-sectional view of a test fixture in accordance with some embodiments of the present invention. Figure 14 illustrates a cross-sectional view of a test device in accordance with some embodiments of the present invention. Figure 15 illustrates a top view of the test device shown in Figure 14. Figure 16 illustrates a perspective view of the device holder shown in Figures 14 and 15. Figure 17 illustrates a cross-sectional view of a test device in accordance with some embodiments of the present invention. Figure 18 illustrates a top view of the test device shown in Figure 17. Figure 19 illustrates a perspective view of the device holder shown in Figures 17 and 18. Figure 20 illustrates a cross-sectional view of a test system in accordance with some embodiments of the present invention. 21 illustrates one or more stages of an example of a test method in accordance with some embodiments of the present invention. Figure 22 illustrates one or more stages of an example of a test method in accordance with some embodiments of the present invention. 23 illustrates a top view of one or more stages of the test method shown in FIG. Figure 24 illustrates one or more stages of an example of a test method in accordance with some embodiments of the present invention. Figure 25 illustrates a radiation path of a test system in accordance with some embodiments of the present invention. Figure 26 illustrates a radiation path of a test system in accordance with some embodiments of the present invention. Figure 27 illustrates various dimensions of a test system in accordance with some embodiments of the present invention. Figure 28 illustrates a schematic diagram of a test system in accordance with some embodiments of the present invention.
Claims (17)
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI734288B (en) * | 2019-12-05 | 2021-07-21 | 鴻勁精密股份有限公司 | Radio frequency electronic component test device and test operation equipment for its application |
| US11205827B2 (en) | 2019-08-16 | 2021-12-21 | Tmy Technology Inc. | Rapid over-the-air production line test platform |
| TWI756139B (en) * | 2019-12-05 | 2022-02-21 | 鴻勁精密股份有限公司 | Rfic testing apparatus and testing equipment using the same |
| CN114167149A (en) * | 2020-09-11 | 2022-03-11 | 株式会社爱德万测试 | Electronic component pressing device and electronic component testing device |
| US11536760B2 (en) | 2017-11-28 | 2022-12-27 | Ase Test, Inc. | Testing device, testing system, and testing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US11536760B2 (en) | 2017-11-28 | 2022-12-27 | Ase Test, Inc. | Testing device, testing system, and testing method |
| TWI805604B (en) * | 2017-11-28 | 2023-06-21 | 台灣福雷電子股份有限公司 | Testing device, testing system, and testing method |
| US11205827B2 (en) | 2019-08-16 | 2021-12-21 | Tmy Technology Inc. | Rapid over-the-air production line test platform |
| TWI751645B (en) * | 2019-08-16 | 2022-01-01 | 稜研科技股份有限公司 | Rapid over-the-air production line test platform |
| TWI734288B (en) * | 2019-12-05 | 2021-07-21 | 鴻勁精密股份有限公司 | Radio frequency electronic component test device and test operation equipment for its application |
| TWI756139B (en) * | 2019-12-05 | 2022-02-21 | 鴻勁精密股份有限公司 | Rfic testing apparatus and testing equipment using the same |
| CN114167149A (en) * | 2020-09-11 | 2022-03-11 | 株式会社爱德万测试 | Electronic component pressing device and electronic component testing device |
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