TWM462378U - Portable electronic device - Google Patents

Portable electronic device Download PDF

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Publication number
TWM462378U
TWM462378U TW102201511U TW102201511U TWM462378U TW M462378 U TWM462378 U TW M462378U TW 102201511 U TW102201511 U TW 102201511U TW 102201511 U TW102201511 U TW 102201511U TW M462378 U TWM462378 U TW M462378U
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Taiwan
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lens
module
electronic device
portable electronic
circuit board
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TW102201511U
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Chinese (zh)
Inventor
Tzu-Chih Lin
Yu-Cheng Huang
Shuei-Lin Chen
Yung-Neng Yu
Hong-Long Chou
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Altek Corp
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Priority to TW102201511U priority Critical patent/TWM462378U/en
Publication of TWM462378U publication Critical patent/TWM462378U/en

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Abstract

A portable electronic device including a body, a first lens module, a second lens module and an image processing unit is provided. The body has a flexible printed circuit board. The first lens module is disposed on the flexible printed circuit board. The first lens module has a first lens. The first lens is capable for providing a first sensing signal. The second lens module is disposed on the flexible printed circuit board. The second lens module has a second lens. The second lens is capable for providing a second sensing signal. The first lens and the second lens have different focal distances. The image processing unit is capable for receiving the first sensing signal and the second sensing signal to generate an image and a comparison image, for generating 3D depth.

Description

可攜式電子裝置Portable electronic device

本創作是有關於一種可攜式電子裝置,且特別是有關於一種具兩鏡頭的可攜式電子裝置。The present invention relates to a portable electronic device, and more particularly to a portable electronic device with two lenses.

隨著科技的日新月異,許多消費性電子產品已從傳統的二維(2 Dimension,2D)顯像漸漸演進為三維(3 Dimension,3D)顯像以滿足消費者更高的視覺感官要求。目前市面上已陸續有具有3D顯像能力的電子產品出現,例如3D電視及3D行動電話等產品,可預見具3D顯像能力之電子產品將是未來的趨勢之一。具有3D顯像能力的電子產品也同樣的必須搭配3D的影像內容。3D的影像內容則可以利用例如具有3D攝像能力之電子裝置所提供,例如3D數位相機等。With the rapid development of technology, many consumer electronic products have evolved from traditional two-dimensional (2 Dimension, 2D) imaging to three-dimensional (3 Dimension, 3D) imaging to meet consumers' higher visual sense requirements. Electronic products with 3D imaging capabilities have emerged on the market, such as 3D TVs and 3D mobile phones. It is expected that electronic products with 3D imaging capabilities will be one of the future trends. Electronic products with 3D imaging capabilities must also be matched with 3D video content. The 3D video content can be provided by, for example, an electronic device having a 3D imaging capability, such as a 3D digital camera.

以3D數位相機為例,廠商多採用雙影像擷取模組的設計以達成擷取立體影像之目的。詳言之,一個影像擷取模組包括一個影像感測元件以及透鏡組。在習知技術中,廠商多將兩個影像擷取模組分別設置於相機機身的兩側,以模擬人類之左右眼,進而獲得類似人眼所觀察到之立體影像。然而,此3D數位相機通常 採用兩個相同等級的鏡頭,且該鏡頭例如為5M以上較高階的規格。如此一來,此設計使得3D數位相機之成本勢必得提高,才能做出符合3D數位相機的功能。並且,上述設計亦使得此高階鏡頭的體積較為龐大,故若要裝載如體積較為輕巧的手機,其會造成組裝上的不易。Taking a 3D digital camera as an example, manufacturers often use the dual image capture module design to achieve the purpose of capturing stereoscopic images. In detail, an image capture module includes an image sensing component and a lens group. In the prior art, the manufacturer places two image capturing modules on both sides of the camera body to simulate the left and right eyes of the human being, thereby obtaining a stereoscopic image similar to that observed by the human eye. However, this 3D digital camera is usually Two lenses of the same grade are used, and the lens is, for example, a higher order specification of 5M or more. As a result, this design makes the cost of the 3D digital camera inevitably higher, in order to make a function compatible with the 3D digital camera. Moreover, the above design also makes the volume of the high-order lens relatively large, so if a mobile phone such as a relatively small volume is to be loaded, it will be difficult to assemble.

另一方面,以陣列相機為例,廠商為使用R,G,B,C的鏡片,並搭配對應的感光元件(如CMOS),以製作並達到具8M照相模組的功能。如此一來,此設計亦使得陣列相機之材料成本勢必得提高,且其影像品質較差。On the other hand, in the case of an array camera, the manufacturer uses lenses of R, G, B, and C, and is matched with a corresponding photosensitive element (such as CMOS) to fabricate and achieve the function of an 8M camera module. As a result, the design also makes the material cost of the array camera inevitably increase, and the image quality is poor.

本創作提供一種可攜式電子裝置,其可減少可攜式電子裝置的體積以及節省成本。The present invention provides a portable electronic device that reduces the size and cost of the portable electronic device.

本創作的可攜式電子裝置,包括一機體、一第一鏡頭模組、一第二鏡頭模組以及一影像處理單元。機體包括一軟性電路板。第一鏡頭模組配置於軟性電路板上,且第一鏡頭模組具有一第一鏡頭。第一鏡頭用以提供一第一感光訊號。第二鏡頭模組配置於軟性電路板上,且第二鏡頭模組具有一第二鏡頭。第二鏡頭用以提供一第二感光訊號,其中第一鏡頭與第二鏡頭具有不同焦距。影像處理單元用以接收第一感光訊號以及第二感光訊號據以產生一影像、一比對影像。影像處理單元根據影像以及比對影像產生一3D深度資料。The portable electronic device of the present invention comprises a body, a first lens module, a second lens module and an image processing unit. The body includes a flexible circuit board. The first lens module is disposed on the flexible circuit board, and the first lens module has a first lens. The first lens is used to provide a first photo-sensing signal. The second lens module is disposed on the flexible circuit board, and the second lens module has a second lens. The second lens is configured to provide a second photo-sensing signal, wherein the first lens and the second lens have different focal lengths. The image processing unit is configured to receive the first photosensitive signal and the second photosensitive signal to generate an image and a comparison image. The image processing unit generates a 3D depth data based on the image and the comparison image.

在本創作的一實施例中,上述的第二鏡頭用以提供一測距訊號。影像處理單元根據測距訊號產生一測距資料。In an embodiment of the present invention, the second lens is configured to provide a ranging signal. The image processing unit generates a ranging data according to the ranging signal.

在本創作的一實施例中,上述的第一鏡頭為一變焦鏡頭。In an embodiment of the present invention, the first lens is a zoom lens.

在本創作的一實施例中,上述的第二鏡頭為一定焦鏡頭。In an embodiment of the present creation, the second lens is a fixed focus lens.

在本創作的一實施例中,上述的第二鏡頭具有一VGA模組感測器。In an embodiment of the present invention, the second lens has a VGA module sensor.

在本創作的一實施例中,上述的機體具有一第一表面與一第二表面。軟性電路板位於第一表面上,且第一鏡頭模組與第二鏡頭模組配置在軟性電路板上。In an embodiment of the present invention, the body has a first surface and a second surface. The flexible circuit board is located on the first surface, and the first lens module and the second lens module are disposed on the flexible circuit board.

在本創作的一實施例中,可攜式電子裝置更包括一閃光燈模組,其中該閃光燈模組是配置在該第一鏡頭與該第二鏡頭之間,用以增加該第一鏡頭模組與該第二鏡頭模組間之一感光區中心間距。In an embodiment of the present invention, the portable electronic device further includes a flash module, wherein the flash module is disposed between the first lens and the second lens to increase the first lens module. The center distance of one photosensitive region between the second lens module and the second lens module.

基於上述,本創作所提供的可攜式電子裝置,其採用不同規格的兩種鏡頭,並將鏡頭置放在同一個軟性電路板上,以具有測距以及3D的功能。相較於習知的3D相機,本創作的第一鏡頭與第二鏡頭具有不同焦距,且不同規格,故可以將兩鏡頭中的其中一個採用如VGA,720P定焦且便宜的鏡頭,以取代2個都是用高解析鏡頭且成本高的3D相機,故可以節省整體裝置的容納空間及製作成本。Based on the above, the portable electronic device provided by the present invention adopts two kinds of lenses of different specifications, and the lens is placed on the same flexible circuit board to have the functions of ranging and 3D. Compared with the conventional 3D camera, the first lens and the second lens of the present invention have different focal lengths and different specifications, so one of the two lenses can be replaced by a lens such as VGA, 720P and a cheap lens. Both of them are 3D cameras with high resolution lenses and high cost, so the storage space and production cost of the whole device can be saved.

除此之外,由於第一鏡頭與第二鏡頭皆配置在同一個軟 性電路板上,而不是將第一鏡頭與第二鏡頭分別配置於對應的軟性電路板上,再將其組裝。此舉不僅可以避免因組裝而產生的視角公差,還可將第一鏡頭與第二鏡頭整合在同一模組上,以節省組裝成本。In addition, since the first lens and the second lens are both disposed in the same soft Instead of arranging the first lens and the second lens on the corresponding flexible circuit board, the first circuit board and the second lens are respectively assembled. This not only avoids the viewing angle tolerance caused by assembly, but also integrates the first lens and the second lens on the same module to save assembly costs.

為讓本創作的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above features and advantages of the present invention more comprehensible, the following embodiments are described in detail with reference to the accompanying drawings.

100‧‧‧可攜式電子裝置100‧‧‧Portable electronic devices

110‧‧‧機體110‧‧‧ body

110a‧‧‧第一表面110a‧‧‧ first surface

110b‧‧‧第二表面110b‧‧‧ second surface

112‧‧‧軟性電路板112‧‧‧Soft circuit board

120‧‧‧第一鏡頭模組120‧‧‧First lens module

122‧‧‧第一鏡頭122‧‧‧ first shot

122a‧‧‧第一感光訊號122a‧‧‧First Photographic Signal

120y‧‧‧第一影像感測器120y‧‧‧First Image Sensor

120z‧‧‧第一影像感測器感光區中心120z‧‧‧The first image sensor photosensitive zone center

130‧‧‧第二鏡頭模組130‧‧‧Second lens module

132‧‧‧第二鏡頭132‧‧‧second lens

132a‧‧‧第二感光訊號132a‧‧‧Second light signal

132b‧‧‧測距訊號132b‧‧‧Ranging signal

130y‧‧‧第二影像感測器130y‧‧‧Second image sensor

130z‧‧‧第二影像感測器感光區中心130z‧‧‧Second image sensor photosensitive zone center

140‧‧‧影像處理單元140‧‧‧Image Processing Unit

150‧‧‧閃光燈模組150‧‧‧ flash module

160‧‧‧待感測物件160‧‧‧Sensitive objects

S1‧‧‧影像S1‧‧ images

S2‧‧‧比對影像S2‧‧‧ alignment image

S3‧‧‧3D深度資料S3‧‧3D depth data

S4‧‧‧測距資料S4‧‧‧Ranging data

S510~S550‧‧‧步驟S510~S550‧‧‧Steps

圖1為本創作一實施例的一種可攜式電子裝置的示意圖。FIG. 1 is a schematic diagram of a portable electronic device according to an embodiment of the present invention.

圖2為圖1的可攜式電子裝置的方塊示意圖。2 is a block diagram of the portable electronic device of FIG. 1.

圖3為本創作另一實施例的一種可攜式電子裝置的示意圖。FIG. 3 is a schematic diagram of a portable electronic device according to another embodiment of the present invention.

圖4為圖1的可攜式電子裝置的模擬示意圖。4 is a schematic diagram of the simulation of the portable electronic device of FIG. 1.

圖5為圖1之可攜式電子裝置的製造方法的文字流程圖。FIG. 5 is a text flow diagram of a method of manufacturing the portable electronic device of FIG. 1. FIG.

圖6及圖7為本創作再一實施例的一種可攜式電子裝置的示意圖。FIG. 6 and FIG. 7 are schematic diagrams of a portable electronic device according to still another embodiment of the present invention.

圖1為本創作一實施例的一種可攜式電子裝置的示意圖。圖2為圖1的可攜式電子裝置的方塊示意圖。圖3為本創作另一實施例的一種可攜式電子裝置的示意圖。請參照圖1至圖3,在本實施例中,可攜式電子裝置100例如為手機且包括一機體110、一第一鏡頭模組120、一第二鏡頭模組130以及一影像處理 單元140。機體110具有一軟性電路板112。需說明的是,在此僅繪示出部分的機體110,以便於說明。FIG. 1 is a schematic diagram of a portable electronic device according to an embodiment of the present invention. 2 is a block diagram of the portable electronic device of FIG. 1. FIG. 3 is a schematic diagram of a portable electronic device according to another embodiment of the present invention. Referring to FIG. 1 to FIG. 3, in the embodiment, the portable electronic device 100 is, for example, a mobile phone, and includes a body 110, a first lens module 120, a second lens module 130, and an image processing. Unit 140. The body 110 has a flexible circuit board 112. It should be noted that only a part of the body 110 is shown here for convenience of explanation.

第一鏡頭模組120具有一第一鏡頭122。第一鏡頭122用以提供一第一感光訊號122a。第二鏡頭模組130具有一第二鏡頭132。第二鏡頭132用以提供一第二感光訊號132a,其中第一鏡頭122與第二鏡頭132具有不同焦距。第一鏡頭122與第二鏡頭132例如是標準鏡頭、廣角鏡頭、變焦鏡頭等,在本實施例中,第一鏡頭122為採用一高解析度的變焦鏡頭,其例如為3.2M,5M,8M或以上的鏡頭。第二鏡頭為採用一低解析度的定焦鏡頭,其例如為具有一VGA模組感測器。在其他實施例中,第二鏡頭還可採用如720P的鏡頭。當然,在其他實施例中,第一鏡頭亦可採用一低解析度的定焦鏡頭,而第二鏡頭便採用一高解析度的變焦鏡頭,本創作不限制於此。The first lens module 120 has a first lens 122. The first lens 122 is configured to provide a first photo-sensing signal 122a. The second lens module 130 has a second lens 132. The second lens 132 is configured to provide a second photo-sensing signal 132a, wherein the first lens 122 and the second lens 132 have different focal lengths. The first lens 122 and the second lens 132 are, for example, a standard lens, a wide-angle lens, a zoom lens, and the like. In the embodiment, the first lens 122 is a high-resolution zoom lens, which is, for example, 3.2M, 5M, 8M or The above lens. The second lens is a low-resolution fixed-focus lens, which has, for example, a VGA module sensor. In other embodiments, the second lens may also employ a lens such as a 720P. Of course, in other embodiments, the first lens can also adopt a low-resolution fixed-focus lens, and the second lens uses a high-resolution zoom lens, and the creation is not limited thereto.

在本實施例中,第一鏡頭122與第二鏡頭132將配置於軟性電路板112上。影像處理單元140用以接收第一感光訊號122a及第二感光訊號132a據以產生一影像S1、一比對影像S2。影像處理單元140根據影像S1以及比對影像S2產生一3D深度資料S3。當然,影像處理單元140還可包括如3D深度產生器的相關構件,在此不多贅述。此外,第二鏡頭130用以提供一測距訊號132b。影像處理單元140根據測距訊號132b產生一測距資料S4,以使此可攜式電子裝置100具有測距的功能。需說明的是,上述 影像處理單元140還包括感光元件,其例如是電荷耦合元件(Charge Coupled Device,CCD)、互補性氧化金屬半導體(Complementary Metal-Oxide Semiconductor,CMOS)元件或其他元件,在此不設限。In this embodiment, the first lens 122 and the second lens 132 are disposed on the flexible circuit board 112. The image processing unit 140 is configured to receive the first light sensing signal 122a and the second light sensing signal 132a to generate an image S1 and a comparison image S2. The image processing unit 140 generates a 3D depth data S3 based on the image S1 and the comparison image S2. Of course, the image processing unit 140 may further include related components such as a 3D depth generator, and details are not described herein. In addition, the second lens 130 is configured to provide a ranging signal 132b. The image processing unit 140 generates a ranging data S4 according to the ranging signal 132b, so that the portable electronic device 100 has a function of ranging. It should be noted that the above The image processing unit 140 further includes a photosensitive element, such as a Charge Coupled Device (CCD), a Complementary Metal-Oxide Semiconductor (CMOS) element, or other components, which is not limited herein.

在此配置之下,本實施例所提供的可攜式電子裝置100,其採用不同規格的兩種鏡頭(如圖1所示的第一鏡頭122與第二鏡頭132),並將其並列置放在同一個軟性電路板112上,以具有測距以及3D的功能。相較於習知的3D相機,本實施的第一鏡頭120與第二鏡頭130具有不同焦距,且不同規格,故可以將兩鏡頭中的其中一個採用如VGA,720P定焦且便宜的鏡頭,以取代2個都是用高解析鏡頭且成本高的3D相機,故可以減少整體裝置的容納體積並節省製作成本。除此之外,由於第一鏡頭122與第二鏡頭132皆配置在同一個軟性電路板112上,而不是將第一鏡頭122與第二鏡頭132分別配置於對應的軟性電路板112上,再將其組裝。此舉不僅可以避免因組裝而產生的視角公差,還可將第一鏡頭122與第二鏡頭132整合在同一模組上,以節省組裝成本。Under this configuration, the portable electronic device 100 provided in this embodiment adopts two kinds of lenses of different specifications (such as the first lens 122 and the second lens 132 shown in FIG. 1 ) and juxtaposes them. It is placed on the same flexible circuit board 112 to have the functions of ranging and 3D. Compared with the conventional 3D camera, the first lens 120 and the second lens 130 of the present embodiment have different focal lengths and different specifications, so that one of the two lenses can adopt a lens with a fixed focus such as VGA and 720P. In order to replace the two 3D cameras which are high-resolution lenses and costly, the storage capacity of the entire device can be reduced and the manufacturing cost can be saved. In addition, since the first lens 122 and the second lens 132 are both disposed on the same flexible circuit board 112, instead of disposing the first lens 122 and the second lens 132 on the corresponding flexible circuit board 112, respectively, Assemble it. This not only avoids the viewing angle tolerance caused by the assembly, but also integrates the first lens 122 and the second lens 132 on the same module to save assembly costs.

詳細而言,機體110具有一第一表面110a與一第二表面110b,軟性電路板112位於第一表面110a上,且第一鏡頭模組120與第二鏡頭模組130配置在軟性電路板112上。此外,本實施例並不限制第一鏡頭模組120與第二鏡頭模組130之間的距離,如圖1所示,第一鏡頭模組120與第二鏡頭模組130之間有一配置 距離,而此配置距離的大小可視實際產品的需求而能夠進行調整,例如:將閃光燈模組配置於第一鏡頭模組120與第二鏡頭模組130之間。然,本創作不限制於此,如圖3所示,第一鏡頭模組120與第二鏡頭模組130為彼此緊鄰在一起。In detail, the body 110 has a first surface 110a and a second surface 110b. The flexible circuit board 112 is located on the first surface 110a, and the first lens module 120 and the second lens module 130 are disposed on the flexible circuit board 112. on. In addition, the present embodiment does not limit the distance between the first lens module 120 and the second lens module 130. As shown in FIG. 1, there is a configuration between the first lens module 120 and the second lens module 130. The distance between the first lens module 120 and the second lens module 130 can be adjusted, for example, by the size of the configuration. However, the present creation is not limited thereto. As shown in FIG. 3, the first lens module 120 and the second lens module 130 are in close proximity to each other.

圖4為圖1的可攜式電子裝置的模擬示意圖。在本實施例中,影像處理單元140可透過立體匹配(Stereo Matching)的技術,來產生影像的深度資料S3,並藉以達到即時對焦與淺景深的效果,即,影像處理單元140對第一鏡頭122與第二鏡頭132所接收的影像進行分析處理,藉以產生淺景深影像。舉例而言,如圖4所示,被攝主體50的部分物件(如大樹)呈模糊狀,而被攝主體50的人物相對清晰。4 is a schematic diagram of the simulation of the portable electronic device of FIG. 1. In this embodiment, the image processing unit 140 can generate the depth data S3 of the image through the technique of Stereo Matching, and thereby achieve the effect of the instant focus and the shallow depth of field, that is, the image processing unit 140 pairs the first lens. The image received by the second lens 132 is analyzed and processed to generate a shallow depth of field image. For example, as shown in FIG. 4, part of the object (such as a large tree) of the subject 50 is blurred, and the person of the subject 50 is relatively clear.

以下將介紹如何將第一鏡頭模組120與第二鏡頭模組130置放在同一個軟性電路板112的製造流程。The following describes how to place the first lens module 120 and the second lens module 130 on the same flexible circuit board 112 manufacturing process.

圖5為圖1的可攜式電子裝置的製造方法的文字流程圖。請參考圖5。首先,進行步驟510,提供一軟性電路板112。接著,進行步驟520,將第一鏡頭122與第二鏡頭132藉由表面黏著技術(Surface Mounting Technology,SMT)而將第一鏡頭122與第二鏡頭132黏附在同一軟性電路板112上。在本實施例中,第一鏡頭122為採用高解析度的變焦鏡頭,其例如為3.2M,5M,8M或以上的鏡頭。第二鏡頭為採用一低解析度的定焦鏡頭,其例如為具有VGA模組感測器。FIG. 5 is a text flow diagram of a method of manufacturing the portable electronic device of FIG. 1. FIG. Please refer to Figure 5. First, in step 510, a flexible circuit board 112 is provided. Then, in step 520, the first lens 122 and the second lens 132 are adhered to the same flexible circuit board 112 by the surface mount technology (SMT). In the present embodiment, the first lens 122 is a high-resolution zoom lens, which is, for example, a lens of 3.2M, 5M, 8M or more. The second lens is a low-resolution fixed-focus lens, for example, having a VGA module sensor.

之後,進行步驟530,進行光學輔助對位,並將較高解析度的第二鏡頭132對準於低解析度的第一鏡頭122,且需控制在誤差2%以內。而後,進行步驟540,利用光學膠(UV glue)將感光元件貼附在第一鏡頭122與第二鏡頭132,以形成第一鏡頭模組120與第二鏡頭模組130。並且,再次進行光學輔助對位,以確保第一鏡頭模組120與第二鏡頭模組130之間的對準需控制在誤差2%以內。最後,進行步驟550,利用UV光照射固化光學膠,便完成了可攜式電子裝置100大致的製造流程。Thereafter, step 530 is performed to perform optically assisted alignment, and the higher resolution second lens 132 is aligned to the low resolution first lens 122 and is controlled within 2% of the error. Then, in step 540, the photosensitive element is attached to the first lens 122 and the second lens 132 by using UV glue to form the first lens module 120 and the second lens module 130. Moreover, the optical assisted alignment is performed again to ensure that the alignment between the first lens module 120 and the second lens module 130 is controlled within 2% of the error. Finally, step 550 is performed to cure the optical adhesive by UV light, thereby completing the approximate manufacturing process of the portable electronic device 100.

圖6及圖7為本創作再一實施例的一種可攜式電子裝置的示意圖,其中圖7為圖6的俯視示意圖。請參照圖6及圖7,可攜式電子裝置100例如為手機且包括一機體110、一第一鏡頭模組120、一第二鏡頭模組130、一閃光燈模組150以及第一鏡頭模組120的第一影像感測器120y的第一影像感測器感光區中心120z與第二鏡頭模組130的第二影像感測器130y的第二影像感測器感光區中心130z和一影像處理單元140。機體110具有一軟性電路板112。需說明的是,在此未繪示影像處理單元140,以便於說明。6 and FIG. 7 are schematic diagrams of a portable electronic device according to still another embodiment of the present invention, wherein FIG. 7 is a top plan view of FIG. 6. Referring to FIG. 6 and FIG. 7 , the portable electronic device 100 is, for example, a mobile phone and includes a body 110 , a first lens module 120 , a second lens module 130 , a flash module 150 , and a first lens module . The first image sensor photosensitive region center 120z of the first image sensor 120y of 120 and the second image sensor photosensitive region center 130z of the second image sensor 130y of the second lens module 130 and an image processing Unit 140. The body 110 has a flexible circuit board 112. It should be noted that the image processing unit 140 is not shown here for convenience of explanation.

詳細而言,機體110具有一第一表面110a與一第二表面110b,軟性電路板112位於第一表面110a上,且第一鏡頭模組120、第二鏡頭模組130與閃光燈模組150配置在軟性電路板112上。In detail, the body 110 has a first surface 110a and a second surface 110b. The flexible circuit board 112 is located on the first surface 110a, and the first lens module 120, the second lens module 130, and the flash module 150 are disposed. On the flexible circuit board 112.

須詳細說明的是,因利用第一鏡頭模組120及第二鏡頭 模組130所取得的深度資料的解析度正比於第一鏡頭模組120的第一影像感測器感光區中心120z與第二鏡頭模組130的第二影像感測器感光區中心130z之間的距離,所以當第一影像感測器感光區中心120z與第二影像感測器感光區中心130z之間的距離越大,可使取得的深度資料的解析度越細緻,且可降低第一鏡頭模組120及第二鏡頭模組130對一待感測物件160的距離偵測誤差。此外,深度資料解析度反比於第二相機模組130的視角,所以當第二相機模組130的視角越小,所取得的深度資料的解析度會越高。是以,在將此具有一閃光燈模組150配置於規格不同的第一鏡頭模組120與第二鏡頭模組130間的電子裝置,應用在具拍照功能的智慧型手機、平板電腦這類具輕薄需求性的電子產品,可以在不增加整體使用面積的前提下,達到大幅減低整體裝置體積,降低製作及調校成本,並可提昇電子裝置的影像感測器對立體影像解析度的效果。It should be noted that the first lens module 120 and the second lens are utilized. The resolution of the depth data obtained by the module 130 is proportional to the first image sensor photosensitive region center 120z of the first lens module 120 and the second image sensor photosensitive region center 130z of the second lens module 130. Therefore, the greater the distance between the center of the first image sensor photosensitive region 120z and the center of the second image sensor photosensitive region 130z, the finer the resolution of the obtained depth data, and the first reduction The lens module 120 and the second lens module 130 detect a distance error of the object to be sensed 160. In addition, the depth data resolution is inversely proportional to the angle of view of the second camera module 130, so the smaller the angle of view of the second camera module 130, the higher the resolution of the acquired depth data. Therefore, the electronic device having the flash module 150 disposed between the first lens module 120 and the second lens module 130 having different specifications is applied to a smart phone or a tablet computer having a camera function. The thin and light demand electronic products can greatly reduce the overall device size, reduce the production and adjustment costs without increasing the overall use area, and can improve the effect of the image sensor of the electronic device on the stereo image resolution.

綜上所述,本創作所提供的可攜式電子裝置,其採用不同規格的兩種鏡頭,並將其置放在同一個軟性電路板上,以達到測距以及3D的功效。相較於習知的3D相機,本實施的第一鏡頭與第二鏡頭具有不同焦距,且不同規格,故可以將兩鏡頭中的其中一個採用VGA,720P的定焦且便宜的鏡頭,以取代2個都是用高解析的鏡頭的3D相機,故可以節省製作成本。In summary, the portable electronic device provided by the present invention adopts two kinds of lenses of different specifications and puts them on the same flexible circuit board to achieve the functions of ranging and 3D. Compared with the conventional 3D camera, the first lens and the second lens of the present embodiment have different focal lengths and different specifications, so one of the two lenses can be replaced by a VGA, 720P fixed focus and cheap lens. Both are 3D cameras with high resolution lenses, so you can save on production costs.

除此之外,由於第一鏡頭與第二鏡頭皆配置在同一個軟 性電路板上,而不是將第一鏡頭與第二鏡頭分別配置於對應的軟性電路板上,再將其組裝。此舉不僅可以避免因組裝而產生的視角公差,還可將第一鏡頭與第二鏡頭整合在同一模組上,以節省組裝成本。In addition, since the first lens and the second lens are both disposed in the same soft Instead of arranging the first lens and the second lens on the corresponding flexible circuit board, the first circuit board and the second lens are respectively assembled. This not only avoids the viewing angle tolerance caused by assembly, but also integrates the first lens and the second lens on the same module to save assembly costs.

雖然本創作已以實施例揭露如上,然其並非用以限定本創作,任何所屬技術領域中具有通常知識者,在不脫離本創作的精神和範圍內,當可作些許的更動與潤飾,故本創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person having ordinary knowledge in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of protection of this creation is subject to the definition of the scope of the patent application.

100‧‧‧可攜式電子裝置100‧‧‧Portable electronic devices

110‧‧‧機體110‧‧‧ body

110a‧‧‧第一表面110a‧‧‧ first surface

110b‧‧‧第二表面110b‧‧‧ second surface

112‧‧‧軟性電路板112‧‧‧Soft circuit board

120‧‧‧第一鏡頭模組120‧‧‧First lens module

122‧‧‧第一鏡頭122‧‧‧ first shot

130‧‧‧第二鏡頭模組130‧‧‧Second lens module

132‧‧‧第二鏡頭132‧‧‧second lens

Claims (7)

一種可攜式電子裝置,包括:一機體,包括一軟性電路板;一第一鏡頭模組,配置於該軟性電路板上,且該第一鏡頭模組具有一第一鏡頭,該第一鏡頭用以提供一第一感光訊號;一第二鏡頭模組,配置於該軟性電路板上,且該第二鏡頭模組具有一第二鏡頭,該第二鏡頭用以提供一第二感光訊號,其中該第一鏡頭與該第二鏡頭具有不同焦距;以及一影像處理單元,用以接收該第一感光訊號以及該第二感光訊號據以產生一影像、一比對影像;其中,該影像處理單元根據該影像以及該比對影像產生一3D深度資料。 A portable electronic device includes: a body including a flexible circuit board; a first lens module disposed on the flexible circuit board, and the first lens module has a first lens, the first lens A second lens module is disposed on the flexible circuit board, and the second lens module has a second lens for providing a second light sensing signal. The first lens and the second lens have different focal lengths, and an image processing unit is configured to receive the first photosensitive signal and the second photosensitive signal to generate an image and a comparison image; wherein the image processing The unit generates a 3D depth data based on the image and the aligned image. 如申請專利範圍第1項所述的可攜式電子裝置,其中該第二鏡頭用以提供一測距訊號,該影像處理單元根據該測距訊號產生一測距資料。 The portable electronic device of claim 1, wherein the second lens is configured to provide a ranging signal, and the image processing unit generates a ranging data according to the ranging signal. 如申請專利範圍第1項所述的可攜式電子裝置,其中該第一鏡頭為一變焦鏡頭。 The portable electronic device of claim 1, wherein the first lens is a zoom lens. 如申請專利範圍第1項所述的可攜式電子裝置,其中該第二鏡頭為一定焦鏡頭。 The portable electronic device of claim 1, wherein the second lens is a fixed focus lens. 如申請專利範圍第1項所述的可攜式電子裝置,其中該第二鏡頭具有一VGA模組感測器。 The portable electronic device of claim 1, wherein the second lens has a VGA module sensor. 如申請專利範圍第1項所述的可攜式電子裝置,其中該機 體具有一第一表面與一第二表面,該軟性電路板位於該第一表面上,且該第一鏡頭模組與該第二鏡頭模組配置在該軟性電路板上。 The portable electronic device of claim 1, wherein the portable electronic device The body has a first surface and a second surface. The flexible circuit board is located on the first surface, and the first lens module and the second lens module are disposed on the flexible circuit board. 如申請專利範圍第1項所述的可攜式電子裝置,更包括一閃光燈模組,其中該閃光燈模組是配置在該第一鏡頭與該第二鏡頭之間,用以增加該第一鏡頭模組與該第二鏡頭模組間之一感光區中心間距。 The portable electronic device of claim 1, further comprising a flash module, wherein the flash module is disposed between the first lens and the second lens to increase the first lens The center distance between the photosensitive region of the module and the second lens module.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI651578B (en) * 2016-11-08 2019-02-21 聚晶半導體股份有限公司 Image capturing device
TWI668638B (en) * 2018-03-13 2019-08-11 鴻海精密工業股份有限公司 Sensing module and electronic devices thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI651578B (en) * 2016-11-08 2019-02-21 聚晶半導體股份有限公司 Image capturing device
TWI668638B (en) * 2018-03-13 2019-08-11 鴻海精密工業股份有限公司 Sensing module and electronic devices thereof

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