TWM500439U - Docking station and electronic assembly - Google Patents
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- TWM500439U TWM500439U TW103219664U TW103219664U TWM500439U TW M500439 U TWM500439 U TW M500439U TW 103219664 U TW103219664 U TW 103219664U TW 103219664 U TW103219664 U TW 103219664U TW M500439 U TWM500439 U TW M500439U
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- 238000003032 molecular docking Methods 0.000 title claims abstract description 22
- 238000010438 heat treatment Methods 0.000 claims description 11
- 230000017525 heat dissipation Effects 0.000 abstract description 14
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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Abstract
Description
本新型創作是有關於一種擴充基座及電子總成，且特別是有關於一種擴充基座及使用此擴充基座的電子總成。The present invention relates to an expansion base and an electronic assembly, and more particularly to an expansion base and an electronic assembly using the same.
隨著科技的日新月異，伴隨著許多可攜式電子裝置的問世，例如筆記型電腦、智慧型手機以及平板電腦等。由於使用者可透過這些可攜式電子裝置即時地處理及收發資料，因此這些可攜式電子裝置儼然成為了現代人在生活上不可或缺的重要用品。以平板電腦為例，其具有體積輕巧及攜帶方便的優點，相當方便使用者在外出時使用。With the rapid development of technology, with the advent of many portable electronic devices, such as notebook computers, smart phones and tablets. Since users can process and send and receive data on the spot through these portable electronic devices, these portable electronic devices have become an indispensable and important item in modern life. Taking a tablet computer as an example, it has the advantages of being compact in size and convenient to carry, and is quite convenient for the user to use when going out.
通常而言，平板電腦可大致分為風扇式散熱與無風扇式(fanless)散熱等兩種散熱方式，其中風扇式散熱會造成平板電腦的內部空間的耗費，並不利於薄型化的設計需求。此外，風扇運行時所產生的噪音，亦會讓使用者感到不適。基於此，常見的平板電腦大多是採用無風扇式散熱的散熱方式，例如是透過銅箔或其他高導熱材料所構成的薄膜或片材貼附於發熱元件，藉以將發熱 元件所產生的熱能傳導至銅箔或其他高導熱材料所構成的薄膜或片材，再自銅箔或其他高導熱材料所構成的薄膜或片材傳導至平板電腦的背蓋，進而逸散至外界。然而，在高效能運轉時，平板電腦內的電子元件會產生的大量的熱能，無風扇發熱元件散熱的散熱方式難以將前述大量的熱能快速地導出，散熱效果有限。Generally speaking, a tablet computer can be roughly classified into two types of heat dissipation methods, a fan type heat dissipation and a fanless type heat dissipation. The fan type heat dissipation causes the internal space of the tablet computer to be consumed, which is not advantageous for the thin design. In addition, the noise generated by the fan during operation can also cause discomfort to the user. Based on this, most common tablet computers use a fanless heat dissipation method. For example, a film or sheet made of copper foil or other highly thermally conductive material is attached to the heating element to heat up. The heat generated by the component is transferred to a film or sheet of copper foil or other highly thermally conductive material, and the film or sheet composed of copper foil or other highly thermally conductive material is transferred to the back cover of the tablet computer, thereby being dispersed to external. However, in high-performance operation, a large amount of thermal energy generated by electronic components in the tablet computer, and a heat dissipation method in which the fanless heat-generating component dissipates heat, it is difficult to quickly derive the aforementioned large amount of thermal energy, and the heat dissipation effect is limited.
本新型創作提供一種擴充基座，能在可攜式電子裝置組裝於其上後提高可攜式電子裝置的散熱效率。The present invention provides an expansion base that can improve the heat dissipation efficiency of the portable electronic device after the portable electronic device is assembled thereon.
本新型創作提供一種電子總成，其具有較佳的散熱效率。The novel creation provides an electronic assembly that has better heat dissipation efficiency.
本新型創作提出一種擴充基座，適用於可攜式電子裝置。擴充基座包括本體、承載座、至少一導熱卡勾、導熱元件以及散熱元件。本體具有插槽以及位於插槽內的連接本體。承載座樞設於本體上。前述至少一導熱卡勾凸設於承載座上。導熱元件位於承載座內。導熱元件連接前述至少一導熱卡勾，並延伸至本體內。散熱元件設置於本體的插槽內，且位於連接本體的至少一側。散熱元件與導熱元件相連接。The novel creation proposes an expansion base suitable for portable electronic devices. The docking station includes a body, a carrier, at least one heat conducting hook, a heat conducting component, and a heat dissipating component. The body has a slot and a connecting body located within the slot. The carrier is pivoted on the body. The at least one thermal conductive hook protrudes from the carrier. The thermally conductive element is located within the carrier. The heat conducting component is coupled to the at least one heat conducting hook and extends into the body. The heat dissipating component is disposed in the slot of the body and located on at least one side of the connecting body. The heat dissipating component is connected to the heat conducting component.
本新型創作提出一種電子總成，包括擴充基座以及可攜式電子裝置。擴充基座包括本體、承載座、至少一導熱卡勾、第一導熱元件以及散熱元件。本體具有插槽以及位於插槽內的第一連接本體。承載座樞設於本體上。前述至少一導熱卡勾凸設於承載座上。第一導熱元件位於承載座內。第一導熱元件連接前述至 少一導熱卡勾，並延伸至本體內。散熱元件設置於本體的插槽內，且位於第一連接本體的至少一側。散熱元件與第一導熱元件相連接。可攜式電子裝置可拆卸地組裝於擴充基座。可攜式電子裝置包括機體、發熱元件以及第二導熱元件。機體具有對應於前述至少一導熱卡勾設置的至少一導熱卡槽。發熱元件位於機體內。第二導熱元件位於機體內，並連接發熱元件與至少一導熱卡槽，其中在可攜式電子裝置組裝於擴充基座上時，前述至少一導熱卡勾卡合於前述至少一導熱卡槽內，使得發熱元件所產生的熱能適於經由第二導熱元件、前述至少一導熱卡槽、前述至少一導熱卡勾、第一導熱元件以及散熱元件的傳導而逸散至外界。The novel creation proposes an electronic assembly including a docking station and a portable electronic device. The docking station includes a body, a carrier, at least one heat conducting hook, a first heat conducting component, and a heat dissipating component. The body has a slot and a first connection body located within the slot. The carrier is pivoted on the body. The at least one thermal conductive hook protrudes from the carrier. The first heat conducting element is located within the carrier. The first heat conducting element is connected to the aforementioned One less thermal hook and extended to the body. The heat dissipating component is disposed in the slot of the body and located on at least one side of the first connecting body. The heat dissipating component is coupled to the first thermally conductive component. The portable electronic device is detachably assembled to the docking station. The portable electronic device includes a body, a heating element, and a second heat conducting element. The body has at least one heat conducting card slot corresponding to the at least one heat conducting hook. The heating element is located inside the body. The second heat conducting component is located in the body and is connected to the heat generating component and the at least one heat conducting card slot. When the portable electronic device is assembled on the docking station, the at least one heat conducting hook is engaged in the at least one heat conducting card slot. The heat energy generated by the heat generating component is adapted to escape to the outside through conduction of the second heat conducting component, the at least one heat conducting card slot, the at least one heat conducting hook, the first heat conducting component, and the heat dissipating component.
基於上述，本新型創作的擴充基座的承載座上設置有導熱卡勾，其中導熱卡勾與延伸至擴充基座的本體內的第一導熱元件相連接，且第一導熱元件與位於本體的插槽內的散熱元件相連接。另一方面，本新型創作的可攜式電子裝置的發熱元件會與第二導熱元件相連接，並且第二導熱元件會與可攜式電子裝置的機體的導熱卡槽相連接。因此，在將可攜式電子裝置組裝於擴充基座後，第二導熱元件、導熱卡槽、與導熱卡槽相卡合的導熱卡勾、第一導熱元件以及散熱元件可構成熱傳導路徑，藉由前述熱傳導路徑可有效地將發熱元件所產生的熱能快速地逸散至外界，進而提高可攜式電子裝置的工作效能，並延長其工作壽命。Based on the above, the base of the expansion base of the present invention is provided with a heat-conducting hook, wherein the heat-conducting hook is connected with the first heat-conducting element extending into the body of the docking station, and the first heat-conducting element is located on the body The heat sinks in the slots are connected. On the other hand, the heat generating component of the portable electronic device of the present invention is connected to the second heat conducting component, and the second heat conducting component is connected to the heat conducting card slot of the body of the portable electronic device. Therefore, after the portable electronic device is assembled to the docking station, the second heat conducting component, the heat conducting card slot, the heat conducting hook that is engaged with the heat conducting card slot, the first heat conducting component, and the heat dissipating component may constitute a heat conduction path. The heat conduction path can effectively dissipate the heat energy generated by the heat generating component to the outside, thereby improving the working performance of the portable electronic device and prolonging the working life thereof.
為讓本新型創作的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will become more apparent and understood from the following description.
10‧‧‧電子總成10‧‧‧Electronic assembly
100‧‧‧擴充基座100‧‧‧Expansion base
110‧‧‧本體110‧‧‧ body
111‧‧‧插槽111‧‧‧Slot
112‧‧‧第一連接本體112‧‧‧First connection ontology
120‧‧‧承載座120‧‧‧ bearing seat
130‧‧‧導熱卡勾130‧‧‧thermal card hook
131‧‧‧導熱本體131‧‧‧thermal body
131a‧‧‧頂面131a‧‧‧ top
132‧‧‧第一殼罩132‧‧‧ first cover
133‧‧‧第二殼罩133‧‧‧second cover
140‧‧‧第一導熱元件140‧‧‧First thermal element
150‧‧‧散熱元件150‧‧‧ Heat Dissipation Components
200‧‧‧可攜式電子裝置200‧‧‧Portable electronic devices
210‧‧‧機體210‧‧‧ body
211‧‧‧導熱卡槽211‧‧‧ Thermal card slot
220‧‧‧發熱元件220‧‧‧heating components
230‧‧‧第二導熱元件230‧‧‧Second thermal element
300‧‧‧可插拔電子模組300‧‧‧pluggable electronic module
310‧‧‧導熱殼體310‧‧‧thermal housing
320‧‧‧電路板320‧‧‧ boards
330‧‧‧控制晶片330‧‧‧Control chip
340‧‧‧第二連接本體340‧‧‧Second connection body
350‧‧‧電磁屏蔽層350‧‧ ‧ electromagnetic shielding
圖1是本新型創作一實施例的電子總成的側視示意圖。1 is a side elevational view of an electronic assembly of an embodiment of the present invention.
圖2是圖1的電子總成的俯視示意圖。2 is a top plan view of the electronic assembly of FIG. 1.
圖3是圖1的導熱卡勾的剖面示意圖。3 is a cross-sectional view of the thermal conductive hook of FIG. 1.
圖4是可插拔電子模組插接至圖2的電子總成的俯視示意圖。4 is a top plan view of the pluggable electronic module plugged into the electronic assembly of FIG. 2.
圖5是圖4沿剖線A-A的局部剖面示意圖。Figure 5 is a partial cross-sectional view of Figure 4 taken along line A-A.
圖1是本新型創作一實施例的電子總成的側視示意圖。圖2是圖1的電子總成的俯視示意圖，其中為求清楚表示與便於說明，本體110、承載座120以及機體210是以虛線繪示。請參考圖1，在本實施例中，電子總成10包括擴充基座100以及可攜式電子裝置200，其中可攜式電子裝置200例如是平板電腦，且為可拆卸地組裝於擴充基座100上。1 is a side elevational view of an electronic assembly of an embodiment of the present invention. 2 is a top plan view of the electronic assembly of FIG. 1, wherein the body 110, the carrier 120, and the body 210 are shown in dashed lines for clarity and convenience of explanation. Referring to FIG. 1 , in the embodiment, the electronic assembly 10 includes a docking station 100 and a portable electronic device 200 , wherein the portable electronic device 200 is, for example, a tablet computer and is detachably assembled to the docking station. 100 on.
擴充基座100包括本體110、承載座120、至少一導熱卡勾130(圖2示意地繪示出兩個)、第一導熱元件140以及散熱元件150，其中本體110可具有操作介面例如是鍵盤組(圖未示)、插槽111以及位於插槽111內的第一連接本體112。通常而言，第一連接本體112的規格可以是通用序列匯流排(Universal Serial Bus,USB)、迷你通用序列匯流排(MINI-USB)、RCA(Radio Corporation of America)、Jack plug、XLR、DIN、MINI-DIN、BNC、DB25、Speakon、TosLink等，本新型創作對此不加以限制。The docking station 100 includes a body 110, a carrier 120, at least one heat conducting hook 130 (two are schematically shown in FIG. 2), a first heat conducting component 140, and a heat dissipating component 150, wherein the body 110 can have an operating interface such as a keyboard. A group (not shown), a slot 111, and a first connection body 112 located in the slot 111. Generally, the specifications of the first connection body 112 may be a Universal Serial Bus (USB), a Mini Universal Serial Bus (MINI-USB), and an RCA (Radio Corporation). Of America), Jack plug, XLR, DIN, MINI-DIN, BNC, DB25, Speakon, TosLink, etc., this new creation does not limit this.
承載座120例如是透過樞軸(圖未示)樞設於本體110上，以相對於本體110轉動。另一方面，導熱卡勾130凸設於承載座120上，第一導熱元件140位於承載座內。第一導熱元件140例如是熱管(heat pipe)或其他高導熱元件，其連接了各個導熱卡勾13，並延伸至本體110內。散熱元件150設置於本體110的插槽111內，且位於第一連接本體112的至少一側，其中散熱元件150與第一導熱元件140相連接。通常而言，散熱元件150可以是由銅、金或銀等導熱金屬，或者是上述導熱金屬的合金所構成。如圖1所示，散熱元件150例如是以環繞第一連接本體112的方式作設置，但本新型創作並不以此為限。The carrier 120 is pivoted to the body 110 via a pivot (not shown) for rotation relative to the body 110. On the other hand, the heat-conducting hook 130 protrudes from the carrier 120, and the first heat-conducting element 140 is located in the carrier. The first thermally conductive element 140 is, for example, a heat pipe or other highly thermally conductive element that connects the respective thermally conductive clips 13 and extends into the body 110. The heat dissipating component 150 is disposed in the slot 111 of the body 110 and is located on at least one side of the first connecting body 112 , wherein the heat dissipating component 150 is coupled to the first heat conducting component 140 . In general, the heat dissipating member 150 may be made of a thermally conductive metal such as copper, gold or silver, or an alloy of the above thermally conductive metal. As shown in FIG. 1 , the heat dissipating component 150 is disposed, for example, in a manner surrounding the first connecting body 112 , but the novel creation is not limited thereto.
可攜式電子裝置200包括機體210、發熱元件220以及第二導熱元件230，其中機體210具有對應於各個導熱卡勾130設置的導熱卡槽211。舉例來說，導熱卡槽211可以是將銅、金或銀等導熱金屬，或者是上述導熱金屬的合金所構成的殼罩內嵌在機體210中對應於各個導熱卡勾130設置的凹槽所形成，但本新型創作並不以此為限。其中，前述殼罩的一端會延伸至第二導熱元件230所在處，並面接觸第二導熱元件230。The portable electronic device 200 includes a body 210, a heat generating component 220, and a second heat conducting component 230. The body 210 has a heat conducting card slot 211 corresponding to each of the heat conducting hooks 130. For example, the heat conducting card slot 211 may be a heat shield metal such as copper, gold or silver, or a cover made of an alloy of the heat conductive metal embedded in the groove of the body 210 corresponding to each of the heat conducting hooks 130. Formed, but this new creation is not limited to this. Wherein, one end of the foregoing cover extends to the position of the second heat conducting component 230 and faces the second heat conducting component 230.
發熱元件220例如是中央處理器(CPU)、繪圖晶片或其它種類之發熱元件，而第二導熱元件230例如是熱管(heat pipe)或其他高導熱元件，其中發熱元件220與第二導熱元件230皆位於機 體210內，並且第二導熱元件230連接了發熱元件230與各個導熱卡槽211。在可攜式電子裝置200組裝於擴充基座100上時，各個導熱卡勾130會卡合於對應的導熱卡槽211內，使得發熱元件220所產生的熱能適於經由第二導熱元件230、導熱卡槽211、與導熱卡槽211相卡合的導熱卡勾130、第一導熱元件140以及散熱元件150的傳導而逸散至外界。The heating element 220 is, for example, a central processing unit (CPU), a graphics chip or other kind of heating element, and the second heat conducting element 230 is, for example, a heat pipe or other high thermal conductive element, wherein the heating element 220 and the second heat conducting element 230 Located in the machine In the body 210, and the second heat conducting element 230 is connected to the heat generating component 230 and the respective heat conducting card slots 211. When the portable electronic device 200 is assembled on the docking station 100, the heat conducting hooks 130 are engaged in the corresponding heat conducting slots 211, so that the heat generated by the heat generating component 220 is adapted to pass through the second heat conducting component 230, The heat conducting card slot 211, the heat conducting hook 130 that is engaged with the heat conducting card slot 211, the first heat conducting component 140, and the heat dissipating component 150 are conducted to escape to the outside.
也就是說，在將可攜式電子裝置200組裝於擴充基座100後，第二導熱元件230、導熱卡槽211、與導熱卡槽211相卡合的導熱卡勾130、第一導熱元件140以及散熱元件150可構成熱傳導路徑，藉由前述熱傳導路徑可有效地將發熱元件220所產生的熱能快速地逸散至外界，進而提高可攜式電子裝置200的工作效能，並延長其工作壽命。That is, after the portable electronic device 200 is assembled to the docking station 100, the second heat conducting component 230, the heat conducting card slot 211, the heat conducting hook 130 that is engaged with the heat conducting card slot 211, and the first heat conducting component 140 The heat dissipating component 150 can form a heat conduction path. The heat conduction path can effectively dissipate the heat generated by the heat generating component 220 to the outside, thereby improving the working performance of the portable electronic device 200 and extending the working life thereof.
圖3是圖1的導熱卡勾的剖面示意圖。請參考圖1至圖3，在本實施例中，導熱卡勾130可以是由導熱本體131、第一殼罩132以及第二殼罩133所組成，其中導熱本體131凸設於承載座120上，且可以是由銅、金、銀等導熱金屬，或上述導熱金屬的合金所構成。第一殼罩132罩覆於導熱本體131，主要是作為提高導熱卡勾130的機械強度所用，其中第一殼罩132的材質可為鋅合金或不鏽鋼。第二殼罩133罩覆於第一殼罩132，主要是作為減少導熱卡勾130插接至導熱卡槽211的過程中所產生的摩擦力所用，其中第二殼罩133可為塑膠。3 is a cross-sectional view of the thermal conductive hook of FIG. 1. Referring to FIG. 1 to FIG. 3 , in the embodiment, the heat-conducting hook 130 may be composed of a heat-conducting body 131 , a first cover 132 , and a second cover 133 , wherein the heat-conducting body 131 is protruded from the carrier 120 . And it may be composed of a heat conductive metal such as copper, gold or silver, or an alloy of the above heat conductive metal. The first cover 132 is covered by the heat-conducting body 131, and is mainly used for improving the mechanical strength of the heat-conductive hook 130. The material of the first cover 132 may be zinc alloy or stainless steel. The second cover 133 is covered by the first cover 132, and is mainly used to reduce the friction generated during the process of inserting the thermal conductive hook 130 into the thermal conductive slot 211. The second cover 133 can be plastic.
另一方面，為確保在導熱卡勾130卡合於導熱卡槽211 後，導熱本體131可與導熱卡槽211相接觸，第一殼罩132與第二殼罩133需設置有相應的穿孔以使導熱本體131頂面131a暴露於第一殼罩132與第二殼罩133，其中導熱本體131頂面131a可與第二殼罩133的頂緣相切齊，或者是突出於第二殼罩133的頂緣，本新型創作對此不加以限制。On the other hand, in order to ensure that the thermal conductive hook 130 is engaged with the thermal conductive card slot 211 After that, the heat conducting body 131 can be in contact with the heat conducting card slot 211. The first shell 132 and the second shell 133 are provided with corresponding perforations to expose the heat conducting body 131 top surface 131a to the first shell 132 and the second shell. The cover 133, wherein the top surface 131a of the heat-conducting body 131 can be aligned with the top edge of the second cover 133 or protrude from the top edge of the second cover 133, the present invention does not limit this.
圖4是可插拔電子模組插接至圖2的電子總成的俯視示意圖。圖5是圖4沿剖線A-A的局部剖面示意圖，其中為求清楚表示與便於說明，本體110、承載座120以及機體210是以虛線繪示。請參考圖2、圖4與圖5，在本實施例中，電子總成10更包括可插拔電子模組300，例如是常見的隨身碟或其他種類的外接式電子模組，適於插接至本體110的插槽111。可插拔電子模組300包括導熱殼體310、電路板320、控制晶片330以及第二連接本體340，其中導熱殼體310可以是由銅、金、銀等導熱金屬，或上述導熱金屬的合金所構成。電路板320與控制晶片330皆位於導熱殼體310內，其中控制晶片330設置於電路板320上，並與電路板320電性連接。第二連接本體340凸設於導熱殼罩310，並與電路板320電性連接。通常而言，第二連接本體340的規格可以是通用序列匯流排(Universal Serial Bus,USB)、迷你通用序列匯流排(MINI-USB)、RCA(Radio Corporation of America)、Jack plug、XLR、DIN、MINI-DIN、BNC、DB25、Speakon、TosLink等，需對應於第一連接本體112的規格而設置，本新型創作對此不加以限制。4 is a top plan view of the pluggable electronic module plugged into the electronic assembly of FIG. 2. 5 is a partial cross-sectional view along line A-A of FIG. 4, wherein the body 110, the carrier 120, and the body 210 are shown in broken lines for clarity and convenience of explanation. Referring to FIG. 2, FIG. 4 and FIG. 5, in the embodiment, the electronic assembly 10 further includes a pluggable electronic module 300, such as a common flash drive or other type of external electronic module, suitable for insertion. Connected to the slot 111 of the body 110. The pluggable electronic module 300 includes a heat conductive housing 310, a circuit board 320, a control wafer 330, and a second connecting body 340. The heat conductive housing 310 may be a heat conductive metal such as copper, gold or silver, or an alloy of the above heat conductive metal. Composition. The control board 330 is disposed on the circuit board 320 and electrically connected to the circuit board 320. The second connecting body 340 protrudes from the heat conducting cover 310 and is electrically connected to the circuit board 320 . Generally, the specifications of the second connection body 340 may be a universal serial bus (USB), a mini universal serial bus (MINI-USB), an RCA (Radio Corporation of America), a Jack plug, an XLR, a DIN. , MINI-DIN, BNC, DB25, Speakon, TosLink, etc., need to be set corresponding to the specifications of the first connection body 112, which is not limited by the novel creation.
當可插拔電子模組300插接至插槽111時，第二連接本體340與第一連接本體112電性連接，而散熱元件150面接觸導熱殼體310。此時，可插拔電子模組300的控制晶片330可發出訊號至可攜式電子裝置200的機體210內的控制單元(圖未示)，其中接收到前述訊號的由控制單元(圖未示)會發出另一訊號以驅使中央處理器(例如是發熱元件220)將機體110切換至高效能的運轉模式。具體來說，處於高效能的運轉模式下的可攜式電子裝置200，其發熱元件220會產生大量的熱能，其中前述熱能可藉由第二導熱元件230、導熱卡槽211、與導熱卡槽211相卡合的導熱卡勾130、第一導熱元件140以及散熱元件150所構成的熱傳導路徑傳導至與散熱元件150面接觸的散熱元件150的導熱殼體310。最後，前述熱能則會自導熱殼體310快速地逸散至外界，因此處於高效能的運轉模式下的可攜式電子裝置200，並不會產生熱能累積的問題，故能維持其運轉的效率與流暢性而不易故障或損壞。When the pluggable electronic module 300 is inserted into the slot 111, the second connecting body 340 is electrically connected to the first connecting body 112, and the heat dissipating component 150 is in surface contact with the heat conducting housing 310. At this time, the control chip 330 of the pluggable electronic module 300 can send a signal to a control unit (not shown) in the body 210 of the portable electronic device 200, wherein the control unit receives the signal (the figure is not shown) Another signal is sent to drive the central processor (e.g., heating element 220) to switch the body 110 to a high performance mode of operation. Specifically, in the portable electronic device 200 in the high-performance operation mode, the heat generating component 220 generates a large amount of thermal energy, wherein the thermal energy can be generated by the second heat conducting component 230, the heat conducting card slot 211, and the heat conducting card slot. The heat conduction path formed by the 211-phase-coupled heat-conducting hook 130, the first heat-conducting element 140, and the heat-dissipating element 150 is conducted to the heat-conductive housing 310 of the heat-dissipating element 150 that is in surface contact with the heat-dissipating element 150. Finally, the thermal energy is quickly dissipated from the heat-conductive housing 310 to the outside, so the portable electronic device 200 in the high-performance operation mode does not have the problem of heat accumulation, so the efficiency of the operation can be maintained. And fluency is not easy to malfunction or damage.
另一方面，可插拔電子模組300還包括電磁屏蔽層350，連接導熱殼體310且位於導熱殼體310與電路板320之間，以將導熱殼體310與電路板320以及控制晶片330阻隔開來，進而降低電磁干擾。On the other hand, the pluggable electronic module 300 further includes an electromagnetic shielding layer 350 connected between the heat conducting housing 310 and between the heat conducting housing 310 and the circuit board 320 to connect the heat conducting housing 310 with the circuit board 320 and the control wafer 330. Blocking to reduce electromagnetic interference.
綜上所述，本新型創作的擴充基座的承載座上設置有導熱卡勾，其中導熱卡勾與延伸至擴充基座的本體內的第一導熱元件相連接，且第一導熱元件與位於本體的插槽內的散熱元件相連接。另一方面，本新型創作的可攜式電子裝置的發熱元件會與第 二導熱元件相連接，並且第二導熱元件會與可攜式電子裝置的機體的導熱卡槽相連接。因此，在將可攜式電子裝置組裝於擴充基座後，第二導熱元件、導熱卡槽、與導熱卡槽相卡合的導熱卡勾、第一導熱元件以及散熱元件可構成熱傳導路徑，藉由前述熱傳導路徑可有效地將發熱元件所產生的熱能快速地逸散至外界，進而提高可攜式電子裝置的工作效能，並延長其工作壽命。In summary, the thermal base of the expansion base of the present invention is provided with a thermal hook, wherein the thermal hook is connected to the first heat conducting component extending into the body of the docking station, and the first heat conducting component is located The heat dissipating components in the slots of the body are connected. On the other hand, the heating element of the portable electronic device created by the present invention will be the same as the first The two heat conducting elements are connected, and the second heat conducting element is connected to the heat conducting card slot of the body of the portable electronic device. Therefore, after the portable electronic device is assembled to the docking station, the second heat conducting component, the heat conducting card slot, the heat conducting hook that is engaged with the heat conducting card slot, the first heat conducting component, and the heat dissipating component may constitute a heat conduction path. The heat conduction path can effectively dissipate the heat energy generated by the heat generating component to the outside, thereby improving the working performance of the portable electronic device and prolonging the working life thereof.
雖然本新型創作已以實施例揭露如上，然其並非用以限定本新型創作，任何所屬技術領域中具有通常知識者，在不脫離本新型創作的精神和範圍內，當可作些許的更動與潤飾，故本新型創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.
10‧‧‧電子總成10‧‧‧Electronic assembly
100‧‧‧擴充基座100‧‧‧Expansion base
110‧‧‧本體110‧‧‧ body
111‧‧‧插槽111‧‧‧Slot
112‧‧‧第一連接本體112‧‧‧First connection ontology
120‧‧‧第一殼罩120‧‧‧First cover
130‧‧‧第二殼罩130‧‧‧Second cover
140‧‧‧第一導熱元件140‧‧‧First thermal element
150‧‧‧散熱元件150‧‧‧ Heat Dissipation Components
200‧‧‧可攜式電子裝置200‧‧‧Portable electronic devices
210‧‧‧機體210‧‧‧ body
211‧‧‧導熱卡槽211‧‧‧ Thermal card slot
220‧‧‧發熱元件220‧‧‧heating components
230‧‧‧第二導熱元件230‧‧‧Second thermal element
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103219664U TWM500439U (en) | 2014-11-06 | 2014-11-06 | Docking station and electronic assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103219664U TWM500439U (en) | 2014-11-06 | 2014-11-06 | Docking station and electronic assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM500439U true TWM500439U (en) | 2015-05-01 |
Family
ID=53722231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103219664U TWM500439U (en) | 2014-11-06 | 2014-11-06 | Docking station and electronic assembly |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM500439U (en) |
-
2014
- 2014-11-06 TW TW103219664U patent/TWM500439U/en not_active IP Right Cessation
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