TWM552123U - Heat dissipating structure of computer chassis - Google Patents
Heat dissipating structure of computer chassis Download PDFInfo
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- TWM552123U TWM552123U TW106211160U TW106211160U TWM552123U TW M552123 U TWM552123 U TW M552123U TW 106211160 U TW106211160 U TW 106211160U TW 106211160 U TW106211160 U TW 106211160U TW M552123 U TWM552123 U TW M552123U
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Description
本新型為提供一種電腦機箱的散熱技術,尤指一種具有絕佳散熱功效,且具有美觀及可以輕易的看到殼體內部之狀態的電腦機箱散熱結構。 The present invention provides a heat dissipation technology for a computer case, and particularly relates to a computer case heat dissipation structure that has excellent heat dissipation performance and is aesthetically pleasing and can easily see the state inside the casing.
按,近年來隨著電腦科技的突飛猛進,使得電腦之運作速度不斷地提高,並且電腦主機內部的電子元件的發熱功率(heat generation rate)亦不斷地攀升。為了預防電腦主機內部的電子元件過熱,而導致電子元件發生暫時性或永久性的失效,所以提供足夠的散熱效能至電腦內部的電子元件將變得非常重要。 In recent years, with the rapid advancement of computer technology, the operation speed of computers has been continuously improved, and the heat generation rate of electronic components inside computer mainframes has continuously increased. In order to prevent the electronic components inside the computer host from overheating, causing temporary or permanent failure of the electronic components, it will become very important to provide sufficient heat dissipation performance to the electronic components inside the computer.
傳統的桌上型電腦由於標準化的主機板(如ATX/u-ATX/Mini-itx等)的限制,將所有主要產生熱能的元件,例如中央處理單元(Central Processing Unit,CPU)、顯示卡、硬碟、電源供應器等元件,全部集中放置於同一個空間中,之後再統一將這些熱能排出。因此,所有的熱源無法迅速有效地排出,或者是,發生區域性熱蓄積的情形。 Traditional desktop computers rely on standardized motherboards (such as ATX/u-ATX/Mini-itx, etc.) to convert all components that generate heat, such as central processing units (CPUs), graphics cards, The components such as the hard disk and the power supply are all placed in the same space, and then the heat is uniformly discharged. Therefore, all the heat sources cannot be discharged quickly and efficiently, or a regional heat accumulation occurs.
再者,這些熱源之間也會發生相互干擾的狀況,而使得殼體內的溫度不斷上升,且導致電腦主機的散熱效率降低。 Moreover, the mutual interference between these heat sources may cause the temperature inside the casing to rise continuously, and the heat dissipation efficiency of the computer main body is lowered.
此外,一般的電腦機殼之正面通常為其短邊處,當擺放的位置不夠深時,將會導致電腦機殼突出一截在外面,非常難看,且一般電腦機殼在放置時,通常是短邊為正面的地方向使用者,因此使用者較不會也無法去觀察電腦機殼內部的狀態。 In addition, the front of a typical computer case is usually at its short side. When the position is not deep enough, it will cause the computer case to protrude outside, which is very ugly, and usually when the computer case is placed, usually The short side is the front direction of the user, so the user is less likely to observe the state inside the computer case.
是以,要如何解決上述習用之問題與缺失,即為本新型之創作人與從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above problems and problems in the past, that is, the creators of the new type and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.
故,本新型之申請人有鑑於上述缺失,乃蒐集相關資料,經由多方評估及考量,並以從事於此行業累積之多年經驗,經由不斷試作及修改,始設計出此種具有絕佳散熱功效,且具有美觀及可以輕易的看到殼體內部之狀態的電腦機箱散熱結構的新型專利者。 Therefore, in view of the above-mentioned shortcomings, the applicants of this new type have collected relevant information, and through multi-party evaluation and consideration, and through years of experience in the industry, through continuous trial and modification, they have designed this excellent heat dissipation effect. A new patent holder with a beautiful appearance and a heat dissipation structure of a computer case that can easily see the state inside the casing.
本新型之主要目的在於:透過控制元件設於殼體之長邊處之技術,以達到讓使用者可清楚且輕易的觀察殼體內部的狀態,且有別於一般電腦機殼的擺設方式。 The main purpose of the present invention is to enable the user to clearly and easily observe the state of the interior of the casing through the technique of the control element being disposed at the long side of the casing, which is different from the general computer casing.
本新型之主要目的在於:透過隔板之設計,達到得以將介面卡及中央處理器分開散熱,達到提升散熱之效果。 The main purpose of the present invention is to achieve the effect of improving the heat dissipation by dissipating the interface card and the central processing unit separately through the design of the partition plate.
本新型之主要目的在於:透過蓋體以旋轉方式開啟,以達到無須找尋擺放蓋體的地方,避免佔用空間。 The main purpose of the novel is to open the cover through the cover body so as to avoid the need to find a place for placing the cover body and avoid occupying space.
本新型之主要目的在於:透過散熱門組之設計,得以強化散熱功能,達到具有更多散熱管道之優勢。 The main purpose of the new model is to enhance the heat dissipation function through the design of the heat dissipation door group to achieve the advantage of having more heat dissipation pipes.
本新型能夠達成上目的之主要結構包括一殼體,殼體在位於長邊處設有至少一控制元件,且在殼體內具有一隔板,以隔離出第一散熱空間及第二散熱空間,並第一散熱空間對應設有一第一風扇組,而第二散熱空間對應設有一第二風扇組,另外,殼體一側樞設有一蓋體,讓蓋體透過樞設方式得以在殼體上進行旋轉開啟或關閉,此外,殼體上還活動設有一散熱門組。藉此,俾當殼體內的介面卡及中央處理器欲進行散熱時,其介面卡可經由第一風扇組讓介面卡所散發出來的熱能得以由第一散熱空間帶離出,而中央處理器則由第二風扇組讓中央處理器所散發出來的熱能得以由第二散熱空間帶離出,達到獨立散熱不相互干擾之優勢,而若散熱效果想要更加強時,則可打開散熱門組讓熱流可從此處排出,另外,因控制元件設於長邊處,因此在擺放殼體時可橫向擺放,讓殼體長邊處面向使用者方向,讓使用者可清楚看到殼體內部狀態,以當發生問題時可即時處理。 The main structure of the present invention for achieving the above object includes a casing having at least one control element at a long side and a partition in the casing to isolate the first heat dissipation space and the second heat dissipation space. The first heat dissipation space is correspondingly provided with a first fan group, and the second heat dissipation space is correspondingly provided with a second fan group. In addition, a cover body is pivotally disposed on one side of the housing, so that the cover body can be pivoted on the housing. The rotation is turned on or off, and in addition, a heat dissipation door group is also disposed on the housing. Therefore, when the interface card in the casing and the central processing unit are to dissipate heat, the interface card can allow the thermal energy emitted by the interface card to be separated from the first heat dissipation space via the first fan group, and the central processor The second fan group allows the thermal energy emitted by the central processing unit to be separated from the second heat dissipation space, so that the independent heat dissipation does not interfere with each other, and if the heat dissipation effect is to be strengthened, the heat dissipation door group can be opened. The heat flow can be discharged from here. In addition, since the control element is arranged at the long side, the housing can be placed laterally when the housing is placed, so that the long side of the housing faces the user, so that the user can clearly see the inside of the housing. The status of the department, so that it can be processed immediately when a problem occurs.
藉由上述技術,可針對習用電腦機殼所存在之正面通常為其短邊處,當擺放的位置不夠深時,將會導致電腦機殼突出一截在外面,非常難看,且一般電腦機殼在放置時,通常是短邊為正面的地方向使用者,因此使用者較不會也無法去觀察電腦機殼內部的狀態的問題點加以突破,達到本新型如上述優點之實 用進步性。 With the above technology, the front side of the conventional computer case can be usually short-side, and when the position is not deep enough, the computer case will be protruded outside, which is very ugly, and the general computer machine When the shell is placed, usually the short side is the front direction of the user, so the user can not see the problem of the state inside the computer case to break through, and achieve the advantages of the present invention. Use progressive.
1‧‧‧殼體 1‧‧‧shell
10‧‧‧短邊 10‧‧‧ Short side
11‧‧‧插置區域 11‧‧‧Interposed area
12‧‧‧擋片 12‧‧ ‧Flap
13‧‧‧樞軸部 13‧‧‧ pivot
14‧‧‧隔板 14‧‧‧Baffle
141‧‧‧第一散熱空間 141‧‧‧First cooling space
142‧‧‧第二散熱空間 142‧‧‧Second heat dissipation space
2‧‧‧控制元件 2‧‧‧Control elements
3‧‧‧蓋體 3‧‧‧ cover
31‧‧‧轉軸部 31‧‧‧ shaft part
32‧‧‧按鈕開關 32‧‧‧ button switch
4‧‧‧散熱門組 4‧‧‧Dissipation door group
41‧‧‧限位件 41‧‧‧Limited parts
42‧‧‧門板 42‧‧‧ door panel
421‧‧‧撥動部 421‧‧‧The Ministry of Movement
43‧‧‧嵌槽 43‧‧‧Inlay
5‧‧‧第一風扇組 5‧‧‧First fan group
6‧‧‧第二風扇組 6‧‧‧Second fan set
7‧‧‧電路板 7‧‧‧ boards
71‧‧‧介面卡 71‧‧‧Interface card
72‧‧‧中央處理器 72‧‧‧Central processor
8‧‧‧維修蓋 8‧‧‧Maintenance cover
81‧‧‧按鍵開關 81‧‧‧Key switch
第一圖 係為本新型較佳實施例之立體圖。 The first figure is a perspective view of a preferred embodiment of the present invention.
第二圖 係為本新型較佳實施例之透視圖。 The second drawing is a perspective view of a preferred embodiment of the present invention.
第三圖 係為本新型較佳實施例之隔板示意圖。 The third figure is a schematic view of the partition of the preferred embodiment of the present invention.
第四圖 係為本新型較佳實施例之散熱門組示意圖。 The fourth figure is a schematic view of the heat dissipation door set of the preferred embodiment of the present invention.
第五圖 係為本新型較佳實施例之蓋體樞軸示意圖。 Figure 5 is a schematic view of the pivot of the cover body of the preferred embodiment of the present invention.
第六圖 係為本新型較佳實施例之開啟蓋體示意圖。 Figure 6 is a schematic view of the opening cover of the preferred embodiment of the present invention.
第七圖 係為本新型較佳實施例之散熱風向示意圖。 Figure 7 is a schematic view of the heat dissipation direction of the preferred embodiment of the present invention.
第八圖 係為本新型較佳實施例之殼體橫向擺放示意圖。 The eighth figure is a schematic view of the lateral arrangement of the casing of the preferred embodiment of the present invention.
第九圖 係為本新型較佳實施例之開啟維修蓋示意圖。 Figure 9 is a schematic view of the opening of the maintenance cover of the preferred embodiment of the present invention.
為達成上述目的及功效,本新型所採用之技術手段及構造,茲繪圖就本新型較佳實施例詳加說明其特徵與功能如下,俾利完全了解。 In order to achieve the above objects and effects, the technical means and structure adopted by the present invention are described in detail in the preferred embodiment of the present invention, and the features and functions thereof are as follows.
請參閱第一圖至第五圖所示,係為本新型較佳實施例之立體圖至蓋體樞軸示意圖,由圖中可清楚看出本新型係包括:一殼體1,殼體1上具有一供介面卡連接器裸露之插置區域11,且與下述散熱門組4位於同一側處,並插置區域11上設有數個擋片12,另外殼體1上具有至少一樞軸部13;至少一設於該殼體1之長邊處的控制元件2;一位於該殼體1內之隔板14,以將該殼體1內分隔成第一散熱空間141及第二散熱空間142,且隔板14乃以組接或一體成形方式設於殼體1上;一樞設於該殼體1一側之蓋體3,以藉活動旋轉於該殼體1之短邊10處上,且蓋體3上具有至少一轉軸部31,該樞軸部13及該轉軸部31乃相互套設樞接,另外蓋體3一側處具有一按鈕開關32,以便開閉該蓋體3;一活動設於該殼體1上之散熱門組4,散熱門組4包含有至少一設於該殼體1上之限位件41、一門板42、及至少一界定於該門板42上之嵌槽43 ,該嵌槽43乃與該限位件41相互嵌合,且門板42上具有一撥動部421;一設於該殼體1上且位置對應該第一散熱空間141之第一風扇組5;一設於該殼體1上且位置對應該第二散熱空間142之第二風扇組6;一設於該殼體1上並與該蓋體3在不同側處的維修蓋8,其維修蓋8一側處具有一按鍵開關81,以便開閉該維修蓋8。 Please refer to the first to fifth figures, which are perspective views of the preferred embodiment of the present invention, to the pivot of the cover body. It can be clearly seen from the figure that the present invention comprises: a housing 1 on the housing 1 There is an insertion area 11 for the interface card connector exposed, and is located at the same side as the heat dissipation door group 4 described below, and the insertion area 11 is provided with a plurality of blocking pieces 12, and the housing 1 has at least one pivot a portion 13; at least one control element 2 disposed at a long side of the casing 1; a partition 14 located in the casing 1 to partition the interior of the casing 1 into a first heat dissipation space 141 and a second heat dissipation a space 142, and the partition plate 14 is disposed on the casing 1 in a combined or integrally formed manner; a cover body 3 pivoted on one side of the casing 1 is rotatably movable to the short side 10 of the casing 1 The cover body 3 has at least one shaft portion 31. The pivot portion 13 and the shaft portion 31 are pivotally connected to each other, and a button switch 32 is provided at one side of the cover body 3 to open and close the cover body. 3; a heat dissipation door group 4 disposed on the casing 1 , the heat dissipation door group 4 includes at least one limiting member 41 , a door panel 42 , and at least one disposed on the casing 1 43 fitted on the groove due to the door panel 42 of The bracket 43 is fitted to the limiting member 41, and the door panel 42 has a dialing portion 421; a first fan group 5 disposed on the housing 1 and corresponding to the first heat dissipation space 141 a second fan set 6 disposed on the housing 1 and corresponding to the second heat dissipation space 142; a maintenance cover 8 disposed on the housing 1 and at a different side from the cover 3, the maintenance thereof A button switch 81 is provided at one side of the cover 8 to open and close the service cover 8.
請同時配合參閱第一圖至第八圖所示,係為本新型較佳實施例之立體圖至殼體橫向擺放示意圖,由圖中可清楚看出,本實施例之殼體1內乃進一步收容有電路板7及插設在電路板7上的介面卡71,以及與電路板7電性連結之中央處理器72,其中央處理器72,而控制元件2係為電路板7的電源開關或重置鍵等,如此,當使用者欲擺放殼體1時,因控制元件2設在殼體1的短邊10,因此使用者可將殼體1橫向擺放,且殼體1為透明時,更可直接觀察殼體1內部的介面卡71與中央處理器72等運作狀態,舉如狀態燈號顯示顏色等;另外當利用控制元件2開啟電路板7及介面卡71時,其開始運作而產生熱能,此時,因隔板14將介面卡71及中央處理器72的散熱通道分離,因此當第一風扇組5運作時可以獨立將介面卡71所排放出來的熱流經由第一散熱空間141排出,而第二風扇組6則可以獨立將中央處理器72所排放出來的熱流經由第二散熱空間142排出,達到獨立散熱,以強化散熱功效;除此之外,更可以透過散熱門組4來進行散熱,只要撥動門板42上的撥動部421,即可將嵌槽43與限位件41配合滑移動作,即可開啟門板42,讓熱流除了利用第一風扇組5及第二風扇組6進行散熱外,更可透過散熱門組4散熱。 Please refer to the first to eighth figures at the same time, which is a perspective view of the preferred embodiment of the present invention, and a lateral arrangement of the housing. As can be clearly seen from the figure, the housing 1 of the present embodiment is further The circuit board 7 and the interface card 71 inserted in the circuit board 7 and the central processing unit 72 electrically connected to the circuit board 7 are disposed, and the control unit 2 is a power switch of the circuit board 7. Or reset button, etc., so that when the user wants to place the housing 1, since the control element 2 is disposed on the short side 10 of the housing 1, the user can place the housing 1 laterally, and the housing 1 is When it is transparent, it is possible to directly observe the operation state of the interface card 71 and the central processing unit 72 inside the casing 1, such as the status light display color, etc.; when the control board 2 is used to open the circuit board 7 and the interface card 71, The operation starts to generate thermal energy. At this time, since the partition 14 separates the heat dissipation channels of the interface card 71 and the central processing unit 72, the heat flow discharged from the interface card 71 can be independently passed through the first when the first fan unit 5 operates. The heat dissipation space 141 is discharged, and the second fan group 6 can be independently The heat flow discharged from the central processing unit 72 is discharged through the second heat dissipation space 142 to achieve independent heat dissipation to enhance the heat dissipation effect; in addition, the heat dissipation can be performed through the heat dissipation door group 4, as long as the dial on the door panel 42 is dialed. The moving portion 421 can slide the slot 43 and the limiting member 41 to open the door panel 42 to allow the heat flow to dissipate heat through the first fan group 5 and the second fan group 6 Group 4 heats up.
另外,若要開啟蓋體3,其透過轉軸部31與樞軸部13的配合作動,即可將蓋體3進行橫向旋轉開啟,非常方便且不佔空間。 Further, if the lid body 3 is to be opened, the lid body 3 can be laterally rotated and opened by the cooperation of the shaft portion 31 and the pivot portion 13, which is very convenient and does not take up space.
再者,因插置區域11上具有數個擋片12,當介面卡71的連接器欲裸露出來時,可拆掉位置相對應的擋片12,以裸露出來供外部插置,且更重要的是,插置區域11無任何的橫桿,僅有可拆卸的擋片12設置,達到節省成本之優勢。 Moreover, since the insertion area 11 has a plurality of flaps 12, when the connector of the interface card 71 is to be exposed, the corresponding flap 12 can be removed to be exposed for external insertion, and more important. The insertion area 11 does not have any crossbars, and only the detachable flaps 12 are provided to achieve cost saving advantages.
請參閱第九圖所示,係為本新型較佳實施例之開啟維修蓋示意圖,由圖中可清楚出,使用者欲維修介面卡、電路板或中央處理器時,可直接按壓按鍵開 關81,即可將維修蓋8一側彈起解鎖,使用者即可快速的將維修蓋8取下,非常方便。 Please refer to the ninth figure, which is a schematic diagram of the opening of the maintenance cover of the preferred embodiment of the present invention. It can be clearly seen from the figure that when the user wants to repair the interface card, the circuit board or the central processing unit, the button can be directly pressed. When 81 is closed, the side of the maintenance cover 8 can be bounced and unlocked, and the user can quickly remove the maintenance cover 8, which is very convenient.
惟,以上所述僅為本新型之較佳實施例而已,非因此即侷限本新型之專利範圍,故舉凡運用本新型說明書及圖式內容所為之簡易修飾及等效結構變化,均應同理包含於本新型之專利範圍內,合予陳明。 However, the above description is only the preferred embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, all the simple modifications and equivalent structural changes that are made by using the present specification and the drawings are the same. It is included in the scope of this new patent and is given to Chen Ming.
故,請參閱全部附圖所示,本新型使用時,與習用技術相較,著實存在下列優點: Therefore, please refer to all the drawings, when compared with the conventional technology, the present invention has the following advantages:
一、透過控制元件2設於殼體1之短邊10處之技術,以達到讓使用者可清楚且輕易的觀察殼體1內部的狀態,且有別於一般電腦機殼的擺設方式。 1. The technique of providing the control element 2 at the short side 10 of the casing 1 so as to allow the user to clearly and easily observe the state of the interior of the casing 1, and is different from the manner in which the general computer casing is disposed.
二、透過隔板14之設計,達到得以將介面卡71及中央處理器72分開散熱,達到提升散熱之效果。 Second, through the design of the partition 14, the interface card 71 and the central processing unit 72 can be separately cooled to achieve the effect of improving heat dissipation.
三、透過蓋體3以旋轉方式開啟,以達到無須找尋擺放蓋體3的地方,避免佔用空間。 3. The cover body 3 is opened in a rotating manner to achieve a place where it is not necessary to find the cover body 3 to avoid occupying space.
四、透過散熱門組4之設計,得以強化散熱功能,達到具有更多散熱管道之優勢。 Fourth, through the design of the heat-dissipating door group 4, the heat-dissipating function can be enhanced to achieve the advantage of having more heat-dissipating pipes.
綜上所述,本新型之電腦機箱散熱結構於使用時,為確實能達到其功效及目的,故本新型誠為一實用性優異之創作,為符合新型專利之申請要件,爰依法提出申請,盼 審委早日賜准本新型,以保障創作人之辛苦創作,倘若 鈞局審委有任何稽疑,請不吝來函指示,創作人定當竭力配合,實感德便。 In summary, the heat dissipation structure of the computer case of the present invention can achieve its efficacy and purpose when used, so the novel is a practical and excellent creation, and is in accordance with the application requirements of the new patent, and submits an application according to law. I hope that the trial committee will grant this new type as soon as possible to protect the creators' hard work. If there is any doubt in the ruling committee, please do not hesitate to give instructions, the creators will try their best to cooperate, and they will feel good.
10‧‧‧短邊 10‧‧‧ Short side
14‧‧‧隔板 14‧‧‧Baffle
141‧‧‧第一散熱空間 141‧‧‧First cooling space
142‧‧‧第二散熱空間 142‧‧‧Second heat dissipation space
5‧‧‧第一風扇組 5‧‧‧First fan group
6‧‧‧第二風扇組 6‧‧‧Second fan set
Claims (10)
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TW106211160U TWM552123U (en) | 2017-07-28 | 2017-07-28 | Heat dissipating structure of computer chassis |
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TW106211160U TWM552123U (en) | 2017-07-28 | 2017-07-28 | Heat dissipating structure of computer chassis |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI677279B (en) * | 2018-09-18 | 2019-11-11 | 致茂電子股份有限公司 | Power supply device |
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2017
- 2017-07-28 TW TW106211160U patent/TWM552123U/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI677279B (en) * | 2018-09-18 | 2019-11-11 | 致茂電子股份有限公司 | Power supply device |
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