M439890 五、新型說明： 【新型所屬之技術領域】 [0001] 本創作係涉及一種熱管結構，特別涉及一種對電子元件 散熱之熱管結構，本創作還涉及一種具有該熱管結構之 散熱模組及使用該散熱模組之電子裝置。 【先前技術】 [0002] 隨著科技的曰新月異，電子元件的功率與效能日益提升 ，連帶地在操作時也產生更多的熱量；倘若這些熱量未 能及時散逸出去而累積於該電子元件的内部，將會導致 該電子元件的溫度升高且影響其效能，甚至嚴重者將導 致該電子元件故障損壞。所以業界為了有效解決電子元 件散熱的問題，便陸續提出具有導熱效能較佳的均溫板 (Vapor chamber)及薄型化之熱管（Heat pipe)， 並將其可與散熱器做搭配組合，以有效解決現階段的散 熱問題。 目前薄型化之熱管結構，其係於圓管口徑的熱管内之中 空部分填入金屬粉末，並透過燒結之方式於該薄型熱管 之内壁形成一環狀的毛細結構，其後將該薄型熱管抽真 空並填充工作流體，最後封閉壓扁以成就薄型化之熱管 結構；然而由於所述毛細結構係佈滿該薄型扁平熱管之 腔室表面，當工作流體由蒸發部受熱蒸發後擴散至該冷 凝端，並該工作流體於該蒸發部係為汽態，由該蒸發部 離開後向該冷凝端擴散時逐步受冷卻冷凝轉換為液態， 並且再透過毛細結構回流至該蒸發部；另外，由於該薄 型扁平熱管之腔室因受壓扁處理而造成熱管腔室空間極 ΗΗ2Π55#單編號 A〇101 第3頁/共34頁 1012037056-0 M439890 為狹隘，致使汽態易受液態之阻礙無法順暢及快速至冷 凝端進行冷卻散熱。 再者，因設於冷凝端之毛細結構於冷凝端造成壓力阻抗 ，令汽態工作流體循環效率降低，造成部分液態之工作 流體滯留於該冷凝端而產生無法回流至蒸發部之現象進 而使熱管之熱傳導效率降低。 另外，所述習知薄型化之熱管於製造上均為固定管徑（ 亦即熱管之管身皆為相同之直徑），無法依照使用者所 欲的需求設計形狀及管徑大小（如一端大徑一端小徑或 二端等徑中間漸大或漸細），且因熱管内之毛細結構係 為固定均勻環狀設置，致使當對所述薄型化熱管之形狀 做改變（如彎曲或凹折狀）時，會使薄型化熱管内部環狀 毛細結構（即燒結之金屬粉末）受到彎折擠壓，而致使該 薄型熱管之毛細結構於撥壓處脫落，故令該薄型熱管之 熱傳效能大幅降低；此外，由於該薄型化熱管係僅具有 環狀之毛細結構，並無其他可變化設計性，致使其在壓 扁薄化時，亦因該環狀毛細結構之上下層壓疊，造成厚 度增加而無法將熱管壓扁薄化至最低程度，薄化效果有 限。 而習知均溫板（vapor chamber)係包括呈矩型狀之 殼體及其殼體内部腔室壁面的毛細結構，且該殼體内部 填充有工作流體，並該殼體的一側（即蒸發區）係貼設在 一發熱元件（如中央處理器、南北橋晶片）上吸附該發熱 元件所產生之熱量，使液態之工作流體於該殼體之蒸發 區產生蒸發轉換為汽態，將熱量傳導至該殼體之冷凝區 ，該汽態之工作流體於冷凝區受冷卻後冷凝為液態，該 10121155^^^^ A〇101 第4頁/共34頁 1012037056-0 M439890 液態之工作流體再透過重力或毛細結構回流至蒸發區繼 續汽液循環，以有效達到均溫散熱之效果。 雖習知均溫板可達到均溫的效果，但卻延伸出另一問 題，即均溫板的傳熱方式是由其一側吸附熱量後，藉由 腔室内的工作流體之汽液相變化傳導另一侧，換言之， 就是均溫板僅是藉由一側面積吸附熱量傳導至相對另一 側面積藉以達到均溫效果，但卻無法具有像熱管一樣的 傳熱方式，可將吸附的熱量傳導至遠端進行散熱，因此 ，使得均溫板僅限於適合應用大面積的均勻導熱，而不 • 適合拿來應用於遠端導熱。 【新型内容】 [0003] 本創作之一目的，係提供一種提升熱傳效能之熱管結構 本創作之一目的，係提供一種降低熱阻值（thermal resistance )之熱管結構。 本創作之一目的，係提供一種提升抗重力熱傳效能之熱 管結構。 本創作之一目的 管結構。 本創作之一目的 熱管結構。 本創作之一目的 係提供一種提升冷凝部結構強度之熱 係提供一種減少熱管内異音發生率之 係提供一種利用該熱管之散熱單元， 及使用該散熱單元之電子裝置。 為達上述各目的，本創作一實施係提供一種熱管結構， 包括：一管體，包含兩封閉端及一蒸發部與一冷凝部； 該蒸發部，具有一第一外表面界定一第一厚度，一第一 1012Π55#單編號 A〇101 第5頁/共34頁 1012037056-0 M439890 内表面及一第一毛細結構環設形成在該第一内表面，並 界定一第一流道；該冷凝部，具有一第二外表面界定一 第二厚度小於該第一外表面之第一厚度，及一第二内表 面界定至少一第一側相對一第二側，且局部設有一或數 個第二毛細結構在該第一側及該第二側之間，該一或數 個第二毛細結構連接該第一侧及該第二側，並界定一或 數個第二流道在該第一側及該第二側之間，且連通該第 —流道。 本創作另一實施係提供一種散熱模組係具有上述的熱管 結構，該散熱模組包含：複數鰭片，係相鄰地連接，一 流道係界定在各相鄰鰭片之間，前述冷凝部係串連該等 鰭片。 本創作另一實施係提供一種電子裝置，.係利用上述的散 熱模組對一發熱源散熱，該散熱模組之熱管的蒸發部係 接觸該發熱源，令蒸發部的工作流體汽液循環將發熱源 的熱量傳遞至冷凝部並經由該複數鰭片散熱。 前述第一内表面為光滑面或設有複數溝槽，且該蒸發部 的管體形狀係為圓形、半圓形、D字型或平板狀。 前述第二内表面為光滑面或設有複數溝槽或設有鍍膜， 且該冷凝部的管體形狀係為扁平狀。 前述第一流道的面積大於該一或數個第二濟道的面積或 面積總和。 前述第一毛細結構及該第二毛細結構係為粉末燒結（ powder-sintering)或網格（mesh)或纖維（fiber )° 前述第二内表面更界定一第三側相對該第四側，該一第 1012U5#單编號删1 第6頁/共34頁 1012037056-0 M439890 第一流道界定在該第二 二毛細結構緊鄰該第三側，該— 毛細結構與該第四側之間。 則迷第二内表面更界定_第三側相對該第四側，該一第 一毛細結構設在該第三側與第四側實質上中間處複數 第-流道分別界定在該第二毛細結構與該第三側之間及 該第二毛細結構與該第四侧之間。 前述第二絲面更界定—第三側相對該第四側，該複數 第-毛細結構間隔設在該第三側與該第四側之間，且其M439890 V. New description: [New technology field] [0001] The present invention relates to a heat pipe structure, in particular to a heat pipe structure for dissipating heat of an electronic component, and the present invention also relates to a heat dissipation module having the heat pipe structure and using the same The electronic device of the heat dissipation module. [Prior Art] [0002] With the rapid development of technology, the power and efficiency of electronic components are increasing, and more heat is generated during operation; if these heats are not dissipated in time, they accumulate in the electrons. The inside of the component will cause the temperature of the electronic component to rise and affect its performance, and even severely, the electronic component will be damaged. Therefore, in order to effectively solve the problem of heat dissipation of electronic components, the industry has successively proposed a Vapor chamber with a better thermal conductivity and a thinned heat pipe, which can be combined with a heat sink to effectively Solve the current heat dissipation problem. At present, the thinned heat pipe structure is filled with metal powder in a hollow portion of the heat pipe of the circular pipe diameter, and an annular capillary structure is formed on the inner wall of the thin heat pipe by sintering, and then the thin heat pipe is pumped. Vacuuming and filling the working fluid, and finally sealing and flattening to achieve a thinned heat pipe structure; however, since the capillary structure is filled with the surface of the thin flat heat pipe, when the working fluid is evaporated by the evaporation portion, the diffusion is diffused to the condensation end. And the working fluid is in a vapor state in the evaporation portion, and is gradually cooled and condensed into a liquid state by the evaporation portion when it is separated from the evaporation portion, and is again returned to the evaporation portion through the capillary structure; and, because of the thin shape The chamber of the flat heat pipe is caused by the flattening process, and the space of the heat pipe chamber is extremely ΗΗ2Π55#单号A〇101 Page 3/34 pages 1012037056-0 M439890 is narrow, which makes the vapor state vulnerable to liquidity and cannot be smoothed. Cool to the condensing end for cooling and cooling. Furthermore, since the capillary structure provided at the condensation end causes a pressure impedance at the condensation end, the circulation efficiency of the vapor working fluid is lowered, and a part of the liquid working fluid is retained at the condensation end to cause a phenomenon that the flow cannot be returned to the evaporation portion, thereby causing the heat pipe. The heat transfer efficiency is lowered. In addition, the conventional thinned heat pipes are manufactured in a fixed pipe diameter (that is, the pipes of the heat pipes are all the same diameter), and the shape and the pipe diameter cannot be designed according to the needs of the user (for example, one end is large). The diameter of one end of the diameter is gradually increased or tapered in the middle of the two ends, and the capillary structure in the heat pipe is fixedly and uniformly arranged in an annular shape, so that the shape of the thinned heat pipe is changed (such as bending or concave folding). In the case of the shape, the inner annular capillary structure (ie, the sintered metal powder) of the thinned heat pipe is bent and pressed, so that the capillary structure of the thin heat pipe is detached at the pressure, so that the heat transfer efficiency of the thin heat pipe is made In addition, since the thinned heat pipe has only a ring-shaped capillary structure, there is no other changeable design, so that when the flattening and thinning are performed, the annular capillary structure is laminated on top of the ring. The thickness is increased and the heat pipe cannot be flattened to a minimum, and the thinning effect is limited. The conventional vapor chamber includes a capillary structure in a rectangular shape and a wall surface of the inner chamber of the housing, and the inside of the housing is filled with a working fluid, and one side of the housing (ie, The evaporation zone is attached to a heating element (such as a central processing unit, a north-south bridge wafer) to adsorb heat generated by the heating element, so that the liquid working fluid is evaporated into a vapor state in the evaporation zone of the casing, and The heat is conducted to the condensing zone of the casing, and the vaporous working fluid is condensed into a liquid state after being cooled in the condensing zone. The liquid working fluid is condensed into a liquid state, which is 10121155^^^^ A〇101, 4th page, total 34 pages 1012037056-0 M439890 Then through the gravity or capillary structure back to the evaporation zone to continue the vapor-liquid circulation, in order to effectively achieve the effect of uniform temperature heat dissipation. Although it is known that the average temperature plate can achieve the effect of uniform temperature, it extends another problem, that is, the heat transfer mode of the uniform temperature plate is caused by the vapor-liquid phase change of the working fluid in the chamber after the heat is absorbed by one side. Conducting the other side, in other words, the temperature equalizing plate only conducts the heat transfer effect by adsorbing heat on one side to the other side, but does not have the same heat transfer mode as the heat pipe, and can absorb the heat. Conducted to the far end for heat dissipation, thus making the temperature equalization plate limited to a uniform heat transfer suitable for a large area, and not suitable for remote thermal conduction. [New Content] [0003] One of the purposes of this creation is to provide a heat pipe structure that enhances heat transfer efficiency. One of the purposes of this creation is to provide a heat pipe structure that reduces thermal resistance. One of the purposes of this creation is to provide a heat pipe structure that enhances the efficiency of anti-gravity heat transfer. One of the purposes of this creation is the tube structure. One of the purposes of this creation is the heat pipe structure. One of the aims of the present invention is to provide a heat system for improving the structural strength of a condensing portion, and to provide a heat dissipating unit using the heat pipe and an electronic device using the heat dissipating unit. In order to achieve the above objectives, an embodiment of the present invention provides a heat pipe structure comprising: a tube body including two closed ends and an evaporation portion and a condensation portion; the evaporation portion having a first outer surface defining a first thickness , a first 1012 Π 55 # 单号 A 〇 101 page 5 / a total of 34 pages 1012037056-0 M439890 inner surface and a first capillary structure ring formed on the first inner surface, and defines a first flow channel; the condensation portion Having a second outer surface defining a second thickness that is less than the first thickness of the first outer surface, and a second inner surface defining at least one first side opposite the second side, and having one or more second portions a capillary structure between the first side and the second side, the one or more second capillary structures connecting the first side and the second side, and defining one or more second flow channels on the first side And between the second side and communicating with the first flow channel. Another embodiment of the present invention provides a heat dissipation module having the above-described heat pipe structure. The heat dissipation module includes: a plurality of fins connected adjacently, and a first-class channel is defined between adjacent fins, and the condensation portion is The fins are connected in series. Another implementation of the present invention provides an electronic device that uses the above-mentioned heat dissipation module to dissipate heat from a heat source. The evaporation portion of the heat pipe of the heat dissipation module contacts the heat source, so that the working fluid vapor-liquid circulation of the evaporation portion will be The heat of the heat source is transferred to the condensing portion and dissipated through the plurality of fins. The first inner surface is a smooth surface or a plurality of grooves, and the shape of the tube of the evaporation portion is circular, semi-circular, D-shaped or flat. The second inner surface is a smooth surface or is provided with a plurality of grooves or a plating film, and the shape of the tube of the condensation portion is flat. The area of the first flow passage is larger than the sum of the area or area of the one or more second passages. The first capillary structure and the second capillary structure are powder-sintering or mesh or fiber. The second inner surface further defines a third side opposite to the fourth side. A 1012U5# single number deletion 1 page 6 / total 34 page 1012037056-0 M439890 The first flow path is defined between the second two capillary structure adjacent to the third side, between the capillary structure and the fourth side. The second inner surface is further defined—the third side is opposite to the fourth side, and the first capillary structure is disposed substantially at the middle of the third side and the fourth side, and the plurality of first-flow passages are respectively defined in the second capillary The structure is between the third side and the second capillary structure and the fourth side. The second filament surface is further defined—the third side is opposite to the fourth side, and the plurality of first capillary structures are spaced between the third side and the fourth side, and
中-第—毛細結構緊鄰該第三側另—第二毛細結構緊 鄰該第四側’另-第二毛細結構設在該第三側與第四側 實質上中間處’複數第二流道分別界定在該相鄰兩第二 毛細結構之間。 本創作之上述目的及其結構與功能上的特性將依據所 附圖式之較佳實施例予以說明。 【實施方式】 [0004]請參閱第1至3B圖，係為本創作熱管結構之示意圖，如圖 所示包括一營體10，該管體包括一第一封閉端11、一第 二封閉端12、一蒸發部13a及一冷凝部14。 一併參閱第4A圖所示，係為第2圖之A-A剖視示意圖，該 蒸發部13a，係定義在實質靠近該第一封閉端處丨丨，具有 一第一外表面131a及一第一内表面132a，該第一外表面 131a界定一第一厚度fAl (如第3A圖及4A圖中的延伸線 所示）’ s亥第·一厚度fAl的定義將在後面詳述。該第一外 表面131a上形成一第一毛細結構133a，該第一毛細結構 133a係連續或非連續狀的環設於該第一内表面132a上， 並界定一第一流道134a。 1012037056-0 1(j121155f單編號A0101 第7頁/共34頁 M439890 一併參閱第6 A圖所示，係為第2圖之B_B剖視示意圖，該 冷凝部14，係定義在實質靠近該第二封閉端12處，具有 一第二外表面141及一第二内表面142，該第二外表面 141界疋一第二厚度fB (如第3A圖及第6 A圖中延伸線所 不）小於該第一外表面13la之第一厚度fA1，該第二厚度 fB的定義將在後面詳述。 該第二内表面142界定至少一第一侧丨421相對一第二側 1422及一第二側1423相對一第四側1424，該冷凝部142 局部設有一第二毛細結構143a »前述第二毛細結構143a 係位於該第一側1421及該第二側1422之間，並連接該第 一側1421及該第二側1422且連接該第三側1423，更界定 一第二流道144a在該第一側1421及該第二側1422之間， 並連通該第一流道134a。 如第3B圖所示，該冷凝部142之第二毛細結構143a具有 一自由端1431a朝該第二封閉端12延伸，且一無毛細結構 空間14 5界定在該自由端14 31 a與該第二封閉端12之間， 連通該第二流道144a。前述無毛細結構空間145係令傳遞 至冷凝部14的汽態的工作流體迅速凝結成液體的工作流 體。 前述蒸發部13a及冷凝部14之具體實施詳述如後： 如第4A圖所示’前述的蒸發部13a的第一内表面132a係 為光滑面且形狀係為圓形。另外，在另一具體可行的實 施中，如第4B圖所示，該蒸發部13b係為半圓形，且具有 一第一外表面131b及一第一内表面132b，該第一外表面 Ϊ311)具有一平面1311b ’並界定一第一厚度fA2。該第一 内表面132b上形成一第一毛細結構133b，該第一毛細結 1〇121155户·單編號ΑΟίοι 第8頁/共34頁 1012037056-0 M439890 構1 33b係連續或非連續狀的環繞該第一内表面132b上， 並界定一第一流道134b。 另外，在另一具體可行實施中，如第4C圖所示，該蒸發 部13c係為平板狀，且具有一第一外表面131(；及一第—内 表面132c，該第一外表面131c具有一第一平面1311(：及 一第一平面1312c，並界定一第一厚度fA3。該第一内表 面132c上形成一第一毛細結構133c，該第一毛細結構 133c係連續或非連續狀的環繞該第一内表面131c，並界 定一第一流道134c。 再者，在一具體實施中，如第5 A圖所示，該蒸發部i3d 具有一第一外表面131 d及一第一内表面13 2d。該第一内 表面132d設有複數溝槽，令該第一内表面132d為複數凹 凸構形，一第一毛細結構133d係連續或非連續狀的環繞 形成在該第一内表面132d上，並界定一第一流道I34d。 在本具體實施中該第一外表面131d界定的厚度與前述第 4A圖相同，將一併在後詳述。 另外’在另一具體可行實施，如第5 B圖所示，該蒸發部 13e係為半圓形，且具有一第一外表面i31e及一第一内表 面132e，該第一外表面l31e具有一平面1311e。該第一 内表面131e設有複數溝槽，令該第一内表面I32e為複數 凹凸構形。一第一毛細結構133e係連續或非連續狀的環 繞形成在該第一内表面132e上，並界定一第一流道134e 。在本具體實施中該第一外表面131e界定的厚度與前述 第4 B圖相同，將一併在後詳述》 另外，在另一具體可行實施，如第5 C圖所示，該蒸發部 13f係為平板狀，且具有一第一外表面i3lf及一第一内表 10121155^^^^ A0101 第9頁/共34頁 1012037056-0 M439890 面132f，該第一外表面I31f具有一第一平面i311f及一 第二平面1312f。該第一内表面i32f設有複數溝槽，令 該第一内表面132f為複數凹凸構形。一第一毛細結構 133f係連續或非連續狀的環繞形成在該第一内表面132f 上，並界定一第一流道134f。在本具體實施中該第一外 表面131f界定的厚度與前述第4C圖相同，將一併在後詳 述0 如第6A圖所示，前述的冷凝部14的形狀係為扁平狀，該 第二外表面141具有一上平面1411及一下平面1412，該 第二内表面142係為光滑面，該第二毛細結構143a係連接 該第一側1421及該第二側1422及該第三側1423 , —第二 流道144a被界定在該第二毛細結構143a與該第四側1424 之間。 另外，在另一具體可行實施，如第6B圖所示，一第二毛 細結構143b設在該第三側1423與第四側1424的實質上中 間處，且連接該第一側1421及該第二側1422，兩個第二 流道144b分別被界定在該第二毛細結構“肋與該第三側 1423之間及該第二毛細結構143b與該第四側1424之間。 另外，在另一具體可行實施，如第6C圖所示，複數第二 毛細結構143c間隔設在該第三側1423與該第四側1424之 間，並連接該第一側1421及該第二側1422，且其中一第 二毛細結構143c連接該第三側1423 ,另一第二毛細結構 143c連接該第四侧1424，另一第二毛細結構U3c設在該 第三側1423與第四侧1424實質上中間處’兩個第二流道 144c分別界定在該相鄰兩第二毛細結構14託之間。 續如第6D、6E及6F圖所示，這些圖式與前述第心咖 10121155^單编號A0101 第10頁/共34頁 1012037056-0 M439890 式描述的結構大致上相同，茲不再贅述相同之處，惟其 不同處在於該第二内表面142設有複數溝槽1425。 再者，前述第二毛細結構143a至143c之數量不侷限於上 述幾種狀態，可以視管體之冷凝部14的寬度、傳導效 率以及汽液循環效率的需求設定數量。 前述的第一毛細結構133a至133f及第二毛細結構1433至 143c，具有導流能力，提供更多的回流通道（channei) ’其中該第二毛細結構143a至143c因為連接在冷凝部14 第一側1421及第二側1422之間，對於厚度較小且為扁平 狀的冷凝部14而言更具有支撺的功效，以防止冷凝部14 凹陷，該第一毛細結構133a至133f及第二毛細結構143& 至143c具體係為粉末燒結（p0Wder_sintering)或網 格（mesh)或纖維（fiber)或前述的加總。再者前述 第一毛細結構133a〜133f的體積大於第二毛細結構143a 至143c的體積。 以下將詳述各第一厚度fAl、fA2、fA3與該第二厚度fB 的定義： 復參閱第4 A及5A圖所示，由於該蒸發部133、13d的形 狀係為圓形，因此該第一厚度fA1係為第一外表面1313、 131d的最大外徑的長度。 請復參閱第4 B及5B圖所示’由於該蒸發部131)、136的 形狀係為半圓形，因此該第一厚度fA2係為第一外表面 131b、131e的最大半徑的長度》 請復參閱第4 C及5C圖所示，由於該蒸發部13(：、13e的 形狀係為平板狀’因此該第一厚度fA2係為第一外表面 131c、131f的第一平面1311c、1311【與第二平面1312(： 10121155卢單、編號 A0101 第11頁/共34頁 1012037056-0 M439890 、】312f之間的最大長度β 請復參閲第6 Α至6F圖所示，由於該冷凝部〗4的形狀係 為扁平狀，因此該第二厚度fB係為該第二外表面14】之上 平面1411與下平面〗41 2之間的最大長度。 前述的第一厚度fA1、fA2&fA3例如但不限制，大於等 於3mm ;前述的第二厚度fB例如但不限制，小於等於 2. 5mm。 再者前述的第一流道134a至134f的面積大於該一個第二 流道144a的面積或數個第二流道1441)、U4c的面積總和 〇 。月續參照第7A及7B圖所示，係顯示一散熱單元2〇，包括 複數鰭片21相鄰達接，一流道211係界定在兩相鄰鰭片21 之間，每一鰭片21設置至少一透孔212。令前述管體1〇的 冷凝部14貫穿該等透孔212，以令該等鰭片21串接該冷凝 部14。 其中該冷凝部14與散熱單元2〇之複數鰭片21連接的方式 不限於上述方式，例如冷凝部14直接貼設該散熱單元2〇 之複數鰭片21，或者該散熱單元2〇之複數鰭片21設有嵌 槽供該冷凝部14對應嵌合的方式。 請續參照第8A、8B圖所示，係顯示一電子設備3〇，例如 一電路板其上設有一發熱源31 (如第8B圖所示），例如 為CPU或MCU或南北橋晶片或通信微處理器等。將前述的 散熱單tc20設在該電子設備3〇上，且令該管體1〇的蒸發 部13a藉由-ϋ定件32ϋ定在該發熱源31上並與該發熱源 31接觸，令在蒸發部⑴的卫作流體汽液循環將發熱源31 的熱量傳遞至冷凝部14經由該複數韓片21散熱。 1012037056-0 10121155+單编號删1 第12頁/共34頁 M439890 以下將以上述一實施來詳細描述該熱管結構的運作： 本創作在實際使用時，管體10内充填有利於蒸發散熱之 工作流體例如但不限制為純水、無機化合物、醇類、酮 類、液態金屬、冷煤、有機化合物或其混合物。 當發熱源31產生熱量時，前述熱量傳導到該管體10之蒸 發部13a，透過該管體10的蒸發部13a其内液態之工作流 體吸收熱量而產生蒸發，以轉換為汽態之工作流體，汽 態之工作流體傳導至該冷凝區14，隨著汽態之工作流體 熱量也傳遞至冷凝部14，藉由鰭片21對外擴散散熱，隨 ® 著熱量的降低，汽態之工作流體迅速轉回液態之工作流 體，並藉由該第一毛細結構133a及該第二毛細結構143a 迅速回流至該蒸發部13a而繼續汽液循環。 由於管體10之蒸發部13a的第一厚度fAl大於冷凝部 14的第二厚度fB，且第一流道134a的面積大於該第二流 道144a的面積，提供一較大空間令蒸發部13a的工作流體 可迅速從液態轉換為汽態，且汽態的工作流體在第一流 道143a的内的移動速度較快。由於冷凝部14的第二流道 ® 144a的面積較小，則會產生較大之熱阻抗（thermal resistance)，不利於將汽態的工作流體將熱量傳遞至 冷凝部14，藉由第一及第二毛細結構133a、143a的設置 可有效降低管内之熱阻抗，促使液態之工作流體迅速回 流至蒸發部13a，以有效加快汽液循環效率，提升抗重力 熱傳效能。 再者，藉由該第一毛細結構133a環繞形成在該蒸發部 13a的第一内表面132a，配合該第二毛細結構143a設置 在冷凝部14的第二内表面142的第一側1421及第二側 10121155#單編號 A0101 第13頁/共34頁 1012037056-0 M439890 1422之間，減少汽態工作流體往冷凝部14流動時產生的 異音。 綜上所述本創作的熱管結構具有以下優點： 1 ·提升熱傳效能》 2·降低管體内的熱阻值（thermal resistance ) ° 3. 提升抗重力熱傳效能’也就是熱量可以長距離的傳遞 ’換言之就是管體的長度可以延伸更長。 4. 提升冷凝部結構強度。 5. 減少管體内異音發生率。 然本創作以實施方式揭露如上，然其並非用以限定本創 作，任何熟悉此技藝者，在不脫離本創作的精神和範圍 内，當可作各種的更動與潤飾，因此本創作之保護範圍 當視後附的申請專利範圍所定者為準。 【圖式簡單說明】 [0005]第1圖係為本創作熱管結構之立體示意圖； 第2圖係為本創作熱管結構之俯視示意圖； 第3A圖係為本創作熱管結構之側視示意圖； 第3B圖係為本創作冷凝部局部剖視示意圖； 第4A圖係為本創作第2圖之A-A剖面示意圖； 第4B圖係為本創作蒸發部另一態樣之示意圖，· 第4C圖係為本創作蒸發部另一態樣之示意圖； 第5A圖係為本創作蒸發部另一態樣之示意圖； 第5B圖係為本創作蒸發部另一態樣之示意圓； 第5C圖係為本創作蒸發部另一態樣之示意圖； 第6A圖係為本創作第2圖之B_B剖面示意圖；The middle-first capillary structure is adjacent to the third side, the second capillary structure is adjacent to the fourth side, and the other second capillary structure is disposed substantially at the middle of the third side and the fourth side. Defined between the adjacent two second capillary structures. The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings. [Embodiment] [0004] Please refer to Figures 1 to 3B, which is a schematic view of the structure of the heat pipe of the present invention. As shown, the utility model comprises a battalion 10 comprising a first closed end 11 and a second closed end. 12. An evaporation portion 13a and a condensation portion 14. Referring to FIG. 4A, which is a schematic cross-sectional view taken along line AA of FIG. 2, the evaporation portion 13a is defined substantially at the first closed end, and has a first outer surface 131a and a first The inner surface 132a defines a first thickness fAl (as indicated by the extension lines in FIGS. 3A and 4A). The definition of the first thickness fAl will be described in detail later. A first capillary structure 133a is formed on the first outer surface 131a. The first capillary structure 133a is continuous or discontinuously disposed on the first inner surface 132a and defines a first flow path 134a. 1012037056-0 1 (j121155f single number A0101 page 7 / total 34 pages M439890 See also figure 6A, which is a schematic cross-sectional view of B_B of Fig. 2, the condensation portion 14 is defined substantially in the first The second closed end 12 has a second outer surface 141 and a second inner surface 142. The second outer surface 141 defines a second thickness fB (as shown in the extension lines in FIGS. 3A and 6A). The second thickness fB is defined as will be described later. The second inner surface 142 defines at least one first side 421 opposite to a second side 1422 and a second. The side 1423 is opposite to the fourth side 1424. The condensation portion 142 is partially provided with a second capillary structure 143a. The second capillary structure 143a is located between the first side 1421 and the second side 1422 and is connected to the first side. 1421 and the second side 1422 are connected to the third side 1423, further defining a second flow path 144a between the first side 1421 and the second side 1422 and communicating with the first flow path 134a. As shown, the second capillary structure 143a of the condensation portion 142 has a free end 1431a extending toward the second closed end 12, and A capillary-free structural space 14 5 is defined between the free end 14 31 a and the second closed end 12 and communicates with the second flow path 144 a. The aforementioned capillary-free structural space 145 is configured to transfer the vapor to the condensation portion 14 . The working fluid is rapidly condensed into a liquid working fluid. The specific implementation of the evaporation portion 13a and the condensing portion 14 is as follows: As shown in Fig. 4A, the first inner surface 132a of the aforementioned evaporation portion 13a is smooth and shaped. In another practical implementation, as shown in FIG. 4B, the evaporation portion 13b is semi-circular and has a first outer surface 131b and a first inner surface 132b. The first outer surface Ϊ 311) has a flat surface 1311b' and defines a first thickness fA2. A first capillary structure 133b is formed on the first inner surface 132b, and the first capillary node is 〇121155 single-number ΑΟίοι Page 8/34 pages 1012037056-0 M439890 Structure 1 33b is continuous or non-continuous surround The first inner surface 132b defines a first flow channel 134b. In addition, in another specific implementation, as shown in FIG. 4C, the evaporation portion 13c is flat and has a first outer surface 131 (; and a first inner surface 132c, the first outer surface 131c Having a first plane 1311 (and a first plane 1312c) and defining a first thickness fA3. The first inner surface 132c defines a first capillary structure 133c, which is continuous or discontinuous. Surrounding the first inner surface 131c and defining a first flow path 134c. In a specific implementation, as shown in FIG. 5A, the evaporation portion i3d has a first outer surface 131 d and a first The inner surface 13 2d. The first inner surface 132d is provided with a plurality of grooves, such that the first inner surface 132d has a plurality of concave and convex configurations, and a first capillary structure 133d is continuously or discontinuously formed around the first inner surface. A first flow path I34d is defined on the surface 132d. The thickness of the first outer surface 131d is the same as that of the aforementioned 4A, and will be described in detail later. In addition, in another specific implementation, As shown in FIG. 5B, the evaporation portion 13e is semicircular. The first outer surface i31e and the first inner surface 132e have a flat surface 1311e. The first inner surface 131e is provided with a plurality of grooves, and the first inner surface I32e has a plurality of concave and convex configurations. A first capillary structure 133e is formed continuously or discontinuously around the first inner surface 132e and defines a first flow path 134e. In the present embodiment, the first outer surface 131e defines a thickness and the foregoing 4B is the same and will be described later in detail. In addition, in another concrete implementation, as shown in FIG. 5C, the evaporation portion 13f is flat and has a first outer surface i3lf and a first The first outer surface I31f has a first plane i311f and a second plane 1312f. The first inner surface i32f is provided with an inner surface 10121155^^^^ A0101 page 9/34 page 1012037056-0 M439890 surface 132f. The plurality of grooves are such that the first inner surface 132f has a plurality of concave and convex configurations. A first capillary structure 133f is continuously or discontinuously formed on the first inner surface 132f and defines a first flow path 134f. The thickness defined by the first outer surface 131f in this embodiment As shown in the above-mentioned 4C, as will be described later in detail, as shown in FIG. 6A, the aforementioned condensation portion 14 has a flat shape, and the second outer surface 141 has an upper plane 1411 and a lower plane 1412. The second inner surface 142 is a smooth surface. The second capillary structure 143a connects the first side 1421 and the second side 1422 and the third side 1423. The second flow path 144a is defined in the second capillary. Structure 143a is between the fourth side 1424. In addition, in another specific implementation, as shown in FIG. 6B, a second capillary structure 143b is disposed substantially at the middle of the third side 1423 and the fourth side 1424, and connects the first side 1421 and the first Two sides 1422, two second flow channels 144b are respectively defined between the second capillary structure "the rib and the third side 1423 and between the second capillary structure 143b and the fourth side 1424. In addition, in another a specific implementation, as shown in FIG. 6C, a plurality of second capillary structures 143c are spaced between the third side 1423 and the fourth side 1424, and connect the first side 1421 and the second side 1422, and One of the second capillary structures 143c is connected to the third side 1423, the other second capillary structure 143c is connected to the fourth side 1424, and the other second capillary structure U3c is disposed substantially between the third side 1423 and the fourth side 1424. The two second flow passages 144c are respectively defined between the adjacent two second capillary structures 14 Torr. Continued as shown in Figures 6D, 6E and 6F, these drawings and the aforementioned first heart coffee 10121155 ^ single number A0101 Page 10 of 34 1012037056-0 M439890 The structure described is roughly the same, no longer repeat The difference is that the second inner surface 142 is provided with a plurality of grooves 1425. Further, the number of the second capillary structures 143a to 143c is not limited to the above-mentioned states, and the condensation portion 14 of the tube body may be regarded. The required width, the conduction efficiency, and the required number of vapor-liquid circulation efficiencies. The aforementioned first capillary structures 133a to 133f and the second capillary structures 1433 to 143c have a flow guiding capability to provide more return channels (channei) The second capillary structures 143a to 143c are connected between the first side 1421 and the second side 1422 of the condensation portion 14, and have a function of supporting the condensation portion 14 having a small thickness and a flat shape to prevent the condensation portion. 14 recesses, the first capillary structures 133a to 133f and the second capillary structures 143 & 143c are specifically powder sintering (p0Wder_sintering) or mesh or fiber or the aforementioned addition. The volume of the capillary structures 133a to 133f is larger than the volume of the second capillary structures 143a to 143c. The definition of each of the first thicknesses fAl, fA2, fA3 and the second thickness fB will be described in detail below: Refer to Figures 4A and 5A for details. Since the shape of the evaporation portions 133 and 13d is circular, the first thickness fA1 is the length of the maximum outer diameter of the first outer surfaces 1313 and 131d. Please refer to the figures 4B and 5B for The evaporation portions 131) and 136 are semicircular in shape, and therefore the first thickness fA2 is the length of the maximum radius of the first outer surfaces 131b and 131e. Please refer to FIGS. 4C and 5C for The evaporation portion 13 (:, 13e has a flat shape). Therefore, the first thickness fA2 is the first plane 1311c, 1311 of the first outer surface 131c, 131f [with the second plane 1312 (: 10121155 Lu, No. A0101) Page 11 of 34 1012037056-0 M439890, the maximum length β between 312f Please refer to Figures 6 to 6F. Since the shape of the condensation section is flat, the second The thickness fB is the maximum length between the upper surface 1411 and the lower plane 141 2 of the second outer surface 14]. The aforementioned first thickness fA1, fA2 & fA3 is, for example but not limited to, greater than 3 mm; the aforementioned second thickness fB is, for example but not limited to, less than or equal to 2. 5 mm. Further, the area of the first flow passages 134a to 134f is larger than the area of the one second flow passage 144a or the total area of the plurality of second flow passages 1441) and U4c. Referring to FIGS. 7A and 7B, a heat dissipating unit 2 is shown, including a plurality of fins 21 adjacent to each other. The first-class track 211 is defined between two adjacent fins 21, and each fin 21 is disposed. At least one through hole 212. The condensing portion 14 of the tubular body 1 is inserted through the through holes 212 such that the fins 21 are connected in series to the condensing portion 14. The manner in which the condensing portion 14 is connected to the plurality of fins 21 of the heat dissipating unit 2 is not limited to the above manner. For example, the condensing portion 14 directly affixes the plurality of fins 21 of the heat dissipating unit 2 or the plurality of fins of the heat dissipating unit 2 The sheet 21 is provided with a fitting groove for the corresponding fitting of the condensation portion 14. Referring to FIGS. 8A and 8B, an electronic device 3 is shown. For example, a circuit board is provided with a heat source 31 (as shown in FIG. 8B), such as a CPU or MCU or a north-south bridge chip or communication. Microprocessor, etc. The heat-dissipating unit tc20 is disposed on the electronic device 3, and the evaporation portion 13a of the tube body 1 is fixed on the heat source 31 by the --setting member 32 and is in contact with the heat source 31. The servo fluid vapor-liquid circulation of the evaporation portion (1) transfers the heat of the heat source 31 to the condensation portion 14 to dissipate heat via the plurality of Korean sheets 21. 1012037056-0 10121155+Single number deletion 1 Page 12/34 M439890 The operation of the heat pipe structure will be described in detail in the above embodiment: In actual use, the pipe body 10 is filled for evaporation and heat dissipation. The working fluid is for example but not limited to pure water, inorganic compounds, alcohols, ketones, liquid metals, cold coal, organic compounds or mixtures thereof. When the heat source 31 generates heat, the heat is conducted to the evaporation portion 13a of the tube body 10, and the liquid working fluid in the evaporation portion 13a of the tube body 10 absorbs heat to evaporate, thereby converting into a vapor working fluid. The working fluid in the vapor state is conducted to the condensing zone 14, and the heat of the working fluid in the vapor state is also transmitted to the condensing portion 14, and is diffused and dissipated by the fins 21, and the working fluid in the vapor state is rapidly decreased as the heat is reduced. The liquid working fluid is turned back, and the first capillary structure 133a and the second capillary structure 143a are rapidly returned to the evaporation portion 13a to continue the vapor-liquid circulation. Since the first thickness fAl of the evaporation portion 13a of the pipe body 10 is larger than the second thickness fB of the condensation portion 14, and the area of the first flow path 134a is larger than the area of the second flow path 144a, a larger space is provided for the evaporation portion 13a. The working fluid can be rapidly converted from a liquid state to a vapor state, and the vaporous working fluid moves faster within the first flow path 143a. Since the area of the second flow channel 144a of the condensing portion 14 is small, a large thermal resistance is generated, which is disadvantageous for transferring the working fluid of the vapor state to the condensing portion 14 by the first The arrangement of the second capillary structures 133a, 143a can effectively reduce the thermal impedance in the tube, prompting the liquid working fluid to rapidly return to the evaporation portion 13a, thereby effectively accelerating the vapor-liquid circulation efficiency and improving the anti-gravity heat transfer efficiency. Furthermore, the first capillary structure 133a surrounds the first inner surface 132a of the evaporation portion 13a, and the second capillary structure 143a is disposed on the first side 1421 of the second inner surface 142 of the condensation portion 14 and The two sides 10121155# single number A0101 page 13 / total 34 page 1012037056-0 M439890 1422, reduce the abnormal sound generated when the vapor working fluid flows to the condensation portion 14. In summary, the heat pipe structure of the present invention has the following advantages: 1. Improve heat transfer efficiency. 2. Reduce thermal resistance in the pipe. 3. Improve anti-gravity heat transfer performance. That is, heat can be long distance. The transfer 'in other words, the length of the tube can extend longer. 4. Increase the structural strength of the condensing section. 5. Reduce the incidence of abnormal sound in the tube. However, the present disclosure is disclosed in the above embodiments, but it is not intended to limit the creation of the present invention. Anyone who is familiar with the art can make various changes and refinements without departing from the spirit and scope of the present creation. The scope of the patent application is subject to the provisions of the attached patent application. [FIG. 1] FIG. 1 is a schematic perspective view of the heat pipe structure of the present invention; FIG. 3A is a schematic plan view of the heat pipe structure of the present invention; 3B is a partial cross-sectional view of the creation condensation section; Figure 4A is a schematic diagram of the AA section of Figure 2 of the creation; Figure 4B is a schematic diagram of another aspect of the creation of the evaporation section, · Figure 4C is A schematic diagram of another aspect of the evaporation section of the creation; FIG. 5A is a schematic diagram of another aspect of the creation evaporation section; FIG. 5B is a schematic circle of another aspect of the creation evaporation section; A schematic diagram of another aspect of the creation of the evaporation section; Figure 6A is a schematic cross-sectional view of the B_B of the second drawing of the creation;
第6B圖係為本創作冷凝部另一態樣之示 1012U55卢單编號A0101 第U頁/共34M 1012037056-0 M439890 第6C圖係為本創作冷凝部另一態樣之示意圖； 第6D圖係為本創作冷凝部另一態樣之示意圖； 第6E圖係為本創作冷凝部另一態樣之示意圖； 第6F圖係為本創作冷凝部另一態樣之示意圖； 第7A圖係為本創作散熱單元之分解示意圖； 第7B圖係為本創作散熱單元之組合示意圖； 第8A圖係為本創作應用該散熱單元之電子設備之立體示 意圖， 第8B圖係為第8A圖之另一視角之示意圖。 ® 【主要元件符號說明】 [0006]管體 10 · 第一封閉端11 第二封閉端12 13a〜13f蒸發部 131a~131f第一外表面 132a~132f第一内表面 I 133a〜133f第一毛細結構 134a〜134f第一流道 fAl〜fA3第一厚度 14冷凝部 141第二外表面 142第二内表面 1421第一側 1422第二側 1423第三側 1424第四側 10121155^^^^ A〇101 ^ 15 1 / * 34 I 1012037056-0 M439890 1425溝槽 143a〜143c第二毛細結構 1431a自由端 145無毛細結構空間Figure 6B is another aspect of the creation of the condensation section 1012U55 Lu single number A0101 U page / total 34M 1012037056-0 M439890 Figure 6C is a schematic diagram of another aspect of the creation of the condensation section; Figure 6D This is a schematic diagram of another aspect of the creation of the condensation section; Figure 6E is a schematic view of another aspect of the creation of the condensation section; Figure 6F is a schematic diagram of another aspect of the creation of the condensation section; Figure 7A is The schematic diagram of the disassembly of the heat dissipation unit of the present invention; the 7B diagram is a schematic diagram of the combination of the heat dissipation unit of the creation; the 8A diagram is a schematic diagram of the electronic device for creating the heat dissipation unit, and the 8B diagram is another diagram of the 8A diagram. Schematic of the perspective. ® [Main component symbol description] [0006] Pipe body 10 · First closed end 11 Second closed end 12 13a to 13f Evaporating portions 131a to 131f First outer surface 132a to 132f First inner surface I 133a to 133f first capillary Structures 134a-134f First flow path fAl~fA3 First thickness 14 Condensation portion 141 Second outer surface 142 Second inner surface 1421 First side 1422 Second side 1423 Third side 1424 Fourth side 10121155^^^^ A〇101 ^ 15 1 / * 34 I 1012037056-0 M439890 1425 grooves 143a to 143c second capillary structure 1431a free end 145 without capillary structure space
第二厚度fB 20散熱單元 21鰭片 211流道 212透孔 30電子設備 31發熱源 32固定件 10121155^^ A〇101 第16頁/共34頁 1012037056-0Second thickness fB 20 heat sink unit 21 fin 211 flow path 212 through hole 30 electronic device 31 heat source 32 fixing member 10121155^^ A〇101 Page 16 of 34 1012037056-0