TWM528253U - Metal heat dissipation plate structure - Google Patents

Description

金屬散熱板結構Metal heat sink structure

本創作係有關於一種金屬散熱板結構，尤指一種具有良好導熱性能之金屬散熱板，且該金屬散熱板能運用於各種電子產品中，達到良好散熱效果為其首先應用創作者。This creation relates to a metal heat sink structure, especially a metal heat sink with good thermal conductivity, and the metal heat sink can be used in various electronic products to achieve a good heat dissipation effect for its first application creator.

按，隨著電子產業的高速發展，現代社會電子裝置越來越普及，如個人電腦、手機、事務機、GPS導航裝置等電子裝置，且現今電子元件和電子設備的體積也日漸驅向薄、輕、小方向發展，除了薄、輕、小之外，功能也越來越多及強大。According to the rapid development of the electronics industry, modern social electronic devices are becoming more and more popular, such as personal computers, mobile phones, business machines, GPS navigation devices and other electronic devices, and the size of electronic components and electronic devices is now increasingly thin. In the light and small direction, in addition to thin, light and small, the functions are more and more powerful.

隨著電子產品的集成度越來越高，單位面積內的電子元件的數量呈幾何級數量增長，散熱成為一個很重要的課題，如果熱量來不及散除將導致元件工作溫度升高，嚴重時還會使電子元件失效，直接影響到使用它們的各種高精密度設備的壽命和可靠性。因此，熱量的如何散發問題已經成為電子產品小型化、集成化的瓶頸。As the integration of electronic products becomes higher and higher, the number of electronic components per unit area increases geometrically. Heat dissipation becomes an important issue. If the heat is too late to dissipate, the operating temperature of the components will rise. The failure of electronic components directly affects the longevity and reliability of the various high-precision equipment in which they are used. Therefore, how to dissipate heat has become a bottleneck for miniaturization and integration of electronic products.

而一般傳統用來散熱的技術為採用導熱矽膠，該導熱矽膠好處在於可壓縮，但導熱矽膠相比銅等金屬來說，熱傳導太慢，並且通常要搭配風扇，在要求快速降低溫度時及空間有限時就顯得無能為力。於是，乃有業者思及於銅底部結合碳層，藉此，以達到散熱特性，請參閱中國公告第CN103476227 A號之「銅碳複合散熱片及其製備方法」，該銅碳複合散熱片由銅箔兩面塗佈碳導熱層構成；其特徵在於:所述銅箔的厚度為0.02〜0.25mm；所述碳導熱層的厚度為0.015〜0.03mm；所述銅碳複合散熱片的厚度為0.08〜0.3mm；所述碳導熱層由如下組分按質量份計組成:石墨烯或者單壁碳納米管100份粘接劑I〜50份所述石墨烯的比表面積為500〜1000m2/g；所述單壁碳納米管的粒徑為5nm；所述粘接劑為聚偏氟乙烯、聚乙烯吡咯烷酮、聚乙二醇、聚乙烯醇中的一種或其一種以上組合物。一種製備，其特徵在於，包括如下步驟：(1)將粘結劑溶於有機溶劑，得到粘結劑的有機溶液；(2)將石墨烯或碳納米管與粘接劑的有機溶液混合，得到混合物；(3)將混合物超聲分散0.5〜I小時，在1500〜3000rpm的轉速下攪拌分散I〜5小時，得到混合均勻的混合物；(4)將混合均勻的混合物雙面塗佈在銅箔上，在惰性氣體保護下固化得到所述銅碳複合銅箔散熱片，其中固化溫度為50〜200°C，固化時間為10〜100min。The traditional technology used for heat dissipation is to use a thermal conductive silicone. The advantage of the thermal conductive silicone is that it can be compressed, but the thermal conductivity of the silicone is too slow compared to metals such as copper, and usually with a fan, when it is required to quickly reduce the temperature and space. When it is limited, it seems powerless. Therefore, some manufacturers have thought about combining the carbon layer at the bottom of the copper, in order to achieve the heat dissipation characteristics, please refer to the "copper carbon composite heat sink and its preparation method" of the Chinese publication No. CN103476227 A, the copper carbon composite heat sink is composed of The copper foil is coated on both sides with a carbon heat conducting layer; the copper foil has a thickness of 0.02~0.25mm; the carbon heat conducting layer has a thickness of 0.015~0.03mm; and the copper carbon composite heat sink has a thickness of 0.08 〜0.3mm; the carbon heat-conducting layer is composed of the following components in parts by mass: graphene or single-walled carbon nanotubes 100 parts of adhesive I 50 parts of the graphene has a specific surface area of 500~1000 m2 / g; The single-walled carbon nanotube has a particle diameter of 5 nm; and the binder is one of polyvinylidene fluoride, polyvinylpyrrolidone, polyethylene glycol, and polyvinyl alcohol or one or more compositions thereof. A preparation comprising the steps of: (1) dissolving a binder in an organic solvent to obtain an organic solution of a binder; and (2) mixing graphene or carbon nanotubes with an organic solution of a binder; Obtaining a mixture; (3) ultrasonically dispersing the mixture for 0.5 to 1 hour, stirring at 1500 to 3000 rpm for 1 to 5 hours to obtain a uniformly mixed mixture; (4) coating the uniformly mixed mixture on the copper foil The copper carbon composite copper foil heat sink is cured under the protection of an inert gas, wherein the curing temperature is 50 to 200 ° C, and the curing time is 10 to 100 min.

上述我國公告第I333221號之「銅碳複合散熱片及其製備方法」雖可達到將含碳物質附著於銅箔底面的效果，但其附著的方式係將含碳物質利用粘結劑、溶劑製成有機溶液後，再塗佈及於惰性氣體保護下固化，以形成銅碳複合銅箔散熱片，故僅以黏著劑或溶劑黏結的方式，不僅使構成碳層之含碳物質本身容易脫落，在與異質銅箔的結合間更不穩固，極容易發生碳層由銅箔表面剝落下來的情形，並且含碳物質間係由黏結劑或溶劑黏結，此方式更會降低含碳物質間的傳導性，大幅減低熱傳導效果。The "copper-carbon composite heat sink and its preparation method" of the above-mentioned China No. I333221 can achieve the effect of attaching a carbonaceous substance to the bottom surface of the copper foil, but the method of attaching the carbonaceous substance is made of a binder or a solvent. After being formed into an organic solution, it is coated and cured under an inert gas to form a copper-carbon composite copper foil heat sink. Therefore, only the adhesive or solvent bonding means that the carbonaceous material constituting the carbon layer is easily peeled off. It is less stable between the combination with the heterogeneous copper foil, and it is easy to cause the carbon layer to peel off from the surface of the copper foil, and the carbonaceous material is bonded by a binder or a solvent, which further reduces the conduction between the carbonaceous materials. Sexually, greatly reducing the heat transfer effect.

緣是，創作人有鑑於現有上述銅箔上結合碳層之構造及成型方式仍有碳層與鋁材結合性不佳，以致降低熱傳導效果和成本過高不符合經濟效益等諸多缺失，乃藉其多年於相關領域的製造及設計經驗和知識的輔佐，並經多方巧思，針對現有散熱板結構做更新的研發改良，而研發出本創作。The reason is that the creator has the disadvantage that the carbon layer and the aluminum material are not well combined in view of the structure and molding method of the carbon layer on the above-mentioned copper foil, so that the heat conduction effect is lowered and the cost is too high, which is not in line with economic benefits and the like. He has been assisting in the manufacturing and design experience and knowledge of related fields for many years, and has developed and developed this creation by making in-depth research and development on the existing heat sink structure.

本創作係有關一種金屬散熱板結構，其主要目的係為了提供一種具有良好導熱性能之金屬散熱板，且該金屬散熱板能運用於各種電子產品中，達到良好散熱效果者。The present invention relates to a metal heat sink structure, the main purpose of which is to provide a metal heat sink with good thermal conductivity, and the metal heat sink can be used in various electronic products to achieve good heat dissipation effect.

本創作金屬散熱板結構的目的與功效係由以下之技術所實現：The purpose and function of the created metal heat sink structure is achieved by the following technologies:

係主要包含有一金屬基材、金屬披覆層及天然石墨層，其中於該金屬基材上、下端面分別植入金屬披覆層，再於二金屬披覆層表面分別植入天然石墨層；藉此，利用金屬基材之表面結構及金屬披覆層，可使高純度石墨牢固地結合於金屬基材上，且由天然石墨層天然石墨層所形成之碳膜，係具有良好熱傳導特性，故使用實施上係能達到大幅提高電子產品的散熱效果，也能延長使用壽命者。The system mainly comprises a metal substrate, a metal coating layer and a natural graphite layer, wherein a metal coating layer is respectively implanted on the upper and lower end surfaces of the metal substrate, and a natural graphite layer is respectively implanted on the surface of the two metal coating layer; Thereby, the high-purity graphite can be firmly bonded to the metal substrate by using the surface structure of the metal substrate and the metal coating layer, and the carbon film formed by the natural graphite layer of the natural graphite layer has good heat conduction characteristics. Therefore, the implementation of the system can greatly improve the heat dissipation effect of electronic products, and can also prolong the service life.

如上所述之金屬散熱板結構，其中進一步該金屬基材為選用銅、鋁、不鏽鋼、冷軋鋼材質。The metal heat sink structure as described above, wherein the metal substrate is further made of copper, aluminum, stainless steel or cold rolled steel.

如上所述之金屬散熱板結構，其中進一步該金屬基材其表面為光滑面，或為粗糙面者。The metal heat sink structure as described above, wherein the metal substrate further has a smooth surface or a rough surface.

如上所述之金屬散熱板結構，其中該金屬基材厚度為10μm~1.6mm。The metal heat sink structure as described above, wherein the metal substrate has a thickness of 10 μm to 1.6 mm.

如上所述之金屬散熱板結構，其中該金屬披覆層為採用鎳、鉻、鎳鉻合金、銀或鈦金屬其一。The metal heat sink structure as described above, wherein the metal coating layer is one of nickel, chromium, nichrome, silver or titanium.

如上所述之金屬散熱板結構，其中該未經加工的金屬基材於真空磁控濺鍍空間條件下進行金屬披覆層植入及天然石墨層植入。The metal heat sink structure as described above, wherein the unprocessed metal substrate is subjected to metal cladding layer implantation and natural graphite layer implantation under vacuum magnetron sputtering space conditions.

為令本創作所運用之技術內容、創作目的及其達成之功效有更完整且清楚的揭露，茲於下詳細說明之，並請一併參閱所揭之圖式及圖號：In order to make the technical content, creative purpose and the effect achieved by this creation more complete and clear, please elaborate below, and please refer to the drawings and drawings:

首先，請參閱第一圖所示，為本創作之金屬散熱板結構之剖視示意圖，其包含有：First, please refer to the first figure, which is a schematic cross-sectional view of the metal heat sink structure of the present invention, which includes:

一金屬基材（１），其具有上、下表面（１１）；a metal substrate (1) having upper and lower surfaces (11);

二金屬披覆層（２），係分別對應植入於金屬基材（１）之上、下表面（１１）；The two metal coating layers (2) are respectively implanted on the metal substrate (1) above and the lower surface (11);

二天然石墨層（３），為採用高純度天然石墨，且分別對應嵌植於金屬披覆層（２）表面者。The two natural graphite layers (3) are made of high-purity natural graphite and are respectively embedded in the surface of the metal coating layer (2).

當於實際實施製作金屬散熱板時，係可由下列製作方式得之，說明如下：When the metal heat sink is actually implemented, it can be obtained by the following methods, as follows:

首先，取得金屬基材（１），該金屬基材（１）可選用銅、鋁、不鏽鋼、冷軋鋼等金屬材質，且其厚度為10μm~1.6mm之間，而該金屬基材（１）之上、下表面（１１）能依據所選用之金屬材質，而呈現表面為光滑面，或為粗糙面，如銅材在未經加工時，其表面（１１）保持光滑面，而如不鏽鋼、冷軋鋼等在未經加工時，表面（１１）呈現凹凸不平的粗糙面。續將該金屬基材（１）置入一真空腔室內，且該真空腔室具備有真空磁控濺鍍空間的條件，讓金屬基材（１）於條件下進行濺鍍植入金屬披覆層（２）。First, a metal substrate (1) is obtained. The metal substrate (1) may be made of a metal such as copper, aluminum, stainless steel or cold-rolled steel, and has a thickness of between 10 μm and 1.6 mm, and the metal substrate (1) The upper and lower surfaces (11) can be made of a smooth surface or a rough surface depending on the metal material selected. For example, when the copper material is not processed, the surface (11) maintains a smooth surface, such as stainless steel. When the cold-rolled steel or the like is not processed, the surface (11) exhibits a rough surface which is uneven. The metal substrate (1) is continuously placed in a vacuum chamber, and the vacuum chamber is provided with a vacuum magnetron sputtering space, and the metal substrate (1) is sputter-plated into the metal under conditions. Layer (2).

於此，進行濺鍍金屬披覆層（２）時，其選用之金屬為採用鎳、鉻、鎳鉻合金、銀或鈦金屬其一。之後，藉由該真空腔室讓該金屬披覆層（２）可植入於金屬基材（１）之上、下表面（１１）；接著，同樣在真空磁控濺鍍空間的條件下，將高純度天然石墨分別植入於金屬披覆層（２）表面，以完成金屬散熱板的製作。Here, when the metal plating layer (2) is sputtered, the metal selected is one of nickel, chromium, nichrome, silver or titanium. Thereafter, the metal coating layer (2) can be implanted on the metal substrate (1) and the lower surface (11) by the vacuum chamber; then, under the condition of the vacuum magnetron sputtering space, High-purity natural graphite is separately implanted on the surface of the metal coating layer (2) to complete the fabrication of the metal heat sink.

據此，金屬散熱板的成型方式，係可以使天然石墨層（３）與金屬基材（１）間具有牢固的結合關係，且由於天然石墨係由碳原子鍵結而成，故石墨本身係具有極佳的密合性不易相互脫落，且由高純度石墨構成的天然石墨層（３）更具有良好的傳導率與導電性，故本創作之金屬散熱板不僅可大幅提散熱板的機械強度，於實施上其良好的高熱傳導率特性，更有助於所組裝之電器產品、電子元件的散熱效果，進而增加使用壽命等的提升者。Accordingly, the metal heat sink is formed by a strong bonding relationship between the natural graphite layer (3) and the metal substrate (1), and since the natural graphite is bonded by carbon atoms, the graphite itself is It has excellent adhesion and is not easy to fall off each other, and the natural graphite layer (3) composed of high-purity graphite has better conductivity and conductivity. Therefore, the metal heat sink of the present invention can not only greatly increase the mechanical strength of the heat sink. In terms of its high thermal conductivity, it is more conducive to the heat dissipation effect of the assembled electrical products and electronic components, thereby increasing the service life and other enhancers.

然而前述之實施例或圖式並非限定本創作之產品態樣、結構或使用方式，任何所屬技術領域中具有通常知識者之適當變化或修飾，皆應視為不脫離本創作之專利範疇。However, the above-described embodiments or drawings are not intended to limit the product, the structure, or the use of the present invention. Any changes or modifications of the ordinary skill in the art should be considered as not departing from the scope of the invention.

由上述結構及實施方式可知，本創作係具有如下優點：According to the above structure and implementation, the author has the following advantages:

1.本創作之金屬散熱板結構係為一金屬基材，且能讓其可呈光滑或粗糙的表面，經由金屬披覆層而讓天然石墨能與基材表面結合，讓高純度的天然石墨可以嵌入金屬基材與金屬披覆層的表面內，而與基材間形成牢固的結合，藉此，即不易發生表面剝落的情形，而能確保散熱板機械強度的提升者。1. The metal heat sink structure of the present invention is a metal substrate, and can be made to have a smooth or rough surface, and the natural graphite can be combined with the surface of the substrate through the metal coating layer to allow high-purity natural graphite. It can be embedded in the surface of the metal substrate and the metal coating layer to form a strong bond with the substrate, whereby the surface peeling is less likely to occur, and the mechanical strength of the heat sink can be improved.

2.本創作之金屬散熱板結構係使用高純度的天然石墨，該石墨具有極佳的密合度及良好的導電性，故於實施上不僅可大幅提高金屬基材的機械強度，於實施上其良好的高熱傳導率特性，更有助於所組裝之電器產品、電子元件的散熱效果，進而增加使用壽命等的提升者。2. The metal heat sink structure of the present invention uses high-purity natural graphite, which has excellent adhesion and good electrical conductivity, so that the mechanical strength of the metal substrate can be greatly improved in implementation, and Good high thermal conductivity characteristics are more conducive to the heat dissipation effect of the assembled electrical products and electronic components, thereby increasing the service life and the like.

3.本創作之金屬散熱板結構，其金屬基材二側表面能有效附著金屬披覆層及採用天然石墨等層狀結構，以使散熱板於使用效率更加倍提高，達到具體提升金屬散熱板的產量及產業競爭力之實質效益。3. The metal heat sink structure of the present invention can effectively adhere the metal coating layer on the two side surfaces of the metal substrate and adopt a layered structure such as natural graphite, so that the use efficiency of the heat dissipation plate is further improved, and the concrete lifting plate is specifically improved. The actual benefits of production and industrial competitiveness.

4.本創作之金屬散熱板結構，其金屬基材能依據所選用之金屬材質，而呈現表面為光滑面，或為粗糙面，達到適用性廣，且結構附著性加的功效。4. The metal heat sink structure of the present invention can be made of a metal material according to the metal material selected, and the surface is smooth or rough, which has wide applicability and structural adhesion.

綜上所述，本創作實施例確能達到所預期之使用功效，又其所揭露之具體構造，不僅未曾見諸於同類產品中，亦未曾公開於申請前，誠已完全符合專利法之規定與要求，爰依法提出新型專利之申請，懇請惠予審查，並賜准專利，則實感德便。In summary, the present embodiment can achieve the expected use efficiency, and the specific structure disclosed therein has not been seen in similar products, nor has it been disclosed before the application, and has fully complied with the provisions of the Patent Law. And the request, the application for a new type of patent in accordance with the law, please forgive the review, and grant the patent, it is really sensible.

本創作：This creation:

（１）‧‧‧金屬基材(1)‧‧‧Metal substrate

（１１）‧‧‧表面(11) ‧ ‧ surface

（２）‧‧‧金屬披覆層(2)‧‧‧Metal coating

（３）‧‧‧天然石墨層(3) ‧‧‧ natural graphite layer

第一圖：本創作之剖視示意圖The first picture: a schematic view of the creation

(1)‧‧‧金屬基材 (1)‧‧‧Metal substrate

(11)‧‧‧表面 (11) ‧ ‧ surface

(2)‧‧‧金屬披覆層 (2)‧‧‧Metal coating

(3)‧‧‧天然石墨層 (3) ‧‧‧ natural graphite layer

Claims (6)

一種金屬散熱板結構，其包含有： 一金屬基材，其具有上、下表面； 二金屬披覆層，係分別對應植入於金屬基材之上、下表面； 二天然石墨層，為採用高純度天然石墨，且分別對應嵌植於金屬披覆層表面者。A metal heat sink structure comprising: a metal substrate having upper and lower surfaces; and a second metal coating layer respectively corresponding to the upper surface and the lower surface of the metal substrate; High-purity natural graphite, which is correspondingly embedded in the surface of the metal coating. 如申請專利範圍第1項所述金屬散熱板結構，其中該金屬基材為選用銅、鋁、不鏽鋼、冷軋鋼材質。The metal heat sink structure as claimed in claim 1, wherein the metal substrate is made of copper, aluminum, stainless steel or cold rolled steel. 如申請專利範圍第2項所述金屬散熱板結構，其中該金屬基材厚度為10μm~1.6mm。The metal heat sink structure according to claim 2, wherein the metal substrate has a thickness of 10 μm to 1.6 mm. 如申請專利範圍第2項所述金屬散熱板結構，其中該金屬基材之表面為依據選用材質而呈現光滑面，或粗糙面。The metal heat sink structure according to claim 2, wherein the surface of the metal substrate is a smooth surface or a rough surface according to the selected material. 如申請專利範圍第1、2或3項所述金屬散熱板結構，其中該金屬披覆層為採用鎳、鉻、鎳鉻合金、銀、鈦金屬其一。The metal heat sink structure as claimed in claim 1, 2 or 3, wherein the metal coating layer is made of nickel, chromium, nickel-chromium alloy, silver or titanium metal. 如申請專利範圍第1、2或3項所述金屬散熱板結構，其中該金屬基材於真空磁控濺鍍空間條件下進行金屬披覆層植入及天然石墨層植入。The metal heat sink structure as claimed in claim 1, 2 or 3, wherein the metal substrate is implanted with a metal coating layer and a natural graphite layer under a vacuum magnetron sputtering space.