TWM484133U - Composite heat sink device - Google Patents

Composite heat sink device Download PDF

Info

Publication number
TWM484133U
TWM484133U TW103202035U TW103202035U TWM484133U TW M484133 U TWM484133 U TW M484133U TW 103202035 U TW103202035 U TW 103202035U TW 103202035 U TW103202035 U TW 103202035U TW M484133 U TWM484133 U TW M484133U
Authority
TW
Taiwan
Prior art keywords
heat
heat sink
conductive base
joints
composite heat
Prior art date
Application number
TW103202035U
Other languages
Chinese (zh)
Inventor
ru-long Chen
Jun-Hou Zhan
Jun-Long Wu
Original Assignee
Emerler Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Emerler Electronics Co Ltd filed Critical Emerler Electronics Co Ltd
Priority to TW103202035U priority Critical patent/TWM484133U/en
Publication of TWM484133U publication Critical patent/TWM484133U/en

Links

Description

複合式散熱裝置Composite heat sink

本創作係有關於一種散熱裝置用以散逸一發熱元件的熱能,特別是指一種結合兩種不同金屬以增加其導熱效率的複合式散熱裝置。The present invention relates to a heat dissipating device for dissipating thermal energy of a heating element, and more particularly to a composite heat dissipating device combining two different metals to increase its heat conduction efficiency.

散熱器已普遍地被利用來散發一發熱元件的熱能,此外為著散熱器接觸上述發熱元件的部份能具更好導熱效果,習知技術也發展出具有二種金屬材質的複合材質之散熱器結構,例如中華民國專利公告號M252069之「複合材質之散熱器結構」。The heat sink has been generally used to dissipate the heat energy of a heat-generating component, and the heat-radiating effect can be obtained for the heat sink to contact the heat-generating component. The conventional technology also develops a heat-dissipating composite material having two kinds of metal materials. The structure of the device is, for example, the "heat sink structure of composite material" of the Republic of China Patent Publication No. M252069.

上述習知專利在鋁材的散熱器本體及銅材導熱座之間的接觸面,採取呈凸齒狀的凹凸嚙咬配合,如鋸齒狀或波浪狀。此種結合的效果仍不夠堅固。散熱器本體仍容易與銅材導熱座分離。In the above-mentioned conventional patent, the contact surface between the heat sink body of the aluminum material and the heat conductive seat of the copper material adopts a convex-toothed concave-convex biting fit, such as a zigzag shape or a wave shape. The effect of this combination is still not strong enough. The heat sink body is still easily separated from the copper heat transfer seat.

本創作實施例在於提供一種複合式散熱裝置,使散熱本體與導熱基座穩固地結合以避免脫離,此外在於導熱基座良好且均勻地將熱傳導至散熱本體。The present embodiment provides a composite heat sink that securely couples the heat sink body to the heat conductive base to avoid detachment, and further that the heat conductive base conducts heat to the heat sink body well and uniformly.

為達上面所描述的,本創作其中一實施例所提供的一種複合式散熱裝置,其包括一導熱基座及一散熱本體。上述導熱基座具有一第一底面及一第一頂面,該第一頂面具有多數個突出狀的結合部,每一結合部具有一連接於該第一底面的底端以及由該底端一體成型地向上延伸的頂端,其中該頂端的截面積大於該底端的 截面積;上述散熱本體具有第二底面及一第二頂面,該第二底面具有一對應於該導熱基座之輪廓的凹陷部、及多數個形成於該凹陷部內的結合槽,該些結合槽的形狀對應於該些結合部的形狀,該些結合部對應地結合於該些結合槽內。In order to achieve the above, a composite heat sink provided by one embodiment of the present invention includes a heat conducting base and a heat dissipating body. The heat conducting base has a first bottom surface and a first top surface, the first top surface has a plurality of protruding joints, each joint has a bottom end connected to the first bottom surface and the bottom end An upwardly extending top end, wherein the top end has a larger cross-sectional area than the bottom end The heat dissipation body has a second bottom surface and a second top surface, the second bottom surface has a recess corresponding to the contour of the heat conductive base, and a plurality of coupling grooves formed in the recess portion, the combination The shape of the groove corresponds to the shape of the joint portions, and the joint portions are correspondingly coupled into the joint grooves.

本創作的有益效果可以在於,本創作實施例的導熱基座可以穩固地咬合於散熱本體,藉由此種彼此咬合的結構,接合面積大、導熱面積大、散熱效率高。The beneficial effect of the present invention is that the heat-conducting base of the present embodiment can be firmly engaged with the heat-dissipating body. With such a structure that is engaged with each other, the joint area is large, the heat-conducting area is large, and the heat-dissipating efficiency is high.

為使能更進一步瞭解本創作之特徵及技術內容,請參閱以下有關本創作之詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本創作加以限制者。In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and explanation, and are not intended to limit the creation.

100、100’‧‧‧複合式散熱裝置100,100'‧‧‧Composite heat sink

10、10’‧‧‧導熱基座10, 10'‧‧‧ Thermal base

11‧‧‧第一底面11‧‧‧ first bottom surface

12‧‧‧第一頂面12‧‧‧ first top surface

14‧‧‧結合部14‧‧‧Combination Department

141‧‧‧底端141‧‧‧ bottom

142‧‧‧頂端142‧‧‧Top

144‧‧‧斜面144‧‧‧Bevel

16‧‧‧結合部16‧‧‧Combination Department

161‧‧‧平板部161‧‧‧ Flat section

162‧‧‧頸部162‧‧‧ neck

20、20’‧‧‧散熱本體20, 20’‧‧‧Solution body

21‧‧‧第二底面21‧‧‧Second bottom

210‧‧‧凹陷部210‧‧‧Depression

212、216‧‧‧結合槽212, 216‧‧‧ joint slot

22‧‧‧第二頂面22‧‧‧Second top

24‧‧‧散熱突出件24‧‧‧heating protruding parts

圖1為本創作之複合式散熱裝置第一實施例的立體分解圖。1 is an exploded perspective view of a first embodiment of a composite heat sink according to the present invention.

圖2為本創作之複合式散熱裝置的另一立體分解圖。2 is another exploded perspective view of the composite heat sink of the present invention.

圖3為本創作之複合式散熱裝置的立體組合圖。FIG. 3 is a perspective assembled view of the composite heat sink of the present invention.

圖4A為本創作之複合式散熱裝置的剖視圖。4A is a cross-sectional view of the composite heat sink of the present invention.

圖4B為本創作之複合式散熱裝置的另一剖視圖。4B is another cross-sectional view of the composite heat sink of the present invention.

圖5為本創作之複合式散熱裝置第二實施例的立體分解圖。FIG. 5 is an exploded perspective view of a second embodiment of the composite heat sink according to the present invention.

圖6為本創作之複合式散熱裝置第二實施例的另一立體分解圖。FIG. 6 is another perspective exploded view of the second embodiment of the composite heat sink according to the present invention.

圖7為本創作之複合式散熱裝置第二實施例的立體組合圖。FIG. 7 is a perspective assembled view of a second embodiment of the composite heat sink according to the present invention.

圖8為本創作之複合式散熱裝置第二實施例的剖視圖。Figure 8 is a cross-sectional view showing a second embodiment of the composite heat sink of the present invention.

以下所描述之實施例提及數量或其類似者,除非另作說明,否則本創作的應用範疇應不受其數量或其類似者之限制。此處揭露的特定細節不應當被解釋為限制,而是僅應當作申請專利範圍的基礎,以及當作一代表性基礎來教示習於此藝者使其等得以事實上任何適當的方式各式各樣地利用本創作,包括利用此處揭露 的各種特徵與此處可能未明白揭露者的組合。另外,本創作提及的方向用語,例如:左、右、前或後等,僅是參考附加圖式的方向,是用來說明而並非用來限制本創作。The embodiments described below refer to quantities or the like, and the scope of application of the present invention should not be limited by the number or the like unless otherwise stated. The specific details disclosed herein are not to be construed as limiting, but only as a basis for the scope of the claims, and as a representative basis. Use this creation in a variety of ways, including using this disclosure The various features of the combination may not be combined with the disclosed herein. In addition, the directional terms mentioned in this creation, such as left, right, front or back, are only used to refer to the direction of the additional schema, and are used to illustrate and not to limit the creation.

[第一實施例][First Embodiment]

請參考圖1及圖2,為本創作之複合式散熱裝置不同角度的立體分解圖。本創作提供一種複合式散熱裝置100,包括一導熱基座10及一散熱本體20。導熱基座10嵌設於散熱本體20的底面。關於本創作一種較佳材質安排方式是,其中所述導熱基座10為一銅質導熱基座,所述散熱本體20為一鋁質本體,利用銅具有較高導熱係數的特質,用以接觸待散熱元件的表面,將熱傳導至散熱本體20以散發出去。上述銅質導熱基座可以是銅或銅合金。然而,本創作不以此為限,例如可以是鋁、銅、不鏽鋼…等不同材料及其合金的組合,並配合金屬粉末射出成型(Metal Injection Molding)、粉末冶金鑄造、金屬鍛造、擠壓鑄造(Squeeze casting)、壓鑄加工(die casting)。圖1及圖2僅為方便表達導熱基座10及散熱本體20的細部結構,並非表示其結合的過程。Please refer to FIG. 1 and FIG. 2 for an exploded perspective view of the composite heat sink of the present invention at different angles. The present invention provides a composite heat sink 100 comprising a thermally conductive base 10 and a heat dissipation body 20. The heat conductive base 10 is embedded in the bottom surface of the heat dissipation body 20 . A preferred material arrangement of the present invention is that the heat-conducting base 10 is a copper heat-conducting base, and the heat-dissipating body 20 is an aluminum body, which utilizes a characteristic of copper having a high thermal conductivity for contact. The surface of the heat dissipating component is conducted to the heat dissipating body 20 to be dissipated. The above copper heat conductive base may be copper or a copper alloy. However, this creation is not limited to this. For example, it can be a combination of different materials such as aluminum, copper, stainless steel, etc., and alloy injection molding (Metal Injection Molding), powder metallurgy casting, metal forging, and extrusion casting. (Squeeze casting), die casting. 1 and 2 are only a detailed structure for facilitating the expression of the thermally conductive base 10 and the heat dissipation body 20, and do not indicate the process of bonding.

導熱基座10具有一第一底面11及一第一頂面12,該第一頂面12具有多數個突出狀的結合部14,每一結合部14具有一連接於該第一底面的底端141以及由該底端141一體成型地向上延伸的頂端142,其中該頂端142的截面積大於該底端141的截面積。由側面觀之,結合部14大體呈倒立的楔形(wedge)。由另一面描述,該些結合部14沿著剖面呈梯形,每一該結合部14的頂端142呈矩形狀並且具有一對斜面144由該頂端142向內漸縮連接至所述導熱基座10的第一頂面12。本實施例藉由頂端142大於底端141的結構,藉此可以穩固地結合於散熱本體20,避免兩者脫離。由另一角度來說,本實施例的結合部14四周都是由其頂端142朝向其底端141漸縮,此種結合的方式在平行或垂直於導熱基座10的方向上都是非常穩固的,不會產生側向的滑移。The heat-conducting base 10 has a first bottom surface 11 and a first top surface 12, and the first top surface 12 has a plurality of protruding joints 14 each having a bottom end connected to the first bottom surface. 141 and a top end 142 extending upwardly from the bottom end 141, wherein the top end 142 has a cross-sectional area greater than a cross-sectional area of the bottom end 141. Viewed from the side, the joint 14 is generally in the shape of an inverted wedge. As described on the other hand, the joint portions 14 are trapezoidal along the cross section, and the top end 142 of each of the joint portions 14 has a rectangular shape and has a pair of inclined surfaces 144 which are tapered inwardly from the top end 142 to the heat conducting base 10 . The first top surface 12. In this embodiment, the top end 142 is larger than the bottom end 141, thereby being firmly coupled to the heat dissipation body 20 to prevent the two from coming off. From another point of view, the joint portion 14 of the present embodiment is tapered from its top end 142 toward its bottom end 141. The manner of such bonding is very stable in the direction parallel or perpendicular to the heat conducting base 10. There will be no lateral slippage.

本實施例的該些結合部14均勻地分佈於導熱基座10的第一頂面12,有利於均勻地導熱至散熱本體20。其中所述導熱基座10的該些結合部14沿著縱向排列呈數排狀,其中該些結合部14沿著橫向的奇數排彼此對齊,該些結合部14沿著橫向的偶數排彼此對齊。然而,也可以呈矩形陣列的排列方式。The joints 14 of the embodiment are evenly distributed on the first top surface 12 of the thermally conductive base 10 to facilitate uniform heat conduction to the heat dissipation body 20 . The joint portions 14 of the heat-conducting base 10 are arranged in a row in a longitudinal direction, wherein the joint portions 14 are aligned with each other along an odd-numbered row in the lateral direction, and the joint portions 14 are aligned with each other along an even-numbered row in the lateral direction. . However, it is also possible to arrange in a rectangular array.

散熱本體20具有第二底面21及一第二頂面22,該第二底面21具有一對應於該導熱基座10之輪廓的凹陷部210、及多數個形成於該凹陷部210內的結合槽212,該些結合槽212的形狀對應於該些結合部14的形狀,該些結合部14對應地結合於該些結合槽212內。換言之,結合槽212具有入口窄,內部寬的結構特徵。另外強調的一點,本實施例的該些結合部14的頂端142大致位於同一平面上,換言之,該些結合部14的頂端142與散熱本體20的凹陷部210底面之間的距離大體是相同的,該些結合部14可以同時將熱傳導至散熱本體20,不會造成熱分佈不平均(熱梯度)的現象。The heat dissipation body 20 has a second bottom surface 21 and a second top surface 22. The second bottom surface 21 has a recess 210 corresponding to the contour of the heat conductive base 10, and a plurality of coupling grooves formed in the recess 210. The shape of the coupling groove 212 corresponds to the shape of the coupling portions 14 , and the coupling portions 14 are correspondingly coupled to the coupling grooves 212 . In other words, the coupling groove 212 has a structural feature that the inlet is narrow and the interior is wide. In addition, the top ends 142 of the joint portions 14 of the present embodiment are substantially on the same plane. In other words, the distance between the top end 142 of the joint portions 14 and the bottom surface of the recess portion 210 of the heat dissipation body 20 is substantially the same. The bonding portions 14 can simultaneously conduct heat to the heat dissipation body 20 without causing a phenomenon in which the heat distribution is uneven (thermal gradient).

請參閱圖3,本實施例中所述導熱基座10的第一底面11切齊於所述散熱本體20的第二底面21。然而,本創作也可以配合待散熱元件的需求形成不同的底面。此外,所述散熱本體20的第二頂面22具有多數個散熱突出件24。圖1及圖3所示的散熱突出件24呈倒圓錐筒狀,然而本創作並不限制於此,例如也可以是鰭片狀。Referring to FIG. 3 , the first bottom surface 11 of the heat conduction base 10 is aligned with the second bottom surface 21 of the heat dissipation body 20 . However, this creation can also form different bottom surfaces in accordance with the requirements of the components to be dissipated. In addition, the second top surface 22 of the heat dissipation body 20 has a plurality of heat dissipation protrusions 24. The heat dissipating projections 24 shown in Figs. 1 and 3 have an inverted conical shape. However, the present invention is not limited thereto, and may be, for example, a fin shape.

如圖3所示,本實施例關於導熱基座10與散熱本體20的製程,較佳是以金屬粉末射出成型技術先製造銅材的導熱基座10,然後將成型後的導熱基座10,置於製造所述鋁材的散熱本體20的模具中,再配合以擠壓鑄造(或稱擠壓成形、液態模鍛)的技術製造散熱本體20以緊密結合於導熱基座10。擠壓鑄造方法係將鋁液以0.05~0.1m/s之低速充填,從融熔狀態至凝固完成過程皆施加50Mpa以上之高壓力而使之凝固。此法與低速充填壓鑄法同樣是 澆口面積大,射出速度慢,本實施例的優點在於,空氣與氣體的捲入非常少,有利於散熱本體20與導熱基座10之間良好密切結合,避免捲入空氣而形成導熱的障礙。若是以金屬粉末射出成型技術或粉末治金以製造散熱本體20並結合導熱基座10,因著粉末之間的空隙,以及燒結過程中體積也會進一步收縮,容易在結合部14與結合槽21的壁面之間殘留氣體而形成不利導熱的多性孔(porosity)結構。As shown in FIG. 3, in the process of the heat conducting base 10 and the heat dissipating body 20, the heat conducting base 10 of the copper material is preferably fabricated by metal powder injection molding technology, and then the formed heat conducting base 10 is The heat dissipating body 20 is placed in a mold for manufacturing the heat dissipating body 20 of the aluminum material, and is coupled to the heat conducting base 10 by a technique of extrusion casting (or extrusion molding, liquid die forging). The extrusion casting method is to fill the aluminum liquid at a low speed of 0.05 to 0.1 m/s, and apply a high pressure of 50 Mpa or more from the molten state to the solidification completion process to solidify. This method is the same as the low speed filling die casting method. The gate area is large and the injection speed is slow. The advantage of this embodiment is that the air and gas are entangled very little, which is beneficial to the good close connection between the heat dissipation body 20 and the heat conductive base 10, and avoids the obstacle of entrainment of air to form heat conduction. . If the metal powder injection molding technique or the powder metallurgy is used to manufacture the heat dissipation body 20 and combined with the heat conductive base 10, the volume between the powders and the volume during the sintering process are further contracted, and the bonding portion 14 and the coupling groove 21 are easily formed. The gas remains between the walls to form a porous structure that is unfavorably thermally conductive.

請參閱圖4A及4B,為本創作之複合式散熱裝置的剖視圖。散熱本體20在兩相鄰的結合槽212之間的結構也像楔形塊,被兩個相鄰的結合部14所夾合。導熱基座10與散熱本體20之間的結合非常穩固。4A and 4B are cross-sectional views of the composite heat sink of the present invention. The structure of the heat dissipation body 20 between the two adjacent coupling grooves 212 is also like a wedge block, and is sandwiched by two adjacent joint portions 14. The bond between the thermally conductive base 10 and the heat dissipation body 20 is very stable.

本創作的導熱基座10與散熱本體20之間採取網狀排列或呈陣列狀的凹凸嚙咬配合,結合部的設計使得鋁材的散熱本體20及銅材的導熱基座10之間的凹凸嚙咬結構更具有可卡合防止脫離的設計。此外,此種網狀排列或稱陣列狀排列的結合部14在導熱基座10與散熱本體20之間的導熱更為平均分佈。因此散熱本體20及導熱基座10之間除具有良好且堅固的接合效果之外,更具有接合面積大、導熱面積大、散熱效率高的功能。The thermally conductive base 10 and the heat dissipating body 20 of the present invention adopt a mesh arrangement or an array of concave and convex bite fitting, and the joint portion is designed to make the unevenness between the heat dissipating body 20 of the aluminum material and the heat conducting base 10 of the copper material. The bite structure is more resistant to snap-in design. In addition, the mesh portion or the array-like joint portion 14 has a more even heat conduction between the heat-conducting base 10 and the heat-dissipating body 20. Therefore, in addition to having a good and strong bonding effect between the heat dissipation body 20 and the heat transfer base 10, the heat dissipation body 20 has a large joint area, a large heat transfer area, and high heat dissipation efficiency.

[第二實施例][Second embodiment]

請參閱圖5及圖6,為本創作之複合式散熱裝置第二實施例的立體分解圖。此實施例之複合式散熱裝置100’與上述實施例差異在於,導熱基座10’具有不同形狀的結合部16,該些結合部16沿著剖面呈T字形,每一該結合部16的頂端呈矩形狀並且具有一平板部161及一由該平板部161延伸至該導熱基座10’的第一頂面12的頸部162。散熱本體20’配合上述結合部16在凹陷部210內形成多個結合槽216。此種T字形的結構也可使散熱本體20’與導熱基座10’卡合防止脫離,該些結合部16的分佈情形類似於上述實施例。Please refer to FIG. 5 and FIG. 6 , which are perspective exploded views of a second embodiment of the composite heat sink according to the present invention. The composite heat sink 100' of this embodiment differs from the above embodiment in that the heat conducting base 10' has joint portions 16 of different shapes, and the joint portions 16 are T-shaped along the cross section, and the top end of each of the joint portions 16 It is rectangular in shape and has a flat portion 161 and a neck portion 162 extending from the flat portion 161 to the first top surface 12 of the thermally conductive base 10'. The heat dissipating body 20' is formed with a plurality of coupling grooves 216 in the recess portion 210 in cooperation with the joint portion 16. Such a T-shaped structure also allows the heat dissipating body 20' to be engaged with the thermally conductive base 10' to prevent detachment, and the distribution of the joint portions 16 is similar to the above embodiment.

圖7為本創作之複合式散熱裝置第二實施例的立體組合圖。第二實施例的複合式散熱裝置100’,散熱本體20’與導熱基座10’結合後的外觀相同於上述實施例。導熱基座10’的第一底面11切齊於所述散熱本體20’的第二底面21。FIG. 7 is a perspective assembled view of a second embodiment of the composite heat sink according to the present invention. The composite heat sink 100' of the second embodiment has the same appearance as the heat radiating base 10' in combination with the above-described embodiment. The first bottom surface 11 of the thermally conductive base 10' is aligned with the second bottom surface 21 of the heat dissipation body 20'.

請參閱圖8,為本創作之複合式散熱裝置第二實施例的剖視圖。本實施例的導熱基座10’與散熱本體20’之間採取網狀排列或呈陣列狀的凹凸嚙咬配合,T字形結合部16的設計使得散熱本體20’及導熱基座10’之間的凹凸嚙咬結構更具有可卡合防止脫離的設計。散熱本體20’在兩相鄰的結合槽216之間的結構也像T形塊,被兩個相鄰的T字形結合部14所咬合。Please refer to FIG. 8 , which is a cross-sectional view of a second embodiment of the composite heat sink according to the present invention. The heat-conducting base 10' and the heat-dissipating body 20' of the present embodiment adopt a mesh-like arrangement or an array of concave-convex engagement, and the T-shaped joint portion 16 is designed to be between the heat-dissipating body 20' and the heat-conductive base 10'. The embossed bite structure is more resistant to snap-off design. The structure of the heat dissipating body 20' between the two adjacent coupling grooves 216 is also like a T-shaped block, and is engaged by two adjacent T-shaped joint portions 14.

〔實施例的可能功效〕[Possible effects of the examples]

綜上所述,本創作的有益效果可以在於,本創作實施例所提供的複合式散熱裝置,導熱基座(10,10’)具有網狀排列或呈陣列狀的呈楔形或T形的結合部,可以穩固地咬合於散熱本體(20,20’)。藉由此種彼此咬合的結構,接合面積大、導熱面積大、散熱效率高,導熱基座(10,10’)可以更良好且更均勻地將熱傳導至散熱本體(20,20’)。In summary, the beneficial effects of the present invention may be that the composite heat sink provided by the present embodiment has a heat-conducting base (10, 10') having a mesh shape or an array of wedge-shaped or T-shaped joints. The part can be firmly engaged with the heat dissipating body (20, 20'). With such a structure that is engaged with each other, the joint area is large, the heat transfer area is large, and the heat dissipation efficiency is high, and the heat transfer base (10, 10') can conduct heat to the heat dissipation body (20, 20') more favorably and more uniformly.

以上所述僅為本創作的較佳可行實施例,非因此侷限本創作的專利範圍,故舉凡運用本創作說明書及圖式內容所做的等效技術變化,均包含於本創作的保護範圍內。The above description is only a preferred and feasible embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, any equivalent technical changes made by using the present specification and the contents of the schema are included in the scope of protection of the present creation. .

100‧‧‧複合式散熱裝置100‧‧‧Composite heat sink

10‧‧‧導熱基座10‧‧‧ Thermal base

11‧‧‧第一底面11‧‧‧ first bottom surface

12‧‧‧第一頂面12‧‧‧ first top surface

14‧‧‧結合部14‧‧‧Combination Department

141‧‧‧底端141‧‧‧ bottom

142‧‧‧頂端142‧‧‧Top

144‧‧‧斜面144‧‧‧Bevel

20‧‧‧散熱本體20‧‧‧Solution body

21‧‧‧第二底面21‧‧‧Second bottom

22‧‧‧第二頂面22‧‧‧Second top

24‧‧‧散熱突出件24‧‧‧heating protruding parts

Claims (9)

一種複合式散熱裝置,包括:一導熱基座,具有一第一底面及一第一頂面,該第一頂面具有多數個突出狀的結合部,每一結合部具有一連接於該第一底面的底端以及由該底端一體成型地向上延伸的頂端,其中該頂端的截面積大於該底端的截面積;及一散熱本體,具有第二底面及一第二頂面,該第二底面具有一對應於該導熱基座之輪廓的凹陷部、及多數個形成於該凹陷部內的結合槽,該些結合槽的形狀對應於該些結合部的形狀,該些結合部對應地結合於該些結合槽內。A composite heat dissipating device includes: a heat conducting base having a first bottom surface and a first top surface, the first top surface having a plurality of protruding joints, each joint having a first connection a bottom end of the bottom surface and a top end integrally extending upwardly from the bottom end, wherein a cross-sectional area of the top end is larger than a cross-sectional area of the bottom end; and a heat dissipating body having a second bottom surface and a second top surface, the second bottom surface a recessed portion corresponding to the contour of the thermally conductive base, and a plurality of coupling grooves formed in the recessed portion, the shape of the coupling grooves corresponding to the shape of the joint portions, the joint portions being correspondingly coupled to the These are combined in the groove. 如請求項1之複合式散熱裝置,其中所述導熱基座的第一底面切齊於所述散熱本體的第二底面。The composite heat sink of claim 1, wherein the first bottom surface of the thermally conductive base is aligned with the second bottom surface of the heat dissipation body. 如請求項1之複合式散熱裝置,其中所述散熱本體的第二頂面具有多數個散熱突出件。The composite heat sink of claim 1, wherein the second top surface of the heat dissipation body has a plurality of heat dissipation protrusions. 如請求項1之複合式散熱裝置,其中所述導熱基座的該些結合部呈網狀排列。The composite heat sink of claim 1, wherein the joints of the thermally conductive base are arranged in a mesh shape. 如請求項4之複合式散熱裝置,其中所述導熱基座的該些結合部沿著縱向排列呈數排狀,其中該些結合部沿著橫向的奇數排彼此對齊,該些結合部沿著橫向的偶數排彼此對齊。The composite heat sink of claim 4, wherein the joints of the thermally conductive base are arranged in a row in a longitudinal direction, wherein the joints are aligned with each other along an odd number of rows in the lateral direction, the joints being along The even rows of the horizontal alignment are aligned with each other. 如請求項1之複合式散熱裝置,其中每一該結合部的四周由其頂端朝向其底端漸縮。The composite heat sink of claim 1, wherein each of the joints is tapered from its top end toward its bottom end. 如請求項6之複合式散熱裝置,其中該些結合部沿著剖面呈梯形,每一該結合部的頂端呈矩形狀並且具有一對斜面由該頂端向內漸縮連接至所述導熱基座的第一頂面。The composite heat sink of claim 6, wherein the joints are trapezoidal along the cross section, the top end of each of the joints is rectangular and has a pair of slopes connected inwardly from the top end to the heat conductive base The first top surface. 如請求項1之複合式散熱裝置,其中所述導熱基座為一銅質導熱基座,所述散熱本體為一鋁質本體。The composite heat sink of claim 1, wherein the heat conductive base is a copper heat conductive base, and the heat dissipation body is an aluminum body. 如請求項1之複合式散熱裝置,其中該些結合部沿著剖面呈T字形,每一該結合部的頂端呈矩形狀並且具有一平板部及一由該平板部延伸至該導熱基座的第一頂面的頸部。The composite heat dissipating device of claim 1, wherein the joint portions are T-shaped along the cross section, the top end of each of the joint portions being rectangular and having a flat portion and a flat portion extending from the flat portion to the thermally conductive base The neck of the first top surface.
TW103202035U 2014-01-29 2014-01-29 Composite heat sink device TWM484133U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103202035U TWM484133U (en) 2014-01-29 2014-01-29 Composite heat sink device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103202035U TWM484133U (en) 2014-01-29 2014-01-29 Composite heat sink device

Publications (1)

Publication Number Publication Date
TWM484133U true TWM484133U (en) 2014-08-11

Family

ID=51793764

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103202035U TWM484133U (en) 2014-01-29 2014-01-29 Composite heat sink device

Country Status (1)

Country Link
TW (1) TWM484133U (en)

Similar Documents

Publication Publication Date Title
JP3140605U (en) Column-shaped radiator with radiating fins
TWI604782B (en) Heat pipe side-by-side heat sink and its production method
TW200412411A (en) Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange
TWM486246U (en) Isothermal plate with heat sink
US20170082377A1 (en) Heat dissipation device
US20170080533A1 (en) Heat dissipation device manufacturing method
TWI570382B (en) The combination of cooling fins and base
TW201821585A (en) High efficiency thermal conductivity structure
JP2015529396A5 (en)
TWM502818U (en) Heat sink with hidden isothermal plate
TWM484133U (en) Composite heat sink device
CN108302970A (en) Water-cooling head
JP5697394B2 (en) Base integrated substrate with fin and base integrated substrate device with fin
JP2012151425A (en) Stacked heat sink
JP2004071599A (en) Heat sink and its manufacturing method
US7461690B2 (en) Optimally shaped spreader plate for electronics cooling assembly
JP2008311610A (en) Working method of graphite heat conductive piece
TWM544191U (en) Heat pipes side by side heat dissipation device
CN109104839A (en) Ceramic heat sink and its manufacturing method
CN204836936U (en) Heat sink
TWM497254U (en) Uniform temperature plate with excellent heat conduction effect
TWI462690B (en) Method of making coplanar evaporator sections of heat pipes with product and jig thereof
TWI774542B (en) Liquid-cooled heat-dissipation substrate with partial reinforcement structure
CN203951719U (en) A kind of fin
JP2012039007A (en) Heat sink for semiconductor substrate, method for manufacturing the same, and pressure member

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees