TWM518650U

TWM518650U - Platform of digital amplifier

Info

Publication number: TWM518650U
Application number: TW104211574U
Authority: TW
Inventors: Ji-Ye Lin
Original assignee: Dongguan Jian Chuang Electronics Co Ltd
Priority date: 2015-07-17
Filing date: 2015-07-17
Publication date: 2016-03-11

Description

數位放大器平台 Digital amplifier platform

本創作係有關於一種車載技術領域，其係尤指一種數位放大器平台。 This creation is about a field of in-vehicle technology, especially a digital amplifier platform.

目前，車載終端的數位放大器一般有下列特點：輸出功率固定，前級處理器為單一類型的處理器，當人們對音響設備要求高時，現有的數位放大器並不能滿足人們的需求，現有的解決方式是在數位放大器上加裝多款前級處理器以滿族用戶的要求。 At present, the digital amplifier of the vehicle terminal generally has the following characteristics: the output power is fixed, and the pre-processor is a single type of processor. When people have high requirements on the audio equipment, the existing digital amplifier cannot meet the needs of the people, and the existing solution is solved. The way is to add a variety of preamps to the digital amplifier to meet the requirements of Manchu users.

為此，現今急需一種數位放大器平台來克服。 To this end, there is an urgent need for a digital amplifier platform to overcome.

本創作之目的之一，在於提供一種數位放大器平台，其具有通用各車載喇叭、可擴展功率、前級處理器兼備發燒級和通用型的功能。 One of the purposes of this creation is to provide a digital amplifier platform with universal car speakers, expandable power, preamplifiers with both enthusiast and general purpose functions.

為了達到上述之目的，本創作之數位放大器平台包含一平台本體與一印刷電路板。印刷電路板裝設於平台本體，印刷電路板板上設置複數功能插槽模組，印刷電路板上裝設有一前級標準行處理模組、一輸入模組、一喇叭輸出模組及一獨立喇叭輸入模組，輸入模組與前級標準型處理模組及功能插槽模組電性連接，前級標準型處理模組與該些功能插槽模組電性連接，喇叭輸出模組及獨立喇叭輸入模組分別與該些功能插槽模組電性連接。與現有技術相比，本創作具有通用各車載喇叭、可擴展功率、兼備發燒級和通用型的功能。 In order to achieve the above objectives, the digital amplifier platform of the present invention comprises a platform body and a printed circuit board. The printed circuit board is mounted on the platform body, and the plurality of function slot modules are disposed on the printed circuit board board. The printed circuit board is provided with a pre-standard processing module, an input module, a speaker output module and an independent The speaker input module and the input module are electrically connected with the front-level standard processing module and the function slot module, and the front-level standard processing module and the function slot module The electrical connection, the speaker output module and the independent speaker input module are electrically connected to the function slot modules respectively. Compared with the prior art, this creation has the functions of universal car speakers, expandable power, both fever and general purpose.

0‧‧‧平台本體 0‧‧‧ platform ontology

1‧‧‧PCB板 1‧‧‧PCB board

11‧‧‧複數功能插槽模組 11‧‧‧Multiple function slot module

112‧‧‧電源管理模組 112‧‧‧Power Management Module

114‧‧‧低功率模組 114‧‧‧Low power module

1141‧‧‧第一四聲道低功率擴展單元 1141‧‧‧First four-channel low power extension unit

1142‧‧‧第二四聲道低功率擴展單元 1142‧‧‧Second four-channel low power extension unit

116‧‧‧高功率模組 116‧‧‧High power module

1161‧‧‧第一四聲道高功率擴展單元 1161‧‧‧First four-channel high power extension unit

1162‧‧‧第二四聲道高功率擴展單元 1162‧‧‧Second four-channel high power extension unit

117‧‧‧前級發燒級處理插槽 117‧‧‧Pre-stage fever processing slot

118‧‧‧前級發燒級型處理模組 118‧‧‧Pre-stage fever-class processing module

1181‧‧‧頻譜分析單元 1181‧‧‧ Spectrum Analysis Unit

1182‧‧‧升級處理單元 1182‧‧‧Upgrade processing unit

12‧‧‧前級標準型處理模組 12‧‧‧Pre-standard standard processing module

13‧‧‧輸入模組 13‧‧‧Input module

14‧‧‧喇叭輸出模組 14‧‧‧ Speaker output module

141‧‧‧DSP串列輸出單元 141‧‧‧DSP serial output unit

15‧‧‧獨立喇叭輸入模組 15‧‧‧Independent speaker input module

第1圖為本創作之一實施例之數位放大器平台的結構示意圖。 FIG. 1 is a schematic structural view of a digital amplifier platform according to an embodiment of the present invention.

第2圖為第1圖之部分結構示意圖。 Figure 2 is a partial schematic view of the structure of Figure 1.

第3圖為第1圖之另一部分結構示意圖。 Figure 3 is a schematic view showing the structure of another part of Fig. 1.

第4圖為本創作之一實施例之尋行擴展功率為270W的方塊圖。 Figure 4 is a block diagram of the homing power of 270W in one embodiment of the present invention.

下面結合圖式與實施例對本創作進行進一步的說明，這是本創作的較佳實施例。 The present invention will be further described below in conjunction with the drawings and embodiments, which is a preferred embodiment of the present invention.

實施例1： Example 1:

請一併參閱第1圖至第4圖，其係為本創作之一實施例之數位放大器平台的結構示意圖、部分結構示意圖及方塊圖。如圖所示，本創作之放大器平台包含一平台本體0、一印刷電路板(Ptinted Circuit Board，PCB，以下稱此為PCB板)1、複數功能插槽模組11、一前級標準型處理模組12、一輸入模組13、一喇叭輸出模組14及一獨立喇叭輸入模組15。PCB板1裝設於平台本體0上，該些功能插槽模組11設置於PCB板上，前級標準型處理模組12、輸入模組13、喇叭輸出模組14與獨立喇叭輸入模組15裝設於PCB板上，輸入模組13與前級標準型處理模組12及功能插槽模組11電性連接，前級標準型處理模組12與功能插槽模組11電性連接，喇叭輸出模組14與獨立喇叭輸出模組15分別與該些功能插槽模組11電性連接；具體而言，本創作之數位放大器平台在使用時，使用者可根據需要通過該些功能插槽模組11選擇設置相對應的功率輸出，還可根據USB輸入每一車輛的音質參數，從而使得本創作在提升音質效果的前提下具有更好地兼容性等。 Please refer to FIG. 1 to FIG. 4 together, which is a structural diagram, a partial structure diagram and a block diagram of a digital amplifier platform according to an embodiment of the present invention. As shown in the figure, the amplifier platform of the present invention comprises a platform body 0, a printed circuit board (PCB), hereinafter referred to as a PCB board, a plurality of function slot modules 11, and a pre-standard processing. The module 12, an input module 13, a speaker output module 14, and a separate speaker input module 15. The PCB board 1 is mounted on the platform body 0. The function slot modules 11 are disposed on the PCB board, the front-level standard processing module 12, the input module 13, the speaker output module 14 and the independent speaker input module. 15 is installed on the PCB board, and the input module 13 is electrically connected to the pre-standard processing module 12 and the function slot module 11 The quasi-type processing module 12 is electrically connected to the function slot module 11, and the speaker output module 14 and the independent speaker output module 15 are electrically connected to the function slot modules 11 respectively; specifically, the creation When the digital amplifier platform is in use, the user can select and set the corresponding power output through the function slot module 11 as needed, and input the sound quality parameters of each vehicle according to the USB, thereby making the creation improve the sound quality effect. Under the premise of better compatibility and so on.

首先，在本實施之中，該些功能插槽模組11包含一電源插槽(圖中未示)及可插拔地設置於電源插槽的一電源管理模組112、一低功率插槽(圖中未示)及可插拔地設置於低功率插槽的一低功率模組114、一高功率插槽(圖中未示)及可插拔地設置於高功率插槽的一高功率模組116以及一前級發燒級處理插槽117及可插拔地設置於前級發燒級處理插槽117的一前級發燒級型處理模組118。具體而言，低功率模組114包含一第一四聲道低功率擴展單元1141與一第二四聲道低功率擴展單元1142。第一四聲道低功率擴展單元1141與前級標準型處理模組12及喇叭輸出模組14電性連接；第二四聲道低功率擴展單元1142與前級標準型處理模組12及喇叭輸出模組14電性連接。高功率處理模組116包含一第一四聲道高功率擴展單元1161與一第二四聲道高功率擴展單元1162。第一四聲道高功率擴展單元1161與前級標準型處理模組12、電源管理模組112及喇叭輸出模組114電性連接；第二四聲道高功率擴展單元1162與前級標準型處理模組12、電源管理模組112及喇叭輸出模組14電性連接。前級發燒級型處理模組118包含一頻譜分析單元1181與一升級處理單元1182。頻譜分析單元1181與輸入模組13及前級標準型處理模組12電性連接；升級處理單元1182與輸入模組13及前級標準型處理模組12電性連接。 First, in the implementation, the function slot module 11 includes a power socket (not shown) and a power management module 112 that is pluggably disposed in the power socket, and a low power slot. (not shown) and a low power module 114, a high power socket (not shown) that is pluggably disposed in the low power slot, and a high pluggable height in the high power slot The power module 116 and a pre-stage fever processing slot 117 and a pre-stage fever-class processing module 118 that is pluggably disposed in the pre-stage fever processing slot 117. Specifically, the low power module 114 includes a first four channel low power extension unit 1141 and a second four channel low power extension unit 1142. The first four-channel low-power expansion unit 1141 is electrically connected to the front-end standard processing module 12 and the speaker output module 14; the second four-channel low-power expansion unit 1142 and the front-level standard processing module 12 and the speaker The output module 14 is electrically connected. The high power processing module 116 includes a first four channel high power extension unit 1161 and a second four channel high power extension unit 1162. The first four-channel high-power extension unit 1161 is electrically connected to the pre-standard processing module 12, the power management module 112, and the speaker output module 114; the second four-channel high-power extension unit 1162 and the pre-standard type The processing module 12, the power management module 112, and the speaker output module 14 are electrically connected. The pre-stage fever-class processing module 118 includes a spectrum analysis unit 1181 and an upgrade processing unit 1182. The spectrum analysis unit 1181 is electrically connected to the input module 13 and the pre-standard processing module 12; the upgrade processing unit 1182 is electrically connected to the input module 13 and the pre-standard processing module 12.

更具體而言，第一四聲道低功率擴展單元1141與第二四聲道低功率擴展單元1142的規格參數為50Wx4，而第一四聲道高功率擴展單元1161與第二四聲道高功率擴展單元1162的規格參數為135Wx4，進一步而言，使用者可根據需要選擇性地使用第一四聲道低功率擴展單元1141、第二四聲道低功率擴展單元1142、第一四聲道高功率擴展單元1161與第二四聲道高功率擴展單元1162，從而使得本創作可根據需要得到相對應的功率輸出及聲道輸出，從而使得本創作的功率輸出範圍為100W~270W，聲道輸出可擴展到16聲道；更進一步地，頻譜分析單元1181具有音質、時間延遲、頻率響應、喇叭分頻點及相位角度調適等功能，頻譜分析單元1181將調適資訊傳送至前級標準型處理模組12上，使得本創作能將音頻資訊中的高音/中音/低音等音頻資訊調整出來，使得本創作無須改裝車載喇叭，即可更好地實現發燒級的臨聽效果；再進一步地，使用者可通過輸入模組13連接電腦，通過升級處理單元1182對本創作進行升級。其中需要說明的是，前級發燒級型處理模組118包括TMS320DA783。 More specifically, the specification parameters of the first four-channel low power extension unit 1141 and the second four-channel low power extension unit 1142 are 50Wx4, and the first four-channel high power extension unit 1161 and the second four-channel high The specification parameter of the power expansion unit 1162 is 135 Wx4. Further, the user can selectively use the first four-channel low power extension unit 1141, the second four-channel low power extension unit 1142, and the first four channels as needed. The high power extension unit 1161 and the second four-channel high power extension unit 1162 enable the present work to obtain corresponding power output and channel output according to requirements, so that the power output range of the creation is 100W~270W, and the channel The output can be extended to 16 channels; further, the spectrum analyzing unit 1181 has functions such as sound quality, time delay, frequency response, speaker crossover point and phase angle adjustment, and the spectrum analyzing unit 1181 transmits the adaptation information to the pre-standard processing. On the module 12, the creation can adjust the audio information such as the treble/middle/bass in the audio information, so that the creation does not need to modify the car speaker. Listen to good effect to achieve clinical grade fever; Still further, the user can be connected to the computer through the input module 13, upgrade to the creation by upgrading processing unit 1182. It should be noted that the pre-stage fever-level processing module 118 includes the TMS320DA783.

輸入模組13包含USB輸入端口，USB輸入端口設置在PCB板1上，具體而言，使用者可通過USB輸入端口連接電腦等智能設備，通過USB輸入端口輸入各車輛音質的參數資訊，前級標準型處理模組12結合前級發燒級型處理模組12的資訊進行調適，從而使得本創作具有兼容各車載喇叭及兼備發燒級音質效果的功能。 The input module 13 includes a USB input port, and the USB input port is disposed on the PCB board 1. Specifically, the user can connect to a smart device such as a computer through a USB input port, and input parameter information of each vehicle sound quality through the USB input port, the pre-stage The standard processing module 12 is adapted to the information of the pre-stage fever-level processing module 12, so that the creation has the functions of being compatible with each car speaker and having a fever-quality sound effect.

喇叭輸出模組14包含一DSP串列輸出單元141，DSP串列輸出單元141與功能插槽模組11連接；具體而言，串列輸出單元141與第一四聲道低功率擴展單元1141、第二四聲道低功率擴展單元1142、第一四聲道高功率擴展單元1161與第二四聲道高功率擴展單元1662電性連接。 The speaker output module 14 includes a DSP serial output unit 141, and the DSP serial output unit 141 is connected to the function slot module 11; specifically, the serial output unit 141 and the first four-channel low power extension unit 1141 The second four-channel low power extension unit 1142, the first four channels are high The power expansion unit 1161 is electrically connected to the second four-channel high power extension unit 1662.

前級標準型處理模組12包含一第一前級標準型處理單元121與第二前級標準型處理單元122。第一前級標準型處理單元121與功能插槽模組11及輸入模組13電性連接，第二前級標準型處理單元與功能插槽模組11及輸入模組電性連接；具體而言，第一前級標準型處理單元121與頻譜分析單元1181、升級處理單元1182、第一四聲道低功率擴展單元1141、第二四聲道低功率擴展單元1142、第一四聲道高功率擴展單元1161、第二四聲道高功率擴展單元1162及獨立喇叭輸入模駔15電性連接；更具體而言，第一前級標準型處理單元121及第二前級標準型處理單元122分別包含FAS3108晶片。 The pre-standard processing module 12 includes a first pre-standard processing unit 121 and a second pre-standard processing unit 122. The first pre-stage standard processing unit 121 is electrically connected to the function slot module 11 and the input module 13, and the second pre-stage standard processing unit is electrically connected to the function slot module 11 and the input module; The first pre-stage standard type processing unit 121 and the spectrum analyzing unit 1181, the upgrading processing unit 1182, the first four-channel low power extension unit 1141, the second four-channel low power extension unit 1142, and the first four channels are high. The power expansion unit 1161, the second four-channel high power extension unit 1162, and the independent speaker input module 15 are electrically connected; more specifically, the first pre-stage standard type processing unit 121 and the second pre-stage standard type processing unit 122 The FAS3108 wafer is included separately.

當擴展功率為70W時，使用者預先通過輸入模組13輸入音質參數至頻譜分析單元1181或升級處理單元1182調適或升級，並將調適或升級的參數資訊傳送至第一前級標準型處理單元121及第二前級標準型處理單元122，音頻資訊傳送至第一前級標準型處理單元121及第二前級標準型處理單元122，進一步地，使用者可根據需要通過輸入模組13向第一前級標準型處理單元121及第二前級標準型處理單元122輸入音質參數資訊，第一前級標準型處理單元121及第二前級標準型處理單元122對處理後的音頻資訊分別經第一四聲道低功率擴展單元1141、第二四聲道低功率擴展單元1142、第一四聲道高功率擴展單元1161及第二四聲道高功率擴展單元1162傳送至DSP串列輸出單元141而輸出；其中需要說明的是，實際使用中於無須每次使用進行升級，使用者可根據實際需要選擇升級與否。 When the extended power is 70W, the user inputs the sound quality parameter to the spectrum analyzing unit 1181 or the upgrading processing unit 1182 through the input module 13 to adapt or upgrade, and transmits the adjusted or upgraded parameter information to the first pre-standard processing unit. 121 and the second pre-stage standard processing unit 122, the audio information is transmitted to the first pre-standard processing unit 121 and the second pre-standard processing unit 122. Further, the user can pass the input module 13 as needed. The first pre-standard processing unit 121 and the second pre-standard processing unit 122 input the sound quality parameter information, and the first pre-standard processing unit 121 and the second pre-standard processing unit 122 respectively process the processed audio information. The first four-channel low power extension unit 1141, the second four-channel low power extension unit 1142, the first four-channel high power extension unit 1161, and the second four-channel high power extension unit 1162 are transmitted to the DSP serial output. The unit 141 outputs the same; it should be noted that, in actual use, the user does not need to upgrade every time, and the user can select whether to upgrade according to actual needs.

從以上描述可以看出，本創作之數位放大器平台，使用者可根據需要自主動選擇功率輸出組合模式，從而使得本創作具有功率擴展的功能，通過本創作同時兼備發燒級及便於升級的功能，進一步地，通過前級發燒級型處理模組118的設置，使得本創做再應用時，無須改裝車輛的喇叭，具有更好的兼容功能。 As can be seen from the above description, the digital amplifier platform of the present creation can be used by the user. The power output combination mode is actively selected according to the need, so that the creation has the function of power expansion, and the function of the fever level and the easy upgrade is simultaneously provided by the creation, and further, the setting of the front-stage fever-level processing module 118 is made. When this application is re-applied, there is no need to modify the speaker of the vehicle, and it has better compatibility.

本新型係實為一具有新穎性、進步性及可供產業利用者，應符合我國專利法所規定之專利申請要件無疑，爰依法提出新型專利申請，祈鈞局早日賜准專利，至感為禱。 This new type is a novelty, progressive and available for industrial use. It should meet the requirements of patent applications stipulated in China's Patent Law. It is undoubtedly a new type of patent application, and the Prayer Council will grant patents as soon as possible. prayer.

惟以上所述者，僅為本新型之一較佳實施例而已，並非用來限定本新型實施之範圍，舉凡依本新型申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾，均應包括於本新型之申請專利範圍內。 However, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the variations, shapes, structures, and spirits described in the scope of the present patent application are equivalent. Modifications are intended to be included in the scope of the present patent application.

0‧‧‧平台本體 0‧‧‧ platform ontology

112‧‧‧電源管理模組 112‧‧‧Power Management Module

114‧‧‧低功率模組 114‧‧‧Low power module

116‧‧‧高功率模組 116‧‧‧High power module

13‧‧‧輸入模組 13‧‧‧Input module

Claims

一種數位放大器平台，其包含：一平台本體；以及一印刷電路板，裝設於該平台本體，該印刷電路板板上設置複數功能插槽模組，該印刷電路板上裝設有一前級標準型處理模組、一輸入模組、一喇叭輸出模組及一獨立喇叭輸入模組，該輸入模組與該前級標準型處理模組及該功能插槽模組電性連接，該前級標準型處理模組與該些功能插槽模組電性連接，該喇叭輸出模組及該獨立喇叭輸入模組分別與該些功能插槽模組電性連接。 A digital amplifier platform includes: a platform body; and a printed circuit board mounted on the platform body, the printed circuit board board is provided with a plurality of function slot modules, and the printed circuit board is provided with a pre-standard The processing module, an input module, a speaker output module and a separate speaker input module, the input module is electrically connected to the pre-standard processing module and the function slot module, the pre-stage The standard processing module is electrically connected to the function slot modules, and the speaker output module and the independent speaker input module are electrically connected to the function slot modules respectively.

如申請專利範圍第1項所述之數位放大器平台，其中該些功能插槽模組包含一電源插槽及可插拔地設置於該電源插槽的一電源管理模組、一低功率插槽及可插拔地設置於該低功率插槽的一低功率模組、一高功率插槽及可插拔地設置於該高功率插槽的一高功率模組以及一前級發燒級處理插槽及可插拔地設置於該前級發燒級處理插槽的一前級發燒級型處理模組。 The digital amplifier platform of claim 1, wherein the function slot module comprises a power socket and a power management module and a low power slot that are pluggably disposed in the power socket And a low power module that is pluggably disposed in the low power slot, a high power socket, and a high power module that is pluggably disposed in the high power slot and a pre-stage fever processing plug a slot and a pre-stage fever-class processing module that is pluggably disposed in the pre-stage fever processing slot.

如申請專利範圍第2項所述之數位放大器平台，其中該低功率模組包含一第一四聲道低功率擴展單元與一第二四聲道低功率擴展單元，該第一四聲道低功率擴展單元與該前級標準型處理模組及該喇叭輸出模組電性連接，該第二四聲道低功率擴展單元與該前級標準型處理模組及該喇叭輸出模組電性連接。 The digital amplifier platform of claim 2, wherein the low power module comprises a first four channel low power extension unit and a second four channel low power extension unit, the first four channels are low The power expansion unit is electrically connected to the pre-standard processing module and the speaker output module, and the second four-channel low power expansion unit is electrically connected to the pre-standard processing module and the speaker output module. .

如申請專利範圍第2項所述之數位放大器平台，其中該高功率模組包含一第一四聲道高功率擴展單元與一第二四聲道高功率擴展單元，該第一四聲道高功率擴展單元與該前級標準型處理模組、該電源管理模組及該喇叭輸出模組電性連接，該第二四聲道高功率擴展單元與該前級標準型處理模組、該電源管理模組及該喇叭輸出模組電性連接。 The digital amplifier platform of claim 2, wherein the high power module comprises a first four channel high power extension unit and a second four channel high power extension unit, the first four channel high The power expansion unit is electrically connected to the pre-standard processing module, the power management module, and the speaker output module, and the second four-channel high power expansion unit and the pre-standard type The power module, the power management module and the speaker output module are electrically connected.

如申請專利範圍第2項所述之數位放大器平台，其中該前級發燒級型處理模組包含：一頻譜分析單元，其與該輸入模組及該前級標準型處理模組電性連接；以及一升級處理單元，其與該輸入模組及該前級標準型處理模組電性連接。 The digital amplifier platform of claim 2, wherein the pre-stage fever-type processing module comprises: a spectrum analysis unit electrically connected to the input module and the pre-standard processing module; And an upgrade processing unit electrically connected to the input module and the pre-standard processing module.

如申請專利範圍第1項所述之數位放大器平台，其中輸入模組包含一USB輸入端口，該USB輸入端口設置於該印刷電路板上。 The digital amplifier platform of claim 1, wherein the input module comprises a USB input port, and the USB input port is disposed on the printed circuit board.

如申請專利範圍第1項所述之數位放大器平台，其中該喇叭輸出模組包含一DSP串列輸出單元，該DSP串列輸出單元與該些功能插槽模組電性連接。 The digital amplifier platform of claim 1, wherein the speaker output module comprises a DSP serial output unit, and the DSP serial output unit is electrically connected to the function slot modules.

如申請專利範圍第1項所述之數位放大器平台，其中該前級標準型處理模組包含：一第一前級標準型處理單元，其與該些功能插槽模組與該輸入模組電性連接；以及一第二前級標準型處理單元，其與該些功能插槽模組與該輸入模組電性連接。 The digital amplifier platform of claim 1, wherein the pre-standard processing module comprises: a first pre-standard processing unit, and the functional slot module and the input module And a second pre-standard processing unit, and the functional slot module and the input module are electrically connected.