TWM538614U - Integral device for sensing touch control and force - Google Patents
Integral device for sensing touch control and force Download PDFInfo
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Abstract
Description
本創作係有關於一種感測裝置，特別是一種觸控與壓力感測之整合裝置。The present invention relates to a sensing device, and more particularly to an integrated device for touch and pressure sensing.
輕薄短小的行動裝置帶動觸控顯示面板的潮流，且由於觸控的人機界面技術成熟與使用者對3D觸控的操作需求不斷提昇，壓力觸控的技術也隨之推陳出新；習知之壓力觸控顯示面板往往將微機電之壓力感測器置於顯示面板之邊緣或角落，藉以感測面板表面之觸碰壓力，不僅感測器成本高昂且貼合不易。也有以複雜製程製作細微可變形之彈性微結構，增加壓力與變形量之相關性，藉此產生較多的物理量變動以利偵測；故壓力感測觸控面板仍有改善之空間。The thin and short mobile device drives the trend of the touch display panel, and due to the mature human touch interface technology and the increasing user demand for 3D touch operation, the pressure touch technology is also updated; the pressure of the conventional touch The control display panel often places the MEMS pressure sensor on the edge or corner of the display panel, thereby sensing the touch pressure of the panel surface, which is not only costly but also difficult to fit. There are also complex microstructures that produce finely deformable elastic microstructures, which increase the correlation between pressure and deformation, thereby generating more physical quantity changes for detection; therefore, the pressure sensing touch panel still has room for improvement.
為改善上述習知技術之缺點，本創作之目的在於提供一種可針對既有觸控面板提供壓力偵測功能之觸控與壓力感測之整合裝置。In order to improve the shortcomings of the above-mentioned prior art, the purpose of the present invention is to provide an integrated device for touch and pressure sensing that can provide a pressure detecting function for an existing touch panel.
為達成本創作之上述目的，本創作提供一種觸控與壓力感測之整合裝置，包含:一觸控面板，該觸控面板具有複數個觸控電極，複數個導電墊與複數條電極連接線；一壓力電極層，包含至少一壓力感應電極；一彈性介電材料層，位於該壓力電極層之一側；一軟性電路板，電性連接該觸控面板及該壓力電極層；一觸控偵測積體電路位於該軟性電路板；一壓力偵測積體電路位於該軟性電路板，且包含至少一電容偵測電路與複數個開關電路；於觸控偵測時序，該複數個觸控電極經由該壓力偵測積體電路內之複數個開關電路電氣連接至該觸控偵測積體電路作觸控操作；於壓力偵測時序，該複數個觸控電極經由該壓力偵測積體電路內之複數個開關電路電氣連接至該壓力偵測積體電路之電容偵測電路作壓力偵測操作。In order to achieve the above object of the present invention, the present invention provides an integrated device for touch and pressure sensing, comprising: a touch panel having a plurality of touch electrodes, a plurality of conductive pads and a plurality of electrode connecting lines a pressure electrode layer comprising at least one pressure sensing electrode; a layer of elastic dielectric material on one side of the pressure electrode layer; a flexible circuit board electrically connecting the touch panel and the pressure electrode layer; The detection integrated circuit is located on the flexible circuit board; a pressure detecting integrated circuit is located on the flexible circuit board, and includes at least one capacitance detecting circuit and a plurality of switching circuits; and the touch detection timing, the plurality of touches The electrodes are electrically connected to the touch detection integrated circuit via the plurality of switch circuits in the pressure detecting integrated circuit for performing a touch operation; and the plurality of touch electrodes detect the integrated body through the pressure during the pressure detection timing A plurality of switching circuits in the circuit are electrically connected to the capacitance detecting circuit of the pressure detecting integrated circuit for pressure detecting operation.
有關本創作的詳細說明及技術內容，請參閱以下的詳細說明和附圖說明如下，須知附圖與詳細說明僅作為說明之用，並非用於限制本創作之權利範圍。The detailed description and technical contents of the present invention are to be understood as the following detailed description and the accompanying drawings.
請參考圖1，為一觸控裝置10a之示意圖，該觸控裝置10a包含一觸控面板20a、位於一軟性電路板80a上之一觸控偵測積體電路(IC) 700a，該觸控裝置10a之軟性電路板80a係電性連接到一主機600a，以接受來自主機600a之指令，或是將觸控偵測結果傳送到主機600a。再者，此觸控面板20a包含複數導電墊22a及電極連接線24a；該觸控面板20a上具有複數之觸控電極TE1~TEn，分別電連接到對應之電極連接線22a，再經由對應之導電墊24a電連接到軟性電路板80a，進而將觸控感應訊號傳送到觸控偵測積體電路700a處理。Please refer to FIG. 1 , which is a schematic diagram of a touch device 10a. The touch device 10a includes a touch panel 20a and a touch detection integrated circuit (IC) 700a on a flexible circuit board 80a. The flexible circuit board 80a of the device 10a is electrically connected to a host 600a for accepting commands from the host 600a or transmitting touch detection results to the host 600a. In addition, the touch panel 20a includes a plurality of conductive pads 22a and electrode connection lines 24a. The touch panel 20a has a plurality of touch electrodes TE1~TEn electrically connected to the corresponding electrode connection lines 22a, respectively. The conductive pad 24a is electrically connected to the flexible circuit board 80a, and the touch sensing signal is transmitted to the touch detection integrated circuit 700a for processing.
然而，隨著電子產品逐漸需求壓力感測，上述之觸控裝置10a已經不敷使用，如果在導入壓力偵測之新功能時能夠利用既有之觸控裝置10a或是觸控偵測積體電路700a，則可大福縮小研發時程與失敗風險，避免研發經費之浪費及產品成本提高。However, as the electronic product gradually demands pressure sensing, the above-mentioned touch device 10a is no longer sufficient, and if the new function of the pressure detection is introduced, the existing touch device 10a or the touch detection integrated body can be utilized. Circuit 700a can reduce the development time and failure risk of Dafu, avoiding waste of research and development expenses and increasing product cost.
參考圖2，為說明本創作觸控與壓力感測之整合裝置10（以下簡稱整合裝置10）之示意圖，該整合裝置10包含一觸控面板20、一壓力電極層30、一軟性電路板80、一觸控偵測積體電路700、一壓力偵測積體電路500。該觸控面板20及該壓力電極層30透過複數導電墊22及電極連接線24而電連接到該軟性電路板80，進而電連接到該壓力偵測積體電路500。配合參見圖5A，該觸控面板20包含一上基板100(具有一第一表面100a及一第二表面100b)、複數個觸控電極(如此圖所示之觸控電極TE1~TE9)位於該第二表面100b上。該整合裝置10更包含一彈性介電材料層25，位於該觸控面板20及該壓力電極層30之間。Referring to FIG. 2 , a schematic diagram of the integrated device 10 for touch sensing and pressure sensing (hereinafter referred to as the integrated device 10 ) is illustrated. The integrated device 10 includes a touch panel 20 , a pressure electrode layer 30 , and a flexible circuit board 80 . A touch detection integrated circuit 700 and a pressure detecting integrated circuit 500 are provided. The touch panel 20 and the pressure electrode layer 30 are electrically connected to the flexible circuit board 80 through the plurality of conductive pads 22 and the electrode connection lines 24 , and are electrically connected to the pressure detecting integrated circuit 500 . Referring to FIG. 5A, the touch panel 20 includes an upper substrate 100 (having a first surface 100a and a second surface 100b), and a plurality of touch electrodes (such as the touch electrodes TE1~TE9 shown in the figure) are located therein. On the second surface 100b. The integrated device 10 further includes a layer of elastic dielectric material 25 between the touch panel 20 and the pressure electrode layer 30.
參見圖3，為說明本創作整合裝置10於觸控偵測時序之操作示意圖。於觸控偵測時序，該複數個觸控電極TE1~TEn經由該壓力偵測積體電路500內之複數個開關電路580a, 580b電氣連接至該觸控偵測積體電路700作觸控操作。復配合參考圖5A，於觸控偵測時序，該觸控偵測積體電路700依序或是隨機將一第一電容感應激勵訊號（觸控電容感應激勵訊號）Vs施加到選定之一觸控電極（例如觸控電極TE4）。此外，該觸控偵測積體電路700也產生與第一電容感應激勵訊號Vs同相位之輔助訊號(auxiliary signal)Va，此輔助訊號Va施加於壓力電極層30中相對的至少一個壓力感應電極（詳見後述）。由於在相對的至少一個壓力感應電極施加與第一電容感應激勵訊號Vs同相位之訊號，等效上即可在對應選定觸控電極TE4與相對的至少一個壓力感應電極之間產生沒有電壓差或是幾乎沒有電壓差的狀態，亦即不會有電容產生或是僅有微量電容產生（不至於影響觸控感測結果之微量電容），即可避免在偵測對應選定觸控電極TE4之觸控操作時，因為彈性介電材料層25受壓翹曲而產生電容的干擾，同時亦阻絕了經由壓力感應電極與接地點間電容並聯效應引發之干擾。再者，雖然未明確繪示於圖5A，但是觸控偵測積體電路700係經由壓力偵測積體電路500內之複數個開關電路580a, 580b而傳送第一電容感應激勵訊號Vs到選定之觸控電極TE4，及傳送輔助訊號Va到相對的至少一個壓力感應電極，且接收來自選定觸控電極TE4之觸控感應訊號Vc1。Referring to FIG. 3, a schematic diagram of the operation of the creative integration device 10 in the touch detection timing is illustrated. In the touch detection timing, the plurality of touch electrodes TE1~TEn are electrically connected to the touch detection integrated circuit 700 via the plurality of switch circuits 580a and 580b in the pressure detecting integrated circuit 500 for touch operation. . Referring to FIG. 5A, in the touch detection timing, the touch detection integrated circuit 700 sequentially or randomly applies a first capacitive sensing excitation signal (touch capacitive sensing excitation signal) Vs to one of the selected touches. Control electrode (such as touch electrode TE4). In addition, the touch detection integrated circuit 700 also generates an auxiliary signal Va that is in phase with the first capacitive sensing excitation signal Vs. The auxiliary signal Va is applied to at least one pressure sensing electrode in the pressure electrode layer 30. (See below for details). Since the signal of the same phase as the first capacitive sensing excitation signal Vs is applied to the opposite at least one pressure sensing electrode, an equivalent voltage difference can be generated between the corresponding selected touch electrode TE4 and the opposite at least one pressure sensing electrode. There is almost no voltage difference state, that is, no capacitance is generated or only a small amount of capacitance is generated (not affecting the touch capacitance of the touch sensing result), and the touch corresponding to the selected touch electrode TE4 can be avoided. During the control operation, the capacitance of the elastic dielectric material layer 25 is caused by the pressure warpage, and the interference caused by the parallel effect of the capacitance between the pressure sensing electrode and the grounding point is also blocked. Moreover, although not explicitly illustrated in FIG. 5A, the touch detection integrated circuit 700 transmits the first capacitive inductive excitation signal Vs to a selected one of the plurality of switching circuits 580a, 580b in the pressure detecting integrated circuit 500. The touch electrode TE4 transmits the auxiliary signal Va to the opposite at least one pressure sensing electrode and receives the touch sensing signal Vc1 from the selected touch electrode TE4.
配合參見圖6，為依據本創作一實施例之整合裝置10之部份上視圖，主要繪示觸控電極TE1~TE8, TEn及壓力感應電極PE1, PE2之分布狀況。如此圖所示，壓力電極層30包含兩個壓力感應電極PE1, PE2，且每一觸控電極TE1~TE8, TEn都相對於至少一個壓力感應電極PE1或是PE2，此處所謂之相對，為由投影角度觀之，每一觸控電極TE1~TE8, TEn都與至少一個壓力感應電極PE1或PE2部份重疊，或是鄰近至少一個壓力感應電極PE1或PE2，以達成前述的防止介電材料層25受壓翹曲而產生電容的干擾之影響。例如對於上述之選定觸控電極TE4而言，其相對的壓力感應電極即為壓力感應電極PE1。若觸控電極之面積大於壓力感應電極，則每一觸控電極則可能對應多個壓力感應電極。因此上述之範例僅為說明本創作之一具體實施方式，而非對於本創作之限制。6 is a top view of the integrated device 10 according to an embodiment of the present invention, mainly showing the distribution of the touch electrodes TE1~TE8, TEn and the pressure sensing electrodes PE1, PE2. As shown in the figure, the pressure electrode layer 30 includes two pressure sensing electrodes PE1, PE2, and each of the touch electrodes TE1~TE8, TEn is opposite to at least one pressure sensing electrode PE1 or PE2. From the perspective of the projection, each touch electrode TE1~TE8, TEn partially overlaps at least one of the pressure sensing electrodes PE1 or PE2, or is adjacent to at least one of the pressure sensing electrodes PE1 or PE2 to achieve the aforementioned dielectric material. Layer 25 is subjected to pressure warpage to cause interference of capacitance. For example, for the selected touch electrode TE4, the opposite pressure sensing electrode is the pressure sensing electrode PE1. If the area of the touch electrode is larger than the pressure sensing electrode, each touch electrode may correspond to a plurality of pressure sensing electrodes. Therefore, the above examples are merely illustrative of one embodiment of the present invention and are not intended to limit the present invention.
參見圖5B，為依據本創作另一實施例之整合裝置10於觸控偵測時序之操作示意圖。該觸控偵測積體電路500除了依序或是隨機將一第一電容感應激勵訊號（觸控電容感應激勵訊號）Vs施加到選定之一觸控電極（例如觸控電極TE4）外，尚且將與第一電容感應激勵訊號Vs同相位之反射訊號Vr施加於該選定的第一觸控電極TE4周遭之觸控電極，例如觸控電極TE3, TE5，以使感應電力線更集中在該選定的觸控電極TE4，增加感應之靈敏度。再者，雖然未明確繪示於圖5B，但是觸控偵測積體電路700也係經由壓力偵測積體電路500內之複數個開關電路580a, 580b而傳送第一電容感應激勵訊號Vs、輔助訊號Va及反射訊號Vr，且接收來自選定觸控電極TE4之觸控感應訊號Vc1。復參見圖3，於上述圖5A, 5B之操作中，輔助訊號Va也可由壓力偵測積體電路500施加到壓力感應電極上。FIG. 5B is a schematic diagram of the operation of the integrated device 10 in the touch detection timing according to another embodiment of the present invention. The touch detection integrated circuit 500 applies a first capacitive sensing excitation signal (touch capacitive sensing excitation signal) Vs to a selected one of the touch electrodes (for example, the touch electrode TE4) in sequence or randomly. Applying a reflected signal Vr that is in phase with the first capacitive sensing excitation signal Vs to the touch electrodes around the selected first touch electrode TE4, such as the touch electrodes TE3, TE5, to concentrate the induced power line on the selected one. The touch electrode TE4 increases the sensitivity of the sensing. Moreover, although not explicitly illustrated in FIG. 5B, the touch detection integrated circuit 700 transmits the first capacitive sensing excitation signal Vs via a plurality of switching circuits 580a, 580b in the pressure detecting integrated circuit 500, The auxiliary signal Va and the reflected signal Vr receive the touch sensing signal Vc1 from the selected touch electrode TE4. Referring to FIG. 3, in the operation of FIG. 5A, FIG. 5B above, the auxiliary signal Va can also be applied to the pressure sensing electrode by the pressure detecting integrated circuit 500.
參見圖4，為說明本創作整合裝置10於壓力偵測時序之操作示意圖。於壓力偵測時序，該複數個觸控電極TE1~TEn經由該壓力偵測積體電路500內之複數個開關電路580a電氣連接至該壓力偵測積體電路500之電容偵測電路50作壓力偵測操作。再者，該壓力偵測積體電路500輸出控制訊號予該觸控偵測積體電路700，俾便中斷或暫停該觸控偵測積體電路700的觸控操作；或者，該壓力偵測積體電路500之虛擬觸控訊號對應電路590輸出複數個虛擬觸控訊號予該觸控偵測積體電路700。Referring to FIG. 4, a schematic diagram of the operation of the authoring integration device 10 for pressure detection timing is illustrated. During the pressure detection sequence, the plurality of touch electrodes TE1~TEn are electrically connected to the capacitance detecting circuit 50 of the pressure detecting integrated circuit 500 via the plurality of switching circuits 580a in the pressure detecting integrated circuit 500. Detection operation. In addition, the pressure detecting integrated circuit 500 outputs a control signal to the touch detection integrated circuit 700 to interrupt or suspend the touch operation of the touch detection integrated circuit 700; or the pressure detection The virtual touch signal corresponding circuit 590 of the integrated circuit 500 outputs a plurality of virtual touch signals to the touch detection integrated circuit 700.
配合參考圖7A及圖7B，為說明本創作之整合裝置10用於壓力感測之操作狀況。本創作之整合裝置10的壓力感測階段，例如可以延續如圖3及圖5A所示之觸控感測操作階段之後立即進行；更具體而言，此壓力感測可在選定觸控電極TE4進行完觸控感測後，對於和選定觸控電極TE4相對的壓力感應電極（例如圖6所示之壓力感應電極PE1）進行或是所有壓力感應電極進行。復參見圖6，與選定觸控電極TE4相對的壓力感應電極為壓力感應電極PE1，因此如圖7A所示，壓力偵測積體電路500之電容偵測電路50對於壓力感應電極PE1施加一用於壓力感測之第二電容感應激勵訊號（壓力電容感應激勵訊號）Vp。此電容偵測電路50具有一同相放大器56，該同相放大器56之增益值較佳為一，可對於此第二電容感應激勵訊號Vp做同相放大以產生遮蔽訊號Vp1，此遮蔽訊號Vp1係施加到非選定的觸控電極TE1~TE3, TE5~TE9及TEn（參見圖6），亦即除了選定觸控電極TE4外之至少部份其他觸控電極。再者，此整合裝置10之電容偵測電路50具有一直流參考訊號源53，可產生一對應激勵訊號Vo施加於選定觸控電極TE4，此對應激勵訊號Vo施加方式可為依序或是隨機。參見圖7B，為說明本創作整合裝置10之部份上視圖，主要繪示觸控電極TE1~TE8, TEn及壓力感應電極PE1, PE2之分布狀況及對應用於壓力感測之第一電容感應激勵訊號Vp、遮蔽訊號Vp1、及對應激勵訊號Vo訊號施加狀況。復配合參見圖7A，在進行壓力感測時，係將與電容感應激勵訊號Vp同相之遮蔽訊號Vp1施加到非選定的觸控電極（亦即非為選定觸控電極TE4之至少部份觸控電極），以遮蔽來自手指操作之電容變化，提高壓力感測精確度。再者，係將一具有預定位準之對應激勵訊號Vo施加到選定觸控電極TE4，以增強相對之壓力感應電極PE1的壓力感測靈敏度。電容偵測電路50之電容讀取電路54可在檢測點P讀取來自壓力感應電極PE1之壓力感應訊號Vc2，即可精確地判斷是否有按壓動作與壓力之大小。7A and 7B, in order to explain the operation state of the integrated device 10 of the present invention for pressure sensing. The pressure sensing phase of the integrated device 10 of the present invention can be performed, for example, immediately after the touch sensing operation phase shown in FIG. 3 and FIG. 5A; more specifically, the pressure sensing can be performed on the selected touch electrode TE4. After the touch sensing is performed, the pressure sensing electrodes (for example, the pressure sensing electrodes PE1 shown in FIG. 6) opposite to the selected touch electrodes TE4 are performed or all of the pressure sensing electrodes are performed. Referring to FIG. 6, the pressure sensing electrode opposite to the selected touch electrode TE4 is the pressure sensing electrode PE1. Therefore, as shown in FIG. 7A, the capacitance detecting circuit 50 of the pressure detecting integrated circuit 500 applies a pressure sensing electrode PE1. The second capacitive induction excitation signal (pressure-capacitance induction excitation signal) Vp of the pressure sensing. The capacitance detecting circuit 50 has a non-inverting amplifier 56. The gain value of the non-inverting amplifier 56 is preferably one. The second capacitive inductive excitation signal Vp can be in-phase amplified to generate a masking signal Vp1. The masking signal Vp1 is applied to the capacitor. The non-selected touch electrodes TE1~TE3, TE5~TE9 and TEn (see FIG. 6), that is, at least some other touch electrodes except the selected touch electrode TE4. Furthermore, the capacitance detecting circuit 50 of the integrated device 10 has a direct current reference signal source 53 for generating a corresponding excitation signal Vo applied to the selected touch electrode TE4. The corresponding excitation signal Vo can be applied in a sequential or random manner. . Referring to FIG. 7B, in order to illustrate a partial upper view of the authoring device 10, the distribution of the touch electrodes TE1~TE8, TEn and the pressure sensing electrodes PE1, PE2 and the corresponding first capacitive sensing for pressure sensing are mainly illustrated. The excitation signal Vp, the masking signal Vp1, and the corresponding excitation signal Vo signal are applied. Referring to FIG. 7A, when the pressure sensing is performed, the masking signal Vp1 in phase with the capacitive sensing excitation signal Vp is applied to the unselected touch electrode (that is, at least part of the touch of the selected touch electrode TE4). Electrode) to mask capacitance changes from finger operation and improve pressure sensing accuracy. Furthermore, a corresponding excitation signal Vo having a predetermined level is applied to the selected touch electrode TE4 to enhance the pressure sensing sensitivity of the pressure sensing electrode PE1. The capacitance reading circuit 54 of the capacitance detecting circuit 50 can read the pressure sensing signal Vc2 from the pressure sensing electrode PE1 at the detecting point P, thereby accurately determining whether there is a pressing action and a magnitude of pressure.
參見圖8A-8C，為依據本創作其他實施例之整合裝置10用於壓力感測之操作狀況。圖8A之實施例類似於圖7A所示實施例，但是電容偵測電路50中用於產生遮蔽訊號Vp1之同相放大器56輸入係不連接到電容讀取電路54之輸入點，例如可直接連接到訊號源520，以避免來自電容讀取電路54輸入點之壓力感應訊號Vc2之影響。圖8B之實施例類似於圖7A所示實施例，但是係以反相放大器59產生與第二電容感應激勵訊號Vp反相之訊號，以作為對應激勵訊號Vo之訊號源；同樣可以達成增強相對之壓力感應電極PE1的壓力感測靈敏度之效果。圖8C之實施例類似於圖8A所示實施例，但是也是以反相放大器59產生與第二電容感應激勵訊號Vp反相之訊號，以作為對應激勵訊號Vo之訊號源；同樣可以達成避免來自電容讀取電路54輸入點之壓力感應訊號Vc2之影響及增強相對之壓力感應電極PE1的壓力感測靈敏度之效果。Referring to Figures 8A-8C, the integrated device 10 in accordance with other embodiments of the present invention is used for pressure sensing operational conditions. The embodiment of FIG. 8A is similar to the embodiment shown in FIG. 7A, but the input of the non-inverting amplifier 56 for generating the masking signal Vp1 in the capacitance detecting circuit 50 is not connected to the input point of the capacitance reading circuit 54, for example, it can be directly connected to The signal source 520 is used to avoid the influence of the pressure sensing signal Vc2 from the input point of the capacitance reading circuit 54. The embodiment of FIG. 8B is similar to the embodiment shown in FIG. 7A, but the signal inverted from the second capacitive inductive excitation signal Vp is generated by the inverting amplifier 59 as a signal source corresponding to the excitation signal Vo; The effect of the pressure sensing sensitivity of the pressure sensing electrode PE1. The embodiment of FIG. 8C is similar to the embodiment shown in FIG. 8A, but also generates a signal inverted from the second capacitive sensing excitation signal Vp by the inverting amplifier 59 as a signal source corresponding to the excitation signal Vo; The effect of the pressure sensing signal Vc2 at the input point of the capacitance reading circuit 54 and the effect of enhancing the pressure sensing sensitivity of the pressure sensing electrode PE1.
圖9為依據本創作另一實施例之觸控電極之上視圖，與圖6之範例相比較，觸控電極TE1-TE11也可為彼此交錯之三角形，例如等腰三角形、直角三角形等。9 is a top view of a touch electrode according to another embodiment of the present invention. Compared with the example of FIG. 6, the touch electrodes TE1-TE11 may also be triangles that are staggered with each other, such as an isosceles triangle, a right triangle, and the like.
此外，在上述實施例中，第一電容感應激勵訊號（觸控電容感應激勵訊號）Vs及第二電容感應激勵訊號（壓力電容感應激勵訊號）Vp係一交變訊號，如一弦波，方波，三角波或梯形波；該第一或第二電容感應感應激勵訊號亦可為一電流源。該對應感應激勵訊號Vo係一直流參考訊號（例如一零電位訊號）或一與該壓力電容感應激勵訊號Vp反相位之交變訊號。In addition, in the above embodiment, the first capacitive sensing excitation signal (touch capacitive sensing excitation signal) Vs and the second capacitive sensing excitation signal (pressure capacitive sensing excitation signal) Vp are an alternating signal, such as a sine wave, square wave The triangular or trapezoidal wave; the first or second capacitive induced inductive signal can also be a current source. The corresponding inductive excitation signal Vo is a continuous reference signal (for example, a zero potential signal) or an alternating signal opposite to the pressure capacitive sensing excitation signal Vp.
參考圖10A，為說明本創作之另一實施例之整合裝置10示意圖，該圖示主要繪示出觸控面板20為互電容式觸控面板。同時並參考圖11A，此整合裝置10包含由上至下之觸控面板20、彈性介電材料層25、及壓力電極層30。該觸控面板20包含由上至下之上基板100(具有一第一表面100a及一第二表面100b)及互電容觸控電極層150。該互電容觸控電極層150包含複數個沿第一方向設置的第一觸控電極110(例如此圖所示之第一觸控電極XE1~XE8)、複數個沿第二方向設置的第二觸控電極120及一絕緣層130，但是須知此圖所示僅為一側視疊層示意圖，因此第一觸控電極110之數量及分布方式不限於此。該些第一觸控電極110係設置於該上基板100之第二表面100b上，且該些第二觸控電極120係設置於該絕緣層130背對該上基板100之一側，亦即相較於該絕緣層130設置且更遠離上基板100。該些第一觸控電極110及該些第二觸控電極120係將該絕緣層130夾置其間，且該些第一觸控電極110係透過該絕緣層130以和整合裝置10其他部份（例如電容偵測電路50，詳見後述）電氣連接。該壓力電極層30係設置於該互電容觸控電極層150背對該保護層100之一側。Referring to FIG. 10A, a schematic diagram of an integrated device 10 according to another embodiment of the present invention is illustrated. The illustration mainly illustrates that the touch panel 20 is a mutual capacitive touch panel. Referring to FIG. 11A, the integrated device 10 includes a top-down touch panel 20, an elastic dielectric material layer 25, and a pressure electrode layer 30. The touch panel 20 includes a top substrate 100 (having a first surface 100a and a second surface 100b) and a mutual capacitance touch electrode layer 150. The mutual-capacitive touch electrode layer 150 includes a plurality of first touch electrodes 110 disposed in a first direction (eg, first touch electrodes XE1 XXE8 as shown in the figure), and a plurality of second electrodes disposed along the second direction The touch electrode 120 and the insulating layer 130 are only shown in the figure. Therefore, the number and distribution of the first touch electrodes 110 are not limited thereto. The first touch electrodes 110 are disposed on the second surface 100b of the upper substrate 100, and the second touch electrodes 120 are disposed on one side of the insulating layer 130 opposite to the upper substrate 100, that is, It is disposed in comparison with the insulating layer 130 and is further away from the upper substrate 100. The first touch electrodes 110 and the second touch electrodes 120 sandwich the insulating layer 130 therebetween, and the first touch electrodes 110 pass through the insulating layer 130 to integrate with other parts of the device 10 . (For example, the capacitance detecting circuit 50, which will be described later in detail) is electrically connected. The pressure electrode layer 30 is disposed on one side of the mutual capacitance touch electrode layer 150 facing away from the protection layer 100.
復參見圖10A，其主要繪示該上基板100、該些第一觸控電極110、該些第二觸控電極120、及該壓力電極層（包含壓力感應電極PE1及PE2）由上視之分布狀況；然在此須知此圖示並未限定該些元件之尺寸關係，而是為了更清楚顯示該些元件之平面配置而故意使其彼此錯開而更易說明。此外該整合裝置10尚且包含位在軟性電路板80上之一觸控偵測積體電路700及一壓力偵測積體電路500，該壓力偵測積體電路500包含一電容偵測電路(例如為一自電容偵測電路，未圖示)。於本實施例中，該些第一觸控電極110(如圖所示之XE1~ XE6)為沿第一方向設置，且第一觸控電極110之數量及分布方式不限於此；再者，該些第二觸控電極120(如圖所示之YE1~ YE4)為沿第二方向設置，且第二觸控電極120之數量及分布方式不限於此，其中該第一方向與該第二方向約略垂直。該整合裝置10更電性連接至一主機600，以接受來自主機600之指令，或是將觸控／壓力測結果傳送到主機600做進一步處理。Referring to FIG. 10A, the upper substrate 100, the first touch electrodes 110, the second touch electrodes 120, and the pressure electrode layers (including the pressure sensing electrodes PE1 and PE2) are viewed from above. The condition of the distribution; however, it should be understood that the illustration does not limit the dimensional relationship of the elements, but is more easily explained in order to more clearly show the planar configuration of the elements. In addition, the integrated device 10 further includes a touch detection integrated circuit 700 and a pressure detecting integrated circuit 500 on the flexible circuit board 80. The pressure detecting integrated circuit 500 includes a capacitance detecting circuit (for example, It is a self-capacitance detection circuit, not shown). In this embodiment, the first touch electrodes 110 (XE1 X XE6 as shown) are disposed along the first direction, and the number and distribution manner of the first touch electrodes 110 are not limited thereto; The second touch electrodes 120 (YE1~ YE4 as shown) are disposed along the second direction, and the number and distribution manner of the second touch electrodes 120 are not limited thereto, wherein the first direction and the second direction are The direction is approximately vertical. The integrated device 10 is further electrically connected to a host 600 to accept commands from the host 600 or to transmit touch/pressure measurements to the host 600 for further processing.
圖11A說明依據圖10A之整合裝置10用於觸控感測之操作狀況；其中第一觸控電極110為感測電極，用以偵測其上是否有手指觸控；而第二觸控電極120為驅動電極。該觸控偵測積體電路700先選定一或多個第二觸控電極120及一或多個第一觸控電極110作觸控偵測。下面說明即以多個選定第二觸控電極120及多個選定第一觸控電極110作為說明，但是須知本創作之概念也可應用於選定單一第二觸控電極120及單一第一觸控電極110之狀況。在觸控偵測階段，觸控偵測積體電路700透過壓力偵測積體電路500內之複數個開關電路580a, 580b電氣連接到選定第一觸控電極110及選定第二觸控電極120。此觸控偵測積體電路700依序或是隨機將觸控發射訊號VTX發送到選定第二觸控電極120且依序或是隨機接收選定第一觸控電極110上之觸控感應訊號VRX之際，同時將一直流參考電壓Vref（例如一零電位電壓）施加於該至少一個的壓力感應電極（如圖10A所示之壓力感應電極PE2），以減少或是完全消除彈性介電材料層25翹曲或是變形對於觸控感測的影響。藉由偵測觸控感應訊號VRX，即可知道對應第一觸控電極110及第二觸控電極120之交叉位置上是否有觸控操作，例如圖10A所示，當施加觸控發射訊號VTX至第二觸控電極YE2並自第一觸控電極XE4接收一觸控感應訊號VRX，便可偵知該交叉處之觸控點T是否有觸碰發生。此外，如圖11A所示，此直流參考電壓Vref也可由壓力偵測積體電路500提供。FIG. 11A illustrates an operation state of the integrated device 10 according to FIG. 10A for touch sensing; wherein the first touch electrode 110 is a sensing electrode for detecting whether there is a finger touch thereon; and the second touch electrode is 120 is the drive electrode. The touch detection integrated circuit 700 first selects one or more second touch electrodes 120 and one or more first touch electrodes 110 for touch detection. The following description is made by using a plurality of selected second touch electrodes 120 and a plurality of selected first touch electrodes 110 as an illustration, but it should be understood that the concept of the present invention can also be applied to selecting a single second touch electrode 120 and a single first touch. The condition of the electrode 110. During the touch detection phase, the touch detection integrated circuit 700 is electrically connected to the selected first touch electrode 110 and the selected second touch electrode 120 through a plurality of switch circuits 580a, 580b in the pressure detecting integrated circuit 500. . The touch detection integrated circuit 700 sequentially or randomly transmits the touch transmission signal VTX to the selected second touch electrode 120 and sequentially or randomly receives the touch sensing signal VRX on the selected first touch electrode 110. At the same time, a constant reference voltage Vref (for example, a zero potential voltage) is simultaneously applied to the at least one pressure sensing electrode (such as the pressure sensing electrode PE2 shown in FIG. 10A) to reduce or completely eliminate the elastic dielectric material layer. 25 The effect of warping or deformation on touch sensing. By detecting the touch sensing signal VRX, it can be known whether there is a touch operation at the intersection of the first touch electrode 110 and the second touch electrode 120, for example, as shown in FIG. 10A, when the touch transmitting signal VTX is applied. The second touch electrode YE2 receives a touch sensing signal VRX from the first touch electrode XE4, and can detect whether the touch point T at the intersection has a touch. Further, as shown in FIG. 11A, the DC reference voltage Vref can also be supplied from the pressure detecting integrated circuit 500.
圖11B說明依據圖10A之整合裝置10用於壓力感測之操作狀況；此實施例可在圖11A之觸控感測後進行。復配合參見圖10A，該壓力偵測積體電路500（例如包含一自電容偵測電路）施加一第二電容感應激勵訊號Vp至對應於選定第一觸控電極之壓力感測電極PE2；依序或是隨機將對應激勵訊號Vo送至選定之第一觸控電極（例如第一觸控電極XE4），該對應激勵訊號Vo也可同時或另行依序或是隨機施加至選定之第二觸控電極120(例如第二觸控電極YE2)；且將遮蔽訊號Vp1施加到非選定的第一觸控電極XE1~XE3，XE5~XE8（或是選定之第一觸控電極XE4附近之至少部份第一觸控電極）及/或非選定之第二觸控電極120(例如第二觸控電極YE1，YE3，YE4)，以遮蔽來自手指之干擾。上述說明中，第二電容感應激勵訊號Vp係一交變訊號，如一弦波，方波，三角波或梯形波；再者，該第二電容感應激勵訊號Vp亦可為一電流源。對應激勵訊號Vo係為與第二電容感應激勵訊號Vp反相之訊號，或是一直流參考訊號（例如一零電位訊號）。遮蔽訊號Vp1係為與第二電容感應激勵訊號Vp同相之訊號。FIG. 11B illustrates an operational condition for pressure sensing in accordance with the integrated device 10 of FIG. 10A; this embodiment can be performed after the touch sensing of FIG. 11A. Referring to FIG. 10A, the pressure detecting integrated circuit 500 (including, for example, a self-capacitance detecting circuit) applies a second capacitive sensing excitation signal Vp to the pressure sensing electrode PE2 corresponding to the selected first touch electrode; The corresponding excitation signal Vo is sent to the selected first touch electrode (for example, the first touch electrode XE4), and the corresponding excitation signal Vo can be simultaneously or randomly applied to the selected second touch. Control electrode 120 (for example, second touch electrode YE2); and apply masking signal Vp1 to non-selected first touch electrodes XE1~XE3, XE5~XE8 (or at least part of selected first touch electrode XE4) The first touch electrode) and/or the unselected second touch electrode 120 (eg, the second touch electrodes YE1, YE3, YE4) to shield interference from the finger. In the above description, the second capacitive sensing excitation signal Vp is an alternating signal, such as a sine wave, a square wave, a triangular wave or a trapezoidal wave; further, the second capacitive sensing excitation signal Vp may also be a current source. The corresponding excitation signal Vo is a signal that is in anti-phase with the second capacitive inductive excitation signal Vp, or a constant current reference signal (for example, a zero potential signal). The masking signal Vp1 is a signal that is in phase with the second capacitive sensing excitation signal Vp.
圖11C說明依據另一實施例的圖10A之整合裝置10用於壓力感測之操作狀況。此整合觸控與壓力感測之裝置10類似圖11B實施例，在進行壓力感測時，電容偵測電路50施加一直流參考電壓Vref至非選定的第一觸控電極XE1~XE3, XE5~XE8，及/或非選定之第二觸控電極120(例如第二觸控電極YE1，YE3，YE4)，以遮蔽來自手指之干擾，其中該直流參考電壓Vref可為一零電位電壓。Figure 11C illustrates the operational condition of the integrated device 10 of Figure 10A for pressure sensing, in accordance with another embodiment. The integrated touch and pressure sensing device 10 is similar to the embodiment of FIG. 11B. When performing pressure sensing, the capacitance detecting circuit 50 applies the DC reference voltage Vref to the unselected first touch electrodes XE1 X XE3, XE5~ XE8, and/or non-selected second touch electrodes 120 (eg, second touch electrodes YE1, YE3, YE4) to shield interference from the finger, wherein the DC reference voltage Vref can be a zero potential voltage.
復配合參見圖10B，為依據本創作另一實施例之整合裝置10之上視圖，且此整合裝置10之觸控面板20也為互電容式觸控面板。第一觸控電極110為沿第一方向設置，即如圖所示之第一至第五行（TX1~TX5）第一觸控電極XE11~XE13、XE21~XE23、XE31~XE33、XE41~XE43、XE51~XE53，且同行之該些第一觸控電極110以一導體跨橋112兩兩互相連接。第二觸控電極120為沿第二方向設置，即如圖所示之第一至第三列（RX1~RX3）第二觸控電極YE11~YE15、YE21~YE25、YE31~YE35，且同列之該些第二觸控電極120以一導體跨橋122兩兩互相連接。再者，導體跨橋112及導體跨橋122有絕緣層（未圖示）隔離以避免短路，該等導體跨橋係金屬或ITO(銦錫氧化物)。FIG. 10B is a top view of the integrated device 10 according to another embodiment of the present invention, and the touch panel 20 of the integrated device 10 is also a mutual capacitive touch panel. The first touch electrodes 110 are disposed along the first direction, that is, the first to fifth rows (TX1~TX5) of the first touch electrodes XE11~XE13, XE21~XE23, XE31~XE33, XE41~XE43, The first touch electrodes 110 of the XE51~XE53 are connected to each other by a conductor across the bridge 112. The second touch electrode 120 is disposed along the second direction, that is, the first to third columns (RX1 RX3) of the second touch electrodes YE11~YE15, YE21~YE25, YE31~YE35, and the same column The second touch electrodes 120 are connected to each other by a conductor across the bridge 122. Furthermore, the conductor bridge 112 and the conductor bridge 122 are insulated by an insulating layer (not shown) to avoid short circuits that span the bridge metal or ITO (indium tin oxide).
請參考圖12，其係為本創作之一具體實例之自電容偵測電路之示意圖。該電容偵測電路50可為圖示之自電容偵測電路且包含一電容激勵驅動電路52及一電容讀取電路54，以偵測電容讀取點P之電容變化值。該電容激勵驅動電路52包含一訊號源520、一驅動器522（包含第二阻抗522a及第三阻抗522b）。該電容讀取電路54包含一差動放大器540、一第一阻抗542及一第一電容544，以偵測一感應電極60上之電容變化，此感應電極60有附帶之第一雜散電容62及一第二雜散電容64。Please refer to FIG. 12 , which is a schematic diagram of a self-capacitance detecting circuit of one specific example of the present invention. The capacitance detecting circuit 50 can be a self-capacitance detecting circuit as shown and includes a capacitive excitation driving circuit 52 and a capacitance reading circuit 54 to detect a capacitance change value of the capacitance reading point P. The capacitor excitation driving circuit 52 includes a signal source 520 and a driver 522 (including a second impedance 522a and a third impedance 522b). The capacitor reading circuit 54 includes a differential amplifier 540, a first impedance 542 and a first capacitor 544 for detecting a change in capacitance on a sensing electrode 60. The sensing electrode 60 has a first stray capacitance 62 attached thereto. And a second stray capacitance 64.
該訊號源520電性連接至該第一阻抗542及該第二阻抗522a；該第一阻抗542電性連接至該第一電容544；該第一電容544電性連接至該差動放大器540之該第一輸入端540a；該第二阻抗522a電性連接至該差動放大器540之該第二輸入端540b；該感應電極60經由該電容偵測電路50之一接點而連接至該第二阻抗522a及該差動放大器540之該第二輸入端540b；該第一雜散電容62電性連接至該接腳；該第二雜散電容64電性連接至該感應電極60。The signal source 520 is electrically connected to the first impedance 542 and the second impedance 522a; the first impedance 542 is electrically connected to the first capacitor 544; the first capacitor 544 is electrically connected to the differential amplifier 540 The first input end 540a is electrically connected to the second input end 540b of the differential amplifier 540. The sensing electrode 60 is connected to the second via a contact of the capacitance detecting circuit 50. An impedance 522a and the second input end 540b of the differential amplifier 540; the first stray capacitance 62 is electrically connected to the pin; the second stray capacitance 64 is electrically connected to the sensing electrode 60.
在圖12所示之自電容偵測電路50中，該感應電極60係感應手指或各類導體或物件之觸碰而接收一觸控訊號；該訊號源520係一週期性之輸入訊號至該第三阻抗522b，且該第一阻抗542之阻抗值等於該第二阻抗522a之阻抗值；該差動放大器540係依據該輸入訊號及該觸控訊號使得該輸出端540c輸出差動放大後之一觸控訊號，該第一電容544之電容值等於該第一雜散電容62及該第二雜散電容64並聯之電容值，當手指或各類導體或物件接近該感應電極60時，該第二雜散電容64之電容值會改變以使得該第一輸入端540a及該第二輸入端540b之電壓值不同，經由該差動放大器540差動放大之後，該輸出端540c輸出放大後之該觸控訊號，透過量測該差動放大器540之輸出變化，以分辨該感應電極60所產生之微量電容值改變，可以有效排除電路、電源等雜訊所造成的干擾，並量測到微量電容值改變。此外，此電容偵測電路50（亦即一自電容偵測電路）之更完整細節可參見同一申請人之發明I473001微量阻抗變化檢測裝置所揭露之自電容偵測電路技術。In the self-capacitance detecting circuit 50 shown in FIG. 12, the sensing electrode 60 senses a touch of a finger or various types of conductors or objects to receive a touch signal; the signal source 520 is a periodic input signal to the a third impedance 522b, and the impedance value of the first impedance 542 is equal to the impedance value of the second impedance 522a; the differential amplifier 540 causes the output terminal 540c to output a differential amplification according to the input signal and the touch signal. a touch signal, the capacitance value of the first capacitor 544 is equal to the capacitance value of the first stray capacitance 62 and the second stray capacitance 64 in parallel. When a finger or various types of conductors or objects approach the sensing electrode 60, the The capacitance value of the second stray capacitance 64 is changed such that the voltage values of the first input terminal 540a and the second input terminal 540b are different. After the differential amplifier 540 is differentially amplified, the output terminal 540c outputs the amplified value. The touch signal is used to measure the change of the output of the differential amplifier 540 to distinguish the change of the trace capacitance generated by the sensing electrode 60, thereby effectively eliminating interference caused by noises such as circuits and power supplies, and measuring the trace amount. Capacitance value change. In addition, for more details of the capacitance detecting circuit 50 (ie, a self-capacitance detecting circuit), refer to the self-capacitance detecting circuit technology disclosed in the same applicant's invention I473001 trace impedance change detecting device.
於上述各實施例及偵測時序中，該上基板100係一玻璃基板、一高分子材料之薄膜基板、或是一硬質的塗佈層，用以保護觸控電極層免於刮擦、觸碰與水氣的損壞。該彈性介電材料層25包含一彈性膠質材料，該彈性膠質材料遇壓力時體積壓縮變形，並於除去壓力時回復原有的體積與形狀，該彈性介電材料層25例如可為（但是不限於）聚二甲基矽氧烷（Polydimethylsiloxane，PDMS）材料或一光學膠。該彈性介電材料層25除了如上述實施例是介於該觸控面板20與該壓力電極層30之間，亦可設置於該壓力電極層30背對該觸控面板20之一側。壓力電極層30係一顯示螢幕的靜電保護層，共同電壓層，陰極層；或是一顯示螢幕中由導電材料形成之偏光層。In the above embodiments and the detection timing, the upper substrate 100 is a glass substrate, a film substrate of a polymer material, or a hard coating layer for protecting the touch electrode layer from scratching and touching. Touch and damage of moisture. The layer of elastic dielectric material 25 comprises an elastic colloidal material which is compressively deformed in volume upon pressure and returns to its original volume and shape upon removal of pressure. The layer of elastic dielectric material 25 can be, for example (but not Limited to polydimethylsiloxane (PDMS) materials or an optical gel. The elastic dielectric material layer 25 may be disposed between the touch panel 20 and the pressure electrode layer 30 as in the above embodiment, or may be disposed on the side of the pressure electrode layer 30 facing away from the touch panel 20 . The pressure electrode layer 30 is an electrostatic protection layer for displaying a screen, a common voltage layer, a cathode layer, or a polarizing layer formed of a conductive material in the display screen.
然以上所述者，僅為本創作之較佳實施例，當不能限定本創作實施之範圍，即凡依本創作申請專利範圍所作之均等變化與修飾等，皆應仍屬本創作之專利涵蓋範圍意圖保護之範疇。本創作還可有其它多種實施例，在不背離本創作精神及其實質的情況下，熟悉本領域的技術人員當可根據本創作作出各種相應的改變和變形，但這些相應的改變和變形都應屬於本創作所附的權利要求的保護範圍。綜上所述，當知本創作已具有產業利用性、新穎性與進步性，又本創作之構造亦未曾見於同類產品及公開使用，完全符合創作專利申請要件，爰依專利法提出申請。However, the above is only a preferred embodiment of the present invention, and the scope of the present invention cannot be limited, that is, the equal changes and modifications made by the scope of the patent application of the present invention should still be covered by the patent of the present invention. The scope of the scope is intended to protect. There may be other various embodiments of the present invention, and those skilled in the art can make various corresponding changes and modifications according to the present invention without departing from the spirit of the present invention, but the corresponding changes and modifications are It is intended to fall within the scope of the appended claims. In summary, when the creation of this book has industrial utilization, novelty and progressiveness, and the structure of this creation has not been seen in similar products and public use, it fully meets the requirements for the creation of patent applications, and applies for the application according to the patent law.
10a‧‧‧觸控裝置10a‧‧‧ touch device
10‧‧‧觸控與壓力感測之整合裝置10‧‧‧ Integrated device for touch and pressure sensing
100‧‧‧上基板100‧‧‧Upper substrate
100a‧‧‧第一表面100a‧‧‧ first surface
100b‧‧‧第二表面100b‧‧‧ second surface
150‧‧‧互電容觸控電極層150‧‧‧ Mutual Capacitive Touch Electrode Layer
110‧‧‧第一觸控電極110‧‧‧First touch electrode
120‧‧‧第二觸控電極120‧‧‧Second touch electrode
130‧‧‧絕緣層130‧‧‧Insulation
20a, 20‧‧‧觸控面板20a, 20‧‧‧ touch panel
22a, 22‧‧‧導電墊22a, 22‧‧‧Electrical mat
24a, 24‧‧‧電極連接線24a, 24‧‧‧electrode cable
25‧‧‧彈性介電材料層25‧‧‧Elastic dielectric material layer
30‧‧‧壓力電極層30‧‧‧pressure electrode layer
TE1~TEn‧‧‧觸控電極TE1~TEn‧‧‧ touch electrode
PE1, PE2‧‧‧壓力感應電極PE1, PE2‧‧‧ pressure sensing electrode
80a‧‧‧軟性電路板80a‧‧‧Soft circuit board
80‧‧‧軟性電路板80‧‧‧Soft circuit board
50‧‧‧電容偵測電路50‧‧‧Capacitance detection circuit
52‧‧‧電容激勵驅動電路52‧‧‧Capacitor excitation drive circuit
520‧‧‧訊號源520‧‧‧Signal source
522‧‧‧驅動器522‧‧‧ drive
53‧‧‧直流參考訊號源53‧‧‧DC Reference Signal Source
54‧‧‧電容讀取電路54‧‧‧Capacitor reading circuit
56‧‧‧同相放大器56‧‧‧In-phase amplifier
59‧‧‧反相放大器59‧‧‧Inverting amplifier
Vref‧‧‧直流參考電壓Vref‧‧‧DC reference voltage
VRX‧‧‧觸控感應訊號VRX‧‧‧ touch sensing signal
VTX‧‧‧觸控發射訊號VTX‧‧‧ touch transmit signal
Vs‧‧‧第一電容感應激勵訊號Vs‧‧‧first capacitive induction excitation signal
Vp‧‧‧第二電容感應激勵訊號Vp‧‧‧second capacitive induction excitation signal
Vp1‧‧‧遮蔽訊號Vp1‧‧‧ shadow signal
Vc1‧‧‧觸控感應訊號Vc1‧‧‧ touch sensing signal
Vc2‧‧‧壓力感應訊號Vc2‧‧‧pressure sensing signal
Vo‧‧‧對應激勵訊號Vo‧‧‧ corresponding incentive signal
542‧‧‧第一阻抗542‧‧‧First impedance
522a‧‧‧第二阻抗522a‧‧‧second impedance
522b‧‧‧第三阻抗522b‧‧‧ third impedance
540‧‧‧差動放大器540‧‧‧Differential Amplifier
544‧‧‧第一電容544‧‧‧first capacitor
60‧‧‧感應電極60‧‧‧Induction electrode
62‧‧‧第一雜散電容62‧‧‧First stray capacitance
64‧‧‧第二雜散電容64‧‧‧Second stray capacitance
540a, 540b‧‧‧輸入端540a, 540b‧‧‧ input
540c‧‧‧輸出端540c‧‧‧output
600a, 600‧‧‧主機600a, 600‧‧‧ host
500‧‧‧壓力偵測積體電路500‧‧‧Pressure detection integrated circuit
700a, 700‧‧‧觸控偵測積體電路700a, 700‧‧‧Touch detection integrated circuit
圖1為一觸控裝置之示意圖。FIG. 1 is a schematic diagram of a touch device.
圖2為說明本創作觸控與壓力感測整合裝置之示意圖。FIG. 2 is a schematic diagram illustrating the integrated touch and pressure sensing integrated device of the present invention.
圖3為說明本創作整合裝置於觸控偵測時序之操作示意圖。FIG. 3 is a schematic diagram showing the operation of the creative integration device in the touch detection timing.
圖4為說明本創作整合裝置於壓力偵測時序之操作示意圖。FIG. 4 is a schematic diagram showing the operation of the authoring integrated device in the pressure detecting sequence.
圖5A說明依據一實施例本創作整合裝置於觸控偵測之施加訊號示意圖。FIG. 5A illustrates a schematic diagram of a signal applied to a touch detection device according to an embodiment of the present invention.
圖5B說明依據另一實施例本創作整合裝置於觸控偵測之施加訊號示意圖。FIG. 5B illustrates a schematic diagram of applying a signal to the touch detection device according to another embodiment.
圖6說明依據一實施例本創作整合裝置之電極部份上視圖。Figure 6 illustrates a top view of an electrode portion of the authoring integrated device in accordance with an embodiment.
圖7A說明依據一實施例本創作整合裝置於壓力偵測之施加訊號示意圖。FIG. 7A illustrates a schematic diagram of the application of the creative integration device to pressure detection in accordance with an embodiment.
圖7B說明本創作整合裝置之電極部份施加訊號之上視圖。Figure 7B illustrates a top view of the application of the electrode portion of the authoring integrated device.
圖8A-8C為說明依據其他實施例本創作整合裝置於壓力偵測之施加訊號示意圖。8A-8C are schematic diagrams illustrating the application of the creative integration device to pressure detection according to other embodiments.
圖9為說明依據另一實施例之觸控電極上視圖。FIG. 9 is a top view illustrating a touch electrode according to another embodiment.
圖10A及10B為說明本創作之整合裝置使用互電容式觸控面板之上視圖。10A and 10B are top views showing the use of a mutual capacitive touch panel in the integrated device of the present invention.
圖11A-11C分別說明圖10A整合裝置於觸控及壓力偵測時之施加訊號示意圖。11A-11C illustrate schematic diagrams of the applied signals of the integrated device of FIG. 10A during touch and pressure detection, respectively.
圖12說明本創作自電容偵測電路之詳細電路圖。Figure 12 illustrates a detailed circuit diagram of the self-capacitance detecting circuit of the present invention.
10‧‧‧觸控與壓力感測之整合裝置 10‧‧‧ Integrated device for touch and pressure sensing
20‧‧‧觸控面板 20‧‧‧Touch panel
22‧‧‧導電墊 22‧‧‧Electrical mat
24‧‧‧電極連接線 24‧‧‧electrode cable
30‧‧‧壓力電極層 30‧‧‧pressure electrode layer
TE1~TEn‧‧‧觸控電極 TE1~TEn‧‧‧ touch electrode
500‧‧‧壓力偵測積體電路 500‧‧‧Pressure detection integrated circuit
600‧‧‧主機 600‧‧‧Host
700‧‧‧觸控偵測積體電路 700‧‧‧Touch detection integrated circuit
80‧‧‧軟性電路板 80‧‧‧Soft circuit board
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105207788U TWM538614U (en) | 2016-05-26 | 2016-05-26 | Integral device for sensing touch control and force |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105207788U TWM538614U (en) | 2016-05-26 | 2016-05-26 | Integral device for sensing touch control and force |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM538614U true TWM538614U (en) | 2017-03-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105207788U TWM538614U (en) | 2016-05-26 | 2016-05-26 | Integral device for sensing touch control and force |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM538614U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI639109B (en) | 2017-06-26 | 2018-10-21 | 英屬開曼群島商敦泰電子有限公司 | A pressure correction method and a pressure correction system for a capacitive pressure sensing panel |
-
2016
- 2016-05-26 TW TW105207788U patent/TWM538614U/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI639109B (en) | 2017-06-26 | 2018-10-21 | 英屬開曼群島商敦泰電子有限公司 | A pressure correction method and a pressure correction system for a capacitive pressure sensing panel |
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