TWM500893U

TWM500893U - Chip probing equipment

Info

Publication number: TWM500893U
Application number: TW103216936U
Authority: TW
Inventors: Hsiu-Wei Lin; Hung-I Lin
Original assignee: Mpi Corp
Priority date: 2014-09-24
Filing date: 2014-09-24
Publication date: 2015-05-11
Also published as: MY171320A

Abstract

A chip probing equipment is suitable for testing an optical character of a chip and includes the following elements. A charging station arranges the chip, not being probed. A probing station provides electric signals via a backside of the chip and testing the optical character of the chip. A discharging station arranges the chip, being probed. A first placing unit transfers the chip, not being probed, from the charging station to the probing station. A second placing unit transfers the chip, being probed, from the probing station to the discharging station. An image capturing unit is located at the discharging station and captures an image of the backside of the chip. The imaging capturing unit may also be located between the probing station and the discharging station or between the charging station and the probing station to capture the image of the backside of the chip.

Description

晶粒點測設備Die spot measuring equipment

本新型是有關一種晶粒點測設備，且特別是有關於一種適用於電極在背面的LED晶粒的晶粒點測設備。The present invention relates to a die spot measuring apparatus, and more particularly to a die spot measuring apparatus suitable for an LED die having an electrode on the back side.

點測機(prober)是一種用來檢測晶粒(例如LED晶粒或IC晶粒)的特性參數的測試設備。對於電極在背面的LED晶粒而言，可利用探針接觸晶粒背面的電極來提供電訊號，同時搭配收光器(例如積分球)來量測LED晶粒的光學特性參數。A probe is a test device used to detect characteristic parameters of a die, such as an LED die or an IC die. For the LED die with the electrode on the back side, the probe can be used to contact the electrode on the back side of the die to provide an electrical signal, and the optical characteristic parameter of the LED die can be measured with a light receiver (such as an integrating sphere).

應用於電極在背面的LED晶粒的點測機通常包括進料站、點測站、出料站及兩取置臂。在點測過程中，利用取置臂先將未點測的晶粒從進料站轉移至點測站以進行點測，再利用另一取置臂將已點測的LED晶粒從點測站轉移至出料站。A spot measuring machine for an LED die having an electrode on the back side typically includes a feed station, a spotting station, a discharge station, and two take-up arms. In the point measurement process, the unmeasured die is transferred from the feeding station to the spot station for spot measurement by using the take-up arm, and the measured LED die is measured from the spot by another pick-up arm. The station is transferred to the discharge station.

為了對LED晶粒進行背部檢查或身份識別，點測機更包括一取像站及另一取置臂。在點測站完成點測以後，利用取置臂將LED晶粒從點測站轉移至取像站，以擷取LED晶粒背面的影像來進行背部檢查或身份識別。最後，利用取置臂將LED晶粒再從取像站轉移回到點測站，再利用原先的取置臂將LED晶粒從點測站轉移至出料站。In order to back-check or identify the LED die, the spotting machine further includes an image taking station and another pick-up arm. After the spot station completes the spot test, the LED die is transferred from the spot station to the image taking station by the take-up arm to capture the image on the back side of the LED die for back inspection or identification. Finally, the LED die is transferred from the image taking station back to the spot station by using the arm, and the LED die is measured from the spot using the original arm. The station is transferred to the discharge station.

在需要對LED晶粒進行身份識別的情況下，每個LED晶粒的背面還具有身份識別編號，故可對所擷取的影像進行光學字元辨識(OCR)，以取得此LED晶粒的身份識別編號。因此，可對應此LED晶粒的身份識別編號來紀錄此LED晶粒的點測結果，以成為每個LED晶粒的個別生產履歷的一部分。In the case where the LED dies need to be identified, the back side of each LED die also has an identification number, so that the captured image can be optically recognized (OCR) to obtain the LED dies. Identification number. Therefore, the spot measurement result of the LED die can be recorded corresponding to the identification number of the LED die to become part of the individual production history of each LED die.

然而，為了取得LED晶粒背面的影像，LED晶粒在點測站及取像站之間的二次轉移將會增加每個LED晶粒的點測週期，因而降低LED晶粒的點測效率。However, in order to obtain the image on the back side of the LED die, the secondary transfer of the LED die between the spot station and the image taking station will increase the spotting period of each LED die, thereby reducing the spotting efficiency of the LED die. .

本新型是指一種晶粒點測設備，適用於電極在背面的LED晶粒的點測。The present invention refers to a die point measuring device suitable for spotting LED electrodes on the back side.

本新型的一實施例提出一種晶粒點測設備適於檢測一晶粒的光學特性並包括下列元件。一進料站安置未點測的晶粒。一點測站從晶粒的一背面提供電訊號並檢測晶粒的光學特性。一出料站安置已點測的晶粒。一第一取置單元將未點測的晶粒從進料站轉移至點測站。一第二取置單元將已點測的晶粒從點測站轉移至出料站。一取像單元設置於出料站並擷取安置在出料站的晶粒背面的一影像。An embodiment of the present invention provides a die spot measuring apparatus adapted to detect optical characteristics of a die and to include the following components. A feed station places unmeasured grains. A point station provides electrical signals from one back side of the die and detects the optical characteristics of the die. A discharge station places the measured crystal grains. A first accommodating unit transfers the unmeasured dies from the feeding station to the spot station. A second take-up unit transfers the spotted die from the point station to the discharge station. An image taking unit is disposed at the discharge station and captures an image of the back of the die disposed at the discharge station.

本新型提出另一種晶粒點測設備適於檢測一晶粒的光學特性並包括下列元件。一進料站安置未點測的晶粒。一點測站從晶粒的一背面提供電訊號並檢測晶粒的光學特性。一出料站安置已點測的晶粒。一第一取置單元將未點測的晶粒從進料站轉移至點測站。一第二取置單元將已點測的晶粒從點測站轉移至出料站。一取像單元設置於點測站與出料站之間，以擷取從點測站轉移至出料站的晶粒背面的一影像。The present invention proposes another grain spotting device suitable for detecting the optical properties of a die and including the following components. A feed station places unmeasured grains. a little station from A back side of the die provides electrical signals and detects the optical properties of the die. A discharge station places the measured crystal grains. A first accommodating unit transfers the unmeasured dies from the feeding station to the spot station. A second take-up unit transfers the spotted die from the point station to the discharge station. An image taking unit is disposed between the spot station and the discharge station to capture an image of the back side of the die transferred from the spot station to the discharge station.

本新型提出另一種晶粒點測設備適於檢測一晶粒的光學特性並包括下列元件。一進料站安置未點測的晶粒。一點測站從晶粒的一背面提供電訊號並檢測晶粒的光學特性。一出料站安置已點測的晶粒。一第一取置單元將未點測的晶粒從進料站轉移至點測站。一第二取置單元將已點測的晶粒從點測站轉移至出料站。一取像單元設置於進料站與點測站之間，以擷取從進料站轉移至點測站的晶粒背面的一影像。The present invention proposes another grain spotting device suitable for detecting the optical properties of a die and including the following components. A feed station places unmeasured grains. A point station provides electrical signals from one back side of the die and detects the optical characteristics of the die. A discharge station places the measured crystal grains. A first accommodating unit transfers the unmeasured dies from the feeding station to the spot station. A second take-up unit transfers the spotted die from the point station to the discharge station. An image taking unit is disposed between the feeding station and the spotting station to capture an image of the back side of the die transferred from the feeding station to the spotting station.

綜上所述，在本新型中，取像單元設置在出料區，或位在點測站與出料站之間，或位在進料站與點測站之間，用以擷取晶粒背面的影像。因此，在不增加晶粒的轉移路徑的距離的情況下，仍可擷取晶粒背面的影像，進而維持晶粒的點測效率。In summary, in the present invention, the image taking unit is disposed in the discharge area, or between the point measurement station and the discharge station, or between the feed station and the point measurement station for picking up the crystal. The image of the back of the grain. Therefore, without increasing the distance of the transfer path of the die, the image on the back side of the die can be captured, thereby maintaining the spotting efficiency of the die.

為讓本新型的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.

50‧‧‧晶粒50‧‧‧ grain

52‧‧‧背面52‧‧‧Back

54‧‧‧電極54‧‧‧Electrode

100‧‧‧晶粒點測設備100‧‧‧Crystal point measuring equipment

110‧‧‧進料站110‧‧‧ Feeding station

112‧‧‧黏性膜112‧‧‧viscous film

114‧‧‧頂針114‧‧‧ thimble

120‧‧‧點測站120‧‧ ‧ point station

122‧‧‧支撐座122‧‧‧ support

124‧‧‧探針124‧‧‧Probe

126‧‧‧收光器126‧‧‧ Receiver

130‧‧‧出料站130‧‧‧Drawing station

132‧‧‧黏性膜132‧‧‧viscous film

141‧‧‧第一取置單元141‧‧‧First take-up unit

142‧‧‧第二取置單元142‧‧‧Second access unit

150‧‧‧取像單元150‧‧‧Image capture unit

152‧‧‧發光元件152‧‧‧Lighting elements

154‧‧‧影像感測元件154‧‧‧Image sensing components

160‧‧‧透明平台160‧‧‧Transparent platform

162‧‧‧真空通道162‧‧‧vacuum channel

170‧‧‧中空平台170‧‧‧ hollow platform

172‧‧‧真空通道172‧‧‧vacuum channel

200‧‧‧真空源200‧‧‧vacuum source

圖1是本新型的一實施例的一種晶粒點測設備的示意圖。1 is a schematic view of a die spot measuring apparatus according to an embodiment of the present invention.

圖2A是圖1之晶粒點測設備的進料站的示意圖。2A is a schematic illustration of a feed station of the die spotting apparatus of FIG. 1.

圖2B是圖1之晶粒點測設備的點測站的示意圖。2B is a schematic diagram of a spot station of the die point measuring device of FIG. 1.

圖2C是圖1之晶粒點測設備的出料站的示意圖。2C is a schematic view of a discharge station of the die point measuring apparatus of FIG. 1.

圖3是本新型的另一實施例的一種晶粒點測設備的取置單元、出料站及取像單元的示意圖。3 is a schematic diagram of a take-out unit, a discharge station, and an image taking unit of a die spot measuring device according to another embodiment of the present invention.

圖4是本新型的另一實施例的一種晶粒點測設備的取置單元、出料站及取像單元的示意圖。4 is a schematic diagram of a take-up unit, a discharge station, and an image taking unit of a die spot measuring device according to another embodiment of the present invention.

圖5是本新型的另一實施例的一種晶粒點測設備的示意圖。FIG. 5 is a schematic diagram of a die spot measuring apparatus according to another embodiment of the present invention.

圖6是本新型的另一實施例的一種晶粒點測設備的示意圖。FIG. 6 is a schematic diagram of a die spot measuring apparatus according to another embodiment of the present invention.

請參考圖1，晶粒點測設備100適於檢測晶粒(例如LED晶粒)的光學特性。晶粒點測設備100包括一進料站110、一點測站120、一出料站130、一第一取置單元141、一第二取置單元142及一取像單元150。進料站110安置未點測的晶粒(如圖2A所示之晶粒50)。點測站120從晶粒的背面提供電訊號以檢測晶粒的光學特性。出料站130安置已點測的晶粒。第一取置單元141(例如取置臂)將未點測的晶粒從進料站110轉移至點測站120。第二取置單元142(例如取置臂)將已點測的晶粒從點測站120轉移至出料站130。取像單元150設置於出料站130並擷取安置在出料站130的晶粒背面的一影像，以提供作為晶粒的背部檢查或身份識別的用途。Referring to FIG. 1, the die spotting apparatus 100 is adapted to detect optical characteristics of a die (eg, an LED die). The die point measuring device 100 includes a feeding station 110, a point measuring station 120, a discharging station 130, a first accommodating unit 141, a second accommodating unit 142 and an image capturing unit 150. The feed station 110 houses the unmeasured grains (the grains 50 as shown in Fig. 2A). Spot station 120 provides electrical signals from the back side of the die to detect the optical characteristics of the die. The discharge station 130 houses the crystal grains that have been spotted. The first accommodating unit 141 (eg, the accommodating arm) transfers the unmeasured dies from the feeding station 110 to the spotting station 120. The second take-up unit 142 (eg, the take-up arm) transfers the spotted die from the spot station 120 to the discharge station 130. The image capture unit 150 is disposed at the discharge station 130 and captures an image disposed on the back side of the die of the discharge station 130 to provide for back inspection or identification of the die.

請參考圖1及圖2A，在本實施例中，進料站110可包括一黏性膜112及一頂針114。晶粒50黏附在黏性膜112上。當利用第一取置單元141將晶粒50從進料站110轉移至點測站120時，頂針114將向上推頂黏性膜112以減少晶片50與黏性膜112之間的黏力，讓第一取置單元141容易拾取晶粒50。Referring to FIG. 1 and FIG. 2A , in the embodiment, the feeding station 110 can include a viscous film 112 and a thimble 114 . The crystal grains 50 adhere to the viscous film 112. When the die 50 is transferred from the feeding station 110 to the spotting station 120 by the first accommodating unit 141, the thimble 114 will push up the viscous film 112 to reduce the adhesion between the wafer 50 and the viscous film 112. The first take-up unit 141 is made easy to pick up the die 50.

請參考圖1及圖2B，在本實施例中，點測站120可包括一支撐座122、多個探針124及一收光器126。在利用第一取置單元141將晶粒50從進料站110轉移至點測站120以後，晶粒50可利用真空吸力定位在支撐座122上，並利用這些探針124分別接觸晶粒50的背面52的多個電極54，以從晶粒50的背面52提供電訊號，而由晶粒50的正面產生光源。同時，利用收光器126來收集晶粒50所發出的光，以檢測晶粒50的光學特性。Referring to FIG. 1 and FIG. 2B , in the embodiment, the station 120 can include a support base 122 , a plurality of probes 124 , and a light receiver 126 . After the die 50 is transferred from the feed station 110 to the spot station 120 by the first accommodating unit 141, the dies 50 can be positioned on the support base 122 by vacuum suction, and the probes 124 are respectively used to contact the die 50. The plurality of electrodes 54 of the back side 52 provide electrical signals from the back side 52 of the die 50, while the source of light is generated from the front side of the die 50. At the same time, the light emitted by the crystal grains 50 is collected by the light collector 126 to detect the optical characteristics of the crystal grains 50.

請參考圖1及圖2C，在本實施例中，出料站130可包括一黏性膜132。在利用第二取置單元142將晶粒50從點測站120轉移至出料站130以後，晶粒50黏附在黏性膜132上。取像單元150擷取晶粒50的背面52穿過黏性膜132的影像，以提供作為晶粒50的背部檢查或身份識別的用途。Referring to FIG. 1 and FIG. 2C, in the embodiment, the discharge station 130 may include a viscous film 132. After the die 50 is transferred from the spot station 120 to the discharge station 130 by the second take-up unit 142, the die 50 is adhered to the viscous film 132. The image taking unit 150 captures the image of the back side 52 of the die 50 through the viscous film 132 to provide for back inspection or identification of the die 50.

在需要對晶粒50進行身份識別的情況下，晶粒50的背面52還具有身份識別編號，例如一組字元，故可對所擷取的影像進行光學字元辨識(OCR)，以取得晶粒50的身份識別編號。因此，可對應晶粒50的身份識別編號來紀錄晶粒50的點測結果，以成為每個晶粒50的個別生產履歷的一部分。In the case where the die 50 needs to be identified, the back surface 52 of the die 50 also has an identification number, such as a set of characters, so that the captured image can be optically recognized (OCR) to obtain The identification number of the die 50. Accordingly, the spot measurements of the die 50 can be recorded corresponding to the identification number of the die 50 to become part of the individual production history of each die 50.

在本實施例中，取像單元150可包括一發光元件152及一影像感測元件154。發光元件152照射晶粒50的背面52。影像感測元件154例如是電荷耦合裝置(CCD)並擷取晶粒50的背面52的影像。In this embodiment, the image capturing unit 150 can include a light emitting component 152 and an image sensing component 154. The light emitting element 152 illuminates the back surface 52 of the die 50. The image sensing element 154 is, for example, a charge coupled device (CCD) and captures an image of the back side 52 of the die 50.

在本實施例中，為了確保黏性膜132上的晶粒50不會晃動而影響取像，晶粒點測設備100更可包括一透明平台160。透明平台160支撐黏性膜132之黏附有晶粒50的部分。因此，取像單元150將會擷取晶粒50的背面52穿過透明平台160及黏性膜132的影像。In this embodiment, in order to ensure that the crystal grains 50 on the adhesive film 132 do not shake and affect the image capturing, the die spot measuring apparatus 100 may further include a transparent platform 160. The transparent platform 160 supports a portion of the adhesive film 132 to which the crystal grains 50 are adhered. Therefore, the image capturing unit 150 will capture the image of the back surface 52 of the die 50 through the transparent platform 160 and the adhesive film 132.

請參考圖3，相較於圖2C的實施例，圖3的實施例的透明平台160具有一或多個真空通道162，其連通至一真空源200，以真空吸附黏性膜132之黏附有晶粒50的部分，故有助於固定晶粒50相對於取像單元150的位置。在本實施例中，真空通道162呈環狀並圍繞正被取像的晶粒50，其亦有助於固定晶粒50相對於取像單元150的位置。Referring to FIG. 3, in contrast to the embodiment of FIG. 2C, the transparent platform 160 of the embodiment of FIG. 3 has one or more vacuum channels 162 that are connected to a vacuum source 200 to adhere the vacuum-adsorbing adhesive film 132. The portion of the die 50 helps to position the die 50 relative to the image taking unit 150. In the present embodiment, the vacuum channel 162 is annular and surrounds the die 50 being imaged, which also helps to position the die 50 relative to the image taking unit 150.

請參考圖4，相較於圖2C及圖3的實施例是採用實心的透明平台，在圖4的實施例中，採用中空平台170，其具有一或多個真空通道172，其亦連通至一真空源200，以真空吸附黏性膜132之黏附有晶粒50的部分，故有助於固定晶粒50相對於取像單元150的位置。在本實施例中，真空通道172呈環狀並圍繞正被取像的晶粒50，其亦有助於固定晶粒50相對於取像單元150的位置。Referring to FIG. 4, the embodiment of FIG. 2C and FIG. 3 employs a solid transparent platform. In the embodiment of FIG. 4, a hollow platform 170 is employed having one or more vacuum channels 172 that are also connected to A vacuum source 200 absorbs the portion of the adhesive film 132 to which the crystal grains 50 are adhered, thereby contributing to the position of the fixed crystal grain 50 with respect to the image capturing unit 150. In the present embodiment, the vacuum channel 172 is annular and surrounds the die 50 being imaged, which also helps to position the die 50 relative to the image taking unit 150.

以上的實施例均是將取像單元設置在出料站，但在下面的實施例中，取像單元亦可設置於晶粒的轉移路徑上。The above embodiments all set the image capturing unit at the discharge station, but below In an embodiment, the image capturing unit may be disposed on the transfer path of the die.

請參考圖5，不同於圖1的實施例，在圖5的實施例中，取像單元150設置於點測站120與出料站130之間，以擷取從點測站120轉移至出料站130的晶粒背面的影像。舉例而言，在第二取置單元142轉移晶粒的過程中，取像單元150可設置在晶粒的轉移路徑上，以擷取晶粒背面的影像。Referring to FIG. 5, different from the embodiment of FIG. 1, in the embodiment of FIG. 5, the image capturing unit 150 is disposed between the point measuring station 120 and the discharging station 130 for capturing from the point station 120 to the out point. An image of the back side of the die of the station 130. For example, in the process of transferring the die by the second accommodating unit 142, the image capturing unit 150 may be disposed on the transfer path of the die to capture an image of the back side of the die.

請參考圖6，不同於圖1及圖5的實施例，在圖6的實施例中，取像單元150設置於進料站110與點測站120之間，以擷取從進料站110轉移至點測站120的晶粒背面的影像。舉例而言，在第一取置單元141轉移晶粒的過程中，取像單元150可設置在晶粒的轉移路徑上，以擷取晶粒背面的影像。Referring to FIG. 6 , unlike the embodiment of FIG. 1 and FIG. 5 , in the embodiment of FIG. 6 , the image capturing unit 150 is disposed between the feeding station 110 and the spotting station 120 for capturing from the feeding station 110 . Transfer to the image of the back side of the die of the spot station 120. For example, in the process of transferring the die by the first accommodating unit 141, the image capturing unit 150 may be disposed on the transfer path of the die to capture an image of the back side of the die.

雖然本新型已以實施例揭露如上，然其並非用以限定本新型，任何所屬技術領域中具有通常知識者，在不脫離本新型的精神和範圍內，當可作些許的更動與潤飾，故本新型的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the present invention is defined by the scope of the appended claims.

100‧‧‧晶粒點測設備100‧‧‧Crystal point measuring equipment

110‧‧‧進料站110‧‧‧ Feeding station

120‧‧‧點測站120‧‧ ‧ point station

130‧‧‧出料站130‧‧‧Drawing station

141‧‧‧第一取置單元141‧‧‧First take-up unit

142‧‧‧第二取置單元142‧‧‧Second access unit

150‧‧‧取像單元150‧‧‧Image capture unit

Claims

一種晶粒點測設備，適於檢測一晶粒的光學特性，該晶粒點測設備包括：一進料站，安置未點測的該晶粒；一點測站，從該晶粒的一背面提供電訊號並檢測該晶粒的光學特性；一出料站，安置已點測的該晶粒；一第一取置單元，將未點測的該晶粒從該進料站轉移至該點測站；一第二取置單元，將已點測的該晶粒從該點測站轉移至該出料站；以及一取像單元，設置於該出料站並擷取安置在該出料站的該晶粒的該背面的一影像。 A die point measuring device adapted to detect optical characteristics of a die, the die point measuring device comprising: a feeding station for arranging the die not spotted; and a spot measuring station from a back of the die Providing a telecommunication signal and detecting an optical characteristic of the die; a discharge station, the spotted spot is placed; and a first take-up unit transferring the unmeasured die from the feed station to the point a second receiving unit that transfers the measured die from the measuring station to the discharging station; and an image capturing unit disposed at the discharging station and being disposed at the discharging device An image of the back side of the die.

如申請專利範圍第1項所述的晶粒點測設備，其中該出料站包括一黏性膜，該晶粒黏附在該黏性膜上，且該取像單元擷取該晶粒的該背面穿過該黏性膜的該影像。 The grain spotting device of claim 1, wherein the discharge station comprises a viscous film, the die adheres to the viscous film, and the image capturing unit picks up the die The image of the back side passing through the viscous membrane.

如申請專利範圍第1項所述的晶粒點測設備，其中該取像單元包括：一發光元件，照射該晶粒的該背面；以及一影像感測元件，擷取該晶粒的該背面的該影像。 The image spotting device of claim 1, wherein the image capturing unit comprises: a light emitting element that illuminates the back surface of the die; and an image sensing element that captures the back side of the die The image.

如申請專利範圍第1項所述的晶粒點測設備，更包括：一透明平台，支撐該黏性膜之黏附有該晶粒的部分，其中該取像單元擷取該晶粒的該背面穿過該透明平台及該黏性膜的該影像。 The die spot measuring device of claim 1, further comprising: a transparent platform supporting a portion of the adhesive film to which the die is adhered, wherein the The image capturing unit captures the image of the back surface of the die through the transparent platform and the adhesive film.

如申請專利範圍第4項所述的晶粒點測設備，其中該透明平台具有至少一真空通道，以真空吸附該黏性膜之黏附有該晶粒的部分。 The grain spotting device of claim 4, wherein the transparent platform has at least one vacuum channel for vacuum-absorbing a portion of the adhesive film to which the die adheres.

如申請專利範圍第5項所述的晶粒點測設備，其中該至少一真空通道呈環狀並圍繞正被取像的該晶粒。 The grain spotting apparatus of claim 5, wherein the at least one vacuum channel is annular and surrounds the die being imaged.

如申請專利範圍第4項所述的晶粒點測設備，其中該取像單元包括：一發光元件，照射該晶粒的該背面；以及一影像感測元件，擷取該晶粒的該背面的該影像。 The image spotting device of claim 4, wherein the image capturing unit comprises: a light emitting element that illuminates the back surface of the die; and an image sensing element that captures the back side of the die The image.

如申請專利範圍第1項所述的晶粒點測設備，更包括：一中空平台，支撐該黏性膜之黏附有該晶粒的部分的周圍，其中該取像單元經由該中空平台及該黏性膜擷取該晶粒的該背面的該影像。 The die point measuring device of claim 1, further comprising: a hollow platform supporting a periphery of a portion of the adhesive film to which the die is adhered, wherein the image capturing unit passes through the hollow platform and the The viscous film captures the image of the back side of the die.

如申請專利範圍第8項所述的晶粒點測設備，其中該中空平台具有至少一真空通道，以真空吸附該黏性膜之黏附有該晶粒的部分的周圍。 The grain spotting device of claim 8, wherein the hollow platform has at least one vacuum channel for vacuum-absorbing the periphery of the portion of the adhesive film to which the die adheres.

如申請專利範圍第9項所述的晶粒點測設備，其中該至少一真空通道呈環狀並圍繞正被取像的該晶粒。 The grain spotting apparatus of claim 9, wherein the at least one vacuum channel is annular and surrounds the die being imaged.

一種晶粒點測設備，適於檢測一晶粒的光學特性，該晶粒點測設備包括：一進料站，安置未點測的該晶粒；一點測站，從該晶粒的一背面提供電訊號並檢測該晶粒的光學特性；一出料站，安置已點測的該晶粒；一第一取置單元，將未點測的該晶粒從該進料站轉移至該點測站；一第二取置單元，將已點測的該晶粒從該點測站轉移至該出料站；以及一取像單元，設置於該點測站與該出料站之間，以擷取從該點測站轉移至該出料站的該晶粒的該背面的一影像。 A die point measuring device is adapted to detect optical characteristics of a die, the die point measuring device comprising: a feeding station, the unmeasured crystal grain is placed; a point station provides an electrical signal from a back surface of the die and detects optical characteristics of the die; and a discharge station places the spotted spot a first accommodating unit, transferring the unmeasured die from the feeding station to the measuring station; a second accommodating unit, transferring the spotted die from the measuring station to The discharging station; and an image capturing unit disposed between the measuring station and the discharging station to capture an image of the back surface of the die transferred from the measuring station to the discharging station.

如申請專利範圍第11項所述的晶粒點測設備，其中該取像單元包括：一發光元件，照射該晶粒的該背面；以及一影像感測元件，擷取該晶粒的該背面的該影像。 The image spotting device of claim 11, wherein the image capturing unit comprises: a light emitting element that illuminates the back surface of the die; and an image sensing element that captures the back side of the die The image.

一種晶粒點測設備，適於檢測一晶粒的光學特性，該晶粒點測設備包括：一進料站，安置未點測的該晶粒；一點測站，從該晶粒的一背面提供電訊號並檢測該晶粒的光學特性；一出料站，安置已點測的該晶粒；一第一取置單元，將未點測的該晶粒從該進料站轉移至該點測站；一第二取置單元，將已點測的該晶粒從該點測站轉移至該出料站；以及一取像單元，設置於該進料站與該點測站之間，以擷取從該進料站轉移至該點測站的該晶粒的該背面的一影像。 A die point measuring device adapted to detect optical characteristics of a die, the die point measuring device comprising: a feeding station for arranging the die not spotted; and a spot measuring station from a back of the die Providing a telecommunication signal and detecting an optical characteristic of the die; a discharge station, the spotted spot is placed; and a first take-up unit transferring the unmeasured die from the feed station to the point Station a second taking unit, transferring the measured die from the measuring station to the discharging station; and an image capturing unit disposed between the feeding station and the measuring station for capturing An image of the back side of the die transferred from the feed station to the spot station.

如申請專利範圍第13項所述的晶粒點測設備，其中該取像單元包括：一發光元件，照射該晶粒的該背面；以及一影像感測元件，擷取該晶粒的該背面的該影像。 The image spotting device of claim 13, wherein the image capturing unit comprises: a light emitting element that illuminates the back surface of the die; and an image sensing element that captures the back side of the die The image.