TWM537776U - Structure of printed circuit board - Google Patents
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- TWM537776U TWM537776U TW105216610U TW105216610U TWM537776U TW M537776 U TWM537776 U TW M537776U TW 105216610 U TW105216610 U TW 105216610U TW 105216610 U TW105216610 U TW 105216610U TW M537776 U TWM537776 U TW M537776U
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Description
本創作有關於一種印刷電路板結構，特別是指一種適合用於軟性電路板的板端連接部的印刷電路板結構。 The present invention relates to a printed circuit board structure, and more particularly to a printed circuit board structure suitable for use in a board end connection of a flexible circuit board.
隨著資訊技術、無線行動通訊和資訊家電的快速發展與應用，為了達到攜帶便利、體積輕巧化的目的，許多資訊產品內部的各種電子元件採用軟性電路板加以連接，以縮減資訊設備電路模組的厚度及尺寸，且使得電路元件位置的安排更具有彈性。 With the rapid development and application of information technology, wireless mobile communication and information appliances, in order to achieve portability and compactness, various electronic components inside many information products are connected by flexible circuit boards to reduce information equipment circuit modules. The thickness and size, and the arrangement of circuit components is more flexible.
如圖1所示，為一現有的軟性的電路基板1的構造，電路基板1通常具有一板端連接部2，電路基板1在板端連接部2的一側具有一接合邊緣3，且於板端連接部2的範圍內設置多個長條狀的金手指接點4，用以作為電路基板4和軟板連接器電性連接的電路接點。 As shown in FIG. 1, the structure of a conventional flexible circuit board 1 generally has a board end connecting portion 2 having a joint edge 3 on one side of the board end connecting portion 2, and A plurality of elongated gold finger contacts 4 are provided in the range of the board end connecting portion 2 for use as circuit contacts for electrically connecting the circuit board 4 and the board connector.
在軟性印刷電路板的製造流程中，電路基板1的接合邊緣3會連接一捨棄部(圖中未示)，且每一個金手指接點4會延伸到捨棄部，並且和捨棄部中的一個導電金屬部連接，然後當電路基板1成型完成後，再以切斷方式將電路基板1和捨棄部沿著所述接合邊緣3切斷。 In the manufacturing process of the flexible printed circuit board, the joint edge 3 of the circuit substrate 1 is connected to a reject portion (not shown), and each of the gold finger joints 4 extends to the reject portion, and one of the discarded portions The conductive metal portions are connected, and then, after the circuit substrate 1 is molded, the circuit substrate 1 and the discarded portion are cut along the joint edge 3 in a cutting manner.
如圖1A所示，當電路基板1切斷時，每一個金手指接點4被切斷處的位置會很容易產生毛邊5。由於現有的電路基板的金手指設計均為具有均一寬度的長條形狀，且再加上金手指接點4彼此間的距離相當狹小，因此電路基板1切斷時，如果金手指接點4於切斷位置產生較大尺寸的金屬屑5a時，則容易使得兩相鄰的金 手指接點4產生短路現象。 As shown in Fig. 1A, when the circuit substrate 1 is cut, the position where each of the gold finger joints 4 is cut can easily generate the burrs 5. Since the gold finger design of the existing circuit substrate has a strip shape having a uniform width, and the distance between the gold finger contacts 4 is relatively narrow, when the circuit substrate 1 is cut, if the gold finger joint 4 is When the cutting position produces a large size of metal shavings 5a, it is easy to make two adjacent gold Finger contact 4 creates a short circuit.
由於以上原因，造成現有的電路基板的金手指接點容易因為切斷位置的毛邊或金屬屑造成短路現象，導致良率下降。故如何藉由結構設計的改良，來克服電路基板金手指接點上述的缺失，已成為該項事業所欲解決的重要課題。 Due to the above reasons, the golden finger joint of the existing circuit board is liable to cause a short circuit due to a burr or metal shavings at the cutting position, resulting in a decrease in yield. Therefore, how to overcome the above-mentioned lack of gold finger joints on circuit boards by improving the structural design has become an important issue to be solved by this business.
本創作主要目的在於提供一種能夠解決現有的印刷電路板的板端連接部切斷後金手指接點容易產生短路問題的印刷電路板結構。 The main purpose of the present invention is to provide a printed circuit board structure capable of solving the problem that a gold finger contact is likely to cause a short circuit after the board end connection portion of the conventional printed circuit board is cut.
本創作其中一實施例提供一種印刷電路板結構，其中包括：一電路基板，電路基板的一側邊具有一接合邊緣，以及一靠近於於接合邊緣的板端連接部，電路基板的表面位於板端連接部的範圍內具有多個金手指接點；其中多個金手指接點靠近於接合邊緣的一端定義為一末端部分，每一金手指接點的末端部分和接合邊緣保持一間距，且每一金手指接點分別具有一從末端部分延伸到接合邊緣的延伸部，每一延伸部位於接合邊緣位置處形成一切斷部，且每一切斷部的寬度小於金手指接點的末端部分的寬度。 One embodiment of the present invention provides a printed circuit board structure including: a circuit substrate having a bonding edge on one side of the circuit substrate and a board end connection portion adjacent to the bonding edge, the surface of the circuit substrate being located on the board a plurality of gold finger joints in the range of the end connection portion; wherein one end of the plurality of gold finger joints adjacent to the joint edge is defined as an end portion, and the end portion of each gold finger joint and the joint edge maintain a spacing, and Each of the gold finger joints has an extension extending from the end portion to the joint edge, each extension portion forming a cut portion at the joint edge position, and each cut portion has a width smaller than that of the end portion of the gold finger joint width.
本創作較佳實施例中，其中每一金手指接點的延伸部呈長條形。 In a preferred embodiment of the present invention, the extension of each of the gold finger joints is elongated.
本創作較佳實施例中，其中每一延伸部的兩側邊分別具有一從末端部分的兩側邊連接到切斷部兩側的一傾斜邊。 In a preferred embodiment of the present invention, each of the two sides of each of the extending portions has a slanting edge that is connected from both side edges of the end portion to both sides of the cutting portion.
本創作較佳實施例中，其中每一延伸部的兩側邊分別具有一從末端部分的兩側邊連接到切斷部兩側的一弧形邊。 In a preferred embodiment of the present invention, each of the two sides of each of the extending portions has an arcuate side connected to both sides of the cutting portion from both side edges of the end portion.
本創作較佳實施例中，其中每一金手指接點的延伸部的一側邊為從金手指接點的一側邊延伸而成的直線部，且延伸部相對於直線部的另一側邊為從金手指接點的末端部分的一側連接到切斷部一側邊的一傾斜邊。 In a preferred embodiment of the present invention, one side of the extension of each gold finger joint is a straight portion extending from one side of the gold finger joint, and the extension portion is opposite to the other side of the straight portion. The side is connected to a side of the end portion of the gold finger joint to a side of the side of the cut portion.
本創作較佳實施例中，其中每一金手指接點和延伸部存在下 列關係：W2<W1且P>1.5×W2；其中W1代表每一金手指接點的末端部分的寬度；W2代表每一延伸部的切斷部的寬度；P代表每相鄰的兩金手指接點的節距。 In the preferred embodiment of the present invention, each of the gold finger joints and extensions are present Column relationship: W2<W1 and P>1.5×W2; where W1 represents the width of the end portion of each gold finger joint; W2 represents the width of the cut portion of each extension; P represents each adjacent two gold fingers The pitch of the contacts.
本創作較佳實施例中，其中每一金手指接點和延伸部存在下列關係：W2<W1且P>2×W2。 In the preferred embodiment of the present invention, each of the golden finger joints and the extension has the following relationship: W2 < W1 and P > 2 × W2.
本創作較佳實施例中，其中每一延伸部的高度介於0.5倍至2倍的金手指接點的寬度之間的範圍內。 In a preferred embodiment of the present invention, the height of each extension is in the range between 0.5 and 2 times the width of the gold finger joint.
本創作有益效果為能夠透過上述結構避免印刷電路板的接合邊緣切斷後，每一金手指接點因切斷部位的毛邊或金屬屑相互接觸導致短路情形發生。 The author has the beneficial effect that after the joint edge of the printed circuit board is cut through the above structure, the short-circuit situation occurs due to the contact of the burrs or metal chips of each of the gold finger joints with each other.
為使能更進一步瞭解本創作的特徵及技術內容，請參閱以下有關本創作的詳細說明與附圖，然而所附圖式僅提供參考與說明用，並非用來對本創作加以限制者。 In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and description, and are not intended to limit the creation.
1‧‧‧電路基板 1‧‧‧ circuit substrate
2‧‧‧板端連接部 2‧‧‧Board connection
3‧‧‧接合邊緣 3‧‧‧ joint edge
4‧‧‧金手指接點 4‧‧‧Gold Finger Contact
5‧‧‧毛邊 5‧‧‧Mamma
5a‧‧‧金屬屑 5a‧‧‧ metal shavings
10‧‧‧電路基板 10‧‧‧ circuit board
11‧‧‧板端連接部 11‧‧‧ Board end connection
12‧‧‧接合邊緣 12‧‧‧ joint edge
13‧‧‧金手指接點 13‧‧‧Gold Finger Contact
131‧‧‧末端部分 131‧‧‧End part
14‧‧‧延伸部 14‧‧‧Extension
141‧‧‧切斷部 141‧‧‧cutting department
20‧‧‧捨棄部 20‧‧ ‧ abandonment department
21‧‧‧導電金屬部 21‧‧‧Electrical Metals
L‧‧‧切斷線 L‧‧‧ cut line
P‧‧‧節距 P‧‧‧ pitch
W1‧‧‧末端部分寬度 W1‧‧‧ end section width
W2‧‧‧切斷部寬度 W2‧‧‧cutting width
h‧‧‧延伸部高度 h‧‧‧Extension height
圖1為一現有的印刷電路板金手指結構的構造示意圖。 1 is a schematic view showing the construction of a conventional printed circuit board gold finger structure.
圖1A為圖1所示的現有印刷電路板金手指結構的局部放大構造示意圖。 1A is a partially enlarged schematic view showing the structure of a gold finger of the conventional printed circuit board shown in FIG. 1.
圖2為本創作印刷電路板結構於捨棄部切斷前狀態的構造示意圖。 FIG. 2 is a schematic structural view showing the state of the printed circuit board structure before the cutting portion is cut.
圖3為本創作印刷電路板結構於捨棄部切斷後狀態的構造示意圖。 FIG. 3 is a schematic structural view showing a state in which the printed circuit board structure is cut off after the discarded portion is created.
圖3A為本創作印刷電路板結構從圖3所取的局部放大構造示意圖。 FIG. 3A is a partially enlarged schematic structural view of the structure of the printed circuit board taken from FIG. 3. FIG.
圖4為本創作印刷電路板結構的延伸部另一具體實施例的局部放大構造示意圖。 4 is a partially enlarged schematic view showing another embodiment of an extension of the structure of the printed circuit board.
圖5為本創作印刷電路板結構的延伸部另一具體實施例的局部放大構造示意圖。 FIG. 5 is a partially enlarged schematic view showing another embodiment of an extension of the structure of the printed circuit board.
圖6為本創作印刷電路板結構的延伸部另一具體實施例的局部放大構造示意圖。 Fig. 6 is a partially enlarged schematic view showing another embodiment of the extension of the structure of the printed circuit board.
如圖2及圖3所示，本創作印刷電路板結構為針對電路基板 的金手指接點在電路基板切斷後容易因為金手指切斷部位的毛邊或金屬屑造成短路問題加以改良。 As shown in FIG. 2 and FIG. 3, the printed circuit board structure of the present invention is for a circuit substrate. The gold finger contact is easily corrected by the burrs of the gold finger cutting portion or the metal shavings after the circuit board is cut.
如圖2所示，為本創作印刷電路板結構的電路基板10於製造完成後尚未切斷狀態下的構造，其中電路基板10的一側邊具有一板端連接部11，電路基板10於板端連接部11的表面設置有多個並排的金手指接點13，每一金手指接點為以金屬箔材料製成，用以作為電路基板10和連接器或其他電連接裝置接觸的電連接點。電路基板10於板端連接部11的外側還進一步連接一捨棄部20，如圖2所示，捨棄部20和電路基板10的板端連接部11是以切割線L為分界，且於電路基板10製造完成後，會將捨棄部20切除，形成如圖3所示的電路基板10。捨棄部20的表面還具有一導電金屬部21，導電金屬部21同樣以導電金屬製成。每一個金手指接點13靠近捨棄部20的一端分別具有一延伸部14，且各個延伸部14的一端連接於金手指接點13的末端，而另一端則延伸到捨棄部20中並和導電金屬部21相互連接。 As shown in FIG. 2, the circuit board 10 of the present invention is in a state in which the circuit board 10 has not been cut off after the manufacturing is completed, wherein one side of the circuit board 10 has a board end connecting portion 11, and the circuit board 10 is on the board. The surface of the end connecting portion 11 is provided with a plurality of side-by-side gold finger joints 13, each of which is made of a metal foil material for electrical connection between the circuit substrate 10 and a connector or other electrical connecting device. point. The circuit board 10 is further connected to a stripping portion 20 on the outer side of the board end connecting portion 11. As shown in FIG. 2, the discarding portion 20 and the board end connecting portion 11 of the circuit board 10 are defined by a cutting line L, and are on the circuit board. After the manufacturing is completed, the discarded portion 20 is cut away to form the circuit substrate 10 as shown in FIG. The surface of the reject portion 20 also has a conductive metal portion 21 which is also made of a conductive metal. Each of the gold finger joints 13 has an extension portion 14 near one end of the reject portion 20, and one end of each extension portion 14 is connected to the end of the gold finger joint 13, and the other end extends into the reject portion 20 and is electrically conductive. The metal portions 21 are connected to each other.
其中導電金屬部21的作用為電路基板10上的各個金手指接點13以及電路基板10內部的導電線路(圖中未示)進行電鍍成型時的電極接點，當電路基板10的製程完成時，會沿著圖2所示的切斷線L的位置將電路基板10和捨棄部20切斷。如圖3所示，電路基板10切斷後的邊緣形成一接合邊緣12，電路基板10能夠以接合邊緣12的一端***於連接器或其他電連接裝置中，使得板端連接部11中的各個金手指接點13和連接器或其他電連接裝置的電路接點接觸。 The conductive metal portion 21 functions as an electrode contact when the gold finger joint 13 on the circuit board 10 and the conductive line (not shown) inside the circuit board 10 are plated, when the circuit substrate 10 is completed. The circuit board 10 and the reject unit 20 are cut along the position of the cutting line L shown in FIG. 2 . As shown in FIG. 3, the cut edge of the circuit substrate 10 forms a joint edge 12, and the circuit substrate 10 can be inserted into the connector or other electrical connection device at one end of the joint edge 12, so that each gold in the board end connection portion 11 The finger contact 13 is in contact with a circuit contact of a connector or other electrical connection.
本創作該實施例中，電路基板10為一軟性印刷電路板，然而實際運用時，本創作的技術也可以運用於其他類型的印刷電路板上，而不限於軟性印刷電路板的範疇。 In this embodiment, the circuit substrate 10 is a flexible printed circuit board. However, in actual use, the art of the present invention can be applied to other types of printed circuit boards, and is not limited to the category of flexible printed circuit boards.
如圖3及圖3A所示，本創作第一實施例中，每一金手指接點13靠近於接合邊緣12的一端定義為一末端部分131，每一所述金 手指接點13的末端部分131和所述接合邊緣12保持一間距，且每一延伸部14分別從金手指接點13的末端部分131延伸到電路基板10的接合邊緣12。 As shown in FIG. 3 and FIG. 3A, in the first embodiment of the present invention, one end of each gold finger joint 13 adjacent to the joint edge 12 is defined as an end portion 131, each of which is gold. The end portion 131 of the finger contact 13 and the joint edge 12 are spaced apart, and each of the extensions 14 extends from the end portion 131 of the gold finger joint 13 to the joint edge 12 of the circuit substrate 10, respectively.
如圖2所示，本創作的電路基板10於進行切斷時，切斷線L的位置通過每一個延伸部14，因此使得電路基板10切斷後，每一延伸部14的末端分別位於電路基板10的接合邊緣12處。 As shown in FIG. 2, when the circuit board 10 of the present invention is cut, the position of the cutting line L passes through each of the extending portions 14, so that the end of each extending portion 14 is respectively located on the circuit substrate after the circuit substrate 10 is cut. At the joint edge 12 of 10.
如圖3A所示，本創作的第一實施例中，每一延伸部14位於接合邊緣12的位置形成一切斷部141。本創作的主要特點，在於每一延伸部14的切斷部141的寬度小於所述金手指接點13的末端部分131的寬度。因此，當電路基板10進行切斷時，是從延伸部14的切斷部141的位置處切斷。由於各個切斷部141的寬度小於金手指接點13的末端部分131的寬度，因此將能夠減少電路基板10切斷時，金手指接點13的末端部分131和捨棄部20的導電金屬部21連接的金屬導體的切斷面積，進而減少電路基板10在接合邊緣12位置產生的毛邊或金屬屑的數量及尺寸，以避免產生短路情形。 As shown in FIG. 3A, in the first embodiment of the present invention, each of the extending portions 14 is located at a position where the engaging edge 12 is formed to form a cut portion 141. The main feature of the present invention is that the width of the cut portion 141 of each extension portion 14 is smaller than the width of the end portion 131 of the gold finger joint 13. Therefore, when the circuit board 10 is cut, it is cut from the position of the cut portion 141 of the extending portion 14. Since the width of each of the cut portions 141 is smaller than the width of the end portion 131 of the gold finger joint 13, it is possible to reduce the end portion 131 of the gold finger joint 13 and the conductive metal portion 21 of the reject portion 20 when the circuit board 10 is cut. The cut-off area of the connected metal conductors, thereby reducing the number and size of burrs or swarf generated by the circuit substrate 10 at the joint edge 12, to avoid a short circuit condition.
為達到有效降低電路基板10切斷後產生毛邊或金屬屑造成短路的機率，本創作每一所述金手指接點13及所述延伸部14的尺寸存在下列關係：如圖3A所示，本創作每一金手指接點13的末端部分131的寬度以標號W1為代表，而每一延伸部14的切斷部141的寬度以標號W2代表，每兩相鄰的金手指接點13的節距以標號P代表，則其中每一切斷部141的寬度W2小於末端部分131的寬度W1，且所述節距P大於1.5倍切斷部141的寬度W2，因此若以公式表示，則存在下列關係：W2<W1；且P>1.5×W2。 In order to effectively reduce the probability of short circuit caused by burrs or metal chips after the circuit board 10 is cut, the size of each of the gold finger joints 13 and the extension portion 14 of the present invention has the following relationship: as shown in FIG. 3A, the creation The width of the end portion 131 of each gold finger joint 13 is represented by the reference W1, and the width of the cut portion 141 of each extension portion 14 is represented by the reference numeral W2, and the pitch of each two adjacent gold finger joints 13 Represented by the reference numeral P, the width W2 of each of the cut portions 141 is smaller than the width W1 of the end portion 131, and the pitch P is larger than 1.5 times the width W2 of the cut portion 141, so if expressed by the formula, the following relationship exists. : W2 < W1; and P > 1.5 × W2.
其中，相鄰兩金手指接點13的節距P安排成大於1.5倍切斷部141寬度W2的目的為能夠有效避免相鄰兩延伸部14切斷後產生毛邊相互接觸造成短路情形，因此若為進一步確保相鄰兩延伸 部14切斷後產生的毛邊或金屬屑不會相互接觸，則金手指接點13的節距P較佳者必須大於2倍的切斷部141寬度W2，因此上述公式能夠修改為：W2<W1；且P>2×W2。 The purpose of the pitch P of the adjacent two gold finger joints 13 being greater than 1.5 times the width W2 of the cutting portion 141 is to effectively prevent the short sides from being generated when the adjacent two extending portions 14 are cut off, so that Further ensure that the two adjacent extensions The burrs or metal chips generated after the cutting of the portion 14 are not in contact with each other, and the pitch P of the gold finger joint 13 is preferably greater than twice the width W2 of the cutting portion 141, so the above formula can be modified as: W2 < W1 And P>2×W2.
此外，如圖3A所示，本創作實施例中，延伸部14的高度h較佳者介於0.5倍至2倍的金手指接點13的寬度的範圍內，因此延伸部14的高度h和金手指接點13寬度W1存在下列關係：0.5×W1<h<2×W1。 In addition, as shown in FIG. 3A, in the present embodiment, the height h of the extending portion 14 is preferably in the range of 0.5 times to 2 times the width of the gold finger joint 13, and thus the height h of the extending portion 14 and The gold finger joint 13 width W1 has the following relationship: 0.5 × W1 < h < 2 × W1.
本創作透過上述方式安排設計延伸部14和金手指接點13的各個相對尺寸，將能夠使得每一金手指接點13維持原有的寬度，而不會影響到金手指接點13原有的導電功能，同時使得每一個金手指接點13和前述導電金屬部21連接導體(即延伸部14)被切斷後產生的毛邊或金屬屑的尺寸或數量減少，且能夠有效避免延伸部14切斷部位產生的毛邊相互接觸產生短路的情形，而提升了印刷電路板的製造良率及其可靠性。 By creating the relative dimensions of the design extension 14 and the gold finger joint 13 in the above manner, the creation will enable each gold finger joint 13 to maintain the original width without affecting the original gold finger joint 13 The conductive function, at the same time, reduces the size or number of burrs or swarf generated after each gold finger joint 13 and the aforementioned conductive metal portion 21 connecting conductor (ie, the extending portion 14) is cut, and can effectively prevent the extension portion 14 from being cut off. The burrs generated in the parts contact each other to create a short circuit, which improves the manufacturing yield and reliability of the printed circuit board.
如圖3及圖3A所示實施例中，所述延伸部14呈長條形的形狀，且每一延伸部14的寬度小於金手指接點13的寬度。然而除了圖3及圖3A所示實施例揭露的長條形形狀外，該延伸部14的形狀能夠做各種適合的變化。 In the embodiment shown in FIGS. 3 and 3A, the extending portion 14 has an elongated shape, and the width of each extending portion 14 is smaller than the width of the golden finger joint 13. However, in addition to the elongated shape disclosed in the embodiment of Figures 3 and 3A, the shape of the extension 14 can be varied as appropriate.
例如圖4所示實施例，其中每一延伸部14的兩側邊分別具有一從所述金手指接點13的末端部分131的兩側邊連接到所述延伸部14的切斷部141兩側邊的傾斜邊，因此使得每一個延伸部14形成等腰梯形的形狀。 For example, in the embodiment shown in FIG. 4, the two sides of each of the extending portions 14 respectively have a cutting portion 141 which is connected to the extending portion 14 from both side edges of the end portion 131 of the gold finger joint 13. The sloping sides of the sides thus cause each of the extensions 14 to form an isosceles trapezoidal shape.
又例如圖5所示實施例，其中每一所述金手指接點13的所述延伸部14的兩側邊分別具有一從所述金手指接點13的末端部分131的兩側連接到所述延伸部14的切斷部141兩側邊的弧形邊緣，因此使得每一所述延伸部形成圓弧形。 For example, in the embodiment shown in FIG. 5, the two sides of the extending portion 14 of each of the gold finger joints 13 respectively have a connection from both sides of the end portion 131 of the gold finger joint 13 to the The curved edges on both sides of the cut portion 141 of the extending portion 14 are such that each of the extending portions is formed in a circular arc shape.
又例如圖6所示實施例，其中每一所述金手指接點13的所述延伸部14的一側邊為從所述金手指接點13的一側邊延伸而成的 直線部，且所述延伸部14相對於所述直線部的另一側邊為從所述金手指接點13的所述末端部分131的一側連接到所述切斷部141一側邊的一傾斜邊，因此使得每一個延伸部形成楔形的形狀。 For example, in the embodiment shown in FIG. 6, one side of the extending portion 14 of each of the gold finger joints 13 is extended from one side of the gold finger joint 13. a straight portion, and the other side of the extending portion 14 is connected to a side of the cutting portion 141 from a side of the end portion 131 of the gold finger joint 13 with respect to the other side of the straight portion A sloping edge thus causes each extension to form a wedge shape.
在此必須說明，本創作的延伸部14的形狀並不限於前述各實施例所揭露構造，其只需要符合延伸部14的切斷部141的寬度小於金手指接點13的末端部分131的寬度的條件的形狀，皆能夠運用作為本創作的延伸部14的形狀。 It should be noted here that the shape of the extension portion 14 of the present invention is not limited to the configuration disclosed in the foregoing embodiments, and it is only required that the width of the cut portion 141 conforming to the extending portion 14 is smaller than the width of the end portion 131 of the gold finger joint 13. The shape of the condition can be applied as the shape of the extension 14 of the present creation.
〔實施例的可能功效〕 [Possible effects of the examples]
綜上所述，本創作的有益效果主要在於有效避免延伸部14的切斷部141產生的毛邊相互接觸產生短路的情形，而能夠提升了印刷電路板的製造良率及其可靠性。 In summary, the beneficial effects of the present invention are mainly to effectively avoid the situation that the burrs generated by the cutting portions 141 of the extending portion 14 are in contact with each other to cause a short circuit, and the manufacturing yield and reliability of the printed circuit board can be improved.
以上所述僅為本創作的較佳可行實施例，非因此侷限本創作的專利範圍，故舉凡運用本創作說明書及圖式內容所做的等效技術變化，均包含於本創作的保護範圍內。 The above description is only a preferred and feasible embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, any equivalent technical changes made by using the present specification and the contents of the schema are included in the scope of protection of the present creation. .
10‧‧‧電路基板 10‧‧‧ circuit board
11‧‧‧板端連接部 11‧‧‧ Board end connection
12‧‧‧接合邊緣 12‧‧‧ joint edge
13‧‧‧金手指接點 13‧‧‧Gold Finger Contact
131‧‧‧末端部分 131‧‧‧End part
14‧‧‧延伸部 14‧‧‧Extension
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105216610U TWM537776U (en) | 2016-11-01 | 2016-11-01 | Structure of printed circuit board |
| CN201621232931.5U CN206314072U (en) | 2016-11-01 | 2016-11-17 | Printed circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105216610U TWM537776U (en) | 2016-11-01 | 2016-11-01 | Structure of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM537776U true TWM537776U (en) | 2017-03-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105216610U TWM537776U (en) | 2016-11-01 | 2016-11-01 | Structure of printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN206314072U (en) |
| TW (1) | TWM537776U (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208805652U (en) * | 2018-10-30 | 2019-04-30 | 惠科股份有限公司 | Pin assembly and display panel |
| CN109511219B (en) * | 2018-11-22 | 2021-08-24 | 京东方科技集团股份有限公司 | Display panel, circuit board and preparation method thereof |
-
2016
- 2016-11-01 TW TW105216610U patent/TWM537776U/en unknown
- 2016-11-17 CN CN201621232931.5U patent/CN206314072U/en active Active
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| CN206314072U (en) | 2017-07-07 |
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