TWM525845U - Pressing device and pressing apparatus having the same - Google Patents
Pressing device and pressing apparatus having the same Download PDFInfo
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- TWM525845U TWM525845U TW105205108U TW105205108U TWM525845U TW M525845 U TWM525845 U TW M525845U TW 105205108 U TW105205108 U TW 105205108U TW 105205108 U TW105205108 U TW 105205108U TW M525845 U TWM525845 U TW M525845U
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Description
本新型是有關於一種壓合裝置及具有該壓合裝置的壓合設備,特別是指一種用以壓平基板的壓合裝置及具有該壓合裝置的壓合設備。The present invention relates to a press-fit device and a press-fit apparatus having the same, and more particularly to a press-fit device for flattening a substrate and a press-fit apparatus having the same.
現有多層化印刷電路基板已廣泛地作為IC封裝製程中的載板。多層化印刷電路基板在製造過程中,會在預先形成的電路圖案上塗佈例如為絕緣綠漆的絕緣材料,以使絕緣材料硬化後形成一絕緣層。Existing multilayer printed circuit boards have been widely used as carrier boards in IC packaging processes. In the manufacturing process of the multilayer printed circuit board, an insulating material such as an insulating green lacquer is applied to the previously formed circuit pattern to form an insulating layer after the insulating material is hardened.
由於電路圖案是呈現凹凸不平整的狀態,因此,絕緣材料塗佈於電路圖案後會隨其表面而產生凹凸起伏的變化,導致硬化後的絕緣層呈現凹凸不平的形狀。如此一來,會對印刷電路基板在後續封裝製程中與晶片之間的組裝造成影響。Since the circuit pattern is in a state in which the unevenness is uneven, the insulating material is applied to the circuit pattern to cause a change in the unevenness of the surface, and the hardened insulating layer has an uneven shape. As a result, the assembly of the printed circuit board with the wafer in the subsequent packaging process is affected.
因此,本新型之一目的,即在提供一種壓合裝置,能有效降低驅動缸驅動壓合架下移至壓合位置所需施加的力量,並能節省能量的耗損。Therefore, it is an object of the present invention to provide a pressing device which can effectively reduce the force required to drive the press cage to the pressing position and save energy consumption.
於是,本新型壓合裝置,適於壓合一基板,該壓合裝置包含一固定座、一壓合架,及一驅動缸。Therefore, the novel pressing device is adapted to press a substrate, and the pressing device comprises a fixing seat, a pressing frame, and a driving cylinder.
固定座包括一頂板、多個設置於該頂板的導向軸承,及一設置於該頂板頂端的下壓合盤;壓合架包括一位於該頂板下方的下板、一位於該下壓合盤上方的上壓合盤,及多個分別穿設於該等導向軸承的滑動桿,該等滑動桿可相對於該固定座上下移動;驅動缸包括一設置於該下板的缸體,及一穿設於該缸體的桿體,該桿體頂端連接於該頂板底端,該驅動缸用以驅動該壓合架下移,以使該上壓合盤與該下壓合盤相配合並壓合該基板。The fixing base comprises a top plate, a plurality of guiding bearings disposed on the top plate, and a lower pressing plate disposed at the top end of the top plate; the pressing frame comprises a lower plate located below the top plate, and a lower pressing plate The upper pressing plate and the plurality of sliding rods respectively disposed on the guiding bearings, the sliding rods are movable up and down relative to the fixing seat; the driving cylinder comprises a cylinder disposed on the lower plate, and a wearing a rod body of the cylinder body, the top end of the rod body is connected to the bottom end of the top plate, and the driving cylinder is used for driving the press frame to move downward so that the upper pressing plate and the lower pressing plate are matched and pressed The substrate is combined.
該頂板具有一頂面,及一相反於該頂面的底面,該下壓合盤設置於該頂面,該桿體頂端連接該底面,該等導向軸承彼此相間隔排列。The top plate has a top surface, and a bottom surface opposite to the top surface, the lower pressing plate is disposed on the top surface, the top end of the rod body is connected to the bottom surface, and the guiding bearings are spaced apart from each other.
該固定座更包括一與該頂板相接合的底座體,該底座體與該頂板共同界定一容置空間,該下板及該驅動缸位於該容置空間內。The mounting base further includes a base body that engages with the top plate. The base body and the top plate together define an accommodating space, and the lower plate and the driving cylinder are located in the accommodating space.
該壓合架更包括一上板,該上壓合盤設置於該上板底端,各該滑動桿上下兩端分別連接於該上板與該下板。The press frame further includes an upper plate, and the upper press plate is disposed at the bottom end of the upper plate, and the upper and lower ends of each of the sliding bars are respectively connected to the upper plate and the lower plate.
本新型之另一目的,即在提供一種具有壓合裝置的壓合設備,能使得基板的上表面及下表面有較佳的平坦化效果,並且還能提升加工基板的速度及效率以提升產能。Another object of the present invention is to provide a pressing device with a pressing device, which can better planarize the upper surface and the lower surface of the substrate, and can also improve the speed and efficiency of processing the substrate to increase the productivity. .
於是,本新型具有壓合裝置的壓合設備,包括一輸送裝置、一滾壓裝置,及一壓合裝置。Thus, the present invention has a press-fit apparatus for a press-fit device, including a transport device, a rolling device, and a press-fit device.
輸送裝置包含一入料前端,及一出料後端,該輸送裝置可沿一平行於一第一軸線的輸送方向輸送一基板,以將該基板由該入料前端輸送至該出料後端;滾壓裝置鄰近於該入料前端用以將至少一薄膜滾壓至該基板;壓合裝置鄰近於該出料後端,該壓合裝置包含一固定座、一壓合架,及一驅動缸,固定座包括一頂板、多個設置於該頂板的導向軸承,及一設置於該頂板頂端的下壓合盤;壓合架包括一位於該頂板下方的下板、一位於該下壓合盤上方的上壓合盤,及多個分別穿設於該等導向軸承的滑動桿,該等滑動桿可沿一垂直於該第一軸線的第二軸線相對於該固定座上下移動;驅動缸包括一設置於該下板的缸體,及一穿設於該缸體的桿體,該桿體頂端連接於該頂板底端,該驅動缸用以驅動該壓合架沿該第二軸線下移,以使該上壓合盤與該下壓合盤相配合並壓合該基板與該薄膜。The conveying device comprises a feeding front end and a discharging rear end, and the conveying device can convey a substrate along a conveying direction parallel to a first axis to convey the substrate from the feeding front end to the discharging rear end a rolling device adjacent to the front end of the feeding body for rolling at least one film to the substrate; a pressing device adjacent to the rear end of the discharging device, the pressing device comprising a fixing seat, a pressing frame, and a driving a cylinder, the fixing base comprises a top plate, a plurality of guiding bearings disposed on the top plate, and a lower pressing plate disposed at a top end of the top plate; the pressing frame comprises a lower plate located below the top plate, and a lower pressing plate An upper pressing plate above the disk, and a plurality of sliding rods respectively disposed on the guiding bearings, the sliding rods are movable up and down relative to the fixing seat along a second axis perpendicular to the first axis; the driving cylinder The utility model comprises a cylinder body disposed on the lower plate, and a rod body disposed on the cylinder body, the top end of the rod body is connected to the bottom end of the top plate, and the driving cylinder is used for driving the pressure frame along the second axis Shifting so that the upper compression plate cooperates with the lower pressure plate Bonding the substrate and the film.
該基板具有一下表面,該滾壓裝置包含一下側壓輥,該下側壓輥用以將該薄膜滾壓至該基板的該下表面。The substrate has a lower surface and the rolling device includes a lower side pressure roller for rolling the film to the lower surface of the substrate.
該基板具有一上表面,該滾壓裝置包含一上側壓輥,該上側壓輥用以將該薄膜滾壓至該基板的該上表面。The substrate has an upper surface, and the rolling device includes an upper side pressure roller for rolling the film onto the upper surface of the substrate.
該基板更具有一上表面,該滾壓裝置更包含一間隔位於該下側壓輥上方的上側壓輥,該上側壓輥用以將另一片薄膜滾壓至該基板的該上表面,該上壓合盤與該下壓合盤分別用以壓平該基板。The substrate further has an upper surface, the rolling device further comprising an upper pressing roller spaced above the lower pressing roller, the upper pressing roller for rolling another film onto the upper surface of the substrate, the upper surface The press plate and the lower press plate are used to flatten the substrate, respectively.
該滾壓裝置更包含一位於該下側壓輥下方的下供應輥,及一位於該上側壓輥上方的上供應輥,該下供應輥與該上供應輥分別捲繞該兩薄膜。The rolling device further includes a lower supply roller located below the lower side pressure roller, and an upper supply roller above the upper side pressure roller, and the lower supply roller and the upper supply roller respectively wind the two films.
壓合設備更包括一位於該滾壓裝置與該壓合裝置之間的切割裝置,該切割裝置包含一切刀,該切刀可沿一垂直於該第二軸線的第三軸線移動以切割該薄膜。The pressing device further includes a cutting device between the rolling device and the pressing device, the cutting device comprising all the blades, the cutter being movable along a third axis perpendicular to the second axis to cut the film .
該頂板具有一頂面,及一相反於該頂面的底面,該下壓合盤設置於該頂面,該桿體頂端連接該底面,該等導向軸承彼此相間隔排列。The top plate has a top surface, and a bottom surface opposite to the top surface, the lower pressing plate is disposed on the top surface, the top end of the rod body is connected to the bottom surface, and the guiding bearings are spaced apart from each other.
該固定座更包括一與該頂板相接合的底座體,該底座體與該頂板共同界定一容置空間,該下板及該驅動缸位於該容置空間內。The mounting base further includes a base body that engages with the top plate. The base body and the top plate together define an accommodating space, and the lower plate and the driving cylinder are located in the accommodating space.
該壓合架更包括一上板,該上壓合盤設置於該上板底端,各該滑動桿上下兩端分別連接於該上板與該下板。The press frame further includes an upper plate, and the upper press plate is disposed at the bottom end of the upper plate, and the upper and lower ends of each of the sliding bars are respectively connected to the upper plate and the lower plate.
本新型之功效在於:藉由滾壓裝置及壓合裝置的設計,能方便且迅速地將下薄膜及上薄膜貼覆在基板上並對基板進行兩道的壓平動作,藉此,使得基板的上表面及下表面能有較佳的平坦化效果,並且還能提升加工基板的速度及效率以提升產能。再者,藉由壓合裝置的下壓合盤、上壓合盤及驅動缸的結構設計,能有效降低驅動缸驅動壓合架下移至壓合位置所需施加的力量,並能節省能量的耗損。The utility model has the advantages that the design of the rolling device and the pressing device can conveniently and quickly attach the lower film and the upper film to the substrate and perform two flat pressing operations on the substrate, thereby making the substrate The upper surface and the lower surface can have a better planarization effect, and can also increase the speed and efficiency of processing the substrate to increase productivity. Furthermore, by the structural design of the lower pressing plate, the upper pressing plate and the driving cylinder of the pressing device, the force required to drive the pressing frame to the pressing position of the driving cylinder can be effectively reduced, and energy can be saved. Loss.
在本新型被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.
參閱圖1及圖2,是本新型具有壓合裝置的壓合設備的一實施例,壓合設備200主要是應用在一基板1的製程中,用以對基板1進行壓平加工處理。在本實施例中,基板1是以一多層化印刷電路基板為例作說明,其包括一板體11,及兩絕緣層12。板體11上、下表面分別形成有一由銅箔所構成並呈凹凸不平的電路圖案111,兩絕緣層12分別塗佈於板體11上、下表面,各絕緣層12為一例如為絕緣綠漆的絕緣材料,各絕緣層12塗佈於板體11後會隨對應的電路圖案111產生凹凸起伏的變化。下側絕緣層12具有一呈凹凸不平的下表面121,而上側絕緣層12具有一呈凹凸不平的上表面122。Referring to FIG. 1 and FIG. 2, an embodiment of a compression device having a press-fit device is mainly used in a process of a substrate 1 for performing a flattening process on the substrate 1. In the embodiment, the substrate 1 is exemplified by a multilayer printed circuit board, which comprises a plate body 11 and two insulating layers 12. A circuit pattern 111 composed of a copper foil and having an unevenness is formed on the upper and lower surfaces of the board body 11. The two insulating layers 12 are respectively coated on the upper surface and the lower surface of the board body 11, and each of the insulating layers 12 is, for example, an insulating green. In the insulating material of the lacquer, after the insulating layer 12 is applied to the board body 11, the unevenness of the undulations is generated along with the corresponding circuit pattern 111. The lower insulating layer 12 has a lower surface 121 which is uneven, and the upper insulating layer 12 has an uneven upper surface 122.
壓合設備200包括一輸送裝置2、一滾壓裝置3、一切割裝置4,及一壓合裝置5。輸送裝置2包含一入料前端21,及一出料後端22,輸送裝置2可沿一平行於一第一軸線X的輸送方向D1輸送基板1,以將基板1由入料前端21輸送至出料後端22。具體而言,本實施例的輸送裝置2包含一第一滾輪單元23、一位於第一滾輪單元23後端的第二滾輪單元24、一位於第二滾輪單元24後端的輸送單元25,及一運送單元26。第一滾輪單元23界定出入料前端21。運送單元26包括一上供應輥261、一上捲取輥262、多個上導引輥263、一下供應輥264、一下捲取輥265,及多個下導引輥266。上供應輥261及下供應輥264分別位於輸送單元25上下兩側,上捲取輥262及下捲取輥265分別位於上供應輥261及下供應輥264後側,該等上導引輥263位於上供應輥261及上捲取輥262之間,而該等下導引輥266位於下供應輥264及下捲取輥265之間。上供應輥261捲繞有一上運送膜267,上運送膜267捲繞在該等上導引輥263及上捲取輥262,透過馬達(圖未示)的帶動,使得上捲取輥262能捲取回收上運送膜267。下供應輥264捲繞有一下運送膜268,下運送膜268捲繞在該等下導引輥266及下捲取輥265,透過馬達(圖未示)的帶動,使得下捲取輥265能捲取回收下運送膜268,其中,下運送膜268界定出料後端22。本實施例的上運送膜267及下運送膜268的材質是以聚對苯二甲酸乙二酯(PET)為例。The pressing device 200 includes a conveying device 2, a rolling device 3, a cutting device 4, and a pressing device 5. The conveying device 2 comprises a feeding front end 21 and a discharge rear end 22, and the conveying device 2 can transport the substrate 1 along a conveying direction D1 parallel to a first axis X to convey the substrate 1 from the feeding front end 21 to Discharge rear end 22. Specifically, the transport device 2 of the present embodiment includes a first roller unit 23, a second roller unit 24 at the rear end of the first roller unit 23, a transport unit 25 at the rear end of the second roller unit 24, and a transport Unit 26. The first roller unit 23 defines a feed front end 21. The transport unit 26 includes an upper supply roller 261, an upper take-up roll 262, a plurality of upper guide rolls 263, a lower supply roll 264, a lower take-up roll 265, and a plurality of lower guide rolls 266. The upper supply roller 261 and the lower supply roller 264 are respectively located on the upper and lower sides of the transport unit 25, and the upper take-up roller 262 and the lower take-up roller 265 are respectively located at the rear sides of the upper supply roller 261 and the lower supply roller 264, and the upper guide roller 263 Located between the upper supply roller 261 and the upper take-up roller 262, and the lower guide roller 266 is located between the lower supply roller 264 and the lower take-up roller 265. The upper supply roller 261 is wound with an upper conveying film 267, and the upper conveying film 267 is wound around the upper guiding roller 263 and the upper winding roller 262, and is driven by a motor (not shown) so that the upper winding roller 262 can The upper transport film 267 is taken up and recovered. The lower supply roller 264 is wound with a lower conveyance film 268, and the lower conveyance film 268 is wound around the lower guide roller 266 and the lower take-up roller 265, and is driven by a motor (not shown) so that the lower take-up roller 265 can The transport film 268 is taken up and recovered, wherein the lower transport film 268 defines the discharge rear end 22. The material of the upper transport film 267 and the lower transport film 268 of the present embodiment is exemplified by polyethylene terephthalate (PET).
參閱圖1、圖2及圖3,滾壓裝置3設置於第一滾輪單元23與第二滾輪單元24之間且鄰近於入料前端21,滾壓裝置3包含一下側壓輥31、一位於下側壓輥31下方的下供應輥32、一位於下側壓輥31上方的上側壓輥33,及一位於上側壓輥33上方的上供應輥34。下供應輥32捲繞有一下薄膜35,下薄膜35同時捲繞在下側壓輥31上,下側壓輥31用以將下薄膜35滾壓至基板1的下表面121。藉此,下側壓輥31除了能透過下薄膜35對基板1的下側絕緣層12進行第一道的壓平動作外,還能將下薄膜35完整地貼覆在下表面121,以防止未硬化而呈黏稠狀的下側絕緣層12沾黏到下側壓輥31。上供應輥34捲繞有一上薄膜36,上薄膜36同時捲繞在上側壓輥33上,上側壓輥33用以將上薄膜36滾壓至基板1的上表面122。藉此,上側壓輥33除了能透過上薄膜36對基板1的上側絕緣層12進行第一道的壓平動作外,還能將上薄膜36完整地貼覆在上表面122,以防止未硬化而呈黏稠狀的上側絕緣層12沾黏到上側壓輥33。Referring to FIG. 1 , FIG. 2 and FIG. 3 , the rolling device 3 is disposed between the first roller unit 23 and the second roller unit 24 and adjacent to the feeding front end 21 , and the rolling device 3 includes a lower pressing roller 31 and a A lower supply roller 32 below the lower pressure roller 31, an upper pressure roller 33 located above the lower pressure roller 31, and an upper supply roller 34 above the upper pressure roller 33. The lower supply roller 32 is wound with a lower film 35 which is simultaneously wound around the lower side pressure roller 31, and the lower side pressure roller 31 is used to roll the lower film 35 to the lower surface 121 of the substrate 1. Thereby, the lower pressing roller 31 can perform the first flat pressing operation on the lower insulating layer 12 of the substrate 1 through the lower film 35, and can also completely cover the lower film 35 on the lower surface 121 to prevent the The hardened and viscous lower insulating layer 12 is adhered to the lower side pressure roller 31. The upper supply roller 34 is wound with an upper film 36 which is simultaneously wound around the upper side pressure roller 33 for pressing the upper film 36 to the upper surface 122 of the substrate 1. Thereby, the upper pressing roller 33 can perform the first flat pressing operation on the upper insulating layer 12 of the substrate 1 through the upper film 36, and can also completely cover the upper film 36 on the upper surface 122 to prevent unhardening. The viscous upper insulating layer 12 is adhered to the upper side pressure roller 33.
參閱圖1、圖4、圖5及圖6,壓合裝置5位於輸送單元25後端且鄰近出料後端22,壓合裝置5包含一固定座51、一壓合架52,及一驅動缸53。固定座51包括一底座體511、一設置於底座體511頂端的頂板512、多個設置於頂板512的導向軸承513,及一設置於頂板512頂端的下壓合盤514。頂板512具有一頂面515,及一相反於頂面515的底面516,頂板512透過例如螺栓鎖固方式鎖固於底座體511頂端,底座體511與頂板512共同界定一容置空間517。下壓合盤514設置於頂板512的頂面515,用以壓合於基板1的底側。該等導向軸承513彼此相間隔排列地設置於頂板512,各導向軸承513形成有一導孔518。Referring to FIG. 1 , FIG. 4 , FIG. 5 and FIG. 6 , the pressing device 5 is located at the rear end of the conveying unit 25 and adjacent to the discharging rear end 22 . The pressing device 5 includes a fixing base 51 , a pressing frame 52 , and a driving device. Cylinder 53. The fixing base 51 includes a base body 511, a top plate 512 disposed at the top end of the base body 511, a plurality of guide bearings 513 disposed on the top plate 512, and a lower pressing plate 514 disposed at the top end of the top plate 512. The top plate 512 has a top surface 515 and a bottom surface 516 opposite to the top surface 515. The top plate 512 is locked to the top end of the base body 511 by bolt locking. The base body 511 and the top plate 512 together define an accommodation space 517. The lower pressing plate 514 is disposed on the top surface 515 of the top plate 512 for pressing against the bottom side of the substrate 1. The guide bearings 513 are disposed at a distance from each other on the top plate 512, and each of the guide bearings 513 is formed with a guide hole 518.
壓合架52包括一下板521、一上板522、多個滑動桿523,及一上壓合盤524。下板521設置於容置空間517內且位於頂板512的底面516下方,下板521形成有一安裝孔525。上板522位於固定座51的頂板512上方,上壓合盤524設置於上板522底端且位於下壓合盤514上方,上壓合盤524用以壓合於基板1的頂側。該等滑動桿523分別穿設於該等導向軸承513的導孔518內,各滑動桿523上下兩端分別固定地連接於上板522與下板521,各滑動桿523上下兩端分別透過例如螺栓鎖固的方式鎖固於上板522與下板521。該等滑動桿523可沿一垂直於第一軸線X的第二軸線Z相對於固定座51上下移動。固定座51透過導向軸承513與滑動桿523相配合的設計方式,除了能導引並限制滑動桿523上下移動的方向以外,還能降低滑動桿523上下移動時的摩擦力,藉此,使得滑動桿523能順暢地相對於固定座51上下移動。The press frame 52 includes a lower plate 521, an upper plate 522, a plurality of sliding bars 523, and an upper pressing plate 524. The lower plate 521 is disposed in the accommodating space 517 and is located below the bottom surface 516 of the top plate 512. The lower plate 521 is formed with a mounting hole 525. The upper plate 522 is located above the top plate 512 of the fixing base 51. The upper pressing plate 524 is disposed at the bottom end of the upper plate 522 and above the lower pressing plate 514. The upper pressing plate 524 is pressed against the top side of the substrate 1. The sliding rods 523 are respectively disposed in the guide holes 518 of the guide bearings 513. The upper and lower ends of the sliding rods 523 are fixedly connected to the upper plate 522 and the lower plate 521, respectively. The upper plate 522 and the lower plate 521 are locked in a bolt locking manner. The sliding rods 523 are movable up and down relative to the fixed seat 51 along a second axis Z perpendicular to the first axis X. The design of the fixing base 51 through the guide bearing 513 and the sliding rod 523 can not only guide and limit the direction in which the sliding rod 523 moves up and down, but also reduce the frictional force when the sliding rod 523 moves up and down, thereby making the sliding The rod 523 can smoothly move up and down with respect to the fixed seat 51.
參閱圖1、圖2及圖4,運送單元26的上運送膜267及下運送膜268呈相互平行地穿設於固定座51的下壓合盤514與壓合架52的上壓合盤524之間,下運送膜268及上運送膜267用以輸送基板1至下壓合盤514與上壓合盤524之間,藉此,使得上壓合盤524及下壓合盤514能分別壓合於基板1上下兩側。Referring to FIG. 1 , FIG. 2 and FIG. 4 , the upper transport film 267 and the lower transport film 268 of the transport unit 26 are disposed in parallel with the lower press plate 514 of the fixed seat 51 and the upper press plate 524 of the press frame 52 . Between the lower transport film 268 and the upper transport film 267, the substrate 1 is transported between the lower press pad 514 and the upper press plate 524, whereby the upper press plate 524 and the lower press plate 514 can be pressed separately. Combined with the upper and lower sides of the substrate 1.
本實施例的驅動缸53為一設置於容置空間517內的油壓缸,其包括一設置於下板521的缸體531,及一穿設於缸體531內的桿體532。缸體531穿設於下板521的安裝孔525內,且缸體531透過例如螺栓鎖固的方式鎖固於下板521。桿體532凸伸出缸體531頂端,桿體532頂端透過例如螺栓鎖固的方式鎖固於頂板512的底面516。驅動缸53用以驅動壓合架52在一初始位置(如圖4所示),及一壓合位置(如圖11所示)之間往復移動,當壓合架52位在初始位置時,上壓合盤524間隔位於下壓合盤514及上運送膜267上方,藉此,使得下運送膜268及上運送膜267能將基板1輸送至下壓合盤514與上壓合盤524之間。當壓合架52位在壓合位置時,上壓合盤524透過上運送膜267壓合於基板1上側的上薄膜36(如圖3所示),而下壓合盤514透過下運送膜268壓合於基板1下側的下薄膜35(如圖3所示),藉此,上壓合盤524能與下壓合盤514相配合而對基板1上、下側的絕緣層12進行第二道的壓平動作。藉由固定座51的容置空間517設計,除了提供下板521與驅動缸53容置的空間以外,還能提供驅動缸53帶動壓合架52下移時所需的移動空間。The driving cylinder 53 of the present embodiment is a hydraulic cylinder disposed in the accommodating space 517, and includes a cylinder 531 disposed on the lower plate 521 and a rod 532 disposed in the cylinder 531. The cylinder 531 is bored in the mounting hole 525 of the lower plate 521, and the cylinder 531 is locked to the lower plate 521 by, for example, bolt locking. The rod body 532 protrudes from the top end of the cylinder block 531, and the top end of the rod body 532 is locked to the bottom surface 516 of the top plate 512 by, for example, bolt locking. The driving cylinder 53 is configured to drive the press frame 52 to reciprocate between an initial position (as shown in FIG. 4) and a pressing position (shown in FIG. 11). When the press frame 52 is in the initial position, The upper pressing plate 524 is spaced above the lower pressing plate 514 and the upper conveying film 267, whereby the lower conveying film 268 and the upper conveying film 267 can convey the substrate 1 to the lower pressing plate 514 and the upper pressing plate 524. between. When the press frame 52 is in the pressing position, the upper press plate 524 is pressed against the upper film 36 on the upper side of the substrate 1 through the upper transfer film 267 (as shown in FIG. 3), and the lower press plate 514 is passed through the lower transfer film. 268 is pressed against the lower film 35 on the lower side of the substrate 1 (as shown in FIG. 3), whereby the upper pressing plate 524 can be engaged with the lower pressing plate 514 to perform the insulating layer 12 on the upper and lower sides of the substrate 1. The second level of flattening action. By the design of the accommodating space 517 of the fixing base 51, in addition to the space in which the lower plate 521 and the driving cylinder 53 are accommodated, the moving space required for the driving cylinder 53 to move the pressing frame 52 downward can be provided.
以下將針對壓合設備200的作動方式進行詳細說明:The following describes in detail how the pressing device 200 operates:
參閱圖1及圖7,首先,將基板1經由入料前端21放置於第一滾輪單元23,第一滾輪單元23會沿輸送方向D1輸送基板1朝後移動。由於下側壓輥31沿一第一旋轉方向R1帶動下薄膜35旋轉,而上側壓輥33沿一相反於第一旋轉方向R1的第二旋轉方向R2帶動上薄膜36旋轉,因此,當基板1沿輸送方向D1通過下側壓輥31及上側壓輥33之間時,下側壓輥31會逐漸地將下薄膜35滾壓至基板1的下表面121,而上側壓輥33則會逐漸地將上薄膜36滾壓至基板1的上表面122。Referring to FIGS. 1 and 7, first, the substrate 1 is placed on the first roller unit 23 via the feed end 21, and the first roller unit 23 transports the substrate 1 rearward in the transport direction D1. Since the lower pressing roller 31 drives the lower film 35 to rotate in a first rotation direction R1, the upper pressing roller 33 rotates the upper film 36 in a second rotation direction R2 opposite to the first rotation direction R1. Therefore, when the substrate 1 is rotated When passing between the lower pressing roller 31 and the upper pressing roller 33 in the conveying direction D1, the lower pressing roller 31 gradually presses the lower film 35 to the lower surface 121 of the substrate 1, and the upper pressing roller 33 gradually The upper film 36 is rolled onto the upper surface 122 of the substrate 1.
下側壓輥31將下薄膜35滾壓至下表面121的過程中會同時透過下薄膜35施加壓力於下表面121,藉此,除了使下薄膜35能平整地貼覆在下表面121以防止兩者之間形成空隙以外,還能同時透過下薄膜35對下側絕緣層12進行第一道的壓平動作。此外,上側壓輥33將上薄膜36滾壓至上表面122的過程中會同時透過上薄膜36施加壓力於上表面122,藉此,除了使上薄膜36能平整地貼覆在上表面122以防止兩者之間形成空隙以外,還能同時透過上薄膜36對上側絕緣層12進行第一道的壓平動作。藉由前述滾壓裝置3的操作方式,能防止下薄膜35及上薄膜36在貼覆過程中產生皺摺,並能提升下薄膜35及上薄膜36貼覆的速度及效率。待基板1移動到第二滾輪單元24上並且移離下側壓輥31及上側壓輥33後,滾壓裝置3即完成對基板1的兩絕緣層12的第一道壓平作業。The lower side pressing roller 31 presses the lower film 35 to the lower surface 121 while applying pressure to the lower surface 121 through the lower film 35, whereby the lower film 35 can be evenly attached to the lower surface 121 to prevent the lower film In addition to the formation of voids between the two, the lower insulating layer 12 can be simultaneously subjected to the first flattening operation through the lower film 35. In addition, the upper side press roller 33 presses the upper film 36 to the upper surface 122 while applying pressure to the upper surface 122 through the upper film 36, thereby preventing the upper film 36 from being flatly attached to the upper surface 122 to prevent In addition to forming a gap between the two, the upper insulating film 12 can be simultaneously subjected to the first flattening operation through the upper film 36. By the operation of the rolling device 3, it is possible to prevent the lower film 35 and the upper film 36 from wrinkles during the attaching process, and to improve the speed and efficiency of the lower film 35 and the upper film 36. After the substrate 1 is moved onto the second roller unit 24 and moved away from the lower pressing roller 31 and the upper pressing roller 33, the rolling device 3 completes the first flattening operation of the two insulating layers 12 of the substrate 1.
參閱圖1、圖7、圖8及圖9,切割裝置4位於滾壓裝置3與壓合裝置5之間且鄰近於滾壓裝置3後側,切割裝置4包含一位於下側壓輥31後側的導引桿41,及一位於上側壓輥33後側的切刀42。導引桿41呈長形並形成一開口朝上的導槽411,導槽411沿一垂直於第二軸線Z的第三軸線Y延伸,導槽411用以供切刀42穿設並導引其移動方向。當第二滾輪單元24帶動基板1移動到一鄰近於切割裝置4前端的待裁切位置(如圖8所示)時,第二滾輪單元24停止帶動基板1沿輸送方向D1移動,此時,基板1的一後端緣13與切割裝置4相間隔一適當距離。接著,導引桿41會沿第二軸線Z上移至鄰近於下薄膜35底面的位置,隨後,切刀42會由圖8所示的一第一位置沿著一平行於第三軸線Y的第一裁切方向D2移動至圖9所示的一第二位置,以將上、下薄膜36、35鄰近於基板1的後端緣13處切斷。Referring to Figures 1, 7, 8, and 9, the cutting device 4 is located between the rolling device 3 and the pressing device 5 and adjacent to the rear side of the rolling device 3, and the cutting device 4 includes a lower pressing roller 31. The side guide rod 41 and a cutter 42 on the rear side of the upper side pressure roller 33. The guide rod 41 has an elongated shape and defines an opening-facing guide groove 411. The guide groove 411 extends along a third axis Y perpendicular to the second axis Z. The guide groove 411 is used for the cutter 42 to be inserted and guided. Its direction of movement. When the second roller unit 24 drives the substrate 1 to move to a position to be cut adjacent to the front end of the cutting device 4 (as shown in FIG. 8 ), the second roller unit 24 stops driving the substrate 1 to move along the conveying direction D1. A rear end edge 13 of the substrate 1 is spaced apart from the cutting device 4 by an appropriate distance. Then, the guiding rod 41 is moved along the second axis Z to a position adjacent to the bottom surface of the lower film 35, and then the cutter 42 is followed by a first position shown in FIG. 8 along a direction parallel to the third axis Y. The first cutting direction D2 is moved to a second position shown in FIG. 9 to cut the upper and lower films 36, 35 adjacent to the rear end edge 13 of the substrate 1.
參閱圖7、圖9及圖10,之後,第二滾輪單元24會繼續帶動基板1沿輸送方向D1移動,當第二滾輪單元24帶動基板1移動到一鄰近於切割裝置4後端的另一待裁切位置(如圖10所示)時,第二滾輪單元24停止帶動基板1沿輸送方向D1移動,此時,基板1的一前端緣14與切割裝置4相間隔一適當距離。接著,切刀42會由圖9所示的第二位置沿著一相反於第一裁切方向D2的第二裁切方向D3移動至圖10所示的第一位置,以將上、下薄膜36、35鄰近於基板1的前端緣14處切斷。此時,下薄膜35被裁切成一貼覆於下表面121的下膜片351,而上薄膜36被裁切成一貼覆於上表面122的上膜片361,下膜片351、上膜片361及基板1共同構成一基材10。Referring to FIG. 7 , FIG. 9 and FIG. 10 , after that, the second roller unit 24 will continue to drive the substrate 1 to move along the conveying direction D1 , and when the second roller unit 24 drives the substrate 1 to move to another adjacent to the rear end of the cutting device 4 . When the cutting position (as shown in FIG. 10), the second roller unit 24 stops moving the substrate 1 in the conveying direction D1. At this time, a front end edge 14 of the substrate 1 is spaced apart from the cutting device 4 by an appropriate distance. Next, the cutter 42 is moved from the second position shown in FIG. 9 along a second cutting direction D3 opposite to the first cutting direction D2 to the first position shown in FIG. 10 to apply the upper and lower films. 36, 35 are cut adjacent to the front end edge 14 of the substrate 1. At this time, the lower film 35 is cut into a lower film 351 which is attached to the lower surface 121, and the upper film 36 is cut into an upper film 361 which is attached to the upper surface 122, and the lower film 351 and the upper film The diaphragm 361 and the substrate 1 together constitute a substrate 10.
參閱圖1及圖4,待切割裝置4裁切完成後,第二滾輪單元24及輸送單元25會依序帶動基材10沿輸送方向D1移動,以將基材10輸送至下運送膜268與上運送膜267之間。接著,下運送膜268與上運送膜267帶動基材10沿輸送方向D1移動至圖4所示的位置後,下運送膜268與上運送膜267便停止帶動基材10移動,使基材10定位在一對齊於下壓合盤514及上壓合盤524的待壓合位置(如圖4所示)。Referring to FIG. 1 and FIG. 4, after the cutting device 4 is cut, the second roller unit 24 and the conveying unit 25 sequentially drive the substrate 10 to move along the conveying direction D1 to transport the substrate 10 to the lower conveying film 268. The upper film 267 is transported. Next, after the lower transport film 268 and the upper transport film 267 move the substrate 10 to the position shown in FIG. 4 in the transport direction D1, the lower transport film 268 and the upper transport film 267 stop the substrate 10 from moving, so that the substrate 10 is moved. Positioned in a position to be pressed (as shown in FIG. 4) aligned with the lower press plate 514 and the upper press plate 524.
參閱圖11及圖12,隨後,壓合裝置5的驅動缸53會施加一朝上的作用力F1驅使桿體532向上移動,由於桿體532頂端固定地連接於固定座51的頂板512的底面516,因此,缸體531會受到一與作用力F1大小相等但方向相反的反作用力F2作用,使缸體531帶動壓合架52沿一平行於第二軸線Z的下移方向D4向下移動。此外,由於壓合架52的各滑動桿523是與對應的導向軸承513滑動地連接在一起,因此,壓合架52會因自身重量而產生一下壓力F3。透過前述反作用力F2及下壓力F3的作用,壓合架52會沿下移方向D4移動至圖11所示的壓合位置。Referring to Figures 11 and 12, the driving cylinder 53 of the pressing device 5 applies an upward force F1 to urge the rod body 532 to move upward, since the top end of the rod body 532 is fixedly coupled to the bottom surface of the top plate 512 of the fixing base 51. 516, therefore, the cylinder 531 is subjected to a reaction force F2 of equal magnitude but opposite direction to the force F1, so that the cylinder 531 drives the press frame 52 to move downward along a downward movement direction D4 parallel to the second axis Z. . Further, since the respective sliding bars 523 of the press frame 52 are slidably coupled to the corresponding guide bearings 513, the press frame 52 generates a downward pressure F3 due to its own weight. Through the action of the aforementioned reaction force F2 and the downward pressure F3, the press frame 52 is moved in the downward movement direction D4 to the pressing position shown in FIG.
當壓合架52下移至壓合位置時,上壓合盤524所施加的下壓力及其產生的熱量會透過上運送膜267及上膜片361傳遞至基板1的上側絕緣層12,以對上側絕緣層12同時進行加熱及加壓的動作,藉此,上側絕緣層12能緊密地附著於板體11上表面的電路圖案111上,使上側絕緣層12與電路圖案111之間不會殘存氣泡或空隙。並且,上壓合盤524會透過上運送膜267及上膜片361壓平上側絕緣層12,使上側絕緣層12的上表面122呈平坦狀。同時,下壓合盤514所施加的上壓力及其產生的熱量會透過下運送膜268及下膜片351傳遞至基板1的下側絕緣層12,以對下側絕緣層12同時進行加熱及加壓的動作,藉此,下側絕緣層12能緊密地附著於板體11下表面的電路圖案111上,使下側絕緣層12與電路圖案111之間不會殘存氣泡或空隙。並且,下壓合盤514會透過下運送膜268及下膜片351壓平下側絕緣層12,使下側絕緣層12的下表面121呈平坦狀。When the press frame 52 is moved down to the pressing position, the downward pressure applied by the upper pressing plate 524 and the heat generated by the upper pressing plate 524 are transmitted to the upper insulating layer 12 of the substrate 1 through the upper conveying film 267 and the upper diaphragm 361. The upper insulating layer 12 is simultaneously heated and pressurized, whereby the upper insulating layer 12 can be closely adhered to the circuit pattern 111 on the upper surface of the board body 11 so that the upper insulating layer 12 and the circuit pattern 111 are not interposed. Remaining bubbles or voids. Further, the upper pressing plate 524 flattens the upper insulating layer 12 through the upper conveying film 267 and the upper diaphragm 361, so that the upper surface 122 of the upper insulating layer 12 is flat. At the same time, the upper pressure applied by the lower pressing plate 514 and the heat generated by the lower pressing plate 514 are transmitted to the lower insulating layer 12 of the substrate 1 through the lower conveying film 268 and the lower diaphragm 351 to simultaneously heat the lower insulating layer 12 and By the pressurizing operation, the lower insulating layer 12 can be closely adhered to the circuit pattern 111 on the lower surface of the plate body 11, so that no air bubbles or voids remain between the lower insulating layer 12 and the circuit pattern 111. Further, the lower pressing plate 514 flattens the lower insulating layer 12 through the lower conveying film 268 and the lower diaphragm 351, so that the lower surface 121 of the lower insulating layer 12 is flat.
由於上壓合盤524與下壓合盤514對基板1所施加的壓力大於上側壓輥33與下側壓輥31對基板1所施加的壓力,因此,藉由上壓合盤524能與下壓合盤514分別對兩絕緣層12進行第二道的壓平動作,能更進一步地提升壓平的效果,使上表面122及下表面121平坦化的效果較佳。此外,本實施例的下壓合盤514為一固定不動的固定件,上壓合盤524為一可相對於下壓合盤514上下移動的活動件,而驅動缸53的缸體531及桿體532分別固定地連接於下板521及頂板512,藉由前述結構設計,驅動缸53所施加的作用力F1不需太大,便能透過反作用力F2的作用以及下壓力F3的輔助作用帶動壓合架52下移至壓合位置,藉此,能有效降低驅動缸53所需施加的作用力F1。Since the upper pressing plate 524 and the lower pressing plate 514 exert a greater pressure on the substrate 1 than the upper pressing roller 33 and the lower pressing roller 31 apply to the substrate 1, the upper pressing plate 524 can be pressed down. The pressing plate 514 performs a second flattening operation on the two insulating layers 12, which can further enhance the effect of flattening, and the effect of flattening the upper surface 122 and the lower surface 121 is better. In addition, the lower pressing plate 514 of the present embodiment is a fixed fixing member, and the upper pressing plate 524 is a movable member movable up and down with respect to the lower pressing plate 514, and the cylinder 531 and the rod of the driving cylinder 53 are driven. The body 532 is fixedly connected to the lower plate 521 and the top plate 512 respectively. With the foregoing structural design, the force F1 applied by the driving cylinder 53 does not need to be too large, and can be driven by the action of the reaction force F2 and the auxiliary action of the downforce F3. The press frame 52 is moved down to the pressing position, whereby the force F1 to be applied to the drive cylinder 53 can be effectively reduced.
參閱圖1、圖11及圖13,待壓合裝置5完成基板1的第二道壓平動作後,驅動缸53的缸體531會對桿體532施加一朝下的作用力F1’,由於桿體532頂端固定地連接於固定座51的頂板512的底面516,因此,缸體531會受到一與作用力F1’大小相等但方向相反的反作用力F2’作用,使缸體531帶動壓合架52沿一相反於下移方向D4的上移方向D5移動並復位至圖13所示的初始位置。隨後,下運送膜268與上運送膜267會帶動基材10沿輸送方向D1移動使基材10移離壓合裝置5。最後,下運送膜268會帶動基材10沿輸送方向D1移動,基材10朝出料後端22移動的過程中,至少一個上冷卻風扇61會對基材10上側進行冷卻,以及至少一個下冷風扇62會對基材10下側進行冷卻,待基材10通過上冷卻風扇61及下冷風扇62後便能由出料後端22出料。Referring to FIG. 1, FIG. 11 and FIG. 13, after the second pressing operation of the substrate 1 is completed by the pressing device 5, the cylinder 531 of the driving cylinder 53 applies a downward force F1' to the rod 532 due to the downward force F1'. The top end of the rod 532 is fixedly connected to the bottom surface 516 of the top plate 512 of the fixing base 51. Therefore, the cylinder 531 is subjected to a reaction force F2' which is equal in magnitude but opposite in direction to the force F1', so that the cylinder 531 drives the pressing. The frame 52 is moved in an upward movement direction D5 opposite to the downward movement direction D4 and reset to the initial position shown in FIG. Subsequently, the lower transport film 268 and the upper transport film 267 move the substrate 10 in the transport direction D1 to move the substrate 10 away from the press device 5. Finally, the lower transport film 268 moves the substrate 10 in the transport direction D1, and during the movement of the substrate 10 toward the discharge rear end 22, at least one upper cooling fan 61 cools the upper side of the substrate 10, and at least one lower The cooling fan 62 cools the lower side of the substrate 10, and the substrate 10 can be discharged from the discharge rear end 22 after passing through the upper cooling fan 61 and the lower cooling fan 62.
參閱圖1、圖2及圖3,需說明的是,本實施例的壓合設備200的輸送裝置2是一片緊接著一片地沿著輸送方向D1輸送基板1移動,以使滾壓裝置3及壓合裝置5能夠逐一地對基板1進行壓合的作業。由於各基板1的輸送及壓合流程皆相同,因此,本實施例只針對一片基板1的輸送及壓合流程進行說明,其餘基板1的輸送及壓合流程則省略不予贅述。此外,隨著基板1的設計形式不同,滾壓裝置3的設計形式也會隨之變化,例如當基板1只有在板體11上表面形成電路圖案111並塗佈絕緣層12時,則滾壓裝置3可透過上側壓輥33將上薄膜36壓合於基板1的上表面122,且滾壓裝置3的結構能省略下供應輥32;例如當基板1只有在板體11下表面形成電路圖案111並塗佈有絕緣層12時,則滾壓裝置3可透過下側壓輥31將下薄膜35壓合於基板1的下表面121,且滾壓裝置3的結構能省略上供應輥34。本實施例的壓合設備200同樣能對前述兩種不同設計形式的基板1進行壓合作業,不以本實施例所揭露的基板1的形式為限。Referring to FIG. 1 , FIG. 2 and FIG. 3 , it should be noted that the conveying device 2 of the pressing device 200 of the present embodiment moves the substrate 1 along the conveying direction D1 one after another, so that the rolling device 3 and The press-fit device 5 can perform the work of pressing the substrate 1 one by one. Since the transporting and pressing processes of the respective substrates 1 are the same, the present embodiment only describes the transport and pressing process of one substrate 1. The transport and pressing processes of the remaining substrates 1 are omitted and will not be described. In addition, as the design form of the substrate 1 is different, the design form of the rolling device 3 also changes. For example, when the substrate 1 is formed only on the upper surface of the plate body 11 and the insulating layer 12 is coated, the rolling is performed. The device 3 can press the upper film 36 to the upper surface 122 of the substrate 1 through the upper pressing roller 33, and the structure of the rolling device 3 can omit the lower supply roller 32; for example, when the substrate 1 has only a circuit pattern formed on the lower surface of the plate body 11, When the insulating layer 12 is applied to the 111, the rolling device 3 can press the lower film 35 to the lower surface 121 of the substrate 1 through the lower pressing roller 31, and the structure of the rolling device 3 can omit the upper supply roller 34. The press-fit device 200 of the present embodiment can also perform the press cooperation on the substrate 1 of the two different designs, which is not limited to the form of the substrate 1 disclosed in this embodiment.
綜上所述,本實施例的壓合設備200,藉由滾壓裝置3及壓合裝置5的設計,能方便且迅速地將下薄膜35及上薄膜36貼覆在基板1上並對基板1進行兩道的壓平動作,藉此,使得基板1的上表面122及下表面121能有較佳的平坦化效果,並且還能提升加工基板1的速度及效率以提升產能。再者,藉由壓合裝置5的下壓合盤514、上壓合盤524及驅動缸53的結構設計,能有效降低驅動缸53驅動壓合架52下移至壓合位置所需施加的力量,並能節省能量的耗損,故確實能達成本新型之目的。In summary, the pressing device 3 of the present embodiment can easily and quickly attach the lower film 35 and the upper film 36 to the substrate 1 and the substrate by the design of the rolling device 3 and the pressing device 5. 1 The two flattening operations are performed, whereby the upper surface 122 and the lower surface 121 of the substrate 1 can have a better flattening effect, and the speed and efficiency of the processed substrate 1 can be improved to increase the productivity. Moreover, by the structural design of the lower pressing plate 514, the upper pressing plate 524 and the driving cylinder 53 of the pressing device 5, the driving cylinder 53 can be effectively reduced in driving the pressing frame 52 to be moved to the pressing position. Power, and can save energy consumption, so it can achieve the purpose of this new type.
惟以上所述者,僅為本新型之實施例而已,當不能以此限定本新型實施之範圍,凡是依本新型申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本新型專利涵蓋之範圍內。However, the above is only the embodiment of the present invention, and when it is not possible to limit the scope of the present invention, all the simple equivalent changes and modifications according to the scope of the patent application and the contents of the patent specification are still This new patent covers the scope.
1‧‧‧基板
10‧‧‧基材
11‧‧‧板體
111‧‧‧電路圖案
12‧‧‧絕緣層
121‧‧‧下表面
122‧‧‧上表面
13‧‧‧後端緣
14‧‧‧前端緣
200‧‧‧壓合設備
2‧‧‧輸送裝置
21‧‧‧入料前端
22‧‧‧出料後端
23‧‧‧第一滾輪單元
24‧‧‧第二滾輪單元
25‧‧‧輸送單元
26‧‧‧運送單元
261‧‧‧上供應輥
262‧‧‧上捲取輥
263‧‧‧上導引輥
264‧‧‧下供應輥
265‧‧‧下捲取輥
266‧‧‧下導引輥
267‧‧‧上運送膜
268‧‧‧下運送膜
3‧‧‧滾壓裝置
31‧‧‧下側壓輥
32‧‧‧下供應輥
33‧‧‧上側壓輥
34‧‧‧上供應輥
35‧‧‧下薄膜
36‧‧‧上薄膜
4‧‧‧切割裝置
41‧‧‧導引桿
411‧‧‧導槽
42‧‧‧切刀
5‧‧‧壓合裝置
51‧‧‧固定座
511‧‧‧底座體
512‧‧‧頂板
513‧‧‧導向軸承
514‧‧‧下壓合盤
515‧‧‧頂面
516‧‧‧底面
517‧‧‧容置空間
518‧‧‧導孔
52‧‧‧壓合架
521‧‧‧下板
522‧‧‧上板
523‧‧‧滑動桿
524‧‧‧上壓合盤
525‧‧‧安裝孔
53‧‧‧驅動缸
531‧‧‧缸體
532‧‧‧桿體
61‧‧‧上冷卻風扇
62‧‧‧下冷卻風扇
D1‧‧‧輸送方向
D2‧‧‧第一裁切方向
D3‧‧‧第二裁切方向
D4‧‧‧下移方向
D5‧‧‧上移方向
R1‧‧‧第一旋轉方向
R2‧‧‧第二旋轉方向
F1、F1’‧‧‧作用力
F2、F2’‧‧‧反作用力
F3‧‧‧下壓力
X‧‧‧第一軸線
Z‧‧‧第二軸線
Y‧‧‧第三軸線
1‧‧‧Substrate
10‧‧‧Substrate
11‧‧‧ board
111‧‧‧ circuit pattern
12‧‧‧Insulation
121‧‧‧lower surface
122‧‧‧ upper surface
13‧‧‧ rear edge
14‧‧‧ front edge
200‧‧‧Compression equipment
2‧‧‧Conveyor
21‧‧‧Input front end
22‧‧‧Delivery backend
23‧‧‧First roller unit
24‧‧‧Second roller unit
25‧‧‧Transporting unit
26‧‧‧Transportation unit
261‧‧‧Upper supply roller
262‧‧‧Up roll
263‧‧‧Upper guide roller
264‧‧‧ supply roller
265‧‧‧Unwinding roll
266‧‧‧ lower guide roller
267‧‧‧Upper film
Transport film under 268‧‧
3‧‧‧Rolling device
31‧‧‧Bottom pressure roller
32‧‧‧ supply roller
33‧‧‧Upper pressure roller
34‧‧‧Upper supply roller
35‧‧‧ under film
36‧‧‧Upper film
4‧‧‧ Cutting device
41‧‧‧ Guide rod
411‧‧‧ Guide slot
42‧‧‧Cutter
5‧‧‧ Pressing device
51‧‧‧ fixed seat
511‧‧‧Base body
512‧‧‧ top board
513‧‧‧guide bearing
514‧‧‧ Lower compression plate
515‧‧‧ top surface
516‧‧‧ bottom
517‧‧‧ accommodating space
518‧‧‧ Guide hole
52‧‧‧ Pressing frame
521‧‧‧ Lower board
522‧‧‧Upper board
523‧‧‧Sliding rod
524‧‧‧Upper pressure plate
525‧‧‧ mounting holes
53‧‧‧ drive cylinder
531‧‧‧Cylinder
532‧‧‧ rod body
61‧‧‧Upper cooling fan
62‧‧‧Under cooling fan
D1‧‧‧ conveying direction
D2‧‧‧First cutting direction
D3‧‧‧Second cutting direction
D4‧‧‧Down direction
D5‧‧‧Upward direction
R1‧‧‧first direction of rotation
R2‧‧‧second direction of rotation
F1, F1'‧‧‧ force
F2, F2'‧‧‧ reaction force
F3‧‧‧down pressure
X‧‧‧first axis
Z‧‧‧second axis
Y‧‧‧ third axis
本新型之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中: 圖1是本新型具有壓合裝置的壓合設備的一實施例的側視示意圖; 圖2是該實施例所欲加工的基板的側視圖; 圖3是該實施例的滾壓裝置的側視示意圖; 圖4是該實施例的壓合裝置的側視示意圖,說明壓合架位在初始位置; 圖5是沿圖4中的I-I線所截取的剖視圖; 圖6是沿圖4中的II-II線所截取的剖視圖; 圖7是圖1的局部放大圖,說明滾壓裝置將下薄膜及上薄膜分別滾壓至基板的下表面及上表面; 圖8是該實施例的局部俯視示意圖,說明切刀位於第一位置; 圖9是該實施例的局部俯視示意圖,說明切刀位於第二位置; 圖10是該實施例的局部俯視示意圖,說明切刀復位至第一位置; 圖11是該實施例的壓合裝置的側視示意圖,說明壓合架位在壓合位置; 圖12是圖11的局部放大圖,說明下壓合盤與上壓合盤壓合基材;及 圖13是該實施例的壓合裝置的側視示意圖,說明壓合架復位至初始位置。Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: Figure 1 is a side elevational view of an embodiment of a compression device having a compression device of the present invention; 3 is a side view of the substrate to be processed; FIG. 3 is a side view of the rolling device of the embodiment; FIG. 4 is a side view of the pressing device of the embodiment, illustrating the press frame in the initial position; Figure 5 is a cross-sectional view taken along line II-I of Figure 4; Figure 6 is a cross-sectional view taken along line II-II of Figure 4; Figure 7 is a partial enlarged view of Figure 1 illustrating the rolling device The film and the upper film are respectively rolled onto the lower surface and the upper surface of the substrate; FIG. 8 is a partial top plan view of the embodiment, illustrating the cutter in a first position; FIG. 9 is a partial top view of the embodiment, illustrating the cutter is located Figure 10 is a partial top plan view of the embodiment, illustrating the cutting tool reset to the first position; Figure 11 is a side elevational view of the press-fit device of the embodiment, illustrating the press-fit position in the press-fit position; 12 is a partial enlarged view of FIG. 11, saying The pressing plate and the pressing plate pressing a substrate; and FIG. 13 is a schematic side view of the pressing device according to this embodiment, description nip carrier returned to the initial position.
10‧‧‧基材 10‧‧‧Substrate
267‧‧‧上運送膜 267‧‧‧Upper film
268‧‧‧下運送膜 Transport film under 268‧‧
5‧‧‧壓合裝置 5‧‧‧ Pressing device
51‧‧‧固定座 51‧‧‧ fixed seat
511‧‧‧底座體 511‧‧‧Base body
512‧‧‧頂板 512‧‧‧ top board
513‧‧‧導向軸承 513‧‧‧guide bearing
514‧‧‧下壓合盤 514‧‧‧ Lower compression plate
515‧‧‧頂面 515‧‧‧ top surface
516‧‧‧底面 516‧‧‧ bottom
517‧‧‧容置空間 517‧‧‧ accommodating space
52‧‧‧壓合架 52‧‧‧ Pressing frame
521‧‧‧下板 521‧‧‧ Lower board
522‧‧‧上板 522‧‧‧Upper board
523‧‧‧滑動桿 523‧‧‧Sliding rod
524‧‧‧上壓合盤 524‧‧‧Upper pressure plate
525‧‧‧安裝孔 525‧‧‧ mounting holes
53‧‧‧驅動缸 53‧‧‧ drive cylinder
531‧‧‧缸體 531‧‧‧Cylinder
532‧‧‧桿體 532‧‧‧ rod body
X‧‧‧第一軸線 X‧‧‧first axis
Z‧‧‧第二軸線 Z‧‧‧second axis
Claims (15)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW105205108U TWM525845U (en) | 2016-04-13 | 2016-04-13 | Pressing device and pressing apparatus having the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW105205108U TWM525845U (en) | 2016-04-13 | 2016-04-13 | Pressing device and pressing apparatus having the same |
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TWM525845U true TWM525845U (en) | 2016-07-21 |
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TW105205108U TWM525845U (en) | 2016-04-13 | 2016-04-13 | Pressing device and pressing apparatus having the same |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114953064A (en) * | 2022-04-29 | 2022-08-30 | 烟台博海木工机械有限公司 | Auxiliary pressing mechanism of staggered laminated plate pressing machine, pressing machine and pressing method of pressing machine |
-
2016
- 2016-04-13 TW TW105205108U patent/TWM525845U/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114953064A (en) * | 2022-04-29 | 2022-08-30 | 烟台博海木工机械有限公司 | Auxiliary pressing mechanism of staggered laminated plate pressing machine, pressing machine and pressing method of pressing machine |
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