TWM533838U - Ceramic circuit board - Google Patents
Ceramic circuit boardInfo
- Publication number
- TWM533838U TWM533838U TW105214552U TW105214552U TWM533838U TW M533838 U TWM533838 U TW M533838U TW 105214552 U TW105214552 U TW 105214552U TW 105214552 U TW105214552 U TW 105214552U TW M533838 U TWM533838 U TW M533838U
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- ceramic circuit
- ceramic
- board
- circuit
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105214552U TWM533838U (en) | 2016-09-22 | 2016-09-22 | Ceramic circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105214552U TWM533838U (en) | 2016-09-22 | 2016-09-22 | Ceramic circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM533838U true TWM533838U (en) | 2016-12-11 |
Family
ID=58226455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105214552U TWM533838U (en) | 2016-09-22 | 2016-09-22 | Ceramic circuit board |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM533838U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113966099A (en) * | 2021-06-30 | 2022-01-21 | 西安空间无线电技术研究所 | Microwave integrated circuit thin film thickening process suitable for fixed products |
-
2016
- 2016-09-22 TW TW105214552U patent/TWM533838U/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113966099A (en) * | 2021-06-30 | 2022-01-21 | 西安空间无线电技术研究所 | Microwave integrated circuit thin film thickening process suitable for fixed products |
CN113966099B (en) * | 2021-06-30 | 2024-06-11 | 西安空间无线电技术研究所 | Microwave integrated circuit film thickening process suitable for solid-state product |
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