TWM515091U - Ultra thin type isothermal plate - Google Patents
Ultra thin type isothermal plate Download PDFInfo
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- TWM515091U TWM515091U TW104208132U TW104208132U TWM515091U TW M515091 U TWM515091 U TW M515091U TW 104208132 U TW104208132 U TW 104208132U TW 104208132 U TW104208132 U TW 104208132U TW M515091 U TWM515091 U TW M515091U
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Description
本創作係屬於散熱裝置的技術領域，尤指一種使用蝕刻工藝製成的微流道結構，以及特殊黏結方式所構成的超薄型均溫板結構，故能有效縮減其成型後的厚度。 The present invention belongs to the technical field of heat dissipating devices, and particularly relates to a micro-channel structure made by an etching process and an ultra-thin isothermal plate structure formed by a special bonding method, so that the thickness after molding can be effectively reduced.
按，由於近年來各項半導體產業的技術大幅提昇，各種如：中央處理器(Central Processing Unit,CPU)、圖形處理器(Graphics Processing Units,GPU)及高功率發光二極體晶片等電子元件之尺寸愈來愈小，但其使用時的發熱量卻愈來愈高、單位面積熱流密度也愈來愈大，為了維持該等電子元件於許可溫度之下運作，最常見的作法就是於該等電子元件上結合各種不同型式之散熱器進行散熱。 According to the recent advancement of various semiconductor industry technologies, such as: Central Processing Unit (CPU), Graphics Processing Units (GPU) and high-power LED chips and other electronic components. The smaller the size, the higher the heat generation and the higher the heat flux per unit area. The most common way to maintain the electronic components operating at the permissible temperature is to do so. The electronic components are combined with various types of heat sinks for heat dissipation.
均溫板係常見之一種二維方式結構設計的散熱器，而具有大面積、高熱傳導率、高熱傳能力、結構簡單、重量輕且不消耗電力等優點，非常符合該等電子元件的散熱需求。加上近年來電子產品有逐漸輕薄的趨勢，而增加了均溫板的應用範圍。請參閱第1圖，係為傳統均溫板的結構示意圖。如圖中所示，該均溫板1的結構主要係包括一殼體11、一毛細組織12及一工作流體13，其中該殼體11係包括一上板111及一下板112，該上板111及該下板112之周緣係透過沖壓而結合成一體，而該毛細組織12係佈設於殼體11(意即該上板111及該下板112相對之表面)之內表面，該毛細組織12常見使用的有金屬粉末(銅粉)燒結而成，並將該工作流體 13填注於該殼體11內。使用時，該殼體11接觸於該等電子元件發熱處係為蒸發區，未接觸該等電子元件處均為冷凝區，位於蒸發區之該工作流體13吸收熱量後而蒸發成為氣態，於該冷凝區冷卻並釋放出潛熱而回復成液態，透過該毛細組織12及重力導引該工作流體13回流至蒸發區，其功能及工作原理與熱導管一致，以其封閉於該殼體11中該工作流體13之蒸發凝結循環作動來達到快速散熱之功效。另外，於該上板111及該下板112之間還會增設有複數個導熱柱體113，期能提昇散熱效率及使用時的強度，間接還能提昇該殼體11組裝後的整體強度。 The uniform temperature plate is a common two-dimensional structure design radiator, which has the advantages of large area, high thermal conductivity, high heat transfer capacity, simple structure, light weight and no power consumption, which is in line with the heat dissipation requirements of the electronic components. . In addition, in recent years, electronic products have gradually become thinner and lighter, and the application range of the uniform temperature plate has been increased. Please refer to Figure 1 for a schematic diagram of the structure of a conventional temperature equalizing plate. As shown in the figure, the structure of the temperature equalizing plate 1 mainly comprises a casing 11, a capillary structure 12 and a working fluid 13, wherein the casing 11 comprises an upper plate 111 and a lower plate 112, the upper plate 111 and the periphery of the lower plate 112 are integrally joined by punching, and the capillary structure 12 is disposed on the inner surface of the casing 11 (that is, the surface opposite to the upper plate 111 and the lower plate 112), the capillary structure 12 commonly used metal powder (copper powder) sintered, and the working fluid 13 is filled in the casing 11. In use, the heat-generating portion of the casing 11 in contact with the electronic components is an evaporation zone, and the non-contacting of the electronic components is a condensation zone, and the working fluid 13 located in the evaporation zone absorbs heat and evaporates into a gaseous state. The condensing zone cools and releases latent heat to return to a liquid state, and the working fluid 13 is returned to the evaporation zone through the capillary structure 12 and gravity, and its function and working principle are consistent with the heat pipe, so that it is enclosed in the casing 11 The evaporative condensation cycle of the working fluid 13 is activated to achieve rapid heat dissipation. In addition, a plurality of heat-conducting columns 113 are added between the upper plate 111 and the lower plate 112 to improve the heat dissipation efficiency and the strength during use, and indirectly improve the overall strength of the casing 11 after assembly.
然，該毛細結構12為金屬粉末(銅粉)高溫燒結而成，金屬粉末的形狀複雜且高度不一，且必須具有良好的孔隙性以供該工作流體13流動；加上該上板111及該下板112進行接合時，係由邊緣進行接合，其通常使用厚度較厚之金屬板材，才能提高接合後的密接性；再者，該等金屬板材的厚度也必須足以支撐該等導熱柱體113，方能進行固定，故現有市面上的各式均溫板1的成型厚度都超過2.8mm，不僅會增加其使用重量，對於後續的加工成型也會有所影響，導致應用範圍大受限制。 The capillary structure 12 is formed by sintering a metal powder (copper powder) at a high temperature, and the metal powder has a complicated shape and a high degree of density, and must have good porosity for the flow of the working fluid 13; When the lower plate 112 is joined, it is joined by edges. Generally, a thick metal plate is used to improve the adhesion after bonding; in addition, the thickness of the metal plates must also be sufficient to support the heat-conducting columns. 113, can be fixed, so the existing thickness of the various types of uniform temperature plate 1 on the market is more than 2.8mm, which will not only increase the weight of its use, but also affect the subsequent processing and molding, resulting in a limited application range. .
有鑑於此，本創作之一目的，旨在提供一種超薄型均溫板製作方法，用以生產厚度係介於0.5mm~2.8mm之該超薄型均溫板，以供用來與一發熱元件相貼合而快速驅散其所產生的熱量，該超薄型均溫板製造流程係包括下列步驟：提供一第一板材、一第二板材、一黏合件、一填充管及一工作流體，其中該黏合件之表面係設有一第一金屬層；對該第一板材之一面進行加工而設有一第一流道，且該第一流道係呈交錯分佈；依序疊 合該第一板材、該黏合件、該填充管及該第二板材；熔化該第一金屬層以將該第一板材、該黏合件、該填充管及該第二板材黏合成一體，並於內部形成一容置空間；及填充該工作流體於該容置空間內，並將該容置空間加以封閉。 In view of this, one of the purposes of the present invention is to provide an ultra-thin isothermal plate manufacturing method for producing the ultra-thin isothermal plate having a thickness of 0.5 mm to 2.8 mm for use in heating. The ultra-thin isothermal plate manufacturing process comprises the steps of: providing a first plate, a second plate, an adhesive member, a filling tube and a working fluid, wherein the components are attached to each other to quickly dissipate the heat generated by the components. Wherein the surface of the adhesive member is provided with a first metal layer; a surface of the first plate is processed to provide a first flow path, and the first flow path is staggered; Combining the first plate, the bonding member, the filling tube and the second plate; melting the first metal layer to bond the first plate, the bonding member, the filling tube and the second plate together An accommodating space is formed inside; and the working fluid is filled in the accommodating space, and the accommodating space is closed.
於一實施例中，本創作之該超薄型均溫板製作方法，於「依序疊合該第一板材、該黏合件及該第二板材」的步驟之前，對該第二板材之一面進行加工而設有一第二流道，且該第二流道係同樣呈交錯分佈，該第一流道及該第二流道係呈相對設置。 In one embodiment, the method for fabricating the ultra-thin isothermal plate of the present invention is to face one of the second plates before the step of “stacking the first plate, the bonding member and the second plate in sequence” A second flow path is provided for processing, and the second flow path is also staggered, and the first flow path and the second flow path are oppositely disposed.
於一實施例中，本創作之該超薄型均溫板製作方法，於「依序疊合該第一板材、該黏合件及該第二板材」的步驟之前，更提供複數個導熱柱，且該導熱柱之外表面設有一第二金屬層，並將該等導熱柱設於該第一板材及該第二板材之間。 In one embodiment, the method for fabricating the ultra-thin isothermal plate of the present invention provides a plurality of thermally conductive columns before the step of “stacking the first plate, the bonding member and the second plate in sequence”. And a second metal layer is disposed on the outer surface of the heat conducting column, and the heat conducting columns are disposed between the first plate and the second plate.
於一實施例中，本創作之該超薄型均溫板製作方法，於「填充該工作流體於該容置空間內，並將該容置空間加以封閉」的過程中，係同步進行抽真空。 In one embodiment, the method for fabricating the ultra-thin isothermal plate of the present invention is to simultaneously perform vacuuming during the process of “filling the working fluid in the accommodating space and closing the accommodating space”. .
本創作之次一目的，旨在提供一種利用前述製造方法而製得之超薄型均溫板，俾採用了薄型化的板材及表面具有黏合用金屬層之黏合件結構，且該板材之內面係設有向內凹入之流道結構，據而有效縮減其組裝後的厚度，且能確保工作流體使用時的流動空間。 The second objective of the present invention is to provide an ultra-thin isothermal plate obtained by the above-mentioned manufacturing method, which adopts a thinned plate material and an adhesive structure having a metal layer for bonding on the surface, and the inside of the plate The surface is provided with an inwardly concave flow path structure, which effectively reduces the thickness of the assembled body and ensures the flow space when the working fluid is used.
本創作之再一目的，旨在提供一種超薄型均溫板，進一步使用了表面具有黏合用金屬層之複數個導熱柱，據而提高其導熱效果及組裝強度。 A further object of the present invention is to provide an ultra-thin isothermal plate, which further utilizes a plurality of thermally conductive columns having a metal layer for bonding on the surface, thereby improving the thermal conductivity and assembly strength.
本創作之又一目的，旨在提供一種超薄型均溫板，係於鄰近該等導熱柱及該等黏合件黏接處設有導流槽結構，以避免黏合時，呈熔融狀態之該等金屬層流入該流道內而影響散熱效果，故能夠有效提昇組裝時的良率。 Another object of the present invention is to provide an ultra-thin temperature-averaging plate which is provided with a guide groove structure adjacent to the heat-conducting column and the bonding portions of the bonding members to avoid the molten state. When the metal layer flows into the flow path and affects the heat dissipation effect, the yield during assembly can be effectively improved.
為達上述目的，本創作之該超薄型均溫板係包括：一第一板材，其一面係佈設有一第一流道，另一面係與該發熱元件相貼合，該第一流道係呈交錯分佈；一第二板材，設於該第一板材具有該第一流道之一側；一黏合件，設於該第一板材與該第二板材之間，該黏合件係對應該第一板材及該第二板材而形成之框圍狀結構體，該黏合件之表面係設有一第一金屬層，使該第一金屬層熔融後而分別黏合於該第一板材及該第二板材上，使該第一板材、該第二板材及該黏合件之內部形成有一容置空間；一填充管，設於該第一板材及該第二板材之間，且該填充管係與該容置空間相連通；及一工作流體，經該填充管而填充設於該容置空間內，該填充管於填充完畢後即封閉外開口，使該工作流體可於該第一流道進行流動。其中，該容置空間內部係於填充過程中同步抽真空。 In order to achieve the above object, the ultra-thin isothermal plate of the present invention comprises: a first plate having a first flow path on one side and a heat-fitting element on the other side, the first flow path being staggered a second plate disposed on the first plate having one side of the first flow path; an adhesive member disposed between the first plate and the second plate, the adhesive member corresponding to the first plate and a frame-shaped structure formed by the second plate, the surface of the bonding member is provided with a first metal layer, and the first metal layer is melted and adhered to the first plate and the second plate respectively, so that An accommodating space is formed in the first plate, the second plate and the adhesive member; a filling tube is disposed between the first plate and the second plate, and the filling pipe is connected to the accommodating space And a working fluid filled in the accommodating space via the filling tube, the filling tube closing the outer opening after filling, so that the working fluid can flow in the first flow channel. Wherein, the interior of the accommodating space is synchronously evacuated during the filling process.
其中，該第一金屬層係以電鍍、塗佈或化學方式設於該黏合件之表面，且該第一金屬層之材質係選自鎳、錫或銅其中之一者，經過加熱或其他至加工製程而能使其熔融後而作為黏合用途，以將該第一板材、該黏合件及該第二板材黏合成一體。 Wherein, the first metal layer is electroplated, coated or chemically disposed on the surface of the adhesive member, and the material of the first metal layer is selected from one of nickel, tin or copper, heated or otherwise The processing process can be melted and used as a bonding application to bond the first plate, the bonding member and the second plate together.
於一實施例中，本創作之該超薄型均溫板，更具有一第二流道，佈設於該第二板材之一面，使該第一流道與該第二流道相對，以提高其散熱效率。 In an embodiment, the ultra-thin isothermal plate of the present invention further has a second flow path disposed on one side of the second plate so that the first flow path is opposite to the second flow path to enhance Cooling efficiency.
於一實施例中，本創作之該超薄型均溫板，更具有複數個導熱柱，該等導熱柱之表面設有一第二金屬層，其熔融後而能將該等導熱柱之二端分別黏合於該第一板材及該第二板材之內表面。 In an embodiment, the ultra-thin isothermal plate of the present invention further has a plurality of heat conducting columns, and the surface of the heat conducting columns is provided with a second metal layer which is melted to be capable of the two ends of the heat conducting columns. Adhesively bonded to the inner surfaces of the first plate and the second plate, respectively.
另外，本創作之該第一流道及該第二流道係對應該黏合件及該等導熱柱，而分別設有複數個第一導流槽及複數個第二導流槽，以填置呈熔融狀態之該第一金屬層及該第二金屬層。 In addition, the first flow channel and the second flow channel of the present invention are corresponding to the adhesive member and the heat conducting columns, and a plurality of first guiding channels and a plurality of second guiding grooves are respectively provided for filling The first metal layer and the second metal layer in a molten state.
【習知】 [Practical]
1‧‧‧均溫板 1‧‧‧Wall plate
11‧‧‧殼體 11‧‧‧Shell
111‧‧‧上板 111‧‧‧Upper board
112‧‧‧下板 112‧‧‧ Lower board
113‧‧‧導熱柱體 113‧‧‧thermal column
12‧‧‧毛細組織 12‧‧‧Muscle tissue
13‧‧‧工作流體 13‧‧‧Working fluid
【本創作】 [This creation]
S1~S7-1‧‧‧步驟 S1~S7-1‧‧‧Steps
2‧‧‧超薄型均溫板 2‧‧‧Ultra-thin isothermal plate
21‧‧‧第一板材 21‧‧‧ first plate
211‧‧‧第一流道 211‧‧‧First runner
2111‧‧‧射線 2111‧‧‧ray
2112‧‧‧側線 2112‧‧‧ Sideline
2113‧‧‧第一導流槽 2113‧‧‧First guide channel
22‧‧‧第二板材 22‧‧‧Second plate
221‧‧‧第二流道 221‧‧‧Second runner
2211‧‧‧第二導流槽 2211‧‧‧Second guide channel
23‧‧‧黏合件 23‧‧‧Adhesive parts
231‧‧‧第一金屬層 231‧‧‧First metal layer
24‧‧‧填充管 24‧‧‧fill tube
25‧‧‧工作流體 25‧‧‧Working fluid
26‧‧‧導熱柱 26‧‧‧thermal column
261‧‧‧第二金屬層 261‧‧‧Second metal layer
3‧‧‧發熱元件件 3‧‧‧Fever element parts
第1圖，為傳統均溫板的結構示意圖。 Figure 1 is a schematic view showing the structure of a conventional temperature equalizing plate.
第2圖，為本創作較佳實施例的步驟流程圖。 Figure 2 is a flow chart showing the steps of the preferred embodiment of the present invention.
第3圖，為對應步驟S1的狀態示意圖。 Fig. 3 is a schematic diagram showing the state corresponding to step S1.
第4圖，為對應步驟S2的狀態示意圖。 Fig. 4 is a schematic view showing the state corresponding to step S2.
第5圖，為對應步驟S3的狀態示意圖。 Fig. 5 is a schematic view showing the state corresponding to step S3.
第6圖，為對應步驟S4的狀態示意圖。 Fig. 6 is a schematic diagram showing the state corresponding to step S4.
第7圖，為對應步驟S5的狀態示意圖。 Fig. 7 is a schematic diagram showing the state corresponding to step S5.
第8圖，為對應步驟S6的狀態示意圖。 Fig. 8 is a schematic view showing the state corresponding to step S6.
第9圖，為對應步驟S7及S7-1的狀態示意圖。 Figure 9 is a schematic diagram showing the states corresponding to steps S7 and S7-1.
第10圖，為本創作較佳實施例組裝後的剖視圖。 Figure 10 is a cross-sectional view of the preferred embodiment of the present invention assembled.
為使 貴審查委員能清楚了解本創作之內容，僅以下列說明搭配圖式，敬請參閱。 In order for your review board to have a clear understanding of the content of this creation, please refer to the following description only.
請參閱第2、3~9及10圖，係為本創作較佳實施例的步驟流程圖及對應各步驟的狀態示意圖，以及其組裝後的剖視圖。如圖 中所示，本創作係依據超薄型均溫板製作方法的操作步驟而製得一超薄型均溫板2，其操作步驟如下： Please refer to Figures 2, 3-9 and 10 for a flow chart of the steps of the preferred embodiment of the present invention and a schematic diagram of the state of the corresponding steps, and a cross-sectional view thereof after assembly. As shown As shown in the figure, the present invention produces an ultra-thin isothermal plate 2 according to the operation steps of the ultra-thin isothermal plate making method, and the operation steps are as follows:
S1：提供一第一板材21、一第二板材22、一黏合件23、一填充管24及一工作流體25，其中該黏合件23之表面係設有一第一金屬層231。應注意的是，該第一金屬層231係以電鍍、塗佈或化學方式設於該黏合件23之表面，且該第一金屬層231之材質係選自鎳、錫或銅其中之一者， S1: A first plate 21, a second plate 22, an adhesive member 23, a filling tube 24 and a working fluid 25 are provided. The surface of the bonding member 23 is provided with a first metal layer 231. It should be noted that the first metal layer 231 is plated, coated or chemically disposed on the surface of the adhesive member 23, and the material of the first metal layer 231 is selected from one of nickel, tin or copper. ,
S2：對該第一板材21之一面進行蝕刻而設有一第一流道211，且該第一流道211係呈交錯分佈。其中該第一流道211之形狀設計係以熱量最集中處向外放射狀發散有複數條射線2111，且該二相鄰之射線2111間並連接設有複數條側線2112，使該第一流道211係呈相互流通之態樣，但其形狀並不受限於此。 S2: etching a surface of the first plate member 21 to form a first flow path 211, and the first flow path 211 is staggered. The shape of the first flow path 211 is such that a plurality of rays 2111 are radiated outwardly at the most concentrated heat, and a plurality of side lines 2112 are connected between the two adjacent rays 2111, so that the first flow path 211 is connected. The system is in a state of mutual circulation, but its shape is not limited to this.
S3：對該第二板材22之一面進行蝕刻而設有一第二流道221，且該第二流道221係呈交錯分佈，該第一流道211及該第二流道221係呈相對設置。其中該第二流道221之形狀設計係與該第一流道211相同，故於此不再多加贅述。應注意的是，本創作之較佳實施例之該第一流道211及該第二流道221係採用物理蝕刻或化學蝕刻等方式而製成，亦可以其他機械加工如：雷射雕刻等方式而製成，故應不以此為限。 S3: etching a surface of the second plate 22 to form a second flow path 221, wherein the second flow path 221 is staggered, and the first flow path 211 and the second flow path 221 are oppositely disposed. The shape design of the second flow path 221 is the same as that of the first flow path 211, and thus no further details are provided herein. It should be noted that the first flow channel 211 and the second flow channel 221 of the preferred embodiment of the present invention are formed by physical etching or chemical etching, and may be processed by other mechanical processes such as laser engraving. It is made, so it should not be limited to this.
S4：提供複數個導熱柱26，且該導熱柱26之表面設有一第二金屬層261。其中之該第二金屬層261係與該第一金屬層231一樣，係以電鍍、塗佈或化學方式設於該等導熱柱26之表面，且其材 質同樣選自鎳、錫或銅其中之一者。 S4: A plurality of heat conducting columns 26 are provided, and a surface of the heat conducting columns 26 is provided with a second metal layer 261. The second metal layer 261 is formed on the surface of the heat conducting columns 26 by electroplating, coating or chemically, similarly to the first metal layer 231. The quality is also selected from one of nickel, tin or copper.
S5：依序疊合該第一板材21、該黏合件23、該填充管24及該第二板材22，並將該等導熱柱26設於該第一板材及該第二板材之間。其中，係將該第一板材21具有該第一流道211之一面朝上，依序疊合該黏合件23、該填充管24及該等導熱柱26，最後再將該第二板材22蓋合於最上方，使該黏合件23、該填充管24及該等導熱柱26被夾設於該第一板材21及該第二板材22之間。 S5: The first plate 21, the adhesive member 23, the filling tube 24 and the second plate 22 are sequentially stacked, and the heat conducting columns 26 are disposed between the first plate and the second plate. Wherein, the first plate 21 has one of the first flow channels 211 facing upward, and the adhesive member 23, the filling tube 24 and the heat conducting columns 26 are sequentially laminated, and finally the second plate 22 is covered. In the uppermost portion, the adhesive member 23, the filling tube 24 and the heat conducting columns 26 are interposed between the first plate member 21 and the second plate member 22.
S6：熔化該第一金屬層231及該第二金屬層261，以將該第一板材21、該黏合件23、該填充管24、該等導熱柱26及該第二板材22合成一體，並於內部形成一容置空間。由於該第一金屬層231及該第二金屬層261之熔點係低於該第一板材21、該黏合件23及該第二板材22，經過加溫或是施加高能量之後，可使該第一金屬層231及該第二金屬層261熔化並呈現熔融狀態，以供填充於該第一板材21、該第二板材22、該黏合件23及該等導熱柱26等之縫隙間，待回復常溫後隨即能夠發揮固定之效果，而達到黏合之功效。應注意的是，為了避免該等第一金屬層231及該第二金屬層261於熔融狀態時，流入該第一流道211及該第二流道221內而造成堵塞，故於該第一流道211及該第二流道221內係對應該導熱柱之位置，分別設有複數個第一導流槽2113及複數個第二導流槽2211，以填置呈熔融狀態之該第一金屬層231及該第二金屬層261。 S6: melting the first metal layer 231 and the second metal layer 261 to integrate the first plate 21, the bonding member 23, the filling tube 24, the heat conducting columns 26 and the second plate 22, and Form an accommodation space inside. Since the melting points of the first metal layer 231 and the second metal layer 261 are lower than the first plate 21, the bonding member 23 and the second plate 22, the heating may be performed after heating or applying high energy. A metal layer 231 and the second metal layer 261 are melted and in a molten state for filling between the gaps of the first plate 21, the second plate 22, the adhesive member 23, and the heat transfer columns 26, etc. Immediately after the normal temperature, the effect of fixation can be exerted to achieve the effect of bonding. It should be noted that, in order to prevent the first metal layer 231 and the second metal layer 261 from flowing into the first flow channel 211 and the second flow channel 221 when the first metal layer 231 and the second metal layer 261 are in a molten state, the first flow channel is blocked. 211 and the second flow channel 221 are respectively disposed at positions corresponding to the heat conducting columns, and a plurality of first guiding channels 2113 and a plurality of second guiding grooves 2211 are respectively disposed to fill the first metal layer in a molten state. 231 and the second metal layer 261.
S7：填充該工作流體25於該容置空間內，並將該容置空間加以封閉。透過該填充管24以將該工作流體25注入該容置空間內， 最後再將該填充管24之管口予以封閉。 S7: filling the working fluid 25 in the accommodating space, and closing the accommodating space. The working fluid 25 is injected into the accommodating space through the filling tube 24, Finally, the nozzle of the filling tube 24 is closed.
S7-1：同步進行抽真空。於填充該工作流體25的同時，透過該填充管24而將該容置空間抽真空，使該工作流體25之沸點得以降低，而能進一步提昇散熱效率。 S7-1: Vacuuming is performed simultaneously. While filling the working fluid 25, the accommodating space is evacuated through the filling tube 24, so that the boiling point of the working fluid 25 is lowered, and the heat dissipation efficiency can be further improved.
如第10圖所示，本創作之超薄型均溫板2係包括該第一板材21、該第二板材22、該黏合件23、該填充管24、該工作流體25及該等導熱柱26，經過上述製作方法之步驟後而完成。 As shown in FIG. 10, the ultra-thin isothermal plate 2 of the present invention includes the first plate 21, the second plate 22, the adhesive member 23, the filling tube 24, the working fluid 25, and the heat-conducting columns. 26, after the steps of the above production method are completed.
其中該第一板材21係採用銅金屬而製成，該第一板材21之一面係佈設有一第一流道211，另一面係與該發熱元件3相貼合，該第一流道211係呈交錯分佈。 The first plate 21 is made of copper metal. One of the first plates 21 is provided with a first flow path 211, and the other surface is attached to the heating element 3. The first flow path 211 is staggered. .
該第二板材22同樣係以銅金屬而製成，該第二板材22係相對設於該第一板材21具有該第一流道211之一側。 The second plate 22 is also made of copper metal, and the second plate 22 is opposite to the first plate 21 and has one side of the first flow path 211.
該黏合件23係設於該第一板材21與該第二板材22之間，該黏合件23係對應該第一板材21及該第二板材22之外輪廓而形成之框圍狀結構體，且該黏合件23之表面係設有一第一金屬層231(此時該第一金屬層231之材質不為銅)，該第一金屬層231經過加熱後形成熔融狀態，以供分別黏合於該第一板材21及該第二板材22之一面上，使該第一板材21、該第二板材22及該黏合件23之內部形成有一容置空間(圖中未標號)。 The adhesive member 23 is disposed between the first plate member 21 and the second plate member 22. The adhesive member 23 is a frame-shaped structure corresponding to the outer contour of the first plate member 21 and the second plate member 22. The surface of the adhesive member 23 is provided with a first metal layer 231 (the material of the first metal layer 231 is not copper), and the first metal layer 231 is heated to form a molten state for bonding to the first metal layer 231. On one side of the first plate 21 and the second plate 22, an accommodating space (not shown) is formed in the interior of the first plate 21, the second plate 22, and the bonding member 23.
該填充管24係連同該黏合件23一併設於該第一板材21及該第二板材22之間，且受到該黏合件23之固定效果而一併固定於其間；該填充管24並與該容置空間相連通。 The filling tube 24 is disposed together with the adhesive member 23 between the first plate member 21 and the second plate member 22, and is fixed together by the fixing effect of the bonding member 23; the filling tube 24 is coupled thereto. The accommodation space is connected.
該工作流體25係透過填充管24而填充設於該容置空間內，該填充管24於填充完畢後即封閉外開口，使該工作流體25可於該容置空間及該第一流道211進行流動。 The working fluid 25 is filled in the accommodating space through the filling tube 24, and the filling tube 24 closes the outer opening after the filling is completed, so that the working fluid 25 can be performed in the accommodating space and the first flow path 211. flow.
該等導熱柱26係以導熱係數良好之金屬材質而製成之圓柱體，其形狀並不受限於圓柱狀形體，亦可為其他形狀之柱狀體或管體等，該等導熱柱26係設於該容置空間內，且該等導熱柱26之表面設有一第二金屬層261，其熔融後而能將其二端分別黏合於該第一板材21及該第二板材22之內表面。 The heat transfer columns 26 are cylindrical bodies made of a metal material having a good thermal conductivity, and the shape thereof is not limited to a cylindrical shape, and may be a columnar body or a tube body of other shapes, and the heat transfer columns 26 may be used. The surface of the heat-conducting column 26 is provided with a second metal layer 261 which is melted to bond the two ends thereof to the first plate 21 and the second plate 22, respectively. surface.
唯，以上所述者，僅為本創作之較佳實施例而已，並非用以限定本創作實施之範圍，故該所屬技術領域中具有通常知識者，或是熟悉此技術所作出等效或輕易的變化者，在不脫離本創作之精神與範圍下所作之均等變化與修飾，皆應涵蓋於本創作之專利範圍內。 However, the above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, it is common knowledge in the technical field or equivalent or easy to be familiar with the technology. The changes and modifications made by the changer without departing from the spirit and scope of this creation shall be covered by the scope of this creation.
21‧‧‧第一板材 21‧‧‧ first plate
2113‧‧‧第一導流槽 2113‧‧‧First guide channel
22‧‧‧第二板材 22‧‧‧Second plate
2211‧‧‧第二導流槽 2211‧‧‧Second guide channel
23‧‧‧黏合件 23‧‧‧Adhesive parts
231‧‧‧第一金屬層 231‧‧‧First metal layer
26‧‧‧導熱柱 26‧‧‧thermal column
261‧‧‧第二金屬層 261‧‧‧Second metal layer
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104208132U TWM515091U (en) | 2012-11-16 | 2012-11-16 | Ultra thin type isothermal plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104208132U TWM515091U (en) | 2012-11-16 | 2012-11-16 | Ultra thin type isothermal plate |
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| Publication Number | Publication Date |
|---|---|
| TWM515091U true TWM515091U (en) | 2016-01-01 |
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| Application Number | Title | Priority Date | Filing Date |
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