TWM533838U - Ceramic circuit board - Google Patents

Ceramic circuit board

Info

Publication number
TWM533838U
TWM533838U TW105214552U TW105214552U TWM533838U TW M533838 U TWM533838 U TW M533838U TW 105214552 U TW105214552 U TW 105214552U TW 105214552 U TW105214552 U TW 105214552U TW M533838 U TWM533838 U TW M533838U
Authority
TW
Taiwan
Prior art keywords
circuit board
ceramic circuit
ceramic
board
circuit
Prior art date
Application number
TW105214552U
Other languages
Chinese (zh)
Inventor
Yi-Wei Wan
Wen-Chuan Chiu
Kuei-Neng Peng
Original Assignee
Jentech Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jentech Prec Ind Co Ltd filed Critical Jentech Prec Ind Co Ltd
Priority to TW105214552U priority Critical patent/TWM533838U/en
Publication of TWM533838U publication Critical patent/TWM533838U/en

Links

TW105214552U 2016-09-22 2016-09-22 Ceramic circuit board TWM533838U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW105214552U TWM533838U (en) 2016-09-22 2016-09-22 Ceramic circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105214552U TWM533838U (en) 2016-09-22 2016-09-22 Ceramic circuit board

Publications (1)

Publication Number Publication Date
TWM533838U true TWM533838U (en) 2016-12-11

Family

ID=58226455

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105214552U TWM533838U (en) 2016-09-22 2016-09-22 Ceramic circuit board

Country Status (1)

Country Link
TW (1) TWM533838U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113966099A (en) * 2021-06-30 2022-01-21 西安空间无线电技术研究所 Microwave integrated circuit thin film thickening process suitable for fixed products

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113966099A (en) * 2021-06-30 2022-01-21 西安空间无线电技术研究所 Microwave integrated circuit thin film thickening process suitable for fixed products
CN113966099B (en) * 2021-06-30 2024-06-11 西安空间无线电技术研究所 Microwave integrated circuit film thickening process suitable for solid-state product

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