TWM550839U - Heat dissipation device for electronic component - Google Patents
Heat dissipation device for electronic component Download PDFInfo
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- TWM550839U TWM550839U TW106207820U TW106207820U TWM550839U TW M550839 U TWM550839 U TW M550839U TW 106207820 U TW106207820 U TW 106207820U TW 106207820 U TW106207820 U TW 106207820U TW M550839 U TWM550839 U TW M550839U
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Description
本創作係與散熱機構有關；特別是指一種電子組件適用之電子元件散熱裝置。 This creation is related to the heat dissipation mechanism; in particular, it refers to an electronic component heat sink for electronic components.
各式電子設備，舉凡日常生活中常見的電腦、數據交換機、音響等，於運作過程中均會產生程度不等之熱能，特別是電子組件包含有需要進行高速運算之電子零件，例如：中央處理器(CPU)或繪圖處理器(GPU)等，在運算時會產生大量的熱能。這些熱能積貯於電子設備內，使電子設備整體溫度升高，不僅大幅影響電子零件的效能，也會降低電子組件的穩定性與功能。 All kinds of electronic devices, such as computers, data switches, audio, etc., which are common in daily life, generate varying degrees of heat during operation. In particular, electronic components contain electronic components that require high-speed operations, such as central processing. A CPU (CPU) or a graphics processing unit (GPU) generates a large amount of heat during operation. These thermal energy are stored in the electronic device, which increases the overall temperature of the electronic device, which not only greatly affects the performance of the electronic components, but also reduces the stability and function of the electronic components.
為避免高熱影響電子設備運行，通常會於電子零件上安裝一散熱裝置。散熱裝置藉由風扇轉動時所產生之氣流，將晶片所生產的熱能帶走，達到降低電子組件溫度之功能。 In order to avoid high heat affecting the operation of electronic equipment, a heat sink is usually installed on the electronic components. The heat sink removes the heat energy generated by the wafer by the airflow generated when the fan rotates, thereby reducing the temperature of the electronic component.
雖然習用之散熱裝置解決電子零件產生之熱能積貯於電子設備中的問題，但卻衍生出另一問題──振動。風扇在轉動時所伴隨之振動，使散熱裝置對電子零件產生不均等之壓力，最終導致電子零件破裂、損壞，造成電子組件失去功能。 Although the conventional heat sink solves the problem of the thermal energy generated by electronic components being stored in electronic equipment, it has another problem - vibration. The vibration accompanying the rotation of the fan causes the heat sink to generate unequal pressure on the electronic components, which eventually causes the electronic components to be broken and damaged, causing the electronic components to lose their functions.
除了散熱裝置所造成之振動外，電子零件所位於之基板亦可能受其他因素而振動、搖晃，連帶使電子零件上下移動，同樣會導致 電子零件與散熱裝置之間產生不均等之壓力，進而減損電子零件之使用年限。 In addition to the vibration caused by the heat sink, the substrate on which the electronic components are located may be vibrated and shaken by other factors, and the electronic components may move up and down together, which may also cause There is unequal pressure between the electronic components and the heat sink, which in turn reduces the useful life of the electronic components.
此外，習用之散熱裝置以一定位件鎖固於電子組件之基板上，以貼近會產生熱能之電子零件，然而定位件鎖固於基板時與基板間之接觸面積小，導致基板鎖固處承受壓力大，造成基板損傷。 In addition, the conventional heat sink is locked on the substrate of the electronic component by a positioning member to be close to the electronic component that generates heat energy. However, the contact area between the positioning component and the substrate when the positioning component is locked on the substrate is small, and the substrate is locked. The pressure is high, causing damage to the substrate.
有鑑於此，本創作之目的在於提供一種電子元件散熱裝置，可降低電子零件於運作時之溫度，並減少振動對電子零件之影響。 In view of this, the purpose of the present invention is to provide an electronic component heat sink device that can reduce the temperature of electronic components during operation and reduce the influence of vibration on electronic components.
本創作之另一目的在於提供一種電子元件散熱裝置，可減少散熱裝置鎖接時對電子組件之基板的損傷。 Another object of the present invention is to provide an electronic component heat sink device that can reduce damage to a substrate of an electronic component when the heat sink is locked.
緣以達成上述目的，本創作提供的一種電子元件散熱裝置，係固定於一電子組件上，該電子組件包含有：一基板與一電子零件，其中該基板具有相背對之一第一側與一第二側，且該電子零件固定於該基板之第一側上；該電子元件散熱裝置包含有：一散熱座，具有至少一貫穿之穿孔；一底板，係呈平板狀且具有至少一螺孔；至少一定位件，係具有螺紋段；以及至少一第一彈簧；藉此，於該電子元件散熱裝置使用於上述電子組件上時，該散熱座係貼設於該電子元件上；該定位件係穿過該散熱座之穿孔及該基板，並與設於該基板第二側之該底板的螺孔螺合；該至少一第一彈簧係設於該定位件與該散熱座之間。 In order to achieve the above object, an electronic component heat dissipating device provided by the present invention is fixed on an electronic component, the electronic component comprising: a substrate and an electronic component, wherein the substrate has a first side opposite to the opposite side a second side, and the electronic component is fixed on the first side of the substrate; the electronic component heat dissipating device comprises: a heat sink having at least one through hole; and a bottom plate having a flat shape and having at least one screw a hole; at least one positioning member having a threaded portion; and at least one first spring; thereby, when the electronic component heat sink is used on the electronic component, the heat sink is attached to the electronic component; The device passes through the through hole of the heat sink and the substrate, and is screwed with the screw hole of the bottom plate disposed on the second side of the substrate; the at least one first spring is disposed between the positioning member and the heat sink.
在一實施例中，該穿孔具有一第一孔段與一第二孔段，其中該第一孔段內徑大於該第二孔段內徑，且該第一孔段與該第二孔段連接處形成一階面；該第一彈簧抵於該階面。 In one embodiment, the through hole has a first hole segment and a second hole segment, wherein the first hole segment inner diameter is larger than the second hole segment inner diameter, and the first hole segment and the second hole segment The joint forms a first-order surface; the first spring abuts the step.
在一實施例中，該定位件具有一抵擋部；於該電子元件散熱裝置使用於上述電子組件上時，該抵擋部位於該散熱座與該基板之間，且該抵擋部抵於該基板之第一側。 In an embodiment, the positioning member has a resisting portion. When the electronic component heat dissipating device is used on the electronic component, the resisting portion is located between the heat sink and the substrate, and the resisting portion is opposite to the substrate. The first side.
在一實施例中，該定位件凹設有一環槽；該電子元件散熱裝置更包含有一抵擋件，該抵擋件卡制於該環槽並構成該另一抵擋部。 In one embodiment, the positioning member is recessed with a ring groove; the electronic component heat sink further includes a resisting member that is engaged with the ring groove and constitutes the other resisting portion.
在一實施例中，該定位件具有另一抵擋部；於該定位件未鎖於該底板時，該另一抵擋部抵於該散熱座。 In an embodiment, the positioning member has another resisting portion; the other resisting portion abuts the heat dissipating portion when the positioning member is not locked to the bottom plate.
在一實施例中，該定位件凹設有一環槽；該電子元件散熱裝置更包含有一抵擋件，該抵擋件卡制於該環槽並構成該另一抵擋部。 In one embodiment, the positioning member is recessed with a ring groove; the electronic component heat sink further includes a resisting member that is engaged with the ring groove and constitutes the other resisting portion.
在一實施例中，更包含有一第二彈簧；於該電子元件散熱裝置使用於上述電子組件上時，該第二彈簧位於該散熱座與該另一抵擋部之間。 In an embodiment, a second spring is further included. When the electronic component heat sink is used on the electronic component, the second spring is located between the heat sink and the other resist.
在一實施例中，該電子元件散熱裝置更包含有一第三彈簧；於該電子元件散熱裝置使用於上述電子組件上時，該第三彈簧係設於該基板與該底板之間。 In one embodiment, the electronic component heat sink further includes a third spring; the third spring is disposed between the substrate and the bottom plate when the electronic component heat sink is used on the electronic component.
在一實施例中，更包含有一第二彈簧；於該電子元件散熱裝置使用於上述電子組件上時，該第二彈簧係設於該基板與該底板之間。 In an embodiment, a second spring is further included. When the electronic component heat sink is used on the electronic component, the second spring is disposed between the substrate and the bottom plate.
在一實施例中，該底板具有一第一部與至少一第二部；該第一部抵接於該基板，且具有一貫穿之開孔；該第二部一端連接於該開孔之局部孔緣上，且具有該螺孔。 In one embodiment, the bottom plate has a first portion and at least a second portion; the first portion abuts the substrate and has a through hole; the second portion is connected to the opening portion On the edge of the hole, and having the screw hole.
本創作之效果在於藉由該底板分散該基板之振動，減少振動傳至該散熱座與電子零件之間的接觸面，以達到降低電子零件因振動而導致破裂、損壞之風險。 The effect of the present invention is that the vibration of the substrate is dispersed by the bottom plate, and the vibration is transmitted to the contact surface between the heat sink and the electronic component, so as to reduce the risk of cracking and damage of the electronic component due to vibration.
本創作之另一效果在於藉由底板與基板之較大接觸面積，可降低該定位件鎖固於基板時對基板所造成之損害。 Another effect of the present invention is that the large contact area between the bottom plate and the substrate can reduce damage to the substrate when the positioning member is locked to the substrate.
〔本創作〕 [this creation]
1‧‧‧電子組件 1‧‧‧Electronic components
2‧‧‧基板 2‧‧‧Substrate
2a‧‧‧第一側 2a‧‧‧ first side
2b‧‧‧第二側 2b‧‧‧ second side
2c‧‧‧穿孔 2c‧‧‧Perforation
3‧‧‧電子零件 3‧‧‧Electronic parts
100、200、300、400、500、600、700‧‧‧電子元件散熱裝置 100, 200, 300, 400, 500, 600, 700‧‧‧ electronic components heat sink
10‧‧‧散熱座 10‧‧‧ Heat sink
10a‧‧‧穿孔 10a‧‧‧Perforation
12‧‧‧第一側 12‧‧‧ first side
12a‧‧‧第一孔段 12a‧‧‧First hole section
14‧‧‧第二側 14‧‧‧ second side
14a‧‧‧第二孔段 14a‧‧‧Second hole section
16‧‧‧階面 16‧‧‧ step
20‧‧‧散熱膠層 20‧‧‧heating layer
30、30’‧‧‧底板 30, 30'‧‧‧ bottom plate
30a‧‧‧螺孔 30a‧‧‧ screw holes
30b‧‧‧開孔 30b‧‧‧Opening
32‧‧‧第一部 32‧‧‧ first
34‧‧‧第二部 34‧‧‧ second
40‧‧‧定位件 40‧‧‧ Positioning parts
42‧‧‧凸部 42‧‧‧ convex
44‧‧‧第一抵擋部 44‧‧‧First resisting department
46‧‧‧第二抵擋部 46‧‧‧second resisting department
50、50’‧‧‧第一彈簧 50, 50'‧‧‧ first spring
60、60’、60’’‧‧‧第二彈簧 60, 60’, 60’’ ‧ ‧ second spring
70‧‧‧第三彈簧 70‧‧‧ Third spring
80‧‧‧殼體 80‧‧‧shell
81‧‧‧凸起部 81‧‧‧ raised parts
81a‧‧‧螺孔 81a‧‧‧ screw hole
81b‧‧‧開孔 81b‧‧‧Opening
812‧‧‧第一部 812‧‧‧ first
814‧‧‧第二部 814‧‧‧ Second
圖1為本創作第一較佳實施例之的示意圖。 1 is a schematic view of a first preferred embodiment of the present invention.
圖2為本創作第二較佳實施例之的示意圖。 2 is a schematic view of a second preferred embodiment of the present invention.
圖3為本創作第三較佳實施例之的示意圖。 Figure 3 is a schematic view of a third preferred embodiment of the present invention.
圖4為本創作第四較佳實施例之的示意圖。 Figure 4 is a schematic view of a fourth preferred embodiment of the present invention.
圖5為本創作第五較佳實施例之的示意圖。 Figure 5 is a schematic view of a fifth preferred embodiment of the present invention.
圖6為本創作第六較佳實施例之的示意圖。 Figure 6 is a schematic view of a sixth preferred embodiment of the present invention.
圖7為本創作第七較佳實施例之的示意圖。 Figure 7 is a schematic view of a seventh preferred embodiment of the present invention.
為能更清楚地說明本創作，茲舉數個較佳實施例並配合圖式詳細說明如後。請參考圖1所示，為本創作第一較佳實施例之電子元件散熱裝置100，係供使用於一電子組件1上，其中該電子組件1包含有：一基板2與一電子零件3，其中該基板2具有相背對之一第一側2a與一第二側2b，與至少一貫穿該基板2之穿孔2c。該電子零件3固定於該基板2之第一側2a上，且在運作時會產生熱能，例如：中央處理器或繪圖處理器等，但並不限於此，該電子元件散熱裝置100係用以降低電子零件3於運作時之溫度，以維持電子零件3的效能。 In order to explain the present invention more clearly, several preferred embodiments are described in detail with reference to the drawings. Referring to FIG. 1 , the electronic component heat dissipation device 100 of the first preferred embodiment of the present invention is used for an electronic component 1 . The electronic component 1 includes a substrate 2 and an electronic component 3 . The substrate 2 has a first side 2a and a second side 2b opposite to each other, and at least one through hole 2c penetrating the substrate 2. The electronic component 3 is fixed on the first side 2a of the substrate 2, and generates thermal energy during operation, such as a central processing unit or a graphics processor, but is not limited thereto. The electronic component heat dissipation device 100 is used for The temperature of the electronic component 3 during operation is lowered to maintain the performance of the electronic component 3.
該電子元件散熱裝置100包含有一散熱座10、一散熱膠層20、一底板30、一定位件40與一第一彈簧50。該散熱座10係具有相背對 之一第一側12與一第二側14，以及一貫穿該散熱座10之穿孔10a(即本創作中所定義之穿孔)，該散熱座10貼設於該電子零件3，且該散熱座10之第二側14與該電子零件3之間塗有一散熱膠層20，以填補該電子零件3與該散熱座10中間空隙，幫助熱能傳導至該散熱座10，當然，在一實施例中，亦可無散熱膠層20，該散熱座10之第二側14亦可直接抵於電子零件3。 The electronic component heat sink 100 includes a heat sink 10 , a heat sink layer 20 , a bottom plate 30 , a positioning member 40 , and a first spring 50 . The heat sink 10 has opposite pairs a first side 12 and a second side 14 , and a through hole 10 a (the perforation defined in the present invention) penetrating the heat sink 10 , the heat sink 10 is attached to the electronic component 3 , and the heat sink A heat dissipating layer 20 is disposed between the second side 14 of the 10 and the electronic component 3 to fill the gap between the electronic component 3 and the heat sink 10 to help conduct heat energy to the heat sink 10. Of course, in an embodiment The heat sink layer 20 can also be omitted, and the second side 14 of the heat sink 10 can also directly abut the electronic component 3.
該散熱座10之穿孔10a具有一靠近該第一側12之第一孔段12a與靠近該第二側14之第二孔段14a，其中該第一孔段12a之內徑大於該第二孔段14a之內徑，且該第一孔段12a與該第二孔段14a連接處形成一階面16。 The through hole 10a of the heat sink 10 has a first hole segment 12a adjacent to the first side 12 and a second hole segment 14a adjacent to the second side 14. The inner diameter of the first hole segment 12a is larger than the second hole. The inner diameter of the segment 14a, and the first hole segment 12a and the second hole segment 14a are joined to form a stepped surface 16.
該底板30呈平板狀且具有至少一螺孔30a。在本實施例中，該底板30係透過該螺孔30a與該定位件40的固接，而裝設於該基板之第二側2b。 The bottom plate 30 has a flat shape and has at least one screw hole 30a. In this embodiment, the bottom plate 30 is fixed to the positioning member 40 through the screw hole 30a, and is mounted on the second side 2b of the substrate.
該定位件40係具有螺紋段且末端設有一凸部42，又，該定位件40自該散熱座10之第一側12穿過該穿孔10a與該基板2之穿孔2c，並與該底板30之螺孔30a螺合；該凸部42位於該穿孔10a之第一孔段12a內，且該凸部42之外徑大於該第二孔段14a之內徑。 The positioning member 40 has a threaded portion and a protrusion 42 is disposed at the end. The positioning member 40 passes through the through hole 10a and the through hole 2c of the substrate 2 from the first side 12 of the heat sink 10, and the bottom plate 30 The screw hole 30a is screwed; the convex portion 42 is located in the first hole segment 12a of the through hole 10a, and the outer diameter of the convex portion 42 is larger than the inner diameter of the second hole portion 14a.
該定位件40具有二抵擋部，分別為一第一抵擋部44與一第二抵擋部46，且該第一抵擋部44與該第二抵擋部46位於該散熱座10與該基板2之間，其中，該第一抵擋部44位於該散熱座10與該第二抵擋部46之間，且該第一抵擋部44外徑大於該第二孔段14a之內徑。在本實施例中，該定位件40凹設有一環槽，該電子元件散熱裝置100更包含有一抵擋件(例如：C形環)，且該抵擋件卡制於該環槽並構成該第一抵擋部44。 The locating member 40 has two resisting portions, which are respectively a first resisting portion 44 and a second resisting portion 46 , and the first resisting portion 44 and the second resisting portion 46 are located between the heat sink 10 and the substrate 2 . The first resisting portion 44 is located between the heat sink 10 and the second resisting portion 46, and the outer diameter of the first resisting portion 44 is larger than the inner diameter of the second hole portion 14a. In this embodiment, the positioning member 40 is recessed with a ring groove, and the electronic component heat dissipating device 100 further includes a resisting member (for example, a C-shaped ring), and the resisting member is engaged in the ring groove and constitutes the first Resist portion 44.
該第二抵擋部46外徑大於該基板2之穿孔2c的內徑，且該第二抵擋部46位於該第一抵擋部44與該基板2之間。當該定位件40鎖固於該底板30時，第二抵擋部46抵於該基板2之第一側2a，以避免該定位件40鎖於該底板30之深度過深，造成該散熱座10緊迫於該電子零件3，而導致電子零件3損傷。 The outer diameter of the second resisting portion 46 is larger than the inner diameter of the through hole 2c of the substrate 2, and the second resisting portion 46 is located between the first resisting portion 44 and the substrate 2. When the positioning member 40 is locked to the bottom plate 30, the second abutting portion 46 abuts against the first side 2a of the substrate 2, so as to prevent the positioning member 40 from being locked to the bottom plate 30 to be too deep, thereby causing the heat sink 10 to be The electronic component 3 is pressed, causing damage to the electronic component 3.
該第一彈簧50係設於該定位件40與該散熱座10之間，且該第一彈簧50兩端分別抵於該定位件40之凸部42與該階面16，使該第一彈簧50位於該第一孔段12a內。 The first spring 50 is disposed between the positioning member 40 and the heat sink 10, and the two ends of the first spring 50 respectively abut the convex portion 42 of the positioning member 40 and the step surface 16 to make the first spring 50 is located within the first bore section 12a.
該定位件40之第一抵擋部44外徑大於該第二孔段14a之內徑，使該定位件40未鎖於該底板30時，該第一抵擋部44可抵於該散熱座10之第二側14，以避免該定位件40因於鎖固過程中擠壓該第一彈簧50，而於除去外力時該第一彈簧50恢復原狀，導致將該定位件40推出該散熱座10之穿孔10a。 The first resisting portion 44 of the positioning member 40 has an outer diameter greater than the inner diameter of the second hole portion 14a. When the positioning member 40 is not locked to the bottom plate 30, the first resisting portion 44 can abut the heat sink 10. The second side 14 is configured to prevent the positioning member 40 from being pressed against the first spring 50 during the locking process, and the first spring 50 is restored to the original state when the external force is removed, thereby causing the positioning member 40 to be pushed out of the heat sink 10 Perforation 10a.
電子元件散熱裝置100於使用過程中，底板30不僅可支撐基板2，且能分散基板2振動能量，減少振動傳至該散熱座10(或該散熱膠層20)與電子零件3之接觸面，降低該散熱座10與電子零件3於第二側14的相對位移差。換言之，藉由降低散熱座10對電子零件3產生不均等之壓力，以達到降低電子零件3因振動而導致破裂、損壞之風險。 During use of the electronic component heat dissipating device 100, the bottom plate 30 can not only support the substrate 2, but also disperse the vibration energy of the substrate 2, and reduce the vibration transmission to the contact surface of the heat sink 10 (or the heat dissipating rubber layer 20) and the electronic component 3. The relative displacement difference between the heat sink 10 and the electronic component 3 on the second side 14 is reduced. In other words, by reducing the pressure of the heat sink 10 on the electronic component 3, the risk of cracking or damage of the electronic component 3 due to vibration is reduced.
又因為底板30與基板2之接觸面積大，可分散該定位件40鎖固於該底板30時對該基板2所造成之壓力，降低對該基板2所造成之損害。 Moreover, because the contact area between the bottom plate 30 and the substrate 2 is large, the pressure caused on the substrate 2 when the positioning member 40 is locked to the bottom plate 30 can be dispersed, and the damage caused to the substrate 2 can be reduced.
該第一彈簧50可吸收振動能量而產生形變，亦減少振動傳至該散熱座10(或該散熱膠層20)與電子零件3之接觸面，降低電子零件3因振動而導致之損壞。 The first spring 50 absorbs the vibration energy to generate deformation, and also reduces the vibration transmitted to the contact surface of the heat sink 10 (or the heat sink layer 20) and the electronic component 3, thereby reducing the damage of the electronic component 3 due to vibration.
本實施例係以一個定位件40將散熱座10與基板2、底板30結合固定，但不以此為限制，亦可使用複數個定位件40以及相對數量之第一彈簧50分別穿設該散熱座10並設於電子組件1上，不僅可以增加散熱座10的固定效果，更可使電子零件3於振動時之加速度小於使用單一固定件40固定之加速度小，換言之，使用複數個定位件40以及相對數量之第一彈簧50配合使用可達到較佳的減振效果。 In this embodiment, the heat sink 10 is fixed to the substrate 2 and the bottom plate 30 by a positioning member 40. However, without limitation, a plurality of positioning members 40 and a corresponding number of first springs 50 may be used to respectively dissipate the heat dissipation. The seat 10 is disposed on the electronic component 1 not only to increase the fixing effect of the heat sink 10, but also to make the acceleration of the electronic component 3 when vibrating less than the acceleration fixed by using the single fixing member 40, in other words, using a plurality of positioning members 40. A preferred amount of damping can be achieved by using a relatively large number of first springs 50.
為了達到更佳的減振效果，電子元件散熱裝置更有以下多種的實施態樣，以增強吸收振動能量的功能，達到降低電子零件3因振動而導致破裂、損壞之風險。 In order to achieve better vibration damping effect, the electronic component heat sink has the following various embodiments to enhance the function of absorbing vibration energy, thereby reducing the risk of cracking and damage of the electronic component 3 due to vibration.
請見圖2至圖4所示，分別為本創作第二至四較佳實施例之電子元件散熱裝置200、300、400，利用複數個彈簧以增加吸收振動能量。 Referring to FIG. 2 to FIG. 4, the electronic component heat dissipating devices 200, 300, and 400 of the second to fourth preferred embodiments of the present invention respectively utilize a plurality of springs to increase the absorption vibration energy.
如圖2所示，本實施例之電子元件散熱裝置200，包含有上述第一較佳實施例之電子元件散熱裝置100，更包含有一第二彈簧60。該第二彈簧60係可設於該散熱座10與該第一抵擋部44之間；或是如圖3，在第三較佳實施例之電子元件散熱裝置300中，該第二彈簧60’設於該基板2與該底板30之間；抑或者，如圖4所示，該電子元件散熱裝置400除了包含有位於該定位件40與該散熱座20之間的第一彈簧50、位於該散熱座10與該第一抵擋部44之間的第二彈簧60，更包含有一第三彈簧70，該第三彈簧70係設於該基板2與該底板30之間。 As shown in FIG. 2, the electronic component heat sink 200 of the present embodiment includes the electronic component heat sink 100 of the first preferred embodiment, and further includes a second spring 60. The second spring 60 can be disposed between the heat sink 10 and the first resisting portion 44. Alternatively, as shown in FIG. 3, in the electronic component heat sink 300 of the third preferred embodiment, the second spring 60' Between the substrate 2 and the bottom plate 30; or, as shown in FIG. 4, the electronic component heat sink 400 includes a first spring 50 located between the positioning member 40 and the heat sink 20, The second spring 60 between the heat sink 10 and the first resisting portion 44 further includes a third spring 70 disposed between the substrate 2 and the bottom plate 30.
上述之第一彈簧50、第二彈簧60、60’與第三彈簧70以線彈簧為例，但不以此為限制，請見圖5所示，揭示為本創作為第五較佳實施例之電子元件散熱裝置500，當中之第一彈簧50’、第二彈簧60’’即為皿形彈簧，當然亦可為其他種類的彈簧，如：波浪彈簧、彈片彈簧、 螺旋彈簧……等，只要是利用材料的彈性作用製成的零件，且能在外力作用下，發生伸長、縮短、彎曲、扭轉等形變，除去外力後又可恢復原狀者，皆可達到吸收振動能量之效果，並不以上述彈簧為限制。 The first spring 50, the second spring 60, 60' and the third spring 70 are exemplified by a wire spring, but are not limited thereto. Please refer to FIG. 5, which is a fifth preferred embodiment. The electronic component heat dissipating device 500, wherein the first spring 50' and the second spring 60'' are cup-shaped springs, of course, other types of springs, such as wave springs, spring springs, A coil spring, etc., as long as it is a part made of the elastic action of the material, and can be deformed by elongation, shortening, bending, torsion, etc. under external force, and can be recovered by removing the external force and recovering the original state. The effect of energy is not limited by the above springs.
請見圖6所示，揭示為本創作第六較佳實施例之電子元件散熱裝置600，類似於本創作第一較佳實施例之電子元件散熱裝置100，可裝設於一殼體80中，不同的是：電子元件散熱裝置600並無獨立之底板，而是以殼體80沖壓成一凸起部81朝向該電子元件散熱裝置600並構成該底板，該定位件40鎖接於該凸起部81之螺孔81a。 As shown in FIG. 6 , the electronic component heat sink 600 of the sixth preferred embodiment of the present invention is disclosed. The electronic component heat sink 100 of the first preferred embodiment of the present invention can be installed in a housing 80 . The difference is that the electronic component heat sink 600 does not have a separate bottom plate, but is stamped into a convex portion 81 by the housing 80 toward the electronic component heat sink 600 and constitutes the bottom plate, and the positioning member 40 is locked to the protrusion. The screw hole 81a of the portion 81.
請參考圖7所示，揭示為本創作第七較佳實施例之電子元件散熱裝置700，類似於上述第六較佳實施例之電子元件散熱裝置600，不同的是：該凸起部81具有一第一部812與一第二部814，該第一部812抵接於該基板2，且具有一貫穿之開孔81b；該第二部814一端連接於該開孔81b之局部孔緣上，且具有該螺孔81a。 Referring to FIG. 7, the electronic component heat dissipating device 700 of the seventh preferred embodiment of the present invention is similar to the electronic component heat dissipating device 600 of the sixth preferred embodiment. The difference is that the convex portion 81 has a first portion 812 and a second portion 814. The first portion 812 abuts the substrate 2 and has a through hole 81b. The second portion 814 is connected at one end to the partial hole of the opening 81b. And having the screw hole 81a.
本實施例之殼體80可為塑膠或金屬所製成，例如：鐵、鋁等，由於塑膠與金屬可彈性變形，又，該定位件40鎖固於該第二部814，因此當散熱座10之振動藉定位件40傳至該殼體80之凸起部81時，該第二部814吸收振動能量而產生形變，而當振動消失時，則該第二部814回復至產生形變之前的狀態。該第二部814吸收振動能量同樣可達到減少該散熱座10與電子零件3的相對位移差，降低電子零件3因振動而造成之損傷。同樣地，該第二部814、該定位件40與該第一彈簧50的數量亦可視需求增加設置，以增加電子元件散熱裝置600固定於電子組件1之效果。 The housing 80 of the embodiment may be made of plastic or metal, such as iron, aluminum, etc., since the plastic and the metal are elastically deformable, and the positioning member 40 is locked to the second portion 814, so that the heat sink is When the vibration of 10 is transmitted to the convex portion 81 of the casing 80 by the positioning member 40, the second portion 814 absorbs vibration energy to cause deformation, and when the vibration disappears, the second portion 814 returns to before the deformation occurs. status. The absorption of the vibration energy by the second portion 814 can also reduce the relative displacement difference between the heat sink 10 and the electronic component 3, and reduce the damage of the electronic component 3 due to vibration. Similarly, the number of the second portion 814, the positioning member 40 and the first spring 50 can also be increased as needed to increase the effect of the electronic component heat sink 600 being fixed to the electronic component 1.
以上所述僅為本創作較佳可行實施例而已，舉凡應用本創作說明書及申請專利範圍所為之等效變化，理應包含在本創作之專利範圍內。 The above is only a preferred embodiment of the present invention, and equivalent changes to the scope of the present application and the scope of the patent application are intended to be included in the scope of the present patent.
1‧‧‧電子組件 1‧‧‧Electronic components
2‧‧‧基板 2‧‧‧Substrate
2a‧‧‧第一側 2a‧‧‧ first side
2b‧‧‧第二側 2b‧‧‧ second side
2c‧‧‧穿孔 2c‧‧‧Perforation
3‧‧‧電子零件 3‧‧‧Electronic parts
100‧‧‧電子元件散熱裝置 100‧‧‧Electronic component heat sink
10‧‧‧散熱座 10‧‧‧ Heat sink
10a‧‧‧穿孔 10a‧‧‧Perforation
12‧‧‧第一側 12‧‧‧ first side
12a‧‧‧第一孔段 12a‧‧‧First hole section
14‧‧‧第二側 14‧‧‧ second side
14a‧‧‧第二孔段 14a‧‧‧Second hole section
16‧‧‧階面 16‧‧‧ step
20‧‧‧散熱膠層 20‧‧‧heating layer
30‧‧‧底板 30‧‧‧floor
30a‧‧‧螺孔 30a‧‧‧ screw holes
40‧‧‧定位件 40‧‧‧ Positioning parts
42‧‧‧凸部 42‧‧‧ convex
44‧‧‧第一抵擋部 44‧‧‧First resisting department
46‧‧‧第二抵擋部 46‧‧‧second resisting department
50‧‧‧第一彈簧 50‧‧‧First spring
Claims (9)
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| Application Number | Priority Date | Filing Date | Title |
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| TW106207820U TWM550839U (en) | 2017-06-01 | 2017-06-01 | Heat dissipation device for electronic component |
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| Application Number | Priority Date | Filing Date | Title |
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| TW106207820U TWM550839U (en) | 2017-06-01 | 2017-06-01 | Heat dissipation device for electronic component |
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| TWM550839U true TWM550839U (en) | 2017-10-21 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI658778B (en) * | 2018-08-22 | 2019-05-01 | 宏碁股份有限公司 | Electronic assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI658778B (en) * | 2018-08-22 | 2019-05-01 | 宏碁股份有限公司 | Electronic assembly |
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