TWM556336U - Camera module - Google Patents
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- TWM556336U TWM556336U TW105208421U TW105208421U TWM556336U TW M556336 U TWM556336 U TW M556336U TW 105208421 U TW105208421 U TW 105208421U TW 105208421 U TW105208421 U TW 105208421U TW M556336 U TWM556336 U TW M556336U
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本新型涉及一種相機模組，尤其涉及一種用於電磁防護、散熱及不透光的低高度基板設計。The invention relates to a camera module, in particular to a low-level substrate design for electromagnetic protection, heat dissipation and opacity.
由於影像感測器(Sensor)處於相機模組的密閉空間內，當開啟影像處理時影像感測器會產生熱源；並且相機模組在做影像高頻訊號傳輸的時候容易受到外來的電磁波干擾，因此散熱和電磁干擾防護便係相機模組最重要的課題。Since the image sensor is in the confined space of the camera module, the image sensor generates a heat source when the image processing is turned on; and the camera module is susceptible to external electromagnetic interference when performing image high-frequency signal transmission. Therefore, heat dissipation and electromagnetic interference protection are the most important issues of the camera module.
為了解決這兩個課題，相機模組傳統的做法係在基板或是連接器的背部設計導電膠和不銹鋼鋼板，鋼板緊貼基板背部因此影像感測器產生的熱源可以藉由鋼板散熱出去。由於鋼板使用導電膠貼附於基板背部，因此基板背部可以有效地防止電磁干擾。In order to solve these two problems, the conventional method of the camera module is to design a conductive adhesive and a stainless steel plate on the back of the substrate or the connector, and the steel plate is closely attached to the back of the substrate, so that the heat source generated by the image sensor can be dissipated by the steel plate. Since the steel plate is attached to the back of the substrate using a conductive adhesive, the back of the substrate can effectively prevent electromagnetic interference.
惟導電膠加鋼板的設計成本較高，且制程複雜，隨著科學技術的發展，市場上亟需一種簡便、價格更為低廉的的相機模組散熱和電磁干擾防護結構。However, the design cost of conductive rubber plus steel plate is high, and the process is complicated. With the development of science and technology, there is a need for a simple and cheaper camera module heat dissipation and electromagnetic interference protection structure.
有鑒於此，有必要提供一種解決上述技術問題的相機模組。In view of this, it is necessary to provide a camera module that solves the above technical problems.
一種相機模組，包括基板、影像感測晶片、鏡筒及鏡座，所述鏡筒收容於鏡座內，所述影像感測晶片貼覆於基板上，所述基板與所述鏡座遠離所述鏡筒的端面相黏接，所述基板包括相背的上表面、下表面及側面，所述側面連接所述上表面及所述下表面，所述影像感測晶片設置於所述上表面，所述下表面貼覆有電磁干擾防護薄膜，所述電磁干擾防護薄膜上貼覆有接地層。A camera module includes a substrate, an image sensing chip, a lens barrel and a lens holder. The lens barrel is received in the lens holder, and the image sensing wafer is attached to the substrate, and the substrate is away from the lens holder. The end surface of the lens barrel is bonded, the substrate includes opposite upper surfaces, a lower surface, and a side surface, the side surfaces connecting the upper surface and the lower surface, and the image sensing wafer is disposed on the upper surface The surface is coated with an electromagnetic interference protection film, and the electromagnetic interference protection film is coated with a ground layer.
相較於先前技術，本新型提供的相機模組，本新型提供的相機模組，於基板下表面貼覆所述電磁干擾防護薄膜，於電磁干擾防護薄膜上貼覆接地層，由於接地層內均具有複數導電粒子，複數導電粒子能穿透電磁干擾防護薄膜的絕緣層電連接電磁干擾防護薄膜及接地層，而作為電磁防護以及散熱的路徑，具有全面性的電磁防護功能及良好的散熱表現，其制程較為簡便，材料成本上也較傳統的鋼板貼覆便宜。Compared with the prior art, the camera module provided by the present invention provides the camera module, and the electromagnetic interference protection film is attached to the lower surface of the substrate, and the ground layer is attached to the electromagnetic interference protection film due to the ground layer. Each has a plurality of conductive particles, and the plurality of conductive particles can penetrate the insulating layer of the electromagnetic interference protection film to electrically connect the electromagnetic interference protection film and the ground layer, and have comprehensive electromagnetic protection function and good heat dissipation performance as a path of electromagnetic protection and heat dissipation. The process is relatively simple, and the material cost is also cheaper than the traditional steel plate.
圖1係本新型較佳實施方式提供的相機模組的分解示意圖。FIG. 1 is an exploded perspective view of a camera module according to a preferred embodiment of the present invention.
圖2係圖1中的相機模組的局部剖面示意圖。2 is a partial cross-sectional view of the camera module of FIG. 1.
圖3係圖2中的相機模組基板周圍塗布不透光導電銀膠的剖面示意圖。3 is a schematic cross-sectional view showing the application of the opaque conductive silver paste around the camera module substrate of FIG. 2.
圖4係本新型實施方式提供的電磁干擾防護薄膜的剖面示意圖。4 is a schematic cross-sectional view of an electromagnetic interference protection film provided by the new embodiment.
圖5係本新型實施方式提供的接地層的剖面示意圖。FIG. 5 is a schematic cross-sectional view of a ground layer provided by the new embodiment.
圖6係本新型實施方式提供的接地層的導電性粒子穿透電磁干擾防護薄膜中的絕緣層的示意圖接地層。6 is a schematic ground plane of an insulating layer in a conductive layer of an electromagnetic interference shielding film provided by a conductive layer provided by the present embodiment.
圖7係圖2中的相機模組中的接地層貼覆有導電泡棉及金屬框體的局部剖面示意圖。7 is a partial cross-sectional view showing the ground layer of the camera module of FIG. 2 with conductive foam and metal frame attached.
下面結合附圖將對本新型實施方式作進一步的詳細說明。The present invention will be further described in detail below with reference to the accompanying drawings.
請參閱圖1，為本新型實施方式提供的相機模組100。所述相機模組100包括一個基板10、一個影像感測器20、一個墊圈30、一個紅外濾光片40、一個音圈馬達50及一個收容於所述音圈馬達50內的鏡頭模組60。Please refer to FIG. 1 , which is a camera module 100 according to an embodiment of the present invention. The camera module 100 includes a substrate 10 , an image sensor 20 , a gasket 30 , an infrared filter 40 , a voice coil motor 50 , and a lens module 60 received in the voice coil motor 50 . .
請結合圖2，所述基板10為電路板。所述基板10包括一個上表面12、一個下表面14及一個側面16。本實施方式中，所述上表面12平行於所述下表面14，所述側面16垂直於所述上表面12及所述下表面14。Referring to FIG. 2, the substrate 10 is a circuit board. The substrate 10 includes an upper surface 12, a lower surface 14, and a side surface 16. In the present embodiment, the upper surface 12 is parallel to the lower surface 14 , and the side surface 16 is perpendicular to the upper surface 12 and the lower surface 14 .
所述影像感測器20設置於所述基板10上，並與所述基板10電連接。The image sensor 20 is disposed on the substrate 10 and electrically connected to the substrate 10 .
所述墊圈30設置於所述基板10上，並覆蓋所述影像感測器20。所述墊圈30大致呈長方形狀。所述墊圈30中央開設一個凹槽32。所述凹槽32貫穿所述墊圈30。所述凹槽32呈長方體，用於***述紅外濾光片40。The gasket 30 is disposed on the substrate 10 and covers the image sensor 20 . The washer 30 has a substantially rectangular shape. A groove 32 is defined in the center of the washer 30. The groove 32 extends through the gasket 30. The groove 32 is in the shape of a rectangular parallelepiped for receiving the infrared filter 40.
所述紅外濾光片40呈長方體，其大小形狀與所述凹槽32相對應。The infrared filter 40 has a rectangular parallelepiped shape and has a size corresponding to the groove 32.
所述音圈馬達50大致呈長方體狀。所述音圈馬達50覆蓋於所述影像感測器20、所述墊圈30及所述紅外濾光片40上，並與所述基板10電連接。所述音圈馬達50中央設置有一收容槽52。所述收容槽52貫穿所述音圈馬達50相對的兩側表面。所述收容槽52用於容置所述鏡頭模組60。所述收容槽52內側面設置有螺紋結構。The voice coil motor 50 has a substantially rectangular parallelepiped shape. The voice coil motor 50 covers the image sensor 20, the gasket 30 and the infrared filter 40, and is electrically connected to the substrate 10. A receiving slot 52 is disposed in the center of the voice coil motor 50. The receiving groove 52 penetrates the opposite side surfaces of the voice coil motor 50. The receiving slot 52 is configured to receive the lens module 60. A threaded structure is disposed on an inner side surface of the receiving groove 52.
所述鏡頭模組60的形狀大小與所述收容槽52相對應。所述鏡頭模組60外側面設置有與所述收容槽52內側面相對應的螺紋結構，以便所述鏡頭模組60於所述收容槽52內移動。The lens module 60 has a shape corresponding to the receiving groove 52. The outer surface of the lens module 60 is provided with a thread structure corresponding to the inner side surface of the receiving groove 52, so that the lens module 60 moves in the receiving groove 52.
請參閱圖2，所述影像感測器20設置於所述上表面12，位於所述基板10中央。所述下表面14貼覆有電磁干擾防護薄膜70。所述電磁干擾防護薄膜70用於防止電磁波由所述下表面14進入所述基板10。本實施方式中，所述電磁干擾防護薄膜70的厚度為15.1微米。Referring to FIG. 2 , the image sensor 20 is disposed on the upper surface 12 at the center of the substrate 10 . The lower surface 14 is covered with an electromagnetic interference protection film 70. The electromagnetic interference shielding film 70 is for preventing electromagnetic waves from entering the substrate 10 from the lower surface 14. In the embodiment, the electromagnetic interference protection film 70 has a thickness of 15.1 μm.
請參閱圖3，所述側面16上貼覆有不透光的導電銀膠90。所述導電銀膠90延長至所述接地層80，並與所述接地層80電連接接地。所述不透光導電銀膠90覆蓋於所述基板10的側面16，以防止所述相機模組100內部的光線從所述側面16中露出。並且所述導電銀膠90還可以防止所述基板10的側面16免受到電磁干擾的影響。Referring to FIG. 3, the side surface 16 is covered with a light-tight conductive silver paste 90. The conductive silver paste 90 is extended to the ground layer 80 and electrically connected to the ground layer 80 to be grounded. The opaque conductive silver paste 90 covers the side surface 16 of the substrate 10 to prevent light from inside the camera module 100 from being exposed from the side surface 16. And the conductive silver paste 90 can also prevent the side surface 16 of the substrate 10 from being affected by electromagnetic interference.
請參閱圖4，所述電磁干擾防護薄膜70的型號可以任意選擇。為了便於介紹所述電磁干擾防護薄膜70的結構，本實施方式以PC5600為例。所述電磁干擾防護薄膜70包括一個第一異方性導電接著劑層72、一個金屬薄膜層74、一個絕緣層76及一個保護膜78。Referring to FIG. 4, the model of the electromagnetic interference protection film 70 can be arbitrarily selected. In order to facilitate the introduction of the structure of the electromagnetic interference protection film 70, the present embodiment takes the PC 5600 as an example. The electromagnetic interference protection film 70 includes a first anisotropic conductive adhesive layer 72, a metal thin film layer 74, an insulating layer 76, and a protective film 78.
請一併參照圖6，所述第一異方性導電接著劑層72貼覆於所述基板10的下表面14。所述第一異方性導電接著劑層72電連接所述基板10及所述金屬薄膜層74。所述第一異方性導電接著劑層72的厚度為17微米。壓合後，所述第一異方性導電接著劑層72的厚度變為10微米。所述第一異方性導電接著劑層72含有複數導電粒子。所述金屬薄膜層74貼附於所述第一異方性導電接著劑層72上。所述金屬薄膜層74藉由所述第一異方性導電接著劑層72電連接所述基板10。所述金屬薄膜層74用於遮罩電磁波。所述金屬薄膜層74的厚度為0.1微米。所述絕緣層76貼覆於所述金屬薄膜層74上。所述絕緣層76的厚度為5微米。所述絕緣層76包括第一絕緣層及第二絕緣層。所述第一絕緣層貼覆於所述金屬薄膜層74表面。所述保護膜78貼覆於所述第二絕緣層上。所述保護膜的厚度為50微米。所述保護膜78由聚對苯二甲酸(PET)製作而成。所述保護膜78用於保護所述電磁干擾防護薄膜70的原材料，使用時，需將所述保護膜78從所述絕緣層76上撕掉(去除)。Referring to FIG. 6 together, the first anisotropic conductive adhesive layer 72 is attached to the lower surface 14 of the substrate 10. The first anisotropic conductive adhesive layer 72 electrically connects the substrate 10 and the metal thin film layer 74. The first anisotropic conductive adhesive layer 72 has a thickness of 17 microns. After pressing, the thickness of the first anisotropic conductive adhesive layer 72 becomes 10 micrometers. The first anisotropic conductive adhesive layer 72 contains a plurality of conductive particles. The metal thin film layer 74 is attached to the first anisotropic conductive adhesive layer 72. The metal thin film layer 74 is electrically connected to the substrate 10 by the first anisotropic conductive adhesive layer 72. The metal thin film layer 74 is used to cover electromagnetic waves. The metal thin film layer 74 has a thickness of 0.1 μm. The insulating layer 76 is attached to the metal thin film layer 74. The insulating layer 76 has a thickness of 5 micrometers. The insulating layer 76 includes a first insulating layer and a second insulating layer. The first insulating layer is attached to the surface of the metal thin film layer 74. The protective film 78 is attached to the second insulating layer. The protective film has a thickness of 50 μm. The protective film 78 is made of polyethylene terephthalate (PET). The protective film 78 is used to protect the raw material of the electromagnetic interference protection film 70. In use, the protective film 78 is torn off (removed) from the insulating layer 76.
請參閱圖2，所述電磁干擾防護薄膜70上貼覆有接地層80。所述接地層80的厚度為13微米。Referring to FIG. 2 , the electromagnetic interference protection film 70 is pasted with a ground layer 80 . The ground layer 80 has a thickness of 13 microns.
請參閱圖5，所述接地層80的型號可以任意選擇。為了便於介紹所述接地層80的結構，本實施方式以FGF500為例。所述接地層80包括一個第二異方性導電接著劑層82、一個銅箔層84、一個電鍍層86及一個保護膜88。Referring to FIG. 5, the type of the ground layer 80 can be arbitrarily selected. In order to facilitate the introduction of the structure of the ground layer 80, the present embodiment takes the FGF500 as an example. The ground layer 80 includes a second anisotropic conductive adhesive layer 82, a copper foil layer 84, a plating layer 86, and a protective film 88.
請一併參照圖6，所述第二異方性導電接著劑層82貼覆於所述絕緣層76表面。所述第二異方性導電接著劑層82的厚度為6微米。所述銅箔層84貼附於所述第二異方性導電接著劑層82上。所述第二異方性導電接著劑層82中含有複數導電粒子820。所述銅箔層84的厚度為6微米。所述銅箔層84貼覆於所述第二異方性導電接著劑層82上。所述電鍍層86貼覆於所述銅箔層84表面。所述電鍍層86用於保護所述銅箔層84，防止所述銅箔層84發生氧化。所述電鍍層86的厚度為1微米。所述保護膜88貼覆於所述電鍍層86上。所述保護膜的厚度為64微米。所述保護膜88由聚對苯二甲酸(PET)製作而成。所述保護膜88用於保護所述接地層80的原材料，組裝使用時需將所述保護膜88撕掉(去除)。本實施方式中，所述保護膜88為一層藍色的補強膜。Referring to FIG. 6 together, the second anisotropic conductive adhesive layer 82 is applied to the surface of the insulating layer 76. The second anisotropic conductive adhesive layer 82 has a thickness of 6 μm. The copper foil layer 84 is attached to the second anisotropic conductive adhesive layer 82. The second anisotropic conductive adhesive layer 82 contains a plurality of conductive particles 820. The copper foil layer 84 has a thickness of 6 microns. The copper foil layer 84 is attached to the second anisotropic conductive adhesive layer 82. The plating layer 86 is attached to the surface of the copper foil layer 84. The plating layer 86 serves to protect the copper foil layer 84 from oxidation of the copper foil layer 84. The plating layer 86 has a thickness of 1 micrometer. The protective film 88 is attached to the plating layer 86. The protective film has a thickness of 64 μm. The protective film 88 is made of polyethylene terephthalate (PET). The protective film 88 is used to protect the raw material of the ground layer 80, and the protective film 88 needs to be torn off (removed) when assembled and used. In the present embodiment, the protective film 88 is a blue reinforced film.
請參閱圖6，所述第二異方性導電接著劑層82貼覆於所述絕緣層76表面。使用所述相機模組100時，所述複數導電粒子820能夠刺穿所述電磁干擾防護薄膜70的絕緣層76，電連接所述第二異方性導電接著劑層82與所述金屬薄膜層74。本實施方式中所述複數導電粒子820能穿透所述金屬薄膜層74，到達所述第一異方性導電接著劑層72表面。在其它實施方式中，所述複數導電粒子820可以不穿透所述金屬薄膜層74，僅到達所述金屬薄膜層74表面。同理，所述第一異方性導電接著劑層72內的複數導電粒子同樣能夠刺穿所述金屬薄膜層74及所述電磁干擾防護薄膜70的絕緣層76，到達所述第二異方性導電接著劑層82表面，電連接所述第二異方性導電接著劑層82。在本實施方式中，所述第一異方性導電接著劑層72內的複數導電粒子可以不穿透所述金屬薄膜層74，僅存在於所述第一異方性導電接著劑層72內。Referring to FIG. 6, the second anisotropic conductive adhesive layer 82 is attached to the surface of the insulating layer 76. When the camera module 100 is used, the plurality of conductive particles 820 can pierce the insulating layer 76 of the electromagnetic interference protection film 70, electrically connecting the second anisotropic conductive adhesive layer 82 and the metal thin film layer. 74. In the embodiment, the plurality of conductive particles 820 can penetrate the metal thin film layer 74 to reach the surface of the first anisotropic conductive adhesive layer 72. In other embodiments, the plurality of conductive particles 820 may not penetrate the metal thin film layer 74 and only reach the surface of the metal thin film layer 74. Similarly, the plurality of conductive particles in the first anisotropic conductive adhesive layer 72 can also pierce the metal thin film layer 74 and the insulating layer 76 of the electromagnetic interference protection film 70 to reach the second opposite side. The surface of the conductive adhesive layer 82 is electrically connected to the second anisotropic conductive adhesive layer 82. In this embodiment, the plurality of conductive particles in the first anisotropic conductive adhesive layer 72 may not penetrate the metal thin film layer 74 and exist only in the first anisotropic conductive adhesive layer 72. .
如此，所述基板10中的露銅可以由所述第一異方性導電接著劑層72中的導電粒子、所述電磁干擾防護薄膜70中的金屬薄膜層74及所述接地層80中的導電粒子820共地到表面的所述電鍍層86。As such, the exposed copper in the substrate 10 may be composed of conductive particles in the first anisotropic conductive adhesive layer 72, the metal thin film layer 74 in the electromagnetic interference protection film 70, and the ground layer 80. Conductive particles 820 are common to the plating layer 86 of the surface.
請參考圖6，所述導電粒子820的截面形狀為正十方體。在其他實施方式中所述導電粒子820的截面可以為其他任何形狀，如圖7所示的橢圓形，但並不以此為限。Referring to FIG. 6, the cross-sectional shape of the conductive particles 820 is a regular square. In other embodiments, the cross section of the conductive particles 820 may be any other shape, such as an ellipse as shown in FIG. 7, but is not limited thereto.
請參閱圖7，整個相機模組100可以利用導電泡棉92接觸所述接地層80共地。具體地，所述導電泡棉92貼附於所述電鍍層86遠離所述電磁干擾防護薄膜70的表面。提供一金屬框體95，將所述金屬框體95藉由所述導電泡棉92固定連接於所述電鍍層86上。所述基板10與所述金屬框體95共地。所述影像感測器20在運行過程中產生的熱源可以藉由所述電磁干擾防護薄膜70、所述接地層80、所述導電泡棉92及所述金屬框體95傳導出所述相機模組100。Referring to FIG. 7, the entire camera module 100 can be electrically connected to the ground layer 80 by using conductive foam 92. Specifically, the conductive foam 92 is attached to the surface of the plating layer 86 away from the electromagnetic interference protection film 70. A metal frame 95 is provided, and the metal frame 95 is fixedly connected to the plating layer 86 by the conductive foam 92. The substrate 10 is co-located with the metal frame 95. The heat source generated by the image sensor 20 during operation may be conducted out of the camera module by the electromagnetic interference protection film 70, the ground layer 80, the conductive foam 92, and the metal frame 95. Group 100.
進一步地，在其它實施方式中，所述接地層80可以不需要在所述相機模組100背面整面貼附，只需要挑選所述電磁干擾防護薄膜70需要接觸電子產品機殼的地方貼附；位置上和設計上都可以很自由的調配設計，無需整個基板10的下表面14露銅而不能走線，充分利用整個基板10的下表面14。Further, in other embodiments, the ground layer 80 may not need to be attached to the entire surface of the camera module 100, and only needs to select the place where the electromagnetic interference protection film 70 needs to be in contact with the electronic product casing. Both the position and the design can be freely configured without the need for the lower surface 14 of the entire substrate 10 to be exposed to copper and cannot be routed, making full use of the lower surface 14 of the entire substrate 10.
本新型提供的相機模組100，於所述基板10下表面14貼覆所述電磁干擾防護薄膜70，於所述電磁干擾防護薄膜70上貼覆所述接地層80，由於所述接地層80內均具有複數導電粒子820，所述複數導電粒子820能穿透所述電磁干擾防護薄膜70的絕緣層76電連接所述電磁干擾防護薄膜70及所述接地層80，而作為電磁防護以及散熱的路徑，具有全面性的電磁防護功能及良好的散熱表現，其厚度及重量遠遠低於傳統的鋼板藉由導電膠貼覆於基板10上的設計時的厚度及重量，材料成本上也較傳統的鋼板貼覆便宜，並且所述基板10佈局走線及與整機接觸的設計彈性較大。The camera module 100 of the present invention attaches the electromagnetic interference protection film 70 to the lower surface 14 of the substrate 10, and the ground layer 80 is attached to the electromagnetic interference protection film 70, because the ground layer 80 Each of the plurality of conductive particles 820 can penetrate the insulating layer 76 of the electromagnetic interference protection film 70 to electrically connect the electromagnetic interference protection film 70 and the ground layer 80, and serve as electromagnetic protection and heat dissipation. The path has a comprehensive electromagnetic protection function and good heat dissipation performance, and its thickness and weight are far lower than the thickness and weight of the conventional steel plate which is coated on the substrate 10 by the conductive adhesive, and the material cost is also higher. The conventional steel plate is inexpensive to apply, and the layout of the substrate 10 and the design of the contact with the whole machine are relatively flexible.
綜上所述，本新型確已符合新型專利之要件，遂依法提出專利申請。惟，以上所述者僅為本新型之較佳實施方式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本新型之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。In summary, the new model has indeed met the requirements of the new patent, and has filed a patent application in accordance with the law. However, the above is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application in this case. Equivalent modifications or variations made by persons familiar with the skill of the present invention in light of the spirit of the present invention are intended to be included in the scope of the following claims.
100‧‧‧相機模組100‧‧‧ camera module
10‧‧‧基板10‧‧‧Substrate
12‧‧‧上表面12‧‧‧ upper surface
14‧‧‧下表面14‧‧‧ Lower surface
16‧‧‧側面16‧‧‧ side
20‧‧‧影像感測器20‧‧‧Image Sensor
30‧‧‧墊圈30‧‧‧Washers
32‧‧‧凹槽32‧‧‧ Groove
40‧‧‧紅外濾光片40‧‧‧Infrared filter
50‧‧‧音圈馬達50‧‧‧ voice coil motor
52‧‧‧收容槽52‧‧‧ housing trough
60‧‧‧鏡頭模組60‧‧‧Lens module
70‧‧‧電磁干擾防護薄膜70‧‧‧Electromagnetic interference protective film
72‧‧‧第一異方性導電接著劑層72‧‧‧First anisotropic conductive adhesive layer
74‧‧‧金屬薄膜層74‧‧‧Metal film layer
76‧‧‧絕緣層76‧‧‧Insulation
78‧‧‧保護膜78‧‧‧Protective film
80‧‧‧接地層80‧‧‧ Grounding layer
82‧‧‧第二異方性導電接著劑層82‧‧‧Second anisotropic conductive adhesive layer
820‧‧‧導電粒子820‧‧‧ conductive particles
84‧‧‧銅箔層84‧‧‧copper layer
86‧‧‧電鍍層86‧‧‧Electroplating
88‧‧‧保護膜88‧‧‧Protective film
90‧‧‧導電銀膠90‧‧‧ Conductive silver glue
92‧‧‧導電泡棉92‧‧‧conductive foam
95‧‧‧金屬框體95‧‧‧Metal frame
【生物材料寄存】【Biomaterial Storage】
無no
Claims (9)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620497657.8U CN205792909U (en) | 2016-05-27 | 2016-05-27 | Camera module |
| ??201620497657.8 | 2016-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM556336U true TWM556336U (en) | 2018-03-01 |
Family
ID=57407293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105208421U TWM556336U (en) | 2016-05-27 | 2016-06-03 | Camera module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205792909U (en) |
| TW (1) | TWM556336U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI734986B (en) * | 2018-12-04 | 2021-08-01 | 日商Ｓｍｋ股份有限公司 | Connector module for camera |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110796948B (en) * | 2019-10-30 | 2022-03-22 | 维沃移动通信有限公司 | Display module, electronic equipment and display module processing method |
| CN110955105B (en) * | 2019-12-20 | 2021-05-28 | 青岛海信激光显示股份有限公司 | Laser projection device |
| JP7364516B2 (en) | 2020-03-27 | 2023-10-18 | 京セラ株式会社 | Circuit board and imaging module |
-
2016
- 2016-05-27 CN CN201620497657.8U patent/CN205792909U/en not_active Expired - Fee Related
- 2016-06-03 TW TW105208421U patent/TWM556336U/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI734986B (en) * | 2018-12-04 | 2021-08-01 | 日商Ｓｍｋ股份有限公司 | Connector module for camera |
Also Published As
| Publication number | Publication date |
|---|---|
| CN205792909U (en) | 2016-12-07 |
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