TWM479438U - Backlight module for LED TV - Google Patents

Description

用於LED TV之背光模組Backlight module for LED TV

本創作係指一種應用於LED TV(LED顯示屏)中，特別是指一種可用以提升照明亮度、降低成本、且體積輕薄之背光模組。This creation refers to a kind of LED TV (LED display), especially a backlight module that can be used to improve illumination brightness, reduce cost, and is light in size.

發光二極體的應用層面越來越廣泛，從早期的輔助照明產品，已逐漸轉變成現今主流的主要照明產品，更進一步的應用在顯示屏上，小至手機顯示屏，大致電視顯示屏。The application level of light-emitting diodes has become more and more extensive. From the early auxiliary lighting products, it has gradually turned into the mainstream lighting products of today's mainstream, and further applied to the display screen, as small as the mobile phone display, and roughly the TV display.

目前大幅應用在顯示屏之背光模組主要係採用側入式為主，所謂側光型即是將發光二極體擺設在顯示屏的四周圍，已藉由發光二極體運作時所發出之光線再透過導光板，將該些光線導引至面板中，進而達到畫面顯示的效果。At present, the backlight module that is widely used in the display screen mainly adopts the side-entry type. The so-called side-light type is that the light-emitting diode is placed around the display screen and has been emitted by the operation of the light-emitting diode. The light is transmitted through the light guide plate to guide the light into the panel to achieve the effect of the screen display.

如第一圖及第二圖所示，為一習知側入式背光模組之平面以及部份剖面放大示意圖。如圖所示，側入式背光模組A主要係於面板B的四周邊緣上，分別擺設有複數發光二極體C(LED)，再於發光二極體C與面板B間設置有一導光板D，使其發光二極體C運作時所釋放出之光線，能夠透過導光板D將光線均勻的引導至面板B中，使其顯示屏上能呈現均勻的光線。As shown in the first and second figures, it is a planar and partial cross-sectional enlarged view of a conventional side-entry backlight module. As shown in the figure, the side-lit backlight module A is mainly disposed on the peripheral edge of the panel B, and is respectively provided with a plurality of LEDs (LEDs), and a light guide plate is disposed between the LEDs C and the panel B. D, the light emitted by the light-emitting diode C during operation can uniformly guide the light through the light guide plate D to the panel B, so that the display screen can display uniform light.

惟，側入式背光模組A當其應用在大型尺寸之顯示屏上時，往往容易造成面板B中央無法獲得光源，使顯示屏形成中央較暗四周較亮的情形，也影響顯示屏所呈現之畫質，造成顯示屏之色彩不均勻。However, when the side-in type backlight module A is applied to a large-sized display screen, it is easy to cause the light source of the panel B to be unable to obtain a light source, so that the display screen is formed in a darker central portion, and the display screen is also rendered. The picture quality causes the display to be uneven in color.

也因此為了因應大尺寸顯示屏的使用，市面上亦出現一種直下式背光模組，所謂的直下式背光模組，主要係在將發光二極體 (LED)等距排列在面板的正下方，以藉由發光二極體(LED)運作時所釋放出之光線，直接投射在整塊面板上，進而使整塊面板上能夠得到較為均勻的光線。Therefore, in order to respond to the use of large-size display screens, there is also a direct-type backlight module on the market. The so-called direct-lit backlight module is mainly used for the light-emitting diode. (LED) is arranged equidistantly below the panel to directly project on the entire panel by the light emitted by the LED (LED), so that a uniform light can be obtained on the entire panel. .

如第三圖所示，為一習知直下式背光模組E之示意圖。如圖所示，現有的直下式背光模組E，主要係成條狀，每一條直下式背光模組E主要係直接將複數發光二極體C(LED)以等距排列方式黏著在一條狀之電路板F上，再將複數條電路板F等距排列在面板(在本實施例中未表示)的下方，進而使複數發光二極體C間能夠等距排列，使其複數發光二極體C運作後，將其光線投射於面板上，令面板上的每一處皆能獲得均勻的光源，以提升顯示屏所呈現之畫質。As shown in the third figure, it is a schematic diagram of a conventional direct type backlight module E. As shown in the figure, the existing direct-lit backlight module E is mainly strip-shaped, and each of the direct-lit backlight modules E mainly directly adheres a plurality of light-emitting diodes C (LEDs) in an equidistant arrangement. On the circuit board F, a plurality of circuit boards F are evenly arranged below the panel (not shown in this embodiment), so that the plurality of light-emitting diodes C can be arranged equidistantly to make the plurality of light-emitting diodes After the body C is in operation, its light is projected onto the panel, so that a uniform light source can be obtained at each place on the panel to enhance the image quality of the display.

惟，目前的直下式背光模組，因為每一發光二極體C所釋放光線的角度受到限制，要使面板每一處皆獲得均勻的光源，就必須在面板的下方擺設有較多的發光二極體C，使每一發光二極體C所釋放出之光線能夠重疊，方能獲得較佳的光源。However, in the current direct type backlight module, since the angle of the light emitted by each of the light-emitting diodes C is limited, in order to obtain a uniform light source at each place of the panel, more light must be placed under the panel. The diode C allows the light emitted by each of the light-emitting diodes C to overlap, so that a better light source can be obtained.

以一台46吋的LED顯示屏來比較，更能凸顯出側入型背光模組與直下式背光模組間之差異。如果在46吋顯示屏上使用側入行背光模組A，每一台46吋顯示屏上大約需要使用到280顆的發光二極體C；相對的，若是使用直下式背光模組E，則大約需要使用到1600顆的發光二極體C，兩者相較之下，大約有六倍之差。Compared with a 46-inch LED display, the difference between the side-lit backlight module and the direct-lit backlight module can be highlighted. If the side-in backlight module A is used on the 46-inch display, approximately 280 LEDs are required on each of the 46-inch displays; in contrast, if the direct-lit backlight module E is used, It is necessary to use 1600 LEDs C, which is about six times worse.

顯然，若是使用直下式背光模組E不但成本高，所需耗費的電力亦相對提高；但若使用側入式背光模組A，雖然可以降低成本，亦能降低能源的使用，但側入式背光模A組存在有色彩不均勻的問題。Obviously, if the direct-lit backlight module E is used, the cost is relatively high, and the power consumption is relatively high. However, if the side-in backlight module A is used, the cost can be reduced and the energy can be reduced, but the side entry type is used. There is a problem of uneven color in the backlight mode A group.

因此，如何解決現有側入式背光模組A以及直下式背光模組E所存在之問題，即為本創作人所欲解決之課題。Therefore, how to solve the problems existing in the existing side-entry backlight module A and the direct-lit backlight module E is a problem that the creator wants to solve.

本創作之主要目的，在於提供一種可用以提升照明亮度、降低成本、且體積輕薄之背光模組。The main purpose of this creation is to provide a backlight module that can be used to increase the brightness of the illumination, reduce the cost, and is light in size.

為達到上述之功效及目的，本創作之背光模組主要係包含有一電路板、複數LED、複數反射片以及複數透鏡(Lans)。其中，電路板上係設有電路佈局，而該些LED係分別排列並黏著於電路板上；每一反射片則是貼附於電路板上，並環設於該些LED之週邊；該些透鏡則是安裝於該些反射片並相對於該些LED之上方。In order to achieve the above effects and purposes, the backlight module of the present invention mainly comprises a circuit board, a plurality of LEDs, a plurality of reflective sheets and a plurality of lenses (Lans). Wherein, the circuit board is provided with a circuit layout, and the LEDs are respectively arranged and adhered to the circuit board; each of the reflective sheets is attached to the circuit board and is disposed around the LEDs; The lens is mounted on the reflective sheets and above the LEDs.

據以，每一透鏡皆安裝於每一LED上，藉以透過該些透鏡將LED所釋放出之光線均勻的向外投射，如此不但可大幅降低LED使用之數量，亦能將低背光模組的厚度，並能有效降低LED背光模組之成本。Accordingly, each lens is mounted on each of the LEDs, so that the light emitted by the LEDs is uniformly projected outward through the lenses, so that the number of LEDs can be greatly reduced, and the low backlight module can also be Thickness and can effectively reduce the cost of LED backlight modules.

先前技術元件符號說明Prior art symbol description

A‧‧‧側入式背光模組A‧‧‧Side-in backlight module

B‧‧‧面板B‧‧‧ panel

C‧‧‧發光二極體C‧‧‧Light Emitting Diode

D‧‧‧導光板D‧‧‧Light guide plate

E‧‧‧直下式背光模組E‧‧‧Direct type backlight module

F‧‧‧電路板F‧‧‧Board

本創作元件符號說明Symbol of this creative component

10‧‧‧背光模組10‧‧‧Backlight module

20‧‧‧電路板20‧‧‧ boards

30‧‧‧LED30‧‧‧LED

40‧‧‧反射片40‧‧‧reflector

41‧‧‧透孔41‧‧‧through hole

50‧‧‧透鏡50‧‧‧ lens

51‧‧‧支撐柱51‧‧‧Support column

60‧‧‧導電金屬60‧‧‧ Conductive metal

70‧‧‧黏著劑70‧‧‧Adhesive

第一圖為習知側入式背光模組之平面示意圖。The first figure is a schematic plan view of a conventional side-lit backlight module.

第二圖為第一圖之部份剖面放大示意圖。The second figure is an enlarged schematic view of a part of the first figure.

第三圖為習知直下式背光模組之平面示意圖。The third figure is a schematic plan view of a conventional direct type backlight module.

第四圖為本創作背光模組之平面示意圖。The fourth figure is a schematic plan view of the creation backlight module.

第五圖為第四圖之部份剖面放大示意圖。The fifth figure is an enlarged schematic view of a part of the fourth figure.

第六圖為本創作之製造流程圖。The sixth picture is the manufacturing flow chart of the creation.

以下將配合圖式及實施例來詳細說明本創作之實施方式，藉此對本創作如何應用技術手段來解決技術問題並達成技術功效的實現過程能充分理解並據以實施。The embodiments of the present invention will be described in detail below with reference to the drawings and the embodiments, so that the implementation process of how to apply the technical means to solve the technical problems and achieve the technical effects can be fully understood and implemented.

如第四圖及第五圖所示，係為本創作之平面及部份剖面放大示意圖。如圖所示，本創作之背光模組10係包含有一電路板20、至少一LED30、至少一反射片40以及至少一透鏡50。其中： 電路板20上係具有電路佈局，其上形成有至少一正極接點以及一負極接點，且在其正負極接點上塗佈有導電金屬60，如錫膏等(此為一般習知技術，在此不加以贅述)。LED30則是黏著於電路板20上，分別與正極接點與負極接點電性連結。在本實施例中，電路板20係成條狀，其上係黏著有複數個LED30，當然在實際應用上，電路板20亦可成型為片狀，可依照使用需求而加以變化。As shown in the fourth and fifth figures, it is an enlarged view of the plane and part of the section of the creation. As shown, the backlight module 10 of the present invention comprises a circuit board 20, at least one LED 30, at least one reflective sheet 40, and at least one lens 50. among them: The circuit board 20 has a circuit layout on which at least one positive electrode contact and one negative electrode contact are formed, and a conductive metal 60 such as solder paste or the like is coated on the positive and negative electrode contacts (this is a conventional technique). , I will not repeat them here). The LEDs 30 are adhered to the circuit board 20 and electrically connected to the positive electrode contacts and the negative electrode contacts, respectively. In the present embodiment, the circuit board 20 is strip-shaped, and a plurality of LEDs 30 are adhered thereto. Of course, in practical applications, the circuit board 20 can also be formed into a sheet shape, which can be changed according to the use requirements.

反射片40則是用以貼附在電路板20上，其反射片40上設有一透孔41，使其反射片40貼附在電路板20上時，得使其透孔41穿過LED30後，再貼附於電路板20上。在本實施例中，每一反射片40上係設置有一透孔41，但反射片40在實際應用上，亦可做成條狀或片狀，並於成條狀或片狀之反射片40上設有複數之透孔41。The reflective sheet 40 is attached to the circuit board 20, and the reflective sheet 40 is provided with a through hole 41. When the reflective sheet 40 is attached to the circuit board 20, the through hole 41 is passed through the LED 30. And attached to the circuit board 20. In this embodiment, each of the reflection sheets 40 is provided with a through hole 41. However, in practice, the reflection sheet 40 may be formed into a strip shape or a sheet shape, and is formed into a strip or sheet shape reflection sheet 40. A plurality of through holes 41 are provided thereon.

透鏡50(Lans)則是用以固定在反射片40上相對於透孔41之上方，其透鏡50之底部係向下延伸形成有複數支撐柱51，使其得以利用該些支撐柱51並透過黏著劑70，將其透鏡50得以確實的固定於反射片40上；由於反射片40之透孔41係穿設於LED30的周邊，因此當透鏡50固定於反射片40上相對於透孔41之上方時，此時能使透鏡50恰好位於LED30的上方位置處。然，在本實施例中，透鏡50之底部係向下延伸有三支撐柱51，但在其應用上，亦可隨使用環境的不同，而形成有二或四支撐柱51或是更多的支撐柱51。The lens 50 (Lans) is fixed on the reflective sheet 40 above the through hole 41, and the bottom of the lens 50 extends downward to form a plurality of support columns 51, so that the support columns 51 can be utilized and transmitted. The adhesive 70 is fixed to the reflective sheet 40 by the lens 50; since the through hole 41 of the reflective sheet 40 is passed through the periphery of the LED 30, the lens 50 is fixed to the reflective sheet 40 with respect to the through hole 41. At the top, the lens 50 can be positioned just above the LED 30 at this time. However, in the embodiment, the bottom of the lens 50 has three support columns 51 extending downward, but in its application, two or four support columns 51 or more support may be formed depending on the use environment. Column 51.

據以，當電路板20導通電源後，能透過電路板20來驅動LED30，使LED30釋放出光線，進而將光線向外投射，此時，光線會先通過LED30上方之透鏡50，藉以利用透鏡50加大光線照射的角度與範圍。Therefore, when the circuit board 20 is turned on, the LED 30 can be driven through the circuit board 20 to cause the LED 30 to emit light, thereby projecting the light outward. At this time, the light passes through the lens 50 above the LED 30, thereby utilizing the lens 50. Increase the angle and range of light exposure.

在本實施例中，主要係將電路板20作成條狀，因此在每一條狀之電路板20上係黏著有14顆LED30、14個反射片40以及14個透鏡50；以一台相同尺寸的顯示屏來說，使用本實施例之背光模組10，僅需要在面板下方設置7片呈條狀之背光模組10，因此在 本實施例中大約只要使用約84顆的LED30，相對於習知的側入型背光模組(需使用140顆LED)或是直下式背光模組(需使用242顆LED)而言，使用本創作的背光模組，皆能有效降低LED的使用數量，換言之，除可有效降低成本外，亦能減少能源的使用，且又能有效減少背光模組的厚度(無須使用導光板)。In this embodiment, the circuit board 20 is mainly formed in a strip shape, so that 14 LEDs 30, 14 reflective sheets 40, and 14 lenses 50 are attached to each strip of the circuit board 20; For the display screen, using the backlight module 10 of the embodiment, it is only necessary to provide seven strip-shaped backlight modules 10 under the panel, so In this embodiment, only about 84 LEDs 30 are used, compared with the conventional side-in type backlight module (140 LEDs are required) or the direct-lit backlight module (242 LEDs are required). The created backlight module can effectively reduce the number of LEDs used. In other words, in addition to effectively reducing the cost, the utility model can also reduce the use of energy, and can effectively reduce the thickness of the backlight module (without using a light guide plate).

又請參閱第六圖所示，為本創作之製造方法流程圖。如圖所示，本創作背光模組10之製造方法係包含有下列步驟：(請同時配合第五圖)Please also refer to the sixth figure, which is a flow chart of the manufacturing method of the creation. As shown in the figure, the manufacturing method of the present backlight module 10 includes the following steps: (Please also cooperate with the fifth figure)

步驟一S1、製作電路板20：先成型有一電路板20，在其電路板上設有電路佈局，係包含有一正極以及一負極接點。Step 1 S1: Making a circuit board 20: First, a circuit board 20 is formed, and a circuit layout is arranged on the circuit board, which includes a positive electrode and a negative electrode contact.

步驟二S2、塗佈導電金屬60：在成型後之電路板20上相對於正極及負極接點上，塗佈導電金屬60，在本實施例中導電金屬60係指錫膏。Step 2: S2, coating the conductive metal 60: On the circuit board 20 after molding, the conductive metal 60 is coated on the contact between the positive electrode and the negative electrode. In the embodiment, the conductive metal 60 is referred to as a solder paste.

步驟三S3、LED30黏著：將LED30黏著於電路板20上，利用導電金屬60使LED30與電路板20之正、負極接點電性連結。Step 3: S3, LED 30 is adhered: the LED 30 is adhered to the circuit board 20, and the conductive metal 60 is used to electrically connect the LED 30 to the positive and negative contacts of the circuit board 20.

步驟四S4、貼附反射片40：將具有透孔41之反射片40貼附於電路板20上，使其透孔41穿過LED30，令反射片40環設於LED30的周邊。Step 4: S4. Attaching the reflection sheet 40: The reflection sheet 40 having the through hole 41 is attached to the circuit board 20, and the through hole 41 is passed through the LED 30 so that the reflection sheet 40 is looped around the periphery of the LED 30.

步驟五S5、透鏡50(Lans)安裝：將具有三支撐腳51之透鏡50利用黏著劑70固定在反射片40上相對於透孔41的上方，使透鏡50恰好位於LED30的上方。Step 5 S5, lens 50 (Lans) mounting: The lens 50 having the three supporting legs 51 is fixed on the reflection sheet 40 with respect to the through hole 41 by the adhesive 70 so that the lens 50 is located just above the LED 30.

藉由上述製造方法，即能夠獲得本創作之背光模組10，並透過透鏡50加大LED30之照射角度與範圍，使其得以達到降低成本、減少能源的使用以及減少厚度的目的。According to the above manufacturing method, the backlight module 10 of the present invention can be obtained, and the irradiation angle and range of the LED 30 can be increased by the lens 50, thereby achieving the purpose of reducing cost, reducing energy use, and reducing thickness.

雖然本創作以前述之實施例揭露如上，然其並非用以限定本創作，任何熟習相像技藝者，在不脫離本創作之精神和範圍內，當可作些許之更動與潤飾，因此本創作之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。Although the present invention is disclosed above in the foregoing embodiments, it is not intended to limit the present invention, and any skilled person skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of patent protection shall be subject to the definition of the scope of the patent application attached to this specification.

10‧‧‧背光模組10‧‧‧Backlight module

20‧‧‧電路板20‧‧‧ boards

30‧‧‧LED30‧‧‧LED

40‧‧‧反射片40‧‧‧reflector

41‧‧‧透孔41‧‧‧through hole

50‧‧‧透鏡50‧‧‧ lens

51‧‧‧支撐柱51‧‧‧Support column

60‧‧‧導電金屬60‧‧‧ Conductive metal

70‧‧‧黏著劑70‧‧‧Adhesive

Claims (5)

一種用於LED TV之背光模組，係包括有：一電路板，其上設有電路佈局；至少一LED，係黏著於該電路板上；至少一反射片，係貼附於該電路板上相對於該LED之位置，且該反射片中央具有一透孔，使該LED設於該透孔中；至少一透鏡，係安裝於該反射片上，相對於該LED上方。 A backlight module for an LED TV, comprising: a circuit board having a circuit layout thereon; at least one LED attached to the circuit board; at least one reflective sheet attached to the circuit board With respect to the position of the LED, and having a through hole in the center of the reflective sheet, the LED is disposed in the through hole; at least one lens is mounted on the reflective sheet opposite to the LED. 如申請專利範圍第1項所述之用於LED TV之背光模組，其中該LED係分別利用導電金屬黏著於電路板上。 The backlight module for LED TV according to claim 1, wherein the LEDs are respectively adhered to the circuit board by using conductive metal. 如申請專利範圍第2項所述之用於LED TV之背光模組，其中該導電金屬係為錫膏。 The backlight module for LED TV according to claim 2, wherein the conductive metal is a solder paste. 如申請專利範圍第1項所述之用於LED TV之背光模組，其中該透鏡之底部係延伸有三支撐柱，該些支撐柱係環設於該LED之周邊。 The backlight module for LED TV according to claim 1, wherein the bottom of the lens is extended with three support columns, and the support column rings are disposed around the LED. 如申請專利範圍第4項所述之用於LED TV之背光模組，其中該每一支撐柱係利用黏著劑固定於該些反射片上。The backlight module for LED TV according to claim 4, wherein each of the support columns is fixed to the reflective sheets by an adhesive.