TWM495711U - Heat-spreading board structure - Google Patents
Heat-spreading board structure Download PDFInfo
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- TWM495711U TWM495711U TW103215720U TW103215720U TWM495711U TW M495711 U TWM495711 U TW M495711U TW 103215720 U TW103215720 U TW 103215720U TW 103215720 U TW103215720 U TW 103215720U TW M495711 U TWM495711 U TW M495711U
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- uniform temperature
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- shaped connecting
- chamber
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Description
一種均溫板結構，尤指一種可提升均溫板支撐度及熱傳導效率的均溫板結構。 The utility model relates to a uniform temperature plate structure, in particular to a temperature equalizing plate structure which can improve the support degree of the uniform temperature plate and the heat conduction efficiency.
現行行動裝置、個人電腦、伺服器、通信機箱皆因運算效能提升而內部計算單元所產生之熱量亦隨著提升，則相對的更加需要散熱單元來輔助其散熱，絕大多數業者選用散熱器、熱管、均溫板等散熱元件搭配風扇進行輔助散熱，並當遇到需大面積進行散熱時則選用均溫板吸熱並搭配散熱器及散熱風扇進行強制散熱，由於各散熱元件間需緊密貼合防止熱阻現象之發生，而均溫板係為一扁平狀板體，並內部設置一提供汽液循環的腔室進行熱傳導，並因為了防止扁平狀之均溫板受壓力或受熱後產生膨脹或變形，則腔室內設置有複數根支撐柱體做為支撐均溫板之腔室使用。 The current mobile devices, personal computers, servers, and communication chassis are all improved in terms of computing power, and the heat generated by the internal computing unit is also increased. Relatively, a heat sink unit is needed to assist the heat dissipation. Most operators choose a heat sink. The heat pipe, the temperature equalizing plate and other heat dissipating components are matched with the fan for auxiliary heat dissipation, and when a large area is required for heat dissipation, the temperature equalizing plate is used for heat absorption, and the heat sink and the cooling fan are used for forced heat dissipation, because the heat dissipating components need to be closely fitted. To prevent the occurrence of thermal resistance, the temperature equalizing plate is a flat plate body, and a chamber for providing a vapor-liquid circulation is internally disposed for heat conduction, and the flat plate is prevented from being subjected to pressure or expansion after being heated. Or deformation, the chamber is provided with a plurality of support columns as a chamber for supporting the temperature equalization plate.
均溫板係為一種面與面之熱量傳遞，並且前述說明中為了防止均溫板受熱膨脹或受外力壓扁變形設置有複數支撐柱體，但於製程上則需額外增加製造工時及製造成本(支撐柱體)，且若選用複數銅柱外部組合燒結環，銅柱作為支撐作用，燒結環僅作為回流循環，其底部平面度控制不易，或使用多溝槽銅柱，該多溝槽之銅柱同作為支撐與回流循環作用，其底部平面度亦相同控制不易。 故習知技術雖解決變形等問題但卻增加了製造工時及成本以及底部平面度控制不易等問題，故仍須針對如何降低製造成本此項問題進行深討。 The uniform temperature plate is a heat transfer between the surface and the surface, and in the foregoing description, in order to prevent the temperature expansion plate from being thermally expanded or crushed by external force, a plurality of support columns are provided, but in the process, additional manufacturing man-hours and manufacturing are required. Cost (supporting cylinder), and if a plurality of external copper rings are combined to form a sintered ring, the copper column serves as a supporting action, the sintered ring is only used as a recirculation cycle, and the bottom flatness control is not easy, or a multi-groove copper column is used, the multi-groove The copper column acts as a support and recirculation cycle, and the bottom flatness is also controlled to be difficult. Therefore, although the conventional technology solves the problems of deformation and the like, but increases the manufacturing man-hours and costs, and the difficulty in controlling the bottom flatness, it is still necessary to discuss the problem of how to reduce the manufacturing cost.
爰此，為有效解決上述之問題，本創作之主要目的，係提供一種均溫板結構，係包含：一本體具有一腔室，該腔室具有一第一側及一第二側及一板狀連接體，該板狀連接體軸向兩端分別連接該第一、二側，所述板狀連接體徑向外側周緣設有一第一毛細結構層，所述腔室內具有工作液體。 Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a temperature equalizing plate structure, comprising: a body having a chamber, the chamber having a first side and a second side and a plate The first and second sides are respectively connected to the axially opposite ends of the plate-shaped connecting body, and a first capillary structure layer is disposed on a radially outer periphery of the plate-shaped connecting body, and the working chamber has a working liquid.
透過本創作均溫板結構除可解決習知均溫板受熱膨脹變形或受壓力壓縮變形以及支撐體底部平面度不易控制等問題外，亦具有達到節省製造工時及提升熱傳效率等優點者。 In addition to solving the problems of the conventional uniform temperature plate being subjected to thermal expansion deformation or pressure compression deformation and the flatness of the bottom of the support body, the temperature equalizing plate structure of the present invention has the advantages of saving manufacturing man-hours and improving heat transfer efficiency. .
1‧‧‧本體 1‧‧‧ Ontology
1a‧‧‧第一板體 1a‧‧‧ first board
1b‧‧‧第二板體 1b‧‧‧Second plate
11‧‧‧腔室 11‧‧‧ chamber
111‧‧‧第一側 111‧‧‧ first side
112‧‧‧第二側 112‧‧‧ second side
12‧‧‧板狀連接體 12‧‧‧ plate-like connectors
121‧‧‧凹槽 121‧‧‧ Groove
13‧‧‧第一毛細結構層 13‧‧‧First capillary structure
131‧‧‧傾角 131‧‧‧Dip angle
14‧‧‧受熱區 14‧‧‧heated area
15‧‧‧第二毛細結構層 15‧‧‧Second capillary structure
2‧‧‧工作液體 2‧‧‧Working liquid
21‧‧‧汽態之工作流體 21‧‧‧Vaporous working fluid
22‧‧‧液態之工作流體 22‧‧‧Liquid working fluid
3‧‧‧熱源 3‧‧‧heat source
第1圖係為本創作之均溫板結構之第一實施例之立體分解圖；第2圖係為本創作之均溫板結構之第一實施例之組合剖視圖；第3圖係為本創作之均溫板結構之第二實施例之組合剖視圖；第4圖係為本創作之均溫板結構之第三實施例之組合剖視圖；第5圖係為本創作之均溫板結構之第四實施例之組合剖視圖；第6圖係為本創作之均溫板結構示意圖。 1 is an exploded perspective view of a first embodiment of a uniform temperature plate structure of the present invention; FIG. 2 is a combined sectional view of a first embodiment of a uniform temperature plate structure of the present invention; A cross-sectional view of a second embodiment of a uniform temperature plate structure; a fourth sectional view of a third embodiment of the uniform temperature plate structure of the present invention; and a fifth drawing of the fourth embodiment of the present invention A sectional view of the combination of the embodiments; Fig. 6 is a schematic view of the structure of the uniform temperature plate of the present invention.
本創作之上述目的及其結構與功能上的特性，將依據所附圖式之較佳實施例予以說明。 The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
請參閱第1、2圖，係為本創作之均溫板結構之第一實施例之立體分解及組合剖視圖，如圖所示，所述均溫板結構，係具有一本體1； 所述本體1具有一腔室11，該腔室11具有一第一側111及一第二側112及一板狀連接體12，該板狀連接體12軸向兩端分別連接該第一、二側111、112，所述板狀連接體12徑向外側周緣設有一第一毛細結構層13，所述腔室11內具有工作液體2，所述第一毛細結構層13係為一燒結粉末體。 Please refer to the first and second figures, which is a perspective exploded view and a combined sectional view of the first embodiment of the present invention. As shown in the figure, the temperature equalizing plate structure has a body 1; The body 1 has a chamber 11 having a first side 111 and a second side 112 and a plate-like connecting body 12, and the two ends of the plate-shaped connecting body 12 are respectively connected to the first The two sides 111, 112 are provided with a first capillary structure layer 13 on the radially outer periphery of the plate-like connecting body 12. The chamber 11 has a working liquid 2 therein, and the first capillary structure layer 13 is a sintered powder. body.
所述本體1更具有一第一板體1a及一第二板體1b，所述第一、二板體1a、1b對應蓋合共同界定前述腔室11。 The body 1 further has a first plate body 1a and a second plate body 1b, and the first and second plate bodies 1a, 1b jointly define the cavity 11 correspondingly.
所述板狀連接體12係為一金屬板體，並所述板狀連接體12係為一銅材質或一鋁材質或導熱良導體其中任一，本實施例係以銅材質作為說明實施例，但不引以為限。 The plate-shaped connecting body 12 is a metal plate body, and the plate-shaped connecting body 12 is made of a copper material or an aluminum material or a thermally conductive conductor. In this embodiment, a copper material is used as an illustrative embodiment. , but not limited to.
所述第一毛細結構層13係為一燒結粉末體，所述第一毛細結構層13呈正方形或矩形或梯形或圓形等幾何形狀其中任一，本實施例係以正方形作為說明實施例，但並不引以為限。 The first capillary structure layer 13 is a sintered powder body, and the first capillary structure layer 13 has a geometric shape such as a square or a rectangle or a trapezoid or a circle. In this embodiment, a square is used as an illustrative embodiment. But it is not limited.
所述板狀連接體12係呈正方形或矩形或梯形或圓形等幾何形狀其中任一，本實施例係以正方形作為說明實施例，但並不引以為限。 The plate-like connecting body 12 is in the form of a square or a rectangle or a trapezoidal or circular geometric shape. The embodiment is a square as an illustrative embodiment, but is not limited thereto.
請參閱第3圖，係為本創作之均溫板結構之第二實施例之組合剖視圖，如圖所示，本實施例部分結構係與前述第一實施例相同，故在此將不再贅述，惟本實施例與前述第一實施例之不同處係為該本體1更具有一受熱區14係凹設於前述第一、二側111、112其中任一，本實施例之受熱區14係凹設於該第一側111，所述板狀連接體12係設置於該受熱區14，所述第一、二側111、112更設有一第二毛細結構層15，並該受熱區14之第二毛細結構層15較其他非受熱區14之區域厚度厚。 Referring to FIG. 3, it is a sectional view of the second embodiment of the present invention. The structure of the present embodiment is the same as that of the first embodiment, and therefore will not be described again. The difference between the embodiment and the first embodiment is that the body 1 has a heat receiving portion 14 recessed in any one of the first and second sides 111 and 112. The heated portion 14 of the embodiment is The first and second sides 111, 112 are further provided with a second capillary structure layer 15 and the heat receiving area 14 is disposed on the first side 111. The plate-shaped connecting body 12 is disposed on the heat receiving area 14. The second capillary structure layer 15 is thicker than the regions of the other non-heat-receiving regions 14.
請參閱第4圖，係為本創作之均溫板結構之第三實施例之立體分解圖，如圖所示，本實施例部分結構係與前述第一實施例相同，故在此將不再贅述，惟本實施例與前述第二實施例之不同處係為所述板狀連接體12外 緣更具有複數凹槽121。 Please refer to FIG. 4 , which is a perspective exploded view of the third embodiment of the temperature equalizing plate structure of the present invention. As shown in the figure, the partial structure of the embodiment is the same as that of the first embodiment, and therefore will not be used here. For the details, the difference between this embodiment and the foregoing second embodiment is that the plate-like connector 12 is external. The edge further has a plurality of grooves 121.
請參閱第5圖，係為本創作之均溫板結構之第四實施例之組合剖視圖，如圖所示，本實施例部分結構係與前述第一實施例相同，故在此將不再贅述，惟本實施例與前述第一實施例之不同處係為所述第一毛細結構層13更具有一傾角131，係有助於汽態之工作流體21進行發散。 Referring to FIG. 5, it is a sectional view of a fourth embodiment of the present invention. The structure of the present embodiment is the same as that of the first embodiment, and therefore will not be described again. However, the difference between the embodiment and the first embodiment is that the first capillary structure layer 13 has an inclination angle 131 to facilitate the divergence of the working fluid 21 in the vapor state.
請參閱第6圖，係為本創作之均溫板結構示意圖，所述本體1與至少一熱源3接觸，並選擇將本體1設置有板狀連接體12之處作為與該熱源3主要接觸之部位，該本體1設置有板狀連接體12之處，該板狀連接體12作為支撐使用，主要可避免兩者緊密貼合時本體1產生變形。 Please refer to FIG. 6 , which is a schematic diagram of the structure of the uniform temperature plate of the present invention. The body 1 is in contact with at least one heat source 3 and selects the body 1 to be provided with the plate-like connecting body 12 as the main contact with the heat source 3 . In the portion, the body 1 is provided with a plate-like connecting body 12, and the plate-like connecting body 12 is used as a support, and the main body 1 is mainly prevented from being deformed when the two are closely attached.
再者，當該本體1與熱源3進行熱傳導時，該第一板體1a將熱量直接傳遞給該板狀連接體12及在輔以腔室11內之工作流體2搭配產生汽液循環，主要熱量由該板狀連接體12作為傳遞，而受蒸發後之汽態之工作流體21及該液態之工作流體22可由該第一毛細結構層13蒸發發散以及回流，藉以達到極佳的散熱效果。 Moreover, when the body 1 and the heat source 3 perform heat conduction, the first plate body 1a directly transfers heat to the plate-like connecting body 12 and cooperates with the working fluid 2 in the chamber 11 to generate a vapor-liquid circulation, mainly The heat is transferred from the plate-like connecting body 12, and the vaporized working fluid 21 and the liquid working fluid 22 can be evaporated and recirculated by the first capillary structure layer 13 to achieve an excellent heat dissipation effect.
1‧‧‧本體 1‧‧‧ Ontology
1a‧‧‧第一板體 1a‧‧‧ first board
1b‧‧‧第二板體 1b‧‧‧Second plate
11‧‧‧腔室 11‧‧‧ chamber
111‧‧‧第一側 111‧‧‧ first side
112‧‧‧第二側 112‧‧‧ second side
12‧‧‧板狀連接體 12‧‧‧ plate-like connectors
13‧‧‧第一毛細結構層 13‧‧‧First capillary structure
2‧‧‧工作液體 2‧‧‧Working liquid
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103215720U TWM495711U (en) | 2014-09-03 | 2014-09-03 | Heat-spreading board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103215720U TWM495711U (en) | 2014-09-03 | 2014-09-03 | Heat-spreading board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM495711U true TWM495711U (en) | 2015-02-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103215720U TWM495711U (en) | 2014-09-03 | 2014-09-03 | Heat-spreading board structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM495711U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11397057B2 (en) | 2014-09-26 | 2022-07-26 | Asia Vital Components Co., Ltd. | Vapor chamber structure |
-
2014
- 2014-09-03 TW TW103215720U patent/TWM495711U/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11397057B2 (en) | 2014-09-26 | 2022-07-26 | Asia Vital Components Co., Ltd. | Vapor chamber structure |
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