TWM433075U - Heat dissipating device - Google Patents

Heat dissipating device

Info

Publication number
TWM433075U
TWM433075U TW101201885U TW101201885U TWM433075U TW M433075 U TWM433075 U TW M433075U TW 101201885 U TW101201885 U TW 101201885U TW 101201885 U TW101201885 U TW 101201885U TW M433075 U TWM433075 U TW M433075U
Authority
TW
Taiwan
Prior art keywords
chamber
pipe
capillary structure
dissipating device
heat dissipating
Prior art date
Application number
TW101201885U
Other languages
Chinese (zh)
Inventor
Wei-I Lin
Chien-Chih Yeh
Wen-Shiang Chen
Chun-Hung Lin
Original Assignee
Cooler Master Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooler Master Co Ltd filed Critical Cooler Master Co Ltd
Priority to TW101201885U priority Critical patent/TWM433075U/en
Publication of TWM433075U publication Critical patent/TWM433075U/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipating device includes a chamber body, a heat dissipater, a pipe, a first capillary structure and N vapor channels. The chamber body has an evaporation chamber and a compensation chamber, wherein the evaporation chamber has a vapor outlet and the compensation chamber has a liquid inlet. The heat dissipater is disposed on an outer wall of a first side of the chamber body and at least covers the compensation chamber. The pipe in installed within the heat dissipater, wherein a first end of the pipe is connected to the vapor outlet and a second end of the pipe is connected to the liquid inlet. The first capillary structure is formed in the evaporation chamber. The N vapor channels are formed in the first capillary structure. The N vapor channels and the compensation chamber are isolated by the first capillary structure.
TW101201885U 2012-02-02 2012-02-02 Heat dissipating device TWM433075U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101201885U TWM433075U (en) 2012-02-02 2012-02-02 Heat dissipating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101201885U TWM433075U (en) 2012-02-02 2012-02-02 Heat dissipating device

Publications (1)

Publication Number Publication Date
TWM433075U true TWM433075U (en) 2012-07-01

Family

ID=60622786

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101201885U TWM433075U (en) 2012-02-02 2012-02-02 Heat dissipating device

Country Status (1)

Country Link
TW (1) TWM433075U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548976B (en) * 2013-07-18 2016-09-11 宏碁股份有限公司 Cycling heat dissipation module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548976B (en) * 2013-07-18 2016-09-11 宏碁股份有限公司 Cycling heat dissipation module

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Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees