TWM488038U - Heat dissipation device with capillary member - Google Patents

Heat dissipation device with capillary member Download PDF

Info

Publication number
TWM488038U
TWM488038U TW103212130U TW103212130U TWM488038U TW M488038 U TWM488038 U TW M488038U TW 103212130 U TW103212130 U TW 103212130U TW 103212130 U TW103212130 U TW 103212130U TW M488038 U TWM488038 U TW M488038U
Authority
TW
Taiwan
Prior art keywords
capillary
disposed
block
item
capillary member
Prior art date
Application number
TW103212130U
Other languages
Chinese (zh)
Inventor
Chien-Hung Sun
lei-lei Liu
Xiao-Min Zhang
Original Assignee
Cooler Master Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooler Master Co Ltd filed Critical Cooler Master Co Ltd
Priority to TW103212130U priority Critical patent/TWM488038U/en
Publication of TWM488038U publication Critical patent/TWM488038U/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Claims (40)

【第1項】[Item 1] 一種具有毛細構件的散熱裝置,包括: 一均溫板,包含一殼體及披覆於該殼體內部的一第一毛細結構,該殼體設有至少一貫通孔; 至少一熱管,穿接於該貫通孔,該熱管包含一管體及披覆於該管體內部的一第二毛細結構,該管體設有配置在該殼體內部的一開口;以及 至少一毛細構件,容置於該殼體,該毛細構件具有一塊體,該塊體延伸有一穿設部,該塊體貼接於該第一毛細結構,該穿設部穿設於該開口並貼接於該第二毛細結構。A heat sink having a capillary member, comprising: a uniform temperature plate comprising a casing and a first capillary structure covering the interior of the casing, the casing being provided with at least one through hole; At least one heat pipe is connected to the through hole, the heat pipe includes a pipe body and a second capillary structure covering the inside of the pipe body, the pipe body is provided with an opening disposed inside the casing; At least one capillary member is disposed in the housing, the capillary member has a body, the block body extends through a through portion, the block is attached to the first capillary structure, and the through portion is inserted through the opening and attached Connected to the second capillary structure. 【第2項】[Item 2] 如請求項1所述之具有毛細構件的散熱裝置,其中該塊體具有一透空區,該透空區連通於該殼體與該管體。A heat dissipating device having a capillary member according to claim 1, wherein the block has a through-opening region that communicates with the casing and the tubular body. 【第3項】[Item 3] 如請求項2所述之具有毛細構件的散熱裝置,其中該透空區包含開設於該塊體的一貫穿孔,該穿設部包含自該塊體延伸的一凸塊,該凸塊配置在該貫穿孔的外周緣一側,該凸塊穿設於該開口並貼接於該第二毛細結構。The heat dissipating device having a capillary member according to claim 2, wherein the permeable region comprises a continuous perforation formed in the block, the penetrating portion comprising a protrusion extending from the block, the protrusion being disposed at the The bump is disposed on the outer peripheral edge of the through hole and is attached to the opening and attached to the second capillary structure. 【第4項】[Item 4] 如請求項2所述之具有毛細構件的散熱裝置,其中該透空區包含開設於該塊體的一貫穿孔,該穿設部包含自該塊體延伸的一環塊,該環塊配置在該貫穿孔的外周緣,該環塊穿設於該開口並貼接於該第二毛細結構。The heat dissipating device having a capillary member according to claim 2, wherein the permeable region comprises a continuous perforation formed in the block, the piercing portion comprising a ring block extending from the block, the ring block being disposed at the through hole An outer circumference of the hole, the ring block is disposed in the opening and attached to the second capillary structure. 【第5項】[Item 5] 如請求項2所述之具有毛細構件的散熱裝置,其中該透空區包含開設於該塊體一側的一剖槽,該穿設部包含自該塊體延伸的一凸塊,該凸塊配置在該剖槽的外周緣,該凸塊穿設於該開口並貼接於該第二毛細結構。The heat dissipating device having a capillary member according to claim 2, wherein the permeable region comprises a slit formed on one side of the block, the through portion comprising a protrusion extending from the block, the bump The protrusion is disposed on the outer circumference of the slot, and the protrusion passes through the opening and is attached to the second capillary structure. 【第6項】[Item 6] 如請求項1或2所述之具有毛細構件的散熱裝置,其中該第一毛細結構及該第二毛細結構分別為顆粒燒結體、金屬網體、溝槽或其組合所構成。The heat dissipating device having a capillary member according to claim 1 or 2, wherein the first capillary structure and the second capillary structure are respectively composed of a particle sintered body, a metal mesh body, a groove, or a combination thereof. 【第7項】[Item 7] 如請求項1或2所述之具有毛細構件的散熱裝置,其中該毛細構件為顆粒燒結體、金屬網體或其組合所構成。A heat dissipating device having a capillary member according to claim 1 or 2, wherein the capillary member is composed of a particle sintered body, a metal mesh body or a combination thereof. 【第8項】[Item 8] 如請求項1或2所述之具有毛細構件的散熱裝置,其中該熱管具有一冷凝段,該冷凝段與該均溫板呈平行配置。A heat dissipating device having a capillary member according to claim 1 or 2, wherein the heat pipe has a condensation section which is disposed in parallel with the temperature equalization plate. 【第9項】[Item 9] 如請求項1或2所述之具有毛細構件的散熱裝置,其中該熱管具有一冷凝段,該冷凝段與該均溫板呈垂直配置。A heat dissipating device having a capillary member according to claim 1 or 2, wherein the heat pipe has a condensation section which is disposed perpendicular to the temperature equalization plate. 【第10項】[Item 10] 如請求項1或2所述之具有毛細構件的散熱裝置,其中該殼體包含一底座及罩蓋於該底座的一蓋板,該底座具有一底壁及環設於該底壁的一環壁,該底壁朝該蓋板方向延伸有複數支承塊,該貫通孔開設於該環壁,該第一毛細結構披覆於該底壁。The heat dissipating device having a capillary member according to claim 1 or 2, wherein the housing comprises a base and a cover covering the base, the base having a bottom wall and a ring wall annularly disposed on the bottom wall The bottom wall extends in the direction of the cover plate with a plurality of support blocks, the through holes are formed in the ring wall, and the first capillary structure is coated on the bottom wall. 【第11項】[Item 11] 一種具有毛細構件的散熱裝置,包括: 一均溫板,包含一殼體及披覆於該殼體內部的一第一毛細結構,該殼體設有複數貫通孔; 複數熱管,分別穿接於各該貫通孔,每一該熱管包含一管體及披覆於該管體內部的一第二毛細結構,每一該管體設有配置在該殼體內部的一開口;以及 一毛細構件,容置於該殼體,該毛細構件具有一塊體,該塊體延伸有複數穿設部,該塊體貼接於該第一毛細結構,各該穿設部穿設於各該開口並貼接於各該第二毛細結構。A heat sink having a capillary member, comprising: a uniform temperature plate comprising a casing and a first capillary structure covering the interior of the casing, the casing being provided with a plurality of through holes; a plurality of heat pipes respectively connected to the through holes, each heat pipe comprising a pipe body and a second capillary structure covering the inside of the pipe body, each pipe body being provided with a one disposed inside the casing Opening; a capillary member is disposed in the housing, the capillary member has a body extending from the plurality of through portions, the block is attached to the first capillary structure, and each of the through portions is disposed in each of the openings And attached to each of the second capillary structures. 【第12項】[Item 12] 如請求項11所述之具有毛細構件的散熱裝置,其中該塊體具有複數透空區,各該透空區連通於該殼體與各該管體。A heat dissipating device having a capillary member according to claim 11, wherein the block has a plurality of permeable areas, each of the permeable areas being connected to the housing and each of the tubes. 【第13項】[Item 13] 如請求項12所述之具有毛細構件的散熱裝置,其中每一該透空區包含開設於該塊體的一貫穿孔,每一該穿設部包含自該塊體延伸的一凸塊,各該凸塊配置在各該貫穿孔的外周緣一側,各該凸塊穿設於各該開口並貼接於各該第二毛細結構。The heat dissipating device having a capillary member according to claim 12, wherein each of the transparent regions comprises a continuous perforation formed in the block, and each of the through portions includes a bump extending from the block, each of the holes The bumps are disposed on one outer peripheral edge of each of the through holes, and each of the bumps is disposed in each of the openings and is attached to each of the second capillary structures. 【第14項】[Item 14] 如請求項12所述之具有毛細構件的散熱裝置,其中每一該透空區包含開設於該塊體的一貫穿孔,每一該穿設部包含自該塊體延伸的一環塊,各該環塊配置在各該貫穿孔的外周緣,各該環塊穿設於各該開口並貼接於各該第二毛細結構。A heat dissipating device having a capillary member according to claim 12, wherein each of the transparent regions comprises a continuous perforation formed in the block, each of the through portions comprising a ring block extending from the block, each of the rings The block is disposed on an outer circumference of each of the through holes, and each of the ring blocks is disposed in each of the openings and is attached to each of the second capillary structures. 【第15項】[Item 15] 如請求項12所述之具有毛細構件的散熱裝置,其中每一該透空區包含開設於該塊體一側的一剖槽,每一該穿設部含自該塊體延伸的一凸塊,各該凸塊配置在各該剖槽的外周緣,各該凸塊穿設於各該開口並貼接於各該第二毛細結構。The heat dissipating device having a capillary member according to claim 12, wherein each of the transparent regions comprises a slit formed on one side of the block, and each of the through portions includes a bump extending from the block Each of the protrusions is disposed on an outer circumference of each of the slots, and each of the protrusions is disposed in each of the openings and is attached to each of the second capillary structures. 【第16項】[Item 16] 如請求項11或12所述之具有毛細構件的散熱裝置,其中該第一毛細結構及該等第二毛細結構分別為顆粒燒結體、金屬網體、溝槽或其組合所構成。The heat dissipating device having a capillary member according to claim 11 or 12, wherein the first capillary structure and the second capillary structures are respectively composed of a particle sintered body, a metal mesh body, a groove or a combination thereof. 【第17項】[Item 17] 如請求項11或12所述之具有毛細構件的散熱裝置,其中該毛細構件為顆粒燒結體、金屬網體或其組合所構成。A heat dissipating device having a capillary member according to claim 11 or 12, wherein the capillary member is composed of a particle sintered body, a metal mesh body or a combination thereof. 【第18項】[Item 18] 如請求項11或12所述之具有毛細構件的散熱裝置,其中每一該熱管具有一冷凝段,該等冷凝段與該均溫板呈平行配置。A heat dissipating device having a capillary member according to claim 11 or 12, wherein each of the heat pipes has a condensation section which is disposed in parallel with the temperature equalization plate. 【第19項】[Item 19] 如請求項11或12所述之具有毛細構件的散熱裝置,其中每一該熱管具有一冷凝段,該等冷凝段與該均溫板呈垂直配置。A heat dissipating device having a capillary member according to claim 11 or 12, wherein each of the heat pipes has a condensation section which is disposed perpendicular to the temperature equalization plate. 【第20項】[Item 20] 如請求項11或12所述之具有毛細構件的散熱裝置,其中該殼體包含一底座及罩蓋於該底座的一蓋板,該底座具有一底壁及環設於該底壁的一環壁,該底壁朝該蓋板方向延伸有複數支承塊,該等貫通孔開設於該環壁,該第一毛細結構披覆於該底壁。The heat dissipating device having a capillary member according to claim 11 or 12, wherein the housing comprises a base and a cover covering the base, the base having a bottom wall and a ring wall annularly disposed on the bottom wall The bottom wall extends in the direction of the cover plate with a plurality of support blocks, and the through holes are formed in the ring wall, and the first capillary structure is coated on the bottom wall.
TW103212130U 2014-07-08 2014-07-08 Heat dissipation device with capillary member TWM488038U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103212130U TWM488038U (en) 2014-07-08 2014-07-08 Heat dissipation device with capillary member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103212130U TWM488038U (en) 2014-07-08 2014-07-08 Heat dissipation device with capillary member

Publications (1)

Publication Number Publication Date
TWM488038U true TWM488038U (en) 2014-10-11

Family

ID=52108958

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103212130U TWM488038U (en) 2014-07-08 2014-07-08 Heat dissipation device with capillary member

Country Status (1)

Country Link
TW (1) TWM488038U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10760855B2 (en) 2018-11-30 2020-09-01 Furukawa Electric Co., Ltd. Heat sink
TWI722690B (en) * 2018-11-30 2021-03-21 日商古河電氣工業股份有限公司 Heat sink

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10760855B2 (en) 2018-11-30 2020-09-01 Furukawa Electric Co., Ltd. Heat sink
TWI722690B (en) * 2018-11-30 2021-03-21 日商古河電氣工業股份有限公司 Heat sink

Similar Documents

Publication Publication Date Title
USD947837S1 (en) Electronic device
USD862476S1 (en) Electronic device with a detachable cover
USD1016039S1 (en) Electronic device
USD949133S1 (en) Portable input/output device
USD876441S1 (en) Electronic device adapter
USD853544S1 (en) Air purifier
USD879152S1 (en) Electronic device
USD880440S1 (en) Electronic device
USD888273S1 (en) Microfluidic chip with microchannels
US10012445B2 (en) Vapor chamber and heat pipe combined structure
USD824566S1 (en) Suspended round luminaire
USD947336S1 (en) Air treatment device
USD1004764S1 (en) Ceiling fan
USD749594S1 (en) Electronic device kickstand shell
USD825463S1 (en) Heat spreader
JP2017125689A5 (en) Gas cell and atomic oscillator
JP2016532630A5 (en)
TW201736794A (en) Heat-conducting structure
TWM488038U (en) Heat dissipation device with capillary member
JP2016531836A5 (en)
JPWO2020121898A5 (en)
USD960336S1 (en) Heat exchanger tube with fins
JP2016040521A5 (en)
JP2019008986A5 (en)
USD800282S1 (en) Heat exchanger fin