TWM445686U - Liquid-cooled heat exchange module with uniform stream channel - Google Patents
Liquid-cooled heat exchange module with uniform stream channel Download PDFInfo
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本創作係有關於一種液冷式熱交換模組，尤指一種具有均勻流道的液冷式熱交換模組。 The present invention relates to a liquid-cooled heat exchange module, and more particularly to a liquid-cooled heat exchange module having a uniform flow path.
隨著科技的日新月異，電子元件的性能越來越強大，但是這些高性能的電子元件在運作過程中會產生很多的熱量，如果這些熱量沒有及時適當地散逸出去的話，將會使這些電子元件的工作溫度超過正常可容許的範圍，甚至故障或燒毀。 With the rapid development of technology, the performance of electronic components is getting stronger and stronger, but these high-performance electronic components generate a lot of heat during operation. If these heats are not properly dissipated in time, they will make these electronic components The operating temperature exceeds the normal allowable range, even failure or burnout.
為了將電子元件所產生的熱量迅速傳導出去，已知有液冷式熱交換模組，其一般的結構包括一殼體及設置於殼體內的一散熱組，殼體是由金屬等導熱材質製成，其貼附一欲被導熱的電子元件，殼體具有一入口及一出口，殼體內部具有與入口相通的一進水槽及與出口相通的一出水槽；散熱組具有複數鰭片，相鄰二鰭片之間構成供冷卻流體流過的一微流道，散熱組設置於殼體內並熱接觸該電子元件。所以，使用時，電子元件所產生的熱量會被殼體傳導至散熱組，冷卻流體從殼體的入口流入該進水槽，然後從該進水槽流過散熱組的微流道而將散熱組所吸收的熱量帶走，冷卻流體最後從出水槽與出口離開殼體，藉此將電子元件所產生的熱量傳導至別處。 In order to quickly conduct heat generated by the electronic component, a liquid-cooled heat exchange module is known. The general structure includes a casing and a heat dissipation group disposed in the casing. The casing is made of a heat conductive material such as metal. An electronic component to be thermally conductive is attached, the housing has an inlet and an outlet, the housing has a water inlet and a water outlet connected to the inlet, and the heat dissipation unit has a plurality of fins. A micro flow path is formed between the adjacent two fins for the cooling fluid to flow through, and the heat dissipation group is disposed in the housing and thermally contacts the electronic component. Therefore, in use, the heat generated by the electronic component is conducted to the heat dissipation group by the housing, and the cooling fluid flows into the water inlet from the inlet of the housing, and then flows from the water inlet through the micro flow passage of the heat dissipation group to dissipate the heat dissipation group. The absorbed heat is carried away, and the cooling fluid finally leaves the housing from the outlet and outlet, thereby transferring the heat generated by the electronic components to another location.
根據先前技術，進水槽與出水槽一般係設置在殼體的二相反側而呈對向設置，這樣的配置方式下理論上是為了使冷卻流體的流動路徑最短，而加快冷卻流體在殼體內 部通過散熱組的速率。 According to the prior art, the water inlet and the water outlet are generally disposed opposite to each other on the opposite side of the housing. In this arrangement, the theoretical way is to minimize the flow path of the cooling fluid and accelerate the cooling fluid in the housing. The rate at which the heat passes through the heat pack.
然而，在實際運作上，這類的液冷式熱交換模組卻具有如下的問題：第一、冷卻流體通過散熱組的時間不夠長，故冷卻流體無法完全與散熱組進行熱交換。第二，從流體力學的角度來分析，由於先前技術中殼體的入口與進水槽為等直徑的管道或槽道，並無任何緩衝或擴散設計，且冷卻流體在殼體的入口及進水槽之流速較快，所以快速的冷卻流體僅沖擊一部份的散熱組，冷卻流體無法完全均勻地流入每一微流道內，且一部分的冷卻流體甚至會被散熱組反彈回來而與其他冷卻流體形成擾流，進而影響冷卻流體流入散熱組的流動速率。 However, in actual operation, such liquid-cooled heat exchange modules have the following problems: First, the cooling fluid does not pass through the heat-dissipating group for a long time, so the cooling fluid cannot completely exchange heat with the heat-dissipating group. Secondly, from the perspective of hydrodynamics, since the inlet and sink of the casing in the prior art are equal diameter pipes or channels, there is no buffer or diffusion design, and the cooling fluid is at the inlet and the sink of the casing. The flow rate is fast, so the rapid cooling fluid only impacts a part of the heat dissipation group, the cooling fluid cannot flow into the micro flow channel completely uniformly, and a part of the cooling fluid is even bounced back by the heat dissipation group and other cooling fluids. A spoiler is formed which in turn affects the flow rate of the cooling fluid into the heat sink.
第三、先前技術中，進水槽與出水槽係位於殼體的相向二側，亦位於散熱組的相向二側。所以，可想而知，冷卻流體主要是通過散熱組較中間的微流道，而對於距離進水槽與出水槽的連線較遠的二側微流道來說，冷卻流體流過的比例較少，所以散熱組內設置的微流道之使用效率不一致，而且冷卻流體通過中間微流道的行進路線較短，而流過外側微流道的行進路線較長，如此無法產生均勻的微流道效果。 Third, in the prior art, the water inlet and the water outlet are located on opposite sides of the casing, and are also located on opposite sides of the heat dissipation group. Therefore, it is conceivable that the cooling fluid mainly passes through the micro flow passage in the middle of the heat dissipation group, and the ratio of the cooling fluid flowing through the two side micro flow passages far from the connection line between the water inlet and the water outlet is higher. There are few, so the use efficiency of the micro flow passages provided in the heat dissipation group is inconsistent, and the travel path of the cooling fluid through the intermediate micro flow passage is short, and the travel path through the outer micro flow passage is long, so that a uniform micro flow cannot be generated. Road effect.
另一方面，在先前技術中，殼體的出水槽與出口亦無任何加速設計，導致通過散熱組的冷卻流體之速度與進入冷卻流體的速度產生較大的落差，如此亦會影響冷卻流體通過整個熱交換模組的速率。 On the other hand, in the prior art, the water outlet and the outlet of the casing do not have any acceleration design, resulting in a large drop in the speed of the cooling fluid passing through the heat dissipation group and the velocity of entering the cooling fluid, which also affects the passage of the cooling fluid. The rate of the entire heat exchange module.
因此，如何解決上述之問題點，即成為本創作人所改良之目標。 Therefore, how to solve the above problems becomes the goal of improvement by the creator.
本創作之一目的，在於提供一種具有均勻流道的液冷式熱交換模組，其能夠使冷卻流體均勻地流過每一微流道且行進路線之距離均相等。 One of the aims of the present invention is to provide a liquid-cooled heat exchange module having a uniform flow path that enables a cooling fluid to flow uniformly through each microchannel and the distances of the travel paths are equal.
本創作之另一目的，在於提供一種具有均勻流道的液冷式熱交換模組，其能夠減少冷卻流體在進入散熱組之前所產生的擾流現象而達成均勻一致的流速。 Another object of the present invention is to provide a liquid-cooled heat exchange module having a uniform flow path that can reduce the turbulence caused by the cooling fluid before entering the heat dissipation group to achieve a uniform flow rate.
為了達成上述之目的，本創作係提供一種具有均勻流道的液冷式熱交換模組，包括：一殼體；一散熱組，設置於該殼體內；以及一導流體，設置於該殼體內，該導流體設有與該殼體內相通的一第一導流槽、與一第二導流槽、連通該第一導流槽與該第二導流槽之間並罩蓋該散熱組的一容置槽，該第一導流槽朝向該容置槽逐漸擴大，而該第二導流槽遠離該容置槽逐漸縮小。 In order to achieve the above object, the present invention provides a liquid-cooled heat exchange module having a uniform flow path, comprising: a casing; a heat dissipation group disposed in the casing; and a fluid guiding body disposed in the casing The guiding fluid is provided with a first guiding groove communicating with the inside of the casing, and a second guiding groove, communicating between the first guiding groove and the second guiding groove, and covering the heat dissipation group The accommodating groove is gradually enlarged toward the accommodating groove, and the second guiding groove is gradually narrowed away from the accommodating groove.
根據本創作的另一特色，殼體具有一入口及一出口，入口設置於殼體的一隅角處，且第一導流槽與第二導流槽相對於殼體及散熱組呈對角線配置。 According to another feature of the present invention, the housing has an inlet and an outlet, the inlet is disposed at a corner of the housing, and the first and second drainage channels are diagonal with respect to the housing and the heat dissipation group. Configuration.
相較於先前技術，本創作具有以下功效：根據本創作，由於入口設置於殼體的一隅角附近，且第一導流槽與第二導流槽相對於殼體及散熱組呈對角線配置，這樣的配置方式能夠使冷卻流體在相同底面積的殼 體內之行徑路線距離最大，故在此最大的行徑路線上能使更多的冷卻流體充分地與散熱組進行熱交換。 Compared with the prior art, the present invention has the following effects: according to the present creation, since the inlet is disposed near a corner of the casing, and the first guiding groove and the second guiding groove are diagonal with respect to the casing and the heat dissipation group Configuration, such a configuration enables the cooling fluid to be in the same bottom area of the shell The distance traveled in the body is the largest, so that the largest flow path can make more cooling fluid exchange heat with the heat dissipation group.
另外，由於入口設置於殼體的一隅角附近，且第一導流槽與第二導流槽相對於殼體及散熱組呈對角線配置，第一導流槽係從入口朝容置槽逐漸擴大，且第二導流槽係從容置槽朝出口逐漸縮小；所以，這樣的配置方式能夠使冷卻流體在散熱組內的每一微流道之流動路線距離幾乎相等，故能產生均勻流道的效果並充分運用散熱組的每一微流道，不會有先前技術中僅主要運用中間地帶的微流道之情形。 In addition, since the inlet is disposed near a corner of the casing, and the first guiding groove and the second guiding groove are diagonally disposed with respect to the casing and the heat dissipation group, the first guiding groove is from the inlet toward the receiving groove. Gradually expanding, and the second flow guiding groove is gradually reduced from the accommodating groove toward the outlet; therefore, such an arrangement can make the flow path distance of each cooling channel of the cooling fluid in the heat dissipation group almost equal, so that a uniform flow can be generated. The effect of the channel and the full use of each micro-flow channel of the heat-dissipation group do not have the situation in the prior art that only the micro-channels of the intermediate zone are mainly used.
另一方面，就流體力學的角度來看，從入口流進第一導流槽的冷卻流體會因為逐漸擴大的第一導流槽而達到擴散的效果，不會像先前技術一樣集中撞擊一部份的散熱組而反彈造成擾流，而且，逐漸縮小的第二導流槽會逐漸收攏而增加冷卻流體離開殼體的速度，故能夠使冷卻流體進入殼體與離開殼體的速率保持一致，而增加熱交換模組的工作效率。 On the other hand, from the viewpoint of hydrodynamics, the cooling fluid flowing from the inlet into the first flow guiding groove will diffuse due to the gradually expanding first guiding groove, and will not concentrate on one part as in the prior art. The heat dissipation group rebounds to cause turbulence, and the tapered second guide groove gradually gathers to increase the speed of the cooling fluid leaving the housing, so that the cooling fluid can enter the housing at a rate consistent with the distance from the housing. Increase the efficiency of the heat exchange module.
有關本創作之詳細說明及技術內容，將配合圖式說明如下，然而所附圖式僅作為說明用途，並非用於侷限本創作。 The detailed description and technical content of the present invention will be described below in conjunction with the drawings, but the drawings are for illustrative purposes only and are not intended to limit the present invention.
請參考第一圖至第五圖，本創作係提供一種具有均勻流道的液冷式熱交換模組(以下簡稱為「熱交換模組1」)。如第一圖所示，本創作的熱交換模組1係運用一冷卻流體而對一電路板100上的一電子發熱元件200進行導熱，熱 交換模組1具有供冷卻流體進出的一入口111及一出口112，入口111連接有一進水管310，出口112連接有一出水管320，出水管320的另一端連接至一循環幫浦300，循環幫浦300的另一端連接有一導管330，導管330的另一端連接到一散熱模組400，散熱模組400的另一端連接至該進水管310，如此夠成一條供冷卻流體循環的迴路。當熱交換模組1與電路板100上的電子發熱元件200進行熱交換之後，電子發熱元件200所產生的熱量會被熱交換模組1吸收，而進一步被熱交換模組1內的冷卻流體帶走，所以出水管320內的冷卻流體溫度較高。循環幫浦300將出水管320的冷卻流體抽回，並將此溫度較高的冷卻流體打入導管310內，進而輸送到散熱模組400內；冷卻流體進入散熱模組400之後，冷卻流體內所含的熱量會被散熱模組400吸收而溫度下降，此溫度下降的冷卻流體便經由進水管330離開散熱模組400而進入熱交換模組1，準備對該電子發熱元件200進行熱交換。以此方式，重複地對該電子發熱元件200持續進行導熱，而使電子發熱元件200的溫度得以保持在正常的工作範圍內。由於常用的冷卻流體為透明無色的水，所以在圖形中無法標示，僅在第六圖至第九圖中以虛線箭頭表示其流動方向，在此合先敘明。 Please refer to the first to fifth figures. The present invention provides a liquid-cooled heat exchange module (hereinafter referred to as "heat exchange module 1") having a uniform flow path. As shown in the first figure, the heat exchange module 1 of the present invention uses a cooling fluid to conduct heat to an electronic heating element 200 on a circuit board 100. The switch module 1 has an inlet 111 and an outlet 112 for the cooling fluid to enter and exit. The inlet 111 is connected to an inlet pipe 310. The outlet 112 is connected to an outlet pipe 320. The other end of the outlet pipe 320 is connected to a circulation pump 300. The other end of the pump 300 is connected to a conduit 330. The other end of the conduit 330 is connected to a heat dissipation module 400. The other end of the heat dissipation module 400 is connected to the inlet pipe 310, so that a loop for cooling fluid circulation is achieved. After the heat exchange module 1 exchanges heat with the electronic heating element 200 on the circuit board 100, the heat generated by the electronic heating element 200 is absorbed by the heat exchange module 1 and further cooled by the cooling fluid in the heat exchange module 1. It is carried away, so the temperature of the cooling fluid in the outlet pipe 320 is high. The circulation pump 300 withdraws the cooling fluid of the water outlet pipe 320, and drives the higher temperature cooling fluid into the conduit 310 to be transported into the heat dissipation module 400. After the cooling fluid enters the heat dissipation module 400, the cooling fluid is cooled. The heat contained therein is absorbed by the heat dissipation module 400 and the temperature is lowered. The cooling fluid whose temperature is lowered exits the heat dissipation module 400 through the inlet pipe 330 and enters the heat exchange module 1 to prepare for heat exchange of the electronic heating element 200. In this manner, the electronic heating element 200 is repeatedly thermally conducted repeatedly, and the temperature of the electronic heating element 200 is maintained within a normal operating range. Since the commonly used cooling fluid is transparent and colorless water, it cannot be marked in the figure, and the flow direction is indicated by a dotted arrow only in the sixth to ninth figures, which will be described first.
以下，將說明本創作的熱交換模組1之結構組成，熱交換模組1包括：一殼體10、一散熱組20、及一導流體30。 Hereinafter, the structural composition of the heat exchange module 1 of the present invention will be described. The heat exchange module 1 includes a casing 10, a heat dissipation group 20, and a fluid guide 30.
如第二圖與第三圖所示，殼體10為金屬材料製成且包括一上蓋11及一底板12，底板12直接貼附於電子發熱元件 200，而上蓋11係用以罩蓋並密封底板12，且使上蓋11與底板12之間具有供散熱組20、導流體30及冷卻流體容置的一空間。殼體10的上蓋11具有供冷卻流體進出的一入口111及一出口112，入口111設置於上蓋11的一隅角附近，從第二圖可以看出，入口111係位於上蓋11四個側表面的其中一側表面上且鄰近一隅角，且入口111呈扁矩形以配合殼體10內的導流體30之輪廓(這一點稍後會補充說明)。出口112則位於上蓋11的頂表面之中心處且朝上凸伸成一管狀部位，以利出水管320插接。此外，入口111及出口112的設置位置亦可以互相調換。 As shown in the second and third figures, the housing 10 is made of a metal material and includes an upper cover 11 and a bottom plate 12, and the bottom plate 12 is directly attached to the electronic heating element. 200, and the upper cover 11 is used to cover and seal the bottom plate 12, and a space between the upper cover 11 and the bottom plate 12 for accommodating the heat dissipation group 20, the fluid guide 30, and the cooling fluid. The upper cover 11 of the housing 10 has an inlet 111 for the entry and exit of the cooling fluid and an outlet 112. The inlet 111 is disposed near a corner of the upper cover 11. As can be seen from the second figure, the inlet 111 is located on the four side surfaces of the upper cover 11. One side of the surface is adjacent to a corner, and the inlet 111 has a flattened shape to fit the contour of the fluid guide 30 in the housing 10 (this will be explained later). The outlet 112 is located at the center of the top surface of the upper cover 11 and protrudes upward to form a tubular portion for the outlet pipe 320 to be inserted. In addition, the installation positions of the inlet 111 and the outlet 112 can also be interchanged.
散熱組20設置於殼體10的底板12上並熱接觸電子發熱元件200，因此底板12能夠將電子發熱元件200所產生的熱量傳導至散熱組20。散熱組20具有複數鰭片21，這些鰭片21彼此平行且相鄰二該鰭片21之間構成供冷卻流體流過的一微流道211(第六圖)，要特別注意的是這些微流道211的走向均一致，而使整個散熱組20形成一進水側Lin及一出水側Lout。 The heat dissipation group 20 is disposed on the bottom plate 12 of the casing 10 and thermally contacts the electronic heating element 200, so that the bottom plate 12 can conduct heat generated by the electronic heating element 200 to the heat dissipation group 20. The heat dissipation group 20 has a plurality of fins 21, and the fins 21 are parallel to each other and adjacent to the fins 21 to form a micro flow path 211 for flowing a cooling fluid (sixth figure). towards flow channel 211 are the same, the entire stack 20 is formed a cooling water inlet side and an outlet side L in L out.
導流體30設置於殼體10內，更明確地說，導流體30的外部輪廓大致等於上蓋11的內部輪廓，致使導流體30能放入上蓋11的內部而位於上蓋11與底板12之間。 The fluid guide 30 is disposed in the housing 10, and more specifically, the outer contour of the fluid guide 30 is substantially equal to the inner contour of the upper cover 11, so that the fluid guide 30 can be placed inside the upper cover 11 between the upper cover 11 and the bottom plate 12.
導流體30設有與入口111相通的一第一導流槽31、與出口112相通的一第二導流槽32、連通第一導流槽31與第二導流槽32之間並罩蓋該散熱組20的一容置槽33；更明確地說，在第二圖中，導流體30右側的一隅角附近對應於上蓋11的入口111開設有第一導流槽31，所以第一導流槽 31的起點之形狀對應上蓋11的入口111之形狀而呈扁矩形，第一導流槽31的終點則擴大而涵蓋整個散熱組20的進水側Lin，因此，第一導流槽31係從入口111朝容置槽33逐漸擴大。參考第六圖，由於第一導流槽31的起點呈扁矩形，有利於通過入口111的冷卻流體加速注入第一導流槽31內，同時第一導流槽31逐漸擴大且其終點涵蓋整個散熱組20的進水側Lin，所以從入口111進入第一導流槽31的冷卻流體能快速擴散而到達散熱組20的每一微流道211內，不會阻塞在第一導流槽31的起點附近，也不會在第一導流槽31的終點與散熱組20之間產生反彈並產生擾流。 The guiding fluid 30 is provided with a first guiding groove 31 communicating with the inlet 111, a second guiding groove 32 communicating with the outlet 112, communicating between the first guiding groove 31 and the second guiding groove 32, and covering a receiving groove 33 of the heat dissipation group 20; more specifically, in the second figure, a first guide groove 31 is opened corresponding to the inlet 111 of the upper cover 11 near a corner of the right side of the fluid guide 30, so the first guide the starting point for the shape of the flow channel 31 corresponding to the shape of the inlet 111 of the upper cover 11 and oblate rectangular end of the first guide groove 31 is enlarged to cover the entire cooling water inlet side group L in 20, and therefore, the first guide groove The 31 system gradually expands from the inlet 111 toward the accommodating groove 33. Referring to the sixth figure, since the starting point of the first guiding groove 31 is a flat rectangular shape, it is facilitated to accelerate the injection of the cooling fluid through the inlet 111 into the first guiding groove 31, while the first guiding groove 31 is gradually enlarged and the end point thereof covers the entire cooling water inlet side group L in 20, so the cooling fluid into the first guide groove 31 can be quickly spread from the inlet 111 to reach the 211, it does not block the first flow channel group for each micro-channel heat sink 20 Near the starting point of 31, no rebound occurs between the end point of the first deflector 31 and the heat dissipation group 20, and a spoiler is generated.
從第六圖可以看出，第二導流槽32的輪廓則與第一導流槽31呈相反對稱，第二導流槽32的起點涵蓋整個散熱組20的出水側Lout，以便收集所有散熱組20的每一微流道211內之冷卻流體；然後第二導流槽32逐漸收攏縮小而匯聚在導流體30的另一隅角附近，換句話說，第二導流槽32係從容置槽33朝該出口112逐漸縮小，第二導流槽32的逐漸縮小之設計能夠有助於離開散熱組20的冷卻流體之加速收集；如此一來，第一導流槽31與該第二導流槽32相對於殼體10及散熱組20係呈對角線配置，特過這樣的「斜進斜出」之對角線配置方式，可以使冷卻流體在相同底面積的導流體30(也可說是相同底面積的殼體10)中產生最大的流動路徑，藉此允許更多冷卻流體流過導流體30與散熱組20，而達到較佳的熱交換效果。 As can be seen from the sixth figure, the contour of the second guiding groove 32 is opposite to the first guiding groove 31, and the starting point of the second guiding groove 32 covers the water outlet side Lout of the entire heat dissipation group 20, so as to collect all Cooling fluid in each microchannel 211 of the heat dissipation group 20; then the second flow guiding groove 32 is gradually gathered and contracted to converge near the other corner of the fluid guiding body 30, in other words, the second guiding channel 32 is accommodating The slot 33 tapers toward the outlet 112, and the tapered design of the second deflector 32 can facilitate accelerated collection of cooling fluid exiting the heat pack 20; thus, the first deflector 31 and the second guide The flow cell 32 is arranged diagonally with respect to the casing 10 and the heat dissipation group 20, and the diagonal arrangement of the "slanting and oblique exit" is such that the cooling fluid can be in the same bottom area of the fluid guide 30 (also It can be said that the largest flow path is produced in the casing 10) of the same bottom area, thereby allowing more cooling fluid to flow through the flow guiding body 30 and the heat dissipation group 20, thereby achieving a better heat exchange effect.
從第四圖、第五圖及第七圖可以看出，第一導流槽31、 容置槽33及第二導流槽32係位於整個導流體30的下部且實質上與散熱組20處於同一平面，而在第二導流槽32的上方設有一緩衝集流槽34，此緩衝集流槽34分別連通第二導流槽32與出口112，緩衝集流槽34的起點設有與第二導流槽32相通的一缺口341，緩衝集流槽34的終點設有與出口112相通的一排水孔342。如第八圖所示，離開第二導流槽32的冷卻流體會朝上層從缺口341流入緩衝集流槽32內，並利用此緩衝集流槽32作為可供聚集的一大範圍緩衝區；然後，如第九圖所示，緩衝集流槽內的冷卻流體經由排水孔342而從出口112離開整個熱交換模組1。 As can be seen from the fourth, fifth and seventh figures, the first flow guiding groove 31, The accommodating groove 33 and the second guiding groove 32 are located at the lower portion of the entire guiding fluid 30 and substantially in the same plane as the heat dissipation group 20, and a buffer collecting groove 34 is disposed above the second guiding groove 32. The collecting groove 34 communicates with the second guiding groove 32 and the outlet 112 respectively. The starting point of the buffer collecting groove 34 is provided with a notch 341 communicating with the second guiding groove 32. The end point of the buffer collecting groove 34 is provided with the outlet 112. A drain hole 342 is connected. As shown in the eighth figure, the cooling fluid leaving the second flow guiding groove 32 flows into the buffer collecting groove 32 from the notch 341 toward the upper layer, and uses the buffer collecting groove 32 as a large-scale buffer for accumulating; Then, as shown in the ninth figure, the cooling fluid in the buffer collecting tank leaves the entire heat exchange module 1 from the outlet 112 via the drain hole 342.
再次參考第六圖，將說明本創作之第一導流槽31與第二導流槽32在幾何學設計上的特點。假設殼體10與導流體30均為正方形，且散熱組20亦為正方形且位於導流體30的中心，第一導流槽31與第二導流槽32相對於散熱組20的中心呈相反對稱。從第六圖可以看出，流經第一導流槽31最左側邊緣(最短邊)的一部分冷卻流體將會進入散熱組20最下方的微流道211，然後沿著第二導流槽32最左側邊緣(最長邊)流出；類似地，流經第一導流槽31最右側邊緣(最長邊)的一部分冷卻流體將會進入散熱組20最上方的微流道211，然後沿著第二導流槽32最右側邊緣(最短邊)流出。因此，由於整個形狀為正方形且左右相反對稱的緣故，上述二部分的冷卻流體所走的路徑雖然不同，但總長度卻相同，如此一來，不僅能充分運用散熱組20的每一微流道211，而且通過每一微流道211的該一部分冷卻流體所走的路徑長度均相同，故本創作確實達成均勻流道的效果，且防止冷卻流體在入口111端的擁擠 與擾流現象，更充分引導冷卻流體進入每一微流道211，而產生最佳的熱交換效果。 Referring again to the sixth figure, the geometric design of the first guide groove 31 and the second guide groove 32 of the present invention will be described. It is assumed that the housing 10 and the fluid guide 30 are both square, and the heat dissipation group 20 is also square and located at the center of the fluid guide 30. The first guide groove 31 and the second guide groove 32 are oppositely symmetric with respect to the center of the heat dissipation group 20. . As can be seen from the sixth figure, a portion of the cooling fluid flowing through the leftmost edge (the shortest side) of the first flow guiding groove 31 will enter the micro flow path 211 at the lowermost portion of the heat dissipation group 20, and then along the second flow guiding groove 32. The leftmost edge (longest side) flows out; similarly, a portion of the cooling fluid flowing through the rightmost edge (longest side) of the first flow guiding groove 31 will enter the micro flow path 211 at the uppermost portion of the heat dissipation group 20, and then along the second The rightmost edge (the shortest side) of the guide groove 32 flows out. Therefore, since the entire shape is square and the left and right are oppositely symmetrical, the paths of the cooling fluids of the above two parts are different, but the total length is the same, so that not only the micro flow path of the heat dissipation group 20 can be fully utilized. 211, and the path length of the cooling fluid taken by the portion of each microchannel 211 is the same, so the creation does achieve the effect of uniform flow and prevents the cooling fluid from being crowded at the inlet 111 end. With the phenomenon of spoiler, the cooling fluid is more fully guided into each microchannel 211 to produce an optimal heat exchange effect.
綜上所述，當知本創作已具有產業利用性、新穎性與進步性，又本創作之構造亦未曾見於同類產品及公開使用，完全符合新型專利申請要件，爰依專利法提出申請。 In summary, when Zhiben's creation has industrial applicability, novelty and progressiveness, and the structure of this creation has not been seen in similar products and public use, it fully complies with the requirements of new patent applications and applies for patent law.
1‧‧‧熱交換模組 1‧‧‧Heat Exchange Module
10‧‧‧殼體 10‧‧‧shell
11‧‧‧上蓋 11‧‧‧Upper cover
111‧‧‧入口 111‧‧‧ Entrance
112‧‧‧出口 112‧‧‧Export
12‧‧‧底板 12‧‧‧floor
20‧‧‧散熱組 20‧‧‧heating group
21‧‧‧鰭片 21‧‧‧Fins
211‧‧‧微流道 211‧‧‧microchannel
Lin‧‧‧進水側 L in ‧‧‧Inlet side
Lout‧‧‧出水側 L out ‧‧‧water side
30‧‧‧導流體 30‧‧‧Conducting fluid
31‧‧‧第一導流槽 31‧‧‧First guide channel
32‧‧‧第二導流槽 32‧‧‧Second guide channel
33‧‧‧容置槽 33‧‧‧ accommodating slots
34‧‧‧緩衝集流槽 34‧‧‧buffer collecting tank
341‧‧‧缺口 341‧‧‧ gap
342‧‧‧排水孔 342‧‧‧Drainage hole
100‧‧‧電路板 100‧‧‧ boards
200‧‧‧電子發熱元件 200‧‧‧Electronic heating element
300‧‧‧循環幫浦 300‧‧‧Circular pump
310‧‧‧進水管 310‧‧‧ water inlet
320‧‧‧出水管 320‧‧‧Outlet
330‧‧‧導管 330‧‧‧ catheter
400‧‧‧散熱模組 400‧‧‧ Thermal Module
第一圖係本創作之操作示意圖。 The first picture is a schematic diagram of the operation of this creation.
第二圖係本創作之分解立體圖。 The second picture is an exploded perspective view of the creation.
第三圖係本創作從另一角度看來之分解立體圖。 The third picture is an exploded perspective view of the present creation from another perspective.
第四圖係本創作之組合立體圖。 The fourth picture is a combined perspective view of the creation.
第五圖係本創作從底面看來之組合立體圖。 The fifth picture is a combined perspective view of the creation from the bottom.
第六圖係本創作之仰視圖。 The sixth picture is a bottom view of the creation.
第七圖係本創作之側視剖面圖，顯示冷卻流體流過散熱組之情形。 The seventh drawing is a side cross-sectional view of the creation showing the flow of cooling fluid through the heat sink.
第八圖係本創作之俯視圖。 The eighth picture is a top view of the creation.
第九圖係本創作之另一側視剖面圖，顯示冷卻流體流經出口之情形。 The ninth drawing is another side cross-sectional view of the present invention showing the flow of cooling fluid through the outlet.
1‧‧‧熱交換模組 1‧‧‧Heat Exchange Module
10‧‧‧殼體 10‧‧‧shell
11‧‧‧上蓋 11‧‧‧Upper cover
111‧‧‧入口 111‧‧‧ Entrance
112‧‧‧出口 112‧‧‧Export
12‧‧‧底板 12‧‧‧floor
20‧‧‧散熱組 20‧‧‧heating group
21‧‧‧鰭片 21‧‧‧Fins
211‧‧‧微流道 211‧‧‧microchannel
Lin‧‧‧進水側 L in ‧‧‧Inlet side
Lout‧‧‧出水側 L out ‧‧‧water side
30‧‧‧導流體 30‧‧‧Conducting fluid
31‧‧‧第一導流槽 31‧‧‧First guide channel
32‧‧‧第二導流槽 32‧‧‧Second guide channel
33‧‧‧容置槽 33‧‧‧ accommodating slots
34‧‧‧緩衝集流槽 34‧‧‧buffer collecting tank
341‧‧‧缺口 341‧‧‧ gap
342‧‧‧排水孔 342‧‧‧Drainage hole
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101215057U TWM445686U (en) | 2012-08-06 | 2012-08-06 | Liquid-cooled heat exchange module with uniform stream channel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101215057U TWM445686U (en) | 2012-08-06 | 2012-08-06 | Liquid-cooled heat exchange module with uniform stream channel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM445686U true TWM445686U (en) | 2013-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101215057U TWM445686U (en) | 2012-08-06 | 2012-08-06 | Liquid-cooled heat exchange module with uniform stream channel |
Country Status (1)
| Country | Link |
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| TW (1) | TWM445686U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI558971B (en) * | 2015-01-30 | 2016-11-21 | 訊凱國際股份有限公司 | Liquid-cooled-type heat-dissipating structure and method of manufacturing the same |
| TWI570381B (en) * | 2013-09-24 | 2017-02-11 | 菲爾科技股份有限公司 | Bonded fluid heat exchanging apparatus |
-
2012
- 2012-08-06 TW TW101215057U patent/TWM445686U/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI570381B (en) * | 2013-09-24 | 2017-02-11 | 菲爾科技股份有限公司 | Bonded fluid heat exchanging apparatus |
| TWI558971B (en) * | 2015-01-30 | 2016-11-21 | 訊凱國際股份有限公司 | Liquid-cooled-type heat-dissipating structure and method of manufacturing the same |
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