TWM483543U - Heat transfer catalysis and heat dissipation structure - Google Patents
Heat transfer catalysis and heat dissipation structure Download PDFInfo
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- TWM483543U TWM483543U TW102223395U TW102223395U TWM483543U TW M483543 U TWM483543 U TW M483543U TW 102223395 U TW102223395 U TW 102223395U TW 102223395 U TW102223395 U TW 102223395U TW M483543 U TWM483543 U TW M483543U
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/006—Heat conductive materials
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/20—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes with nanostructures
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
- F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
Description
本創作是有關於一種熱傳遞催化散熱結構，尤指一種可使載體吸收熱源後，由六角環碳基奈米碳散熱膜進行散熱，且利用六角環碳基奈米碳散熱膜有效引導熱傳遞至空氣中，以避免載體與空氣間產生熱傳遞落差，而達到提升熱傳遞效能、有效減少熱傳遞瓶頸、不需使用散熱鰭片、大幅降低散熱成本、減輕體積重量、減少原物料消耗以及節能減碳之功效者。 The present invention relates to a heat transfer catalytic heat dissipation structure, in particular to a heat dissipation source for a carrier, which is cooled by a hexagonal ring carbon-based carbon heat-dissipating film, and uses a hexagonal ring carbon-based carbon heat-dissipating film to effectively guide heat transfer. In the air, to avoid heat transfer between the carrier and the air, to improve heat transfer efficiency, effectively reduce heat transfer bottlenecks, eliminate the need for heat sink fins, significantly reduce heat dissipation costs, reduce volume and weight, reduce raw material consumption, and save energy The effect of reducing carbon.
按，一般習用之散熱機制，其係利用一散熱膠或高熱傳導層，安置在一散熱體與一熱源之間，且於散熱體上進一步設置有散熱鰭片，藉以利用散熱體進行散熱。 According to the conventional heat dissipation mechanism, a heat dissipating glue or a high heat conducting layer is disposed between a heat sink and a heat source, and heat dissipating fins are further disposed on the heat dissipating body to dissipate heat by using the heat dissipating body.
今以上述習用之散熱機制而言，由於膠合體的熱傳導係數較小，因此，習用之方法係利用高散熱絕緣層(其熱傳導係數較大)來取代膠合體，但是由於熱傳遞之瓶頸與障壁，並非發生於熱源與散熱體之介面，而是發生於散熱體與空氣接觸之介面，由於該介面存在非常大之熱傳遞落差(即散熱體之熱傳遞大，然空氣熱傳遞小)，雖該習用之散熱機制利用熱傳導係數較大之高散熱絕緣層來取代膠合體，試圖提升熱傳遞效能，然熱經由散熱體內熱傳遞途徑，傳遞到散熱體與空氣間時，將因熱傳遞效能之巨大落差，而產生散熱體內熱傳遞途徑之熱回流，因此，造成熱傳遞的瓶 頸與障壁。故，習用之散熱機制是無明顯效果之方法，因其將高熱傳導層安置在兩者之間，雖有助於提升熱傳遞，但成效有限，因為根本的熱傳遞瓶頸與障壁，並沒有得到解決，因此，散熱不良之問題尚無法得到有效改善；且除上述所提缺點之外，該散熱鰭片體之設置更會同時造成有增加散熱成本、增加設備之體積重量以及浪費原物料之缺失。 In view of the above-mentioned conventional heat dissipation mechanism, since the heat transfer coefficient of the cement is small, the conventional method uses a high heat dissipation insulating layer (which has a large heat transfer coefficient) instead of the glue, but the bottleneck and the barrier of heat transfer It does not occur in the interface between the heat source and the heat sink, but occurs in the interface between the heat sink and the air. Because the interface has a very large heat transfer drop (ie, the heat transfer of the heat sink is large, the heat transfer of the air is small), although The conventional heat dissipation mechanism uses a high heat dissipation insulating layer with a large heat transfer coefficient to replace the glue, in an attempt to improve the heat transfer efficiency, and the heat is transferred to the heat sink and the air through the heat transfer path in the heat dissipation body, and the heat transfer efficiency is a huge drop, which creates a heat backflow in the body's heat transfer path, thus causing a heat transfer bottle Neck and barrier. Therefore, the conventional heat dissipation mechanism is a method with no obvious effect. Because it places the high heat conduction layer between the two, although it helps to improve heat transfer, the effect is limited because the fundamental heat transfer bottleneck and barrier are not obtained. Therefore, the problem of poor heat dissipation cannot be effectively improved; and in addition to the above-mentioned disadvantages, the arrangement of the heat dissipating fins will simultaneously increase the cost of heat dissipation, increase the volume and weight of the equipment, and waste the waste material. .
有鑑於此，本案之創作人特針對前述習用創作問題深入探討，並於長時間、且嚴謹之實際測試下，發現熱傳遞之瓶頸與障壁，並非於散熱體與熱源之間，而是存在於散熱體與空氣接觸之處，故，本案之申請人藉由多年從事相關產業之研發與製造經驗，積極尋求解決之道，經過長期努力之研究與發展，終於成功的開發出本創作「熱傳遞催化散熱結構」，提出從最根本、直接消除或降低散熱之瓶頸與障壁之方法，藉以改善習用之種種問題。 In view of this, the creators of this case have in-depth discussion on the above-mentioned customary creation problems, and under the long-term and rigorous practical test, found that the bottlenecks and barriers of heat transfer are not between the heat sink and the heat source, but exist in The radiator is in contact with the air. Therefore, the applicant of this case actively seeks solutions through years of experience in R&D and manufacturing of related industries. After long-term research and development, the company successfully developed the “heat transfer”. The catalytic heat dissipation structure proposes a method for improving the conventional problems from the most fundamental and direct elimination or reduction of the bottleneck and barrier of heat dissipation.
本創作之主要目的係在於，可使載體吸收熱源後，由六角環碳基奈米碳散熱膜進行散熱，且利用六角環碳基奈米碳散熱膜有效引導熱傳遞至空氣中，以避免載體與空氣間產生熱傳遞落差，而達到提升熱傳遞效能、有效減少熱傳遞瓶頸、不需使用散熱鰭片、大幅降低散熱成本、減輕體積重量、減少原物料消耗以及節能減碳之功效。 The main purpose of this creation is to enable the carrier to absorb heat and then dissipate heat from a hexagonal ring carbon-based carbon film, and use a hexagonal ring carbon-based carbon heat-dissipating film to effectively guide heat transfer to the air to avoid the carrier. The heat transfer difference between the air and the air is achieved, thereby improving the heat transfer efficiency, effectively reducing the heat transfer bottleneck, eliminating the need for heat sink fins, greatly reducing heat dissipation costs, reducing volumetric weight, reducing raw material consumption, and saving energy and reducing carbon.
為達上述之目的，本創作係一種熱傳遞催化散熱結構，其散包含有：一熱體；一設於載體一面上之熱源；以及至少設於載體另一面上之六角環碳基奈米碳散熱膜。 For the above purposes, the present invention is a heat transfer catalytic heat dissipation structure comprising: a heat body; a heat source disposed on one side of the carrier; and a hexagonal ring carbon-based carbon carbon disposed on at least the other side of the carrier Heat sink film.
於上述之實施例中，該載體與熱源之間係以膠合體進行結合。 In the above embodiments, the carrier and the heat source are bonded by a glue.
於上述之實施例中，該載體與熱源之間係結合有一高散熱絕緣層。 In the above embodiments, a high heat dissipation insulating layer is bonded between the carrier and the heat source.
於上述之實施例中，該載體係包括但不限於散熱片、風扇以及水冷散熱器。 In the above embodiments, the carrier includes, but is not limited to, a heat sink, a fan, and a water-cooled heat sink.
於上述之實施例中，該熱源與載體之間係可進一步設有另一六角環碳基奈米碳散熱膜。 In the above embodiments, another heat-source between the heat source and the carrier may be further provided with another hexagonal ring carbon-based carbon heat-dissipating film.
1‧‧‧載體 1‧‧‧ Carrier
11‧‧‧膠合體 11‧‧‧Glues
111‧‧‧膠合體內熱傳遞途徑 111‧‧‧Glue heat transfer pathway
112‧‧‧載體內熱傳遞途徑 112‧‧‧Carrier heat transfer pathway
113‧‧‧散熱膜內熱傳遞途徑 113‧‧‧ Heat transfer film inside the heat film
114‧‧‧催化後空氣中熱傳遞途徑 114‧‧‧Analysis of heat transfer in the air after catalysis
2‧‧‧熱源 2‧‧‧heat source
3、3a‧‧‧六角環碳基奈米碳散熱膜 3, 3a‧‧‧ hexagonal ring carbon-based carbon heat-dissipating film
4‧‧‧高散熱絕緣層 4‧‧‧High heat dissipation insulation
第1圖，係本創作第一實施例之剖面狀態示意圖。 Fig. 1 is a schematic cross-sectional view showing the first embodiment of the present invention.
第2圖，係本創作第一實施例之熱傳遞狀態示意圖。 Fig. 2 is a schematic view showing the heat transfer state of the first embodiment of the present invention.
第3圖，係本創作第二實施例之剖面狀態示意圖。 Fig. 3 is a schematic cross-sectional view showing the second embodiment of the present invention.
第4圖，係本創作第三實施例之剖面狀態示意圖。 Fig. 4 is a schematic cross-sectional view showing the third embodiment of the present creation.
請參閱『第1及第2圖』所示，係分別為本創作第一實施例之剖面狀態示意圖及本創作第一實施例之熱傳遞狀態示意圖。如圖所示：本創作係一種熱傳遞催化散熱結構，其至少係由一載體1、一熱源2以及一六角環碳基奈米碳散熱膜3所構成。 Please refer to the "1st and 2nd drawings" for a schematic view of the cross-sectional state of the first embodiment of the present invention and a schematic diagram of the heat transfer state of the first embodiment of the present invention. As shown in the figure, the present invention is a heat transfer catalytic heat dissipation structure which is composed of at least a carrier 1, a heat source 2 and a hexagonal ring carbon-based carbon heat-dissipating film 3.
上述所提之載體1係包括但不限於散熱片、風扇以及水冷散熱器。 The carrier 1 mentioned above includes, but is not limited to, a heat sink, a fan, and a water-cooled heat sink.
該熱源2係設於載體1之一面上，而該載體1與熱源2之間係以膠合體11進行結合。 The heat source 2 is disposed on one side of the carrier 1, and the carrier 1 and the heat source 2 are bonded by the glue 11.
該六角環碳基奈米碳散熱膜3至少設於載體1之另一面上(即載體1與空氣接觸之一面)。如是，藉由上述之結構構成一全新之熱傳遞催化散熱結構。 The hexagonal ring carbon-based carbon heat dissipating film 3 is provided on at least the other side of the carrier 1 (i.e., one side of the carrier 1 in contact with air). If so, a new heat transfer catalytic heat dissipation structure is constructed by the above structure.
當本創作於運用時，熱係由熱源2製造且開始向外傳遞(該熱源2包括但不限於處理器CPU、繪圖晶片、LED晶片、太陽能晶片、以及引擎內燃…等)，而由載體1吸收熱源2所發出之熱能，並以六角環碳基奈米碳散熱膜3進行散熱；而由於熱源1所產生之熱向外傳遞時，因膠合體11之導熱係數較小，故膠合體內熱傳遞途徑111之熱傳遞效能較低，當熱進入載體1之後，則因載體1之導熱係數較大，故載體內熱傳遞途徑112之熱傳遞效能較高，因空氣中熱傳遞效能極低，因此在介面處，最高與最低的熱傳遞落差造成熱傳遞障礙，本創作所設置之六角環碳基奈米碳散熱膜3，即可做為載體1與空氣之間熱傳遞瓶頸或障壁之踏板，以其散熱膜內熱傳遞途徑113有效引導熱傳遞，而配合載體1將熱傳遞至空氣中，達到有效提升熱傳遞效能之效果，催化後空氣中熱傳遞途徑214之熱傳遞效能，接近傳熱介面2之導熱效率，因此不需使用散熱鰭片而可大幅降低散熱成本，並減輕設備之體積重量，此外更可減少原物料消耗而符合節能減碳之功效。 When the present invention is used, the heat is manufactured by the heat source 2 and begins to be transferred outwards (including, but not limited to, the processor CPU, the graphics wafer, the LED chip, the solar wafer, and the engine internal combustion, etc.), and the carrier 1 absorbing heat energy generated by the heat source 2, and dissipating heat by the hexagonal ring carbon-based carbon heat-dissipating film 3; and when the heat generated by the heat source 1 is transmitted outward, since the thermal conductivity of the cement 11 is small, the glue body is The heat transfer path 111 has a low heat transfer efficiency. When the heat enters the carrier 1, the heat transfer coefficient of the heat transfer path 112 is high because the heat transfer coefficient of the heat transfer path 112 is high, and the heat transfer efficiency in the air is extremely low. Therefore, at the interface, the highest and lowest heat transfer drop causes heat transfer obstacles. The hexagonal ring carbon-based carbon heat-dissipating film 3 provided in the present invention can be used as a heat transfer bottleneck or barrier between the carrier 1 and the air. The heat transfer path 113 is used to effectively guide the heat transfer, and the carrier 1 transfers heat to the air to effectively improve the heat transfer efficiency, and the heat transfer effect of the heat transfer path 214 in the air after the catalysis. , 2 near the heat heat transfer efficiency of the interface, and therefore without the use of heat-dissipating fins can significantly reduce cooling costs, and reduce the volume and weight of the device, in addition also reduce the consumption of raw materials in line with the effect of carbon reduction.
請參閱『第3圖』所示，係本創作第二實施例之剖面狀態示意圖。如圖所示：本創作除上述第一實施例所提結構形態之外，更可為本第二實施例之結構形態，而其所不同之處係在於，該載體1與熱源2之間係結合有一高散熱絕緣層4；如此，可使熱源1產生之熱透過高散熱絕緣層4傳遞至載體1，待載體1吸收熱源後 ，同時配合六角環碳基奈米碳散熱膜3進行散熱，而同樣達到提升熱傳遞效能以及有效減少熱傳遞瓶頸之功效。 Please refer to FIG. 3, which is a schematic cross-sectional view of the second embodiment of the present invention. As shown in the figure, in addition to the structural form of the first embodiment, the present invention can be the structural form of the second embodiment, and the difference is that the carrier 1 and the heat source 2 are A high heat dissipation insulating layer 4 is combined; thus, the heat generated by the heat source 1 can be transmitted to the carrier 1 through the high heat dissipation insulating layer 4, and after the carrier 1 absorbs the heat source At the same time, the hexagonal ring carbon-based carbon heat-dissipating film 3 is used for heat dissipation, and the heat transfer efficiency is also improved and the heat transfer bottleneck is effectively reduced.
請參閱『第4圖』所示，係本創作第三實施例之剖面示狀態意圖。如圖所示：本創作除上述第一及第二實施例所提結構形態之外，更可為本第三實施例之結構形態，而其所不同之處係在於，該熱源2與載體1之間係可進一步設有另一六角環碳基奈米碳散熱膜3a；如此，可使熱源2產生之熱透過第一道六角環碳基奈米碳散熱膜3a傳遞至載體1，待載體1吸收熱源後，同時配合第二道六角環碳基奈米碳散熱膜3進行散熱，而同樣達到提升熱傳遞效能以及有效減少熱傳遞瓶頸之功效，藉以使本創作能更符合實際使用時之所需。 Please refer to FIG. 4 for a schematic view of the third embodiment of the present invention. As shown in the figure, in addition to the structural forms mentioned in the first and second embodiments, the present invention may be the structural form of the third embodiment, and the difference is that the heat source 2 and the carrier 1 Further, another hexagonal ring carbon-based carbon heat-dissipating film 3a may be further disposed; thus, heat generated by the heat source 2 may be transmitted to the carrier 1 through the first hexagonal ring carbon-based carbon heat-dissipating film 3a. After the carrier 1 absorbs the heat source, it simultaneously dissipates heat with the second hexagonal ring carbon-based carbon heat-dissipating film 3, and also achieves the effect of improving heat transfer efficiency and effectively reducing the heat transfer bottleneck, thereby making the creation more suitable for practical use. Needed.
綜上所述，本創作熱傳遞催化散熱結構可有效改善習用之種種缺點，可使載體吸收熱源後，由六角環碳基奈米碳散熱膜進行散熱，且利用六角環碳基奈米碳散熱膜有效引導熱傳遞至空氣中，以避免載體與空氣間產生熱傳遞落差，而達到提升熱傳遞效能、有效減少熱傳遞瓶頸、不需使用散熱鰭片、大幅降低散熱成本、減輕體積重量、減少原物料消耗以及節能減碳之功效；進而使本創作之產生能更進步、更實用、更符合消費者使用之所須，確已符合創作專利申請之要件，爰依法提出專利申請。 In summary, the present heat transfer catalytic heat dissipation structure can effectively improve various disadvantages of the conventional use, and the carrier can absorb heat from the hexagonal ring carbon-based carbon heat-dissipating film, and use the hexagonal ring carbon-based carbon to dissipate heat. The membrane effectively guides heat transfer to the air to avoid heat transfer between the carrier and the air, thereby improving heat transfer efficiency, effectively reducing heat transfer bottlenecks, eliminating the need for heat sink fins, greatly reducing heat dissipation costs, reducing volumetric weight, and reducing The original material consumption and the effect of energy saving and carbon reduction; furthermore, the creation of this creation can be more progressive, more practical, and more in line with the needs of consumers. It has indeed met the requirements for the creation of a patent application, and has filed a patent application according to law.
惟以上所述者，僅為本創作之較佳實施例而已，當不能以此限定本創作實施之範圍；故，凡依本創作申請專利範圍及創作說明書內容所作之簡單的等效變化與修飾，皆應仍屬本創作專利涵蓋之範圍內。 However, the above is only the preferred embodiment of the present invention, and the scope of the creation of the present invention cannot be limited by this; therefore, the simple equivalent changes and modifications made by the scope of the patent application and the content of the creation specification are All should remain within the scope of this creation patent.
1‧‧‧載體 1‧‧‧ Carrier
11‧‧‧膠合體 11‧‧‧Glues
2‧‧‧熱源 2‧‧‧heat source
3‧‧‧六角環碳基奈米碳散熱膜 3‧‧‧Hexagonal ring carbon-based carbon film
Claims (5)
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| Application Number | Priority Date | Filing Date | Title |
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| TW102223395U TWM483543U (en) | 2013-12-11 | 2013-12-11 | Heat transfer catalysis and heat dissipation structure |
| US14/288,516 US20150159969A1 (en) | 2013-12-11 | 2014-05-28 | Thermal transfer catalytic heat dissipation structure |
| CN201420403619.2U CN204131895U (en) | 2013-12-11 | 2014-07-21 | Heat transfer catalysis heat dissipation structure |
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| TW102223395U TWM483543U (en) | 2013-12-11 | 2013-12-11 | Heat transfer catalysis and heat dissipation structure |
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| TWM483543U true TWM483543U (en) | 2014-08-01 |
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| CN (1) | CN204131895U (en) |
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| US11676880B2 (en) | 2016-11-26 | 2023-06-13 | Texas Instruments Incorporated | High thermal conductivity vias by additive processing |
| US10529641B2 (en) * | 2016-11-26 | 2020-01-07 | Texas Instruments Incorporated | Integrated circuit nanoparticle thermal routing structure over interconnect region |
| US10256188B2 (en) | 2016-11-26 | 2019-04-09 | Texas Instruments Incorporated | Interconnect via with grown graphitic material |
| US10811334B2 (en) | 2016-11-26 | 2020-10-20 | Texas Instruments Incorporated | Integrated circuit nanoparticle thermal routing structure in interconnect region |
| US11004680B2 (en) | 2016-11-26 | 2021-05-11 | Texas Instruments Incorporated | Semiconductor device package thermal conduit |
| US10861763B2 (en) | 2016-11-26 | 2020-12-08 | Texas Instruments Incorporated | Thermal routing trench by additive processing |
| WO2019025201A1 (en) * | 2017-08-01 | 2019-02-07 | Philips Lighting Holding B.V. | A lighting device, and a method of producing a lighting device |
| CN110491846B (en) * | 2019-07-16 | 2021-01-15 | 广东埃文低碳科技股份有限公司 | Chip adopting micro-thermal generator |
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|---|---|---|---|---|
| US5339214A (en) * | 1993-02-12 | 1994-08-16 | Intel Corporation | Multiple-fan microprocessor cooling through a finned heat pipe |
| US7542290B2 (en) * | 2006-09-26 | 2009-06-02 | Hewlett-Packard Development Company, L.P. | Computer device cooling system |
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2013
- 2013-12-11 TW TW102223395U patent/TWM483543U/en not_active IP Right Cessation
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2014
- 2014-05-28 US US14/288,516 patent/US20150159969A1/en not_active Abandoned
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| CN204131895U (en) | 2015-01-28 |
| US20150159969A1 (en) | 2015-06-11 |
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