TWM430023U

TWM430023U - Card edge connector

Info

Publication number: TWM430023U
Application number: TW100224289U
Authority: TW
Inventors: Shi-Qing Fan
Original assignee: Argosy Res Inc
Priority date: 2011-12-22
Filing date: 2011-12-22
Publication date: 2012-05-21

Description

M430023M430023

101年.03月28日後壬^5_ 五、新型說明：【新型所屬之技術領域】 [0001] 本創作是有關一種卡緣連接器’尤指一種供設置於電路板上，以供一電子卡插接的卡緣連接器。【先前技術】 [0002]快速周邊元件互連（Peripheral Component101年.03月28日后壬5_5, new description: [New technology field] [0001] This creation is related to a card edge connector 'especially for one type on the circuit board for an electronic card Plug-in card edge connector. [Prior Art] [0002] Fast Peripheral Component Interconnect (Peripheral Component)

Interconnect Express，PCI Express)介面協定是由美國英特爾（Intel)公司在2004年發表。該介面可取代舊有的PCI、PCI-X及AGP介面’所以被廣泛應用於個人電腦的各式介面卡中。 [0003]目前一般Mini PCI Express連接器中，其結構組成的上、下排導電端子常見的設計方式，如第一種設計均為利用插針式結構設計，從而插設於絕緣本體，例如中國大陸實用新型專利授權公告號CN201 160131Y所揭示的端子結構設計。端子插針式結構雖具有製程簡單·、不良率低的效益。但此類整體的結構產品高度較高，無法滿足電子產品日益輕薄的市場要求，例如即無法供應安裝於比一般Notebook還要輕薄的Ultrabook裏。 [〇〇〇4]第二種的導電端子設計即利用Insert Molding方式，從而將上 '下排的導電端子均埋設於絕緣本體内，繼而使得整體連接器的產品高度達成低度化的設計，以應用於曰益輕薄的電子產品内。然雖可滿足產品日益輕薄的市場需求，但因上、下排的導電端子均需lnsert M0lding 如此使得模具的結構複雜化，連接器產品不良率較高 1013117481-0 、產能低、成本較高等之問題。 10〇22428卢單編號A01(n 第3頁/共π頁 M430023 101年.03月28日梭正替換頁 [0005] 緣是，本創作人感上述之缺失可改善，乃潛心研究並配合學理之運用，終於提出一種設計合理且有效改善上述問題之本創作。【新型内容】 [〇〇〇6] 本創作是提出一種卡緣連接器，其將上下排導電端子通過不同組合方式的結構設計與絕緣本體組成，具有降低產品整體的高度，又可提高產品製作的產能，及達成降低產品不良率的效益。 [0007] 為達上述，本創作提出一種卡緣連接器，包括絕緣本體、多個設於絕緣本體呈上下排相對設置的上排導電端子及下排導電端子。絕緣本體形成有插卡槽，及形成有多個與插卡槽連通的上排端子槽，其特徵在於：上排導電端子分別插固的固定於對應位置的上排端子槽，上排導電端子具有一固持於上排端子槽的固持部、一伸出於上排端4槽的第一焊接腳及一部分的伸入於插卡槽的第一彈性接觸部。下排導電端子分別埋設的固設於絕緣本體，下排導電端子具有一埋設於絕緣本體内的埋入部、一部 β 分的伸入於插卡槽的第二彈性接觸部及一伸出於絕緣本體外的第二焊接腳。 [0008] 較佳地，上排導電端子與該下排導電端子是傳輸符合 Mini PCI Express版本的連接器端子的訊號傳輸規範。或者，亦可為是傳輸符合記憶體模組連接器技術規範的信號傳輸端子。 [0009] 較佳地，下排導電端子是埋設於絕緣本體的前端部，第二彈性接觸部是自埋入部的一端往插卡槽方向向後延伸 1()()22428f單编號A0101 第4頁/共17頁 1013117481-0 M430023 _____ 101年.03月28日修正脊^頁而成，第二焊接腳是自埋入部的另一端往遠離插卡槽方向向前延伸而成。The Interconnect Express (PCI Express) interface protocol was published by Intel Corporation of the United States in 2004. This interface replaces the old PCI, PCI-X and AGP interfaces' and is widely used in various interface cards for personal computers. [0003] In the current Mini PCI Express connector, the common design method of the upper and lower row of conductive terminals of the structure, such as the first design, is designed by using a pin-type structure, thereby being inserted into the insulating body, such as China. The terminal structure design disclosed in the mainland utility model patent authorization announcement number CN201 160131Y. The terminal pin type structure has the advantages of simple process and low defect rate. However, such a holistic structural product is highly high and cannot meet the increasingly light and thin market requirements of electronic products, for example, it cannot be installed in an Ultrabook which is thinner than a general notebook. [〇〇〇4] The second type of conductive terminal design uses the Insert Molding method to embed the upper and lower rows of conductive terminals in the insulating body, which in turn makes the overall connector product height low. It is used in electronic products that are thin and light. Although it can meet the increasingly light and thin market demand of the products, the conductive terminals of the upper and lower rows need to be lnsert M0lding, which makes the structure of the mold complicated, the defect rate of the connector products is higher 1013117481-0, the production capacity is low, the cost is high, etc. problem. 10〇22428卢单号 A01(n Page 3/Total π page M430023 101. March 28th Shuttle is replacing page [0005] The reason is that this creator feels that the above-mentioned lack can be improved, but is devoted to research and coordination The application finally proposes a creation that is reasonable in design and effective in improving the above problems. [New content] [〇〇〇6] This creation proposes a card edge connector that uses the structural design of the upper and lower rows of conductive terminals through different combinations. It is composed of an insulating body, which can reduce the overall height of the product, increase the production capacity of the product, and achieve the benefit of reducing the product defect rate. [0007] In order to achieve the above, the present invention proposes a card edge connector, including an insulating body, and more The upper row of conductive terminals and the lower row of conductive terminals are disposed on the upper and lower rows of the insulating body. The insulating body is formed with a card slot, and a plurality of upper terminal slots are formed to communicate with the card slot, wherein: The row of conductive terminals are respectively fixed and fixed to the upper row of terminal slots of the corresponding position, and the upper row of conductive terminals has a holding portion held by the upper row of terminal slots, and a slot extending from the upper row of ends a first soldering leg and a portion of the first elastic contact portion extending into the card slot. The lower row of the conductive terminals are respectively embedded in the insulating body, and the lower row of the conductive terminals has a buried portion embedded in the insulating body, and a portion a second elastic contact portion extending into the card slot and a second soldering leg extending outside the insulating body. [0008] Preferably, the upper row of conductive terminals and the lower row of conductive terminals are transmitted in accordance with the Mini PCI The signal transmission specification of the connector version of the Express version. Alternatively, it may be a signal transmission terminal that transmits the technical specifications of the connector of the memory module. [0009] Preferably, the lower row of conductive terminals is embedded in the front end of the insulating body. The second elastic contact portion extends rearward from the end of the embedded portion toward the card slot 1 () () 22228f single number A0101 page 4 / total 17 pages 1013117481-0 M430023 _____ 101 years. March 28 correction The ridge is formed by a sheet, and the second soldering leg is formed by extending the other end of the embedded portion away from the card slot.

[0010] 較佳地，絕緣本體更形成有下排端子容置槽，下排導電端子的第二彈性接觸部位設於對應位置的下排端子容置槽内，且是第二彈性接觸部的自由端部伸入於插卡槽P[0010] Preferably, the insulative housing is further formed with a lower row of terminal receiving slots, and the second resilient contact portion of the lower row of electrically conductive terminals is disposed in the lower row of terminal receiving slots of the corresponding position, and is the second resilient contact portion. The free end protrudes into the card slot P

[owl] 較佳地，包括有二焊接件，其各具有一直立片、一自直立片頂端彎折延伸的定位片及一自直立片底端彎折延伸的焊接片，絕緣本體相對的兩側端部各設有容置插槽， • 焊接件插固於對應位置的容置插槽，直立片及定位片插固于該容置插槽’焊接片的底面與第一焊接腳末端部底面及第二焊接腳底面呈同一平面。 [0012]本創作具有之效益：藉由上、下排導電端子採用了不同組合方式的結構設計與絕緣本體組成，上排導電端子均為插針式結構，保有結構制程簡單、不良率低的優勢；下排導電端子通過注塑_體成型埋設於絕緣本體，利於降低產品高度；據此，導電端子通過不同組合方式的設計與絕緣本體組成，具有降低產品整體的高度，又可提高產品製作的產能，及達成降低產品不良率的效益。【實施方式】 [0013] 10022428#單编號如第一圖至第五圖所示，本創作是提出一種卡緣連接器，其用以供設置於一電路板p上，可用以供一電子卡（未圖不）插置，以使電子卡與電路板p達成電性連接，所述的電子卡可為Mini PCI Express ModuU Card，當然也可為如記憶體模組（DDR Module)等類的電子卡。該卡 =接器包含有-絕緣本體！、多個上排導電端子2及多 1013117481-0 M430023 101年.03月28日梭正替换頁個下排導電端子3。 [0014] 絕緣本體1由絕緣性材料所製成的，其在縱長的方向形成有插卡槽11，以供電子卡的卡緣***。並且更形成有多個上排端子槽12，其分別與插卡槽11連通。[ owl] Preferably, there are two welding members, each having a vertical piece, a positioning piece extending from the top end of the vertical piece and a welding piece extending from the bottom end of the vertical piece, the opposite two of the insulating body Each of the side end portions is provided with a receiving slot, and the welding member is inserted into the receiving slot of the corresponding position, and the upright piece and the positioning piece are inserted in the bottom surface of the receiving slot and the end portion of the first soldering leg. The bottom surface and the bottom surface of the second soldering leg are in the same plane. [0012] The benefit of the creation is that the upper and lower rows of conductive terminals are composed of different combinations of structural design and insulating body, and the upper row of conductive terminals are pin-type structures, which have simple structure process and low defect rate. Advantages; the lower row of conductive terminals are embedded in the insulating body by injection molding, which is beneficial to reduce the height of the product; accordingly, the conductive terminals are composed of different combinations of designs and insulating bodies, which can reduce the overall height of the product and improve the production of the product. Capacity, and the benefits of reducing product non-performing rates. [Embodiment] [0013] 10022428# Single Number As shown in the first to fifth figures, the present invention proposes a card edge connector for being disposed on a circuit board p for use in an electronic device. The card (not shown) is inserted to electrically connect the electronic card to the circuit board p. The electronic card may be a Mini PCI Express ModuU Card, or may be a memory module (DDR Module) or the like. Electronic card. The card = connector contains - insulated body! Multiple upper row of conductive terminals 2 and more 1013117481-0 M430023 101. March 28th, the shuttle is replacing the lower row of conductive terminals 3. [0014] The insulative housing 1 is made of an insulating material, and has a card insertion slot 11 in the longitudinal direction for insertion of the card edge of the electronic card. Further, a plurality of upper terminal grooves 12 are formed, which are respectively connected to the card insertion slots 11.

[0015] 另，絕緣本體1的底部處更可形成有下排端子容置槽13，其與插卡槽11連通。並且絕緣本體1是具有相對向的前端部與後端部*在後端部的底部處可向後突伸有凸牆14。凸牆14設有多個間隔設置的定位槽15。絕緣本體1相對的兩側端部更可設有容置插槽16，其可分別由絕緣本體1的後端部由後往前凹設而成。插卡槽11則是位於絕緣本體1 的前端部。 [0016] 上排導電端子2分別具有一固持部21、一第一焊接腳22及第一彈性接觸部23。第一焊接腳22是自固持部21的一端彎折延伸而成，第一彈性接觸部23則是自固持部21相對的另一端子延伸而成。 [0017] 如第六圖所示，下排導電端子3則具有一埋入部31、一第二焊接腳32及一第二彈性接觸部33。在組裝時，下排導電端子3是利用Insert Molding(注塑一體成型）的技術方式，繼而分別埋設的固設於絕緣本體1的底部處。埋入部31是埋設於絕緣本體1内，第二彈性接觸部33的部分伸入於插卡槽11，第二焊接腳32則是伸出於絕緣本體1外，具體的說明，第二焊接腳32是伸出於絕緣本體1的前端部外。 [0018] 更具體的說明，本創作的下排導電端子3是埋設的設置於 10022428^^^^ A〇101 第6頁/共17頁 1013117481-0 M430023 101年03月28日按正替換頁絕緣本體1的前端部處，第二彈性接觸部33是自埋入部31 的一端往插卡槽11的方向向後延伸而成，第二焊接腳32 則是自埋入部31的另一端往遠離插卡槽11的方向向前延伸而成。每一第二彈性接觸部33位設於對應位置的下排端子容置槽13内，且是自由端部伸入於插卡槽11，藉由下排端子容置槽13的設置，使得下排導電端子3的第二彈性接觸部33更具有優良的彈性力，以與電子卡接觸。 [0019] 再復參第一圖至第六圖，上排導電端子2的組裝方式，則 • • 是利用插針的方式組設於絕緣本體1，而上排導電端子2 與下排導電端子3即是呈上下排相對設置。更進一步的說明，每一上排導電端子2是分別插固的固定於對應位置的上排端子槽12，固持部21固持於上排端子槽12，第一彈性接觸部23是往插卡槽11的方向向前延伸，使得部分的第一彈性接觸部23伸入於插卡槽11。而第一焊接腳22是往遠離插卡槽11的方向向後延伸於上排端子槽12外，即第一焊接腳22是往後的彎折延伸而成。更進一步的說明，上排導電端子2是由絕緣本體1的後端部往前端部的方向由後往前插固於對應的上排端子槽12的導電端子結構〇 [0020] 另，上排導電端子2部份的第一焊接腳22是可定位於絕緣本體1對應位置的定位槽15中，藉以定位長度較長的第一焊接腳22。其次，第一焊接腳22與第二焊接腳32均可為 SMT(表面接著技術）型的焊接腳結構，但不以此為限，亦可均為DIP(插接）型的焊接腳結構（圖式是以SMT型為例），或可為SMT及DIP的混合設計。另一方面，上排導電端第7頁/共17頁 10022428^^^^ A〇101 1013117481-0 M430023 子2與下排導電端子坤是可為傳輪符合本的軸心訊纖_。或者，亦可 7傳輪符合記憶體模組連接器技術規範的信號傳輪端千0 [0021] 料，在本創作之實施例卜卡緣連接器更可包含有二焊接件4」其各具有—直立片41、一自直立片化頁端彎折 L伸的疋位>;42及-自直立片41底端彎折延伸的谭接片 43。焊接件4是插固於絕緣本體1對應位置的容置插槽16 ’直立片41及定位片42均插固于容置插槽16内，焊接片 43的底面是與第一焊接腳22末端部底面及第二焊接腳μ[0015] In addition, a lower row of terminal receiving grooves 13 may be formed at the bottom of the insulative housing 1 , which is in communication with the card slot 11 . And the insulative housing 1 has opposite front and rear end portions. * A convex wall 14 is protruded rearward at the bottom of the rear end portion. The convex wall 14 is provided with a plurality of spaced apart positioning grooves 15. The opposite ends of the insulative housing 1 can be further provided with receiving slots 16 which can be recessed from the rear end of the insulative housing 1 from the rear to the front. The card slot 11 is located at the front end of the insulative housing 1. [0016] The upper row of conductive terminals 2 respectively have a holding portion 21, a first soldering leg 22 and a first resilient contact portion 23. The first soldering leg 22 is bent and extended from one end of the holding portion 21, and the first elastic contact portion 23 is formed by extending from the other terminal of the holding portion 21. [0017] As shown in the sixth figure, the lower row of conductive terminals 3 has a buried portion 31, a second soldering leg 32 and a second resilient contact portion 33. At the time of assembly, the lower row of conductive terminals 3 is a technique utilizing Insert Molding, and then embedded and fixed at the bottom of the insulative housing 1 respectively. The embedded portion 31 is embedded in the insulative housing 1 , the portion of the second resilient contact portion 33 extends into the card slot 11 , and the second soldering leg 32 extends beyond the insulative housing 1 . 32 is extended outside the front end portion of the insulative housing 1. [0018] More specifically, the lower row of conductive terminals 3 of the present invention is embedded in the setting of 10022428^^^^ A〇101 6th page/total 17 pages 1013117481-0 M430023 101 March 30, according to the replacement page At the front end portion of the insulative housing 1, the second elastic contact portion 33 is formed to extend rearward from the end of the embedding portion 31 toward the card insertion slot 11, and the second soldering leg 32 is inserted from the other end of the embedding portion 31. The direction of the card slot 11 extends forward. Each of the second elastic contact portions 33 is disposed in the lower row of terminal receiving slots 13 at the corresponding position, and the free end portion extends into the card slot 11 by the arrangement of the lower row of terminal receiving slots 13 The second elastic contact portion 33 of the row of conductive terminals 3 has an excellent elastic force to be in contact with the electronic card. [0019] Referring back to the first to sixth figures, the assembly manner of the upper row of the conductive terminals 2 is set up in the insulating body 1 by means of pins, and the upper row of conductive terminals 2 and the lower row of conductive terminals 3 is the relative arrangement of the upper and lower rows. Further, each of the upper row of conductive terminals 2 is respectively fixed and fixed to the upper row of terminal slots 12 at corresponding positions, the holding portion 21 is held by the upper row of terminal slots 12, and the first elastic contact portion 23 is for the card slot. The direction of 11 extends forward so that a portion of the first resilient contact portion 23 projects into the card slot 11. The first soldering leg 22 extends rearwardly away from the card slot 11 in the direction of the upper row of the terminal slots 12, that is, the first soldering leg 22 is formed by bending backwards. Further, the upper row of conductive terminals 2 is a conductive terminal structure that is inserted into the corresponding upper row of terminal slots 12 from the rear end portion of the insulative housing 1 toward the front end portion. [0020] The first soldering leg 22 of the portion of the row of the conductive terminals 2 is positioned in the positioning slot 15 corresponding to the position of the insulative housing 1 to thereby position the first soldering leg 22 having a longer length. Secondly, the first soldering leg 22 and the second soldering leg 32 may both be SMT (surface following technology) type soldering leg structures, but not limited thereto, and may also be DIP (plug-in) type soldering foot structures ( The schema is based on the SMT model, or it can be a hybrid design of SMT and DIP. On the other hand, the upper row of conductive end page 7 / a total of 17 pages 10022428 ^ ^ ^ ^ A 〇 101 1013117481-0 M430023 child 2 and the lower row of conductive terminals Kun is the shaft of the shaft can be used for the transmission. Alternatively, the 7-passenger wheel can be used to meet the technical requirements of the memory module connector. In the embodiment of the present invention, the card edge connector can further include two soldering members 4" There is an upright piece 41, a leg portion extending from the upright sheet end of the sheet, and a tandem piece 43 extending from the bottom end of the upright piece 41. The soldering member 4 is a receiving slot 16 that is inserted into the corresponding position of the insulative housing 1. The upright tab 41 and the positioning tab 42 are both inserted into the receiving slot 16, and the bottom surface of the soldering tab 43 is the end of the first soldering leg 22. Bottom surface and second soldering foot μ

底面呈同一平面，藉以使三者能在同一平面上利於焊接於電路板上，以改善降低端子空焊的情形。 [0022]通過上述的說明，本創作所提供的卡緣連接器，其上、下排導電端子採用了不同組合方式的結構設計與絕緣本體組成’上排導電端子均為插針式結構，保有結構制程簡單、不良率低的優勢。下排導電端子通過注塑一體成型（Insert Molding)埋設於絕緣本體，利於降低產品高度。據此，導電端子通過不同組合方式與絕緣本體組成’既降低了產品高度，又可提高了產品製作的產能，降低產品不良率。 [0023]另外’如第六圖及第一圖’下排導電端子3位設於絕緣本體1的前端部，與上排導電端子2呈前後的設置，如此更能降低佔用絕緣本體1底部處的高度，從而使產品能達到最佳的的高度降低化，本創作卡緣連接器於電路板p上的高度Η可製做到2. 9cm，能大幅降低佔用電子產品内部空 10022428#單編號删1 第8頁/共17頁 M430023 [0024] [0025] [0026]The bottom surfaces are in the same plane, so that the three can be soldered to the circuit board on the same plane to improve the situation of reducing the terminal soldering. [0022] Through the above description, the card edge connector provided by the present invention has upper and lower row of conductive terminals adopting different combinations of structural design and insulative body composition. The upper row of conductive terminals are pin-type structures, and are retained. The structure is simple and the defect rate is low. The lower row of conductive terminals are embedded in the insulative body by injection molding, which helps to reduce the height of the product. Accordingly, the conductive terminals are combined with the insulating body by different combinations, which not only reduces the product height, but also increases the production capacity of the product and reduces the product defect rate. [0023] In addition, as shown in the sixth figure and the first figure, the lower row of the conductive terminals 3 are disposed at the front end portion of the insulative housing 1 and are disposed forward and backward with the upper row of the conductive terminals 2, so as to reduce the occupation of the bottom portion of the insulative housing 1 The height of the product, so that the product can achieve the best height reduction, the height of the card edge connector on the circuit board p can be made 2. 9cm, can greatly reduce the occupation of the internal space of the electronic product 10022428# single number Delete 1 Page 8 / Total 17 pages M430023 [0024] [0026]

[0027] [0028] [0029] [0030][0030] [0030] [0030]

[0031] [0032] [0033] [0034] [0035] [0036] 101年.03月28日修正^頁間的優勢，而利於電子產品達成輕薄的要求。以上僅為本創作之較佳可行實施例，非因此即侷限本創作的專利範圍，故舉凡運用本創作說明書及圖式内容所為之等效結構變化，均同理皆包含於本創作之範圍内，合予陳明。【圖式簡單說明】第一圖為本創作卡緣連接器設置於電路板的剖視圖。第二圖為本創作卡緣連接器的立體分解圖。第三圖為本創作卡緣連接器的絕緣本體的立體圖。第四圖為本創作卡緣連接器的上排導電端子的立體圖。第五圖為本創作卡緣連接器的下排導電端子與絕緣本體結合後的立體圖。第六圖為本創作卡緣連接器的下排導電端子與絕緣本體結合後的剖視圖。【主要元件符號說明】 1絕緣本體 11插卡槽 12上排端子槽 13下排端子容置槽 14凸牆 1 5定位槽 100麵卢單編號A0101 第9頁/共17頁 1013117481-0 M430023 [0037] 16容置插槽 [0038] 2上排導電端子 [0039] 21固持部 [0040] 22第一焊接腳 [0041] 23第一彈性接觸部 [0042] 3下排導電端子 [0043] 31埋入部 [0044] 32第二焊接腳 [0045] 33第二彈性接觸部 [0046] 4焊接件 [0047] 41直立片 [0048] 42定位片 [0049] 43焊接片 [0050] P電路板 [0051] Η高度 22428#單编號 A〇101 第10頁/共17頁 101年03月28日按正替換頁[0036] [0036] [0036] 101 years. March 28th revised the advantages of the page, and facilitated the electronic product to achieve the thin and light requirements. The above is only a preferred and feasible embodiment of the present invention, and thus does not limit the scope of the patent of the present invention. Therefore, the equivalent structural changes that are made by using the present specification and the contents of the schema are all included in the scope of the present creation. , combined with Chen Ming. [Simple description of the drawing] The first figure is a cross-sectional view of the creative card edge connector disposed on the circuit board. The second figure is an exploded perspective view of the creative card edge connector. The third figure is a perspective view of the insulative housing of the creative card edge connector. The fourth figure is a perspective view of the upper row of conductive terminals of the creative card edge connector. The fifth figure is a perspective view of the lower row of conductive terminals of the card edge connector and the insulative housing. The sixth figure is a cross-sectional view of the lower row of conductive terminals of the card edge connector and the insulative housing. [Main component symbol description] 1 Insulation body 11 Card slot 12 Upper terminal slot 13 Lower row Terminal receiving slot 14 Convex wall 1 5 Positioning slot 100 Surface Lu single number A0101 Page 9 / Total 17 pages 1013117481-0 M430023 [ 0037] 16 accommodating slot [0038] 2 upper row of conductive terminals [0039] 21 holding portion [0040] 22 first soldering leg [0041] 23 first elastic contact portion [0042] 3 lower row of conductive terminals [0043] 31 Buried portion [0044] 32 second soldering leg [0045] 33 second elastic contact portion [0046] 4 soldering member [0047] 41 upright sheet [0048] 42 positioning sheet [0049] 43 soldering sheet [0050] P circuit board [ 0051] Η Height 22428#单号A〇101 Page 10 of 17 Page 101 March 28th Press the replacement page

1013117481-01013117481-0

Claims

101年.03月28日梭正替換頁 M430023 六、申請專利範圍： 1 . 一種卡缘連接器，包括絕緣本體、多個設於該絕緣本體呈上下排相對設置的上排導電端子及下排導電端子；該絕緣本體形成有插卡槽，及形成有多個與該插卡槽連通的上排端子槽，其特徵在於：該上排導電端子分別插固的固定於對應位置的上排端子槽，該上排導電端子具有一固持於該上排端子槽的固持部、一伸出於該上排端子槽的第一焊接腳及一部分的伸入於該插卡槽的第一彈性接觸部；該下排導電端子分別埋設的固設於該絕緣本體，該下排導電端子具有一埋設於該絕緣本體内的埋入部、一部分的伸入於該插卡槽的第二彈性接觸部及一伸出於該絕緣本體外的第二焊接腳。 2 .如申請專利範圍第1項所述的卡緣連接器，其中該上排導電端子與該下排導電端子是傳輸符合Mini PCI Express 版本的連接器端子的訊號傳輸規範。 3 .如申請專利範圍第1項所述的卡緣‘接器，其中該絕緣本體是具有相對向的前端部與後端部，該插卡槽位於該絕緣本體的前端部，該上排導電端子的第一焊接腳是自該固持部的一端往遠離該插卡槽方向向後彎折延伸而成，該第一彈性接觸部是自該固持部的另一端往該插卡槽方向向前延伸而成。 4 .如申請專利範圍第3項所述的卡緣連接器，其中該下排導電端子是埋設於該絕緣本體的前端部，該第二彈性接觸部是自該埋入部的一端往該插卡槽方向向後延伸而成，該第二焊接腳是自該埋入部的另一端往遠離該插卡槽方向向前延伸而成。 10022428#單編號 A〇101 第11頁/共17頁 1013117481-0 M430023 101年.03月28日梭正替換頁 5 .如申請專利範圍第4項所述的卡緣連接器，其中該絕緣本體更形成有下排端子容置槽，該下排導電端子的第二彈性接觸部位設於對應位置的下排端子容置槽内，且是該第二彈性接觸部的自由端部伸入於該插卡槽。 6 .如申請專利範圍第3項所述的卡緣連接器，其中該絕緣本體的後端部向後突伸有凸牆，該凸牆設有多個間隔設置的定位槽，該上排導電端子部分的第一焊接腳定位於對應位置的定位槽中。101. March 28th Shuttle replacement page M430023 VI. Patent application scope: 1. A card edge connector, comprising an insulating body, a plurality of upper row of conductive terminals and lower rows arranged opposite to each other in the upper and lower rows of the insulating body a conductive terminal; the insulating body is formed with a card slot, and a plurality of upper terminal slots are formed in communication with the card slot, wherein the upper row of conductive terminals are respectively fixed and fixed at corresponding positions of the upper row of terminals a slot, the upper row of conductive terminals having a retaining portion retained in the upper row of terminal slots, a first soldering leg extending from the upper row of terminal slots, and a portion of the first resilient contact portion extending into the card slot; The lower row of conductive terminals are respectively embedded in the insulative housing, and the lower row of conductive terminals has a buried portion embedded in the insulating body, a portion of the second elastic contact portion extending into the card slot, and an extension a second soldering leg outside the insulating body. 2. The card edge connector of claim 1, wherein the upper row of conductive terminals and the lower row of conductive terminals are signal transmission specifications for transmitting a Mini PCI Express version of the connector terminals. 3. The card edge connector of claim 1, wherein the insulative housing has opposite front and rear ends, the card slot is located at a front end of the insulative housing, and the upper row is electrically conductive. The first soldering leg of the terminal is bent and extended from one end of the holding portion away from the card slot, and the first elastic contact portion extends forward from the other end of the holding portion toward the card slot. Made. 4. The card edge connector of claim 3, wherein the lower row of conductive terminals is embedded in a front end portion of the insulative housing, and the second elastic contact portion is from the end of the embedding portion to the card The slot direction extends rearward, and the second soldering leg extends forward from the other end of the embedding portion away from the card slot. 100 。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。。 Further formed with a lower row of terminal receiving slots, the second resilient contact portion of the lower row of conductive terminals is disposed in the lower row of terminal receiving slots of the corresponding position, and the free end of the second resilient contact portion extends into the Card slot. 6. The card edge connector of claim 3, wherein the rear end portion of the insulative housing protrudes rearward with a convex wall, and the convex wall is provided with a plurality of spaced apart positioning slots, the upper row of conductive terminals A portion of the first soldering leg is positioned in the corresponding positioning slot.

7.如申請專利範圍第3項所述的卡緣連接器，其更包括有二焊接件，其各具有一直立片、一自該直立片頂端彎折延伸的定位片及一自該直立片底端彎折延伸的焊接片，該絕緣本體相對的兩侧端部各設有容置插槽，該焊接件插固於對應位置的容置插槽，該直立片及該定位片插固於該容置插槽，該焊接片的底面與該第一焊接腳末端部底面及該第二焊接腳底面呈同一平面。 8 .如申請專利範圍第3項所述的卡緣連接器，其中該上排導7. The card edge connector of claim 3, further comprising two soldering members each having a standing piece, a positioning piece bent from the top end of the upright piece, and a standing piece from the upright piece a soldering piece extending from the bottom end, the opposite ends of the insulating body are respectively provided with receiving slots, the soldering member is inserted into the receiving slot of the corresponding position, and the upright piece and the positioning piece are fastened The receiving slot has a bottom surface of the soldering piece that is flush with the bottom surface of the first soldering leg end portion and the bottom surface of the second soldering leg. 8. The card edge connector of claim 3, wherein the upper row guide

電端子是由該絕緣本體的後端部往前端部的方向由後往前插固於對應的上排端子槽的導電端子結構。 9 .如申請專利範圍第1、2或3項所述的卡緣連接器，其中該上排導電端子的第一焊接腳及該下排導電端子的第二焊接腳均為表面接著技術型的焊接腳結構。 10022428^^^^ A〇101 第12頁/共17頁 1013117481-0The electrical terminal is a conductive terminal structure that is inserted into the corresponding upper row of terminal slots from the rear end portion of the insulating body toward the front end portion. 9. The card edge connector of claim 1, wherein the first soldering leg of the upper row of conductive terminals and the second soldering leg of the lower row of conductive terminals are surface-on-technical Welded foot structure. 10022428^^^^ A〇101 Page 12 of 17 1013117481-0