TWM511111U - Magnetic core inductor - Google Patents
Magnetic core inductor Download PDFInfo
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- TWM511111U TWM511111U TW104210227U TW104210227U TWM511111U TW M511111 U TWM511111 U TW M511111U TW 104210227 U TW104210227 U TW 104210227U TW 104210227 U TW104210227 U TW 104210227U TW M511111 U TWM511111 U TW M511111U
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Description
本新型是有關於一種電感器，特別是指一種磁芯電感器。The present invention relates to an inductor, and more particularly to a magnetic core inductor.
目前市面上的電感器，主要可分為薄膜式(thin film)、積層式(multilayer)及繞線式(wire wound)。如台灣第TWI430300證書號發明專利案(以下稱前案1)所公開的一種積層式電感器(圖未示)，其包含複數絕緣層與複數線圈圖案層，且該等絕緣層與該等線圈圖案層是彼此交替地疊置而成，其透過彼此疊置而成的該等絕緣層與該等線圈圖案層以分別定義出該積層式電感器的一主體與一線圈。Currently, inductors on the market are mainly classified into thin film, multilayer, and wire wound. A laminated inductor (not shown) disclosed in the TWI430300 certificate number invention patent (hereinafter referred to as the first case 1) of Taiwan, which comprises a plurality of insulating layers and a plurality of coil pattern layers, and the insulating layers and the coils The pattern layers are alternately stacked one on another, and the insulating layers and the coil pattern layers are stacked to define a body and a coil of the laminated inductor, respectively.
詳細地來說，該前案1之積層式電感器是將各線圈圖案層對應鍍製於各絕緣層上；其中，各絕緣層上所鍍製的各線圈圖案層，只圍繞該積層式電感器之一軸線的1+7/8圈，且各線圈圖案層於其一內端部及其一外端部尚需透過其所對應之絕緣層之位處於各線圈圖案層之內端部與外端部的兩貫孔及兩填置於其貫孔內之內連線，來分別與其下方之絕緣層上的線圈圖案層之內端部及其上方之絕緣層上的線圈圖案層之外端部導通。此外，以各鍍製有線圈圖案層之絕緣層的製作程序來看，其皆需經過鍍線圈圖案層程序、貫孔程序、線圈端部導通程序等三道程序。換句 話說，當該積層式電感器的線圈所需匝數高達10圈時，該積層式電感器的製作方法則需交互地疊置達六層鍍製有各線圈圖案層的絕緣層，且總程序也多達十八道。因此，前案1的製作程序相當繁瑣。In detail, the laminated inductor of the first embodiment 1 is correspondingly plated on each of the insulating layers; wherein each of the coil pattern layers plated on each of the insulating layers surrounds only the laminated inductor. 1+7/8 turns of one of the axes of the coil, and each of the coil pattern layers at its inner end and one of its outer ends still need to pass through the corresponding insulating layer at the inner end of each coil pattern layer Two through holes of the outer end portion and two inner wires filled in the through holes thereof, respectively, outside the inner end portion of the coil pattern layer on the insulating layer below and the coil pattern layer on the insulating layer above the insulating layer The end is turned on. In addition, in the production procedure of the insulating layer in which the coil pattern layer is plated, it is necessary to pass through three procedures of a coil pattern layer program, a through hole program, and a coil end conduction program. Change sentence In other words, when the number of turns required for the coil of the laminated inductor is up to 10 turns, the method of fabricating the laminated inductor needs to alternately stack up to six layers of the insulating layer coated with each coil pattern layer, and the total procedure There are also as many as eighteen. Therefore, the production process of the previous case 1 is rather cumbersome.
為了進一步簡化積層式電感器的主體形成程序 ，如台灣第TW 201440090 A早期公開號發明專利案(以下稱前案2)則是公開的另一種積層式磁芯電感器1(magnetic-core inductor，見圖1)及其製造方法(見圖2至圖7)。該積層式磁芯電感器1的製造方法，包含以下步驟：(A)由下而上依序積層壓接一第一電路陶瓷母片110、一第二電路陶瓷母片120、一第三電路陶瓷母片130，及一第四電路陶瓷母片140(如圖2所示)；(B)令一表面塗佈有一焊墊電極(bonding pad)1501陣列的載膜150，面向該第一電路陶瓷母片110的一第一預定電路圖案1120陣列設置(如圖3所示)；(C)將該焊墊電極1501陣列轉印至該第一電路陶瓷母片110上的第一預定電路圖案1120陣列從而構成一第一電路圖案112陣列(如圖4所示)；(D)剝離該載膜150(如圖5所示)；(E)燒結該等電路陶瓷母片110、120、130、140以構成一集合基板100(如圖6所示)，且該集合基板100的厚度是控制在0.6mm以下；及(F)以一刻劃具160對該集合基板100施予刻劃，令該集合基板100被分割成多數個積層體10，且令集合基板100內的第一電路圖案112陣列被分割成多數個第一電路圖案112並構成如圖1所示的積層式磁芯電感器1。In order to further simplify the main body forming procedure of the laminated inductor For example, Taiwan's TW 201440090 A early publication invention patent case (hereinafter referred to as the previous case 2) is another disclosed magnetic-core inductor (see FIG. 1) and its manufacturing method (see FIG. 2 to Figure 7). The manufacturing method of the laminated core inductor 1 comprises the following steps: (A) sequentially laminating a first circuit ceramic mother chip 110, a second circuit ceramic mother chip 120, and a third circuit from bottom to top. a ceramic mother chip 130, and a fourth circuit ceramic mother chip 140 (shown in FIG. 2); (B) a surface coated with a carrier film 150 of an array of bonding pads 1501 facing the first circuit A first predetermined circuit pattern 1120 of the ceramic mother substrate 110 is arranged in an array (as shown in FIG. 3); (C) an array of the pad electrode 1501 is transferred to the first predetermined circuit pattern on the first circuit ceramic mother substrate 110. The array of 1120 thus constitutes an array of first circuit patterns 112 (as shown in FIG. 4); (D) stripping the carrier film 150 (as shown in FIG. 5); (E) sintering the circuit ceramic master chips 110, 120, 130 , 140 to form a collective substrate 100 (as shown in FIG. 6), and the thickness of the collective substrate 100 is controlled to be less than 0.6 mm; and (F) to scribe the collective substrate 100 with a scribing tool 160, The collective substrate 100 is divided into a plurality of laminated bodies 10, and the array of first circuit patterns 112 in the collective substrate 100 is divided into a plurality of first circuit patterns. 112 and constitutes a laminated core inductor 1 as shown in FIG.
如圖1所示，經該步驟(F)所刻劃出的該積層式 磁芯電感器1由下而上依序包含：一第一電路陶瓷片11、一第二電路陶瓷片12、一第三電路陶瓷片13，及一第四電路陶瓷片14。該第一電路陶瓷片11具有一非磁性體111，及該配置於該第一電路陶瓷片11之非磁性體111中的第一電路圖案112。該第二電路陶瓷片12與該第三電路陶瓷片13分別具有一磁性體121、131，及一分別配置於其磁性體121、131中的第二電路圖案122與第三電路圖案132。該第四電路陶瓷片14具有一非磁性體141，及一配置於該第四電路陶瓷片14之非磁性體141中的第四電路圖案142。As shown in FIG. 1, the laminated layer engraved by the step (F) The core inductor 1 includes a first circuit ceramic piece 11, a second circuit ceramic piece 12, a third circuit ceramic piece 13, and a fourth circuit ceramic piece 14 in order from bottom to top. The first circuit ceramic piece 11 has a non-magnetic body 111 and a first circuit pattern 112 disposed in the non-magnetic body 111 of the first circuit ceramic piece 11. The second circuit ceramic piece 12 and the third circuit ceramic piece 13 respectively have a magnetic body 121, 131, and a second circuit pattern 122 and a third circuit pattern 132 respectively disposed in the magnetic bodies 121, 131 thereof. The fourth circuit ceramic piece 14 has a non-magnetic body 141 and a fourth circuit pattern 142 disposed in the non-magnetic body 141 of the fourth circuit ceramic piece 14.
該積層式磁芯電感器1是利用該等電路陶瓷片 11、12、13、14的電路圖案112、122、132、142以共同構成一內繞式的線圈，並配合該等磁性體121、131以形成該積層式磁芯電感器1的一磁芯。然而，詳細地來說，於執行該步驟(A)之前，是分別依序對多數陶瓷母片(圖未示)貫孔以於各陶瓷母片形成多數通孔、於各通孔內填置導電糊以形成多數導通導體，以及在各陶瓷母片上塗置導電糊以形成各電路圖案112、122、132、142等多道程序，才可製得各電路陶瓷母片110、120、130、140。此外，在執行完該步驟(E)的燒結處理與該步驟(F)之刻畫後才可取得各積層式磁芯電感器1之積層體10的外觀面。The laminated core inductor 1 utilizes the circuit ceramic pieces The circuit patterns 112, 122, 132, and 142 of 11, 12, 13, and 14 together form an inner winding type coil, and cooperate with the magnetic bodies 121 and 131 to form a magnetic core of the laminated core inductor 1. . However, in detail, before performing this step (A), a plurality of ceramic mother sheets (not shown) are sequentially formed to form a plurality of through holes for each ceramic mother sheet, and are filled in the respective through holes. The conductive paste is used to form a plurality of conductive conductors, and a conductive paste is applied on each of the ceramic mother sheets to form a plurality of circuits such as circuit patterns 112, 122, 132, and 142, so that the circuit ceramic mother sheets 110, 120, and 130 can be obtained. 140. Further, the appearance surface of the laminated body 10 of each laminated core inductor 1 can be obtained after the sintering process of the step (E) and the drawing of the step (F) are performed.
就製程面來說，構成該內繞式的線圈需經過四 道的貫孔程序、四道的填置導電糊程序、四道的塗佈導電糊以形成各電路圖案112、122、132、142程序，與一道步 驟(E)之燒結處理等十三道程序，前案2的程序雖然略較該前案1簡化；然而，該前案2的總程序也多達十三道，相當繁瑣，導致製造所需耗費的時間成本提升。就實際應用面來說，因為積層體10是經堆疊燒結該等電路陶瓷母片110、120、130、140並施予刻劃後所取得，使該積層式磁芯電感器1體積(最大厚度達0.6mm)也隨之提高，而不利於安排至電路板上的布局。除此之外，由於該內繞式線圈是由各電路陶瓷片11、12、13、14的電路圖案112、122、132、142所構成，各電路圖案112、122、132、142間之非連續的界面易產生非歐姆式接觸(non-ohmic contact)或增加阻抗而產生額外的電熱效應(Joule-heating)，皆不利於電感器的運作。In terms of the process surface, the coils that make up the inner winding need to go through four The through hole program of the track, the four-way filling of the conductive paste program, and the four-way application of the conductive paste to form the circuit patterns 112, 122, 132, and 142, and a step The thirteen procedures of the sintering process of (E), the procedure of the previous case 2 is slightly simplified compared to the previous case 1; however, the total procedure of the previous case 2 is as many as thirteen, which is quite cumbersome and leads to manufacturing requirements. The cost of time is increased. As far as the practical application is concerned, since the laminated body 10 is obtained by stacking and sintering the circuit ceramic mother sheets 110, 120, 130, and 140, the laminated core inductor 1 volume (maximum thickness) is obtained. Up to 0.6mm) is also improved, which is not conducive to the layout on the board. In addition, since the inner wound coil is composed of circuit patterns 112, 122, 132, and 142 of the circuit ceramic sheets 11, 12, 13, and 14, the circuit patterns 112, 122, 132, and 142 are different. Continuous interfaces tend to produce non-ohmic contacts or increase impedance to create additional Joule-heating, which is detrimental to the operation of the inductor.
經上述說明可知，簡化電感器的製作方法以降 低製作成本的同時，並解決電感器之阻抗過高的問題，是此技術領域的相關技術人員所待突破的難題。According to the above description, the simplified inductor manufacturing method can be reduced. The problem of low production cost and solving the problem of excessive impedance of the inductor is a problem to be solved by those skilled in the technical field.
因此，本新型之目的，即在提供一種磁芯電感器。Therefore, the object of the present invention is to provide a magnetic core inductor.
於是，本新型磁芯電感器包含：一主體與一第一線圈。該主體具有一輪廓面，該主體之輪廓面包括相反設置的一第一側緣及一第二側緣。該主體是由一磁性材料所構成，且為一體(unity)者。該第一線圈設置於該主體，並包括複數頂部段、複數縱部段，及複數底部段。該等頂部段、該等縱部段與該等底部段是沿一自該主體之該第一 側緣朝該第二側緣的第一方向彼此間隔排列。該等頂部段與該等底部段是分別設置於該主體的輪廓面之一頂面區與一底面區，且各頂部段是透過其相鄰之兩縱部段的相反兩端緣沿該第一方向以與各底部段依序電性連接。Thus, the novel magnetic core inductor comprises: a main body and a first coil. The body has a contoured surface, and the contoured surface of the body includes a first side edge and a second side edge disposed oppositely. The body is composed of a magnetic material and is unity. The first coil is disposed on the body and includes a plurality of top segments, a plurality of vertical segments, and a plurality of bottom segments. The top segment, the vertical segments, and the bottom segments are along the first from the body The side edges are spaced apart from each other in a first direction toward the second side edge. The top segment and the bottom segment are respectively disposed on a top surface region and a bottom surface region of the contour surface of the main body, and each of the top segments is opposite to the opposite end edges of the two longitudinal portions adjacent thereto One direction is electrically connected to each bottom segment in sequence.
2‧‧‧磁芯電感器2‧‧‧Magnetic core inductor
20‧‧‧基板20‧‧‧Substrate
200‧‧‧基座200‧‧‧Base
201‧‧‧上表面201‧‧‧ upper surface
202‧‧‧下表面202‧‧‧lower surface
203‧‧‧輪廓面203‧‧‧ contour surface
204‧‧‧第一側緣204‧‧‧First side edge
205‧‧‧第二側緣205‧‧‧second side edge
21‧‧‧主體21‧‧‧ Subject
210‧‧‧輪廓面210‧‧‧ contour surface
2101‧‧‧頂面區2101‧‧‧Top area
2102‧‧‧底面區2102‧‧‧Bottom area
2103‧‧‧左側面區2103‧‧‧Left area
2104‧‧‧右側面區2104‧‧‧ right side area
2105‧‧‧前面區2105‧‧‧ front area
2106‧‧‧背面區2106‧‧‧Back area
211‧‧‧第一側緣211‧‧‧ first side edge
212‧‧‧第二側緣212‧‧‧Second side edge
213‧‧‧溝槽213‧‧‧ trench
214‧‧‧穿孔214‧‧‧Perforation
22‧‧‧連接部22‧‧‧Connecting Department
220‧‧‧輪廓面220‧‧‧ contour surface
221‧‧‧第一端221‧‧‧ first end
222‧‧‧第二端222‧‧‧ second end
2221‧‧‧凹槽2221‧‧‧ Groove
23‧‧‧第一線圈23‧‧‧First coil
231‧‧‧頂部段231‧‧‧Top section
232‧‧‧縱部段232‧‧‧Longitudinal section
233‧‧‧底部段233‧‧‧ bottom section
24‧‧‧絕緣層24‧‧‧Insulation
25‧‧‧第二線圈25‧‧‧second coil
3‧‧‧第一光阻層3‧‧‧First photoresist layer
31‧‧‧預定圖案31‧‧‧Prescribed pattern
310‧‧‧外觀形狀310‧‧‧ appearance shape
311‧‧‧基座部311‧‧‧Base section
312‧‧‧橋接部312‧‧ ‧Bridge
3121‧‧‧缺口3121‧‧ ‧ gap
313‧‧‧本體部313‧‧‧ Body Department
3131‧‧‧缺口3131‧‧ ‧ gap
3132‧‧‧孔洞3132‧‧‧ hole
4‧‧‧第一前驅物層4‧‧‧First precursor layer
41‧‧‧局部區域41‧‧‧Local area
5‧‧‧第二光阻層5‧‧‧Second photoresist layer
51‧‧‧線路圖案區51‧‧‧Line pattern area
6‧‧‧第一金屬層6‧‧‧First metal layer
7‧‧‧第二前驅物層7‧‧‧Second precursor layer
71‧‧‧局部區域71‧‧‧Local area
8‧‧‧第三光阻層8‧‧‧ Third photoresist layer
81‧‧‧線路圖案區81‧‧‧Line pattern area
9‧‧‧第二金屬層9‧‧‧Second metal layer
X‧‧‧第一方向X‧‧‧ first direction
Y‧‧‧第二方向Y‧‧‧second direction
本新型之其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中：圖1是一立體分解圖，說明由台灣第TW 201440090 A早期公開號發明專利案所公開的一種積層式電感器；圖2是一截面圖，說明該積層式電感器的製造方法的一步驟(A)；圖3是一截面圖，說明該積層式電感器的製造方法的一步驟(B)；圖4是一截面圖，說明該積層式電感器的製造方法的一步驟(C)；圖5是一截面圖，說明該積層式電感器的製造方法的一步驟(D)；圖6是一截面圖，說明該積層式電感器的製造方法的一步驟(E)；圖7是一截面圖，說明該積層式電感器的製造方法的一步驟(F)；圖8是一立體示意圖，說明本新型磁芯電感器的一第一實施例；圖9是一立體示意圖，說明本新型磁芯電感器的一第二 實施例；圖10是一立體示意圖，說明本新型磁芯電感器的一第三實施例；圖11是一立體示意圖，說明本新型磁芯電感器的一第四實施例；圖12是一沿圖11的直線X Ⅱ-X Ⅱ所取得的剖視示意圖；圖13是一俯視示意圖，說明一第一量產方法之一步驟(a1)；圖14是一沿圖13的直線XIV-XIV所取得的剖視示意圖；圖15是一俯視示意圖，說明該第一量產方法之一步驟(b1)；圖16是一沿圖15的直線XVI-XVI所取得的剖視示意圖；圖17是一俯視示意圖，說明該第一量產方法的一步驟(c1)；圖18是一立體示意圖，說明該第一量產方法的一步驟(d1)；圖19是一立體示意圖，說明該第一量產方法的一步驟(e1)；圖20是一立體示意圖，說明該第一量產方法的一步驟(f1)；圖21是一立體示意圖，說明該第一量產方法的一步驟 (h1)；圖22是一俯視示意圖，說明該第一量產方法的一步驟(g1)；圖23是一俯視示意圖，說明本新型磁芯電感器之一第二量產方法之一步驟(a1)；圖24是一俯視示意圖，說明本新型磁芯電感器之一第三量產方法之一步驟(a1)；圖25是一立體示意圖，說明本新型磁芯電感器之一第四量產方法之一步驟(i11)；圖26是一立體示意圖，說明該第四量產方法的一步驟(i12)；圖27是一立體示意圖，說明該第四量產方法的一步驟(i13)；圖28是一立體示意圖，說明該第四量產方法的一步驟(i14)；圖29是一立體示意圖，說明本新型磁芯電感器的預形體之一第五量產方法之一步驟(a2)的一模具；圖30是一剖視示意圖，說明該第五量產方法的該步驟(a2)；及圖31是一剖視示意圖，說明該量產方法的第五實施例之一步驟(b2)。Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is an exploded perspective view showing a layer disclosed by the Taiwan Patent Publication No. TW 201440090 A. Figure 2 is a cross-sectional view showing a step (A) of the method of manufacturing the laminated inductor; Figure 3 is a cross-sectional view showing a step (B) of the method of manufacturing the laminated inductor; 4 is a cross-sectional view showing a step (C) of the method of manufacturing the laminated inductor; FIG. 5 is a cross-sectional view showing a step (D) of the method of manufacturing the laminated inductor; FIG. 7 is a cross-sectional view showing a step (F) of the manufacturing method of the laminated inductor; FIG. 8 is a perspective view showing a step (F) of the manufacturing method of the laminated inductor; A first embodiment of the novel magnetic core inductor; FIG. 9 is a perspective view showing a second of the novel magnetic core inductor FIG. 10 is a perspective view showing a third embodiment of the novel magnetic core inductor; FIG. 11 is a perspective view showing a fourth embodiment of the novel magnetic core inductor; Figure 11 is a schematic cross-sectional view taken along line X II-X II; Figure 13 is a top plan view showing one of the first mass production methods (a1); Figure 14 is a line along line XIV-XIV of Figure 13 FIG. 15 is a top plan view showing one step (b1) of the first mass production method; FIG. 16 is a cross-sectional view taken along line XVI-XVI of FIG. 15; FIG. FIG. 18 is a perspective view showing a step (d1) of the first mass production method; FIG. 19 is a perspective view showing the first amount; a step (e1) of the production method; Fig. 20 is a perspective view showing a step (f1) of the first mass production method; and Fig. 21 is a perspective view showing a step of the first mass production method (h1); FIG. 22 is a top plan view illustrating a first step (g1) of the first mass production method; FIG. 23 is a top plan view showing one of the steps of the second mass production method of the novel magnetic core inductor ( A1); FIG. 24 is a top plan view showing one step (a1) of a third mass production method of the novel magnetic core inductor; FIG. 25 is a perspective view showing a fourth quantity of the novel magnetic core inductor One step (i11) of the production method; FIG. 26 is a perspective view showing a step (i12) of the fourth mass production method; FIG. 27 is a perspective view showing a step (i13) of the fourth mass production method 28 is a perspective view showing a step (i14) of the fourth mass production method; and FIG. 29 is a perspective view showing one step of the fifth mass production method of the preform of the novel magnetic core inductor ( FIG. 30 is a cross-sectional view showing the step (a2) of the fifth mass production method; and FIG. 31 is a cross-sectional view showing a step of the fifth embodiment of the mass production method. (b2).
在本新型被詳細描述之前，應當注意在以下的說明內容中，類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.
參閱圖8，本新型磁芯電感器2的一第一實施例，包含一主體21與一第一線圈23。Referring to FIG. 8, a first embodiment of the novel magnetic core inductor 2 includes a main body 21 and a first coil 23.
該主體21具有一輪廓面210，該主體21之輪廓面210包括相反設置的一第一側緣211及一第二側緣212。該主體21是由一磁性材料所構成，且為一體者。The body 21 has a contoured surface 210. The contoured surface 210 of the body 21 includes a first side edge 211 and a second side edge 212 disposed oppositely. The main body 21 is made of a magnetic material and is integrated.
該第一線圈23設置於該主體21，並包括複數頂部段231、複數縱部段232，及複數底部段233。該等頂部段231、該等縱部段232與該等底部段233是沿一自該主體21之該第一側緣211朝該第二側緣212的第一方向X彼此間隔排列。該等頂部段231與該等底部段233是分別設置於該主體21的輪廓面210之一頂面區2101與一底面區2102，且各頂部段231是透過其相鄰之兩縱部段232的相反兩端緣沿該第一方向X以與各底部段233依序電性連接。The first coil 23 is disposed on the main body 21 and includes a plurality of top sections 231, a plurality of vertical sections 232, and a plurality of bottom sections 233. The top section 231, the longitudinal sections 232 and the bottom sections 233 are spaced apart from each other along a first direction X from the first side edge 211 of the body 21 toward the second side edge 212. The top section 231 and the bottom sections 233 are respectively disposed on one of the top surface area 2101 and the bottom surface area 2102 of the contour surface 210 of the main body 21, and each of the top sections 231 is through two adjacent vertical sections 232. The opposite end edges are electrically connected to the respective bottom segments 233 in the first direction X.
更具體地來說，在本新型該第一實施例中，該主體21的輪廓面210是由如圖8所示之該主體21的該頂面區2101、該底面區2102、一左側面區2103、一右側面區2104、一前面區2105與一背面區2106所共同定義而成。又，在本新型該第一實施例中，該第一線圈23之該等頂部段231、該等縱部段232與該等底部段233是如圖8所示，分別沿一與該第一方向夾一小於等於90度的延伸方向延伸，且該第一線圈23的該等縱部段232是分別設置於該前面區2105與該背面區2106；也就是說，本新型磁芯電感器之該第一實施例的第一線圈23為一外繞式線圈。此外，該主 體21是由該磁性材料所構成，以令該第一實施例之本體21為一體結構。較佳地，該磁性材料是選自一磁性金屬或一磁性陶瓷。適用於本新型之磁性金屬可以是如鐵(Fe)、鈷(Co)或鎳(Ni)；適用於本新型之磁性陶瓷可以是具有反尖晶石(inverse spinel structure)結構的鐵氧磁體(ferrite，Fe3 O4 )。More specifically, in the first embodiment of the present invention, the contour surface 210 of the main body 21 is the top surface area 2101, the bottom surface area 2102, and the left side area of the main body 21 as shown in FIG. 2103, a right side area 2104, a front area 2105 and a back area 2106 are defined together. Moreover, in the first embodiment of the present invention, the top segments 231, the vertical segments 232, and the bottom segments 233 of the first coil 23 are as shown in FIG. The direction clips extend in an extending direction of less than or equal to 90 degrees, and the longitudinal sections 232 of the first coils 23 are respectively disposed in the front area 2105 and the back side area 2106; that is, the novel magnetic core inductor The first coil 23 of the first embodiment is an outer wound coil. Further, the main body 21 is composed of the magnetic material so that the body 21 of the first embodiment has an integral structure. Preferably, the magnetic material is selected from a magnetic metal or a magnetic ceramic. The magnetic metal suitable for the present invention may be, for example, iron (Fe), cobalt (Co) or nickel (Ni); the magnetic ceramic suitable for the present invention may be a ferrite magnet having an inverse spinel structure ( Ferrite, Fe 3 O 4 ).
經前述說明可知，該主體21為一體者，以致於 該磁芯電感器2之主體21的整體結構強度高，不像圖1所示之積層式磁芯電感器1般，於該等電路陶瓷片11、12、13、14相鄰界面間存在有強度不足的問題。除此之外，該第一線圈23亦為一體結構，不會如圖1所示各電路圖案112、122、132、142間的不連續界面產生非歐姆式接觸或增加阻抗而產生額外的電熱效應。As can be seen from the foregoing description, the main body 21 is integrated, so that The main structure 21 of the magnetic core inductor 2 has a high overall structural strength, unlike the laminated core inductor 1 shown in FIG. 1, and exists between adjacent interfaces of the circuit ceramic sheets 11, 12, 13, and 14. Insufficient strength. In addition, the first coil 23 is also an integrated structure, which does not generate non-ohmic contact or increase impedance to generate additional electricity according to the discontinuous interface between the circuit patterns 112, 122, 132, 142 as shown in FIG. Thermal effect.
整合本新型該第一實施例上述詳細說明，簡單 地來說，本新型於上面所述之一體者，是被定義為一體結構。此外，所謂的一體結構，是指該主體21是經由蝕刻、噴砂或沖斷一塊材(bulk matter)所成形取得，以致於該主體21結構強度高，且內部不存在有層間剝離的問題。該塊材可以是一板狀的塊材，如，磁性陶瓷基板。Integrating the above detailed description of the first embodiment of the present invention, simple In general, the present invention is defined as a unitary structure in one of the above. In addition, the so-called integral structure means that the main body 21 is formed by etching, sandblasting or punching a bulk matter, so that the main body 21 has high structural strength and there is no problem of interlayer peeling inside. The block may be a plate-like block such as a magnetic ceramic substrate.
參閱圖9，本新型磁芯電感器2的一第二實施例 ，大致相同於該第一實施例，其不同之處在於，該主體21還具有兩排分設於其主體21之輪廓面210的前面區2105與背面區2106的溝槽213。各排溝槽213是沿該第一方向X彼此間隔排列，並自該主體21之輪廓面210的該頂面區 2101向該底面區2102延伸，且該兩排溝槽213是分別從該主體21的輪廓面210的該前面區2105與該背面區2106相向凹陷。該第一線圈23的各縱部段232是容置於各溝槽213；也就是說，本新型磁芯電感器之該第二實施例的第一線圈23亦為一外繞式線圈。Referring to FIG. 9, a second embodiment of the novel magnetic core inductor 2 The first embodiment is substantially the same as the first embodiment, and the main body 21 further has two rows of grooves 213 defined in the front area 2105 and the back side area 2106 of the contour surface 210 of the main body 21. Each row of grooves 213 are spaced apart from each other along the first direction X, and the top surface area of the contour surface 210 of the main body 21 2101 extends toward the bottom surface region 2102, and the two rows of trenches 213 are recessed from the front surface region 2105 of the contour surface 210 of the main body 21 and the back surface region 2106, respectively. Each longitudinal section 232 of the first coil 23 is received in each of the grooves 213; that is, the first coil 23 of the second embodiment of the novel magnetic core inductor is also an outer wound coil.
參閱圖10，本新型磁芯電感器2的一第三實施 例，大致相同於該第一實施例，其不同之處在於，該主體21還具有兩排穿孔214。各排穿孔214是沿該第一方向X彼此間隔排列。該等穿孔214是分別貫穿該主體21之輪廓面210的該頂面區2101與該底面區2102。該第一線圈23的各縱部段232是容置於各穿孔214；也就是說，本新型磁芯電感器之該第三實施例的第一線圈23為一內繞式線圈。Referring to FIG. 10, a third implementation of the novel magnetic core inductor 2 For example, it is substantially the same as the first embodiment, except that the body 21 also has two rows of perforations 214. Each row of perforations 214 are spaced apart from each other along the first direction X. The perforations 214 are the top surface region 2101 and the bottom surface region 2102 that extend through the contoured surface 210 of the body 21, respectively. Each longitudinal section 232 of the first coil 23 is received in each of the through holes 214; that is, the first coil 23 of the third embodiment of the novel magnetic core inductor is an inner wound coil.
參閱圖11與圖12，本新型磁芯電感器2的一第 四實施例，大致相同於該第一實施例，其不同之處在於，該第四實施例還包含一絕緣層24與一第二線圈25。該絕緣層24覆蓋於該主體21之輪廓面210與該第一線圈23上。 該第二線圈25則設置於該絕緣層24上，以圍繞於該主體21之輪廓面210的該頂面區2101、該底面區2102、該前面區2105與該背面區2106外，使該第一線圈23與該第二線圈25共同形成一共芯雙層線圈(concentric coil winding)的結構。於圖12中是以兩層線圈23、25為例作說明，但不以此為限，可依實際應用面，交替地鍍覆絕緣層與線圈以形成共芯多層線圈的結構。Referring to FIG. 11 and FIG. 12, a first embodiment of the novel magnetic core inductor 2 The fourth embodiment is substantially the same as the first embodiment except that the fourth embodiment further includes an insulating layer 24 and a second coil 25. The insulating layer 24 covers the contour surface 210 of the body 21 and the first coil 23. The second coil 25 is disposed on the insulating layer 24 to surround the top surface area 2101, the bottom surface area 2102, the front surface area 2105 and the back surface area 2106 of the contour surface 210 of the main body 21, so that the second coil 25 A coil 23 and the second coil 25 together form a structure of a concentric coil winding. In FIG. 12, the two-layer coils 23 and 25 are taken as an example. However, not limited thereto, the insulating layer and the coil may be alternately plated to form a structure of the common-core multilayer coil according to the practical application surface.
詳細地說，本新型磁芯電感器2各實施例的該 第一線圈23與該第四實施例的該第二線圈25由於是通過電鍍法(electroplating)或化學鍍法(electroless plating)所形成，所以本新型磁芯電感器2還包含一設置於該第一線圈23下的第一前驅物層4(圖未示)與一設置於該第二線圈25下的第二前驅物層7(圖未示)，詳細的製造方法容後說明。In detail, the embodiment of the novel magnetic core inductor 2 of the present invention The first coil 23 and the second coil 25 of the fourth embodiment are formed by electroplating or electroless plating, so the novel core inductor 2 further includes a first A first precursor layer 4 (not shown) under a coil 23 and a second precursor layer 7 (not shown) disposed under the second coil 25 are described in detail.
參閱圖13至圖22，本新型磁芯電感器2之一第 一量產方法，是以MEMS製程來製作出如圖8所示之第一實施例之磁芯電感器2，其依序包含一步驟(a1)、一步驟(b1)、一步驟(c1)、一步驟(d1)、一步驟(e1)、一步驟(f1)、一步驟(h1)及一步驟(g1)。Referring to FIG. 13 to FIG. 22, one of the novel magnetic core inductors 2 In a mass production method, a magnetic core inductor 2 of the first embodiment shown in FIG. 8 is produced by a MEMS process, which sequentially includes a step (a1), a step (b1), and a step (c1). One step (d1), one step (e1), one step (f1), one step (h1), and one step (g1).
參閱圖13與圖14，該步驟(a1)是於一基板20 的一上表面201與一下表面202上各形成一具有一預定圖案31的第一光阻層3。各預定圖案31具有一覆蓋該基板20之上表面201與下表面202的陣列，各陣列具有複數外觀形狀310，且各外觀形狀310沿該第一方向X依序具有彼此連接的一基座部311、兩橋接部312與一本體部313。 該等外觀形狀310之本體部313是沿該第一方向X或一與該第一方向X夾一預定角度的第二方向Y彼此間隔排列，且該等外觀形狀310之基座部311是沿該第一方向X或該第二方向Y彼此連接。Referring to FIG. 13 and FIG. 14, the step (a1) is on a substrate 20 A first photoresist layer 3 having a predetermined pattern 31 is formed on each of the upper surface 201 and the lower surface 202. Each of the predetermined patterns 31 has an array covering the upper surface 201 and the lower surface 202 of the substrate 20, each array having a plurality of external shapes 310, and each of the external shapes 310 sequentially has a base portion connected to each other along the first direction X. 311, two bridges 312 and a body portion 313. The body portion 313 of the external shape 310 is spaced apart from each other along the first direction X or a second direction Y that is a predetermined angle with the first direction X, and the base portion 311 of the external shape 310 is along The first direction X or the second direction Y are connected to each other.
在該第一量產方法中，該基板20是由該磁性材 料所構成，該預定角度是以90度為例作說明，但不以此為限；各第一光阻層3之該等外觀形狀310是如圖13所示，沿該第一方向X彼此間隔排列，且該等第一光阻層3之預 定圖案31的該等外觀形狀310是彼此上下對準；該等外觀形狀310之本體部313是沿該第二方向Y彼此間隔排列，該等外觀形狀310之基座部311是沿該第二方向Y彼此連接；各外觀形狀310之橋接部312的一寬度是沿該第一方向X遞減，且各外觀形狀310之該等橋接部312是沿該第二方向Y彼此間隔設置；形成於該基板20之上表面201與下表面202的第一光阻層3之各外觀形狀310的各橋接部312於鄰近其本體部313處形成有一缺口3121，且各缺口3121是自其橋接部312的一周緣沿該第二方向Y凹陷，以令各橋接部312與各本體部313彼此斷開。In the first mass production method, the substrate 20 is made of the magnetic material The predetermined angle is exemplified by 90 degrees, but is not limited thereto; the external shape 310 of each first photoresist layer 3 is as shown in FIG. 13 along the first direction X. Arranged at intervals, and pre-determined by the first photoresist layer 3 The outer shape 310 of the predetermined pattern 31 is vertically aligned with each other; the body portions 313 of the outer shape 310 are spaced apart from each other along the second direction Y, and the base portion 311 of the outer shape 310 is along the second The directions Y are connected to each other; a width of the bridge portion 312 of each appearance shape 310 is decreased along the first direction X, and the bridge portions 312 of the respective appearance shapes 310 are spaced apart from each other along the second direction Y; Each of the bridge portions 312 of the respective outer shape 310 of the first photoresist layer 3 of the upper surface 202 of the substrate 20 and the lower surface 202 is formed with a notch 3121 adjacent to the body portion 313 thereof, and each of the notches 3121 is from the bridge portion 312 thereof. The peripheral edge is recessed in the second direction Y such that each of the bridge portions 312 and each of the body portions 313 are disconnected from each other.
參閱圖15與圖16，該步驟(b1)是以噴砂、濕式 蝕刻或乾式蝕刻移除裸露於該等第一光阻層3之預定圖案31之陣列外的該基板20，並從而形成基座200陣列與一預形體陣列。各預形體沿該第一方向X包括至少一連接部22，及一如圖8所示的主體21。各基座200與各連接部22分別具有一輪廓面203、220。各基座200之輪廓面203包括相反設置的一第一側緣204及一第二側緣205，且各連接部22的輪廓面220包括相反設置的一第一端221與一第二端222。各連接部22的第一端221與第二端222是分別對應連接於各基座200的第二側緣205與各主體21的第一側緣211，以令各連接部22的輪廓面220是對應銜接於各主體21的輪廓面210與各基座200的輪廓面203。此外，該步驟(b1)之各連接部22之第二端222是形成有兩凹槽2221，各連接部22之該兩凹槽2221之其中一者(見顯示於圖16 之上方凹槽2221)是自其輪廓面220之一頂面區朝其一底面區延伸，且各連接部22的該兩凹槽2221之其中另一者(見顯示於圖16之下方凹槽2221)是自其輪廓面220的底面區向朝其頂面區延伸，且各連接部22之該兩凹槽2221是自其輪廓面220沿該第二方向Y凹陷。在該第一量產方法中，該步驟(b1)是以濕式蝕刻做說明，但並不限於此。Referring to Figure 15 and Figure 16, this step (b1) is sandblasted, wet Etching or dry etching removes the substrate 20 exposed outside the array of predetermined patterns 31 of the first photoresist layers 3 and thereby forms an array of pedestals 200 and a pre-form array. Each preform includes at least one connecting portion 22 along the first direction X, and a body 21 as shown in FIG. Each of the susceptor 200 and each of the connecting portions 22 has a contoured surface 203, 220. The contoured surface 203 of each of the pedestals 200 includes a first side edge 204 and a second side edge 205 which are oppositely disposed, and the contoured surface 220 of each connecting portion 22 includes a first end 221 and a second end 222 which are oppositely disposed. . The first end 221 and the second end 222 of each connecting portion 22 are respectively connected to the second side edge 205 of each base 200 and the first side edge 211 of each main body 21 to make the contour surface 220 of each connecting portion 22 It is corresponding to the contour surface 210 of each main body 21 and the contour surface 203 of each susceptor 200. In addition, the second end 222 of each connecting portion 22 of the step (b1) is formed with two recesses 2221, one of the two recesses 2221 of each connecting portion 22 (see FIG. 16). The upper groove 2221) extends from a top surface area of one of the contour faces 220 toward a bottom surface area thereof, and the other of the two grooves 2221 of each connecting portion 22 (see the lower groove shown in FIG. 16) 2221) extends from the bottom surface area of the contour surface 220 toward the top surface area thereof, and the two grooves 2221 of the respective connecting portions 22 are recessed from the contour surface 220 in the second direction Y. In the first mass production method, the step (b1) is described by wet etching, but is not limited thereto.
此外，需說明的是，該第一量產方法是以該兩 第一光阻層3之外觀形狀310的橋接部312皆具有該缺口3121為例做說明，但並不限於此。當該第一量產方法是該兩第一光阻層3的其中一者之外觀形狀310的橋接部312具有該缺口3121時，可令該步驟(b1)之各連接部22的第二端222僅形成有單一個凹槽2221，且該步驟(b1)之各連接部22的凹槽2221是自其輪廓面220之頂面區及底面區兩者其中一者，朝其輪廓面220之頂面區及底面區兩者其中另一者延伸。In addition, it should be noted that the first mass production method is the two The bridging portion 312 of the outer shape 310 of the first photoresist layer 3 has the notch 3121 as an example, but is not limited thereto. When the first mass production method is that the bridge portion 312 of the outer shape 310 of one of the two first photoresist layers 3 has the notch 3121, the second end of each connecting portion 22 of the step (b1) can be made. 222 is formed with only one single groove 2221, and the groove 2221 of each connecting portion 22 of the step (b1) is one of the top surface area and the bottom surface area of the contour surface 220 thereof, toward the contour surface 220 thereof. The other of the top and bottom regions extends.
再參閱圖16並配合參閱圖17，該步驟(c1)是移 除該等第一光阻層3。詳細地來說，該第一量產方法於移除該等第一光阻層3後，是成形出如圖17所示的基座200陣列、連接部22陣列與主體21陣列，且該等基座200是沿該第二方向Y彼此連接，該等主體21是沿該第二方向Y彼此間隔設置。Referring again to FIG. 16 and referring to FIG. 17, the step (c1) is shifting. Except for the first photoresist layers 3. In detail, after removing the first photoresist layers 3, the first mass production method forms an array of susceptors 200, an array of connecting portions 22, and an array of main bodies 21 as shown in FIG. The susceptors 200 are connected to each other along the second direction Y, and the bodies 21 are spaced apart from each other along the second direction Y.
參閱圖18，該步驟(d1)是於各主體21的輪廓面 210上形成一第一前驅物層4(圖18僅顯示一主體21與一第一前驅物層4為例做說明)。Referring to FIG. 18, the step (d1) is on the contour surface of each main body 21. A first precursor layer 4 is formed on 210 (FIG. 18 shows only one body 21 and a first precursor layer 4 as an example).
參閱圖19，該步驟(e1)是於該等第一前驅物層4 上形成一第二光阻層5，且該第二光阻層5具有複數對應裸露出各第一前驅物層4之一局部區域41的線路圖案區51。同樣地，圖19亦僅顯示一第一前驅物層4的一局部區域41與該第二光阻層5的一線路圖案區51為例做說明。Referring to FIG. 19, the step (e1) is at the first precursor layer 4 A second photoresist layer 5 is formed thereon, and the second photoresist layer 5 has a plurality of line pattern regions 51 corresponding to a partial region 41 of each of the first precursor layers 4. Similarly, FIG. 19 also shows a partial region 41 of the first precursor layer 4 and a line pattern region 51 of the second photoresist layer 5 as an example.
再參閱圖19並配合參閱圖20，該步驟(f1)是於 各第一前驅物層4上鍍製一第一金屬層6，以於各第一前驅物層4的該局部區域41上形成一如圖8所示的第一線圈23。同樣地，圖19與圖20亦僅顯示一第一前驅物層4與一第一金屬層6為例做說明。此處需進一步說明的是，若構成該基板20之該磁性材料是選自該磁性金屬時；例如，鈷(Co)，於實施步驟(d1)之第一前驅物層4形成步驟前，尚需預先在各主體21鍍覆上一電性絕緣層(insulator)，以防止該步驟(f1)所形成的第一線路23因直接接觸該磁性金屬而產生短路的問題。Referring again to FIG. 19 and referring to FIG. 20, the step (f1) is A first metal layer 6 is plated on each of the first precursor layers 4 to form a first coil 23 as shown in FIG. 8 on the partial region 41 of each of the first precursor layers 4. Similarly, FIG. 19 and FIG. 20 also show only a first precursor layer 4 and a first metal layer 6 as an example. It should be further noted that, if the magnetic material constituting the substrate 20 is selected from the magnetic metal; for example, cobalt (Co), before the step of forming the first precursor layer 4 of the step (d1), An electric insulating layer is required to be plated on each of the main bodies 21 in advance to prevent the first line 23 formed in the step (f1) from being short-circuited due to direct contact with the magnetic metal.
較佳地，該步驟(d1)之各第一前驅物層4是一含 有鉑(Pt)、鈀(Pd)、金(Au)、銀(Ag)或銅等催化性金屬源的活性材料層(active layer)，或一含有鉻(Cr)、鎳(Ni)、鈦(Ti)、鎢(W)或鉬(Mo)的導電性晶種層(conductive seed layer)。 須補充說明的是，當該步驟(d1)的各第一前驅物層4是該導電性晶種層時，該步驟(f1)之各第一金屬層6是以電鍍法形成於各第一前驅物層4的該局部區域41；當該步驟(d1)之各第一前驅物層4是該活性材料層時，該步驟(f1)之各第一金屬層6是以化學鍍法形成於各第一前驅物層4的該局部 區域41上。在該第一量產方法中，該步驟(d1)之各第一前驅物層4是該導電晶種層，且該步驟(f1)是以電鍍法於各第一前驅物層4的該局部區域41上形成各第一線圈23。Preferably, each of the first precursor layers 4 of the step (d1) is a An active material layer of a catalytic metal source such as platinum (Pt), palladium (Pd), gold (Au), silver (Ag) or copper, or a chromium (Cr), nickel (Ni), titanium A conductive seed layer of (Ti), tungsten (W) or molybdenum (Mo). It should be noted that when each of the first precursor layers 4 of the step (d1) is the conductive seed layer, each of the first metal layers 6 of the step (f1) is formed by electroplating. The partial region 41 of the precursor layer 4; when each of the first precursor layers 4 of the step (d1) is the active material layer, each of the first metal layers 6 of the step (f1) is formed by electroless plating The portion of each of the first precursor layers 4 On area 41. In the first mass production method, each of the first precursor layers 4 of the step (d1) is the conductive seed layer, and the step (f1) is electroplating to the portion of each of the first precursor layers 4. Each of the first coils 23 is formed on the region 41.
須進一步說明的是，為了令本新型磁芯電感器2 能透過表面黏著技術(surface-mount technology；SMT)接著於一電路板(圖未示)，於該步驟(f1)之後，依序還可包含一步驟(j1)、一步驟(j2)及一步驟(j3)。該步驟(j1)是形成一前驅物層(圖未示)於各第一線圈23與各主體21上。該步驟(j2)是形成一光阻層(圖未示)於該步驟(j1)的該等前驅物層上，且該步驟(j2)的光阻層具有複數對端電極圖案區(圖未示)。 各對端電極圖案區是分別位於各主體21的左側面區2103與右側面區2104，以局部裸露出各主體21之左側面區2103與右側面區2014。該步驟(j3)是於各前驅物層上鍍覆一金屬層，從而於各前驅物層上對應形成各對端電極(圖未示)。It should be further explained that in order to make the novel magnetic core inductor 2 The surface-mount technology (SMT) can be followed by a circuit board (not shown), and after the step (f1), a step (j1), a step (j2), and a step can be sequentially included. Step (j3). In the step (j1), a precursor layer (not shown) is formed on each of the first coils 23 and the main bodies 21. The step (j2) is to form a photoresist layer (not shown) on the precursor layers of the step (j1), and the photoresist layer of the step (j2) has a plurality of opposite electrode pattern regions (not shown). Show). The opposite end electrode pattern regions are respectively located on the left side surface area 2103 and the right side surface area 2104 of each main body 21 to partially expose the left side surface area 2103 and the right side surface area 2014 of each main body 21. In the step (j3), a metal layer is plated on each of the precursor layers to form respective opposite electrodes (not shown) on the respective precursor layers.
參閱圖21並配合參閱圖19與圖20，該步驟(h1) 是移除該第二光阻層5與各第一前驅物層4之被該第二光阻層5之各線路圖案區51所覆蓋的一剩餘區域，從而在各主體21上留下各第一線圈23。值得一提的是，為了保護該第一線圈23免於受外部因素干擾而造成短路或斷路，還能在完成步驟(h1)後，形成一絕緣保護層(圖未示)於各主體21與各第一線圈23上。Referring to FIG. 21 and referring to FIG. 19 and FIG. 20, the step (h1) Removing the second photoresist layer 5 and a remaining region of each of the first precursor layers 4 covered by the respective line pattern regions 51 of the second photoresist layer 5, thereby leaving each of the main bodies 21 A coil 23. It is worth mentioning that, in order to protect the first coil 23 from being short-circuited or broken by external factors, an insulating protective layer (not shown) may be formed on each body 21 after the step (h1) is completed. Each of the first coils 23 is on.
參閱圖22，該步驟(g1)是於該等連接部22處由 上而下或由下而上地分別施予一外力，使各連接部22的第二端222自各主體21的第一側緣211斷裂，從而令各主體 21自各連接部22脫離以量產出如圖8所示的磁芯電感器2。在該第一量產方法中，是於該步驟(g1)前完成該步驟(h1)為例作說明，然而該步驟(h1)亦可於該步驟(g1)之後執行，並不以本量產方法為限。Referring to FIG. 22, the step (g1) is at the connecting portion 22 An external force is applied from top to bottom or from bottom to top, so that the second end 222 of each connecting portion 22 is broken from the first side edge 211 of each main body 21, thereby causing each main body 21 is detached from each of the connecting portions 22 to produce the magnetic core inductor 2 as shown in FIG. In the first mass production method, the step (h1) is completed before the step (g1) as an example, but the step (h1) can also be performed after the step (g1), not in the amount. The production method is limited.
經前述量產方法的詳細說明可知，位於各第一 光阻層3之外觀形狀310之橋接部312處該等缺口3121是用來使該基板20於執行步驟(b1)之蝕刻後，可形成複數如圖16與圖17所顯示之各預形體之連接部22的凹槽2221，而顯示於圖17中的凹槽2221，其目的則是令該量產方法於執行該步驟(g1)時，有利於受該外力所折斷以達量產化的效用。值得一提的是，各凹槽2221亦可於該步驟(b1)成形出各連接部22後，再以切割(scriber)或蝕刻方式形成於各連接部22上。According to the detailed description of the mass production method described above, it is located at each first The notch 3121 of the bridge portion 312 of the outer shape 310 of the photoresist layer 3 is used to form the plurality of pre-forms as shown in FIGS. 16 and 17 after the substrate 20 is etched in the step (b1). The groove 2221 of the connecting portion 22 is shown in the groove 2221 in FIG. 17, and the purpose is to enable the mass production method to be broken by the external force for mass production when the step (g1) is performed. utility. It should be noted that each of the grooves 2221 may be formed on each of the connecting portions 22 by scribe or etching after forming the connecting portions 22 in the step (b1).
本新型磁芯電感器2之一第二量產方法是以 MEMS製程來量產出如圖9所示之第二實施例的磁芯電感器2，其量產方法大致上是相同於該第一量產方法，不同之處是在於，如圖23所示，各第一光阻層3的各外觀形狀310之主體部31具有兩排分設於其本體部313之一周緣的缺口3131，且各本體部313之該兩排缺口3131是自其本體部313的周緣相向凹陷。因此，該第二量產方法於實施完該步驟(b1)之蝕刻步驟後，該等第一光阻層3之各主體部31的該兩排缺口3131能令各主體21對應成形出如圖9所示的該兩排溝槽213，以致於該步驟(d1)所形成的各第一前驅物層4亦可覆蓋該兩排溝槽213，且在實施完該步驟(f1)後所形 成的各第一線圈23是呈該外繞式線圈。The second mass production method of the novel magnetic core inductor 2 is The MEMS process produces a magnetic core inductor 2 of the second embodiment as shown in FIG. 9, and the mass production method is substantially the same as the first mass production method, except that, as shown in FIG. The main body portion 31 of each of the external shape 310 of each of the first photoresist layers 3 has two rows of notches 3131 disposed on one of the peripheral edges of the main body portion 313, and the two rows of notches 3131 of the main body portions 313 are from the main body portion thereof. The circumference of 313 is concave toward each other. Therefore, after the etching step of the step (b1) is performed, the two rows of notches 3131 of the main body portions 31 of the first photoresist layers 3 can form the corresponding bodies 21 as shown in the figure. The two rows of trenches 213 are shown in FIG. 9, so that the first precursor layers 4 formed in the step (d1) can also cover the two rows of trenches 213, and are formed after the step (f1) is completed. Each of the first coils 23 is formed as the outer wound coil.
本新型磁芯電感器2之一第三量產方法是以 MEMS製程來量產出如圖10所示之第三實施例的磁芯電感器2，其量產方法大致上是相同於該第一量產方法，不同之處是在於，如圖24所示，各第一光阻層3的各外觀形狀310之主體部311具有兩排分設於其本體部313的孔洞3132，各本體部313之該兩排孔洞3132是沿該第一方向X彼此間隔排列。因此，該第三量產方法於實施完該步驟(b1)之蝕刻步驟後，該等第一光阻層3之各主體部31的該兩排孔洞3132能令各主體21對應成形出如圖10所示的該兩排穿孔214，以致於該步驟(d1)所形成的各第一前驅物層4亦可覆蓋定義出該兩排穿孔214之兩排內環面，且在實施完該步驟(f1)後所形成的各第一線圈23是呈該內繞式線圈。The third mass production method of the novel magnetic core inductor 2 is The MEMS process produces a magnetic core inductor 2 of the third embodiment as shown in FIG. 10, and the mass production method thereof is substantially the same as the first mass production method, except that, as shown in FIG. The main body portion 311 of each appearance shape 310 of each of the first photoresist layers 3 has two rows of holes 3132 defined in the main body portion 313, and the two rows of holes 3132 of the main body portions 313 are spaced apart from each other along the first direction X. arrangement. Therefore, after the etching step of the step (b1) is performed, the two rows of holes 3132 of the main body portions 31 of the first photoresist layers 3 can form the corresponding bodies 21 as shown in the figure. The two rows of perforations 214 are shown in FIG. 10, so that each of the first precursor layers 4 formed in the step (d1) can also cover two rows of inner annulus defining the two rows of perforations 214, and after performing the steps Each of the first coils 23 formed after (f1) is in the inner wound coil.
參閱圖25至圖28，本新型磁芯電感器2之一第 四量產方法是以MEMS製程來量產出如圖11與圖12所示之第四實施例的磁芯電感器2，其量產方法大致上是相同於該第一量產方法，不同之處是在於，於該步驟(h1)後，還依序包含一步驟(i11)、一步驟(i12)、一步驟(i13)，及一步驟(i14)。Referring to FIG. 25 to FIG. 28, one of the novel magnetic core inductors 2 The fourth mass production method is based on the MEMS process to produce the magnetic core inductor 2 of the fourth embodiment shown in FIG. 11 and FIG. 12, and the mass production method is substantially the same as the first mass production method. The step is that after the step (h1), a step (i11), a step (i12), a step (i13), and a step (i14) are sequentially included.
參閱圖25，該步驟(i11)是於各主體21與各第 一線圈23上形成一絕緣層24。參圖26，該步驟(i12)是於各絕緣層24上形成一第二前驅物層7。參圖27，該步驟(i13)是於該等第二前驅物層7上形成一第三光阻層8，且該第三光阻層8具有複數對應裸露出各第二前驅物層7之一局部 區域71的線路圖案區81。再參閱圖27並配合參閱圖28，該步驟(i14)是於各第二前驅物層7上鍍製一第二金屬層9，以於各第二前驅物層7的該局部區域71上形成一如圖11與圖12所示的第二線圈25。最後，再移除該第三光阻層8與各第二前驅物層7之被該第三光阻層8之各線路圖案區81所覆蓋的一剩餘區域即可得到如圖11與圖12所示之共芯雙層線圈的磁芯電感器2。需說明的是，圖25至圖28皆只顯示出單一個主體21之輪廓面210、單一個第二前驅物層7、該第二光阻層8之單一個線路圖案區81，與單一個第二金屬層9為例做說明。在該第四量產方法中，該步驟(i12)與該步驟(i14)之實施方式是比照該第一量產方法，於此不再多加贅述。Referring to FIG. 25, the step (i11) is performed on each main body 21 and each An insulating layer 24 is formed on a coil 23. Referring to FIG. 26, the step (i12) is to form a second precursor layer 7 on each of the insulating layers 24. Referring to FIG. 27, the step (i13) is to form a third photoresist layer 8 on the second precursor layer 7, and the third photoresist layer 8 has a plurality of corresponding portions of the second precursor layer 7 exposed. Partial The line pattern area 81 of the area 71. Referring to FIG. 27 and referring to FIG. 28, the step (i14) is: plating a second metal layer 9 on each of the second precursor layers 7 to form on the partial region 71 of each of the second precursor layers 7. A second coil 25 as shown in FIGS. 11 and 12. Finally, a remaining area of the third photoresist layer 8 and each of the second precursor layers 7 covered by the line pattern regions 81 of the third photoresist layer 8 is removed, as shown in FIG. 11 and FIG. 12 . A core inductor 2 of a common core double layer coil as shown. It should be noted that FIGS. 25-28 only show the contour surface 210 of a single body 21, a single second precursor layer 7, and a single line pattern area 81 of the second photoresist layer 8, and a single one. The second metal layer 9 is exemplified. In the fourth mass production method, the implementation of the step (i12) and the step (i14) is a comparison with the first mass production method, and details are not described herein again.
參閱圖29圖30與圖31，本新型磁芯電感器之 一第五量產方法是以一模具4透過沖壓來實施，其依序包含一步驟(a2)、一步驟(b2)、一步驟(b2’)、一步驟(c2)、一步驟(d2)、一步驟(e2)，及一步驟(f2)。Referring to Figures 29, 30 and 31, the novel magnetic core inductor A fifth mass production method is implemented by stamping a mold 4, which comprises a step (a2), a step (b2), a step (b2'), a step (c2), and a step (d2). , one step (e2), and one step (f2).
參閱圖29與圖30，該步驟(a2)是令該模具4的 一模穴41陣列面向該基板20之上表面201或下表面202設置，以使該基板20的一部分區域2011是面向該模穴41陣列。在該第五量產方法中，該模具4之模穴41陣列是面向該基板20的上表面201，但本新型並不以此為限。Referring to FIG. 29 and FIG. 30, the step (a2) is to make the mold 4 An array of mold holes 41 is disposed facing the upper surface 201 or the lower surface 202 of the substrate 20 such that a portion of the region 2011 of the substrate 20 faces the array of the mold holes 41. In the fifth mass production method, the array of the mold holes 41 of the mold 4 faces the upper surface 201 of the substrate 20, but the present invention is not limited thereto.
較佳地，構成該步驟(a2)之基板20的磁性材料 是選自該磁性金屬或一磁性陶瓷生坯(green)。在該第四量產方法中，構成該步驟(a2)之基板20的磁性材料是選自該 磁性陶瓷生坯，如鐵氧磁體生坯。Preferably, the magnetic material constituting the substrate 20 of the step (a2) It is selected from the magnetic metal or a magnetic ceramic green. In the fourth mass production method, the magnetic material constituting the substrate 20 of the step (a2) is selected from the group consisting of Magnetic ceramic green bodies, such as ferrite magnet green bodies.
參閱圖31，該步驟(b2)是用該模具4沖斷該基 板20之上表面201與下表面202，以使該基板20的該部分區域2011置入該模穴41陣列內，且移除該基板20之面對該模穴41陣列外的一剩餘區域2012，並從而成形出如圖17所示一基座200陣列與一預形體陣列。該預形體陣列中的各預形體沿該第一方向包括該兩連接部22，及一如圖8所示的主體21，但各預形體之該兩連接部22處未成形出該兩凹槽2221。Referring to FIG. 31, the step (b2) is to break the base with the mold 4. The upper surface 201 and the lower surface 202 of the board 20 are such that the partial area 2011 of the substrate 20 is placed in the array of the mold holes 41, and a remaining area of the substrate 20 facing the array of the mold holes 41 is removed 2012 And thereby forming an array of susceptors 200 and a pre-form array as shown in FIG. Each of the preforms in the array of preforms includes the two connecting portions 22 along the first direction, and a main body 21 as shown in FIG. 8, but the two connecting portions 22 of each pre-form are not formed at the two connecting portions 22. 2221.
須補充說明的是，為了進一步形成各連接部22 的凹槽2221，可於該步驟(b2)後以切割(scriber)或蝕刻方式將各凹槽2221形成於各連接部22上。It should be added that in order to further form each connecting portion 22 The groove 2221 may be formed on each of the connecting portions 22 by scriber or etching after the step (b2).
該步驟(b2’)是燒結該磁性陶瓷生坯，令該磁性 陶瓷生坯結晶化(crystallization)，從而使該基座200陣列與該預形體陣列整體結構強度提升。然而，此處需補充說明的是，當構成該第五量產方法之該基板20的磁性材料是選自該磁性金屬時，是可以省略該步驟(b2’)。在該第五量產方法中，實施該步驟(b2’)與否，是決定於該基板20之材質的選用。This step (b2') is to sinter the magnetic ceramic green body to make the magnetic The ceramic green body is crystallized, thereby increasing the overall structural strength of the array of susceptors 200 and the array of preforms. However, it should be additionally noted here that when the magnetic material of the substrate 20 constituting the fifth mass production method is selected from the magnetic metal, the step (b2') may be omitted. In the fifth mass production method, the step (b2') is performed depending on the material of the substrate 20.
該步驟(c2)、該步驟(d2)、該步驟(e2)分別相同 於該第一量產方法中的該步驟(d1)、該步驟(e1)，及該步驟(f1)，也就是，形成各第一線圈23於各主體21上，此處不再贅述。The step (c2), the step (d2), and the step (e2) are respectively the same In the first mass production method, the step (d1), the step (e1), and the step (f1), that is, the first coils 23 are formed on the main bodies 21, and details are not described herein again.
再參閱圖18，該步驟(f2)是相同於該第一量產 方法之步驟(g1)，將各磁芯電感器2的主體21自各連接部22脫離，此處不再多加贅述。Referring again to Figure 18, the step (f2) is the same as the first mass production. In the step (g1) of the method, the main body 21 of each of the core inductors 2 is detached from each of the connecting portions 22, and no further details are provided here.
值得一提的是，為了形成如該第四量產方法的 雙層線圈結構，於該步驟(e2)後，還包含一步驟(i21)、一步驟(i22)、一步驟(i23)，及一步驟(i24)。該步驟(i21)、該步驟(i22)、該步驟(i23)，及該步驟(i24)是分別相同於該第四量產方法的該步驟(i11)、該步驟(i12)、該步驟(i13)，及該步驟(i14)，此處不再多加贅述。It is worth mentioning that in order to form the fourth mass production method The double-layer coil structure further comprises a step (i21), a step (i22), a step (i23), and a step (i24) after the step (e2). The step (i21), the step (i22), the step (i23), and the step (i24) are the same as the step (i11), the step (i12), and the step of the fourth mass production method, respectively. I13), and this step (i14), no more details will be given here.
經上述本新型磁芯電感器2之各量產方法的詳 細說明可知，本新型僅需透過該步驟(a1)至該步驟(f1)或該步驟(a2)至該步驟(e2)等步驟，即可形成出外繞式或內繞式的第一線圈23。此外，本新型之量產方法也只需要透過步驟(i11)至步驟(i14)或步驟(i21)至步驟(i24)等四道程序，即可簡易地量產出共芯雙層線圈結構的磁芯電感器2。無須如同前案2般，尚需經過四道的貫孔程序、四道的填置導電糊程序、四道的塗佈導電糊以形成各電路圖案112、122、132、142程序，與一道步驟(E)之燒結處理等十三道程序，才可構成該內繞式的線圈。就製程面來說，本新型之量產方法程序簡化；就成本面來說，本新型之量產方法可因程序簡化而減少製程上所需耗費的時間成本。The details of the mass production methods of the above novel magnetic core inductor 2 As can be seen from the detailed description, the present invention only needs to pass through the steps (a1) to (f1) or the steps (a2) to (e2) to form the outer winding or the inner winding type of the first coil 23 . In addition, the mass production method of the present invention only needs to pass through the four steps of step (i11) to step (i14) or step (i21) to step (i24), so that the common core double-layer coil structure can be easily produced. Magnetic core inductor 2. There is no need to follow the four steps of the through hole procedure, four passes of the conductive paste program, four coats of conductive paste to form the circuit patterns 112, 122, 132, 142 procedures, and a step The internal winding type coil can be constructed by thirteen procedures such as sintering treatment of (E). In terms of the process surface, the new mass production method program is simplified; in terms of cost, the new mass production method can reduce the time cost required for the process due to the simplification of the program.
再者，本新型各實施例之磁芯電感器2是透過 MEMS製程直接由該基板20經過上述量產方法之步驟(b1)或步驟(b2)來成形出各磁芯電感器2的本體21。具體來說，各本體21為一體結構，以致於各磁芯電感器2之主體21 的整體結構強度高，不像圖1所示之積層式磁芯電感器1般，於該等電路陶瓷片11、12、13、14相鄰界面間存在有強度不足的問題。除此之外，本新型各實施例之磁芯電感器2的第一線圈23與第二線圈25亦為一體結構，不會如圖1所示各電路圖案112、122、132、142間因不連續界面而產生非歐姆式接觸或增加阻抗而產生額外的電熱效應。Furthermore, the magnetic core inductor 2 of each embodiment of the present invention is transmitted through The MEMS process directly forms the body 21 of each of the core inductors 2 from the substrate 20 through the step (b1) or the step (b2) of the mass production method described above. Specifically, each of the bodies 21 has an integral structure such that the main body 21 of each of the core inductors 2 The overall structural strength is high, unlike the laminated core inductor 1 shown in FIG. 1, there is a problem of insufficient strength between adjacent interfaces of the circuit ceramic sheets 11, 12, 13, and 14. In addition, the first coil 23 and the second coil 25 of the magnetic core inductor 2 of the embodiments of the present invention are also integrated, and the circuit patterns 112, 122, 132, and 142 are not shown in FIG. Non-ohmic contacts or increased impedance due to discontinuous interfaces create additional electrothermal effects.
綜上所述，本新型磁芯電感器2是透過MEMS 製程直接對該基板20進行噴砂、蝕刻或沖斷以預先成形出結構強度高且呈一體結構的各主體21，並於各主體21之輪廓面210上形成各第一前驅物層4，以進一步地在呈立體態的各輪廓面210上之各第一前驅物層4上電鍍/或化學鍍出各外繞式或內繞式的第一線圈23，亦可在各第一線圈23上與各主體21之立體態的輪廓面210上繼續形成出各第二線圈25，就電感器的性能面來看，結構強度高且不易產生過熱問題，就製程面與成本面來看，因製作程序簡化而降低時間成本，故確實能達成本新型之目的。In summary, the novel magnetic core inductor 2 is through MEMS The substrate 20 is sandblasted, etched or punched directly to pre-form each body 21 having a high structural strength and a unitary structure, and each first precursor layer 4 is formed on the contour surface 210 of each body 21 to further The first coils 23 of the outer winding or the inner winding are electroplated or chemically plated on the first precursor layers 4 on the contour surfaces 210 of the three-dimensional state, and may also be on the first coils 23 Each of the second coils 25 is continuously formed on the contour surface 210 of each of the solid bodies 21, and the structural strength is high and the overheating problem is not easily caused in terms of the performance of the inductor, and the manufacturing process is based on the process surface and the cost side. Simplify and reduce the time cost, so it can achieve the purpose of this new type.
惟以上所述者，僅為本新型之實施例而已，當 不能以此限定本新型實施之範圍，即凡是依本新型申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本新型專利涵蓋之範圍內。However, the above is only an embodiment of the present invention, when The scope of the novel implementation is not limited thereto, that is, any equivalent equivalent changes and modifications made in accordance with the scope of the present patent application and the contents of the patent specification are still within the scope of the present patent.
2‧‧‧磁芯電感器2‧‧‧Magnetic core inductor
21‧‧‧主體21‧‧‧ Subject
210‧‧‧輪廓面210‧‧‧ contour surface
2101‧‧‧頂面區2101‧‧‧Top area
2102‧‧‧底面區2102‧‧‧Bottom area
2103‧‧‧左側面區2103‧‧‧Left area
2104‧‧‧右側面區2104‧‧‧ right side area
2105‧‧‧前面區2105‧‧‧ front area
2106‧‧‧背面區2106‧‧‧Back area
211‧‧‧第一側緣211‧‧‧ first side edge
212‧‧‧第二側緣212‧‧‧Second side edge
23‧‧‧第一線圈23‧‧‧First coil
231‧‧‧頂部段231‧‧‧Top section
232‧‧‧縱部段232‧‧‧Longitudinal section
233‧‧‧底部段233‧‧‧ bottom section
X‧‧‧第一方向X‧‧‧ first direction
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| TW104210227U TWM511111U (en) | 2015-06-25 | 2015-06-25 | Magnetic core inductor |
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| CN107154301B (en) * | 2016-03-03 | 2018-12-25 | 台达电子企业管理（上海）有限公司 | Magnet assembly |
| KR101853850B1 (en) * | 2016-09-02 | 2018-06-08 | 아비코전자 주식회사 | Micro Inductor and Method of Manufacturing the Same |
| CN113005436A (en) * | 2021-02-02 | 2021-06-22 | 肇庆国华电子有限公司 | Chemical nickel plating solution for winding inductor and nickel plating method thereof |
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