TWM433075U - Heat dissipating device - Google Patents
Heat dissipating deviceInfo
- Publication number
- TWM433075U TWM433075U TW101201885U TW101201885U TWM433075U TW M433075 U TWM433075 U TW M433075U TW 101201885 U TW101201885 U TW 101201885U TW 101201885 U TW101201885 U TW 101201885U TW M433075 U TWM433075 U TW M433075U
- Authority
- TW
- Taiwan
- Prior art keywords
- chamber
- pipe
- capillary structure
- dissipating device
- heat dissipating
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat dissipating device includes a chamber body, a heat dissipater, a pipe, a first capillary structure and N vapor channels. The chamber body has an evaporation chamber and a compensation chamber, wherein the evaporation chamber has a vapor outlet and the compensation chamber has a liquid inlet. The heat dissipater is disposed on an outer wall of a first side of the chamber body and at least covers the compensation chamber. The pipe in installed within the heat dissipater, wherein a first end of the pipe is connected to the vapor outlet and a second end of the pipe is connected to the liquid inlet. The first capillary structure is formed in the evaporation chamber. The N vapor channels are formed in the first capillary structure. The N vapor channels and the compensation chamber are isolated by the first capillary structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101201885U TWM433075U (en) | 2012-02-02 | 2012-02-02 | Heat dissipating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101201885U TWM433075U (en) | 2012-02-02 | 2012-02-02 | Heat dissipating device |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM433075U true TWM433075U (en) | 2012-07-01 |
Family
ID=60622786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101201885U TWM433075U (en) | 2012-02-02 | 2012-02-02 | Heat dissipating device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM433075U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI548976B (en) * | 2013-07-18 | 2016-09-11 | 宏碁股份有限公司 | Cycling heat dissipation module |
-
2012
- 2012-02-02 TW TW101201885U patent/TWM433075U/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI548976B (en) * | 2013-07-18 | 2016-09-11 | 宏碁股份有限公司 | Cycling heat dissipation module |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |