TWM505402U - Multilayer complex copper-foil forming equipment - Google Patents
Multilayer complex copper-foil forming equipment Download PDFInfo
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- TWM505402U TWM505402U TW104202117U TW104202117U TWM505402U TW M505402 U TWM505402 U TW M505402U TW 104202117 U TW104202117 U TW 104202117U TW 104202117 U TW104202117 U TW 104202117U TW M505402 U TWM505402 U TW M505402U
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Description
本創作涉及一種電路板製造設備，特別是涉及一種於電路板製程進行銅箔與介電材覆層成形之設備。The present invention relates to a circuit board manufacturing apparatus, and more particularly to an apparatus for forming a copper foil and a dielectric material in a circuit board process.
電路板，係一用以承載電子元件，並且對於各個電子元件進行電性連接之載體。A circuit board is a carrier for carrying electronic components and electrically connecting the respective electronic components.
現有技術電路板之構造，其中一種為具複數層結合結構之多層電路板，其構造係由複數介電層及複數導電層交互覆設疊置形成，導電層上佈設導電線路以電性連接各電子元件，而介電層則做為各導電層間之絕緣基材，再將導電層及介電層經熱壓處理而結合成一整體；導電層材質一般為銅箔，而介電層則為玻璃纖或聚丙烯(PP)。The structure of the prior art circuit board, wherein one of the layers is a multi-layer circuit board having a plurality of layers combined structure, the structure is formed by alternately covering a plurality of dielectric layers and a plurality of conductive layers, and conductive lines are arranged on the conductive layer to electrically connect the respective layers. The electronic component, and the dielectric layer acts as an insulating substrate between the conductive layers, and then the conductive layer and the dielectric layer are combined by heat pressing to form a whole; the conductive layer is generally made of copper foil, and the dielectric layer is glass. Fiber or polypropylene (PP).
然而，現有技術電路板之銅箔與介電材覆層之成形流程，係透過輸送帶與機械手臂之配合，待輸送帶運行至一特定站位，機械手臂將導電層與介電層依序逐一的移動放置於輸送帶上並將導電層與介電層予以疊置，藉以完成銅箔與介電材覆層之結構，因此，使得整個覆層成形之流程過於冗長，從而令相關設備所需之空間增加，不僅無法有效運用廠內空間，也拉長製程所需時間。However, the forming process of the copper foil and the dielectric material coating of the prior art circuit board is through the cooperation of the conveyor belt and the mechanical arm, and the conveyor belt is operated to a specific position, and the mechanical arm sequentially conducts the conductive layer and the dielectric layer. Moving one by one on the conveyor belt and superimposing the conductive layer and the dielectric layer to complete the structure of the copper foil and the dielectric material coating, so that the entire coating forming process is too long, so that the relevant equipment The increase in space required not only fails to effectively use the space inside the plant, but also lengthens the time required for the process.
本創作之目的在於改善現有技術中，銅箔與介電材覆層成形之流程過長，造成廠內空間無法有效利用，以及製程所需時間延長之缺失，藉由本創作技術手段之實施，縮短銅箔與介電材覆層成形之流程，因而得以有效利用廠內空間，並且縮短製程所需時間。The purpose of this creation is to improve the prior art, the process of forming the copper foil and the dielectric material is too long, the internal space cannot be effectively utilized, and the lack of time required for the process is shortened, and the implementation of the creative technique shortens. The process of forming the copper foil and the dielectric material cladding enables efficient use of the plant space and shortens the time required for the process.
為達到上述之創作目的，本創作所採用的技術手段為設計一種多層複銅箔成形設備，具有一進料裝置、一交換裝置、一輸送裝置及一夾取裝置；該交換裝置位於該進料裝置下方，並且具有一基座、一第一載台及一第二載台；該基座至少具有一頂架、一底架、二軌道、二溜座及二馬達，該基座由複數支架、該頂架及該底架相互結合組成，該頂架及該底架分別位於該基座之上、下二端處，該二軌道分別設置於該頂架及該底架，該溜座可移動的連接於該軌道，該二馬達安裝於該基座並且分別動力連接於該二溜座；該第一載台連接設置於該頂架之溜座；該第二載台具有一台座、一伸縮組及複數滑軌，該伸縮組及該滑軌之相對二端分別連接於該台座及設置於該底架之溜座；該輸送裝置設置於該交換裝置之一側；該夾取裝置設置於該交換裝置之另一側。In order to achieve the above-mentioned creative purposes, the technical means adopted in the present invention is to design a multi-layer copper foil forming apparatus having a feeding device, an exchange device, a conveying device and a gripping device; the switching device is located at the feeding device Under the device, and having a base, a first stage and a second stage; the base has at least one top frame, one bottom frame, two tracks, two sliding seats and two motors, the base is composed of a plurality of brackets The top frame and the bottom frame are combined with each other, and the top frame and the bottom frame are respectively located at the upper and lower ends of the base, and the two rails are respectively disposed on the top frame and the bottom frame, and the sliding seat can be Movably connected to the track, the two motors are mounted on the base and are respectively respectively connected to the two slides; the first stage is connected to the slide seat of the top frame; the second stage has a seat and a seat a telescopic group and a plurality of sliding rails, wherein the telescopic group and the opposite ends of the sliding rail are respectively connected to the pedestal and the sliding seat disposed on the chassis; the conveying device is disposed on one side of the switching device; the clamping device is disposed On the other side of the switching device.
所述之多層複銅箔成形設備，其中該基座進一步具有複數傳動件及複數定位轉向件，該複數定位轉向件分別裝設於該頂架及該底架，該複數傳動件繞設該定位轉向件，並且連接於該溜座及該馬達之輸出端，使該溜座受該馬達之動力傳輸而於該軌道位移。The multi-layer copper foil forming apparatus, wherein the base further has a plurality of transmission members and a plurality of positioning and steering members, wherein the plurality of positioning and steering members are respectively mounted on the top frame and the chassis, and the plurality of transmission members surround the positioning And a steering member coupled to the sliding seat and the output end of the motor, such that the sliding seat is displaced by the power of the motor and displaced in the track.
所述之多層複銅箔成形設備，其中該伸縮組係具有一氣缸及一活塞桿，該氣缸的活塞桿自由端連接於該第二載台之台座，該氣缸連接於該底架之溜座。The multi-layer copper foil forming apparatus, wherein the telescopic assembly has a cylinder and a piston rod, and a free end of the piston rod of the cylinder is connected to a pedestal of the second stage, and the cylinder is connected to the sliding seat of the chassis .
所述之多層複銅箔成形設備，其中該進料裝置具有一橫移軌道及一吸吊機，該橫移軌道裝設一驅動馬達，該驅動馬達動力連接該吸吊機，該吸吊機可移動的連接於該橫移軌道；該交換裝置設置位於該橫移軌道下方。The multi-layer copper foil forming apparatus, wherein the feeding device has a traverse track and a suction crane, the traverse rail is provided with a driving motor, and the driving motor is powered to connect the suction crane, the suction crane Removably attached to the traverse track; the switching device is disposed below the traverse track.
所述之多層複銅箔成形設備，其中該輸送裝置具有一第一運送軌道、一第二運送軌道、一夾吊機及一運送馬達；該第一運送軌道及該第二運送軌道互呈垂直設置，該運送馬達裝設於該輸送裝置並且動力連接該夾吊機，該夾吊機可移動的連接於該第一運送軌道及該第二運送軌道；該第一運送軌道的一端突伸設置位於該交換裝置之上方。The multi-layer copper foil forming apparatus, wherein the conveying device has a first conveying rail, a second conveying rail, a hoisting machine and a conveying motor; the first conveying rail and the second conveying rail are perpendicular to each other Provided that the transport motor is mounted on the transport device and is electrically connected to the clamp crane, the clamp crane is movably coupled to the first transport rail and the second transport rail; one end of the first transport rail protrudes Located above the switching device.
本創作的優點在於，透過交換裝置之設置，使得銅箔與介電材覆層成形之流程得以縮短，由於第一載台及第二載台係可移動的連接於基座，因此，當進料裝置與夾取裝置分別夾取介電材與銅箔至交換裝置時，第一載台及第二載台彼此進行位置交換，使得介電材與銅箔之進給得以交錯進行，從而達成銅箔與介電材之覆設成形，再由輸送裝置將完成覆層成形之銅箔與介電材移至下一製程處，因而得以有效利用廠內空間，並且縮短製程所需時間。The advantage of this creation is that the flow of forming the copper foil and the dielectric material is shortened by the arrangement of the switching device, and since the first stage and the second stage are movably connected to the base, When the material device and the clamping device respectively take the dielectric material and the copper foil to the switching device, the first stage and the second stage exchange position with each other, so that the feeding of the dielectric material and the copper foil is interleaved, thereby achieving The copper foil and the dielectric material are overmolded, and the copper foil and the dielectric material which complete the cladding forming are moved to the next process by the conveying device, thereby effectively utilizing the internal space of the plant and shortening the time required for the process.
以下配合圖式及本創作之較佳實施例，進一步闡述本創作為達成預定創作目的所採取的技術手段。The technical means adopted by the present invention for achieving the intended purpose of creation are further explained below in conjunction with the drawings and the preferred embodiment of the present invention.
請參照圖1所示，本創作之多層複銅箔成形設備具有一進料裝置10、一交換裝置20、一輸送裝置30及一夾取裝置(圖中未示)。Referring to FIG. 1, the multi-layer copper foil forming apparatus of the present invention has a feeding device 10, an exchange device 20, a conveying device 30, and a gripping device (not shown).
請參照圖1及圖3所示，該進料裝置10具有一橫移軌道11及一吸吊機12，該橫移軌道11裝設一驅動馬達111，該驅動馬達111動力連接該吸吊機12，該吸吊機12可移動的連接於該橫移軌道11，該吸吊機12受該驅動馬達111帶動可於該橫移軌道11進行位移，其中該移動機構為現有技術；該橫移軌道11下方之相對二端處分別設置一第一料架101及一第二料架102，該第一料架101疊置裝載有介電材之複數料盤，該第二料架102疊置有未裝載介電材之料盤，該吸吊機12可吸取該第一料架101處之介電材，該介電材之材質可為PP或玻璃纖維，另可將該第一料架101之空料盤吸取移至該第二料架102。Referring to FIG. 1 and FIG. 3, the feeding device 10 has a traverse track 11 and a suction crane 12, and the traverse track 11 is provided with a driving motor 111, and the driving motor 111 is connected to the suction crane. 12, the suction crane 12 is movably coupled to the traverse rail 11, and the hoisting machine 12 is movably displaced by the driving motor 111, wherein the moving mechanism is prior art; the traverse A first rack 101 and a second rack 102 are respectively disposed at opposite ends of the rail 11, and the first rack 101 is stacked with a plurality of trays loaded with dielectric materials, and the second racks 102 are stacked. The tray is unloaded with a dielectric material, and the suction machine 12 can absorb the dielectric material at the first rack 101. The material of the dielectric material can be PP or glass fiber, and the first material rack can be used. The empty tray of 101 is sucked and moved to the second rack 102.
請參照圖1及圖2所示，該交換裝置20位於該進料裝置10下方，並且位在第一料架101及第二料架102之間，交換裝置20具有一基座21、一第一載台22及一第二載台23，該第一載台22及該第二載台23可移動的連接於該基座21。Referring to FIG. 1 and FIG. 2, the switching device 20 is located below the feeding device 10 and is located between the first rack 101 and the second rack 102. The switching device 20 has a base 21 and a first A stage 22 and a second stage 23 are movably connected to the base 21.
該基座21至少具有一頂架211、一底架212、二軌道213、二溜座214及二馬達215。The base 21 has at least one top frame 211, one bottom frame 212, two tracks 213, two slides 214, and two motors 215.
該基座21由複數支架、該頂架211及該底架212相互結合組成，該頂架211及該底架212分別位於該基座21之上、下二端處，該二軌道213分別設置於該頂架211及該底架212，該溜座214可移動的連接於該軌道213，該二馬達215安裝於該基座21並且分別動力連接於該二溜座214；於本創作之具體實施例，該基座21進一步具有複數傳動件216及複數定位轉向件217，該複數定位轉向件217分別裝設於該頂架211及該底架212，該複數傳動件216繞設該定位轉向件217，並且連接於該溜座214及該馬達215之輸出端，使該溜座214受該馬達215之動力傳輸而於該軌道213位移。The base 21 is composed of a plurality of brackets, the top frame 211 and the bottom frame 212. The top frame 211 and the bottom frame 212 are respectively located above and below the base 21, and the two rails 213 are respectively disposed. The top frame 211 and the bottom frame 212 are movably connected to the rail 213, and the two motors 215 are mounted on the base 21 and are respectively respectively connected to the two slides 214; In an embodiment, the base 21 further has a plurality of transmission members 216 and a plurality of positioning and steering members 217. The plurality of positioning and steering members 217 are respectively mounted on the top frame 211 and the chassis 212. The plurality of transmission members 216 are disposed around the positioning. The member 217 is coupled to the slide holder 214 and the output end of the motor 215 such that the slide holder 214 is transmitted by the power of the motor 215 to be displaced on the rail 213.
該第一載台22連接設置於該頂架211之溜座214，該第一載台22可於該頂架211之軌道213進行橫向位移。The first stage 22 is connected to the slide 214 disposed on the top frame 211. The first stage 22 is laterally displaceable on the rail 213 of the top frame 211.
該第二載台23具有一台座230、一伸縮組231及複數滑軌232，該伸縮組231及該滑軌232之相對二端分別連接於該台座230及設置於該底架212之溜座214，該第二載台23可於該底架212之軌道213進行橫向位移，並且該伸縮組231及該複數滑軌使該台座230可於該頂架211及該底架212之間縱向的升降位移，具體而言，該伸縮組231係具有一氣缸及一活塞桿，該氣缸的活塞桿自由端連接於該台座230，該氣缸連接於該底架212之溜座214；請參照圖3所示，該交換裝置20設置於該進料裝置10之橫移軌道11下方。The second stage 23 has a pedestal 230, a telescopic group 231 and a plurality of sliding rails 232. The opposite ends of the telescopic group 231 and the sliding rail 232 are respectively connected to the pedestal 230 and the sliding seat disposed on the chassis 212. 214, the second stage 23 is laterally displaceable on the track 213 of the chassis 212, and the telescopic group 231 and the plurality of slide rails enable the pedestal 230 to be longitudinally between the top frame 211 and the chassis 212. The lifting and lowering, in particular, the telescopic group 231 has a cylinder and a piston rod, the free end of the piston rod of the cylinder is connected to the pedestal 230, and the cylinder is connected to the sliding seat 214 of the chassis 212; please refer to FIG. As shown, the exchange device 20 is disposed below the traverse track 11 of the feed device 10.
請參照圖1所示，該輸送裝置30設置於該交換裝置20之一側，並且具有一第一運送軌道31、一第二運送軌道32、一夾吊機33及一運送馬達(圖中未示)；該第一運送軌道31及該第二運送軌道32的運送移動方向為互呈垂直設置，該運送馬達裝設於該輸送裝置30並且動力連接該夾吊機33，該夾吊機33可移動的連接於該第一運送軌道31及該第二運送軌道32，該夾吊機33受該運送馬達驅動可於該第一運送軌道31及該第二運送軌道32進行位移；該第一運送軌道31的一端突伸設置位於該交換裝置20上方。Referring to FIG. 1 , the conveying device 30 is disposed on one side of the switching device 20 and has a first conveying rail 31 , a second conveying rail 32 , a clamping machine 33 and a conveying motor (not shown in the figure). The transporting direction of the first transport rail 31 and the second transport rail 32 is perpendicular to each other, and the transport motor is mounted on the transport device 30 and is electrically connected to the clamp crane 33. The clamp crane 33 The first transport rail 31 and the second transport rail 32 are movably connected to the first transport rail 31 and the second transport rail 32 by the transport motor; the first One end of the transport rail 31 is projectingly disposed above the exchange device 20.
該夾取裝置設置於該交換裝置20之另一側(圖中未示)；該夾取裝置用以夾取銅箔至該交換裝置20之載台。The clamping device is disposed on the other side of the switching device 20 (not shown); the clamping device is used for clamping the copper foil to the loading platform of the switching device 20.
於本創作進行銅箔與介電材覆層之過程，請同時參照圖2、圖4及圖5所示，首先，該夾取裝置夾取一第一片銅箔41至該第一載台22，接著該第二載台23之台座230由該伸縮組231帶動沿著該滑軌232下降，同時，該第一載台22則由另一馬達215帶動沿著該頂架211之軌道213位移至原本第二載台23之位置，並且該第二載台23由其中一馬達215帶動沿著該底架212之軌道213位移至原本第一載台22之位置，再由該伸縮組231帶動沿著該滑軌232上升，此時，該第一載台22及該第二載台23完成位置之交換。For the process of coating the copper foil and the dielectric material in the present invention, please refer to FIG. 2, FIG. 4 and FIG. 5 at the same time. First, the clamping device picks up a first piece of copper foil 41 to the first stage. 22, then the pedestal 230 of the second stage 23 is driven by the telescopic group 231 to descend along the sliding rail 232, and the first stage 22 is driven by another motor 215 along the track 213 of the top frame 211. Displacement to the position of the second stage 23, and the second stage 23 is displaced by the motor 215 along the track 213 of the chassis 212 to the position of the original first stage 22, and then the telescopic group 231 The driving is raised along the sliding rail 232. At this time, the first stage 22 and the second stage 23 complete the exchange of positions.
接著，該夾取裝置夾取另一第一片銅箔42至該第二載台23，請同時參照圖3及圖4所示，同時，該進料裝置10之吸吊機12由該馬達111驅動位移至該第一料架101上方吸取一介電材103，並將該介電材103放置該第一載台22之第一片銅箔41上。Next, the clamping device picks up another first piece of copper foil 42 to the second stage 23, please refer to FIG. 3 and FIG. 4 at the same time, and at the same time, the suction machine 12 of the feeding device 10 is driven by the motor. 111 driving displacement to the first rack 101 to pick up a dielectric material 103, and placing the dielectric material 103 on the first copper foil 41 of the first stage 22.
裝載有該第一片銅箔41及該介電材103之第一載台22，經由該馬達215帶動沿著該頂架211之軌道213位移至原本之位置，同時，裝載該第一片銅箔42之第二載台23由該伸縮組231帶動沿著該滑軌232下降，並且該第二載台23由該馬達215帶動沿著該底架212之軌道213位移至原本之位置，再由該伸縮組231帶動沿著該滑軌232上升，則該第一載台22及該第二載台23完成再次交換，以回復原本之位置；此時，該進料裝置10之吸吊機12將該第一料架101之空料盤吸取移至該第二料架102疊置。The first stage 22 on which the first copper foil 41 and the dielectric material 103 are loaded is driven to move to the original position along the track 213 of the top frame 211 via the motor 215, and the first piece of copper is loaded. The second stage 23 of the foil 42 is driven by the telescopic group 231 to descend along the sliding rail 232, and the second stage 23 is driven by the motor 215 to move along the track 213 of the chassis 212 to the original position. The first stage 22 and the second stage 23 are exchanged again to return to the original position. 12, the empty tray of the first rack 101 is sucked and moved to the second rack 102.
再下一步，該進料裝置10之吸吊機12由該第一料架101吸取一介電材104，並將該介電材103放置該第二載台23之第一片銅箔42上，同時，該夾取裝置夾取另一第二片銅箔43至裝載有該第一片銅箔41及該介電材103之第一載台22，將該第二片銅箔43覆設於該介電材103上，使一電路板形成上、下各有一層銅箔而且中間夾設一介電材之覆層結構，從而完成銅箔與介電材覆層成形之製程；請同時參照圖1所示，該輸送裝置30之夾吊機33沿著該第一運送軌道31位移至該第一載台22上方，並且夾取完成覆層製程之銅箔與介電材，該夾吊機33接著沿該第二運送軌道32位移，以將銅箔與介電材之覆層移至下一製程處。In the next step, the suction and hoisting machine 12 of the feeding device 10 draws a dielectric material 104 from the first material rack 101, and places the dielectric material 103 on the first copper foil 42 of the second loading table 23. The clamping device picks up another second piece of copper foil 43 to the first stage 22 on which the first piece of copper foil 41 and the dielectric material 103 are loaded, and the second piece of copper foil 43 is coated thereon. On the dielectric material 103, a circuit board is formed with a layer of copper foil on each of the upper and lower layers, and a cladding structure of a dielectric material is interposed therebetween, thereby completing the process of forming the copper foil and the dielectric material cladding layer; The hoisting machine 33 of the conveying device 30 is displaced along the first conveying rail 31 to the first stage 22, and the copper foil and the dielectric material which complete the coating process are clamped, and the hoisting machine 33 is continued Displacement along the second transport track 32 to move the copper foil and dielectric coating to the next process.
本創作之多層複銅箔成形設備透過該交換裝置20之設置，使得銅箔與介電材覆層成形之流程得以縮短，由於該第一載台22及該第二載台23係可移動的連接於基座21，因此，當該進料裝置10與該夾取裝置(圖中未示)分別夾取介電材與銅箔至該交換裝置20時，該第一載台22及該第二載台23透過該基座21之軌道213、溜座214及馬達215，而彼此進行位置交換，使得介電材與銅箔移至該交換裝置20之進給得以交錯進行，從而達成銅箔與介電材之覆設成形，最後，再由該輸送裝置30之夾吊機33將完成覆層成形之銅箔與介電材移至下一製程處，因而，令本創作得以改善銅箔與介電材覆層流程冗長之缺失，有效利用廠內空間，並且縮短製程所需時間。The multi-layer copper foil forming apparatus of the present invention is configured to shorten the flow of forming the copper foil and the dielectric material by the arrangement of the switching device 20, since the first stage 22 and the second stage 23 are movable The first stage 22 and the first portion are connected to the base device 21 when the feeding device 10 and the clamping device (not shown) respectively sandwich the dielectric material and the copper foil to the switching device 20 The two stages 23 are exchanged with each other through the track 213, the slide 214 and the motor 215 of the base 21, so that the feeding of the dielectric material and the copper foil to the exchange device 20 is staggered, thereby achieving copper foil. Forming and forming with the dielectric material, and finally, the copper foil and the dielectric material which are completed by the coating device 33 are moved to the next process, thereby improving the copper foil of the present invention. The lack of lengthy process with the dielectric coating process makes efficient use of the plant space and shortens the time required for the process.
以上所述僅是本創作的較佳實施例而已，並非對本創作做任何形式上的限制，雖然本創作已以較佳實施例揭露如上，然而並非用以限定本創作，任何所屬技術領域中具有通常知識者，在不脫離本創作技術方案的範圍內，當可利用上述揭示的技術內容作出些許更動或修飾為等同變化的等效實施例，但凡是未脫離本創作技術方案的內容，依據本創作的技術實質對以上實施例所作的任何簡單修改、等同變化與修飾，均仍屬於本創作技術方案的範圍內。The above description is only a preferred embodiment of the present invention, and does not impose any form limitation on the present invention. Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit the present creation, and has any technical field. A person skilled in the art can make some modifications or modifications to equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. The technical essence of the creation Any simple modification, equivalent change and modification of the above embodiments are still within the scope of the technical solution of the present invention.
10‧‧‧進料裝置
11‧‧‧橫移軌道
111‧‧‧馬達
12‧‧‧吸吊機
101‧‧‧第一料架
102‧‧‧第二料架
103、104‧‧‧介電材
20‧‧‧交換裝置
21‧‧‧基座
211‧‧‧頂架
212‧‧‧底架
213‧‧‧軌道
214‧‧‧溜座
215‧‧‧馬達
216‧‧‧傳動件
217‧‧‧定位轉向件
22‧‧‧第一載台
23‧‧‧第二載台
231‧‧‧氣缸
232‧‧‧滑軌
30‧‧‧輸送裝置
31‧‧‧第一運送軌道
32‧‧‧第二運送軌道
33‧‧‧夾吊機
41、42‧‧‧第一片銅箔
43‧‧‧第二片銅箔10‧‧‧Feeding device
11‧‧‧traversing orbit
111‧‧‧Motor
12‧‧‧ suction crane
101‧‧‧First rack
102‧‧‧Second rack
103, 104‧‧‧ dielectric materials
20‧‧‧Exchange device
21‧‧‧Base
211‧‧‧Top frame
212‧‧‧ Chassis
213‧‧‧ Track
214‧‧‧Slide
215‧‧‧ motor
216‧‧‧ transmission parts
217‧‧‧ Positioning steering parts
22‧‧‧First stage
23‧‧‧Second stage
231‧‧‧ cylinder
232‧‧‧rails
30‧‧‧Conveyor
31‧‧‧First transport track
32‧‧‧Second transport track
33‧‧‧Clamp crane
41, 42‧‧‧ first piece of copper foil
43‧‧‧Second copper foil
圖1為本創作之上視圖。 圖2為本創作交換裝置之正視圖。 圖3為本創作進料裝置之正視圖。 圖4為本創作進行銅箔與介電材覆層之流程示意圖。 圖5為本創作交換裝置之第一載台與第二載台位移之示意圖。Figure 1 is a top view of the creation. Figure 2 is a front elevational view of the authoring exchange device. Figure 3 is a front elevational view of the inventive feeding device. FIG. 4 is a schematic flow chart of copper foil and dielectric material coating in the present invention. Figure 5 is a schematic view showing the displacement of the first stage and the second stage of the authoring exchange device.
10‧‧‧進料裝置 10‧‧‧Feeding device
101‧‧‧第一料架 101‧‧‧First rack
102‧‧‧第二料架 102‧‧‧Second rack
20‧‧‧交換裝置 20‧‧‧Exchange device
21‧‧‧基座 21‧‧‧Base
22‧‧‧第一載台 22‧‧‧First stage
23‧‧‧第二載台 23‧‧‧Second stage
30‧‧‧輸送裝置 30‧‧‧Conveyor
31‧‧‧第一運送軌道 31‧‧‧First transport track
32‧‧‧第二運送軌道 32‧‧‧Second transport track
33‧‧‧夾吊機 33‧‧‧Clamp crane
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104202117U TWM505402U (en) | 2015-02-10 | 2015-02-10 | Multilayer complex copper-foil forming equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104202117U TWM505402U (en) | 2015-02-10 | 2015-02-10 | Multilayer complex copper-foil forming equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM505402U true TWM505402U (en) | 2015-07-21 |
Family
ID=54153208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104202117U TWM505402U (en) | 2015-02-10 | 2015-02-10 | Multilayer complex copper-foil forming equipment |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM505402U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109435213A (en) * | 2018-12-12 | 2019-03-08 | 陈秀莲 | A kind of multilayer material heat seal forming machine and its multilayer material heat seal setting process |
-
2015
- 2015-02-10 TW TW104202117U patent/TWM505402U/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109435213A (en) * | 2018-12-12 | 2019-03-08 | 陈秀莲 | A kind of multilayer material heat seal forming machine and its multilayer material heat seal setting process |
| CN109435213B (en) * | 2018-12-12 | 2023-05-12 | 汕头市亿力机械设备有限公司 | Multilayer material heat-seal shaping machine and multilayer material heat-seal shaping process thereof |
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