TWM505729U - A high frequency connector structure - Google Patents
A high frequency connector structure Download PDFInfo
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- TWM505729U TWM505729U TW103217308U TW103217308U TWM505729U TW M505729 U TWM505729 U TW M505729U TW 103217308 U TW103217308 U TW 103217308U TW 103217308 U TW103217308 U TW 103217308U TW M505729 U TWM505729 U TW M505729U
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Description
本創作是有關於一種高頻連接器結構，特別係指一種利用一絕緣體、複數個端子、一接地導體、一屏蔽罩及一金屬殼體組合設計而成之高頻連接器結構。The present invention relates to a high-frequency connector structure, in particular to a high-frequency connector structure designed by using an insulator, a plurality of terminals, a grounding conductor, a shielding cover and a metal casing combination.
由於多數電子裝置間傳輸的資料量持續增加，為提供使用者更友善的使用經驗，多數電子裝置間傳輸訊號的速度隨之而增加。為了讓使用者在更短暫的時間內傳輸大量電子資料，除了增加電子裝置間傳輸電子訊號的通路外，目前一般採取的對應措施是提高電子裝置間所傳遞的電子訊號頻率。連接器是一種位於不同電子裝置間的電子訊號溝通橋樑，在不同電子裝置間相互傳遞的該電子訊號頻率持續增加的情況下，連接器也必須考慮該高頻電子訊號通過該連接器時對高頻電子訊號的不利影響，並對該不利高頻電子訊號傳輸的原因加以控制或採取適當對應措施降低其實質上的影響，使高頻電子訊號能完整地在多數電子裝置間傳遞。As the amount of data transmitted between most electronic devices continues to increase, in order to provide users with a more user-friendly experience, the speed of transmitting signals between most electronic devices increases. In order to allow users to transmit a large amount of electronic data in a shorter period of time, in addition to increasing the path for transmitting electronic signals between electronic devices, the corresponding countermeasure currently generally adopted is to increase the frequency of electronic signals transmitted between electronic devices. A connector is an electronic signal communication bridge between different electronic devices. When the frequency of the electronic signal transmitted between different electronic devices continues to increase, the connector must also consider the high frequency of the high-frequency electronic signal passing through the connector. The adverse effects of the frequency electronic signal, and the reason for the transmission of the unfavorable high-frequency electronic signal or the appropriate countermeasures to reduce its substantial impact, so that the high-frequency electronic signal can be completely transmitted between most electronic devices.
由於電子裝置在體積極小化的趨勢下，該連接器的整體體積也相對被要求必須縮小，導致在不減少端子數量或僅增加少數端子數量的情形下，單位面積的端子數量因此而提高，形成所謂連接器。然而導電端子間距持續縮小是不利於高頻電子訊號的傳輸，因為各別導電端子傳輸的 該高頻電子訊號容易因此而造成交互干擾(crosstalk)，使原本傳遞的高頻電子訊號產生雜訊(noise)。Due to the tendency of the electronic device to be actively reduced, the overall volume of the connector must also be reduced relative to the requirement, so that the number of terminals per unit area is increased without reducing the number of terminals or increasing the number of terminals. A so-called connector is formed. However, the continuous reduction of the spacing of the conductive terminals is not conducive to the transmission of high-frequency electronic signals, because of the transmission of the respective conductive terminals. The high-frequency electronic signal is likely to cause crosstalk, which causes noise to be transmitted from the originally transmitted high-frequency electronic signal.
如第5圖所示，美國第8,684,769號專利所揭露的高頻連接器是由一絕緣體A、多數端子B、一金屬殼體C及一接地導體D所組成。在該揭露中，該絕緣體A是由一框架A1、一第一絕緣子A2及一第二絕緣子A3所組成。在該先前技術中，該絕緣體A框架A1具有一穿孔A11，該第一絕緣子A2於一基部A21沿伸一舌板部A22，該第一絕緣子A2的舌板部A22可以穿越該絕緣體A框架A1的該穿孔A11，且該第二絕緣子A3是被裝置於該第一絕緣子A2的適當位置。各該端子B被區分為一第一組端子B3及一第二組端子B4，各該端子B分別具有一接觸部B1及一固定部B2，且第一組端子B3的各端子B接觸部B1是被排列於該第一絕緣子A2的外表面(圖式中為舌板A22的上表面)，該第二組端子B4是被固定於該第二絕緣子A3，再利用該二絕緣子A2、A3的組裝程序，使該第二組端子A3的各端子B接觸部B1排列於該第一絕緣子A2的另一外表面(圖式中為舌板A22的下表面)。各該端子B的固定部B2是分別被固定於一電路板上，使各該端子可與該電路板上的適當電子電路形成性連接。As shown in Fig. 5, the high frequency connector disclosed in U.S. Patent No. 8,684,769 is composed of an insulator A, a plurality of terminals B, a metal casing C and a ground conductor D. In the disclosure, the insulator A is composed of a frame A1, a first insulator A2 and a second insulator A3. In the prior art, the insulator A frame A1 has a through hole A11, and the first insulator A2 extends along a base portion A21 along a tongue portion A22, and the tongue portion A22 of the first insulator A2 can pass through the insulator A frame A1. The through hole A11, and the second insulator A3 is disposed at an appropriate position of the first insulator A2. Each of the terminals B is divided into a first group of terminals B3 and a second group of terminals B4, each of which has a contact portion B1 and a fixing portion B2, and each terminal B of the first group of terminals B3 contacts the portion B1. Is arranged on the outer surface of the first insulator A2 (in the figure, the upper surface of the tongue A22), the second group of terminals B4 is fixed to the second insulator A3, and the two insulators A2 and A3 are used. The assembly procedure is such that the terminal B contact portions B1 of the second group terminal A3 are arranged on the other outer surface of the first insulator A2 (in the drawing, the lower surface of the tongue plate A22). The fixing portions B2 of the terminals B are respectively fixed to a circuit board so that the terminals can be formally connected to appropriate electronic circuits on the circuit board.
在前述先前技術的揭露中，該絕緣體A被該金屬殼體C拘束，且利用該金屬殼體C的金屬材料的電磁波屏蔽特性，保護各該被固定於絕緣體A上的端子B，防止該連接器外部的電磁波影響各該端子B在傳輸電子訊號時的訊號完整性。In the foregoing prior art, the insulator A is restrained by the metal casing C, and the electromagnetic wave shielding property of the metal material of the metal casing C is utilized to protect each of the terminals B fixed to the insulator A to prevent the connection. The electromagnetic wave outside the device affects the signal integrity of each of the terminals B when transmitting the electronic signal.
在前述先前技術的揭露中，由於該第一組端子B3及第二組端子B4的各端子B接觸部B1是被排列在該絕緣體A舌板部A22的相對二表 面，使該二組端子B3、B4的各端子B接觸部B1彼此間的距離過於接近，容易產生電磁波的相互感應，特別是在傳輸高頻電子訊號時，因此以該接地導體D阻隔該二組端子B3、B4間造成交互感應的電磁波。In the foregoing prior art, since the terminal B contact portions B1 of the first group terminal B3 and the second group terminal B4 are opposite two meters arranged in the tongue portion A22 of the insulator A The distance between the contact portions B1 of the terminals B3 and B4 of the two sets of terminals B3 and B4 is too close to each other, and mutual induction of electromagnetic waves is likely to occur, especially when transmitting high-frequency electronic signals, so that the ground conductor D blocks the two. Electromagnetic waves caused by interaction between the group terminals B3 and B4.
在該先前技術的揭露中，該接地導體D具有多數懸臂D1及多數連接部D2，各該接地導體D的懸臂D1是沿伸於該二組端子B3、B4的各端子B接觸部B1間，再透過該接地導體D的多數連接部D2將該二組端子B3、B4的各端子B接觸部B1間電磁波雜訊傳導至接地電路。In the disclosure of the prior art, the grounding conductor D has a plurality of cantilevers D1 and a plurality of connecting portions D2, and the cantilever D1 of each of the grounding conductors D is located between the contact portions B1 of the terminals B extending from the two sets of terminals B3 and B4. Further, electromagnetic wave noise between the terminals B1 of the terminals B3 and B4 of the two sets of terminals B3 and B4 is transmitted to the ground circuit through the plurality of connection portions D2 of the ground conductor D.
在該先前技術的揭露中，該接地導體D是透過各該懸臂D1間與該第一絕緣子A2形成干涉關係(interference)，且該第一絕緣子A2的基部A21及舌板A22必須設有通道(圖式中未繪示)以收容各該懸臂D1。如此結構，使得位於該第一絕緣子A2基部A21及舌板A22的通道成型困難，並使該接地導體D的屏蔽效應發生破損，除此之外，當高頻連接器與電路板連接時會有部分外露，而此高頻連接器外露之部分亦會與該電路板間產生相互電磁干擾，因此應加以改良。In the disclosure of the prior art, the grounding conductor D is in interference with the first insulator A2 through each of the cantilevers D1, and the base A21 and the tongue A22 of the first insulator A2 must be provided with a channel ( Not shown in the drawings) to accommodate each of the cantilevers D1. With such a structure, it is difficult to form a channel located at the base A21 and the tongue A22 of the first insulator A2, and the shielding effect of the ground conductor D is damaged. In addition, when the high frequency connector is connected to the circuit board, Partially exposed, and the exposed part of the high-frequency connector will also cause mutual electromagnetic interference with the board, so it should be improved.
本創作主要目的在於提供一種高頻連接器結構，特別係指一種利用一絕緣體、複數個端子、一接地導體、一屏蔽罩及一金屬殼體組合設計而成之高頻連接器結構，使本創作於使用時能隔絕電磁波之干擾。The main purpose of the present invention is to provide a high-frequency connector structure, in particular to a high-frequency connector structure designed by using an insulator, a plurality of terminals, a grounding conductor, a shielding cover and a metal casing combination. Created to interfere with electromagnetic waves when used.
為達上述目的，本創作提供一種高頻連接器結構係與一電路板連結，其包括一絕緣體、複數個端子、一接地導體、一屏蔽罩及一金屬殼體，其中該絕緣體具有一舌板部，該些端子係分別具有一接觸部，且每一接觸部是被排列於該舌板部之表面，使每一接觸部可與一對接連接器形 成電性連接，該接地導體至少部分被定位於該絕緣體的舌板部內，該屏蔽罩係附著於該絕緣體表面的金屬材料，且該屏蔽罩具有一擋板位於該絕緣體與該電路板之間，該金屬殼體係遮蓋該絕緣體外及該屏蔽罩之部分。In order to achieve the above object, the present invention provides a high frequency connector structure connected to a circuit board, comprising an insulator, a plurality of terminals, a grounding conductor, a shielding cover and a metal casing, wherein the insulator has a tongue plate The terminals have a contact portion, and each contact portion is arranged on the surface of the tongue portion, so that each contact portion can be connected with a pair of connectors. Electrically connected, the ground conductor is at least partially positioned in a tongue portion of the insulator, the shield is attached to the metal material of the surface of the insulator, and the shield has a baffle between the insulator and the circuit board The metal housing covers the outside of the insulator and a portion of the shield.
在本創作所揭露的實施例中，該接地導體係一部分位於該絕緣體的舌板內，而另一部分係暴露於該絕緣體基部外，因此該接地導體可以是被組裝入該絕緣體，或該絕緣體的任一部份可以是以埋入射出成型法(insert molding)而成型於該接地導體外表，無需如先前技術的揭露而造成接地導體的屏蔽效應發生破損或絕緣體舌板部成型困難。In the embodiment disclosed in the present disclosure, the grounding conductor system is partially located in the tongue of the insulator, and the other portion is exposed outside the base of the insulator, so the grounding conductor may be assembled into the insulator, or the insulator. Any portion may be formed on the outer surface of the ground conductor by insert molding, without the prior art disclosure causing damage to the shielding effect of the ground conductor or difficulty in forming the insulator tongue portion.
A‧‧‧絕緣體A‧‧‧Insulator
A1‧‧‧框架A1‧‧‧ framework
A11‧‧‧穿孔A11‧‧‧ perforation
A2‧‧‧第一絕緣子A2‧‧‧first insulator
A21‧‧‧基部A21‧‧‧ base
A22‧‧‧舌板部A22‧‧‧ tongue plate
A3‧‧‧第二絕緣子A3‧‧‧second insulator
B‧‧‧端子B‧‧‧ terminals
B1‧‧‧接觸部B1‧‧‧Contacts
B2‧‧‧固定部B2‧‧‧Fixed Department
B3‧‧‧第一組端子B3‧‧‧First set of terminals
B4‧‧‧第二組端子B4‧‧‧Second group terminal
C‧‧‧金屬殼體C‧‧‧Metal housing
D‧‧‧接地導體D‧‧‧ Grounding conductor
D1‧‧‧懸臂D1‧‧‧ cantilever
D2‧‧‧連接部D2‧‧‧Connecting Department
1‧‧‧電路板1‧‧‧ boards
2‧‧‧絕緣體2‧‧‧Insulator
20‧‧‧本體20‧‧‧ body
201‧‧‧舌板部201‧‧‧ tongue plate
202‧‧‧端子槽202‧‧‧Terminal slot
21‧‧‧第一絕緣子21‧‧‧First insulator
22‧‧‧第二絕緣子22‧‧‧second insulator
3‧‧‧端子3‧‧‧ terminals
31‧‧‧第一組端子31‧‧‧First set of terminals
311‧‧‧接觸部311‧‧‧Contacts
312‧‧‧固定部312‧‧‧ Fixed Department
32‧‧‧第二組端子32‧‧‧Second group terminal
321‧‧‧接觸部321‧‧‧Contacts
322‧‧‧固定部322‧‧‧ fixed department
4‧‧‧接地導體4‧‧‧ Grounding conductor
41‧‧‧遮蔽板41‧‧‧Shielding board
42‧‧‧連接部42‧‧‧Connecting Department
5‧‧‧金屬殼體5‧‧‧Metal housing
6‧‧‧屏蔽罩6‧‧‧Shield
61‧‧‧接合部61‧‧‧ joints
62‧‧‧擋板62‧‧‧Baffle
第1圖係為本創作高頻連接器結構之結構外觀圖。The first figure is a structural appearance view of the structure of the high frequency connector.
第2圖係為本創作高頻連接器結構之結構分解圖。Fig. 2 is a structural exploded view of the structure of the high frequency connector of the present invention.
第3圖係為本創作高頻連接器結構之部分結構圖。The third figure is a partial structural diagram of the structure of the high frequency connector.
第4圖係為本創作高頻連接器結構之使用示意圖。Figure 4 is a schematic diagram of the use of the high frequency connector structure.
第5圖，為美國第8,684,769號專利所揭露的先前技術。Figure 5 is a prior art disclosed in U.S. Patent No. 8,684,769.
如第1至4圖所示，本創作高頻連接器結構係與一電路板1連結，其包含一絕緣體2、複數個端子3、一接地導體4、一金屬殼體5及一屏蔽罩6，其中該絕緣體2包括一本體20、一第一絕緣子21及一第二絕緣子22，其中該本體20沿伸有一舌板部201，而該舌板部201不相鄰的二表面分別凹設有複數個端子槽202，該舌板部201不相鄰的二表面於圖式中係為舌板部201的上表面及下表面。As shown in FIGS. 1 to 4, the high frequency connector structure of the present invention is coupled to a circuit board 1 and includes an insulator 2, a plurality of terminals 3, a ground conductor 4, a metal case 5, and a shield case 6. The insulator 2 includes a body 20, a first insulator 21 and a second insulator 22, wherein the body 20 has a tongue portion 201 extending therefrom, and the two surfaces of the tongue portion 201 not adjacent to each other are respectively recessed. The plurality of terminal grooves 202, the two surfaces of the tongue portion 201 not adjacent to each other are the upper surface and the lower surface of the tongue portion 201 in the drawing.
本實施例中，該些端子3係區分為一第一組端子31及一第二 組端子32，該第一組端子31被固定於第一絕緣子21，該第二組端子32被固定於該第二絕緣子22，其中該第一絕緣子21及該第二絕緣子22是各自成形於該第一組端子31及該第二端子32外緣，這是因為本創作所揭露的該第一絕緣子21及第二絕緣子22是以埋入射出成型法成型於該第一組端子31及該第二端子32外緣，惟上所述僅於本實施例而已，實際使用時，該第一絕緣子21及該第二絕緣子22亦可採用其他成型方法。In this embodiment, the terminals 3 are divided into a first group of terminals 31 and a second a set of terminals 32, the first set of terminals 31 are fixed to the first insulator 21, and the second set of terminals 32 are fixed to the second insulator 22, wherein the first insulator 21 and the second insulator 22 are each formed in the The first set of terminals 31 and the second end of the second terminal 32 are formed, because the first insulator 21 and the second insulator 22 disclosed in the present invention are formed by the immersion molding method on the first group of terminals 31 and the first The outer edge of the two terminals 32, except for the above, is only used in the present embodiment. In actual use, the first insulator 21 and the second insulator 22 may also adopt other forming methods.
本實施例中，該第一組端子31分別具有一接觸部311及一固定部312，該第二組端子32分別具有一接觸部321及一固定部322，且該第一組端子31及該第二組端子32之每一接觸部311、321及每一固定部312、322係分別延伸出該第一絕緣子21及第二絕緣子22。當該第一絕緣子21與該第二絕緣子22被組裝於該本體20時，該第一組端子31及之每一接觸部311係分別穿置於該舌板部201上表面之端子槽202，而每一接觸部321係分別穿置於該舌板部201下表面之端子槽202，使每一接觸部311、321可與一對接連接器形成電性連接，且每一固定部312、322係與該電路板1上適當電子電路形成電性連接。In this embodiment, the first group of terminals 31 respectively have a contact portion 311 and a fixing portion 312. The second group of terminals 32 respectively have a contact portion 321 and a fixing portion 322, and the first group of terminals 31 and the Each of the contact portions 311 and 321 and each of the fixing portions 312 and 322 of the second group of terminals 32 respectively extends the first insulator 21 and the second insulator 22 . When the first insulator 21 and the second insulator 22 are assembled to the body 20, the first group of terminals 31 and each of the contact portions 311 are respectively disposed on the terminal slots 202 of the upper surface of the tongue portion 201. Each of the contact portions 321 is respectively disposed on the terminal groove 202 of the lower surface of the tongue portion 201, so that each of the contact portions 311 and 321 can be electrically connected to the pair of connectors, and each of the fixing portions 312 and 322 It is electrically connected to appropriate electronic circuits on the circuit board 1.
本實施例中，該接地導體4係以金屬薄板裁切彎折成型且具有一遮蔽板41及一連接部42，因該本體20係以埋入射出成型法直接成型於該接地導體4外緣，故該遮蔽板41是被定位於該舌板201內，用以隔離位於該舌板部201相對二表面的該第一組端子31之每一接觸部311及該第二組端子32之每一接觸部321之間的相互電磁感應，而該連接部42係延伸出該本體20外，並利用鈑金技術成型將該連接部42折彎成朝向該電路板1上之接地電路，使該接地導體4能電連接該電路板1，並將高頻電磁波雜訊傳導致該電 路板1之接地電路。然而，此僅為本創作實施方式的一例示，習於此項技藝者可以依據本創作之揭露，而將該接地導體4變化為組裝於該本體20的變化。In this embodiment, the grounding conductor 4 is formed by bending and bending a metal thin plate and has a shielding plate 41 and a connecting portion 42. The body 20 is directly formed on the outer edge of the grounding conductor 4 by a buried incident molding method. Therefore, the shielding plate 41 is positioned in the tongue plate 201 for isolating each contact portion 311 of the first group of terminals 31 and the second group of terminals 32 located on opposite sides of the tongue plate portion 201. a mutual electromagnetic induction between the contact portions 321 , and the connecting portion 42 extends out of the body 20 and is bent by a sheet metal technique to bend the connecting portion 42 to a ground circuit on the circuit board 1 to make the ground The conductor 4 can electrically connect the circuit board 1 and transmit high frequency electromagnetic wave noise to the electricity Ground circuit of the circuit board 1. However, this is merely an example of an embodiment of the present invention, and those skilled in the art can change the ground conductor 4 to a variation assembled to the body 20 in accordance with the disclosure of the present invention.
本實施例中，該屏蔽罩6係由金屬薄板裁切彎折成型且具有一接合部61及一擋板62，於本實施例中，該接合部61係接合該舌板部201外，而該擋板62係由該接合部61一端延伸後屏蔽該第一絕緣子21之部分表面。當本創作與該電路板1連接時，該第一絕緣子21係部分外露於該電路板1(請同參第3圖所示)，該第一絕緣子21部分之外露會導致該些端子3在運作時因為缺少屏蔽而與電路板之間產生相互電磁干擾，故本創作該屏蔽罩6之設計係屏蔽該第一絕緣子2外露之部分(請同參第4圖所示)，以阻絕該些端子3與電路板之間所產生之相互電磁干擾。於本實施例中該接地導體4及該屏蔽罩6係採分開之設計，惟實際使用時，亦可將該屏蔽罩6及該接地導體4採用同一金屬材料，並透過金屬裁切彎折之方式使該屏蔽罩6及該接地導體4為一體成型之設計。In this embodiment, the shielding cover 6 is formed by bending and bending a metal thin plate and has a joint portion 61 and a baffle 62. In the embodiment, the joint portion 61 is engaged with the tongue portion 201, and The baffle 62 extends from one end of the joint portion 61 to shield a portion of the surface of the first insulator 21. When the present invention is connected to the circuit board 1, the first insulator 21 is partially exposed to the circuit board 1 (please refer to FIG. 3), and the partial exposure of the first insulator 21 causes the terminals 3 to be In operation, due to the lack of shielding, electromagnetic interference occurs between the board and the circuit board. Therefore, the design of the shield 6 is to shield the exposed portion of the first insulator 2 (please refer to FIG. 4) to block the Mutual electromagnetic interference between terminal 3 and the board. In the present embodiment, the grounding conductor 4 and the shielding cover 6 are designed separately. However, in actual use, the shielding cover 6 and the grounding conductor 4 may be made of the same metal material and cut and bent through the metal. The shield 6 and the ground conductor 4 are designed in one piece.
本實施例中，該金屬殼體5係由金屬板材以機械鈑金手段裁切並拗折成型，且該金屬殼體5係電連接至該電路板1之接地電路。該金屬殼體5係遮蓋該絕緣體外及該屏蔽罩之部分，用以阻隔該金屬殼體5內、外的電磁波，避免該金屬殼體5內各該端子3傳輸高頻電子訊號時，受外界電磁波影響而產生雜訊。In this embodiment, the metal casing 5 is cut and folded by a metal sheet by mechanical sheet metal, and the metal shell 5 is electrically connected to the ground circuit of the circuit board 1. The metal casing 5 covers the outside of the insulator and a portion of the shielding cover for blocking electromagnetic waves inside and outside the metal casing 5 to prevent the terminals 3 in the metal casing 5 from transmitting high-frequency electronic signals. Noise is generated by the influence of external electromagnetic waves.
本創作較佳實施例之揭露並非用以限定本創作的範圍，任何熟習此技藝者，在不脫離本創作之精神和範圍內，當可作些許之更動與潤飾，因此本創作之保護範圍當視後附之申請專利範圍所界定者為準。The disclosure of the preferred embodiment of the present invention is not intended to limit the scope of the present invention. Any person skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. This is subject to the definition of the scope of the patent application.
1‧‧‧電路板1‧‧‧ boards
2‧‧‧絕緣體2‧‧‧Insulator
20‧‧‧本體20‧‧‧ body
201‧‧‧舌板部201‧‧‧ tongue plate
202‧‧‧端子槽202‧‧‧Terminal slot
21‧‧‧第一絕緣子21‧‧‧First insulator
22‧‧‧第二絕緣子22‧‧‧second insulator
3‧‧‧端子3‧‧‧ terminals
31‧‧‧接觸部31‧‧‧Contacts
32‧‧‧固定部32‧‧‧ Fixed Department
33‧‧‧第一組端子33‧‧‧First set of terminals
34‧‧‧第二組端子34‧‧‧Second group terminal
4‧‧‧接地導體4‧‧‧ Grounding conductor
41‧‧‧遮蔽板41‧‧‧Shielding board
42‧‧‧連接部42‧‧‧Connecting Department
5‧‧‧金屬殼體5‧‧‧Metal housing
6‧‧‧屏蔽罩6‧‧‧Shield
61‧‧‧接合部61‧‧‧ joints
62‧‧‧擋片62‧‧‧Block
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103217308U TWM505729U (en) | 2014-09-29 | 2014-09-29 | A high frequency connector structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103217308U TWM505729U (en) | 2014-09-29 | 2014-09-29 | A high frequency connector structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM505729U true TWM505729U (en) | 2015-07-21 |
Family
ID=54153507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103217308U TWM505729U (en) | 2014-09-29 | 2014-09-29 | A high frequency connector structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM505729U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI651895B (en) * | 2017-11-01 | 2019-02-21 | 幃翔精密股份有限公司 | Electrical connector |
| CN110656821A (en) * | 2019-10-18 | 2020-01-07 | 珠海优特电力科技股份有限公司 | Electronic lock |
| CN110670979A (en) * | 2019-10-18 | 2020-01-10 | 珠海优特电力科技股份有限公司 | Control method of electronic lock and electronic lock |
-
2014
- 2014-09-29 TW TW103217308U patent/TWM505729U/en unknown
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI651895B (en) * | 2017-11-01 | 2019-02-21 | 幃翔精密股份有限公司 | Electrical connector |
| CN110656821A (en) * | 2019-10-18 | 2020-01-07 | 珠海优特电力科技股份有限公司 | Electronic lock |
| CN110670979A (en) * | 2019-10-18 | 2020-01-10 | 珠海优特电力科技股份有限公司 | Control method of electronic lock and electronic lock |
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