TWM451699U - 電連接器 - Google Patents
電連接器 Download PDFInfo
- Publication number
- TWM451699U TWM451699U TW101218156U TW101218156U TWM451699U TW M451699 U TWM451699 U TW M451699U TW 101218156 U TW101218156 U TW 101218156U TW 101218156 U TW101218156 U TW 101218156U TW M451699 U TWM451699 U TW M451699U
- Authority
- TW
- Taiwan
- Prior art keywords
- electrical connector
- contact arms
- base body
- conductive terminals
- receiving
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
- H01R13/2485—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point for contacting a ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
- H01R13/112—Resilient sockets forked sockets having two legs
Landscapes
- Connecting Device With Holders (AREA)
- Multi-Conductor Connections (AREA)
Description
本創作涉及一種電連接器,尤其涉及一種導電端子具有複數接觸臂以夾持晶片模組之錫球的電連接器。
美國專利第691412號揭示了一種電連接器,用以連接晶片模組至電路板。該電連接器包括收容有複數導電端子之絕緣本體,壓蓋樞接於絕緣本體之一側。當晶片模組安裝至絕緣本體上時,壓蓋向下抵壓晶片模組且晶片模組向下抵壓導電端子,導電端子具有延伸出絕緣本體上表面之傾斜端子,組裝完成後,晶片模組與電連接器實現電性導通。
然,由於電連接器之導電端子之接觸臂延伸出絕緣本體上表面一段距離,其增加電連接器之高度,不適應小型化之發展趨勢。另,接觸臂於受壓時彎曲變形,相鄰端子間存在短路之風險。
鑒於此,確有必要提供一種改進之電連接器,以克服前述電連接器存在之缺陷。
本創作之目的係提供一種低構造之電連接器。
為實現前述目的,本創作采用如下技術方案:一種電連接器,用以連接設有複數錫球之晶片模組,該電連接器包括設有複數收容孔之絕緣本體及複數分別位於收容孔內之導電端子,每一導電端子包含固定部及自固定部向上延伸之至少兩個接觸臂並且該等接觸臂之間設有用以收容晶片模組之錫球的收容空間,至少一個接觸臂設有朝向收容空間延伸且與晶片之錫球配合的夾持部。
為實現前述目的,本創作采用如下技術方案:一種電連接器,用以連接複數錫球之晶片模組與電路板,該電連接器包括絕緣本體及複數導電端子,前述絕緣本體包括基體,前述基體設有以與晶片模組配合之上表面、以與電路板配合之下表面及複數貫穿上表面與下表面之收容孔,前述導電端子分別收容於前述收容孔中,每一導電端子包括延伸至基體下表面以焊接至印刷電路板上之平板狀之固定部及至少兩個自固定部向上彎折以夾持晶片模組中之錫球的接觸臂。
相較于先前技術,本創作電連接器至少存在以下優點:電連接器之複數接觸臂用以夾持晶片模組之錫球並且接觸臂自固定部向上彎折延伸,得減小導電端子之高度。
請參閲第一圖至第三圖所示,本創作電連接器1用以連接晶片模組2。晶片模組2包括位於其底面(未標號)之複數錫球20。電連接器1包括絕緣本體10以及收容於絕緣本體10中之複數導電端子11。絕緣本體10包括基體12以及自基體12向上延伸之四個側壁13。基體12設有以與晶片模組配合之上表面120、以與電路板配合之下表面121及複數貫穿上表面120與下表面121且收容導電端子11之收容孔14。導電端子11位於絕緣本體10之上表面120之下。
請重點參閲第四圖至第五圖所示,導電端子11係由金屬材料製成。平板狀金屬片(未圖示)首先成型出長條狀之連接部30及連接於連接部30相對兩側之分支部31。接著,兩個分支部31均相對於連接部30向上彎折並形成導電端子11之接觸臂111。連接部30之相鄰兩個導電端子11之間多餘之部分(第五圖中虛線所示)最終被裁切下來以形成單個之導電端子11。每一導電端子11包括用來焊接到電路板(未圖示)上之固定部110及分別位於固定部110相對兩側之兩對接觸臂111。固定部110之另一相對兩側由於裁切過程形成豎直之裁切面113。於本實施方式中,該固定部110向上延伸設有四個接觸臂111,且該四個接觸臂111之間形成一個夾持晶片模組2中錫球20之收容空間114。 每一接觸臂111具有朝向收容空間114且夾持晶片模組2中錫球20之夾持部112,以可靠之夾持錫球20。
導電端子11從絕緣本體10之底部(未標號)***絕緣本體10中。每一收容孔14之底部位置包括四個供接觸臂111穿過之固定孔15,固定孔15之間的壁部(未標號)可擋止固定部110,以防止導電端子11相對於絕緣本體10繼續向上移動。
電連接器1組裝完成後,晶片模組2與電連接器1之組合以低構型設置,導電端子11可節省成本且通過夾持部112能夠可靠之夾持錫球20。本創作電連接器1之導電端子11收容於基體12中,以減小相鄰導電端子11之間被短路之風險。
綜上所述,本創作符合新型專利要件,依法提出專利申請。惟,以上所述者僅為本創作之較佳實施例,本創作之範圍並不以前述實施例為限,舉凡熟習本案技藝之人士依本創作之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。
1‧‧‧電連接器
2‧‧‧晶片模組
10‧‧‧絕緣本體
11‧‧‧導電端子
12‧‧‧基體
13‧‧‧側壁
14‧‧‧收容孔
15‧‧‧固定孔
20‧‧‧錫球
30‧‧‧連接部
31‧‧‧分支部
110‧‧‧固定部
111‧‧‧接觸臂
112‧‧‧夾持部
113‧‧‧裁切面
114‧‧‧收容空間
120‧‧‧上表面
121‧‧‧下表面
第一圖係本創作電連接器及晶片模組之立體組合圖。
第二圖係本創作電連接器及晶片模組之另一角度之立體圖。
第三圖係本創作電連接器之立體分解圖。
第四圖係本創作電連接器之導電端子夾持晶片模組的錫球之立體圖。
第五圖係本創作電連接器之複數導電端子連接成的料帶之示意圖。
20‧‧‧錫球
110‧‧‧固定部
111‧‧‧接觸臂
112‧‧‧夾持部
113‧‧‧裁切面
Claims (10)
- 一種電連接器,用以連接設有複數錫球之晶片模組,該電連接器包括設有複數收容孔之絕緣本體及複數導電端子,其中,每一導電端子包含平板狀之固定部及自固定部向上延伸之至少兩個接觸臂,前述接觸臂凸伸入收容孔内,且兩者之間設有用以收容晶片模組之錫球的收容空間,至少一個前述接觸臂設有朝向收容空間延伸且與晶片模組之錫球配合的夾持部。
- 如申請範圍專利第1項所述之電連接器,其中前述導電端子設有兩對前述接觸臂並且兩對接觸臂位於固定部兩側呈相對設置且用以夾持晶片模組之錫球。
- 如申請範圍專利第1項所述之電連接器,其中前述絕緣本體包括基體及複數自基體向上延伸之側壁,且平板狀的固定部位于收容孔之外。
- 如申請範圍專利第1項所述之電連接器,其中前述絕緣本體還包括以與晶片模組配合之上表面及以與電路板配合之下表面,前述導電端子位於絕緣本體之上表面之下。
- 如申請範圍專利第3項所述之電連接器,其中前述收容孔包括複數位於基體中之固定孔,前述導電端子之接觸臂分別穿過固定孔且固定部被擋止於基體之下。
- 一種電連接器,用以連接設有複數錫球之晶片模組與電路板,該電連接器包括絕緣本體及複數導電端子,前述絕緣本體包括基體,前述基體設有以與晶片模組配合之上表面、以與電路板配合之下表面及複數貫穿上表面與下表面之收容孔,前述導電端子分別收容於前述收容孔中,每一導電端子包括延伸至基體下表面以焊接到印刷電路板上之平板狀之固定部及至少兩個自固定部向上彎折以夾持晶片模組中之錫球的接觸臂。
- 如申請範圍專利第6項所述之電連接器,其中前述導電端子之固定部之相對兩側設有呈相對設置之裁切面。
- 如申請範圍專利第6項所述之電連接器,其中前述導電端子之每一接觸臂具有一個用以夾持晶片模組之錫球的夾持部。
- 如申請範圍專利第6項所述之電連接器,其中前述前述收容孔包括複數位於基體之下表面的固定孔,前述接觸臂分別穿過前述固定孔且固定部被擋止於下表面。
- 如申請範圍專利第6項所述之電連接器,其中前述導電端子位於基體的上表面之下,前述絕緣本體還包括複數自基體向上延伸之側臂。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/241,306 US8449307B2 (en) | 2011-09-23 | 2011-09-23 | Socket connector having contact with multiple beams jointly grasping ball of IC package |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM451699U true TWM451699U (zh) | 2013-04-21 |
Family
ID=47911747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101218156U TWM451699U (zh) | 2011-09-23 | 2012-09-20 | 電連接器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8449307B2 (zh) |
CN (1) | CN202855980U (zh) |
TW (1) | TWM451699U (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016119611A1 (de) * | 2016-10-14 | 2018-04-19 | Walter Söhner GmbH & Co. KG | Elektronikkontakt |
US10725069B1 (en) * | 2017-09-19 | 2020-07-28 | Johnstech International Corporation | Integrated circuit contactor for testing ICs and method of construction |
CN111029814A (zh) * | 2019-12-10 | 2020-04-17 | 番禺得意精密电子工业有限公司 | 电连接器 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5746608A (en) * | 1995-11-30 | 1998-05-05 | Taylor; Attalee S. | Surface mount socket for an electronic package, and contact for use therewith |
US6045416A (en) * | 1996-04-02 | 2000-04-04 | Aries Electronics, Inc. | Universal production ball grid array socket |
US5730606A (en) * | 1996-04-02 | 1998-03-24 | Aries Electronics, Inc. | Universal production ball grid array socket |
US6843662B2 (en) * | 2003-03-31 | 2005-01-18 | Ted Ju | Electric connector housing supporting a plurality of solder balls and including a plurality of protruding blocks respectively supporting the plurality of solder balls |
US7537461B2 (en) * | 2003-07-16 | 2009-05-26 | Gryphics, Inc. | Fine pitch electrical interconnect assembly |
US6914192B2 (en) | 2003-08-25 | 2005-07-05 | Ted Ju | Adapter-connector and conductor set |
US7695287B2 (en) * | 2006-07-06 | 2010-04-13 | Harris Corporation | Ball grid array (BGA) connection system and related method and ball socket |
US7442045B1 (en) * | 2007-08-17 | 2008-10-28 | Centipede Systems, Inc. | Miniature electrical ball and tube socket with self-capturing multiple-contact-point coupling |
US7771209B2 (en) * | 2008-09-08 | 2010-08-10 | Lotes Co., Ltd | Electrical connecting apparatus |
US7857631B2 (en) * | 2008-12-30 | 2010-12-28 | Cascade Microtech, Inc. | Socket with a housing with contacts with beams of unequal lengths |
TWM378516U (en) * | 2009-09-30 | 2010-04-11 | Hon Hai Prec Ind Co Ltd | Electrical connector and terminals thereof |
-
2011
- 2011-09-23 US US13/241,306 patent/US8449307B2/en not_active Expired - Fee Related
-
2012
- 2012-09-18 CN CN201220474171.4U patent/CN202855980U/zh not_active Expired - Fee Related
- 2012-09-20 TW TW101218156U patent/TWM451699U/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US8449307B2 (en) | 2013-05-28 |
CN202855980U (zh) | 2013-04-03 |
US20130078829A1 (en) | 2013-03-28 |
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Legal Events
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MM4K | Annulment or lapse of a utility model due to non-payment of fees |