TWM522954U

TWM522954U - Electrical deposition apparatus

Info

Publication number: TWM522954U
Application number: TW104219438U
Authority: TW
Inventors: 呂春福; 周雅靜; 劉力維; 陳興華
Original assignee: 財團法人工業技術研究院
Priority date: 2015-12-03
Filing date: 2015-12-03
Publication date: 2016-06-01
Also published as: US20170159196A1

Abstract

An electrical deposition apparatus includes a brush plating head. The brush plating head includes a plurality of channels, and each of the channels at a same side of the brush plating electrode has an opening. Electroplating solution may be temporarily kept in the channels of the brush plating head, and thus it may supply for the to-be-plated workpiece timely.

Description

電沉積設備Electrodeposition equipment

本新型創作是有關於一種沉積設備，且特別是有關於一種電沉積設備。The present invention relates to a deposition apparatus, and more particularly to an electrodeposition apparatus.

在電沉積製程中，當工件尺寸長達數十米時，不易建置巨型電鍍處理槽以進行電沉積。因此，需要以3D鍍著成型的方法沉積金屬，而所謂3D鍍著成型的方式，具體而言就是屬於電沉積製程中的刷鍍。In the electrodeposition process, when the workpiece size is as long as several tens of meters, it is not easy to build a giant plating treatment tank for electrodeposition. Therefore, it is necessary to deposit metal by a 3D plating method, and the so-called 3D plating forming method is specifically a brush plating in an electrodeposition process.

應用刷鍍進行電沉積時，某些金屬（例如鉻）的沉積效率不高，不易還原析出並有離子化的傾向。為解決上述問題，電沉積過程中需要使用高電流密度。然而，刷鍍設備會因為高電流密度通過而發熱，且高溫又會導致金屬沉積的效率變差。When electrodepositing by brush plating, some metals (such as chromium) are not highly efficient in deposition, and are not easily reductive and have a tendency to ionize. In order to solve the above problems, high current density is required in the electrodeposition process. However, the brush plating apparatus generates heat due to the passage of a high current density, and the high temperature causes the efficiency of metal deposition to deteriorate.

本新型創作提供一種電沉積設備，可有效控制刷鍍製程的溫度且提高金屬沉積效率。The novel creation provides an electrodeposition apparatus that can effectively control the temperature of the plating process and improve the metal deposition efficiency.

本新型創作的電沉積設備，包括刷鍍頭。刷鍍頭包括多個通道，且每一通道在刷鍍頭的同一面具有一開口。The present invention creates an electrodeposition apparatus comprising a brush plating head. The brush plating head includes a plurality of channels, and each channel has an opening in the same mask of the brush plating head.

在本新型創作的一實施例中，上述刷鍍頭具有多個柱狀結構構成多個通道。In an embodiment of the present invention, the brush plating head has a plurality of columnar structures to form a plurality of channels.

在本新型創作的一實施例中，上述刷鍍頭具有開口的面包括平面或弧面。In an embodiment of the present invention, the face having the opening of the brush head includes a flat surface or a curved surface.

在本新型創作的一實施例中，上述電沉積設備還可包括電源供應器。電源供應器電性連接刷鍍頭與被鍍工件。In an embodiment of the present novel creation, the above electrodeposition apparatus may further include a power supply. The power supply is electrically connected to the brush plating head and the workpiece to be plated.

在本新型創作的一實施例中，上述電沉積設備還可包括與刷鍍頭相連的握把。In an embodiment of the novel creation, the electrodeposition apparatus may further include a grip connected to the brush plating head.

在本新型創作的一實施例中，上述電沉積設備還可包括鍍液回收裝置。In an embodiment of the present novel creation, the above electrodeposition apparatus may further include a plating solution recovery device.

在本新型創作的一實施例中，上述電沉積設備還可包括鍍液輸入裝置，用以供應鍍液至刷鍍頭。In an embodiment of the present invention, the electrodeposition apparatus may further include a plating liquid input device for supplying the plating solution to the brush plating head.

在本新型創作的一實施例中，上述刷鍍頭還可包括鍍液輸入管道，用以使鍍液輸入通道。In an embodiment of the present invention, the brush head may further include a plating liquid input pipe for inputting the plating liquid into the channel.

在本新型創作的一實施例中，上述電沉積設備還可包括鍍液回收裝置與泵。鍍液回收裝置用以回收鍍液。泵則用以將回收的鍍液輸入上述鍍液輸入裝置。In an embodiment of the present invention, the electrodeposition apparatus may further include a plating solution recovery device and a pump. The plating solution recovery device is used to recover the plating solution. The pump is used to input the recovered plating solution into the plating solution input device.

在本新型創作的一實施例中，上述刷鍍頭中的多個通道為等距分布或不等距分布。In an embodiment of the present invention, the plurality of channels in the brush plating head are equidistantly distributed or unequally distributed.

在本新型創作的一實施例中，位於上述刷鍍頭的邊緣之通道的寬度比位於刷鍍頭的中心之通道的寬度大。In an embodiment of the present invention, the width of the passage at the edge of the brush head is greater than the width of the passage at the center of the brush head.

在本新型創作的一實施例中，上述電沉積設備還可包括摩擦墊。摩擦墊至少包覆刷鍍頭具有上述開口的那一面。In an embodiment of the present novel creation, the above electrodeposition apparatus may further include a friction pad. The friction pad covers at least the side of the brush head having the opening.

在本新型創作的一實施例中，上述電沉積設備還可包括間隔件。間隔件設置於刷鍍頭具有上述開口的那一面。In an embodiment of the present novel creation, the above electrodeposition apparatus may further include a spacer. The spacer is disposed on the side of the brush plating head having the opening.

在本新型創作的一實施例中，上述刷鍍頭還可包括連接多個通道的連通道。In an embodiment of the present invention, the brush head may further include a connecting passage connecting the plurality of passages.

在本新型創作的一實施例中，上述刷鍍頭還可包括連接連通道的排氣孔。In an embodiment of the present invention, the brush head may further include a venting hole connecting the passages.

在本新型創作的一實施例中，上述電沉積設備還可包括蓋板。所述蓋板設置於刷鍍頭具有開口的那一面，其中蓋板包括多個通孔，多個通孔分別連接開口。In an embodiment of the present novel creation, the above electrodeposition apparatus may further include a cover plate. The cover plate is disposed on a side of the brush plating head having an opening, wherein the cover plate includes a plurality of through holes, and the plurality of through holes respectively connect the openings.

在本新型創作的一實施例中，上述蓋板還包括多個盲孔，盲孔不與上述開口連通。In an embodiment of the present invention, the cover plate further includes a plurality of blind holes, and the blind holes are not in communication with the opening.

在本新型創作的一實施例中，上述通孔具有固定孔徑。In an embodiment of the present invention, the through hole has a fixed aperture.

在本新型創作的一實施例中，上述通孔靠近刷鍍頭之孔徑大於遠離刷鍍頭之孔徑。In an embodiment of the present invention, the through hole has a larger aperture than the brush plating head than the aperture away from the brush plating head.

在本新型創作的一實施例中，上述通孔包括點狀通孔、狹縫式通孔、虛線型通孔或其組合。In an embodiment of the present invention, the through hole includes a point through hole, a slit type through hole, a broken line type through hole, or a combination thereof.

在本新型創作的一實施例中，上述蓋板還可包括連接多個通孔的連通道。In an embodiment of the present invention, the cover plate may further include a connecting passage connecting the plurality of through holes.

在本新型創作的一實施例中，上述刷鍍頭還可包括連接上述蓋板之連通道的排氣孔。In an embodiment of the present invention, the brush head may further include an exhaust hole connecting the connecting passages of the cover plate.

基於上述，本新型創作所提出的電沉積設備可藉由刷鍍頭中的通道，使電沉積的過程中刷鍍頭的反應面積增加並且使刷鍍頭端部的電流密度提高，因此可提高金屬的沉積效率。此外，上述通道的空間可作為鍍液的暫存區，並藉由暫存區內的鍍液來沖擊冷卻操作中高溫的刷鍍頭尖端，故可避免高溫導致金屬沉積效率變差的問題。再者，藉由具有多個通道的刷鍍頭之設計，還可減輕刷鍍頭的重量，故可使刷鍍頭的操作更為容易。Based on the above, the electrodeposition apparatus proposed by the present invention can increase the reaction area of the brush head during electrodeposition and increase the current density at the end of the brush plating head by the passage in the brush plating head, thereby improving Metal deposition efficiency. In addition, the space of the above-mentioned channel can be used as a temporary storage area of the plating solution, and the plating liquid in the temporary storage area can impact the tip of the brush head in the cooling operation, so that the problem of deterioration of the metal deposition efficiency due to high temperature can be avoided. Moreover, by designing the brush plating head having a plurality of channels, the weight of the brush plating head can be reduced, so that the operation of the brush plating head can be made easier.

為讓本新型創作的上述特徵能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。In order to make the above-described features of the present invention more apparent, the following embodiments are described in detail with reference to the accompanying drawings.

圖1是依照本新型創作的第一實施例的一種電沉積設備的示意圖。1 is a schematic illustration of an electrodeposition apparatus in accordance with a first embodiment of the present invention.

請參照圖1，電沉積設備100包括刷鍍頭102，其中刷鍍頭102包括多個通道104，且通道104在刷鍍頭102的同一面102a都具有開口104a。電沉積設備100還具有電源供應器106分別電性連接刷鍍頭102與被鍍工件108，且由於圖1中的刷鍍頭102是與一握把110相連，所以可透過握把110間接與刷鍍頭102電性連接。在本實施例中，刷鍍頭102的表面102a為平面，然而在其他實施例中此面102a亦可為弧面或對應不同形狀的被鍍工件108而設計成對應的形狀，本新型創作不以平面為限。本新型創作中不以刷鍍頭102的形狀為限，只要刷鍍頭102中包括通道104即屬於本新型創作的範疇中，所屬技術領域中具有通常知識者可依產品設計需求來改變刷鍍頭102的形狀；舉例來說，刷鍍頭102也可以是圓餅型，並配合適當的握把，即可應用於旋轉式刷筆。再者，藉由具有多個通道104的刷鍍頭102之設計，可減輕刷鍍頭102的重量，故可使刷鍍頭102更為容易操作。電沉積設備100還可在對應被鍍工件108的位置設置鍍液回收裝置112，用以回收自被鍍工件108滴下的鍍液。至於鍍液則可利用外加的鍍液輸入裝置114，用以於電鍍期間供應鍍液至刷鍍頭100。在其他實施例中，鍍液輸入裝置114亦可透過握把110中的管路(未繪)，而將鍍液輸入刷鍍頭102內並到達被鍍工件108。Referring to FIG. 1, the electrodeposition apparatus 100 includes a brush plating head 102 in which the brush plating head 102 includes a plurality of channels 104, and the channels 104 have openings 104a on the same side 102a of the brush plating head 102. The electrodeposition apparatus 100 further has a power supply 106 electrically connected to the brush plating head 102 and the workpiece 108 to be plated, and since the brush plating head 102 in FIG. 1 is connected to a grip 110, the indirect contact with the grip 110 is possible. The brush plating head 102 is electrically connected. In this embodiment, the surface 102a of the brush plating head 102 is a flat surface. However, in other embodiments, the surface 102a may also be a curved surface or a corresponding shape corresponding to the workpiece 108 to be plated. Limited to the plane. In the present invention, the shape of the brush plating head 102 is not limited. As long as the channel 104 is included in the brush head 102, it belongs to the scope of the novel creation. Those skilled in the art can change the brush plating according to the design requirements of the product. The shape of the head 102; for example, the brush head 102 can also be of a round cake type, and can be applied to a rotary brush with a suitable grip. Furthermore, by designing the brush head 102 having a plurality of channels 104, the weight of the brush head 102 can be reduced, so that the brush head 102 can be made easier to handle. The electrodeposition apparatus 100 can also provide a plating solution recovery device 112 at a position corresponding to the workpiece to be plated 108 for recovering the plating solution dropped from the workpiece 108 to be plated. As for the plating solution, an additional plating liquid input device 114 can be utilized for supplying the plating solution to the brush plating head 100 during plating. In other embodiments, the bath input device 114 can also pass through the tubing (not shown) in the grip 110 to feed the bath into the brush head 102 and reach the workpiece 108 to be plated.

在本實施例中，鍍液是選自金(Au)、銀(Ag)、鎳(Ni)、鐵(Fe)、銅(Cu)、鈷(Co)、鋅(Zn)、錫(Sn)、鎢(W)、鉛(Pb)、鎘(Cd)、銦(In)、鉻(Cr)等鍍液。譬如：鈷鎳、鎢鎳、磷鎳、鐵鎳、鎘鎳、鎘鋅、磷鈷鎳、鎳鋅、鋅錫、錫鉛、銻銅錫、銦銅等合金鍍液。另外，所述鍍液也可選自金屬與氧化物、金屬與氮化物或金屬與無機物的複合鍍液。In this embodiment, the plating solution is selected from the group consisting of gold (Au), silver (Ag), nickel (Ni), iron (Fe), copper (Cu), cobalt (Co), zinc (Zn), and tin (Sn). A plating solution such as tungsten (W), lead (Pb), cadmium (Cd), indium (In), or chromium (Cr). For example: cobalt nickel, tungsten nickel, phosphorous nickel, iron nickel, cadmium nickel, cadmium zinc, phosphorus cobalt nickel, nickel zinc, zinc tin, tin lead, beryllium copper tin, indium copper and other alloy plating solutions. Further, the plating solution may also be selected from the group consisting of a metal and an oxide, a metal and a nitride, or a composite plating solution of a metal and an inorganic material.

在圖1中，刷鍍頭100內的通道104是呈現狹縫式的通道，但本新型創作並不限於此。第一實施例的刷鍍頭也可如圖2A與圖2B所示。In Fig. 1, the passage 104 in the brush head 100 is a slit-like passage, but the creation of the present invention is not limited thereto. The brush plating head of the first embodiment can also be as shown in Figs. 2A and 2B.

在圖2A中，刷鍍頭200具有多個柱狀結構202構成多個通道204，由於通道204是柱狀結構202構成，所以其端部會產生尖端放電，故可進一步提高電流密度，並藉由使用具有高電流密度的刷鍍頭200，避免某些金屬(例如是鉻)不易還原析出的問題。而且，圖2A的柱狀結構202之頂面202a雖為平面，但可依照需求將其設計成弧面或其他形狀。在圖2B中，刷鍍頭204中的通道206是凹洞式通道，且其開口206a呈點狀分布。當柱狀結構202彼此分離時，在操作電沉積設備100的過程中可於柱狀結構103a與靠近工件114一側的端部產生尖端放電，故可進一步提高電流密度。藉由使用具有高電流密度的刷鍍頭102a，可避免某些金屬(例如是鉻)不易還原析出的問題。In FIG. 2A, the brush head 200 has a plurality of columnar structures 202 constituting a plurality of channels 204. Since the channel 204 is formed by the columnar structure 202, a tip discharge is generated at the ends thereof, so that the current density can be further increased and borrowed. By using the brush plating head 200 having a high current density, the problem that some metals (for example, chromium) are not easily reduced and precipitated is avoided. Moreover, the top surface 202a of the columnar structure 202 of FIG. 2A is planar, but may be designed as a curved surface or other shape as desired. In Fig. 2B, the passage 206 in the brush head 204 is a recessed passage, and its opening 206a is distributed in a dot shape. When the columnar structures 202 are separated from each other, a tip discharge can be generated at the end of the columnar structure 103a and the side close to the workpiece 114 during the operation of the electrodeposition apparatus 100, so that the current density can be further increased. By using the brush plating head 102a having a high current density, it is possible to avoid the problem that some metals (for example, chromium) are not easily reduced in precipitation.

圖3是依照本新型創作的第二實施例的一種電沉積設備的示意圖。3 is a schematic illustration of an electrodeposition apparatus in accordance with a second embodiment of the present invention.

請參照圖3，本實施例的電沉積設備300與第一實施例類似，包括刷鍍頭302、位於刷鍍頭302內的多個通道304、電源供應器306、被鍍工件308、鍍液回收裝置312與鍍液輸入裝置314。在第二實施例中，被鍍工件308是裝設在電極板310上，所以電源供應器306是分別電性連接刷鍍頭300與電極板310。另外，可藉由泵318，將鍍液回收裝置312中回收的鍍液，輸入鍍液輸入裝置314，再進入刷鍍頭302內的鍍液輸入管道316。此外，電沉積過程中會產生氣泡，而氣泡的產生可能導致反應面積變小且易發生燒焦的情形。因此，鍍液輸入管道316也可改為排氣孔使用，藉由排氣孔的設計可將電沉積過程中所產生的氣泡排出，故可避免隨著電沉積過程的進行發生反應面積變小以及燒焦的問題。此外，藉由連接多個通道304之連通道320，可引導通道304中產生的氣泡使其排出。若是連通道320的位置較低，還可使通道304中的鍍液經由連通道320均勻混合。另外，電沉積設備100還可包括摩擦墊322，至少包覆刷鍍頭302具有開口304a的面302a。在進行電沉積期間，刷鍍頭302電性連接電源供應器306的正極，而被鍍工件308透過電極板310電性連接到電源供應器108的負極，使得刷鍍頭302、鍍液與被鍍工件308進行氧化還原反應，而在被鍍工件308上還原出欲鍍的金屬。上述磨擦墊322設置於刷鍍頭302與被鍍工件308之間，可避免刷鍍頭302與被鍍工件308發生短路的問題，且磨擦墊322可使鍍液通過。Referring to FIG. 3, the electrodeposition apparatus 300 of the present embodiment is similar to the first embodiment, and includes a brush plating head 302, a plurality of channels 304 located in the brush plating head 302, a power supply 306, a workpiece 308 to be plated, and a plating solution. Recovery device 312 and plating solution input device 314. In the second embodiment, the workpiece 308 is mounted on the electrode plate 310, so the power supply 306 is electrically connected to the brush head 300 and the electrode plate 310, respectively. Further, the plating solution recovered in the plating solution recovery device 312 can be input to the plating liquid input device 314 by the pump 318, and then into the plating liquid input pipe 316 in the brush plating head 302. In addition, bubbles are generated during electrodeposition, and the generation of bubbles may cause the reaction area to become small and burnt to occur. Therefore, the plating liquid input pipe 316 can also be used as a vent hole, and the vent hole can be designed to discharge bubbles generated during the electrodeposition process, thereby avoiding a small reaction area as the electrodeposition process proceeds. And the problem of burning. Further, by connecting the connecting passages 320 of the plurality of passages 304, the bubbles generated in the passages 304 can be guided to be discharged. If the position of the channel 320 is lower, the plating solution in the channel 304 can be evenly mixed via the connecting channel 320. Additionally, the electrodeposition apparatus 100 can further include a friction pad 322 that at least covers the face 302a of the opening 304a. During the electrodeposition, the brushing head 302 is electrically connected to the positive electrode of the power supply 306, and the plated workpiece 308 is electrically connected to the negative electrode of the power supply 108 through the electrode plate 310, so that the brushing head 302, the plating solution and the plating solution are The plated workpiece 308 is subjected to a redox reaction, and the metal to be plated is reduced on the workpiece 308 to be plated. The friction pad 322 is disposed between the brush plating head 302 and the workpiece 308 to be plated, thereby avoiding the problem that the brush plating head 302 and the workpiece 308 are short-circuited, and the friction pad 322 can pass the plating solution.

在圖3中，刷鍍頭300內的通道304為等距分布，並具有相同的寬度；但本新型創作並不限於此。第二實施例的刷鍍頭也可如圖4所示。In Fig. 3, the passages 304 in the brush head 300 are equidistantly distributed and have the same width; however, the novel creation is not limited thereto. The brush plating head of the second embodiment can also be as shown in FIG.

請參照圖4，其中的刷鍍頭400的通道402a~402b為不等距分布，譬如位於刷鍍頭400的邊緣之通道402a的寬度w1比位於刷鍍頭400的中心之通道402b的寬度w2大。因為溫度上升會導致金屬沉積效率變差，所以這樣的設計能改善刷鍍頭302的邊緣區域因電流密度較大，而造成邊緣區域溫度過熱的情形。Referring to FIG. 4, the channels 402a-402b of the brush plating head 400 are unequally distributed. For example, the width w1 of the channel 402a at the edge of the brush plating head 400 is wider than the width w2 of the channel 402b at the center of the brush plating head 400. Big. Since the temperature rise causes the metal deposition efficiency to deteriorate, such a design can improve the case where the edge region of the brush plating head 302 is overheated due to a large current density.

圖5是依照本新型創作的第三實施例的一種電沉積設備的剖面示意圖。Figure 5 is a cross-sectional view of an electrodeposition apparatus in accordance with a third embodiment of the present invention.

請參照圖5，第三實施例的電沉積設備500除了有刷鍍頭502、位於刷鍍頭502內的多個通道504、電源供應器508、被鍍工件510、電極板512等構件，還有設置於刷鍍頭502具有開口504a的面502a上的間隔件506。所述間隔件506因為設置於刷鍍頭502與被鍍工件510之間，所以能避免刷鍍頭502與被鍍工件510發生短路的問題，其作用與圖3中的摩擦墊322類似。Referring to FIG. 5, the electrodeposition apparatus 500 of the third embodiment has a brush plating head 502, a plurality of channels 504 located in the brush plating head 502, a power supply 508, a workpiece 510 to be plated, an electrode plate 512, and the like. There is a spacer 506 disposed on the face 502a of the brush head 502 having an opening 504a. Since the spacer 506 is disposed between the brush plating head 502 and the workpiece 510 to be plated, the problem that the brush plating head 502 and the workpiece 510 to be plated are short-circuited can be avoided, and the effect is similar to the friction pad 322 in FIG.

圖6A是依照本新型創作的第四實施例的一種電沉積設備之剖面示意圖。Figure 6A is a schematic cross-sectional view of an electrodeposition apparatus in accordance with a fourth embodiment of the present invention.

請參照圖6A，第四實施例的電沉積設備600除了有刷鍍頭602、位於刷鍍頭602內的多個通道604、電源供應器606、被鍍工件608、電極板610、摩擦墊612等構件，還有設置於刷鍍頭602具有開口604a的面602a的一蓋板614。所述蓋板614包括多個通孔616，其立體圖如圖6B所示，且蓋板614的通孔616分別連接刷鍍頭602的開口604a。這個蓋板614與刷鍍頭602之間的連結，可利用外加固定件(未繪)或者插槽、卡隼等接合部(未繪)來達成。蓋板614的作用在於調節刷鍍頭602內鍍液輸出液量，所以蓋板614的通孔616除了如圖6A是固定孔徑d1，還可以有不同的變化。Referring to FIG. 6A, the electrodeposition apparatus 600 of the fourth embodiment has a brush plating head 602, a plurality of channels 604 located in the brush plating head 602, a power supply 606, a workpiece 608 to be plated, an electrode plate 610, and a friction pad 612. The member also has a cover 614 disposed on the face 602a of the brush head 602 having the opening 604a. The cover plate 614 includes a plurality of through holes 616, the perspective view of which is shown in FIG. 6B, and the through holes 616 of the cover plate 614 are respectively connected to the openings 604a of the brush plating head 602. The connection between the cover plate 614 and the brush plating head 602 can be achieved by using an external fixing member (not shown) or a joint such as a slot or a cassette (not shown). The function of the cover plate 614 is to adjust the amount of plating solution output liquid in the brush plating head 602. Therefore, the through hole 616 of the cover plate 614 may have different changes in addition to the fixed aperture d1 as shown in FIG. 6A.

圖6C是依照本新型創作的第四實施例的另一種電沉積設備之剖面示意圖，其中使用與圖6A相同的元件符號代表相同或類似的構件。如圖6C所示，蓋板618中也有多個通孔620，其立體圖如圖6D所示。但通孔620靠近刷鍍頭602之孔徑d2大於遠離刷鍍頭602之孔徑d3，所以在刷鍍頭602移動過程中，能使鍍液更容易形成渦流，而增加刷鍍頭602的散熱效果。Figure 6C is a cross-sectional view of another electrodeposition apparatus in accordance with a fourth embodiment of the present invention, in which the same reference numerals as in Figure 6A are used to designate the same or similar components. As shown in FIG. 6C, the cover plate 618 also has a plurality of through holes 620, a perspective view of which is shown in FIG. 6D. However, the aperture d2 of the through hole 620 near the brush plating head 602 is larger than the aperture d3 away from the brush plating head 602, so that during the movement of the brush plating head 602, the plating liquid can be more easily formed into a vortex, and the heat dissipation effect of the brush plating head 602 is increased. .

圖6E是依照本新型創作的第四實施例的又一種電沉積設備之剖面示意圖，其中使用與圖6A相同的元件符號代表相同或類似的構件。圖6E的蓋板622可同時設有通孔624以及連接通孔624的連通道626，其立體圖如圖6F所示。連通道626的作用與圖3的連通道320類似，可與刷鍍頭602內設置的排氣孔602b連通，而排出電沉積過程形成的氣泡，以進一步避免反應面積變小以及燒焦的問題。另外，排氣孔602b也可變更為連接至鍍液輸入裝置的通道，來供應鍍液至刷鍍頭602。Figure 6E is a cross-sectional view of still another electrodeposition apparatus in accordance with a fourth embodiment of the present invention, in which the same reference numerals as in Figure 6A are used to designate the same or similar components. The cover 622 of FIG. 6E can be provided with both a through hole 624 and a connecting passage 626 connecting the through holes 624, a perspective view of which is shown in FIG. 6F. The function of the connecting passage 626 is similar to that of the connecting passage 320 of FIG. 3, and can communicate with the exhaust hole 602b provided in the brush plating head 602 to discharge bubbles formed during the electrodeposition process to further avoid the problem of small reaction area and charring. . In addition, the venting opening 602b is also variably connected to the passage of the plating liquid input device to supply the plating solution to the brush plating head 602.

圖7是第四實施例的蓋板之其他變形例的立體示意圖。在圖7中，蓋板700還可包括多個盲孔702。盲孔702是朝向被鍍工件(608)而不與開口(604a)連通。在電沉積過程中，盲孔702可作為另一個鍍液暫存的空間，使鍍液均勻分布在被鍍工件(608)上而提高電沉積的均勻性。此外，蓋板700的通孔可依照需求做不同的設計與分布，例如點狀通孔704、狹縫式通孔706、虛線型通孔708或其組合，本新型創作不以通孔704~708的形狀為限，所屬技術領域中具有通常知識者可依產品需求調整其形狀與分布。Fig. 7 is a perspective view showing another modification of the cover plate of the fourth embodiment. In FIG. 7, the cover plate 700 can also include a plurality of blind holes 702. The blind hole 702 is oriented toward the workpiece (608) being plated and not in communication with the opening (604a). During the electrodeposition process, the blind via 702 can serve as a temporary storage space for the plating solution to uniformly distribute the plating solution on the workpiece (608) to improve the uniformity of electrodeposition. In addition, the through holes of the cover plate 700 can be differently designed and distributed according to requirements, such as a point through hole 704, a slit type through hole 706, a broken line type through hole 708 or a combination thereof, and the present invention does not use the through hole 704~ The shape of the 708 is limited, and those skilled in the art can adjust the shape and distribution according to the needs of the product.

綜上所述，本新型創作的電沉積設備具有較佳的沉積效率以及更易為操作。詳而言之，刷鍍頭中具有通道，其可使電沉積的過程中電極的反應面積增加，且使刷鍍頭端部的電流密度提高，故可提高金屬的沉積效率。此外，刷鍍頭中通道的空間可作為鍍液的暫存區，使得暫存區內的鍍液可冷卻操作中溫度提高的刷鍍頭，故可避免電沉積過程中高溫導致金屬沉積效率變差的問題。再者，藉由刷鍍頭中具有多個通道的設計，可減輕刷鍍頭的重量，故可使刷鍍頭更為容易操作。In summary, the electrodeposition apparatus of the present invention has better deposition efficiency and is easier to operate. In detail, the brush plating head has a channel which can increase the reaction area of the electrode during electrodeposition and increase the current density at the end of the brush plating head, thereby improving the deposition efficiency of the metal. In addition, the space of the channel in the brush plating head can be used as a temporary storage area of the plating solution, so that the plating liquid in the temporary storage area can cool the brush plating head with an increased temperature during operation, thereby avoiding high temperature and high metal deposition efficiency during electrodeposition. Poor question. Moreover, by designing a plurality of channels in the brush head, the weight of the brush head can be reduced, so that the brush head can be operated more easily.

雖然本新型創作已以實施例揭露如上，然其並非用以限定本新型創作，任何所屬技術領域中具有通常知識者，在不脫離本新型創作的精神和範圍內，當可作些許的更動與潤飾，故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.

100、300、500、600‧‧‧電沉積設備
102、200、204、302、400、502、602‧‧‧刷鍍頭
102a、202a、206a、302a、502a、602a‧‧‧表面
104、204、206、304、402a、402b、504、604‧‧‧通道
104a、206a、304a、504a、604a‧‧‧開口
106、306、508、606‧‧‧電源供應器
108、308、510、608‧‧‧被鍍工件
110‧‧‧握把
112、312‧‧‧鍍液回收裝置
114、314‧‧‧鍍液輸入裝置
202‧‧‧柱狀結構
310、512、610‧‧‧電極板
316‧‧‧鍍液輸入管道
318‧‧‧泵
320、626‧‧‧連通道
322、612‧‧‧摩擦墊
506‧‧‧間隔件
602b‧‧‧排氣孔
614、618、622、700‧‧‧蓋板
616、620、624、704、706、708‧‧‧通孔
702‧‧‧盲孔
w1、w2‧‧‧寬度
d1、d2、d3‧‧‧孔徑100, 300, 500, 600‧‧‧electrodeposition equipment
102, 200, 204, 302, 400, 502, 602‧‧‧ brush head
102a, 202a, 206a, 302a, 502a, 602a‧‧‧ surface
104, 204, 206, 304, 402a, 402b, 504, 604‧‧ channels
104a, 206a, 304a, 504a, 604a‧‧‧ openings
106, 306, 508, 606‧‧‧ power supply
108, 308, 510, 608‧‧‧ workpieces
110‧‧‧ grip
112, 312‧‧‧ plating solution recovery device
114, 314‧‧‧ plating liquid input device
202‧‧‧ Columnar structure
310, 512, 610‧‧‧ electrode plates
316‧‧‧ plating liquid input pipe
318‧‧‧ pump
320, 626‧‧‧ even channel
322, 612‧‧‧ friction pads
506‧‧‧ spacers
602b‧‧‧ venting holes
614, 618, 622, 700‧‧ ‧ cover
616, 620, 624, 704, 706, 708‧‧ ‧ through holes
702‧‧‧Blind hole
W1, w2‧‧‧ width
D1, d2, d3‧‧‧ aperture

圖1是依照本新型創作的第一實施例的一種電沉積設備之示意圖。圖2A與圖2B是第一實施例的刷鍍頭之兩種變形例的立體示意圖。圖3是依照本新型創作的第二實施例的一種電沉積設備之剖面示意圖。圖4是第二實施例的刷鍍頭之一種變形例的剖面示意圖。圖5是依照本新型創作的第三實施例的一種電沉積設備的剖面示意圖。圖6A是依照本新型創作的第四實施例的一種電沉積設備之剖面示意圖。圖6B是圖6A中的蓋板之立體示意圖。圖6C是依照本新型創作的第四實施例的另一種電沉積設備之剖面示意圖。圖6D是圖6C中的蓋板之立體示意圖。圖6E是依照本新型創作的第四實施例的再一種電沉積設備之剖面示意圖。圖6F是圖6E中的蓋板之立體示意圖。圖7是第四實施例的蓋板之其他變型例的立體示意圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic illustration of an electrodeposition apparatus in accordance with a first embodiment of the present invention. 2A and 2B are perspective views of two modifications of the brush plating head of the first embodiment. 3 is a schematic cross-sectional view of an electrodeposition apparatus in accordance with a second embodiment of the present invention. Fig. 4 is a schematic cross-sectional view showing a modification of the brush plating head of the second embodiment. Figure 5 is a cross-sectional view of an electrodeposition apparatus in accordance with a third embodiment of the present invention. Figure 6A is a schematic cross-sectional view of an electrodeposition apparatus in accordance with a fourth embodiment of the present invention. Figure 6B is a perspective view of the cover of Figure 6A. Figure 6C is a schematic cross-sectional view of another electrodeposition apparatus in accordance with a fourth embodiment of the present invention. Figure 6D is a perspective view of the cover of Figure 6C. 6E is a schematic cross-sectional view of still another electrodeposition apparatus in accordance with a fourth embodiment of the present invention. Figure 6F is a perspective view of the cover of Figure 6E. Fig. 7 is a perspective view showing another modification of the cover plate of the fourth embodiment.

100‧‧‧電沉積設備 100‧‧‧Electrodeposition equipment

102‧‧‧刷鍍頭 102‧‧‧ brush head

102a‧‧‧表面 102a‧‧‧ surface

104‧‧‧通道 104‧‧‧ channel

104a‧‧‧開口 104a‧‧‧ openings

106‧‧‧電源供應器 106‧‧‧Power supply

108‧‧‧被鍍工件 108‧‧‧Worked workpiece

110‧‧‧握把 110‧‧‧ grip

112‧‧‧鍍液回收裝置 112‧‧‧ plating solution recovery device

114‧‧‧鍍液輸入裝置 114‧‧‧ plating liquid input device

Claims

一種電沉積設備，包括刷鍍頭，所述刷鍍頭包括多個通道以及位在所述刷鍍頭的同一面的多個開口，其中每一所述通道由所述刷鍍頭的內部延伸至每一所述開口。 An electrodeposition apparatus comprising a brush plating head, the brush plating head comprising a plurality of channels and a plurality of openings on the same side of the brush plating head, wherein each of the channels is extended by an interior of the brush plating head To each of the openings.

如申請專利範圍第1項所述的電沉積設備，其中所述刷鍍頭具有多個柱狀結構構成所述多個通道。 The electrodeposition apparatus according to claim 1, wherein the brush plating head has a plurality of columnar structures constituting the plurality of channels.

如申請專利範圍第1項所述的電沉積設備，其中所述刷鍍頭具有所述開口的所述面包括平面或弧面。 The electrodeposition apparatus of claim 1, wherein the face of the brush plating head having the opening comprises a plane or a curved surface.

如申請專利範圍第1項所述的電沉積設備，更包括電源供應器，電性連接所述刷鍍頭與被鍍工件。 The electrodeposition apparatus according to claim 1, further comprising a power supply device electrically connecting the brush plating head and the workpiece to be plated.

如申請專利範圍第1項所述的電沉積設備，更包括握把，與所述刷鍍頭相連。 The electrodeposition apparatus of claim 1, further comprising a grip connected to the brush plating head.

如申請專利範圍第1項所述的電沉積設備，更包括鍍液回收裝置。 The electrodeposition apparatus according to claim 1, further comprising a plating solution recovery device.

如申請專利範圍第1項所述的電沉積設備，更包括鍍液輸入裝置，用以供應鍍液至所述刷鍍頭。 The electrodeposition apparatus according to claim 1, further comprising a plating liquid input device for supplying plating solution to the brush plating head.

如申請專利範圍第7項所述的電沉積設備，其中所述刷鍍頭更包括鍍液輸入管道，用以使所述鍍液輸入所述通道。 The electrodeposition apparatus of claim 7, wherein the brush plating head further comprises a plating liquid input pipe for inputting the plating solution into the channel.

如申請專利範圍第7項所述的電沉積設備，更包括：鍍液回收裝置，用以回收所述鍍液；以及泵，用以將回收的所述鍍液輸入所述鍍液輸入裝置。 The electrodeposition apparatus of claim 7, further comprising: a plating solution recovery device for recovering the plating solution; and a pump for inputting the recovered plating solution into the plating liquid input device.

如申請專利範圍第1項所述的電沉積設備，其中所述刷鍍頭中的所述多個通道為等距分布。 The electrodeposition apparatus of claim 1, wherein the plurality of channels in the brush plating head are equidistantly distributed.

如申請專利範圍第1項所述的電沉積設備，其中所述刷鍍頭中的所述多個通道為不等距分布。 The electrodeposition apparatus of claim 1, wherein the plurality of channels in the brush plating head are not equidistantly distributed.

如申請專利範圍第11項所述的電沉積設備，其中位於所述刷鍍頭的邊緣之所述通道的寬度比位於所述刷鍍頭的中心之所述通道的寬度大。 The electrodeposition apparatus according to claim 11, wherein the width of the passage at the edge of the brush plating head is larger than the width of the passage at the center of the brush plating head.

如申請專利範圍第1項所述的電沉積設備，更包括摩擦墊，至少包覆所述刷鍍頭具有所述開口的所述面。 The electrodeposition apparatus of claim 1, further comprising a friction pad covering at least the face of the brush plating head having the opening.

如申請專利範圍第1項所述的電沉積設備，更包括間隔件，設置於所述刷鍍頭具有所述開口的所述面。 The electrodeposition apparatus according to claim 1, further comprising a spacer disposed on the face of the brush plating head having the opening.

如申請專利範圍第1項所述的電沉積設備，其中所述刷鍍頭更包括連通道，連接所述多個通道。 The electrodeposition apparatus of claim 1, wherein the brush plating head further comprises a connecting passage connecting the plurality of channels.

如申請專利範圍第15項所述的電沉積設備，其中所述刷鍍頭更包括排氣孔，所述排氣孔連接所述連通道。 The electrodeposition apparatus of claim 15, wherein the brush plating head further comprises a vent hole, the vent hole connecting the connecting passage.

如申請專利範圍第1項所述的電沉積設備，更包括蓋板，設置於所述刷鍍頭具有所述開口的所述面，其中所述蓋板包括多個通孔，所述多個通孔分別連接所述開口。 The electrodeposition apparatus of claim 1, further comprising a cover plate disposed on the face of the brush plating head having the opening, wherein the cover plate comprises a plurality of through holes, the plurality of Through holes are respectively connected to the openings.

如申請專利範圍第17項所述的電沉積設備，其中所述蓋板更包括多個盲孔，所述盲孔不與所述開口連通。 The electrodeposition apparatus of claim 17, wherein the cover plate further comprises a plurality of blind holes, the blind holes not communicating with the opening.

如申請專利範圍第17項所述的電沉積設備，其中所述通孔具有固定孔徑。 The electrodeposition apparatus of claim 17, wherein the through hole has a fixed aperture.

如申請專利範圍第17項所述的電沉積設備，其中所述通孔靠近所述刷鍍頭之孔徑大於遠離所述刷鍍頭之孔徑。 The electrodeposition apparatus according to claim 17, wherein a diameter of the through hole adjacent to the brush plating head is larger than an aperture away from the brush plating head.

如申請專利範圍第17項所述的電沉積設備，其中所述通孔包括點狀通孔、狹縫式通孔、虛線型通孔或其組合。 The electrodeposition apparatus according to claim 17, wherein the through hole comprises a dot through hole, a slit type through hole, a broken line type through hole, or a combination thereof.

如申請專利範圍第17項所述的電沉積設備，其中所述蓋板更包括連通道，連接所述多個通孔。 The electrodeposition apparatus of claim 17, wherein the cover plate further comprises a connecting passage connecting the plurality of through holes.

如申請專利範圍第22項所述的電沉積設備，其中所述刷鍍頭更包括排氣孔，所述排氣孔連接所述連通道。The electrodeposition apparatus according to claim 22, wherein the brush plating head further comprises a vent hole, the vent hole connecting the connecting passage.