TWM528544U - DDR series memory module adapter - Google Patents
DDR series memory module adapter Download PDFInfo
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- TWM528544U TWM528544U TW105207721U TW105207721U TWM528544U TW M528544 U TWM528544 U TW M528544U TW 105207721 U TW105207721 U TW 105207721U TW 105207721 U TW105207721 U TW 105207721U TW M528544 U TWM528544 U TW M528544U
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Description
本創作係提供一種DDR系列記憶體模組轉接裝置，尤指裝有記憶體模組之轉接裝置插設於主機板上後，其主機板插接腳座的插槽二側扳動體之頂推板，便扣入於記憶體模組二側所設之第一扣槽內呈一穩固定位，以避免記憶體模組另側之複數端子接點受多次插拔而產生磨損。 The present invention provides a DDR series memory module switching device, especially when the adapter device with the memory module is inserted into the motherboard, and the socket side of the motherboard is inserted into the socket. The top push plate is fastened to the first buckle groove provided on the two sides of the memory module to prevent the plurality of terminal contacts on the other side of the memory module from being repeatedly inserted and removed to cause wear.
按，現今電腦科技以日新月異快速發展，而桌上型或筆記型電腦已普遍存在於社會上各個角落，其電腦之發展趨勢亦朝運算功能強、速度快及體積小方向邁進，使電腦內部之連接器也隨之大幅的縮小，以因應電腦之發展趨勢，且為了配合電腦運作功能不斷的提升、進步，電腦之主機板必須擴充更多的應用功能、運作效率，而透過增加記憶體模組、介面卡或功能板卡等，將主機板的操作能力升級，則主機板上也要設置更多的插接腳座供各式記憶體模組、介面卡或功能板卡電性插接、並可傳輸訊號，而在插接腳座上必須設置定位結構，以供卡固各式記憶體模組、介面卡或功能板卡，即將各式記憶體模組、介面卡或功能板卡穩固插設在插接腳座的插槽內。 According to the current rapid development of computer technology, desktop or notebook computers have been ubiquitous in all corners of the society, and the development trend of computers is also moving toward computing power, speed and small size, making the computer internal. The connector has also been greatly reduced in order to cope with the development trend of the computer, and in order to cope with the continuous improvement and advancement of the computer operation function, the motherboard of the computer must expand more application functions and operational efficiency, and increase the memory module. The interface card or the function board, etc., to upgrade the operating capability of the motherboard, and more sockets are also provided on the motherboard for various types of memory modules, interface cards or function boards. And can transmit signals, and the positioning structure must be set on the plug socket for securing various memory modules, interface cards or function boards, that is, all kinds of memory modules, interface cards or function boards are stable. Plug in the slot of the socket.
再者，在電腦主機板在生產出來後，其廠商為了保證主機板出貨的品質，主機板必須經過功能上的測試，以確認主機板整體的運作 、執行等功能均正常，所以廠商大多會在主機板的插接腳座之插槽內插設有記憶體模組，即可針對主機板的運作進行測試，以測試出主機板的各種應用功能是否為正常。 Furthermore, after the computer motherboard is produced, the manufacturer must pass the functional test to confirm the overall operation of the motherboard in order to ensure the quality of the motherboard shipment. The functions such as execution and execution are normal. Therefore, most of the manufacturers will insert a memory module into the slot of the motherboard's plug-in socket, so that the operation of the motherboard can be tested to test various application functions of the motherboard. Is it normal?
然而，由於科技的進步使用者對於主機板的需求量便逐年增加，所以需測試的主機板工作量也隨之增多，其因主機板的插接腳座之插槽內為直接供記憶體模組進行插設，以用於進行功能上的測試，進而導致增加記憶體模組插拔的次數，且該主機板一旦受到記憶體模組插拔的次數增多，容易使插槽內的插接端子與記憶體模組上的端子接點相互磨損，且不斷地進行插拔的動作，亦容易使主機板或記憶體模組上的電子零件、本身結構發生彎曲、變形，甚至損壞的情況，進而增加整體的生產成本。 However, due to the advancement of technology, the demand for motherboards by users has increased year by year, so the workload of the motherboard to be tested has also increased, because the slot in the socket of the motherboard is directly for the memory model. The group is inserted for functional testing, which leads to an increase in the number of times the memory module is inserted and removed, and the number of times the motherboard is inserted and removed by the memory module is increased, and the socket is easily inserted. The terminal contacts on the terminal and the memory module are worn out, and the action of continuously inserting and removing is also easy to bend, deform, or even damage the electronic components on the motherboard or the memory module. This in turn increases overall production costs.
是以，要如何解決上述習用之問題與缺失，即為從事此行業之相關廠商所亟欲研究改善之方向所在者。 Therefore, how to solve the above problems and shortcomings in the past is the direction for the relevant manufacturers engaged in this industry to research and improve.
故，創作人有鑑於上述缺失，乃搜集相關資料，經由多方評估及考量，並以從事於此行業累積之多年經驗，經由不斷試作及修改，始設計出此種DDR系列記憶體模組轉接裝置的新型專利者。 Therefore, in view of the above-mentioned deficiencies, the creators have collected relevant information, and through multi-party evaluation and consideration, and through years of experience in the industry, through continuous trial and modification, we have designed this DDR series memory module transfer. A new patent for the device.
本創作之主要目的乃在於該轉接裝置係包括轉接座及轉接電路板，其中該轉接座一側設有轉接插槽，以供插設記憶體模組，並於轉接座對側凸設有複數連接端子，以供焊固轉接電路板一側表面之複數第一金屬接點，而轉接電路板另側為設有供插設於主機板的插接腳座之插槽內形成電性連接之複數第二金屬接點，以對主機板的運作、性能來進行測試，其因轉接座的高度與轉接插槽的深度之差相加轉接電路板的高度後，為 等同於記憶體模組相對二側邊的第一扣槽與第二扣槽之高度差，所以當裝設有記憶體模組之轉接裝置插設至插槽內時，其插槽二側扳動體之卡制片便扣入於第一扣槽內呈一扣合定位，即可透過使用轉接裝置來防止記憶體模組不斷地直接與主機板進行插接作業，以避免記憶體模組另側之複數端子接點多次進行插拔而產生磨損之狀況，進而延長記憶體模組的使用壽命，藉此達到降低整體生產成本之目的。 The main purpose of the present invention is that the adapter device includes an adapter and a transfer circuit board, wherein the adapter has a transfer slot on one side for inserting the memory module and the adapter A plurality of connecting terminals are provided on the opposite side for soldering and fixing a plurality of first metal contacts on one side surface of the circuit board, and the other side of the transit circuit board is provided with a plug socket for being inserted into the motherboard. A plurality of second metal contacts electrically connected in the slot are tested for operation and performance of the motherboard, and the transfer board is added by the difference between the height of the adapter and the depth of the adapter slot After the height, for The difference between the height of the first buckle slot and the second buckle slot of the opposite side of the memory module is such that when the adapter device with the memory module is inserted into the slot, the two sides of the slot The card body of the pulling body is buckled into the first buckle groove to be in a snap-fit position, so that the memory module can be prevented from being directly connected to the motherboard through the use of the adapter device to avoid the memory. The multiple terminal contacts on the other side of the module are inserted and removed multiple times to cause wear and tear, thereby prolonging the service life of the memory module, thereby reducing the overall production cost.
本創作之次要目的乃在於該轉接座的高度與轉接插槽的深度之差相加轉接電路板的高度為等同於記憶體模組相對二側邊的第一扣槽與第二扣槽之高度差，所以當裝設有記憶體模組之轉接裝置插設於主機板的插接腳座之插槽內時，其插槽二側扳動體之卡制片便會扣入至第一扣槽內，即可使記憶體模組穩定地傳輸電子訊號至主機板上以進行運作及功能上的測試，且便可藉由此種結構設計來確保定位上的穩固性，以及達到訊號傳輸穩定性之目的。 The second purpose of the creation is that the height of the adapter and the depth of the adapter slot are added to the height of the adapter board to be equal to the first slot and the second of the opposite sides of the memory module. The height difference of the buckle groove is such that when the adapter device with the memory module is inserted into the slot of the socket of the motherboard, the card of the two sides of the slot is buckled. By entering the first buckle groove, the memory module can stably transmit the electronic signal to the motherboard for operational and functional testing, and the structural design can be used to ensure the stability of the positioning. And achieve the purpose of signal transmission stability.
1‧‧‧轉接裝置 1‧‧‧Transfer device
11‧‧‧轉接座 11‧‧‧Transfer seat
111‧‧‧轉接插槽 111‧‧‧Transfer slot
1111‧‧‧轉接端子 1111‧‧‧Transfer terminal
112‧‧‧連接端子 112‧‧‧Connecting terminal
12‧‧‧轉接電路板 12‧‧‧Transfer board
121‧‧‧第一金屬接點 121‧‧‧First metal joint
122‧‧‧第二金屬接點 122‧‧‧Second metal joint
2‧‧‧記憶體模組 2‧‧‧ memory module
21‧‧‧端子接點 21‧‧‧Terminal contacts
22‧‧‧第一扣槽 22‧‧‧First buckle
23‧‧‧第二扣槽 23‧‧‧Second buckle
3‧‧‧主機板 3‧‧‧ motherboard
31‧‧‧插接腳座 31‧‧‧ Plug-in socket
310‧‧‧插槽 310‧‧‧Slots
3101‧‧‧插接端子 3101‧‧‧Plug terminal
32‧‧‧扳動體 32‧‧‧ Pulling body
321‧‧‧頂推板 321‧‧‧Pushing board
322‧‧‧卡制片 322‧‧‧Cards
323‧‧‧按壓部 323‧‧‧ Pressing Department
第一圖 係為本創作之立體外觀圖。 The first picture is a three-dimensional appearance of the creation.
第二圖 係為本創作之立體分解圖。 The second picture is a three-dimensional exploded view of the creation.
第三圖 係為本創作另一視角之立體分解圖。 The third figure is a three-dimensional exploded view of another perspective of the creation.
第四圖 係為本創作較佳實施例之立體分解圖。 The fourth figure is a perspective exploded view of the preferred embodiment of the present invention.
第五圖 係為本創作轉接裝置插接前之側視圖。 The fifth figure is a side view of the original transfer device before it is inserted.
第六圖 係為本創作轉接裝置插接後之側視圖。 The sixth figure is a side view of the authoring transfer device after being inserted.
為達成上述目的及功效，本創作所採用之技術手段及其構造，茲繪圖就本創作之較佳實施例詳加說明其特徵與功能如下，俾利完全瞭解。 In order to achieve the above objectives and effects, the technical means and structure of the present invention are described in detail in the preferred embodiment of the present invention, and the features and functions are as follows.
請參閱第一、二、三圖所示，係為本創作之立體外觀圖、立體分解圖及另一視角之立體分解圖，由圖中可清楚看出，本創作之轉接裝置1係包括轉接座11、轉接電路板12，其中：該轉接座11為呈長矩形，並於轉接座11一側剖設有轉接插槽111，且轉接插槽111內穿設有複數轉接端子1111，再於轉接座11相對於轉接插槽111對側凸設有複數連接端子112。 Please refer to the first, second and third figures, which are the three-dimensional external view, the three-dimensional exploded view and the three-dimensional exploded view of another perspective. As can be clearly seen from the figure, the switching device 1 of the present invention includes The adapter base 11 and the adapter circuit board 12, wherein the adapter base 11 has a long rectangular shape, and the adapter slot 111 is disposed on one side of the adapter base 11 , and the adapter slot 111 is disposed inside the adapter socket 11 . The plurality of connection terminals 1111 are further provided with a plurality of connection terminals 112 protruding from opposite sides of the adapter socket 11 with respect to the adapter socket 111.
該轉接電路板12一側表面為設有複數第一金屬接點121，而轉接電路板12另側表面則設有複數第二金屬接點122。 A plurality of first metal contacts 121 are disposed on one surface of the transit circuit board 12, and a plurality of second metal contacts 122 are disposed on the other side surface of the transit circuit board 12.
本創作於組裝時，係可利用焊槍以焊固的方式將轉接座11一側凸設之複數連接端子112一一電性連接於轉接電路板12一側之複數第一金屬接點121，且待焊固完成後，即可藉由轉接座11、轉接電路板12組構成轉接裝置1。 In the assembly, the plurality of connection terminals 112 protruding from one side of the adapter 11 are electrically connected to the plurality of first metal contacts 121 on the side of the transit circuit board 12 by means of a welding torch. After the completion of the soldering, the adapter device 1 can be formed by the adapter 11 and the adapter circuit board 12.
請搭配參閱第一、四、五、六圖所示，係為本創作之立體外觀圖、較佳實施例之立體分解圖、轉接裝置插接前之側視圖、轉接裝置插接後之側視圖，由圖中所示可以清楚看出，本創作之轉接裝置1於較佳實施例可供型式為***雙倍資料率同步動態隨機存取記憶體(Double-Data-Rate Fourth Generation Synchronous Dynamic Random Access Memory，簡稱為DDR4 SDR AM)之記憶體模組2插設，但於實際應用時，亦可供第一、二或三代之雙倍資料率同步動態隨機存取記憶體插設，其記憶體模組2一側為設有複數端子接點21，並於記憶體模組2相對於複數端子接點21另二側邊各設有第一扣槽22，以及位於第一扣槽22上方一距離處之第二扣槽23，當轉接裝置1利用轉接座11之轉接插槽111來供記憶體模組2***時，其記憶體模組2之複數端子接點21則電性連接於轉接插槽111內的複數轉接端子1111，再藉由轉接座11下方焊設之轉接電路板12來電性插接於待測試主機板3上之插接腳座31的插槽310內，其轉接電路板12二側邊即分別抵靠於插槽310二側扳動體32底部的頂推板321上，並抵推二側扳動體32使其分別向相對內側旋移，而二扳動體32頂部之卡制片322則分別扣入於記憶體模組2的二側之第一扣槽22內，以使轉接電路板12完全***插接腳座31的插槽310中，且待轉接電路板12之第二金屬接點122與插槽310內之複數插接端子3101形成電性連接狀態後，便可對待測試主機板3的運作性能、執行效果進行準確的測試。 Please refer to the first, fourth, fifth and sixth figures, which are the three-dimensional appearance of the creation, the exploded view of the preferred embodiment, the side view before the adapter is plugged in, and the adapter after the adapter is inserted. In a side view, it can be clearly seen from the figure that the switching device 1 of the present invention is available in the preferred embodiment as a fourth generation double data rate synchronous dynamic random access memory (Double-Data-Rate Fourth). Generation Synchronous Dynamic Random Access Memory, referred to as DDR4 SDR AM) memory module 2 is inserted, but in actual application, it can also be used for the first, second or third generation double data rate synchronous dynamic random access memory insertion, and the memory module 2 side is A plurality of terminal contacts 21 are disposed, and a first buckle groove 22 is disposed on the other side of the memory module 2 opposite to the plurality of terminal contacts 21, and a second buckle is located at a distance above the first buckle groove 22. In the slot 23, when the adapter device 1 uses the adapter slot 111 of the adapter 11 for the memory module 2 to be inserted, the plurality of terminal contacts 21 of the memory module 2 are electrically connected to the adapter slot. The plurality of transfer terminals 1111 in the 111 are electrically connected to the socket 310 of the plug-in socket 31 on the motherboard 3 to be tested by the transfer circuit board 12 soldered under the adapter 11 The two sides of the circuit board 12 are respectively abutted against the pushing plate 321 at the bottom of the two-side pulling body 32 of the slot 310, and the two side pulling bodies 32 are pushed to be respectively rotated to the opposite inner side, and the two boards are respectively The card pieces 322 on the top of the movable body 32 are respectively inserted into the first buckle grooves 22 on the two sides of the memory module 2, so that the adapter circuit board 12 is completely inserted into the slot 310 of the plug socket 31. After the second metal contact 122 of the circuit board 12 to be transferred and the plurality of plug terminals 3101 in the socket 310 are electrically connected, the operation performance and the execution effect of the test board 3 can be accurately performed. test.
當待測試主機板3的測試作業完成後，其欲將裝設有記憶體模組2之轉接裝置1由待測試主機板3的插接腳座31中退出，可透過插接腳座31二側之扳動體32的按壓部323，分別向外施力按壓，即利用二扳動體32之頂推板321來分別頂推轉接座11的轉接電路板12二側邊，以使轉接電路板12向上推動而脫離至插接腳座31的插槽310外部，且二側扳動體32的卡制片322在二側頂推板321頂推轉接電路板12時，並不會形成抵擋記憶體模組2插接的阻力，並可供轉接 裝置1的轉接座11、轉接電路板12順利退出插接腳座31中，以減少記憶體模組2***轉接插槽111時所受到的阻擋或干擾。 After the test operation of the motherboard 3 to be tested is completed, the adapter device 1 to which the memory module 2 is mounted is to be withdrawn from the socket 10 of the motherboard 3 to be tested, and is detachable through the socket 31. The pressing portions 323 of the two-side pulling body 32 are respectively pressed outwardly, that is, the pushing plates 321 of the two pulling bodies 32 are used to push the two sides of the adapter circuit board 12 of the adapter 11 respectively. The adapter circuit board 12 is pushed upward to be disengaged from the outside of the slot 310 of the socket base 31, and the card piece 322 of the two-side trigger body 32 pushes the adapter circuit board 12 when the two-side thrust plate 321 pushes the circuit board 12 It does not form a resistance against the insertion of the memory module 2 and can be transferred The adapter base 11 and the adapter circuit board 12 of the device 1 smoothly exit the plug socket 31 to reduce the blocking or interference that the memory module 2 receives when inserted into the adapter slot 111.
本創作轉接裝置1之轉接座11的高度(A)減去轉接插槽111的深度(B)，並與轉接電路板12的高度(C)相加後，為等同於記憶體模組2之第一扣槽22及第二扣槽23與底面距離的高度差(即A-B+C=D2-D1)，即可透過此種結構設計，使裝設有記憶體模組2之轉接裝置1插設於主機板3之插接腳座31內時，其扳動體32便會旋動而使卡制片322扣入於第一扣槽22內呈一穩固定位，以供記憶體模組2穩定地傳輸電子訊號至主機板3上進行功能測試，便可達到確保定位上的穩固性，以及訊號傳輸上的穩定性之效用，且利用轉接裝置1可防止記憶體模組2直接不斷地與主機板3進行插接作業，以避免記憶體模組2一側之複數端子接點21受到多次的插拔而產生之磨損情況，進而延長記憶體模組2的使用壽命，藉此降低整體的生產成本。 The height (A) of the adapter 11 of the authoring adapter 1 is subtracted from the depth (B) of the adapter slot 111, and is added to the height (C) of the adapter board 12 to be equivalent to the memory. The height difference between the first buckle groove 22 and the second buckle groove 23 of the module 2 and the bottom surface (ie, A-B+C=D 2 -D 1 ) can be designed to be equipped with the memory. When the adapter device 1 of the module 2 is inserted into the plug-in socket 31 of the motherboard 3, the triggering body 32 is rotated to buckle the card 322 into the first buckle slot 22 to form a stable Positioning, for the memory module 2 to stably transmit the electronic signal to the motherboard 3 for functional testing, thereby achieving the effect of ensuring the stability of the positioning and the stability of the signal transmission, and the switching device 1 can be utilized. The memory module 2 is prevented from being directly connected to the motherboard 3 to prevent the plurality of terminal contacts 21 on the side of the memory module 2 from being subjected to multiple insertions and removals, thereby prolonging the memory mode. The service life of Group 2, thereby reducing overall production costs.
再者，上述之轉接插槽111深度(B)係小於轉接座11的高度(A)，且轉接插槽111深度可約為轉接座11高度的預定比值(B=1/2A或2/3A等，且B<A)；另外，該轉接插槽111內穿設之複數轉接端子1111與轉接電路板12之複數第二金屬接點122的數目及長度皆為等同於記憶體模組2一側複數端子接點21的數目及長度。 Furthermore, the depth (B) of the above-mentioned adapter slot 111 is smaller than the height (A) of the adapter seat 11, and the depth of the adapter slot 111 can be approximately a predetermined ratio of the height of the adapter seat 11 (B=1/2A). Or 2/3A, etc., and B<A); in addition, the number and length of the plurality of second metal contacts 122 of the plurality of adapter terminals 1111 and the adapter circuit board 12 that are disposed in the adapter slot 111 are equal The number and length of the plurality of terminal contacts 21 on the memory module 2 side.
是以，以上所述僅為本創作之較佳實施例而已，非因此侷限本創作之專利範圍，本創作為主要針對轉接裝置1的轉接座11的高度與轉接插槽111的深度之差相加轉接電路板12的高度為等同於記憶體 模組2相對二側邊的第一扣槽22與第二扣槽23之高度差，所以當裝有記憶體模組2之轉接裝置1插設至插槽310內時，其插槽310二側扳動體32之卡制片322便扣入於第一扣槽22內呈一扣合定位，以確保定位上的穩固性，以及訊號傳輸上的穩定性，且利用轉接裝置1可避免記憶體模組2另側之複數端子接點21不斷因受到插拔而產生之磨損，進而延長記憶體模組2的使用壽命、降低整體生產成本，故舉凡可達成前述效果之結構、裝置皆應受本創作所涵蓋，此種簡易修飾及等效結構變化，均應同理包括於本創作之專利範圍內，合予陳明。 Therefore, the above description is only a preferred embodiment of the present invention, and thus is not limited to the scope of the patent of the present invention. The present invention is mainly for the height of the adapter 11 of the adapter device 1 and the depth of the adapter slot 111. The difference is added to the height of the transit circuit board 12 to be equivalent to the memory The height difference between the first buckle 22 and the second buckle 23 of the two sides of the module 2 is such that when the adapter device 1 with the memory module 2 is inserted into the slot 310, the slot 310 The clamping piece 322 of the two-side pulling body 32 is buckled into the first fastening groove 22 for fastening positioning to ensure the stability of the positioning and the stability of the signal transmission, and the switching device 1 can be used. The structure and device for achieving the foregoing effects can be avoided by avoiding the wear and tear caused by the plugging and unplugging of the plurality of terminal contacts 21 on the other side of the memory module 2, thereby prolonging the service life of the memory module 2 and reducing the overall production cost. All of them should be covered by this creation. Such simple modifications and equivalent structural changes should be included in the scope of this patent and combined with Chen Ming.
綜上所述，本創作上述之DDR系列記憶體模組轉接裝置於使用時，為確實能達到其功效及目的，故本創作誠為一實用性優異之新型，為符合新型專利之申請要件，爰依法提出申請，盼 審委早日賜准本案，以保障創作人之辛苦創作，倘若 鈞局審委有任何稽疑，請不吝來函指示，創作人定當竭力配合，實感公便。 In summary, the above-mentioned DDR series memory module switching device can achieve its efficacy and purpose when used, so this creation is a new type of practicality, which is in line with the application requirements of the new patent.爰Proposing an application in accordance with the law, I hope that the trial committee will grant this case as soon as possible to protect the creators' hard work. If there is any doubt in the ruling committee, please do not hesitate to give instructions, the creator will try his best to cooperate and feel polite.
1‧‧‧轉接裝置 1‧‧‧Transfer device
11‧‧‧轉接座 11‧‧‧Transfer seat
111‧‧‧轉接插槽 111‧‧‧Transfer slot
1111‧‧‧轉接端子 1111‧‧‧Transfer terminal
112‧‧‧連接端子 112‧‧‧Connecting terminal
12‧‧‧轉接電路板 12‧‧‧Transfer board
121‧‧‧第一金屬接點 121‧‧‧First metal joint
122‧‧‧第二金屬接點 122‧‧‧Second metal joint
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105207721U TWM528544U (en) | 2016-05-25 | 2016-05-25 | DDR series memory module adapter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105207721U TWM528544U (en) | 2016-05-25 | 2016-05-25 | DDR series memory module adapter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM528544U true TWM528544U (en) | 2016-09-11 |
Family
ID=57444143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105207721U TWM528544U (en) | 2016-05-25 | 2016-05-25 | DDR series memory module adapter |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM528544U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI790749B (en) * | 2021-09-16 | 2023-01-21 | 英業達股份有限公司 | Adapter card |
| TWI819347B (en) * | 2020-11-02 | 2023-10-21 | 南韓商三星電子股份有限公司 | Module board and memory module including the same |
-
2016
- 2016-05-25 TW TW105207721U patent/TWM528544U/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI819347B (en) * | 2020-11-02 | 2023-10-21 | 南韓商三星電子股份有限公司 | Module board and memory module including the same |
| TWI790749B (en) * | 2021-09-16 | 2023-01-21 | 英業達股份有限公司 | Adapter card |
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