TWM484277U - LED light emitting device and LED lamp - Google Patents
LED light emitting device and LED lamp Download PDFInfo
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- TWM484277U TWM484277U TW103205802U TW103205802U TWM484277U TW M484277 U TWM484277 U TW M484277U TW 103205802 U TW103205802 U TW 103205802U TW 103205802 U TW103205802 U TW 103205802U TW M484277 U TWM484277 U TW M484277U
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Description
本創作是有關一種發光裝置，且特別是有關於一種能以交流電力直接驅動發光的LED發光裝置及LED燈具。The present invention relates to a light-emitting device, and more particularly to an LED light-emitting device and an LED lamp capable of directly driving light with alternating current power.
近幾年來，發光二極體(LED)的應用已逐漸廣泛，且隨著技術領域的不斷提升，目前已研發出高照明輝度的高功率發光二極體，其足以取代傳統的照明光源。但，LED要完全取代傳統的照明光源還有許多待克服的問題存在。舉例來說，由於LED所適用的範圍越來越廣，所以微小化以及同款型號適於搭配更多尺寸之光學元件，已是研究發展的趨勢。In recent years, the application of light-emitting diodes (LEDs) has gradually become widespread, and with the continuous improvement of the technical field, high-power light-emitting diodes with high illumination brightness have been developed, which are sufficient to replace the traditional illumination sources. However, there are still many problems to be overcome in order to completely replace the traditional lighting source. For example, due to the wider range of LEDs, miniaturization and the same model are suitable for matching optical components of more sizes, which is the trend of research and development.
於是，本創作人有感上述缺失之可改善，乃特潛心研究並配合學理之運用，終於提出一種設計合理且有效改善上述缺失之本創作。Therefore, the creator feels that the above-mentioned deficiency can be improved. He is devoted to research and cooperates with the application of theory, and finally proposes a creation that is reasonable in design and effective in improving the above-mentioned deficiency.
本創作實施例在於提供一種LED發光裝置及LED燈具，其能進一步地微小化且能與更多尺寸之光學配件搭配使用而不會大幅影響出光效果。The present embodiment provides an LED light-emitting device and an LED lamp that can be further miniaturized and can be used with more-sized optical components without greatly affecting the light-emitting effect.
本創作實施例提供一種LED發光裝置，包括：一電路板，具有一基板與一電路層，該基板具有位於相反側的一第一表面與一第二表面，該電路層設於該基板的第一表面，且該電路層具有一LED線路、一電子元件線路、及兩電極，該電子元件線路電性連接於該LED線路，而該兩電極電性連接於該電子元件線路；一內阻隔牆，其大致呈圓形且設置於該電路板，該內阻隔牆與該電路 板共同包圍界定出一內容置空間，該LED線路至少部分顯露於該內容置空間；一外阻隔牆，其大致呈圓形且設置於該電路板，該外阻隔牆位於該內阻隔牆外側，並且該外阻隔牆的圓心重疊於該內阻隔牆的圓心，該外阻隔牆、該內阻隔牆、與該電路板共同包圍界定出一外容置空間，該電子元件線路至少部分顯露於該外容置空間，而該兩電極至少部分顯露於該外阻隔牆之外；至少一LED裸晶，其設置於該內容置空間且電性連接於該LED線路；數個電子元件，其大致呈圓環狀地排列設置於該外容置空間且電性連接於該電子元件線路，並且該些電子元件具有一LED驅動元件；一透光封裝體，其形成於該內容置空間且包覆該LED裸晶於其內；以及一反光封裝體，其形成於該外容置空間且包覆該些電子元件於其內；其中，該兩電極用以電性連接於一交流電源，使該交流電源所提供之交流電力經由該電路層與該些電子元件之傳輸與轉換，而能令該LED裸晶發光。The present invention provides an LED lighting device, comprising: a circuit board having a substrate and a circuit layer, the substrate having a first surface and a second surface on opposite sides, the circuit layer being disposed on the substrate a surface, and the circuit layer has an LED line, an electronic component line, and two electrodes, the electronic component line is electrically connected to the LED line, and the two electrodes are electrically connected to the electronic component line; an internal barrier wall , which is substantially circular and disposed on the circuit board, the inner barrier wall and the circuit The common enclosure defines a content space, the LED circuit is at least partially exposed in the content space; an outer barrier wall is substantially circular and disposed on the circuit board, and the outer barrier wall is located outside the inner barrier wall. And the center of the outer barrier wall is overlapped with the center of the inner barrier wall, and the outer barrier wall, the inner barrier wall, and the circuit board together define an outer accommodating space, and the electronic component circuit is at least partially exposed Storing a space, and the two electrodes are at least partially exposed outside the outer barrier wall; at least one LED die is disposed in the space and electrically connected to the LED line; and the plurality of electronic components are substantially round Arranging annularly in the outer accommodating space and electrically connected to the electronic component circuit, and the electronic components have an LED driving component; a light transmissive package formed in the content space and covering the LED And a reflective package formed in the outer accommodating space and covering the electronic components therein; wherein the two electrodes are electrically connected to an alternating current power source to make the alternating current AC electric power provided through the circuit layer and the plurality of transmission and conversion of electronic components, and make light emission of the LED die.
本創作實施例另提供一種LED燈具，包括：如上所述之該LED發光裝置；以及一光學配件，其裝設於該LED發光裝置上，該光學配件鄰近於該發光裝置之該反光封裝體的部位形成有一大致呈圓形的開口，並且該開口的圓心對應於該內阻隔牆的圓心，而該開口的直徑大於等於該內阻隔牆的直徑，並小於等於該外阻隔牆的直徑。The present invention further provides an LED lamp comprising: the LED lighting device as described above; and an optical component mounted on the LED lighting device, the optical component being adjacent to the reflective package of the lighting device The portion is formed with a substantially circular opening, and the center of the opening corresponds to the center of the inner barrier wall, and the diameter of the opening is greater than or equal to the diameter of the inner barrier wall and less than or equal to the diameter of the outer barrier wall.
綜上所述，本創作實施例所提供的LED發光裝置及LED燈具，其在能夠以交流電力直接驅動發光的前提下，透過將電子元件圓環狀地排列設置在外容置空間，藉以能進一步縮小基板所使用的尺寸；並且，經由形成圓環狀的反光封裝體，用以使LED發光裝置頂面能有效地反射光線，進而令裝設在LED發光裝置之光學配件開口尺寸能有更大的選用範圍。As described above, the LED light-emitting device and the LED lamp provided by the present embodiment can further expand the arrangement of the electronic components in the outer housing space under the premise that the light can be directly driven by the alternating current power, thereby further Reducing the size of the substrate; and forming an annular reflective package to enable the top surface of the LED illumination device to effectively reflect light, thereby enabling the optical component opening size of the LED illumination device to be larger The range of options.
為使能更進一步瞭解本創作之特徵及技術內容，請參閱以下有關本創作之詳細說明與附圖，但是此等說明與所附圖式僅係用 來說明本創作，而非對本創作的權利範圍作任何的限制。In order to further understand the features and technical content of this creation, please refer to the following detailed description and drawings of this creation, but these explanations are only used with the drawings. To illustrate this creation, and not to limit the scope of the scope of this creation.
100‧‧‧LED發光裝置100‧‧‧LED lighting device
1‧‧‧電路板1‧‧‧ boards
11‧‧‧基板11‧‧‧Substrate
111‧‧‧第一表面111‧‧‧ first surface
112‧‧‧第二表面112‧‧‧ second surface
12‧‧‧電路層12‧‧‧ circuit layer
121‧‧‧LED線路121‧‧‧LED lines
122‧‧‧電子元件線路122‧‧‧Electronic component line
123‧‧‧電極123‧‧‧electrode
2‧‧‧內阻隔牆2‧‧‧Internal barrier wall
21‧‧‧內容置空間21‧‧‧Content space
3‧‧‧外阻隔牆3‧‧‧External barrier wall
31‧‧‧外容置空間31‧‧‧External space
4‧‧‧LED裸晶4‧‧‧LED bare crystal
5‧‧‧電子元件5‧‧‧Electronic components
51‧‧‧LED驅動元件51‧‧‧LED drive components
52‧‧‧整流元件52‧‧‧Rectifying components
53‧‧‧功率元件53‧‧‧Power components
6‧‧‧透光封裝體6‧‧‧Light-transmissive package
61‧‧‧出光面61‧‧‧Glossy
7‧‧‧反光封裝體7‧‧‧Reflective package
71‧‧‧反射面71‧‧‧reflecting surface
200‧‧‧光學配件200‧‧‧Optical accessories
201‧‧‧反射杯201‧‧‧Reflection Cup
202、202’‧‧‧開口202, 202’‧‧‧ openings
300‧‧‧交流電源300‧‧‧AC power supply
圖1為本創作LED發光裝置的立體示意圖。FIG. 1 is a perspective view of the LED lighting device of the present invention.
圖2為圖1的剖視示意圖。Figure 2 is a cross-sectional view of Figure 1.
圖3為圖1的分解示意圖。Figure 3 is an exploded perspective view of Figure 1.
圖4為圖1的另一分解示意圖。4 is another exploded view of FIG. 1.
圖5為圖1的又一分解示意圖。FIG. 5 is another exploded schematic view of FIG. 1. FIG.
圖6為本創作LED發光裝置之反射面的反射率示意圖。FIG. 6 is a schematic view showing the reflectance of the reflecting surface of the LED light emitting device.
圖7為本創作LED發光裝置連接交流電源的發光示意圖。FIG. 7 is a schematic diagram of the illumination of the LED light emitting device connected to the AC power source.
圖8為本創作LED燈具的示意圖。Figure 8 is a schematic view of the LED lamp of the present invention.
圖9為本創作LED燈具另一態樣的示意圖。FIG. 9 is a schematic view showing another aspect of the LED lamp of the present invention.
請參閱圖1，其為本創作的一實施例，需先說明的是，本實施例對應圖式所提及之相關數量與數量，僅用以具體地說明本創作的實施方式，以便於了解其內容，而非用以侷限本創作的權利範圍。Please refer to FIG. 1 , which is an embodiment of the present invention. It should be noted that the related quantity and quantity mentioned in the embodiment are only used to specifically describe the implementation manner of the present creation, so as to facilitate understanding. Its content, not the scope of its rights to limit this creation.
請參閱圖1和圖2所示，本實施例為一種LED發光裝置100，包括一電路板1、設於電路板1上的一內阻隔牆2與一外阻隔牆3、設在電路板1上的數個LED裸晶4與數個電子元件5、設於電路板1與內阻隔牆2所包圍之空間內的一透光封裝體6、及設於內阻隔牆2外側的一反光封裝體7。本實施例於下述先說明LED發光裝置100各元件之可能的實施構造，而後再適時介紹各元件之間的彼此連接關係。As shown in FIG. 1 and FIG. 2 , the present embodiment is an LED lighting device 100 including a circuit board 1 , an internal barrier wall 2 disposed on the circuit board 1 and an external barrier wall 3 , and a circuit board 1 . a plurality of LED bare crystals 4 and a plurality of electronic components 5, a light-transmissive package 6 disposed in a space surrounded by the circuit board 1 and the inner barrier wall 2, and a reflective package disposed outside the inner barrier wall 2 Body 7. In this embodiment, a possible implementation configuration of each component of the LED lighting device 100 will be described below, and then the connection relationship between the components will be described in a timely manner.
如圖3至圖5，所述電路板1包含有一基板11與一電路層12，上述基板11大致呈方形(如：長方形或正方形)且具有位於相反側的一第一表面111與一第二表面112。其中，所述基板11可為金 屬基板和絕緣基板，當採用金屬基板時，更包含一介電層(圖略)設置於金屬基板和電路層12之間，介電層覆蓋於金屬基板的板面上，且介電層邊緣大致與金屬基板邊緣切齊。金屬基板可為鋁基板或銅基板，不以此為限。絕緣基板可為陶瓷基板或樹脂板。而於本實施例中，基板11是以絕緣基板為例。As shown in FIG. 3 to FIG. 5, the circuit board 1 includes a substrate 11 and a circuit layer 12. The substrate 11 is substantially square (eg, rectangular or square) and has a first surface 111 and a second on opposite sides. Surface 112. Wherein, the substrate 11 can be gold The substrate and the insulating substrate, when a metal substrate is used, further comprises a dielectric layer (not shown) disposed between the metal substrate and the circuit layer 12, the dielectric layer covering the surface of the metal substrate, and the edge of the dielectric layer It is roughly aligned with the edge of the metal substrate. The metal substrate may be an aluminum substrate or a copper substrate, and is not limited thereto. The insulating substrate may be a ceramic substrate or a resin plate. In the present embodiment, the substrate 11 is exemplified by an insulating substrate.
所述電路層12設於基板11的第一表面111，且電路層12具有一LED線路121、一電子元件線路122、及兩電極123，上述電子元件線路122電性連接於LED線路121，而兩電極123則電性連接於電子元件線路122。須說明的是，有關電性連接之方式可以透過打線等方式實施，在此不加以侷限。The circuit layer 12 is disposed on the first surface 111 of the substrate 11. The circuit layer 12 has an LED line 121, an electronic component line 122, and two electrodes 123. The electronic component line 122 is electrically connected to the LED line 121. The two electrodes 123 are electrically connected to the electronic component line 122. It should be noted that the way of electrical connection can be implemented by means of wire bonding, etc., and is not limited here.
所述內阻隔牆2之材質較佳為陶瓷材料，但不侷限於此。內阻隔牆2大致呈圓形且固設於電路板1的大致中央部位上(即位於基板11的第一表面111與部分電路層12上)。其中，遠離基板11的內阻隔牆2頂緣，其至基板11第一表面111的距離(相當於內阻隔牆2之高度)大於任一LED裸晶4頂緣至基板11第一表面111的距離(相當於LED裸晶4的高度)。The material of the inner barrier wall 2 is preferably a ceramic material, but is not limited thereto. The inner barrier wall 2 is substantially circular and is fixed to a substantially central portion of the circuit board 1 (ie, on the first surface 111 of the substrate 11 and a portion of the circuit layer 12). Wherein, the distance from the top edge of the inner barrier wall 2 of the substrate 11 to the first surface 111 of the substrate 11 (corresponding to the height of the inner barrier wall 2) is greater than the top edge of any of the LED bare crystals 4 to the first surface 111 of the substrate 11. Distance (equivalent to the height of the LED bare crystal 4).
再者，所述內阻隔牆2與電路板1共同包圍界定出一內容置空間21，而上述LED線路121至少部分顯露於內容置空間21，用以供LED裸晶4作為置晶與打線之用。Furthermore, the inner barrier wall 2 and the circuit board 1 together define a content space 21, and the LED line 121 is at least partially exposed in the content space 21 for the LED bare crystal 4 to be used for crystallization and wire bonding. use.
所述外阻隔牆3之材質較佳為陶瓷材料，但不侷限於此。外阻隔牆3亦大致呈圓形且設置於電路板1上(即位於基板11的第一表面111與部分電路層12上)，並且外阻隔牆3位於內阻隔牆2外側，而外阻隔牆3的圓心重疊於內阻隔牆2的圓心。其中，遠離基板11的外阻隔牆3頂緣，其至基板11第一表面111的距離(相當於外阻隔牆3之高度)大於任一電子元件5頂緣至基板11第一表面111的距離(相當於電子元件5之高度)。而於本實施例中，所述外阻隔牆3之高度大致等於內阻隔牆2之高度，但實際應用時不受限於此。The material of the outer barrier wall 3 is preferably a ceramic material, but is not limited thereto. The outer barrier wall 3 is also substantially circular and disposed on the circuit board 1 (ie, on the first surface 111 of the substrate 11 and part of the circuit layer 12), and the outer barrier wall 3 is located outside the inner barrier wall 2, and the outer barrier wall The center of 3 overlaps the center of the inner barrier wall 2. Wherein, the distance from the top edge of the outer barrier wall 3 of the substrate 11 to the first surface 111 of the substrate 11 (corresponding to the height of the outer barrier wall 3) is greater than the distance from the top edge of any electronic component 5 to the first surface 111 of the substrate 11. (corresponding to the height of the electronic component 5). In the present embodiment, the height of the outer barrier wall 3 is substantially equal to the height of the inner barrier wall 2, but the actual application is not limited thereto.
再者，所述外阻隔牆3、內阻隔牆2、與電路板1共同包圍界定出一外容置空間31，所述電子元件線路122至少部分顯露於外容置空間31，用以供電子元件5安裝之用；而上述兩電極123至少部分顯露於外阻隔牆3之外，用以供外部電源連接之用。Furthermore, the outer barrier wall 3, the inner barrier wall 2, and the circuit board 1 together define an outer accommodating space 31, and the electronic component line 122 is at least partially exposed to the outer accommodating space 31 for electronic The component 5 is mounted for use; and the two electrodes 123 are at least partially exposed outside the outer barrier wall 3 for external power connection.
更詳細地說，所述兩電極123位於外阻隔牆3徑向方向上的相反兩側部位，並且所述兩電極123所在的位置大致位於基板11的相對向之兩角落。並且所述兩電極123用以電性連接於一交流電源300(如圖7)，使交流電源300所提供之交流電力經由電路層12與該些電子元件5之傳輸與轉換，而能令置於LED線路121上的LED裸晶4發光。In more detail, the two electrodes 123 are located on opposite sides of the outer barrier wall 3 in the radial direction, and the positions of the two electrodes 123 are located substantially at opposite corners of the substrate 11. The two electrodes 123 are electrically connected to an AC power source 300 (as shown in FIG. 7 ), so that the AC power provided by the AC power source 300 can be transmitted and converted through the circuit layer 12 and the electronic components 5 . The LED bare crystal 4 on the LED line 121 emits light.
所述LED裸晶4(尤指直流LED裸晶)設置於內容置空間21，並且LED裸晶4電性連接於電路層12的LED線路121。其中，上述LED裸晶4於本實施例中是兩種不同發光型態的LED裸晶，但於實際應用時，LED裸晶4的發光型態不受限於此。The LED die 4 (especially the DC LED die) is disposed in the content space 21 , and the LED die 4 is electrically connected to the LED line 121 of the circuit layer 12 . In the present embodiment, the LED bare crystal 4 is two bare LEDs of different illumination patterns, but in practical applications, the illumination pattern of the LED bare crystal 4 is not limited thereto.
所述電子元件5較佳為裸晶態樣且大致呈圓環狀地排列設置於外容置空間31，並且電子元件5電性連接於電路層12的電子元件線路122。進一步地說，本實施例透過將電子元件5以圓環狀排列的方式設置於LED裸晶4的周圍，藉以使電子元件5的排列更為密集，進而令基板11的尺寸能夠縮小。The electronic component 5 is preferably in a bare crystal state and arranged in a substantially annular shape in the outer accommodating space 31 , and the electronic component 5 is electrically connected to the electronic component line 122 of the circuit layer 12 . Further, in the present embodiment, the electronic components 5 are arranged in an annular shape so as to be arranged around the LED bare crystals 4, whereby the arrangement of the electronic components 5 is made denser, and the size of the substrate 11 can be reduced.
再者，所述電子元件5於本實施例中分為兩組，而每組電子元件5以包含有LED驅動元件51、整流元件52(如：橋式整流器)、及功率元件53為例，但於實際應用時，電子元件5所包含的元件種類與數量可依設計者需求而加以調整，並不侷限於此。舉例來說，在一未繪示的實施例中，所述電子元件5亦可以同時包含有線性元件與非線性元件。附帶說明一點，本實施例所指的電子元件5排除LED晶片或LED裸晶。Furthermore, the electronic component 5 is divided into two groups in the embodiment, and each set of electronic components 5 includes an LED driving component 51, a rectifying component 52 (such as a bridge rectifier), and a power component 53 as an example. However, in practical applications, the types and quantities of components included in the electronic component 5 can be adjusted according to the needs of the designer, and are not limited thereto. For example, in an embodiment not shown, the electronic component 5 can also include both linear components and nonlinear components. Incidentally, the electronic component 5 referred to in this embodiment excludes an LED chip or an LED bare crystal.
藉此，當上述LED裸晶4採用兩種不同發光型態時，其能分別電性連接於所述兩組的LED驅動元件51、整流元件52、及功 率元件53。而所述兩組的LED驅動元件51、整流元件52、及功率元件53則能分別用以驅動上述兩種不同發光型態的LED裸晶4，藉以調整上述兩種不同發光型態的LED裸晶4的發光比例，進而達到混光的效果。Therefore, when the LED bare crystal 4 adopts two different illumination patterns, it can be electrically connected to the two groups of the LED driving component 51, the rectifying component 52, and the work. Rate element 53. The LED driving component 51, the rectifying component 52, and the power component 53 of the two groups can respectively drive the LED bare crystals 4 of the two different illumination types to adjust the LED bareness of the two different illumination patterns. The ratio of the luminescence of the crystal 4 further achieves the effect of light mixing.
補充說明一點，上述LED裸晶4與電子元件5裝設於電路層12的方式可以是覆晶(flip chip)、迴焊(reflow)、超音波(ultrasonic)、表面貼裝技術(SMT)、或打線(wire bonding)等方式，在此不加以限制。In addition, the manner in which the LED bare metal 4 and the electronic component 5 are mounted on the circuit layer 12 may be a flip chip, a reflow, an ultrasonic, a surface mount technology (SMT), or the like. Or wire bonding, etc., there is no limitation here.
所述透光封裝體6可以由矽樹脂(silicone)或是環氧樹脂(epoxy resin)所製成，更進一步地說，所述透光封裝體6可為一種單純的透明膠體或內混有螢光粉的螢光膠體，但本實施例不以此為限。The transparent package 6 can be made of silicone or epoxy resin. Further, the transparent package 6 can be a simple transparent colloid or mixed with Fluorescent colloid of phosphor powder, but this embodiment is not limited thereto.
再者，所述透光封裝體6填設於內阻隔牆2與電路板1所共同圍繞定義的內容置空間21之中，藉以使LED裸晶4能被透光封裝體6所封裝(即LED裸晶4包覆於透光封裝體6之內)。換個角度來看，透過上述透光封裝體6被限位在內阻隔牆2所圍繞的封裝範圍內，以使得透光封裝體6的封裝範圍及填膠量得到有效的控制。In addition, the light-transmissive package 6 is filled in the content space 21 defined by the inner barrier wall 2 and the circuit board 1 , so that the LED bare crystal 4 can be encapsulated by the light-transmissive package 6 (ie, The LED bare crystal 4 is covered in the light-transmissive package 6). From another point of view, the light-transmissive package 6 is limited to a package surrounded by the inner barrier wall 2, so that the package range and the amount of glue of the light-transmitting package 6 are effectively controlled.
所述反光封裝體7較佳為不導電膠體，反光封裝體7主要填設於電路板1、內阻隔牆2、及外阻隔牆3所共同包圍的外容置空間31之中，藉以使反光封裝體7包覆該些電子元件5於其內，也就是說，裸晶態樣的電子元件5能被反光封裝體7所封裝。The reflective package 7 is preferably a non-conductive paste. The reflective package 7 is mainly filled in the outer housing space 31 surrounded by the circuit board 1, the inner barrier wall 2, and the outer barrier wall 3, so as to reflect light. The package body 7 encloses the electronic components 5 therein, that is, the bare-state electronic component 5 can be encapsulated by the reflective package 7.
藉此，透過反光封裝體7同時一體封裝電子元件5於其內，以大幅度地降低生產LED發光裝置100時所需耗費的封裝成本。並且由於反光封裝體7為不導電膠體，因而使得反光封裝體7能具備有隔絕電路之功能，進而避免LED發光裝置100有跳火之情事發生。Thereby, the electronic component 5 is integrally packaged through the retroreflective package 7 at the same time, so that the packaging cost required for producing the LED light-emitting device 100 is greatly reduced. Moreover, since the reflective package 7 is a non-conductive colloid, the reflective package 7 can be provided with a function of isolating the circuit, thereby preventing the LED light-emitting device 100 from jumping.
於遠離基板11的透光封裝體6表面(如圖1中的透光封裝體6 頂面)與反光封裝體7表面(如圖1中的反光封裝體7頂面)，兩者於本實施例中皆平行於基板11的第一表面111且大致呈共平面設置，但不以此為限。On the surface of the light-transmissive package 6 away from the substrate 11 (such as the light-transmissive package 6 in FIG. 1) The top surface) and the surface of the reflective package 7 (such as the top surface of the reflective package 7 in FIG. 1) are both parallel to the first surface 111 of the substrate 11 and substantially coplanar in this embodiment, but not This is limited.
更詳細地說，所述透光封裝體6具有一遠離基板11的出光面61，而反光封裝體7具有一遠離基板11的反射面71。其中，上述反射面71相對於波長為400nm至500nm的光線具有大於85%之反射率(較佳為90%以上)。亦即，反光封裝體7能使用如圖6所示之任一曲線所代表的材質，或是說，圖6所示之任一曲線即代表上述反射面71的反射率。In more detail, the light-transmissive package 6 has a light-emitting surface 61 away from the substrate 11, and the reflective package 7 has a reflective surface 71 away from the substrate 11. The reflection surface 71 has a reflectance (more preferably 90% or more) of more than 85% with respect to light having a wavelength of 400 nm to 500 nm. That is, the reflective package 7 can use a material represented by any of the curves shown in FIG. 6, or any curve shown in FIG. 6 represents the reflectance of the reflective surface 71.
再者，所述反射面71覆蓋在遠離基板11的內阻隔牆2頂緣，並且反射面71與出光面61呈無間隙地相連。而在LED發光裝置100的俯視角度下，遠離基板11的內阻隔牆2頂緣完全被反光封裝體7的反射面71所遮蔽，所以無法被看到。藉此，反光封裝體7的反射面71能用以將光線有效地進行反射，以避免遠離基板11的內阻隔牆2頂緣產生吸收光線之情事，進而提升所述LED發光裝置100整體之光效。Furthermore, the reflecting surface 71 covers the top edge of the inner barrier wall 2 away from the substrate 11, and the reflecting surface 71 is connected to the light emitting surface 61 without a gap. On the other hand, in the plan view angle of the LED lighting device 100, the top edge of the inner barrier wall 2 away from the substrate 11 is completely shielded by the reflecting surface 71 of the reflective package 7, so that it cannot be seen. Thereby, the reflective surface 71 of the reflective package 7 can be used to effectively reflect the light to avoid absorbing light from the top edge of the inner barrier wall 2 of the substrate 11, thereby improving the overall light of the LED light-emitting device 100. effect.
附帶說明一點，反光封裝體7除覆蓋遠離基板11的內阻隔牆2頂緣之外，也可一併覆蓋外阻隔牆3的頂緣與外表面，具體實施態樣在此不加以限制。It is to be noted that the reflective package 7 can cover the top edge and the outer surface of the outer barrier wall 3 in addition to the top edge of the inner barrier wall 2 away from the substrate 11. The specific embodiment is not limited herein.
以上為LED發光裝置100的構造說明，上述LED發光裝置100即為一完整的產品，其能接地被應用(如圖7)或搭配其他裝置使用，可能的應用情況如下述實施例說明之。The above is a description of the configuration of the LED lighting device 100. The LED lighting device 100 is a complete product that can be grounded (as shown in FIG. 7) or used in conjunction with other devices. Possible applications are as described in the following embodiments.
請參閱圖8和圖9所示，本創作的另一實施例提供一種LED燈具，包括如上述實施例所載之LED發光裝置100以及裝設於LED發光裝置100的一光學配件200。其中，光學配件200於本實施例中是以一反射杯201為例，但亦可以是其他類型之光學元件(如：透鏡)。Referring to FIG. 8 and FIG. 9 , another embodiment of the present invention provides an LED lamp comprising the LED lighting device 100 as described in the above embodiment and an optical accessory 200 mounted on the LED lighting device 100 . The optical component 200 is exemplified by a reflective cup 201 in this embodiment, but may be other types of optical components (such as lenses).
所述反射杯201的外型大致呈中空的截圓錐狀，亦即，反射 杯201的兩端各形成有一大致呈圓形且尺寸不同的開口202、202’，並且反射杯201較小的開口202鄰近於LED發光裝置100之反光封裝體7，而上述較小的開口202之圓心對應於內阻隔牆2的圓心。The shape of the reflector cup 201 is substantially hollow and frustoconical, that is, reflection Each of the two ends of the cup 201 is formed with a substantially circular and differently sized opening 202, 202', and the smaller opening 202 of the reflective cup 201 is adjacent to the reflective package 7 of the LED lighting device 100, and the smaller opening 202 is The center of the circle corresponds to the center of the inner barrier wall 2.
由於LED發光裝置100之反光封裝體7形成有反射面71，所以上述反射杯201在選用時，只須符合其較小之開口202的直徑大於等於內阻隔牆2的直徑，並小於等於外阻隔牆3的直徑。換言之，LED發光裝置100能與更多尺寸之反射杯201搭配使用而不影響出光效果。Since the reflective package 7 of the LED lighting device 100 is formed with the reflecting surface 71, the reflecting cup 201 is only required to meet the diameter of the smaller opening 202 and the diameter of the inner blocking wall 2 is greater than or equal to the outer barrier. The diameter of the wall 3. In other words, the LED lighting device 100 can be used with more reflective cups 201 without affecting the light-emitting effect.
綜上所述，本創作實施例所提供的LED發光裝置與LED燈具，其在能夠以交流電力直接驅動發光的前提下，透過將電子元件圓環狀地排列設置在外容置空間，藉以能進一步縮小基板所使用的尺寸；並且，經由形成圓環狀的反光封裝體，用以使LED發光裝置頂面能有效地反射光線，進而令裝設在LED發光裝置之光學配件開口尺寸能有更大的選用範圍。In summary, the LED light-emitting device and the LED lamp provided by the present embodiment can further align the electronic components in the outer housing space under the premise that the light can be directly driven by the alternating current power, thereby further Reducing the size of the substrate; and forming an annular reflective package to enable the top surface of the LED illumination device to effectively reflect light, thereby enabling the optical component opening size of the LED illumination device to be larger The range of options.
再者，透過反光封裝體形成相對於波長400nm至500nm的光線具有大於85%反射率的反射面，進而有效地提升LED發光裝置的整體光效。Moreover, the reflective surface having a reflectance greater than 85% with respect to light having a wavelength of 400 nm to 500 nm is formed through the reflective package, thereby effectively improving the overall light efficiency of the LED light-emitting device.
以上所述僅為本創作之較佳可行實施例，其並非用以侷限本創作之專利範圍，凡依本創作申請專利範圍所做之均等變化與修飾，皆應屬本創作之涵蓋範圍。The above is only a preferred embodiment of the present invention, and it is not intended to limit the scope of the patents of the present invention. Any changes and modifications made to the scope of the patent application of the present invention should be covered by the present invention.
100‧‧‧LED發光裝置100‧‧‧LED lighting device
1‧‧‧電路板1‧‧‧ boards
11‧‧‧基板11‧‧‧Substrate
111‧‧‧第一表面111‧‧‧ first surface
112‧‧‧第二表面112‧‧‧ second surface
12‧‧‧電路層12‧‧‧ circuit layer
121‧‧‧LED線路121‧‧‧LED lines
122‧‧‧電子元件線路122‧‧‧Electronic component line
123‧‧‧電極123‧‧‧electrode
2‧‧‧內阻隔牆2‧‧‧Internal barrier wall
21‧‧‧內容置空間21‧‧‧Content space
3‧‧‧外阻隔牆3‧‧‧External barrier wall
31‧‧‧外容置空間31‧‧‧External space
4‧‧‧LED裸晶4‧‧‧LED bare crystal
5‧‧‧電子元件5‧‧‧Electronic components
51‧‧‧LED驅動元件51‧‧‧LED drive components
52‧‧‧整流元件52‧‧‧Rectifying components
53‧‧‧功率元件53‧‧‧Power components
6‧‧‧透光封裝體6‧‧‧Light-transmissive package
61‧‧‧出光面61‧‧‧Glossy
7‧‧‧反光封裝體7‧‧‧Reflective package
71‧‧‧反射面71‧‧‧reflecting surface
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| TW103205802U TWM484277U (en) | 2014-04-03 | 2014-04-03 | LED light emitting device and LED lamp |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103205802U TWM484277U (en) | 2014-04-03 | 2014-04-03 | LED light emitting device and LED lamp |
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| TWM484277U true TWM484277U (en) | 2014-08-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI551806B (en) * | 2014-04-03 | 2016-10-01 | 弘凱光電（深圳）有限公司 | Led lighting device and led lamp |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI551806B (en) * | 2014-04-03 | 2016-10-01 | 弘凱光電（深圳）有限公司 | Led lighting device and led lamp |
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