TWM532641U - Improved varistor with thermal protection function - Google Patents
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- TWM532641U TWM532641U TW105211518U TW105211518U TWM532641U TW M532641 U TWM532641 U TW M532641U TW 105211518 U TW105211518 U TW 105211518U TW 105211518 U TW105211518 U TW 105211518U TW M532641 U TWM532641 U TW M532641U
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本創作係有關一種壓敏電阻，尤指一種具熱保護功能之壓敏電阻改良。This creation is related to a varistor, especially a varistor with thermal protection.
雷擊、開關動作或其他零件損壞所產生的突波或瞬間過電壓，因為會直接擾亂或破壞電子元件或其他電子線路，因此，具優異突波吸收功能的突波吸收器，已廣泛被應用於當作電子元件或電子線路的過電壓或突波保護元件。但，突波吸收器一旦遇太高的過電壓或持續性較高過電壓的時候，通常會造成壓敏電阻元件持續過熱或溫度持續升高，最終可能導致元件燒毀而發生安全問題。Surge or transient overvoltage caused by lightning strikes, switching actions or other parts damage, because it directly disturbs or destroys electronic components or other electronic circuits, so the surge absorber with excellent surge absorption function has been widely used. An overvoltage or surge protection component that acts as an electronic component or electronic circuit. However, when the surge absorber encounters a too high overvoltage or a high overvoltage, the varistor component will continue to overheat or the temperature will continue to rise, which may eventually cause the component to burn out and cause safety problems.
傳統突波保護電路主要設有一壓敏電阻器，壓敏電阻器具有優越的非線性電阻特性，只要電路出現瞬時過電壓，則壓敏電阻器就會立即動作來抑制過電壓增幅和吸收釋放突波能量，以保護電器設備及元件。若各種類型的瞬時過電壓持續或過於頻繁出現，則勢必會導致壓敏電阻器的性能劣化乃至失效。再者，當壓敏電阻接受持續性過電壓時，壓敏電阻會迅速局部擊穿導致起火燃燒現象，現有技術中具有熱保護功能之壓敏電阻，一般係設有一貼附靠近壓敏電阻元件的熱熔絲於電流迴路中，利用熱熔絲之熔點低於其他元件的原理，當過大電流通過而產生高溫時，高溫將熱熔絲燒毀而形成斷路，因而達到熱保護功能。The traditional surge protection circuit is mainly provided with a varistor. The varistor has superior nonlinear resistance characteristics. As long as the transient overvoltage occurs in the circuit, the varistor acts immediately to suppress overvoltage increase and absorption and release. Wave energy to protect electrical equipment and components. If various types of transient overvoltages continue or appear too frequently, it is bound to cause the performance of the varistor to deteriorate or even fail. Furthermore, when the varistor receives a continuous overvoltage, the varistor will rapidly break down locally and cause a fire phenomenon. In the prior art, the varistor having a thermal protection function is generally provided with a affixed close to the varistor component. The thermal fuse is used in the current loop, and the melting point of the thermal fuse is lower than that of other components. When an excessive current passes to generate a high temperature, the high temperature burns the thermal fuse to form an open circuit, thereby achieving a thermal protection function.
現有技術中，如美國第5,708,553號專利揭露在一突波吸收元件的導線及相應的電極間連接上一焊接柱(solder column)，當突波吸收元件的溫度過熱超過焊接柱的熔點時，藉焊接柱的融化使突波吸收元件的導線呈斷路狀態，以阻止突波吸收元件的溫度進一步過熱。In the prior art, as disclosed in Japanese Patent No. 5,708,553, a solder column is connected between a wire of a surge absorbing element and a corresponding electrode, and when the temperature of the surge absorbing element is overheated beyond the melting point of the soldering column, The melting of the welding column causes the wire of the surge absorbing element to be in an open state to prevent further overheating of the temperature of the surge absorbing element.
另一件美國第5,901,027號專利，則揭露在一突波吸收元件的其中一表面上安裝一層平面熱熔層，且使該層平面熱熔層成為突波吸收元件的電路的一部分，當突波吸收器過熱時，藉平面熱熔層的融化使突波吸收元件的電路呈斷路狀態，以阻止突波吸收元件的溫度進一步過熱。Another U.S. Patent No. 5,901,027 discloses the application of a planar hot melt layer on one of the surfaces of a surge absorbing element and making the planar hot melt layer part of the circuit of the surge absorbing element. When the absorber is overheated, the melting of the planar hot melt layer causes the circuit of the surge absorbing element to be in an open state to prevent further overheating of the temperature of the surge absorbing element.
另一件歐洲第1150307號公開案，則揭露將長條狀熱熔膨脹材料連接在突波吸收元件的電極和導線之間，同時以圓片型的絕緣熱熔膨脹材料墊在前述長條狀熱熔膨脹材料的下方，當突波吸收元件過熱時，長條狀熱熔膨脹材料產生融化，因此整個線路產生斷路狀態，故可以提升線路的安全度。In another European publication No. 1150307, it is disclosed that a long strip of hot melt expansion material is connected between the electrode of the surge absorbing element and the wire, and a disk-shaped insulating hot melt expansion material is padded in the strip shape. Below the hot-melt expansion material, when the surge absorbing element is overheated, the long-shaped hot-melt expansion material is melted, so that the entire line is disconnected, so that the safety of the line can be improved.
因此，如何發展一種有別於現有技術的壓敏電阻，實為相關技術領域者目前所迫切需要解決之問題。Therefore, how to develop a varistor different from the prior art is an urgent problem to be solved by those skilled in the related art.
有鑑於此，本創作提供一種具熱保護功能之壓敏電阻改良，為其主要目的者。In view of this, the present invention provides a varistor improvement with thermal protection function as its main purpose.
本創作中具熱保護功能之壓敏電阻至少包含：一壓敏電阻本體；一載體，具有相對之第一、第二表面，且以其第一表面接觸設置於該壓敏電阻本體之一表面；第一、第二導電接腳，該第一或第二導電接腳設置於該載體之第二表面，該第一導電接腳係與該壓敏電阻本體形成電性連接；一熱熔絲，跨接於該第一、第二導電接腳之間，與該壓敏電阻本體間以該載體隔開，且該熱熔絲二端分別於該第一、第二導電接腳形成電性連接；以及一熱熔膨脹材料係設置於該載體之第二表面。The varistor having thermal protection function in the present invention comprises at least: a varistor body; a carrier having opposite first and second surfaces and disposed on a surface of the varistor body with the first surface contact a first or a second conductive pin, the first or second conductive pin is disposed on the second surface of the carrier, the first conductive pin is electrically connected to the varistor body; a thermal fuse Interconnecting between the first and second conductive pins, separated from the varistor body by the carrier, and the two ends of the thermal fuse respectively form electrical properties on the first and second conductive pins And a hot melt expansion material is disposed on the second surface of the carrier.
其中，當壓敏電阻本體於承受持續性過電壓導致過熱狀況下，熱熔絲能迅速熔融斷裂以形成斷路，可避免持續過熱與溫度持續升高，而造成元件或甚至電器燒毀。Wherein, when the varistor body is subjected to the overheating condition caused by the persistent overvoltage, the thermal fuse can be rapidly melted and fractured to form an open circuit, which can avoid continuous overheating and continuous temperature rise, and cause components or even electrical appliances to be burnt.
依據上述技術特徵，所述第一導電接腳係位於該壓敏電阻本體並與其電性連接。According to the above technical feature, the first conductive pin is located on the varistor body and is electrically connected thereto.
依據上述技術特徵，所述載體具電氣絕緣特性，具有阻隔第二導電接腳直接與壓敏電阻本體電性連接之作用。According to the above technical feature, the carrier has electrical insulation properties and has the function of blocking the second conductive pin to directly connect with the varistor body.
依據上述技術特徵，所述熱熔膨脹材料係設置於該熱熔絲上且相對於該第一、第二導電接腳之間。According to the above technical feature, the hot melt expansion material is disposed on the thermal fuse and between the first and second conductive pins.
依據上述技術特徵，所述熱熔膨脹材料係設置於該載體之第二表面。According to the above technical feature, the hot melt expansion material is disposed on the second surface of the carrier.
依據上述技術特徵，所述熱熔絲二端分別以一第一焊接部與該第一、第二導電接腳形成電性連接，而該第一導電接腳以一第四焊接部與該壓敏電阻本體形成電性連接。According to the above technical feature, the two ends of the thermal fuse are electrically connected to the first and second conductive pins by a first soldering portion, and the first conductive pin is connected to the first conductive portion by a fourth soldering portion. The varistor body forms an electrical connection.
依據上述技術特徵，所述熱熔絲二端分別以一第一焊接部與該第一、第二導電接腳形成電性連接，而該第一導電接腳處之第一焊接部亦構成與該壓敏電阻本體之電性連接。According to the above technical feature, the two ends of the thermal fuse are electrically connected to the first and second conductive pins by a first soldering portion, and the first soldering portion of the first conductive pin is also configured. The varistor body is electrically connected.
依據上述技術特徵，所述載體之第二表面相對於該第一、第二導電接腳處分別設有可供電性連接之第一、第二電極。According to the above technical feature, the second surface of the carrier is respectively provided with first and second electrodes that are electrically connectable with respect to the first and second conductive pins.
依據上述技術特徵，所述熱熔膨脹材料係設置於該熱熔絲相對於該第一、第二導電接腳之間。According to the above technical feature, the hot melt expansion material is disposed between the thermal fuse and the first and second conductive pins.
依據上述技術特徵，所述熱熔膨脹材料係設置於該載體之第二表面。According to the above technical feature, the hot melt expansion material is disposed on the second surface of the carrier.
依據上述技術特徵，所述載體之第二表面相對於該熱熔膨脹材料處設有第三電極。According to the above technical feature, the second surface of the carrier is provided with a third electrode relative to the hot melt expansion material.
依據上述技術特徵，所述載體之第二表面相對於該熱熔膨脹材料處設有第三電極。According to the above technical feature, the second surface of the carrier is provided with a third electrode relative to the hot melt expansion material.
依據上述技術特徵，所述熱熔絲二端分別以一第一焊接部與該第一、第二導電接腳形成電性連接，而該第一導電接腳以一第四焊接部與該壓敏電阻本體形成電性連接。According to the above technical feature, the two ends of the thermal fuse are electrically connected to the first and second conductive pins by a first soldering portion, and the first conductive pin is connected to the first conductive portion by a fourth soldering portion. The varistor body forms an electrical connection.
依據上述技術特徵，所述第一、第二導電接腳與該第一、第二電極分別以一第二焊接部形成電性連接，以及該熱熔絲二端與該第一、第二電極分別以一第三焊接部形成電性連接，使該熱熔絲二端分別藉由該第一、第二電極與該第一、第二導電接腳形成電性連接，而該第一導電接腳以一第四焊接部與該壓敏電阻本體形成電性連接。According to the above technical feature, the first and second conductive pins are electrically connected to the first and second electrodes by a second soldering portion, and the two ends of the thermal fuse and the first and second electrodes are respectively An electrical connection is formed by a third soldering portion, and the two ends of the thermal fuse are electrically connected to the first and second conductive pins respectively by the first and second electrodes, and the first conductive connection is The foot is electrically connected to the varistor body by a fourth soldering portion.
依據上述技術特徵，所述熱熔絲係為低熔點合金材料，其熔點係介於攝氏150度至攝氏220度之間。According to the above technical feature, the thermal fuse is a low melting point alloy material having a melting point of between 150 degrees Celsius and 220 degrees Celsius.
依據上述技術特徵，所述第一、第二、第三、第四焊接部係為低熔點合金材料，其熔點係介於攝氏130度至攝氏190度之間。According to the above technical feature, the first, second, third, and fourth welded portions are low melting point alloy materials having a melting point of between 130 degrees Celsius and 190 degrees Celsius.
本創作另提供一種具熱保護功能之壓敏電阻改良，至少包含：一壓敏電阻本體，具有相對之第一、第二表面；第一、第二導電接腳，該第一、第二導電接腳設置於該壓敏電阻本體之第一表面，而該第一導電接腳係與該壓敏電阻本體形成電性連接；一熱熔絲，跨接於該第一、第二導電接腳之間，該熱熔絲連同與其相連結之第二導電接腳投影於該壓敏電阻本體之第一表面的部分與該壓敏電阻本體之第一表面間形成一間距，且該熱熔絲二端分別於該第一、第二導電接腳形成電性連接；以及一熱熔膨脹材料，係設置於該壓敏電阻本體之第一表面。The invention further provides a varistor improvement with thermal protection function, comprising at least: a varistor body having opposite first and second surfaces; first and second conductive pins, the first and second conductive a pin is disposed on the first surface of the varistor body, and the first conductive pin is electrically connected to the varistor body; a thermal fuse is connected to the first and second conductive pins Between the portion of the thermal fuse and the second conductive pin connected thereto, a portion projected on the first surface of the varistor body and the first surface of the varistor body form a gap, and the thermal fuse The two ends are respectively electrically connected to the first and second conductive pins; and a hot melt expansion material is disposed on the first surface of the varistor body.
依據上述技術特徵，所述熱熔膨脹材料係設置於該熱熔絲相對於該第一、第二導電接腳之間。According to the above technical feature, the hot melt expansion material is disposed between the thermal fuse and the first and second conductive pins.
依據上述技術特徵，所述熱熔絲二端分別以一第一焊接部與該第一、第二導電接腳形成電性連接。According to the above technical feature, the two ends of the thermal fuse are electrically connected to the first and second conductive pins by a first soldering portion.
依據上述技術特徵，所述第一導電接腳於該壓敏電阻本體之區域內形成至少一彎折部。According to the above technical feature, the first conductive pin forms at least one bent portion in a region of the varistor body.
為利 貴審查員瞭解本創作之技術特徵、內容與優點及其所能達成之功效，茲將本創作配合附圖，並以實施例之表達形式詳細說明如下，而其中所使用之圖式，其主旨僅為示意及輔助說明書之用，未必為本創作實施後之真實比例與精準配置，故不應就所附之圖式的比例與配置關係解讀、侷限本創作於實際實施上的權利範圍，合先敘明。In order to understand the technical characteristics, content and advantages of the creation and the effects that can be achieved by the examiner, the author will use the drawings in detail and explain the following in the form of the examples, and the drawings used therein The subject matter is only for the purpose of illustration and supplementary instructions. It is not necessarily the true proportion and precise configuration after the implementation of the original creation. Therefore, the proportions and configuration relationships of the attached drawings should not be interpreted or limited in the actual implementation scope. First described.
請參閱第1圖所示為本創作中具熱保護功能之壓敏電阻的第一結構示意圖。首先，本創作具熱保護功能之壓敏電阻至少包含：一壓敏電阻本體1、一載體2、第一、第二導電接腳31、32、一熱熔絲4以及一熱熔膨脹材料5，其中：Please refer to Figure 1 for the first structure of the varistor with thermal protection function in this creation. Firstly, the varistor having the thermal protection function comprises at least: a varistor body 1, a carrier 2, first and second conductive pins 31, 32, a thermal fuse 4 and a hot melt expansion material 5 ,among them:
壓敏電阻本體1可以為金屬氧化物壓敏電阻(Metal Oxide Varistor,MOV)；載體2具有相對之第一、第二表面21、22，且以其第一表面21接觸設置於該壓敏電阻本體1之一表面，而該第二表面22則裸露於外，該載體2可以為體積電阻率大於10 10(歐姆․cm)之絕緣材料，例如：氧化鋁、氮化鋁、氧化矽、陶瓷基板或者為低溫共燒陶瓷基板(Low-Temperature Cofired Ceramics；LTCC) ，其具電氣絕緣特性，具有阻隔第二導電接腳直接與壓敏電阻本體電性連接之作用。 The varistor body 1 may be a metal oxide varistor (MOV); the carrier 2 has opposite first and second surfaces 21, 22, and is disposed at the first surface 21 of the varistor One surface of the body 1 and the second surface 22 are exposed. The carrier 2 may be an insulating material having a volume resistivity of more than 10 10 (ohm.cm), such as alumina, aluminum nitride, tantalum oxide, ceramics. The substrate or the Low-Temperature Cofired Ceramics (LTCC) has electrical insulation properties and has the function of blocking the second conductive pin to directly connect with the varistor body.
該第一或第二導電接腳31、32設置於該載體之第二表面22，如圖所示之實施例中，第一、第二導電接腳31、32係設置於該載體之第二表面22，該第一導電接腳31以一第四焊接部64與該壓敏電阻本體1形成電性連接。The first or second conductive pins 31, 32 are disposed on the second surface 22 of the carrier. In the embodiment shown, the first and second conductive pins 31, 32 are disposed on the second of the carrier. The first conductive pin 31 is electrically connected to the varistor body 1 by a fourth soldering portion 64.
熱熔絲4則跨接於該第一、第二導電接腳31、32之間，且該熱熔絲4二端分別於該第一、第二導電接腳31、32形成電性連接；其中，熱熔絲4係為低熔點合金材料，其熔點係介於攝氏150度至攝氏220度之間，且熱熔絲4二端分別以一第一焊接部61與第一、第二導電接腳31、32形成電性連接，第一焊接部61同樣係為低熔點合金材料，其熔點係介於攝氏130度至攝氏190度之間。The thermal fuses 4 are connected between the first and second conductive pins 31, 32, and the two ends of the thermal fuses 4 are electrically connected to the first and second conductive pins 31, 32, respectively; The thermal fuse 4 is a low melting point alloy material, and the melting point thereof is between 150 degrees Celsius and 220 degrees Celsius, and the two ends of the thermal fuse 4 are respectively connected to the first and second conductive portions by a first soldering portion 61. The pins 31, 32 are electrically connected, and the first soldering portion 61 is also a low melting point alloy material having a melting point of between 130 degrees Celsius and 190 degrees Celsius.
熱熔膨脹材料5係設置於該載體之第二表面22，如圖所示之實施例中，其係設置於該熱熔絲4相對於該第一、第二導電接腳31、32之間。The hot melt expansion material 5 is disposed on the second surface 22 of the carrier. In the embodiment shown, it is disposed between the thermal fuse 4 and the first and second conductive pins 31, 32. .
其中，當壓敏電阻本體1於承受持續性過電壓導致過熱狀況下，熱熔絲4能迅速熔融斷裂以形成斷路，可避免持續過熱與溫度持續升高，而造成元件或甚至電器燒毀。Wherein, when the varistor body 1 is subjected to overheating caused by continuous overvoltage, the thermal fuse 4 can be rapidly melted and fractured to form an open circuit, which can avoid continuous overheating and continuous temperature rise, and cause components or even electrical appliances to be burnt.
如第2圖之第二結構示意圖所示，該載體2之第二表面22相對於該第一、第二導電接腳31、32處分別設有第一、第二電極71、72，該第一、第二電極71、72可以為銀電極，該第一電極71係與該第一導電接腳31以一第二焊接部62形成電性連接，該第二電極72係與該第二導電接腳32以一第二焊接部62形成電性連接，以及該熱熔絲4二端與該第一、第二電極71、72分別以一第三焊接部63形成電性連接，使該熱熔絲4二端分別藉由該第一、第二電極71、72與該第一、第二導電接腳31、32形成電性連接；其中，該第二、第三焊接部62、63係為低熔點合金材料。當然，本實施例中，該熱熔膨脹材料5係設置於該熱熔絲4相對於該第一、第二導電接腳31、32之間；該熱熔膨脹材料係設置於該載體之第二表面。As shown in the second structural diagram of FIG. 2, the second surface 22 of the carrier 2 is provided with first and second electrodes 71 and 72 respectively opposite to the first and second conductive pins 31 and 32. The second electrode 71, 72 is a silver electrode, and the first electrode 71 is electrically connected to the first conductive pin 31 by a second soldering portion 62. The second electrode 72 is connected to the second conductive portion. The pin 32 is electrically connected to the second soldering portion 62, and the two ends of the thermal fuse 4 are electrically connected to the first and second electrodes 71 and 72 by a third soldering portion 63, respectively. The two ends of the fuse 4 are electrically connected to the first and second conductive pins 31 and 32 by the first and second electrodes 71 and 72 respectively; wherein the second and third soldering portions 62 and 63 are It is a low melting point alloy material. Of course, in this embodiment, the hot melt expansion material 5 is disposed between the thermal fuse 4 and the first and second conductive pins 31, 32; the hot melt expansion material is disposed on the carrier Two surfaces.
如第3圖之第三結構示意圖所示，其架構大致與第二結構示意圖相同，差別僅在於，該載體之第二表面22相對於該熱熔膨脹材料5處設有第三電極73，該熱熔膨脹材料5則設置於該第三電極73處，而該熱熔絲4二端同樣分別藉由該第一、第二電極71、72與該第一、第二導電接腳31、32形成電性連接，當壓敏電阻本體1於承受持續性過電壓導致過熱狀況下，熱熔絲4可有三個熔斷點容易讓該熱熔絲4熔斷。As shown in the third structural diagram of FIG. 3, the structure is substantially the same as that of the second structure, except that the second surface 22 of the carrier is provided with a third electrode 73 relative to the hot-melt expansion material 5. The hot-melt expansion material 5 is disposed at the third electrode 73, and the two ends of the thermal fuse 4 are also the first and second electrodes 71, 72 and the first and second conductive pins 31, 32, respectively. The electrical connection is formed. When the varistor body 1 is subjected to an overheating condition caused by a persistent overvoltage, the thermal fuse 4 may have three melting points to facilitate the blowing of the thermal fuse 4.
如第4圖之第四結構示意圖所示，該載體之第二表面22相對於該熱熔膨脹材料5處設有第三電極73，該熱熔膨脹材料5則設置於該第三電極73處，而熱熔絲4二端分別以一第一焊接部61與第一、第二導電接腳31、32形成電性連接。As shown in the fourth structural diagram of FIG. 4, the second surface 22 of the carrier is provided with a third electrode 73 opposite to the hot-melt expansion material 5, and the hot-melt expansion material 5 is disposed at the third electrode 73. The two ends of the thermal fuse 4 are electrically connected to the first and second conductive pins 31 and 32 by a first soldering portion 61, respectively.
如第5圖之第五結構示意圖所示，僅第二導電接腳32設置於該載體之第二表面22，該第一導電接腳31係位於該壓敏電阻本體1並與其電性連接，該熱熔膨脹材料5係設置於該熱熔絲4上且相對於該第一、第二導電接腳31、32之間，而該熱熔絲4二端分別以一第一焊接部61與該第一、第二導電接腳31、32形成電性連接，而該第一導電接腳31以一第四焊接部64與該壓敏電阻本體1形成電性連接。As shown in the fifth structural diagram of FIG. 5 , only the second conductive pin 32 is disposed on the second surface 22 of the carrier, and the first conductive pin 31 is electrically connected to the varistor body 1 . The hot-melt expansion material 5 is disposed on the thermal fuse 4 and opposite to the first and second conductive pins 31, 32, and the two ends of the thermal fuse 4 are respectively connected by a first soldering portion 61 and The first and second conductive pins 31 and 32 are electrically connected to each other, and the first conductive pin 31 is electrically connected to the varistor body 1 by a fourth soldering portion 64.
如第6圖之第六結構示意圖所示，其架構大致與第五結構示意圖相同，差別僅在於，該第一導電接腳31於該壓敏電阻本體之區域內形成至少一彎折部33。As shown in the sixth structural diagram of FIG. 6, the structure is substantially the same as that of the fifth structure, except that the first conductive pin 31 forms at least one bent portion 33 in the region of the varistor body.
如第7圖之第七結構示意圖所示，其架構大致與第六結構示意圖相同，差別僅在於，該熱熔膨脹材料5係設置於該載體之第二表面22，並非位於該熱熔絲4上。As shown in the seventh structural diagram of FIG. 7, the structure is substantially the same as that of the sixth structural diagram, except that the hot-melt expansion material 5 is disposed on the second surface 22 of the carrier, not in the thermal fuse 4. on.
如第8圖之第八結構示意圖所示，其架構大致與第七結構示意圖相同，差別僅在於，該熱熔絲4二端分別以一第一焊接部61與該第一、第二導電接腳31、32形成電性連接，而該第一導電接腳31處之第一焊接部61亦構成與該壓敏電阻本體1之電性連接。As shown in the eighth structural diagram of FIG. 8, the structure is substantially the same as that of the seventh structural diagram. The only difference is that the two ends of the thermal fuse 4 are respectively connected to the first and second conductive portions by a first soldering portion 61. The legs 31 and 32 are electrically connected to each other, and the first soldering portion 61 at the first conductive pin 31 also forms an electrical connection with the varistor body 1 .
如第9圖之第九結構示意圖及第10圖第十結構示意圖之所示，壓敏電阻本體1與熱熔絲4連同第二導線接腳32間並無設置有載體(如第1圖之載體2)，該壓敏電阻本體1同樣具有相對之第一、第二表面11、12，該第一、第二導電接腳31、32設置於該壓敏電阻本體之第一表面11，且第一導電接腳31與該壓敏電阻本體1形成電性連接，其中，第一導電接腳31一端透過焊接部61與該壓敏電阻本體之第一表面11電極形成電性連接；而熱熔絲4則跨接於該第一、第二導電接腳31、32之間，與該壓敏電阻本體之第一表面間形成一間距9，請同時參閱第11圖及第12圖所示，且該熱熔絲4二端分別分別以一第一焊接部61與該第一、第二導電接腳31、32形成電性連接。第二導電接腳32經由焊接部61與熱熔絲4連接後，該熱熔絲4連同與其相連結之第二導電接腳32投影於該壓敏電阻本體之第一表面11的部分與該壓敏電阻本體之第一表面11間形成一間距9，而熱熔膨脹材料5則係設置於該壓敏電阻本體之第一表面11，如第9圖與第10圖之實施例所示，該第一導電接腳31於該壓敏電阻本體之區域內形成至少一彎折部33；而如第10圖之實施例所示，該熱熔膨脹材料5可設置於該熱熔絲4相對於該第一、第二導電接腳31、32之間。第9圖與第10圖實施例之側視結構圖如第11圖所示，經樹脂封裝後之側視結構圖如第12圖所示，其中可見第二導電接腳32與熱熔絲4連接後整體與該壓敏電阻本體之第一表面11間形成一間距9，封裝製程中包封用之封裝樹脂8填入該間距中並扮演先述實施例中載體之角色，同樣作為阻隔第二導電接腳直接與壓敏電阻本體電性連接之作用。As shown in the ninth structural diagram of FIG. 9 and the tenth structural diagram of FIG. 10, the varistor body 1 and the thermal fuse 4 and the second lead pin 32 are not provided with a carrier (as shown in FIG. 1). The varistor body 1 also has opposite first and second surfaces 11 and 12, and the first and second conductive pins 31 and 32 are disposed on the first surface 11 of the varistor body, and The first conductive pin 31 is electrically connected to the varistor body 1 , wherein one end of the first conductive pin 31 is electrically connected to the first surface 11 electrode of the varistor body through the soldering portion 61; The fuse 4 is connected between the first and second conductive pins 31 and 32 to form a gap 9 with the first surface of the varistor body. Please refer to FIG. 11 and FIG. 12 at the same time. The two ends of the thermal fuse 4 are respectively electrically connected to the first and second conductive pins 31 and 32 by a first soldering portion 61. After the second conductive pin 32 is connected to the thermal fuse 4 via the soldering portion 61, the thermal fuse 4 is projected onto the first surface 11 of the varistor body together with the second conductive pin 32 coupled thereto. A gap 9 is formed between the first surface 11 of the varistor body, and the hot melt expansion material 5 is disposed on the first surface 11 of the varistor body, as shown in the embodiments of FIGS. 9 and 10. The first conductive pin 31 forms at least one bent portion 33 in the region of the varistor body; and as shown in the embodiment of FIG. 10, the hot melt expandable material 5 can be disposed on the thermal fuse 4 Between the first and second conductive pins 31, 32. 9 is a side view of the embodiment shown in FIG. 11, and the side view of the resin package is shown in FIG. 12, wherein the second conductive pin 32 and the thermal fuse 4 are visible. After the connection, a gap 9 is formed between the whole surface and the first surface 11 of the varistor body, and the encapsulating resin 8 for encapsulation in the encapsulation process is filled in the pitch and plays the role of the carrier in the above-mentioned embodiment, and is also used as the second barrier. The conductive pin is directly connected to the varistor body.
上述各實施例中，壓敏電阻本體1與熱熔絲4並非實體接觸設置，其中該熱熔絲4係設置於載體2，且熱熔絲4與第一、第二導電接腳31、32之電性連接亦於該載體2上進行，再將完成電性連接之熱熔絲4與第一、第二導電接腳31、32設置於該壓敏電阻本體1上，使得該熱熔絲4以及第二導電接腳32與該壓敏電阻本體1間以該載體2隔開，或者不須設置載體僅須在製作過程中將熱熔絲與該壓敏電阻本體之第一表面間形成有一間距(如第9圖至第12圖之實施例)，利用封裝樹脂8填充於該間距，使該熱熔絲4以及第二導電接腳32與該壓敏電阻本體1間形成電性隔絕。不僅整體結構與習有技術不同，且製作較為簡便，且本創作之壓敏電阻本體1於承受持續性過電壓導致過熱狀況時，熱熔絲4能迅速熔融斷裂以形成斷路，可避免持續過熱與溫度持續升高，而造成元件或甚至電器燒毀。In the above embodiments, the varistor body 1 and the thermal fuse 4 are not in physical contact, wherein the thermal fuse 4 is disposed on the carrier 2, and the thermal fuse 4 and the first and second conductive pins 31, 32 are provided. The electrical connection is also performed on the carrier 2, and the thermal fuse 4 and the first and second conductive pins 31, 32 which are electrically connected are disposed on the varistor body 1 to make the thermal fuse. 4 and the second conductive pin 32 is separated from the varistor body 1 by the carrier 2, or the carrier is not required to be formed only between the thermal fuse and the first surface of the varistor body during the manufacturing process. A spacing (such as the embodiment of FIGS. 9 to 12) is filled in the pitch by the encapsulating resin 8 to electrically isolate the thermal fuse 4 and the second conductive pin 32 from the varistor body 1 . Not only the overall structure is different from the conventional technology, but also the production is relatively simple, and the varistor body 1 of the present invention can be rapidly melted and fractured to form an open circuit when subjected to overheating due to continuous overvoltage, thereby avoiding continuous overheating. The temperature continues to rise, causing components or even electrical appliances to burn out.
綜上所述，本創作提供一較佳可行具熱保護功能之壓敏電阻，爰依法提呈新型專利之申請；本創作之技術內容及技術特點巳揭示如上，然而熟悉本項技術之人士仍可能基於本創作之揭示而作各種不背離本案創作精神之替換及修飾。因此，本創作之保護範圍應不限於實施例所揭示者，而應包括各種不背離本創作之替換及修飾，並為以下之申請專利範圍所涵蓋。In summary, the present invention provides a preferred varistor with thermal protection function, and submits a new patent application according to law; the technical content and technical features of the present invention are disclosed above, but those skilled in the art still It is possible to make various substitutions and modifications based on the disclosure of this creation without departing from the spirit of the creation of the case. Therefore, the scope of the present invention is not limited to the embodiments disclosed, but includes various alternatives and modifications that do not depart from the present invention and are covered by the following claims.
1‧‧‧壓敏電阻本體
2‧‧‧載體
21‧‧‧第一表面
22‧‧‧第二表面
31‧‧‧第一導電接腳
32‧‧‧第二導電接腳
33‧‧‧彎折部
4‧‧‧熱熔絲
5‧‧‧熱熔膨脹材料
61‧‧‧第一焊接部
62‧‧‧第二焊接部
63‧‧‧第三焊接部
64‧‧‧第四焊接部
71‧‧‧第一電極
72‧‧‧第二電極
73‧‧‧第三電極
8‧‧‧封裝樹脂
9‧‧‧間距1‧‧‧varistor body
2‧‧‧ Carrier
21‧‧‧ first surface
22‧‧‧ second surface
31‧‧‧First conductive pin
32‧‧‧Second conductive pin
33‧‧‧Bending
4‧‧‧Hot fuse
5‧‧‧Hot melt expansion materials
61‧‧‧First Welding Department
62‧‧‧Second welding department
63‧‧‧ Third Welding Department
64‧‧‧ Fourth Welding Department
71‧‧‧First electrode
72‧‧‧second electrode
73‧‧‧ third electrode
8‧‧‧Encapsulation resin
9‧‧‧ spacing
第1圖所示為本創作中具熱保護功能之壓敏電阻的第一結構示意圖。 第2圖所示為本創作中具熱保護功能之壓敏電阻的第二結構示意圖。 第3圖所示為本創作中具熱保護功能之壓敏電阻的第三結構示意圖。 第4圖所示為本創作中具熱保護功能之壓敏電阻的第四結構示意圖。 第5圖所示為本創作中具熱保護功能之壓敏電阻的第五結構示意圖。 第6圖所示為本創作中具熱保護功能之壓敏電阻的第六結構示意圖。 第7圖所示為本創作中具熱保護功能之壓敏電阻的第七結構示意圖。 第8圖所示為本創作中具熱保護功能之壓敏電阻的第八結構示意圖。 第9圖所示為本創作中具熱保護功能之壓敏電阻的第九結構示意圖。 第10圖所示為本創作中具熱保護功能之壓敏電阻的第十結構示意圖。 第11圖所示為本創作中具熱保護功能之壓敏電阻的第九、第十結構之側面示意圖。 第12圖所示為本創作中具熱保護功能之壓敏電阻的第九、第十結構樹脂封裝後之側面示意圖。Figure 1 shows the first structure of the varistor with thermal protection function in the creation. Figure 2 shows the second structure of the varistor with thermal protection function in the creation. Figure 3 shows the third structure of the varistor with thermal protection function in the creation. Figure 4 shows the fourth structure of the varistor with thermal protection function in the creation. Figure 5 shows the fifth structure of the varistor with thermal protection function in the creation. Figure 6 shows the sixth structure of the varistor with thermal protection function in the creation. Figure 7 shows the seventh structure of the varistor with thermal protection function in the creation. Figure 8 shows the eighth structure of the varistor with thermal protection function in the creation. Figure 9 is a schematic view showing the ninth structure of the varistor with thermal protection function in the creation. Figure 10 is a schematic view showing the tenth structure of the varistor with thermal protection function in the creation. Figure 11 is a side view showing the ninth and tenth structures of the varistor having thermal protection function in the present invention. Fig. 12 is a side view showing the ninth and tenth structural resin packages of the varistor having thermal protection function in the present invention.
1‧‧‧壓敏電阻本體 1‧‧‧varistor body
2‧‧‧載體 2‧‧‧ Carrier
21‧‧‧第一表面 21‧‧‧ first surface
22‧‧‧第二表面 22‧‧‧ second surface
31‧‧‧第一導電接腳 31‧‧‧First conductive pin
32‧‧‧第二導電接腳 32‧‧‧Second conductive pin
4‧‧‧熱熔絲 4‧‧‧Hot fuse
5‧‧‧熱熔膨脹材料 5‧‧‧Hot melt expansion materials
61‧‧‧第一焊接部 61‧‧‧First Welding Department
64‧‧‧第四焊接部 64‧‧‧ Fourth Welding Department
Claims (18)
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| TW105211518U TWM532641U (en) | 2016-07-29 | 2016-07-29 | Improved varistor with thermal protection function |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105211518U TWM532641U (en) | 2016-07-29 | 2016-07-29 | Improved varistor with thermal protection function |
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| Publication Number | Publication Date |
|---|---|
| TWM532641U true TWM532641U (en) | 2016-11-21 |
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| TW (1) | TWM532641U (en) |
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2016
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